US3648355A - Method for making an electric contact material - Google Patents
Method for making an electric contact material Download PDFInfo
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- US3648355A US3648355A US51278A US3648355DA US3648355A US 3648355 A US3648355 A US 3648355A US 51278 A US51278 A US 51278A US 3648355D A US3648355D A US 3648355DA US 3648355 A US3648355 A US 3648355A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
- B32B15/018—Layered products comprising a layer of metal all layers being exclusively metallic one layer being formed of a noble metal or a noble metal alloy
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H1/00—Contacts
- H01H1/02—Contacts characterised by the material thereof
- H01H1/021—Composite material
- H01H1/023—Composite material having a noble metal as the basic material
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S428/00—Stock material or miscellaneous articles
- Y10S428/922—Static electricity metal bleed-off metallic stock
- Y10S428/9265—Special properties
- Y10S428/929—Electrical contact feature
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49204—Contact or terminal manufacturing
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12771—Transition metal-base component
- Y10T428/12861—Group VIII or IB metal-base component
- Y10T428/12868—Group IB metal-base component alternative to platinum group metal-base component [e.g., precious metal, etc.]
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12771—Transition metal-base component
- Y10T428/12861—Group VIII or IB metal-base component
- Y10T428/12896—Ag-base component
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12771—Transition metal-base component
- Y10T428/12861—Group VIII or IB metal-base component
- Y10T428/12903—Cu-base component
Definitions
- FIGZB FIG. 2C
- FIGZD FIGSD INVENTORS SANKICHI SHIDA TSUNEHIKD TODO-Ropq ATTORNEYS METHOD FOR MAKING AN ELECTRIC CONTACT MATERIAL
- This invention relates to a method for making an electric contact material and particularly said electric contact material is in a three layer bonded sheet including a palladium alloy top layer, a silver alloy intermediate layer and nickle-copper alloy spring layer.
- the advanced industry has required increasingly a more reliable electric contact material.
- the reliable electric contact material must be provided with a high resistance to chemical corrosion such as sulfurization and mechanical wear as well as a low contact resistance and a high spring action.
- FIG. 1 is a cross sectional view of a three layer bonded sheet according to the present invention
- FIGS. 2A through 2D are a schematic illustration of production steps of a three layer bonded sheet of FIG. 1,
- FIGS. 3A through 3D are another schematic illustration of production steps of a three layer bonded sheet of FIG. 1,
- FIG. 4 is variations of contact resistance with palladium content of palladium-silver alloy after sulfurization.
- a method for making an electric contact material according to the present invention comprises the following steps:
- FIG. I Reference character designates, as a whole, an electric contact material consisting essentially of a three layer bonded sheet which has the following layers integrated together in the order of top below; a palladium alloy top layer 1, a silver alloy intermediate layer 2 and a nickelcopper alloy spring layer 3. These layers I, 2 and 3 are bonded in a method described in detail hereinafter.
- the palladium alloy top layer I is to protect the silver alloy intermediate layer 2 from the sulfurization and oxidation during storage and operation.
- the nickel-copper alloy spring layer 3 is to provide the electric contact material 10 with spring action.
- the silver alloy intermediate layer 2 has a low electric resistance and acts as an electric contact part. A composition and thickness of each of three layers 1, 2 and 3 will be explained hereinafter.
- the method comprises a combination of following steps:
- An operable pressure range from 5 to 20 kg./cm. and can be applied by any suitable and available method during heating.
- the combination 20 is penched by two thick stainless steel plates which are clamped strongly at the four corners by bolts. After heating for given time which depends upon the size of the combination 20, the combination 20 is converted into a two layer bonded sheet 30 consisting of a palladium alloy top layer I and silver alloy intermediate layer 4.
- the bonding layer M diffuses away through the palladium alloy sheet 11 and the silver alloy sheet 12 during the heating and disappears when cooled to room temperature.
- the compositions of the palladium alloy top layer 1 and the silver alloy intermediate layer 4 are different from the original palladium alloy sheet 11 and the original silver alloy sheet 12, respectively due to the diffusion of bonding layer M.
- the palladium alloy sheet 11 is in a composition consisting essentially of a main ingredient of palladium, a first additive ingredient selected from the group consisting of nickel, cobalt and copper and a second additive ingredient selected from the group consisting of silver and copper.
- the bonding layer I I consisting essentially of a member selected from the group consisting of a copper layer and a combination of a copper layer and an indium layer.
- the bonding layer M can be formed by any suitable and available methods such as vacuum deposition or electrochemical deposition of bonding material on either palladium alloy sheet I] or silver alloy sheet 12. Another method is to insert bonding material foil between the palladium alloy sheet II and silver alloy sheet 12.
- Said another bonding layer I5 has a composition essentially the same as that of said bonding layer Id and can be formed in a manner similar to that of the bonding layer I4.
