US3586524A - Consolidation of formations by electroless metal plating process - Google Patents
Consolidation of formations by electroless metal plating process Download PDFInfo
- Publication number
- US3586524A US3586524A US840826A US3586524DA US3586524A US 3586524 A US3586524 A US 3586524A US 840826 A US840826 A US 840826A US 3586524D A US3586524D A US 3586524DA US 3586524 A US3586524 A US 3586524A
- Authority
- US
- United States
- Prior art keywords
- formations
- solution
- metal plating
- grams
- consolidation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000007747 plating Methods 0.000 title abstract description 25
- 238000000034 method Methods 0.000 title abstract description 18
- 230000015572 biosynthetic process Effects 0.000 title description 24
- 238000005755 formation reaction Methods 0.000 title description 24
- 229910052751 metal Inorganic materials 0.000 title description 23
- 239000002184 metal Substances 0.000 title description 23
- 238000007596 consolidation process Methods 0.000 title description 7
- 229910052728 basic metal Inorganic materials 0.000 abstract description 5
- 150000003818 basic metals Chemical class 0.000 abstract description 5
- 239000000243 solution Substances 0.000 description 45
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 10
- 238000000576 coating method Methods 0.000 description 9
- 239000000463 material Substances 0.000 description 9
- CVHZOJJKTDOEJC-UHFFFAOYSA-N saccharin Chemical compound C1=CC=C2C(=O)NS(=O)(=O)C2=C1 CVHZOJJKTDOEJC-UHFFFAOYSA-N 0.000 description 9
- 229940081974 saccharin Drugs 0.000 description 9
- 235000019204 saccharin Nutrition 0.000 description 9
- 239000000901 saccharin and its Na,K and Ca salt Substances 0.000 description 9
- 239000012190 activator Substances 0.000 description 8
- 238000006243 chemical reaction Methods 0.000 description 8
- 229910001868 water Inorganic materials 0.000 description 8
- 230000003213 activating effect Effects 0.000 description 6
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 6
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 5
- 239000011343 solid material Substances 0.000 description 5
- OAKJQQAXSVQMHS-UHFFFAOYSA-N Hydrazine Chemical compound NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 description 4
- 230000003197 catalytic effect Effects 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 4
- 229910052759 nickel Inorganic materials 0.000 description 4
- -1 palladium halide Chemical class 0.000 description 4
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 239000012530 fluid Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- PIBWKRNGBLPSSY-UHFFFAOYSA-L palladium(II) chloride Chemical compound Cl[Pd]Cl PIBWKRNGBLPSSY-UHFFFAOYSA-L 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 description 2
- AEMRFAOFKBGASW-UHFFFAOYSA-N Glycolic acid Chemical compound OCC(O)=O AEMRFAOFKBGASW-UHFFFAOYSA-N 0.000 description 2
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 2
- 229960000583 acetic acid Drugs 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 239000012670 alkaline solution Substances 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 238000005336 cracking Methods 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 238000007865 diluting Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000008187 granular material Substances 0.000 description 2
- 238000001465 metallisation Methods 0.000 description 2
- 229910052763 palladium Inorganic materials 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N palladium Substances [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 239000004576 sand Substances 0.000 description 2
- 125000006850 spacer group Chemical group 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- TXUICONDJPYNPY-UHFFFAOYSA-N (1,10,13-trimethyl-3-oxo-4,5,6,7,8,9,11,12,14,15,16,17-dodecahydrocyclopenta[a]phenanthren-17-yl) heptanoate Chemical compound C1CC2CC(=O)C=C(C)C2(C)C2C1C1CCC(OC(=O)CCCCCC)C1(C)CC2 TXUICONDJPYNPY-UHFFFAOYSA-N 0.000 description 1
- NWZSZGALRFJKBT-KNIFDHDWSA-N (2s)-2,6-diaminohexanoic acid;(2s)-2-hydroxybutanedioic acid Chemical compound OC(=O)[C@@H](O)CC(O)=O.NCCCC[C@H](N)C(O)=O NWZSZGALRFJKBT-KNIFDHDWSA-N 0.000 description 1
- RYHBNJHYFVUHQT-UHFFFAOYSA-N 1,4-Dioxane Chemical compound C1COCCO1 RYHBNJHYFVUHQT-UHFFFAOYSA-N 0.000 description 1
- 229940093475 2-ethoxyethanol Drugs 0.000 description 1
- 101100129232 Danio rerio mafaa gene Proteins 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- AEMRFAOFKBGASW-UHFFFAOYSA-M Glycolate Chemical compound OCC([O-])=O AEMRFAOFKBGASW-UHFFFAOYSA-M 0.000 description 1
- 229920000084 Gum arabic Polymers 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 229910021586 Nickel(II) chloride Inorganic materials 0.000 description 1
