GB1312151A - Manufacture of composite materials - Google Patents

Manufacture of composite materials

Info

Publication number
GB1312151A
GB1312151A GB3217970A GB3217970A GB1312151A GB 1312151 A GB1312151 A GB 1312151A GB 3217970 A GB3217970 A GB 3217970A GB 3217970 A GB3217970 A GB 3217970A GB 1312151 A GB1312151 A GB 1312151A
Authority
GB
United Kingdom
Prior art keywords
bonding
alloy sheet
sheet
layer
sheets
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB3217970A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Publication of GB1312151A publication Critical patent/GB1312151A/en
Expired legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
    • B32B15/018—Layered products comprising a layer of metal all layers being exclusively metallic one layer being formed of a noble metal or a noble metal alloy
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H1/00—Contacts
    • H01H1/02—Contacts characterised by the material thereof
    • H01H1/021—Composite material
    • H01H1/023—Composite material having a noble metal as the basic material
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/922—Static electricity metal bleed-off metallic stock
    • Y10S428/9265—Special properties
    • Y10S428/929—Electrical contact feature
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49204—Contact or terminal manufacturing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12861—Group VIII or IB metal-base component
    • Y10T428/12868—Group IB metal-base component alternative to platinum group metal-base component [e.g., precious metal, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12861—Group VIII or IB metal-base component
    • Y10T428/12896—Ag-base component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12861—Group VIII or IB metal-base component
    • Y10T428/12903—Cu-base component

Abstract

1312151 Welding by pressure MATSUSHITA ELECTRIC INDUSTRIAL CO Ltd 2 July 1970 [2 July 1969] 32179/70 Heading B3R A method of making a composite three-layer material suitable for use for electric contacts comprises heating under pressure an assembly consisting of a Pd alloy sheet and a Ag alloy sheet with an interposed bonding medium consisting essentially of Cu or Cu and In so that the bonding material diffuses into the Pd and Ag alloy sheets to form a two-layer sheet and heating under pressure an assembly comprising the bonded two-layer sheet and a Ni-Cu alloy sheet with an interposed bonding material to form the three-layer material. The Pd alloy sheet may have any of the following compositions in weight per cent: Pd Ag Ni Co Cu 60-95 2-39 1-6 - - 60-95 2-39 - 1-6 - 79-95 - 1-6 - 2-15 79-95 - - 1-6 2-15 60-95 2-37 - - 3-15 The Ag alloy sheet may have the following compositions in weight per cent: Ag Cu P Ni 60-96À8 3-39À95 0À05-0À2 - 60-96À5 3-37 - 0À5-3 The Ni-Cu alloy sheet may have the following composition: Ni Fe Mn Si S C Cu 63À0-70À0 <2À5 <1À25 <0À5 <0À024 <0À08 Balance. The bonding material for both bonding steps may be a single sheet or two sheets, one of Cu and the other In, and these may be deposited by vacuum or electrodeposition on the Pd, Ag or Ni-Cu sheets or inserted as foil. The bonding layer is preferably of a thickness of 20-50 microns. Pressures employed in the two bonding steps are in the ranges 5-20 kg./cm.<SP>2</SP> and 30 to 70 kg./cm.<SP>2</SP> while the temperatures are 720-850‹ C. and 700-830‹ C. Bonding is carried out in a non-oxidizing atmosphere, e.g. of N 2 or A or under vacuum and with the workpieces clamped between thick stainless steel plates bolted together at the four corners. The bonding steps are followed by successive rolling and annealing steps to reduce the material to the required thickness.
GB3217970A 1969-07-02 1970-07-02 Manufacture of composite materials Expired GB1312151A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP44053639A JPS5030587B1 (en) 1969-07-02 1969-07-02

Publications (1)

Publication Number Publication Date
GB1312151A true GB1312151A (en) 1973-04-04

Family

ID=12948461

Family Applications (1)

Application Number Title Priority Date Filing Date
GB3217970A Expired GB1312151A (en) 1969-07-02 1970-07-02 Manufacture of composite materials

Country Status (6)

Country Link
US (1) US3648355A (en)
JP (1) JPS5030587B1 (en)
CA (1) CA932258A (en)
FR (1) FR2054003A5 (en)
GB (1) GB1312151A (en)
NL (1) NL145087B (en)

