US3557000A - Alkali etchant composition for aluminum having extended bath life - Google Patents
Alkali etchant composition for aluminum having extended bath life Download PDFInfo
- Publication number
- US3557000A US3557000A US769755A US3557000DA US3557000A US 3557000 A US3557000 A US 3557000A US 769755 A US769755 A US 769755A US 3557000D A US3557000D A US 3557000DA US 3557000 A US3557000 A US 3557000A
- Authority
- US
- United States
- Prior art keywords
- aluminum
- alkali
- bath
- etching
- alkali metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000203 mixture Substances 0.000 title abstract description 31
- 229910052782 aluminium Inorganic materials 0.000 title abstract description 28
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 title abstract description 28
- 239000003513 alkali Substances 0.000 title abstract description 13
- 238000005530 etching Methods 0.000 abstract description 24
- 150000008044 alkali metal hydroxides Chemical class 0.000 abstract description 17
- 239000004094 surface-active agent Substances 0.000 abstract description 16
- 239000002738 chelating agent Substances 0.000 abstract description 8
- 239000007864 aqueous solution Substances 0.000 abstract description 7
- 235000010210 aluminium Nutrition 0.000 description 26
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 15
- 239000000243 solution Substances 0.000 description 13
- 125000003709 fluoroalkyl group Chemical group 0.000 description 12
- 239000002253 acid Substances 0.000 description 7
- JOPOVCBBYLSVDA-UHFFFAOYSA-N chromium(6+) Chemical compound [Cr+6] JOPOVCBBYLSVDA-UHFFFAOYSA-N 0.000 description 7
- 229910000838 Al alloy Inorganic materials 0.000 description 6
- 150000003839 salts Chemical class 0.000 description 6
- KWYUFKZDYYNOTN-UHFFFAOYSA-M potassium hydroxide Inorganic materials [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 5
- 235000011121 sodium hydroxide Nutrition 0.000 description 5
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 4
- 150000007513 acids Chemical class 0.000 description 4
- 229910001430 chromium ion Inorganic materials 0.000 description 4
- PXLIDIMHPNPGMH-UHFFFAOYSA-N sodium chromate Chemical compound [Na+].[Na+].[O-][Cr]([O-])(=O)=O PXLIDIMHPNPGMH-UHFFFAOYSA-N 0.000 description 4
- 239000007787 solid Substances 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- WMFOQBRAJBCJND-UHFFFAOYSA-M Lithium hydroxide Chemical compound [Li+].[OH-] WMFOQBRAJBCJND-UHFFFAOYSA-M 0.000 description 3
- 229910052783 alkali metal Inorganic materials 0.000 description 3
- 150000001340 alkali metals Chemical class 0.000 description 3
- -1 described in U.S. 3 Chemical class 0.000 description 3
- 230000005484 gravity Effects 0.000 description 3
- 238000010348 incorporation Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- CIWBSHSKHKDKBQ-JLAZNSOCSA-N Ascorbic acid Chemical compound OC[C@H](O)[C@H]1OC(=O)C(O)=C1O CIWBSHSKHKDKBQ-JLAZNSOCSA-N 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 2
- FBPFZTCFMRRESA-FSIIMWSLSA-N D-Glucitol Natural products OC[C@H](O)[C@H](O)[C@@H](O)[C@H](O)CO FBPFZTCFMRRESA-FSIIMWSLSA-N 0.000 description 2
- WGLPBDUCMAPZCE-UHFFFAOYSA-N Trioxochromium Chemical compound O=[Cr](=O)=O WGLPBDUCMAPZCE-UHFFFAOYSA-N 0.000 description 2
- 125000000217 alkyl group Chemical group 0.000 description 2
- 125000002947 alkylene group Chemical group 0.000 description 2
- 150000003863 ammonium salts Chemical class 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 229910052804 chromium Inorganic materials 0.000 description 2
- 239000011651 chromium Substances 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 2
