US3644184A - Electrolytic gold plating solutions and methods for using same - Google Patents
Electrolytic gold plating solutions and methods for using same Download PDFInfo
- Publication number
- US3644184A US3644184A US50969A US3644184DA US3644184A US 3644184 A US3644184 A US 3644184A US 50969 A US50969 A US 50969A US 3644184D A US3644184D A US 3644184DA US 3644184 A US3644184 A US 3644184A
- Authority
- US
- United States
- Prior art keywords
- solution
- gold
- thallium
- range
- grams
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 title claims abstract description 30
- 239000010931 gold Substances 0.000 title claims abstract description 30
- 229910052737 gold Inorganic materials 0.000 title claims abstract description 30
- 238000007747 plating Methods 0.000 title claims abstract description 16
- 238000000034 method Methods 0.000 title claims description 23
- 239000000243 solution Substances 0.000 claims abstract description 34
- 229910052716 thallium Inorganic materials 0.000 claims abstract description 27
- BKVIYDNLLOSFOA-UHFFFAOYSA-N thallium Chemical compound [Tl] BKVIYDNLLOSFOA-UHFFFAOYSA-N 0.000 claims abstract description 27
- 239000008151 electrolyte solution Substances 0.000 claims abstract description 9
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 claims description 10
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 9
- 230000003139 buffering effect Effects 0.000 claims description 7
- 150000003839 salts Chemical class 0.000 claims description 7
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 claims description 4
- 238000005868 electrolysis reaction Methods 0.000 claims description 4
- IZLAVFWQHMDDGK-UHFFFAOYSA-N gold(1+);cyanide Chemical compound [Au+].N#[C-] IZLAVFWQHMDDGK-UHFFFAOYSA-N 0.000 claims description 4
- 229910052700 potassium Inorganic materials 0.000 claims description 4
- 239000011591 potassium Substances 0.000 claims description 4
- ATRRKUHOCOJYRX-UHFFFAOYSA-N Ammonium bicarbonate Chemical compound [NH4+].OC([O-])=O ATRRKUHOCOJYRX-UHFFFAOYSA-N 0.000 claims description 3
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 claims description 3
- 229940037003 alum Drugs 0.000 claims description 3
- 239000001099 ammonium carbonate Substances 0.000 claims description 3
- 235000012501 ammonium carbonate Nutrition 0.000 claims description 3
- 239000000908 ammonium hydroxide Substances 0.000 claims description 3
- VMDSWYDTKFSTQH-UHFFFAOYSA-N sodium;gold(1+);dicyanide Chemical compound [Na+].[Au+].N#[C-].N#[C-] VMDSWYDTKFSTQH-UHFFFAOYSA-N 0.000 claims description 3
- 150000001875 compounds Chemical class 0.000 claims description 2
- 230000007935 neutral effect Effects 0.000 abstract description 2
- 239000000463 material Substances 0.000 description 18
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 4
- 238000004070 electrodeposition Methods 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- 230000002378 acidificating effect Effects 0.000 description 3
- 235000011114 ammonium hydroxide Nutrition 0.000 description 3
- QFFVPLLCYGOFPU-UHFFFAOYSA-N barium chromate Chemical compound [Ba+2].[O-][Cr]([O-])(=O)=O QFFVPLLCYGOFPU-UHFFFAOYSA-N 0.000 description 3
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 3
- 238000000151 deposition Methods 0.000 description 3
- 230000008021 deposition Effects 0.000 description 3
- 239000003792 electrolyte Substances 0.000 description 3
- 235000011118 potassium hydroxide Nutrition 0.000 description 3
- 239000011734 sodium Substances 0.000 description 3
- LLELVHKMCSBMCX-UHFFFAOYSA-M sodium 1-[(4-chloro-5-methyl-2-sulfophenyl)diazenyl]naphthalen-2-olate Chemical compound [Na+].Cc1cc(N=Nc2c(O)ccc3ccccc23)c(cc1Cl)S([O-])(=O)=O LLELVHKMCSBMCX-UHFFFAOYSA-M 0.000 description 3
- 235000011121 sodium hydroxide Nutrition 0.000 description 3
- QGZKDVFQNNGYKY-UHFFFAOYSA-O Ammonium Chemical compound [NH4+] QGZKDVFQNNGYKY-UHFFFAOYSA-O 0.000 description 2