- the combination 10 After heating for given time which depends upon the size of the combination M, the combination 10 is converted into a three layer bonded sheet 50 consisting of a palladium alloy top layer I, a silver alloy intermediate layer 2 and a nickel-copper alloy spring layer 3.
- the another bonding layer 15 diffuses away through the silver alloy layer 4 and the nickel-copper alloy sheet I3 during the heating and disappears when cooled to room temperature.
- the composition of the silver alloy intermediate layer 2 and the nickel-copper alloy spring layer 3 are different from the original silver alloy intermediate layer I and the original nickel-copper alloy sheet I3, respectively clue to the diffusion of another bonding layer IS.
- a heating atmosphere on bonding step l) and (2) must be non-oxidizing atmosphere such as nitrogen gas, argon gas or vacuum for prevention of oxidation of electric contact material. It is necessary that the second boiling temperature is always lower than the first bonding temperature.
- a third step for rolling the cooled three layer bonded sheet 50 into an electric contact material I0 having a desired thickness is 620 to 670 C. for 1 hour. This method makes it possible to form a fine electric contact material characterized by the strong bonding strength between each two layers.
- Operable composition for the silver alloy sheet I2 consists essentially of 60 to 97 wt. percent of silver and 3 to 40 wt. percent of copper. Copper, indium, lead, tin, zinc, etc. and their combinations are useful for bonding layer M. In view of the electric contact characteristics, copper and indium are preferable.
- each of two bonding layers 14 and 15 is preferably composed of a copper layer in view of the solidus temperature of silver alloy sheet 12.
- each of two bonding layers 14 and 15 must be composed of a combination of a copper layer 14-1 or 15-1 and indium layer 14-2 or 15-2 in view of the eutectic temperature of silver alloy sheet 12 as shown in FIGS. 3A through 3D in which similar characters designate components similar to those of FIGS. 2A through 2D. It has been discovered according to the present invention that a higher bonding strength can be obtained by facing the copper layer 15-1 to the nickel-copper alloy sheet 13. A combination of a copper layer 14-1 or 15-1 and an indium layer 14-2 or 15-2 reacts with silver-copper alloy to form silver-copper-indium eutectic composition having a melting point lower than that of silver-copper alloy.
- a thickness of the two bonding layers 14 and 15 less than 20 microns results in a low bonding strength.
- the bonding layer 14 and 15 thicker than 50 microns causes larger amounts of copper to diffuse to a surface of the palladium alloy sheet 11 during heating at the first bonding temperature. The diffused copper on the surface impairs the electric contact characteristics.
- the bonding layer 15 thicker than 50 microns fails to form a complete eutectic melt and remains a part of copper unmelted. This impairs the bonding strength. Operable thickness of the two bonding layers 14 and 15 must be 20 to 50 microns.
- a thickness ratio of the copper layer to indium layer preferably ranges from 1:1 to 1:2.
- An indium layer thicker than the ratio 1:1 produces a large amount of electric melt at an interface between the palladium alloy sheet 1 l and the silver alloy sheet 12 or between the two layer bonded sheet 30 and the nickel-copper alloy sheet 13.
- the large amount of eutectic melt leaks away from the interface and prevents a formation of smooth interface. This also impairs the bonding strength.
- a foresaid palladium alloy top layer 1 is to protect the silver alloy intermediate layer 2 from a chemical erosion such as sulfurization.
- An operable thickness of said palladium alloy top layer 1 is 0.5 to 5 microns.
- the sulfurization limit is 40 wt. percent of palladium for palladium-silver alloy in view of the contact resistance. The necessity can be satisfied by employing a palladium alloy sheet 11 in a composition listed in table 1.
- Nickel or cobalt is effective in strengthening the palladium alloy top layer 1.
- Nickel or cobalt more than 6 wt. percent is apt to segregate and impair the ductility and workability of palladium alloy sheet 11.
- Palladium-nickel or palladium-cobalt alloy without silver and/or copper causes silver and/or copper to diffuse irregularly from the silver alloy sheet 12 and the bonding layer 14. The irregular diffusion results in a dappled surface of palladium alloy top layer 1.
- An addition of copper or silver of at least 2 wt. percent can prevent the irregular diffusion of silver and/or copper in the palladium alloy top layer 1.
- Upper limit of copper addition is 15 wt. percent in view of the electric contact characteristics.
- Upon limit of silver addition is 39 wt. percent in view of the sulfurization of palladium alloy top layer 1.
- Silver alloys in a composition of table 2 are advantageous in view of mechanical properties and electric contact characteristics as intermediate layer. Copper less than 3 wt. percent does not provide the intermediate layer 2 with sufiicient mechanical properties. Copper above 40 wt. percent has no effect to increase the mechanical properties and impairs electric contact characteristics.
- a composition listed in table 3 is useful for nickel-copper alloy sheet which forms finally into a spring layer.