- 239000004615 ingredient Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 125000000896 monocarboxylic acid group Chemical group 0.000 description 2
- SIOXPEMLGUPBBT-UHFFFAOYSA-N picolinic acid Chemical compound OC(=O)C1=CC=CC=N1 SIOXPEMLGUPBBT-UHFFFAOYSA-N 0.000 description 2
- KMUONIBRACKNSN-UHFFFAOYSA-N potassium dichromate Chemical compound [K+].[K+].[O-][Cr](=O)(=O)O[Cr]([O-])(=O)=O KMUONIBRACKNSN-UHFFFAOYSA-N 0.000 description 2
- 239000000600 sorbitol Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- TUSDEZXZIZRFGC-UHFFFAOYSA-N 1-O-galloyl-3,6-(R)-HHDP-beta-D-glucose Natural products OC1C(O2)COC(=O)C3=CC(O)=C(O)C(O)=C3C3=C(O)C(O)=C(O)C=C3C(=O)OC1C(O)C2OC(=O)C1=CC(O)=C(O)C(O)=C1 TUSDEZXZIZRFGC-UHFFFAOYSA-N 0.000 description 1
- QLOKJRIVRGCVIM-UHFFFAOYSA-N 1-[(4-methylsulfanylphenyl)methyl]piperazine Chemical compound C1=CC(SC)=CC=C1CN1CCNCC1 QLOKJRIVRGCVIM-UHFFFAOYSA-N 0.000 description 1
- JHWIEAWILPSRMU-UHFFFAOYSA-N 2-methyl-3-pyrimidin-4-ylpropanoic acid Chemical compound OC(=O)C(C)CC1=CC=NC=N1 JHWIEAWILPSRMU-UHFFFAOYSA-N 0.000 description 1
- FBPFZTCFMRRESA-KVTDHHQDSA-N D-Mannitol Chemical compound OC[C@@H](O)[C@@H](O)[C@H](O)[C@H](O)CO FBPFZTCFMRRESA-KVTDHHQDSA-N 0.000 description 1
- WQZGKKKJIJFFOK-QTVWNMPRSA-N D-mannopyranose Chemical compound OC[C@H]1OC(O)[C@@H](O)[C@@H](O)[C@@H]1O WQZGKKKJIJFFOK-QTVWNMPRSA-N 0.000 description 1
- FEWJPZIEWOKRBE-JCYAYHJZSA-N Dextrotartaric acid Chemical compound OC(=O)[C@H](O)[C@@H](O)C(O)=O FEWJPZIEWOKRBE-JCYAYHJZSA-N 0.000 description 1
- QEVGZEDELICMKH-UHFFFAOYSA-N Diglycolic acid Chemical compound OC(=O)COCC(O)=O QEVGZEDELICMKH-UHFFFAOYSA-N 0.000 description 1
- KCXVZYZYPLLWCC-UHFFFAOYSA-N EDTA Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(O)=O)CC(O)=O KCXVZYZYPLLWCC-UHFFFAOYSA-N 0.000 description 1
- 239000001263 FEMA 3042 Substances 0.000 description 1
- 239000005715 Fructose Substances 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- LKDRXBCSQODPBY-AMVSKUEXSA-N L-(-)-Sorbose Chemical compound OCC1(O)OC[C@H](O)[C@@H](O)[C@@H]1O LKDRXBCSQODPBY-AMVSKUEXSA-N 0.000 description 1
- CKLJMWTZIZZHCS-REOHCLBHSA-N L-aspartic acid Chemical compound OC(=O)[C@@H](N)CC(O)=O CKLJMWTZIZZHCS-REOHCLBHSA-N 0.000 description 1
- 229930195725 Mannitol Natural products 0.000 description 1
- LRBQNJMCXXYXIU-PPKXGCFTSA-N Penta-digallate-beta-D-glucose Natural products OC1=C(O)C(O)=CC(C(=O)OC=2C(=C(O)C=C(C=2)C(=O)OC[C@@H]2[C@H]([C@H](OC(=O)C=3C=C(OC(=O)C=4C=C(O)C(O)=C(O)C=4)C(O)=C(O)C=3)[C@@H](OC(=O)C=3C=C(OC(=O)C=4C=C(O)C(O)=C(O)C=4)C(O)=C(O)C=3)[C@H](OC(=O)C=3C=C(OC(=O)C=4C=C(O)C(O)=C(O)C=4)C(O)=C(O)C=3)O2)OC(=O)C=2C=C(OC(=O)C=3C=C(O)C(O)=C(O)C=3)C(O)=C(O)C=2)O)=C1 LRBQNJMCXXYXIU-PPKXGCFTSA-N 0.000 description 1
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 1
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 1
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 1
- CZMRCDWAGMRECN-UGDNZRGBSA-N Sucrose Chemical compound O[C@H]1[C@H](O)[C@@H](CO)O[C@@]1(CO)O[C@@H]1[C@H](O)[C@@H](O)[C@H](O)[C@@H](CO)O1 CZMRCDWAGMRECN-UGDNZRGBSA-N 0.000 description 1
- 229930006000 Sucrose Natural products 0.000 description 1
- FEWJPZIEWOKRBE-UHFFFAOYSA-N Tartaric acid Natural products [H+].[H+].[O-]C(=O)C(O)C(O)C([O-])=O FEWJPZIEWOKRBE-UHFFFAOYSA-N 0.000 description 1
- WKNIDMJWLWUOMZ-UHFFFAOYSA-N [K].[Cr] Chemical compound [K].[Cr] WKNIDMJWLWUOMZ-UHFFFAOYSA-N 0.000 description 1
- HEUMNKZPHGRBKR-UHFFFAOYSA-N [Na].[Cr] Chemical compound [Na].[Cr] HEUMNKZPHGRBKR-UHFFFAOYSA-N 0.000 description 1
- 239000011149 active material Substances 0.000 description 1