- 229910001020 Au alloy Inorganic materials 0.000 description 2
- RGHNJXZEOKUKBD-SQOUGZDYSA-N D-gluconic acid Chemical compound OC[C@@H](O)[C@@H](O)[C@H](O)[C@@H](O)C(O)=O RGHNJXZEOKUKBD-SQOUGZDYSA-N 0.000 description 2
- FEWJPZIEWOKRBE-JCYAYHJZSA-N Dextrotartaric acid Chemical compound OC(=O)[C@H](O)[C@@H](O)C(O)=O FEWJPZIEWOKRBE-JCYAYHJZSA-N 0.000 description 2
- 229910001007 Tl alloy Inorganic materials 0.000 description 2
- OFLYIWITHZJFLS-UHFFFAOYSA-N [Si].[Au] Chemical compound [Si].[Au] OFLYIWITHZJFLS-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000003353 gold alloy Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 229940083608 sodium hydroxide Drugs 0.000 description 2
- BMYNFMYTOJXKLE-UHFFFAOYSA-N 3-azaniumyl-2-hydroxypropanoate Chemical compound NCC(O)C(O)=O BMYNFMYTOJXKLE-UHFFFAOYSA-N 0.000 description 1
- OSWFIVFLDKOXQC-UHFFFAOYSA-N 4-(3-methoxyphenyl)aniline Chemical compound COC1=CC=CC(C=2C=CC(N)=CC=2)=C1 OSWFIVFLDKOXQC-UHFFFAOYSA-N 0.000 description 1
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 description 1
- BTBUEUYNUDRHOZ-UHFFFAOYSA-N Borate Chemical compound [O-]B([O-])[O-] BTBUEUYNUDRHOZ-UHFFFAOYSA-N 0.000 description 1
- KRKNYBCHXYNGOX-UHFFFAOYSA-K Citrate Chemical compound [O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O KRKNYBCHXYNGOX-UHFFFAOYSA-K 0.000 description 1
- 244000248349 Citrus limon Species 0.000 description 1
- 235000005979 Citrus limon Nutrition 0.000 description 1
- RGHNJXZEOKUKBD-UHFFFAOYSA-N D-gluconic acid Natural products OCC(O)C(O)C(O)C(O)C(O)=O RGHNJXZEOKUKBD-UHFFFAOYSA-N 0.000 description 1
- BDAGIHXWWSANSR-UHFFFAOYSA-M Formate Chemical compound [O-]C=O BDAGIHXWWSANSR-UHFFFAOYSA-M 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- JVTAAEKCZFNVCJ-UHFFFAOYSA-M Lactate Chemical compound CC(O)C([O-])=O JVTAAEKCZFNVCJ-UHFFFAOYSA-M 0.000 description 1
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 description 1
- FEWJPZIEWOKRBE-UHFFFAOYSA-N Tartaric acid Natural products [H+].[H+].[O-]C(=O)C(O)C(O)C([O-])=O FEWJPZIEWOKRBE-UHFFFAOYSA-N 0.000 description 1
- 235000011054 acetic acid Nutrition 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 229910052783 alkali metal Inorganic materials 0.000 description 1
- 150000008044 alkali metal hydroxides Chemical class 0.000 description 1
- 150000001340 alkali metals Chemical class 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 150000004649 carbonic acid derivatives Chemical class 0.000 description 1
- 150000001805 chlorine compounds Chemical class 0.000 description 1
- OIDPCXKPHYRNKH-UHFFFAOYSA-J chrome alum Chemical compound [K]OS(=O)(=O)O[Cr]1OS(=O)(=O)O1 OIDPCXKPHYRNKH-UHFFFAOYSA-J 0.000 description 1
- 235000015165 citric acid Nutrition 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- YXVFQADLFFNVDS-UHFFFAOYSA-N diammonium citrate Chemical compound [NH4+].[NH4+].[O-]C(=O)CC(O)(C(=O)O)CC([O-])=O YXVFQADLFFNVDS-UHFFFAOYSA-N 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 235000019253 formic acid Nutrition 0.000 description 1
- 239000000174 gluconic acid Substances 0.000 description 1
- 235000012208 gluconic acid Nutrition 0.000 description 1
- MXZVHYUSLJAVOE-UHFFFAOYSA-N gold(3+);tricyanide Chemical compound [Au+3].N#[C-].N#[C-].N#[C-] MXZVHYUSLJAVOE-UHFFFAOYSA-N 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 150000007522 mineralic acids Chemical class 0.000 description 1
- 150000002823 nitrates Chemical class 0.000 description 1
- 150000007524 organic acids Chemical class 0.000 description 1
- 235000005985 organic acids Nutrition 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 1
- 239000002243 precursor Substances 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000001509 sodium citrate Substances 0.000 description 1
- 239000011975 tartaric acid Substances 0.000 description 1
- 235000002906 tartaric acid Nutrition 0.000 description 1
- 229940095064 tartrate Drugs 0.000 description 1
