US3644181A - Localized electroplating method - Google Patents

Localized electroplating method Download PDF

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Publication number
US3644181A
US3644181A US844323A US3644181DA US3644181A US 3644181 A US3644181 A US 3644181A US 844323 A US844323 A US 844323A US 3644181D A US3644181D A US 3644181DA US 3644181 A US3644181 A US 3644181A
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United States
Prior art keywords
strip
cathode
electroplating
anode
electrically conductive
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
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US844323A
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English (en)
Inventor
John G Donaldson
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GTE Sylvania Inc
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Sylvania Electric Products Inc
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Publication date
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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • C25D7/0671—Selective plating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas

Definitions

  • the process involves providing a potential difference between an anode and a cathode wherein the cathode is the strip of electrically conductive substrate, and the current density at the cathode is at least about 300 amperes per square foot per feet per minute of the advance of the cathode, and circulating an electroplating solution containing the metal to be deposited between the anode and the cathode at a velocity of at least 6.5 ft.lsec. at the cathode.
  • an apparatus comprises a means of continuously advancing the strip of electrically conductive substrate past at least one electroplating station that comprises a housing having one face adapted for contact with the strip, an anode recessed in the housing, a channel having specific dimensions and connecting the anode and the strip and a pair of passages at opposite ends of the channel that are in close proximity to the channel, the passages have one end terminating at the face that is in contact with the strip and the other end terminating at a face other than the one that is not adapted for contact with said strip and a container for an electroplating solution and a means for circulating the electroplating solution through the electroplating station and a means for receiving the electroplated strip.
  • This invention relates to a process and equipment useful in electroplating a metal upon a continuous strip of electrically conductive material. More particularly it relates to an improved process and equipment that will continuously selectively electroplate a metal upon the strip of electrically conductive substrate in a desired pattern.
  • a particular pattern of a metal deposited upon a base of electrically conductive material generally metallic is often desirable.
  • the substrate is often a longcontinuous metal strip that can be formed in a particular fashion to have perforations in a particular manner, or can be a solid continuous strip of material. It is often desirable to have a pattern of a different or similar metal deposited in a pattern upon the strip, as for example, a stripe of metal deposit extending the length of the strip but covering only a narrow width of the total metal strip.
  • the methods heretofore used have several disadvantages.
  • one method employed a rotating wheel that contained a reservoir of electroplating solution that rotated in the same direction and the same speed as the continuously advancing strip.
  • the electroplating solution is applied to the metal strip via ports in the wheel and an anode is immersed in the solution and the advancing strip serves as a cathode.
  • the pattern that is formed is suitable for some purposes, the method outlined above has some serious disadvantages. For example, close uniform contact between the rotating wheel and the advancing strip of metal is hard to maintain. The result is that a uniform pattern is not achieved, that is, the pattern can vary in thickness and in width. As can be appreciated, uniformity is desired from both a functional and economic standpoint.
  • an apparatus for continuously deposiing a relatively uniform metal pattern upon a strip of electrically conductive material comprising (a) means for continuously advancing a strip of electrically conductive material, (b) at least one electroplating station that comprises a housing of an electrically insulative material, one face of the housing being in contact with the strip of material, an anode recessed in the housing, a channel connecting the anode and the strip, the width of the channel being approximately equal to the width of the desired pattern and the length of the channel preferably being approximately equal to the length of the anode, and a first and second passage for the electroplating solution at opposite ends of the channel, one end of each passage terminating in close proximity to the corresponding ends of the channel and the other end of each passage terminating at one of the faces that is not the face that is in contact with the strip, (c) a container for an electroplating solution, ((1) means for circulating the electroplating solution from the container and to the following elements in series, the first
  • FIG. 1 is an elevational view of the apparatus with parts in section;
  • FIG. 2 is a cross-sectional view of the electroplating station taken along the line 2-2 of FIG. 1;
  • FIG. 3 is a cross-sectional view of an alternate embodiment of an electroplating station for use in electroplating a solid strip of electrically conductive material;
  • FIG. 4 shows a segment of a preformed strip that has been processed by this invention.
  • FIG. 5 shows a segment of a solid processed by this invention.
  • An improved selective electroplating process upon a continuously advancing strip of electrically conductive material is achieved by maintaining a relatively high current density at the cathode (the strip) in relationship to the speed of travel of the strip and by maintaining a relatively high velocity of the electroplating solutions past the cathode.
  • an electroplating solution is circulated at a relatively high velocity between a cathode and an anode.
  • the volume between the anode and cathode is kept at a minimum.
  • the current density at the cathode is thereby maximized for a given potential. It is to be noted that the volume between the cathode and anode is reduced from that generally employed and the current density for a given potential is thereby increased. In many instances, however, it is necessary for practical design reasons to keep the volume at a level to keep the pressure drop in the electroplating solution circulation system at a reasonable level.
  • the cathode used is the continuously advancing electrically conductive strip upon which a pattern of metal is to be deposited.
  • the process can be employed to electroplate any electrically conductive material.
  • Such materials suitable for substrates are known in the art.
  • Materials that have heretofore been electroplated and are satisfactory cathode materials include stainless steels, copper, nickel, various alloys, metallic coated plastics and the like.