- PNNNRSAQSRJVSB-BXKVDMCESA-N aldehydo-L-rhamnose Chemical compound C[C@H](O)[C@H](O)[C@@H](O)[C@@H](O)C=O PNNNRSAQSRJVSB-BXKVDMCESA-N 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- AZDRQVAHHNSJOQ-UHFFFAOYSA-N alumane Chemical class [AlH3] AZDRQVAHHNSJOQ-UHFFFAOYSA-N 0.000 description 1
- JOSWYUNQBRPBDN-UHFFFAOYSA-P ammonium dichromate Chemical compound [NH4+].[NH4+].[O-][Cr](=O)(=O)O[Cr]([O-])(=O)=O JOSWYUNQBRPBDN-UHFFFAOYSA-P 0.000 description 1
- 150000001450 anions Chemical class 0.000 description 1
- 239000011668 ascorbic acid Substances 0.000 description 1
- 229960005070 ascorbic acid Drugs 0.000 description 1
- 235000010323 ascorbic acid Nutrition 0.000 description 1
- 235000003704 aspartic acid Nutrition 0.000 description 1
- OQFSQFPPLPISGP-UHFFFAOYSA-N beta-carboxyaspartic acid Natural products OC(=O)C(N)C(C(O)=O)C(O)=O OQFSQFPPLPISGP-UHFFFAOYSA-N 0.000 description 1
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 235000008504 concentrate Nutrition 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- OAEGRYMCJYIXQT-UHFFFAOYSA-N dithiooxamide Chemical compound NC(=S)C(N)=S OAEGRYMCJYIXQT-UHFFFAOYSA-N 0.000 description 1
- 229960001484 edetic acid Drugs 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 238000005246 galvanizing Methods 0.000 description 1
- 125000001183 hydrocarbyl group Chemical group 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-M hydroxide Chemical compound [OH-] XLYOFNOQVPJJNP-UHFFFAOYSA-M 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 235000014666 liquid concentrate Nutrition 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- 239000000594 mannitol Substances 0.000 description 1
- 235000010355 mannitol Nutrition 0.000 description 1
- 229910000000 metal hydroxide Inorganic materials 0.000 description 1
- 150000004692 metal hydroxides Chemical class 0.000 description 1
- 239000002923 metal particle Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000003607 modifier Substances 0.000 description 1
- 229910017464 nitrogen compound Inorganic materials 0.000 description 1
- 150000002830 nitrogen compounds Chemical group 0.000 description 1
- 125000005010 perfluoroalkyl group Chemical group 0.000 description 1
- 229940081066 picolinic acid Drugs 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 239000002689 soil Substances 0.000 description 1
- 239000011343 solid material Substances 0.000 description 1
- 239000005720 sucrose Substances 0.000 description 1
- 150000003460 sulfonic acids Chemical class 0.000 description 1
- LRBQNJMCXXYXIU-NRMVVENXSA-N tannic acid Chemical compound OC1=C(O)C(O)=CC(C(=O)OC=2C(=C(O)C=C(C=2)C(=O)OC[C@@H]2[C@H]([C@H](OC(=O)C=3C=C(OC(=O)C=4C=C(O)C(O)=C(O)C=4)C(O)=C(O)C=3)[C@@H](OC(=O)C=3C=C(OC(=O)C=4C=C(O)C(O)=C(O)C=4)C(O)=C(O)C=3)[C@@H](OC(=O)C=3C=C(OC(=O)C=4C=C(O)C(O)=C(O)C=4)C(O)=C(O)C=3)O2)OC(=O)C=2C=C(OC(=O)C=3C=C(O)C(O)=C(O)C=3)C(O)=C(O)C=2)O)=C1 LRBQNJMCXXYXIU-NRMVVENXSA-N 0.000 description 1
- 229940033123 tannic acid Drugs 0.000 description 1
- 235000015523 tannic acid Nutrition 0.000 description 1
- 229920002258 tannic acid Polymers 0.000 description 1
- 239000011975 tartaric acid Substances 0.000 description 1
- 235000002906 tartaric acid Nutrition 0.000 description 1
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/10—Etching compositions
- C23F1/14—Aqueous compositions
- C23F1/32—Alkaline compositions
- C23F1/36—Alkaline compositions for etching aluminium or alloys thereof
Definitions
- An alkali etching composition for aluminum is comprised of an aqueous solution of alkali metal hydroxide, hexavalent chorium ion, chelating agent, and a minor pro portion of fluoroalkyl surfactant. The composition provides more eflicient alkali consumption and a longer bath life.