- 229910021120 PdC12 Inorganic materials 0.000 description 1
- 229910002666 PdCl2 Inorganic materials 0.000 description 1
- 101150003085 Pdcl gene Proteins 0.000 description 1
- 241000978776 Senegalia senegal Species 0.000 description 1
- 229910021626 Tin(II) chloride Inorganic materials 0.000 description 1
- 239000000205 acacia gum Substances 0.000 description 1
- 235000010489 acacia gum Nutrition 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000002180 anti-stress Effects 0.000 description 1
- 239000006172 buffering agent Substances 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 239000008367 deionised water Substances 0.000 description 1
- 229910021641 deionized water Inorganic materials 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 239000012153 distilled water Substances 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 239000012362 glacial acetic acid Substances 0.000 description 1
- 229940093915 gynecological organic acid Drugs 0.000 description 1
- IKDUDTNKRLTJSI-UHFFFAOYSA-N hydrazine monohydrate Substances O.NN IKDUDTNKRLTJSI-UHFFFAOYSA-N 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 239000007943 implant Substances 0.000 description 1
- 238000012332 laboratory investigation Methods 0.000 description 1
- 239000003607 modifier Substances 0.000 description 1
- QMMRZOWCJAIUJA-UHFFFAOYSA-L nickel dichloride Chemical compound Cl[Ni]Cl QMMRZOWCJAIUJA-UHFFFAOYSA-L 0.000 description 1
- 150000007524 organic acids Chemical class 0.000 description 1
- 235000005985 organic acids Nutrition 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 238000007086 side reaction Methods 0.000 description 1
- 239000001632 sodium acetate Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000001119 stannous chloride Substances 0.000 description 1
- 235000011150 stannous chloride Nutrition 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/12—Bonding of a preformed macromolecular material to the same or other solid material such as metal, glass, leather, e.g. using adhesives
- C08J5/121—Bonding of a preformed macromolecular material to the same or other solid material such as metal, glass, leather, e.g. using adhesives by heating
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K8/00—Compositions for drilling of boreholes or wells; Compositions for treating boreholes or wells, e.g. for completion or for remedial operations
- C09K8/50—Compositions for plastering borehole walls, i.e. compositions for temporary consolidation of borehole walls
- C09K8/504—Compositions based on water or polar solvents
- C09K8/5045—Compositions based on water or polar solvents containing inorganic compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K8/00—Compositions for drilling of boreholes or wells; Compositions for treating boreholes or wells, e.g. for completion or for remedial operations
- C09K8/56—Compositions for consolidating loose sand or the like around wells without excessively decreasing the permeability thereof
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1635—Composition of the substrate
- C23C18/1644—Composition of the substrate porous substrates
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/1803—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces
- C23C18/1824—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces by chemical pretreatment
- C23C18/1827—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces by chemical pretreatment only one step pretreatment
- C23C18/1831—Use of metal, e.g. activation, sensitisation with noble metals
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
- C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
- C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
- C23C18/36—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents using hypophosphites
-
- E—FIXED CONSTRUCTIONS
- E21—EARTH OR ROCK DRILLING; MINING
- E21B—EARTH OR ROCK DRILLING; OBTAINING OIL, GAS, WATER, SOLUBLE OR MELTABLE MATERIALS OR A SLURRY OF MINERALS FROM WELLS
- E21B33/00—Sealing or packing boreholes or wells
- E21B33/10—Sealing or packing boreholes or wells in the borehole
- E21B33/13—Methods or devices for cementing, for plugging holes, crevices or the like
- E21B33/138—Plastering the borehole wall; Injecting into the formation
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2323/00—Characterised by the use of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Derivatives of such polymers
- C08J2323/02—Characterised by the use of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Derivatives of such polymers not modified by chemical after treatment
Definitions
- a sulfimide such as saccharin is unique in its capability of providing competent metal coatings where alkaline solutions are used at relatively low temperatures.