- the carbon content in the nickel-copper alloy is important factor for the elasticity. Carbon content must be less than 0.08 wt. percent. Ductility and fatigue strength are damaged when carbon content is higher than 0.08 wt. percent.
- the thickness of palladium alloy top layer 1 of rolled three layer bonded sheet 10 is 0.5 to 5 microns.
- the effect of palladium alloy top layer 1 against sulfide formation is not sufficient when thickness of palladium alloy top layer 1 is less than 0.5 microns. Above 5 microns, other convenient methods serve the purpose of making this type of electric contact material.
- a three layer electric contact material such as shown in FIG. 1 was made by following steps. Referring to FIG. 3, a palladium alloy sheet 11 was in a composition of wt. percent of palladium, 12 wt. percent of silver and 3 wt.
- percent of nickel and a silver alloy sheet 12 was in a composition of 85 wt. percent of silver, 13 wt. percent of copper and 2 wt. percent of nickel.
- Original thicknesses of the palladium alloy sheet 11 and the silver alloy sheet 12 were 0.3 and 4.2 mm. respectively. Both sheets were cleaned on their surfaces to remove gross contaminations by a usual manner. Then a copper layer 14-1 of 20 microns thick and an indium layer 14- 2 of 20 microns were electro-chemically deposited on the palladium alloy sheet 11 and silver alloy sheet 12 respectively.
- a combination 20 was penched under pressure of about 10 kgJcm. by two thick stainless steel plates which were clamped strongly at the four comers by bolts so that electrochemically deposited layers were faced closely to each other.
- the penched combination was held at 750 C. for 30 minutes in vacuum (10 mm. Hg).
- the combination 20 was converted into a two layer bonded sheet 30 of 1 mm. thick after three repetitions of a cycle of annealing at 550 C. for 30 minutes and cold-rolling of 40 percent reduction.
- a nickel-copper alloy sheet 13 of 9 mm. thick was cleaned on its surface.
- a copper layer 15-1 of 20 microns thick was electro-chemically deposited on the nickel-copper alloy sheet 13 as shown in FIG. 30.
- An indium layer 15-2 of 20 microns thick was electro-chemically deposited on the silver alloy intermediate layer 4.
- the combination 40 was penched in a way similar to that of first step under pressure of about 50 kg./cm. and held at 700 C. for 30 minutes in vacuum mm. Hg).
- three layer bonded sheet 50 was converted into an electric contact material 10 of 0.15 mm. thick after six repetitions of a cycle of annealing at 650 C. for 40 minutes and cold-rolling. The rolling process was followed by the annealing process every time when thickness of the three layer bonded sheet 50 was 5 mm., 2.4 mm., 1.2 mm., 0.6 mm., and 0.3 mm. Final reduction of thickness was 50 percent and the palladium alloy top layer 1 was in a thickness of about 1.5 micron by a microscopic examination. The palladium content of the surface of the palladium alloy top layer 1 was determined to be above 40 wt. percent by using microanalyzer. Other elements were mainly silver, copper and nickel. indium was detected as trace.
- Table 4 shows the mechanical properties of so produced electric contact material.
- the electric contact material was subjected to a sulfurization test shown by table 4. After testing, the electric contact material had a contact resistance of 0.024 as shown in table 4.
- the sulfurization test was carried out by holding the electric contact material at 85 C. for 100 hours in air including 100 ppm. of H 8.
- the contact resistance was measured in the following manner. A gold electrode having a spherical surface at the end was brought into against a contact with the surface of electric contact material under pressure of 20 g. A direct current of 10 ma. was designed to flow from the GOLD electrode through the contact area to the electric contact material. The potential drop across the gold electrode and the electric contact material was measured by an electronic galvanometer and was calculated into a contact resistance.
- Example 2 is substantially the same as example 1 and was made by the method described in example 1 except that a palladium alloy sheet 11 was in a composition of 95 wt. percent of palladium, 2 wt. percent of silver and 3 wt. percent of cobalt and that a silver alloy sheet 12 was in a composition of 60 wt. percent of silver, 37 wt. percent of copper and 3 wt. percent of nickel.
- Table 4 shows the mechanical properties and contact resistance after sulfurization test of resultant electric contact material.
- Example 3 is substantially the same as example 1 and was made by the method described in example 1. Example 3 differs from example 1 in the following:
- a palladium alloy sheet 11 was in a composition of 84 wt. percent of palladium, l5 wt. percent of copper and 1 wt. percent of nickel and silver alloy sheet 12 was in a composition of 93 wt. percent of silver, 6 wt. percent of copper and 1 wt. percent of nickel.
- Each of bonding layers 14 and 15 was a combination of copper and 30 microns thick and indium of 15 microns thick.
- Table 4 shows the mechanical properties and contact resistance after sulfurization test of resultant electric contact material.
- Example 4 is substantially the same as example 1 and was made by the method described in example 1. Example 4 differs from example 1 in the following:
- a palladium alloy sheet 11 was in a composition of 60 wt. percent of palladium, 34 wt. percent of silver and 6 wt. percent of nickel and was in an original thickness of 1.35 mm.