- 150000003475 thallium Chemical class 0.000 description 1
- 150000003568 thioethers Chemical class 0.000 description 1
- HRXKRNGNAMMEHJ-UHFFFAOYSA-K trisodium citrate Chemical compound [Na+].[Na+].[Na+].[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O HRXKRNGNAMMEHJ-UHFFFAOYSA-K 0.000 description 1
- 229940038773 trisodium citrate Drugs 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- 239000010930 yellow gold Substances 0.000 description 1
- 229910001097 yellow gold Inorganic materials 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/48—Electroplating: Baths therefor from solutions of gold
Definitions
- the present invention is based on the discovery that small amounts of thallium 'in' the-electrolytic solution employed within a defined pH range have a beneficial effect on the gold deposit, providing a plate of acceptable aesthetic qualities as well as one which is uniformly distributed and readily attachable to other surfaces.
- small amounts is meant not more than mg./l. and preferably between 3 to 50 milligrams of thallium per liter of plating solution.
- these limits should be observed since operation outside of this range and especially on the high side, yields gold deposits which are unsuitable in one or more of several respects, especially in attachability to other surfaces.
- Thegold present in the electrolytic solution of the present invention is added in the form of the gold-cyanide double salt of an alkali metal.
- an alkali metal typically, potassium or sodium gold-cyanide are employeds
- the bath may contain sufficient gold to perform under the conditions desired by the plater but ordinarily the amountpresent in the bath is suitably in the range of from 1 to 75 grams per liter and preferably 8 to l2 grams perliter.
- the electrolytic bath also contains sufficient conducting and buffering materials to give a pH in the range of at least 6.5 and preferably from about 7 to about 13.
- the advantages of the invention are best obtained from baths having a pH on the alkaline side, that is in the range of from about 10 to 12 and this constitutes the most preferred mode of the invention.
- the desired pI-I may be obtainedin a variety of ways known to those skilled in the art. For example, if the inherent pH of the bath is within the'desired range, then additional buffer materials need not be supplied. If, however, the pH is either too high or too low, appropriate acidic or basic materials can be added to reach the desired pH.
- inorganic acids such as hydrochloric 7 acid, hydrobromicacid, phosphoric acid and the like
- organic acids especially weak acids suchas formic acid, citric acid, acetic acid, tartaric acid, gluconic acid,.and the like. These may be employed singly or in combination. Additionally, they may be employed as partially'neutralized materials using alkaline reactants such as ammonium or alkali metal hydroxides and carbonates such as ammonium, sodium or potassium hydroxides,.ammonium carbonate and the like.
- vsoluble'thallous and thallic salts such as the sulfides, chlorides,
- the electrolytic solution may contain other materials as desired'such as conducting salts and the like, which may also act in the capacity of buffering materials.
- it is suitable'toprovide-one or more of the sulfate,-sulfamate, formate, acetate, citrate, lactate, tartrate,'fiuoroborate, borate,
- phosphate ions may be provided in theform'of asuitable metal-salt.
- suitable results are obtained at levels ranging from 10 to 500 g. of the salt per liter of plating solution.
- the desired pI-lin the bathis obtainedinherently from such materials it may be unnecessary to add additional buffering and conducting materials.
- the use of these salts, and others is desirable when an alloy of'electrodeposited gold is sought such as is obtained by adding from 0-100 g./l. of alum toproduce a 24 karat gold alloy.
