US3563862A - High precision anodizing of thin films - Google Patents
High precision anodizing of thin films Download PDFInfo
- Publication number
- US3563862A US3563862A US773185A US3563862DA US3563862A US 3563862 A US3563862 A US 3563862A US 773185 A US773185 A US 773185A US 3563862D A US3563862D A US 3563862DA US 3563862 A US3563862 A US 3563862A
- Authority
- US
- United States
- Prior art keywords
- electrolyte
- resistance
- measurement
- pad
- anodization
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000010409 thin film Substances 0.000 title description 9
- 238000007743 anodising Methods 0.000 title description 3
- 239000003792 electrolyte Substances 0.000 abstract description 16
- 238000005259 measurement Methods 0.000 abstract description 14
- 238000002048 anodisation reaction Methods 0.000 abstract description 8
- 239000002184 metal Substances 0.000 abstract description 8
- 230000001360 synchronised effect Effects 0.000 abstract description 4
- 230000001590 oxidative effect Effects 0.000 abstract description 2
- 239000010408 film Substances 0.000 description 11
- 230000003647 oxidation Effects 0.000 description 11
- 238000007254 oxidation reaction Methods 0.000 description 11
- 238000000034 method Methods 0.000 description 6
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 241001481789 Rupicapra Species 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 235000011007 phosphoric acid Nutrition 0.000 description 1
- 239000002984 plastic foam Substances 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
- C25D11/02—Anodisation
- C25D11/04—Anodisation of aluminium or alloys based thereon
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
- C25D11/005—Apparatus specially adapted for electrolytic conversion coating
Definitions
- Anodization is carried through a movable arm carrying a pad filled with electrolyte the movement of which is synchronized with the A-C oxidising current.
- the film surface is dried when the pad is removed.
- the present invention relates to improvements in processes for the anodization of thin-film devices and more particularly to the control of this operation. It is well known to produce devices from thin metal films deposited upon insulating substrates. These devices alford such advantages from the view-point of overall dimensions and reliability that their industrial development has been very rapid in recent years. Such devices consist mainly in metal deposits produced by evaporation in vacuo, by cathode sputtering or by any other method known per se. These films, which are very thin, are relatively sensitive to weathering agents, and a protective oxide layer is employed to passivate the surface. This protection is often afforded through anodization.
- a simple method of controlling the degree of oxidation consists in measuring the resistance of the layer in the course of the operation. When the operation is automatic, the measurement permits to limit its duration.
- the component consists of a patterned thin metal deposit on a non-conductive support.
- a coarse adjustment of the value of the resistance is effected by means of the parameters defining the deposit: geometrical shape, thickness, etc.
- the precise adjustment of the value of the resistance is effected by anodizing the resistive layer.
- the present invention is aimed at increasing the precision of the anodization control by increasing the precision of the dynamic resistance measurement during oxidation. It is mainly characterised in that it makes it possible to eliminate the measurement error due to the presence of electrolyte on the surface of the film the resistance of which is being controlled.
- the present invention has for its object to eliminate the influence of the electrolyte during the measurement, and it is essentially characterised in that the layer to be anodized is only in contact with the electrolyte during the time when it acts as an anode, the said layer being electrolyte-free during the measuring time.
- the resistor to be adjusted which consists of a metal deposit of given pattern on an insulating substrate 1.
- the terminal contacts of the metal deposit are connected, generally by soldering, to two leads .2, 2'. These two leads are connected through a switch (not shown) to the resistance measuring circuit (not shown), for example a measuring bridge of a type known per se.
- the switch makes it possible, to interconnect the lead 2 to a first output terminal of an alternatingcurrent supply source.
- the switch is so designed as to connect the resistor to the said terminal during the halfcycles in which the latter is positive in relation to the second terminal of the same supply.
- a pad 3 filled with electrolyte is mounted on the core 4 of an electromagnet 5 which is supplied with alternating current synchronized with the supply source serving for the oxidation.
- Pad 3 is connected to the second supply terminal.
- the winding of the electromagnet is so chosen that the pad is in contact with the layer to be anodized during the half-cycles in which the oxidation occurs. It is removed from the resistor as shown in the figure during the half-cycle in which no oxidation is performed and during which the measurement of the resistance takes place. It is to be understood that the alternating displacement of the core may be controlled at any frequency provided that the oxidation current and the movement of the core are synchronous.