Families Citing this family (36)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3803711A (en) * 1971-02-04 1974-04-16 Texas Instruments Inc Electrical contact and method of fabrication
CH600621A5 (en) * 1975-09-12 1978-06-30 Juerg Nigg
DE2540943B2 (en) * 1975-09-13 1978-02-02 W.C. Heraeus Gmbh, 6450 Hanau CONTACT BODY FOR AN ELECTRIC CONNECTOR
US4246321A (en) * 1978-12-20 1981-01-20 Chugai Denki Kogya Kabushiki-Kaisha Ag-SnO Alloy composite electrical contact
US4529667A (en) * 1983-04-06 1985-07-16 The Furukawa Electric Company, Ltd. Silver-coated electric composite materials
US4980245A (en) * 1989-09-08 1990-12-25 Precision Concepts, Inc. Multi-element metallic composite article
US5139890A (en) * 1991-09-30 1992-08-18 Olin Corporation Silver-coated electrical components
US5436082A (en) * 1993-12-27 1995-07-25 National Semiconductor Corporation Protective coating combination for lead frames
US5650661A (en) * 1993-12-27 1997-07-22 National Semiconductor Corporation Protective coating combination for lead frames
US5728285A (en) * 1993-12-27 1998-03-17 National Semiconductor Corporation Protective coating combination for lead frames
JP2895793B2 (en) * 1995-02-24 1999-05-24 マブチモーター株式会社 Sliding contact material, clad composite material, commutator made of the same, and small DC motor using the commutator
US5679471A (en) * 1995-10-16 1997-10-21 General Motors Corporation Silver-nickel nano-composite coating for terminals of separable electrical connectors
KR0183645B1 (en) * 1996-03-26 1999-03-20 이대원 Semiconductor leadframe having composite plating
KR100231828B1 (en) * 1997-02-20 1999-12-01 유무성 Multi-layer plated lead frame
US5953511A (en) * 1997-04-08 1999-09-14 National Instruments Corporation PCI bus to IEEE 1394 bus translator
US6027564A (en) * 1997-09-23 2000-02-22 American Superconductor Corporation Low vacuum vapor process for producing epitaxial layers
US6022832A (en) * 1997-09-23 2000-02-08 American Superconductor Corporation Low vacuum vapor process for producing superconductor articles with epitaxial layers
US6458223B1 (en) 1997-10-01 2002-10-01 American Superconductor Corporation Alloy materials
US6428635B1 (en) 1997-10-01 2002-08-06 American Superconductor Corporation Substrates for superconductors
US6807734B2 (en) * 1998-02-13 2004-10-26 Formfactor, Inc. Microelectronic contact structures, and methods of making same
US6255126B1 (en) * 1998-12-02 2001-07-03 Formfactor, Inc. Lithographic contact elements
AT3175U1 (en) * 1999-02-05 1999-11-25 Plansee Ag METHOD FOR PRODUCING A THERMALLY HIGH-STRENGTH COMPOSITE COMPONENT
US6475311B1 (en) 1999-03-31 2002-11-05 American Superconductor Corporation Alloy materials
US7353982B2 (en) * 2003-11-25 2008-04-08 Membrane Reactor Technologies Ltd. Diffusion bonding for metallic membrane joining with metallic module
CN100389005C (en) * 2005-09-21 2008-05-21 浙江大学 Bimetallic compound Cu/Ag plate making process
CN100390913C (en) * 2006-03-02 2008-05-28 乐百令 Three-layer composite electric contact manufacturing process
JP4834022B2 (en) * 2007-03-27 2011-12-07 古河電気工業株式会社 Silver coating material for movable contact parts and manufacturing method thereof
US7812691B1 (en) 2007-11-08 2010-10-12 Greatbatch Ltd. Functionally graded coatings for lead wires in medical implantable hermetic feedthrough assemblies
JP5086485B1 (en) 2011-09-20 2012-11-28 Ｊｘ日鉱日石金属株式会社 Metal material for electronic parts and method for producing the same
JP5284526B1 (en) 2011-10-04 2013-09-11 Ｊｘ日鉱日石金属株式会社 Metal material for electronic parts and method for producing the same
TWI493798B (en) * 2012-02-03 2015-07-21 Jx Nippon Mining & Metals Corp Push-in terminals and electronic parts for their use
JP6029435B2 (en) 2012-06-27 2016-11-24 Ｊｘ金属株式会社 METAL MATERIAL FOR ELECTRONIC COMPONENT AND ITS MANUFACTURING METHOD, CONNECTOR TERMINAL USING THE SAME, CONNECTOR AND ELECTRONIC COMPONENT
JP6050664B2 (en) 2012-06-27 2016-12-21 Ｊｘ金属株式会社 METAL MATERIAL FOR ELECTRONIC COMPONENT AND ITS MANUFACTURING METHOD, CONNECTOR TERMINAL USING THE SAME, CONNECTOR AND ELECTRONIC COMPONENT
US9403023B2 (en) * 2013-08-07 2016-08-02 Heraeus Deutschland GmbH & Co. KG Method of forming feedthrough with integrated brazeless ferrule
US10211586B2 (en) * 2017-06-28 2019-02-19 Ethicon Llc Surgical shaft assemblies with watertight housings
US11296436B2 (en) * 2019-06-10 2022-04-05 Rohm And Haas Electronic Materials Llc Press-fit terminal with improved whisker inhibition

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2303497A (en) * 1938-10-27 1942-12-01 Bell Telephone Labor Inc Duplex metal body
US2691816A (en) * 1951-01-04 1954-10-19 Metals & Controls Corp Manufacture of composite multilayer sheet metal material
US3091026A (en) * 1958-11-13 1963-05-28 Engelhard Ind Inc Method of making wire
US3514840A (en) * 1968-04-18 1970-06-02 Allegheny Ludlum Steel Method of fabricating narrow-width composites

Also Published As

Publication number Publication date
NL7009800A (en) 1971-01-05
FR2054003A5 (en) 1971-04-16
US3648355A (en) 1972-03-14
JPS5030587B1 (en) 1975-10-02
DE2033870A1 (en) 1971-02-25
NL145087B (en) 1975-02-17
DE2033870B2 (en) 1974-06-20
CA932258A (en) 1973-08-21

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
746 Register noted 'licences of right' (sect. 46/1977)
PE20 Patent expired after termination of 20 years