- the electrolytic solutions of the present invention are utilizedin'theelectroplating process at current densities suitably in the'range of l to 200 and preferably 2 to 10 amperes per square foot.
- the temperature of operation is preferably elevated, of the order of 100 to 180 F. Higher or lower temperatures may be employed if desired. For example, temperatures in range of from 50 to 180 F. are suitable.
- EXAMPLE 1 A 24 karat gold plating electrolyte solution is formulated by dissolving the indicated materials in sufficient water to make 1 liter of solution.
- Gold [as KAu(CN),] 12 grams Na," P 60 grams Thallium (as TI,SO.) 20 milligrams The pH was adjusted to about 10.5.
- a header consisting of a cap having several small leads extending therefrom is plated at a temperature of around 140 F. at a current density of around 5 amps. per square foot.
- a smooth semibright 24 karat lemonyellow gold deposit is obtained on the header. The deposit is uniformly distributed over the cap and small wire leads of the transistor header.
- Example ll The procedure of Example 1 is followed utilizing an electrolyte made from the following materials in sufficient water to make 1 liter of solution.
- Gold [as KAu(CM ),l 24 grams Na,H P0 60 grams Trisodium citrate 60 grams Thallium (as T1 80 I40 milligrams The pH of the solution was adjusted to 10.0. The plating is conducted at a temperature of around 150 F. at a current density of around 6 amps. per square foot yielding a 24 karat lemon-yellow gold deposit. The deposit is smooth and semibright, has a uniform gold thickness and exhibits good characteristics of attachability to gold-silicon dies.
- Example 1 The procedure of Example 1 is followed utilizing an electrolyte made from the following materials in sufficient water to make 1 liter of solution.
- Example IV The procedure of Example I is followed utilizing an electrolyte made from the following materials in sufficient water to make 1 liter of solution.
- An aqueous electrolytic cyanide-gold plating solution comprising a gold cyanide complex, from 1 to 140 milligrams of thallium per liter of plating solution and sufficient conducting and buffering materials to provide a pH in said solution of at least 6.5.
- conducting and buffering compounds comprise ammonium hydroxide, potassium hydroxide, sodium hydroxide or ammonium carbonate.
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US5096970A | 1970-06-29 | 1970-06-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| US3644184A true US3644184A (en) | 1972-02-22 |
Family
ID=21968602
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US50969A Expired - Lifetime US3644184A (en) | 1970-06-29 | 1970-06-29 | Electrolytic gold plating solutions and methods for using same |
Country Status (13)
| Country | Link |
|---|---|
| US (1) | US3644184A (enExample) |
| JP (1) | JPS5534235B1 (enExample) |
| AT (1) | AT313663B (enExample) |
| BE (1) | BE768886A (enExample) |
| CA (1) | CA929481A (enExample) |
| CH (1) | CH525963A (enExample) |
| DE (1) | DE2131815A1 (enExample) |
| DK (1) | DK133791B (enExample) |
| ES (1) | ES392679A1 (enExample) |
| FR (1) | FR2096799B1 (enExample) |
| GB (1) | GB1349796A (enExample) |
| NL (1) | NL149861B (enExample) |
| SE (1) | SE360888B (enExample) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3833488A (en) * | 1971-08-20 | 1974-09-03 | Auric Corp | Gold electroplating baths and process |
| DE3400670A1 (de) * | 1983-01-28 | 1984-08-02 | Omi International Corp., Warren, Mich. | Waessriges goldsulfit enthaltendes galvanisches bad und verfahren zur galvanischen abscheidung von gold unter verwendung dieses bades |
| US5755947A (en) * | 1996-01-31 | 1998-05-26 | The United States Of America As Represented By The Secretary Of The Navy | Adhesion enhancement for underplating problem |