- the metal plating of subterranean earth formations may be used to disperse and implant metal to be used as catalysts, activators, property indicators, etc. In the latter operations it may be advantageous to form deposits which crack and expose large surface areas of metal.
- the present invention involves the discovery that in an electroless metal plating at a given temperature the degree of competency of the coating is uniquely responsive to the rate of reaction of the plating solution at the given temperature. This discovery is contrary to what would be expected from the effects from strain-reducing additives in electrolytic metal plating. It can be utilized to form highly competent, or incompetent, coatings at the option of the operator, Moderately cracked coatings can be formed by diluting a solution having a relatively high rate of reaction with a solvent such as 2-ethoxyethanol (Cellosolve), dioxane, glycerol, etc. Highly cracked coatings can be formed by diluting such a solution with a lower .alcohol such as isopropanol.
- a solvent such as 2-ethoxyethanol (Cellosolve), dioxane, glycerol, etc.
- Highly cracked coatings can be formed by diluting such a solution with a lower .alcohol such as isopropanol.
- the activator solutions can be any of the activator solutions described in U.S. Pats. 3,393,737; 3,438,440 or 3,43 8,441 and include stannous chloride and/ or palladium chloride solutions which may contain hydrazine and which solutions can be buffered with Weak organic acids and their salts. Preferred activator solutions are shown in Tables 1 and 2.
- the metal plating solutions can also include the compositions described in'the above-mentioned patents provided they are modified by the reaction rate modifier and anti-stress and cracking controller of the prevention invention; namely, by the vaddition of a small amount and sufficient to control reaction rate of an organic sulfimide compound, said compound containing therein at least one fi E ON i fi CO2 5 2 m n 02: 5233328 o 23:5 82 m ES ERvEEPv when E 32 32% p wc n o D can H $56 3b33- 2 EE EB 23: v5 8 298, s 3 8 83 m m figs?
- NiC1T6H1O grams/l 34 8 NiS O4 6H O grams/1- NaHzPOrHzO. grams/1 29.4% NHa, cc./l NHlCl, grams/l Na glycolate, grams/l Na succlnatefiH O grams/ 70% glycolic acid, cc./l NaOH, grams/l 2O,CC-/l 860 860 827 865 805 NiSO4-6HzO,grams/l 42.0 42.0 42.0 43.0 43.0 N tlP02'Hz0,gTamS/1 38.0 38.0 38.0 46.3 46.3 (Nfinzsol, grams/1.- 79.0 79.0 40.0 80.0 80.0 29.4% N113, 05.11.... 52.0 52.0 115 53.0 53.0 SaccharimgramS/L. 10 10 10 8.0
- Saccharin also changes the relative importance of side reactions, giving slightly less H production (not noted in Table 4) and more acid production, which lowers the pH in spent solution (see runs 17 and 18).
- This effect of saccharin on hydrogen production may indicate that saccharin plays a role in the stress-relieving reaction by causing some H+ to form (assumed to be a fast reaction) instead of H gas (assumed to be a slow one) from the chemisorbed H on the metal. Also, this may be the mechanism by which saccharin slows down the overall deposition reaction.
- the metal plating process of this invention can be modified by any of the methodsdescribed in the above patents on the subject as well as in copending applications Ser. No. 850,253 filed Aug. 14, 1969 and Ser. No. 835,- 243 filed June 20, 1969 wherein spacer and backflush fluids are employed for this process of consolidating formations.
- This invention provides a uniquely advantageous way of avoiding problems encountered in consolidating incompetent subterranean reservoir formations. It is also useful in controlling the competency of substantially any coating deposited by electroless metal plating from an alkaline plating solution on substantially any material. It
- the plating is particularly useful where the plating is effected by flowing a plurality of pore volumes of activating and plating solutions through a permeable non-catalytic material, such as a permeable earth formation, a permeable mass and/ or structure of plastic, metal, or the like material that is non-catalytic to such a metal deposition, etc.