- a silver alloy sheet 12 was in a composition of 60 wt. percent of silver, 39.95 wt. percent of copper and 0.05 wt. percent of phosphorous and was in an original thickness of 3.15 mm.
- Table 4 shows the mechanical properties and contact resistance after sulfurization test of resultant electric contact material and the palladium alloy top layer 1 was in a thickness of about 5 microns by a microscopic examination.
- Example 5 is substantially the same as example I and was made by the method described in example I.
- Example 4 differs from example 1 in the following:
- a palladium alloy sheet 11 was in a composition of 75 wt. percent of palladium, 15 wt. percent of copper and 6 wt. percent of cobalt and was in an original thickness of l.35 mm.
- a silver alloy sheet 12 was in a composition of wt. percent of silver, l3 wt. percent of copper and 2 wt. percent of nickel and was in an original thickness of 3.15 mm.
- Each of bonding layers 14 and 15 was a combination of copper of 25 microns thick and indium of 25 microns thick.
- Table 4 shows the mechanical properties and contact resistance after sulfurization test of resultant electric contact material.
- Example 6 is substantially the same as example 1 and was made by the method described in example I.
- Example 6 differs from example l in the following:
- a palladium alloy sheet 11 was in a composition of 60 wt. percent of palladium, 25 wt. percent of silver and I5 wt. percent of copper and was in an original thickness of 1.2 mm.
- a silver alloy sheet 12 was in an original thickness of 3.3 mm.
- Each of bonding layers 14 and 15 was a combination of copper and 10 microns thick and indium of 10 microns thick.
- Table 4 shows the mechanical properties and contact resistance after sulfurization test of resultant electric contact material.
- EXAMPLE 7 This example is substantially the same as example 1.
- a palladium alloy sheet 11 was in a composition of 60 wt. percent of palladium, 39 wt. percent of silver and 1 wt. percent of cobalt, and was in an original thickness of 0.6 mm.
- a silver alloy sheet 12 was in a composition of 93 wt. percent of silver, 6 wt. percent of copper and 1 wt. percent of nickel and was in an original thickness of 8.4 mm.
- a copper layer 14-1 of 20 microns thick and an indium layer 14-2 of 20 microns thick were electro-chemically deposited on the palladium alloy sheet 11 and silver alloy sheet 12 respectively. Then a combination 20 was bonded at 720 C. for 30 minutes in the same manner of example 1 and was converted into a two layer bonded sheet 30 of 1.2 mm. thick after two repetitions of a cycle of annealing at 550 C. for 20 minutes and cold-running of about 65 percent reduction.
- a nickel-copper alloy sheet 13 of l0.8 mm. thick was cleaned on its surface.
- a copper layer 15-1 of 20 microns thick was electro-chemically deposited on the nickel-copper alloy sheet 13.
- An indium layer 15-2 of 20 microns thick was electro-chemically deposited on the silver alloy intermediate layer 41.
- a combination 40 was bonded at 700 C. for 30 minutes in the same manner of first step and was converted into an electric contact material 10 of 0.15 mm. thick after four repetitions of a cycle of annealing at 650 C. for 30 minutes and cold-rolling. The rolling process was followed by the annealing process every time when thickness of the three layer bonded sheet 50 was 9.6 mm., 2.4 mm. and 0.6 mm. Final reduction of thickness was 75 percent.
- Table 4 shows the mechanical properties of so produced electric contact material. After sulfurization test carried out similarly to example 1, the electric contact material had a contact resistance of 0.038 as shown in table 4.
- Example 8 is substantially the same as example 1 and was made by the method described in example 7 except that a palladium alloy sheet 11 was in a composition of 60 wt. percent of palladium, 37 wt. percent of silver and 3 wt. percent of copper and that silver alloy sheet 12 was in a composition of 60 wt. percent of silver, 37 wt. percent of copper and 3 wt. 1 percent of copper and 3 wt. percent of nickel.
- Table 4 shows the mechanical properties and contact resistance after sulfurization test of resultant electric contact material.
- Example 9 is substantially the same as example 1 and was made by the method described in example 7 except that a palladium alloy sheet 11 was in a composition of 84 wt. percent of palladium, wt. percent of copper and 1 wt. percent of EXAMPLE 10
- Example 10 is substantially the same as example 1 and was 3 made by the method described in example 7.
- Example 3 differs from example 7 in the following:
- a palladium alloy sheet 11 was in a composition of 95 wt. percent of palladium, 2 wt. percent of copper and 3 wt. percent of nickel and was in an original thickness of 0.2 mm.
- silver alloy sheet 12 was in an original thickness of 8.8 mm.
- Table 4 shows the mechanical properties and contact resistance after sulfurization test of resultant electric contact material and the palladium alloy top layer 1 was in a thickness of about 0.5 microns by a microscopic examination.