- the pad 3 consists of felt, plastic foam, eider chamois skin or any other porous material which does not leave any fluff and which is filled with 0.1% aqueous orthophosphoric acid solution, the refilling with electrolyte being effected by injection of liquid controlled by an electromagnetic valve every 3 minutes.
- the alternating-current supply source is a source whose frequency is between 15 and c./s. The frequency is chosen as a function of the range of resistance values to be obtained.
- the result of the measurement may be used for automating the operation.
- the resistance value to be reached is stored in a memory, and the measured value may be compared with the desired value, there being derived from this comparison an error signal which serves to control the anodic oxidising circuit either on an on-off basis or progressively, for example by control of the anodic oxidation voltage.
- the same result would be obtained by displacing, the thin-film circuit, such as the resistor ,1 described in the foregoing instead of the electrolyte filled pad.
- the thin-film circuit such as the resistor ,1 described in the foregoing instead of the electrolyte filled pad.
- withdrawal of the pad may be insufficient.
- the drying may be etfected, for example, by means of a jet ;of dry hot air blown onto the surface during the withdrawal of the buffer.
- the thin film device When the thin film device is displaced, its own movement may be utilised to remove any electrolyte remaining on the surface through mechanical force.
- a process for controlling the resistance of a thin metallic film during anodization thereof comprising the following steps:
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Measurement Of Resistance Or Impedance (AREA)
- Investigating Or Analyzing Materials By The Use Of Electric Means (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR127648 | 1967-11-10 |
Publications (1)
Publication Number | Publication Date |
---|---|
US3563862A true US3563862A (en) | 1971-02-16 |
Family
ID=8641505
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US773185A Expired - Lifetime US3563862A (en) | 1967-11-10 | 1968-11-04 | High precision anodizing of thin films |
Country Status (6)
Country | Link |
---|---|
US (1) | US3563862A (enrdf_load_stackoverflow) |
BE (1) | BE723227A (enrdf_load_stackoverflow) |
DE (1) | DE1808103B2 (enrdf_load_stackoverflow) |
FR (1) | FR1554760A (enrdf_load_stackoverflow) |
GB (1) | GB1243830A (enrdf_load_stackoverflow) |
NL (1) | NL6815523A (enrdf_load_stackoverflow) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4085026A (en) * | 1975-06-13 | 1978-04-18 | Imperial Metal Industries (Kynoch) Limited | Anode assembly for electrodeposition cell |
US5184550A (en) * | 1990-03-01 | 1993-02-09 | Heidelberger Druckmaschinen Ag | Device for controlling wetting behavior of metal surfaces by application of electrolyte under controlled voltage |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2702207C2 (de) * | 1977-01-20 | 1984-01-12 | Robert Bosch Gmbh, 7000 Stuttgart | Verfahren und Vorrichtung zum Abgleich elektronischer Schaltungen |
DE2908361C2 (de) * | 1979-03-03 | 1985-05-15 | Dynamit Nobel Ag, 5210 Troisdorf | Verfahren zum Erhöhen des Widerstandes elektrischen Zündelementen |
-
1967
- 1967-11-10 FR FR127648A patent/FR1554760A/fr not_active Expired
-
1968
- 1968-10-29 GB GB51168/68A patent/GB1243830A/en not_active Expired
- 1968-10-31 NL NL6815523A patent/NL6815523A/xx unknown
- 1968-10-31 BE BE723227D patent/BE723227A/xx unknown
- 1968-11-04 US US773185A patent/US3563862A/en not_active Expired - Lifetime
- 1968-11-09 DE DE19681808103 patent/DE1808103B2/de active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4085026A (en) * | 1975-06-13 | 1978-04-18 | Imperial Metal Industries (Kynoch) Limited | Anode assembly for electrodeposition cell |
US5184550A (en) * | 1990-03-01 | 1993-02-09 | Heidelberger Druckmaschinen Ag | Device for controlling wetting behavior of metal surfaces by application of electrolyte under controlled voltage |
Also Published As
Publication number | Publication date |
---|---|
FR1554760A (enrdf_load_stackoverflow) | 1969-01-24 |
BE723227A (enrdf_load_stackoverflow) | 1969-04-01 |
GB1243830A (en) | 1971-08-25 |
NL6815523A (enrdf_load_stackoverflow) | 1969-05-13 |
DE1808103B2 (de) | 1971-05-19 |
DE1808103A1 (de) | 1969-09-25 |
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