  • the anodes are, in general, the nonconsumable type, that is the anode does not furnish the metal to be coated. Selection of the material for the anode will be dependent upon the metal that is being deposited on the strip of material and are known strip that has been to those skilled in the electroplating art. The shape of the anode will depend upon several factors, such as the width of the pattern, the length of the channel connecting the anode and cathode and other features of the particular production unit desired.
  • a relatively high current density is used. Current densities above about 300 amperes per square foot (a.s.f.) per foot per minute of advance of the strip of material are used. It is preferred to employ a current density of from at least about 375 a.s.f. per ft./min. of advance of the strip of material when silver is being deposited and at least about 350 a.s.f. per ft./min. of advance of the strip of material when gold is being deposited from the commercially available gold and silver electroplating solutions. Although higher current density can be used, it will seldom be necessary to exceed about 1,000 a.s.f. per ft./min. of advance of the strip.
  • the electroplating solution is kept at a relatively high velocity past the cathode, that is a velocity of at least about 6.5 ft./sec. is maintained. Generally velocities from about 6.8 to about ft./sec. are employed. Lower velocities result in nonuniform deposits and low production rates. Higher velocities can be used but no additional beneficial results are achieved, thus increased power costs result.
  • the flow of electroplating solution in an opposite direction or countercurrent to the direction of movement of the continuously advancing strip of material. In this manner the desired velocities of the electroplating solution can be achieved at less power costs and somewhat better uniformity and adherence is achieved.
  • electroplating solutions that are useful in the process of this invention are known in the art.
  • gold patterns are deposited from an electroplating solution containing a gold concentration of about 8 to 10 ounces per gallon, generally in the form of basic aqueous solution of potassium gold cyanide.
  • An example of a suitable gold plating solution is sold by the Sel-Rex Corporation under the trade name Temperex.
  • a suitable silver aqueous electroplating solution comprises about to about ounces per gallon of silver, about 9 to about 12 ounces per gallon of potassium cyanide and about 2 to about 4 ounces per gallon of potassium hydroxide.
  • Any metal, such as nickel, tin and the like, that is generally deposited upon a base metal via electroplating, can be deposited in the process of this invention.
  • the current density used is dependent upon the rate of advance of the strip of material past the electroplating station.
  • the preferred current density is about 200 a.s.f. and at 1.0 ft./min.
  • the preferred current density is about 400 a.s.f.
  • the speed of travel of the strip of material can be increased to any level as long as there is a corresponding increase in current density to maintain the before-mentioned relationship of the variable, for practical mechanical reasons the speed of advance is kept below about 8 ft./min. and generally at about 5 ft./min. In most instances it will be desired to have the strip of material advancing at a rate of at least above about 0.5 ft./min. Thus the current density will be kept within the corresponding level.
  • electroplating station can be used in many instances, multiple stations can be used either in series or in parallel. If a relatively thick pattern is desired, then stations can be used in series. If parallel patterns are desired, stations can be used in parallel. Additionally, both sides of a strip of material can be electroplated by the use of two electroplating stations.
  • an electroplating apparatus An electroplating solution is stored in the container 10. It is circulated to the electroplating station 12 that comprises a housing 14 having an anode 16 recessed from the face 18 that is in contact with the continuously advancing strip of material 20 of the electrically conductive material that serves as the cathode.
  • the electroplating solution flows from the solution-circulating means 22 to a first passage 24 in the housing 14.
  • the solution then flows through a channel 26 that connects the anode 16 and the strip of material 20.
  • the solution is kept at a velocity of at least 6.5 ft./sec. past the strip or cathode 20.
  • the electroplating solution exits from another face 27 of the electroplating station 12 via second passage 28 and returns to the storage container 10.
  • the strip of material 20 is advanced past the electroplating station 12 by the advancing means 29. Contact between the strip of material 20 and the electroplating station 12 is maintained by the guide means 30 and by the plate 31. The electroplated strip after being electroplated by the station 12 is received by the receiving means 32.
  • FIG. 2 there is shown a cross section of the electroplating station 12 taken along line 2-2 of FIG. 1.
  • the width of the channel 26 is essentially the same width as the pattern that is desired on the strip of material 20.
  • FIG. 3 there is shown an electroplating station 12 that is adapted for use in electroplating a solid strip 33.
  • the station is essentially the same as that described in reference to FIG. 1 with the exception that there is not provided a plate and the shape of the face is slightly curved.
  • FIG. 4 and FIG. 5 there is shown two types of electrically conductive strips that can be produced by this invention.
  • a preformed electrically conductive strip 34 and a pattern 35 in the form of a stripe is deposited on the preformed strip 34.
  • the width of the stripe 35 is approximately equal to the width of the channel 26 (shown in FIG. 2).
  • a solid electrically conductive strip 36 upon which a pattern 38 has been deposited is shown.
  • the solution is circulated at a sufficient velocity of about 8 ft./sec. past the strip that serves as the cathode.
  • the current density at the cathode is about 800 amperes per square foot with a rate of strip advance of about 2 ft./min.
  • a stripe of silver of about 0.l4 inch wide and about 0.000250 inch thick is deposited in a uniform pattern.
  • Samples of the strip containing the deposited pattern are placed upon a hotplate at 900 F. to determine if any blistering will occur. Samples are additionally subjected to a bend test to determine the adherence of the deposit. On samples produced and tested in the above manner no blistering or flaking of deposit is observed.
  • Example I Following the procedure as given in Example I, except that a gold electroplating solution is used in place of the silver electroplating solution and the strip is advanced at a rate of about 2 feet per minute and a current density of about 750 amperes per square foot is used. The solution is circulated at about 8 ft./sec. A uniform deposit of about 0.00020 inch is achieved. Samples of the strip, when subjected to the blister and bend tests as in Example I, showed no blistering or flaking.
  • a process according to claim 2 wherein the rate of advance of said metal strip is from about 0.5 ft./min. to about 8.0 ft./min.
  • a process according to claim 5 wherein the rate of advance of said metal strip is from about 0.5 ft./min. to about 8.0 ft./min.
  • rate of advance is from about 1 to about 5 ft./min. and the current density is from at least about 350 amperes per square foot per ft./min. of advance and the velocity of said electroplating solution is from about 6.8 to about 10 ft. per second past the cathode.