- EXAMPLE 1 This example is substantially the same as example 1.
- a palladium alloy sheet 11 was in a composition 5 of 95 wt. percent of palladium, 2 wt. percent of silver and 3 wt.. percent of nickel and was in an original thickness of 0.6 mm.
- a silver alloy sheet 12 was in a composition of 96.5 wt. percent of silver, 3 wt. percent of copper and 0.5 wt. percent of nickel and was in an original thickness of 8.4 mm.
- a copper layer 14 of 20 microns thick was electro-chemically deposited on the silver alloy sheet 12 and a combination 20 was penched in the same manner of example 1 so that the copper layer 14 and the palladium alloy sistance after sulfurization test of resultant electric contact material.
- Example 12 is substantially the same as example 1 and was made by the method described in example 11 except that a palladium alloy sheet 11 was in a composition of 95 wt. percent of palladium, 2 wt. percent of silver and 3 wt. percent of copper and that a silver alloy sheet 12 was in a composition of 96,8 wt. percent of silver, 3 wt. percent of copper and 0.2 wt. percent of phosphorous.
- Table 4 shows the mechanical properties and contact resistance after sulfurization test of resultant electric contact material.
- EXAMPLE 13 This example is substantially the same as example 1.
- a palladium alloy sheet 11 was in a composition of 60 wt. percent of palladium, 39 wt. percent of silver and 1 wt. percent of nickel and a silver alloy sheet 12 was in a composition of 96.5 wt. percent of silver, 3 wt. percent of copper and 0.5 wt. percent of nickel.
- Original thickness of the palladium alloy sheet 11 and the silver alloy sheet 12 were L2 and 3.3 mm. respectively. After both sheets were cleaned on their surfaces, a copper layer 14 of 30 microns thick was electrochemically deposited on the silver alloy sheet 12 and a combination 20 was penched under pressure of about 20 kgJcm.
- a nickel-copper alloy sheet 13 of 9 mm. thick was cleaned on its surface.
- a copper layer 15 of 30 microns thick was electro-chemically deposited on the nickel-copper alloy sheet 13.
- the combination 40 was penched under pressure of about 70 kg./cm. in the same manner of example I and held 830 C. for 30 minutes in vacuum 10 mm. Hg).
- three layer bonded sheet was converted into an electric contact material 10 of 0.15 mm. thick in the same manner of example 1 except that annealing condition was in a 5 temperature of 620 C. and was in a holding time of 1 hour.
- Table 4 shows the mechanical properties and contact re- Table 4 shows the mechanical properties and contact resistance after sulfurization test of resultant electric contact material.
- Example 14 is substantially the same as example 1 and was made by the method described in example 13 except that a palladium alloy sheet 11 was in a composition of 60 wt. percent of palladium, 34 wt. percent of silver and 6 wt. percent of cobalt.
- Table 4 shows the mechanical properties and contact resistance after sulfurization test of resultant electric contact material.
- Example 15 is substantially the same as example 1 and was made by the method described in example 13. Example 15 differs from example 13 in the following:
- a palladium alloy sheet 11 was in a composition of 79 wt. percent of palladium, l5 wt. percent of copper and 6 wt. percent of nickel and a silver alloy sheet 12 was in a composition of 94 wt. percent of silver, 6.5 wt. percent of copper and 0.5 wt. percent of nickel.
- An annealing temperature of three layer bonded sheet 50 was 670 C.
- Table 4 shows the mechanical properties and contact resistance after sulfurization test of resultant electric contact material.
- Example 17 is substantially the same as example 1 and was made by the method described in example 13. Example 17 differs from example 13 in the following:
- a palladium alloy sheet 11 was in a composition of 95 wt. percent of palladium, 3 wt. percent of silver and 2 wt. percent of copper. Copper layers 14 and were in a thickness of microns. An annealing temperature of three layers bonded sheet 50 was 670 C.
- Table 4 shows the mechanical properties and contact resistance after sulfurization test of resultant electric contact material.
- a method for making an electric contact material defined in claim 3, said combination has a thickness of 20 to microns whereby a thickness ratio of an indium layer to said copper layer ranges from 1:1 to 1:2.
- a method for making an electric contact material comprising heating a combination of a palladium alloy sheet and a silver alloy sheet having a bonding layer inserted thcrebetween under pressure at a first bonding temperature of 720 to 850 C., whereby said bonding layer diffuses into both said palladium alloy sheet and said silver alloy sheet to form a two layer bonded sheet, said palladium alloy sheet being in a composition consisting essentially of a main ingredient of palladium, a first additive ingredient selected from the group consisting of nickel, cobalt and copper and a second additive ingredient selected from the group consisting of silver and copper and said bonding layer consisting essentially of a member selected from the group consisting of a copper layer and a combination of a copper layer and an indium layer;
- metal selected from the group consisting of nickel and cobalt, 2 to 39 wt. percent of silver and 60 to wt. percent of palladium.