| CN102517614A (zh) * | 2011-12-20 | 2012-06-27 | 安徽华东光电技术研究所 | 一种在铝硅合金上电镀金的镀液配方及其电镀方法 |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4465564A (en) * | 1983-06-27 | 1984-08-14 | American Chemical & Refining Company, Inc. | Gold plating bath containing tartrate and carbonate salts |
| DE3905705A1 (de) * | 1989-02-24 | 1990-08-30 | Degussa | Bad zur galvanischen abscheidung von feingoldueberzuegen |
-
1970
- 1970-06-29 US US50969A patent/US3644184A/en not_active Expired - Lifetime
-
1971
- 1971-06-11 CH CH859571A patent/CH525963A/fr not_active IP Right Cessation
- 1971-06-16 GB GB2811771A patent/GB1349796A/en not_active Expired
- 1971-06-23 DE DE19712131815 patent/DE2131815A1/de not_active Withdrawn
- 1971-06-23 BE BE768886A patent/BE768886A/xx not_active IP Right Cessation
- 1971-06-24 SE SE08283/71A patent/SE360888B/xx unknown
- 1971-06-26 ES ES392679A patent/ES392679A1/es not_active Expired
- 1971-06-28 DK DK316771AA patent/DK133791B/da unknown
- 1971-06-28 NL NL717108893A patent/NL149861B/xx not_active IP Right Cessation
- 1971-06-28 AT AT05592/71A patent/AT313663B/de not_active IP Right Cessation
- 1971-06-29 JP JP4757871A patent/JPS5534235B1/ja active Pending
- 1971-06-29 FR FR7124926*A patent/FR2096799B1/fr not_active Expired
- 1971-06-29 CA CA116933A patent/CA929481A/en not_active Expired
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3833488A (en) * | 1971-08-20 | 1974-09-03 | Auric Corp | Gold electroplating baths and process |
| DE3400670A1 (de) * | 1983-01-28 | 1984-08-02 | Omi International Corp., Warren, Mich. | Waessriges goldsulfit enthaltendes galvanisches bad und verfahren zur galvanischen abscheidung von gold unter verwendung dieses bades |
| US5755947A (en) * | 1996-01-31 | 1998-05-26 | The United States Of America As Represented By The Secretary Of The Navy | Adhesion enhancement for underplating problem |
| CN102517614A (zh) * | 2011-12-20 | 2012-06-27 | 安徽华东光电技术研究所 | 一种在铝硅合金上电镀金的镀液配方及其电镀方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| BE768886A (fr) | 1971-11-03 |
| CH525963A (fr) | 1972-07-31 |
| FR2096799A1 (enExample) | 1972-02-25 |
| SE360888B (enExample) | 1973-10-08 |
| DE2131815A1 (de) | 1972-01-05 |
| AT313663B (de) | 1974-01-15 |
| CA929481A (en) | 1973-07-03 |
| DK133791C (enExample) | 1976-12-06 |
| ES392679A1 (es) | 1974-07-16 |
| FR2096799B1 (enExample) | 1976-02-06 |
| JPS5534235B1 (enExample) | 1980-09-05 |
| GB1349796A (en) | 1974-04-10 |
| DK133791B (da) | 1976-07-19 |
| NL149861B (nl) | 1976-06-15 |
| NL7108893A (enExample) | 1971-12-31 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| AS | Assignment |
Owner name: OXY METAL INDUSTRIES CORPORATION Free format text: CHANGE OF NAME;ASSIGNOR:OXY METAL FINISHING CORPORATION;REEL/FRAME:003967/0084 Effective date: 19741220 |
|
| AS | Assignment |
Owner name: HOOKER CHEMICALS & PLASTICS CORP. Free format text: MERGER;ASSIGNOR:OXY METAL INDUSTRIES CORPORATION;REEL/FRAME:004075/0885 Effective date: 19801222 |
|
| AS | Assignment |
Owner name: OCCIDENTAL CHEMICAL CORPORATION Free format text: CHANGE OF NAME;ASSIGNOR:HOOKER CHEMICAS & PLASTICS CORP.;REEL/FRAME:004126/0054 Effective date: 19820330 |
|
| AS | Assignment |
Owner name: OMI INTERNATIONAL CORPORATION, 21441 HOOVER ROAD, Free format text: ASSIGNMENT OF ASSIGNORS INTEREST.;ASSIGNOR:OCCIDENTAL CHEMICAL CORPORATION;REEL/FRAME:004190/0827 Effective date: 19830915 |
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| AS | Assignment |
Owner name: MANUFACTURERS HANOVER TRUST COMPANY, A CORP OF NY Free format text: SECURITY INTEREST;ASSIGNOR:INTERNATIONAL CORPORATION, A CORP OF DE;REEL/FRAME:004201/0733 Effective date: 19830930 |