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
US844323A 1969-07-24 1969-07-24 Localized electroplating method Expired - Lifetime US3644181A (en)

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US84432369A 1969-07-24 1969-07-24

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US (1) US3644181A (de)
DE (2) DE7027615U (de)
FR (1) FR2053128B3 (de)
NL (1) NL7010904A (de)

Cited By (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3894918A (en) * 1973-12-20 1975-07-15 Western Electric Co Methods of treating portions of articles
US3994786A (en) * 1975-06-13 1976-11-30 Gte Sylvania Incorporated Electroplating device and method
US4001093A (en) * 1975-08-06 1977-01-04 Bell Telephone Laboratories, Incorporated Method of electroplating precious metals in localized areas
US4014773A (en) * 1974-07-31 1977-03-29 Daiichi Denshi Kogyo Kabushiki Kaisha Apparatus for electrolytic treatment
US4030999A (en) * 1975-10-06 1977-06-21 National Semiconductor Corporation Stripe on strip plating apparatus
US4033844A (en) * 1975-11-03 1977-07-05 National Semiconductor Corporation Apparatus for selectively plating lead frames
US4093520A (en) * 1976-02-17 1978-06-06 Bell Telephone Laboratories, Incorporated Process for gold plating
US4110190A (en) * 1975-08-11 1978-08-29 Ultra Centrifuge Nederland N.V. Apparatus for machining electrically conducting substances by electrochemical attack
US4119516A (en) * 1976-10-16 1978-10-10 Koito Manufacturing Company Limited Continuous electroplating apparatus
US4224117A (en) * 1979-04-18 1980-09-23 Western Electric Company, Inc. Methods of and apparatus for selective plating
US4367125A (en) * 1979-03-21 1983-01-04 Republic Steel Corporation Apparatus and method for plating metallic strip
US4376683A (en) * 1980-04-21 1983-03-15 Siemens Aktiengesellschaft Method and device for the partial galvanization of surfaces which are conducting or have been made conducting
US4391692A (en) * 1980-01-08 1983-07-05 Mannesmann Aktiengesellschaft Device for the chemical or electrochemical surface treatment or material in a heated liquid treatment medium, more particularly a strip pickling plant
US4401541A (en) * 1981-11-25 1983-08-30 Masami Kobayashi Apparatus for electroplating a strip of metal of relatively low electric conductivity
US4401523A (en) * 1980-12-18 1983-08-30 Republic Steel Corporation Apparatus and method for plating metallic strip
US4601794A (en) * 1983-09-07 1986-07-22 Sumitomo Metal Industries, Ltd. Method and apparatus for continuous electroplating of alloys
US4721554A (en) * 1984-10-31 1988-01-26 Inovan-Stroebe Gmbh & Co. Kg. Electroplating apparatus
GB2214931A (en) * 1988-02-03 1989-09-13 Gen Electric Co Plc Selective coating part of a member
US5100524A (en) * 1988-02-03 1992-03-31 The General Electric Company, P.L.C. Apparatus for selectively coating part of a member
US20030188965A1 (en) * 2002-04-05 2003-10-09 3M Innovative Properties Company Web processing method and apparatus
US20110028044A1 (en) * 2009-07-29 2011-02-03 John Peng Flat pin of network jack and method for gilding the same