- the plating can be efiected in order to improve the strength or stability of a granular material and/or an intergranular cementing material within a mass of granular material and/or to plug or reduce the permeability of such a mass or permeable structure, to bond catalytic and/or conductive metal within such a mass or structure, to bond other materials into such a mass or structure, etc.
- a method of consolidating an incompetent formation comprising treating the formation with an activating solution and thereafter treating the activated formation with a basic metal plating solution containing a small amount of an organic sulfimide until the formation is consolidated into a crack-resistant, water-resistant formation.
- the activating solution is a palladium halide solution and the metal plating solution is a basic nickel halide solution containing saccharin.
- activating solution is a palladium chloride solution containing a buffering agent and the nickel containing solution is a basic nickel chloride solution.
- a method of depositing metal on a solid material comprising contacting the solid material with an activating solution followed by treating said activated solid material with an electroless basic metal plating solution containing a small amount of an organic sulfimide until metal is deposited on the solid material.
- the activating solution is a palladium halide solution and the metal plating solution is a nickel halide solution containing saccharin.
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- General Life Sciences & Earth Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- General Chemical & Material Sciences (AREA)
- Geology (AREA)
- Mining & Mineral Resources (AREA)
- Fluid Mechanics (AREA)
- Health & Medical Sciences (AREA)
- Inorganic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Environmental & Geological Engineering (AREA)
- Polymers & Plastics (AREA)
- Manufacturing & Machinery (AREA)
- Medicinal Chemistry (AREA)
- Geochemistry & Mineralogy (AREA)
- Chemically Coating (AREA)
- Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US84082669A | 1969-07-10 | 1969-07-10 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| US3586524A true US3586524A (en) | 1971-06-22 |
Family
ID=25283323
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US840826A Expired - Lifetime US3586524A (en) | 1969-07-10 | 1969-07-10 | Consolidation of formations by electroless metal plating process |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US3586524A (enrdf_load_stackoverflow) |
| CA (1) | CA926230A (enrdf_load_stackoverflow) |
| DE (1) | DE2033913C3 (enrdf_load_stackoverflow) |
| GB (1) | GB1318573A (enrdf_load_stackoverflow) |
| MY (1) | MY7600070A (enrdf_load_stackoverflow) |
| NL (1) | NL164356C (enrdf_load_stackoverflow) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4188227A (en) * | 1977-05-27 | 1980-02-12 | Bauer Randy L | Method of preparing multi-component chemical compositions |
| DE4005088A1 (de) * | 1989-02-27 | 1990-08-30 | Omi Int Corp | Plattierungszusammensetzung und verfahren |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2158854B (en) * | 1984-05-16 | 1987-09-16 | Shell Int Research | Method of recovering hydrocarbons from an underground formation |
-
1969
- 1969-07-10 US US840826A patent/US3586524A/en not_active Expired - Lifetime
-
1970
- 1970-07-08 CA CA087684A patent/CA926230A/en not_active Expired
- 1970-07-08 DE DE2033913A patent/DE2033913C3/de not_active Expired
- 1970-07-08 GB GB3316370A patent/GB1318573A/en not_active Expired
- 1970-07-08 NL NL7010063.A patent/NL164356C/xx not_active IP Right Cessation
-
1976
- 1976-12-30 MY MY70/76A patent/MY7600070A/xx unknown
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4188227A (en) * | 1977-05-27 | 1980-02-12 | Bauer Randy L | Method of preparing multi-component chemical compositions |
| DE4005088A1 (de) * | 1989-02-27 | 1990-08-30 | Omi Int Corp | Plattierungszusammensetzung und verfahren |
| BE1003583A5 (fr) * | 1989-02-27 | 1992-04-28 | Omi Internat Corp | Composition et procede de revetement a l'aide d'un metal. |
Also Published As
| Publication number | Publication date |
|---|---|
| DE2033913A1 (de) | 1971-01-21 |
| MY7600070A (en) | 1976-12-31 |
| NL164356B (nl) | 1980-07-15 |
| NL7010063A (enrdf_load_stackoverflow) | 1971-01-12 |
| CA926230A (en) | 1973-05-15 |
| NL164356C (nl) | 1980-12-15 |
| DE2033913C3 (de) | 1980-03-20 |
| DE2033913B2 (de) | 1979-07-19 |
| GB1318573A (en) | 1973-05-31 |
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