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Application Number | Priority Date | Filing Date | Title |
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JP44053639A JPS5030587B1 (ko) | 1969-07-02 | 1969-07-02 |
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US3648355A true US3648355A (en) | 1972-03-14 |
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US51278A Expired - Lifetime US3648355A (en) | 1969-07-02 | 1970-06-30 | Method for making an electric contact material |
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US (1) | US3648355A (ko) |
JP (1) | JPS5030587B1 (ko) |
CA (1) | CA932258A (ko) |
FR (1) | FR2054003A5 (ko) |
GB (1) | GB1312151A (ko) |
NL (1) | NL145087B (ko) |
Cited By (36)
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US3803711A (en) * | 1971-02-04 | 1974-04-16 | Texas Instruments Inc | Electrical contact and method of fabrication |
US4111515A (en) * | 1975-09-12 | 1978-09-05 | Nigg Juerg | Lamp holder for twin-socket type halogen lamps |
US4138604A (en) * | 1975-09-13 | 1979-02-06 | W. C. Heraeus Gmbh | Electrical plug-type connector |
US4246321A (en) * | 1978-12-20 | 1981-01-20 | Chugai Denki Kogya Kabushiki-Kaisha | Ag-SnO Alloy composite electrical contact |
US4529667A (en) * | 1983-04-06 | 1985-07-16 | The Furukawa Electric Company, Ltd. | Silver-coated electric composite materials |
US4980245A (en) * | 1989-09-08 | 1990-12-25 | Precision Concepts, Inc. | Multi-element metallic composite article |
US5139890A (en) * | 1991-09-30 | 1992-08-18 | Olin Corporation | Silver-coated electrical components |
US5436082A (en) * | 1993-12-27 | 1995-07-25 | National Semiconductor Corporation | Protective coating combination for lead frames |
US5650661A (en) * | 1993-12-27 | 1997-07-22 | National Semiconductor Corporation | Protective coating combination for lead frames |
US5679471A (en) * | 1995-10-16 | 1997-10-21 | General Motors Corporation | Silver-nickel nano-composite coating for terminals of separable electrical connectors |
US5728285A (en) * | 1993-12-27 | 1998-03-17 | National Semiconductor Corporation | Protective coating combination for lead frames |
US5767574A (en) * | 1996-03-26 | 1998-06-16 | Samsung Aerospace Industries, Ltd. | Semiconductor lead frame |
US5876862A (en) * | 1995-02-24 | 1999-03-02 | Mabuchi Motor Co., Ltd. | Sliding contact material, clad compoosite material, commutator employing said material and direct current motor employing said commutator |
US5953511A (en) * | 1997-04-08 | 1999-09-14 | National Instruments Corporation | PCI bus to IEEE 1394 bus translator |
US6022832A (en) * | 1997-09-23 | 2000-02-08 | American Superconductor Corporation | Low vacuum vapor process for producing superconductor articles with epitaxial layers |
US6027564A (en) * | 1997-09-23 | 2000-02-22 | American Superconductor Corporation | Low vacuum vapor process for producing epitaxial layers |
US6150711A (en) * | 1997-02-20 | 2000-11-21 | Samsung Aerospace Industries, Ltd | Multi-layer plated lead frame |
US6428635B1 (en) | 1997-10-01 | 2002-08-06 | American Superconductor Corporation | Substrates for superconductors |
US6443354B1 (en) * | 1999-02-05 | 2002-09-03 | Plansee Aktiengesellschaft | Process for the production of a composite component that can resist high thermal stress |
US6458223B1 (en) | 1997-10-01 | 2002-10-01 | American Superconductor Corporation | Alloy materials |
US6475311B1 (en) | 1999-03-31 | 2002-11-05 | American Superconductor Corporation | Alloy materials |
US20040072452A1 (en) * | 1998-02-13 | 2004-04-15 | Formfactor, Inc. | Microelectronic contact structures, and methods of making same |
US20050109821A1 (en) * | 2003-11-25 | 2005-05-26 | Anwu Li | Diffusion bonding for metallic membrane joining with metallic module |
US20050148214A1 (en) * | 1998-12-02 | 2005-07-07 | Formfactor, Inc. | Lithographic contact elements |
CN100389005C (zh) * | 2005-09-21 | 2008-05-21 | 浙江大学 | 一种Cu/Ag双金属复合板制备方法 |
CN100390913C (zh) * | 2006-03-02 | 2008-05-28 | 乐百令 | 三复合电触头制造工艺 |
US7812691B1 (en) | 2007-11-08 | 2010-10-12 | Greatbatch Ltd. | Functionally graded coatings for lead wires in medical implantable hermetic feedthrough assemblies |
CN101681728B (zh) * | 2007-03-27 | 2012-08-22 | 古河电气工业株式会社 | 用于可动接点部件的银包覆材料及其制造方法 |