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2140310B1 (de) * 1971-06-09 1974-03-08 Anvar
LU80496A1 (fr) * 1978-11-09 1980-06-05 Cockerill Procede et diopositif pour le depot electrolytique en continu et a haute densite de courant d'un metal de recouvrement sur une tole

Cited By (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3894918A (en) * 1973-12-20 1975-07-15 Western Electric Co Methods of treating portions of articles
US4014773A (en) * 1974-07-31 1977-03-29 Daiichi Denshi Kogyo Kabushiki Kaisha Apparatus for electrolytic treatment
US3994786A (en) * 1975-06-13 1976-11-30 Gte Sylvania Incorporated Electroplating device and method
US4001093A (en) * 1975-08-06 1977-01-04 Bell Telephone Laboratories, Incorporated Method of electroplating precious metals in localized areas
US4110190A (en) * 1975-08-11 1978-08-29 Ultra Centrifuge Nederland N.V. Apparatus for machining electrically conducting substances by electrochemical attack
US4072581A (en) * 1975-10-06 1978-02-07 National Semiconductor Corporation Stripe on strip plating method
US4030999A (en) * 1975-10-06 1977-06-21 National Semiconductor Corporation Stripe on strip plating apparatus
US4033844A (en) * 1975-11-03 1977-07-05 National Semiconductor Corporation Apparatus for selectively plating lead frames
US4093520A (en) * 1976-02-17 1978-06-06 Bell Telephone Laboratories, Incorporated Process for gold plating
US4119516A (en) * 1976-10-16 1978-10-10 Koito Manufacturing Company Limited Continuous electroplating apparatus
US4367125A (en) * 1979-03-21 1983-01-04 Republic Steel Corporation Apparatus and method for plating metallic strip
US4224117A (en) * 1979-04-18 1980-09-23 Western Electric Company, Inc. Methods of and apparatus for selective plating
US4391692A (en) * 1980-01-08 1983-07-05 Mannesmann Aktiengesellschaft Device for the chemical or electrochemical surface treatment or material in a heated liquid treatment medium, more particularly a strip pickling plant
US4376683A (en) * 1980-04-21 1983-03-15 Siemens Aktiengesellschaft Method and device for the partial galvanization of surfaces which are conducting or have been made conducting
US4401523A (en) * 1980-12-18 1983-08-30 Republic Steel Corporation Apparatus and method for plating metallic strip
US4401541A (en) * 1981-11-25 1983-08-30 Masami Kobayashi Apparatus for electroplating a strip of metal of relatively low electric conductivity
US4601794A (en) * 1983-09-07 1986-07-22 Sumitomo Metal Industries, Ltd. Method and apparatus for continuous electroplating of alloys
US4721554A (en) * 1984-10-31 1988-01-26 Inovan-Stroebe Gmbh & Co. Kg. Electroplating apparatus
GB2214931A (en) * 1988-02-03 1989-09-13 Gen Electric Co Plc Selective coating part of a member
GB2214931B (en) * 1988-02-03 1991-11-13 Gen Electric Co Plc Apparatus for selectively coating part of a member
US5100524A (en) * 1988-02-03 1992-03-31 The General Electric Company, P.L.C. Apparatus for selectively coating part of a member
US20030188965A1 (en) * 2002-04-05 2003-10-09 3M Innovative Properties Company Web processing method and apparatus
US6991717B2 (en) * 2002-04-05 2006-01-31 3M Innovative Properties Company Web processing method and apparatus
US20060116268A1 (en) * 2002-04-05 2006-06-01 3M Innovative Properties Company Web processing method and apparatus
US20110028044A1 (en) * 2009-07-29 2011-02-03 John Peng Flat pin of network jack and method for gilding the same

Also Published As

Publication number Publication date
DE7027615U (de) 1971-04-08
FR2053128B3 (de) 1973-04-27
DE2036387A1 (de) 1971-02-25
FR2053128A7 (de) 1971-04-16
NL7010904A (de) 1971-01-26

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