US3704213A - Acid coppering bath - Google Patents

Acid coppering bath Download PDF

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Publication number
US3704213A
US3704213A US108141A US3704213DA US3704213A US 3704213 A US3704213 A US 3704213A US 108141 A US108141 A US 108141A US 3704213D A US3704213D A US 3704213DA US 3704213 A US3704213 A US 3704213A
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US
United States
Prior art keywords
acid
urea
bath
lit
agent
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US108141A
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English (en)
Inventor
Roger Fournier
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Automobiles Peugeot SA
Renault SA
Original Assignee
Automobiles Peugeot SA
Renault SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Automobiles Peugeot SA, Renault SA filed Critical Automobiles Peugeot SA
Application granted granted Critical
Publication of US3704213A publication Critical patent/US3704213A/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/38Electroplating: Baths therefor from solutions of copper

Definitions

  • the present invention relates in general to the electrolytic deposit of bright copper from an acid aqueous bath, and more particularly to the use of products added to baths of this character with a view to improve the deposit obtained therefrom.
  • These metal elements must further receive a complementary nickel or chromium deposit.
  • thiourea addition or substitution compounds mercuric salts of triarylmethanes, certain dyestuffs of the methylene blue group, etc.
  • the present invention aims at avoiding the above-disclosed inconveniences by providing a method of depositing copper by electrolysis, which consists in electrolyzing an aqueous solution containing on the one hand one or a plurality of copper salts such as copper sulfate or copper nitrate and on the other hand additives having levelling properties, which are stable and economical since their cost is only one fraction of that of other additives utilized heretofore.
  • the present invention provides an aqueous bright acid electrolytic coppering bath containing a copper salt, a brightener, a surface tension agent and a levelling agent resulting from the combination of two formaldehyde molecules on one urea molecule, the resultant product being firstly modified by using a heavy alcohol or one of its derivatives, then polymerized and possibly sulfonated.
  • butanol is the most frequently used due on the one hand to the satisfactory results obtained therewith and on the other hand to its low cost.
  • glycol esters o phthalic acid, malonic acid and maleic acid.
  • the initial pH value is about 8.
  • the temperature is gradually raised to 95 C.
  • the temperature is maintained at 95 C. Then the water in the formol solution distils slowly by azeotropy and the condensation is continued during one hour.
  • the pH value of the reaction medium is then about 3.
  • the resulting resin has the following formula:
  • n has a value within the range of 500 to 1,000.
  • this resin i.e. when it is introduced as a levelling agent into an aqueous bright acid electrolytic coppering bath, a sulfonation is carried out according to the known method by reason of 100 g. of resin per liter of 30% (volume) H 50 solution, with the consequence that the solubility of said resin is increased considerably in the electrolyte bath.
  • EXAMPLE 1 The following substances are mixed in succession in the electrolytic coppering vat, with the proportions given hereinafter:
  • Example 1 The coppered pieces obtained from the above Examples 1 and 2 are compared with coppered pieces obtained with conventional baths without the levelling agent; the procedure used for comparing the surface condition of the pieces coppered according to these various methods is the profile test. It proved that in Example 1 the improvement in levelling of the copper deposit obtained in the treated parts is of the order of 30%, and in the case of Example 2 the improvement is of the order of 50% These examples clearly show the advantages deriving from the use of these additives in methods designed for covering oxidizable metal parts with protective deposits, notably preliminary to nickel-plating or chromium-plating processes as currently applied-to automotive parts.
  • the satisfactory surface condition of the copper deposit thus obtained permits reducing the thickness of the noble metals subsequently deposited thereon while preserving an eventually identical exterior appearance. Under these conditions, this invention is characterized by the economy resulting from the process set forth hereinabove, with the additional advantage resulting from the difference between the cost of the levelling agent of this invention and the additives previously utilized for the same purpose.
  • this invention should not be construed as being limited by the composition of electrolytic baths containing such levelling agents but should also be considered as comprising all articles provided with a deposit obtained from such baths.
  • An aqueous acid electrolytic coppering bath containing a copper salt, a brightener, and a surface tension agent, further comprising a leveling agent having the genwherein n is an integer in the range of about 500 to about 1000 and the -OR linkage is a derivative of a compound selected from the group consisting of: aliphatic alcohols having 4-8 carbon atoms, benzyl alcohol, and esters resulting from the reactions of a glycol with an acid selected from the group consisting of phthalic acid, malonic acid and maleie acid.
  • modified urea-formaldehyde resin is a sulfonated modified ureaformaldehyde resin, for facilitating its solution in the aqueous acid bath.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Chemically Coating (AREA)
US108141A 1970-01-22 1971-01-20 Acid coppering bath Expired - Lifetime US3704213A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR7002242A FR2076646A5 (enExample) 1970-01-22 1970-01-22

Publications (1)

Publication Number Publication Date
US3704213A true US3704213A (en) 1972-11-28

Family

ID=9049444

Family Applications (1)

Application Number Title Priority Date Filing Date
US108141A Expired - Lifetime US3704213A (en) 1970-01-22 1971-01-20 Acid coppering bath

Country Status (5)

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US (1) US3704213A (enExample)
BE (1) BE761663A (enExample)
CA (1) CA978891A (enExample)
FR (1) FR2076646A5 (enExample)
GB (1) GB1337841A (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3923613A (en) * 1972-02-22 1975-12-02 Kampschulte & Cie Dr W Acidic galvanic copper bath
US5232575A (en) * 1990-07-26 1993-08-03 Mcgean-Rohco, Inc. Polymeric leveling additive for acid electroplating baths
CN111501072A (zh) * 2020-05-09 2020-08-07 广东哈福科技有限公司 一种电镀铜镀液去钝化剂及电镀铜镀液

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3923613A (en) * 1972-02-22 1975-12-02 Kampschulte & Cie Dr W Acidic galvanic copper bath
US5232575A (en) * 1990-07-26 1993-08-03 Mcgean-Rohco, Inc. Polymeric leveling additive for acid electroplating baths
CN111501072A (zh) * 2020-05-09 2020-08-07 广东哈福科技有限公司 一种电镀铜镀液去钝化剂及电镀铜镀液
CN111501072B (zh) * 2020-05-09 2021-01-05 广东哈福科技有限公司 一种电镀铜镀液去钝化剂及电镀铜镀液

Also Published As

Publication number Publication date
GB1337841A (en) 1973-11-21
DE2102779B2 (de) 1972-11-30
FR2076646A5 (enExample) 1971-10-15
BE761663A (fr) 1971-06-16
DE2102779A1 (de) 1971-07-29
CA978891A (en) 1975-12-02

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