US20150011132A1 (en) * | 2012-02-03 | 2015-01-08 | Jx Nippon Mining & Metals Corporation | Press-fit terminal and electronic component using the same |
US20160331979A1 (en) * | 2013-08-07 | 2016-11-17 | Heraeus Deutschland GmbH & Co. KG | Feedthrough with integrated brazeless ferrule |
US9576693B2 (en) | 2011-09-20 | 2017-02-21 | Jx Nippon Mining & Metals Corporation | Metal material for electronic component and method for manufacturing the same |
US9580783B2 (en) | 2011-10-04 | 2017-02-28 | Jx Nippon Mining & Metals Corporation | Electronic component metal material and method for manufacturing the same |
WO2019003017A3 (en) * | 2017-06-28 | 2019-02-21 | Ethicon Llc | SURGICAL TREE ASSEMBLIES WITH WATERPROOF HOUSINGS |
US10530084B2 (en) | 2012-06-27 | 2020-01-07 | Jx Nippon Mining & Metals Corporation | Metallic material for electronic components and method for producing same, and connector terminals, connectors and electronic components using same |
US10594066B2 (en) | 2012-06-27 | 2020-03-17 | Jx Nippon Mining & Metals Corporation | Metallic material for electronic components and method for producing same, and connector terminals, connectors and electronic components using same |
US11296436B2 (en) * | 2019-06-10 | 2022-04-05 | Rohm And Haas Electronic Materials Llc | Press-fit terminal with improved whisker inhibition |
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- 1970-07-02 NL NL707009800A patent/NL145087B/xx unknown
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US2303497A (en) * | 1938-10-27 | 1942-12-01 | Bell Telephone Labor Inc | Duplex metal body |
US2691816A (en) * | 1951-01-04 | 1954-10-19 | Metals & Controls Corp | Manufacture of composite multilayer sheet metal material |
US3091026A (en) * | 1958-11-13 | 1963-05-28 | Engelhard Ind Inc | Method of making wire |
US3514840A (en) * | 1968-04-18 | 1970-06-02 | Allegheny Ludlum Steel | Method of fabricating narrow-width composites |
Cited By (46)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3803711A (en) * | 1971-02-04 | 1974-04-16 | Texas Instruments Inc | Electrical contact and method of fabrication |
US4111515A (en) * | 1975-09-12 | 1978-09-05 | Nigg Juerg | Lamp holder for twin-socket type halogen lamps |
US4138604A (en) * | 1975-09-13 | 1979-02-06 | W. C. Heraeus Gmbh | Electrical plug-type connector |
US4246321A (en) * | 1978-12-20 | 1981-01-20 | Chugai Denki Kogya Kabushiki-Kaisha | Ag-SnO Alloy composite electrical contact |
US4529667A (en) * | 1983-04-06 | 1985-07-16 | The Furukawa Electric Company, Ltd. | Silver-coated electric composite materials |
US4980245A (en) * | 1989-09-08 | 1990-12-25 | Precision Concepts, Inc. | Multi-element metallic composite article |
US5139890A (en) * | 1991-09-30 | 1992-08-18 | Olin Corporation | Silver-coated electrical components |
US5728285A (en) * | 1993-12-27 | 1998-03-17 | National Semiconductor Corporation | Protective coating combination for lead frames |
US5650661A (en) * | 1993-12-27 | 1997-07-22 | National Semiconductor Corporation | Protective coating combination for lead frames |
US5436082A (en) * | 1993-12-27 | 1995-07-25 | National Semiconductor Corporation | Protective coating combination for lead frames |
US5876862A (en) * | 1995-02-24 | 1999-03-02 | Mabuchi Motor Co., Ltd. | Sliding contact material, clad compoosite material, commutator employing said material and direct current motor employing said commutator |
US5679471A (en) * | 1995-10-16 | 1997-10-21 | General Motors Corporation | Silver-nickel nano-composite coating for terminals of separable electrical connectors |
US5767574A (en) * | 1996-03-26 | 1998-06-16 | Samsung Aerospace Industries, Ltd. | Semiconductor lead frame |
US6150711A (en) * | 1997-02-20 | 2000-11-21 | Samsung Aerospace Industries, Ltd | Multi-layer plated lead frame |
US5953511A (en) * | 1997-04-08 | 1999-09-14 | National Instruments Corporation | PCI bus to IEEE 1394 bus translator |
US6022832A (en) * | 1997-09-23 | 2000-02-08 | American Superconductor Corporation | Low vacuum vapor process for producing superconductor articles with epitaxial layers |
US6027564A (en) * | 1997-09-23 | 2000-02-22 | American Superconductor Corporation | Low vacuum vapor process for producing epitaxial layers |
US6426320B1 (en) | 1997-09-23 | 2002-07-30 | American Superconductors Corporation | Low vacuum vapor process for producing superconductor articles with epitaxial layers |
US6458223B1 (en) | 1997-10-01 | 2002-10-01 | American Superconductor Corporation | Alloy materials |
US6428635B1 (en) | 1997-10-01 | 2002-08-06 | American Superconductor Corporation | Substrates for superconductors |
US20040072452A1 (en) * | 1998-02-13 | 2004-04-15 | Formfactor, Inc. | Microelectronic contact structures, and methods of making same |
US7798822B2 (en) | 1998-02-13 | 2010-09-21 | Formfactor, Inc. | Microelectronic contact structures |
US20090286429A1 (en) * | 1998-02-13 | 2009-11-19 | Formfactor, Inc. | Microelectronic contact structures, and methods of making same |
US20100088888A1 (en) * | 1998-12-02 | 2010-04-15 | Formfactor, Inc. | Lithographic contact elements |
US20050148214A1 (en) * | 1998-12-02 | 2005-07-07 | Formfactor, Inc. | Lithographic contact elements |
US7287322B2 (en) | 1998-12-02 | 2007-10-30 | Formfactor, Inc. | Lithographic contact elements |
US20080115353A1 (en) * | 1998-12-02 | 2008-05-22 | Formfactor, Inc. | Lithographic contact elements |
US7555836B2 (en) | 1998-12-02 | 2009-07-07 | Formfactor, Inc. | Method of making lithographic contact elements |
US6443354B1 (en) * | 1999-02-05 | 2002-09-03 | Plansee Aktiengesellschaft | Process for the production of a composite component that can resist high thermal stress |
US6475311B1 (en) | 1999-03-31 | 2002-11-05 | American Superconductor Corporation | Alloy materials |
US20050109821A1 (en) * | 2003-11-25 | 2005-05-26 | Anwu Li | Diffusion bonding for metallic membrane joining with metallic module |
US7353982B2 (en) * | 2003-11-25 | 2008-04-08 | Membrane Reactor Technologies Ltd. | Diffusion bonding for metallic membrane joining with metallic module |
CN100389005C (zh) * | 2005-09-21 | 2008-05-21 | 浙江大学 | 一种Cu/Ag双金属复合板制备方法 |
CN100390913C (zh) * | 2006-03-02 | 2008-05-28 | 乐百令 | 三复合电触头制造工艺 |
CN101681728B (zh) * | 2007-03-27 | 2012-08-22 | 古河电气工业株式会社 | 用于可动接点部件的银包覆材料及其制造方法 |
US7812691B1 (en) | 2007-11-08 | 2010-10-12 | Greatbatch Ltd. | Functionally graded coatings for lead wires in medical implantable hermetic feedthrough assemblies |
US9576693B2 (en) | 2011-09-20 | 2017-02-21 | Jx Nippon Mining & Metals Corporation | Metal material for electronic component and method for manufacturing the same |
US9580783B2 (en) | 2011-10-04 | 2017-02-28 | Jx Nippon Mining & Metals Corporation | Electronic component metal material and method for manufacturing the same |
US20150011132A1 (en) * | 2012-02-03 | 2015-01-08 | Jx Nippon Mining & Metals Corporation | Press-fit terminal and electronic component using the same |
US9728878B2 (en) * | 2012-02-03 | 2017-08-08 | Jx Nippon Mining & Metals Corporation | Press-fit terminal and electronic component using the same |
US10530084B2 (en) | 2012-06-27 | 2020-01-07 | Jx Nippon Mining & Metals Corporation | Metallic material for electronic components and method for producing same, and connector terminals, connectors and electronic components using same |
US10594066B2 (en) | 2012-06-27 | 2020-03-17 | Jx Nippon Mining & Metals Corporation | Metallic material for electronic components and method for producing same, and connector terminals, connectors and electronic components using same |
US20160331979A1 (en) * | 2013-08-07 | 2016-11-17 | Heraeus Deutschland GmbH & Co. KG | Feedthrough with integrated brazeless ferrule |
US9814891B2 (en) * | 2013-08-07 | 2017-11-14 | Heraeus Duetschland Gmbh & Co. Kg | Feedthrough with integrated brazeless ferrule |
WO2019003017A3 (en) * | 2017-06-28 | 2019-02-21 | Ethicon Llc | SURGICAL TREE ASSEMBLIES WITH WATERPROOF HOUSINGS |
US11296436B2 (en) * | 2019-06-10 | 2022-04-05 | Rohm And Haas Electronic Materials Llc | Press-fit terminal with improved whisker inhibition |
Also Published As
Publication number | Publication date |
---|---|
NL145087B (nl) | 1975-02-17 |
DE2033870B2 (de) | 1974-06-20 |
FR2054003A5 (ko) | 1971-04-16 |
NL7009800A (ko) | 1971-01-05 |
CA932258A (en) | 1973-08-21 |
DE2033870A1 (de) | 1971-02-25 |
GB1312151A (en) | 1973-04-04 |
JPS5030587B1 (ko) | 1975-10-02 |
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