- This invention pertains to compositions for the etching of aluminum and aluminum alloys. More particularly, this invention concerns an alkali composition which, as an aqueous alkali etching solution for aluminum, provides more efiicient alkali consumption and longer bath life due to the incorporation therein of a specifically defined minor proportion of fluoroalkyl surfactant.
- Industrial aluminum finishers usually process their product in an aqueous alkaline etching bath to remove surface imperfections and generally to enhance the appearance of the aluminum or aluminum alloy product. In such operations it is desirable for obvious economic reasons to produce good finishes with the smallest possible consumption of etching chamicals while endeavoring to employ the etchant baths over an extended period of time without the need for frequent costly dumping and recharging.
- the conventional, previously used, alkaline etching compositions suffer from deficiencies in these areas in the following respects.
- Conventional alkaline etchant systems such as that disclosed in my US. Pat. 3,314,890, generally involve the removal of a relatively large amount of metal from the surface of the treated aluminum object to produce an acceptable finish.
- the novel aqueous etching solution of this invention produces a desired architectural finish on aluminum and aluminum alloys that may be described as an etched finish, gray white to white in color, having a non-metallic appearance, having a low or matte reflectance, having a uniform fine grained appearance independent of any underlying aluminum grain boundaries and having what is known in the trade as an excellent hide, that is, all extrusion, die marks and scratches are completely hidden.
- the etchant consumption is significantly reduced to the extent that there is about 10% to 25% less consumption of the etchant chemicals than that incurred using the conventional etching compositions to accomplish an equivalent amount of surface finishing.
- the bath life is appreciably extended because the solution can be used without causing product surface defects until the specific gravity of the bath is increased by dissolved aluminum to a value of from about 1.35 to 1.50, compared to a specific gravity of 1.20 for the previously known baths at which point dumping would be required to avoid defective etching.
- This invention provides an alkali etching composition for aluminum and aluminum alloys comprised of an aqueous solution containing (A) from 3.75 to 209 grams per liter of alkali metal hydroxide, (B) water-soluble hexavalent chromium ion ranging in amount of at least 0.035% by weight of the alkali metal hydroxide content and no greater than 11 grams per liter, (C) chelating agent ranging in amount of at least 3% by weight of the alkali metal hydroxide content and no greater than 44 grams per liter and (D) fluoroalkyl surface active agent ranging in amount of at least 0.0002% by wegiht of the alkali metal hydroxide content and up to 0.44 gram per liter.
- A from 3.75 to 209 grams per liter of alkali metal hydroxide
- B water-soluble hexavalent chromium ion ranging in amount of at least 0.035% by weight of the alkali metal hydroxide content and no greater than 11 grams
- an embodiment of the invention comprises the solid granular compositions which are capable of forming the foregoing aqueous solutions by mixing in water.
- the components are present in the following ranges in percents by weight: (A) from 80% to 95% of alkali metal hydroxide, (B) from 0.035% to 5% of water-soluble hexavalent chromium, (C) from 3% to 20% of chelating agent, and (D) from 0.0002% to 0.2% of fluoroalkyl surfactant, said percentages of (B), (C) and (D) based on the weight of the alkali metal hydroxide (A).
- the total of the four components will, of course, be 100%.
- the composition of this invention can also be conveniently handled as a liquid concentrate comprised of from 15 to 60 weight percent of the aforesaid granular composition and from 40 to weight percent water.
- Sodium hydroxide is the principal source of the alkali metal hydroxide because it is inexpensive as compared to potassium or lithium hydroxide. However, potassium hydroxide or other alkali metal hydroxides are equally efficient in these compositions.
- the source materials for the hexavalent chromium ion are one or more of the wellknown water-soluble ionizable chromium containing compounds. They may beselected from the group which includes sodium dichromate, potassium dichromate, ammonium dichromate, sodium chromate, potassium chromate, chromic anhydride, sodium chrom glucosate and potassium chrom glucosate.
- the above sources of hexavalent chromium ion are all normally solid materials and of course are useful in preparing the solid granular concentrates which are used in making the etching solutions.
- the third component of the formulation which acts as a surface modifier with respect to the action of the alkali metal hydroxide etchant on aluminum and aluminum al-v loys is a special group of Wellknown surface modifyingg agents of the chelating type which combine with the hexavalent chromium to modify the attack of the caustic soda and to prevent precipitation of aluminum salts from solution.
- Suitable chelating agents include sorbital, mannitol, ascorbic acid, sorbose, tannic acid, ethylene diaminetetraacetic acid, diglycolic acid, picolinic acid, aspartic acid, dithiooxamide, l-rhamnose, b-fructose, glycerol, maleic acid, mannose, succinic acid, sucrose, tartaric acid and the like.
- R is an alkylene group and R is hydrogen or alkyl; the acids and salts of U.S. 2,951,051, i.e.,
- the aluminum or aluminum alloy is first cleaned with a conventional aluminum cleaner which may be of the alkaline or acid type to remove oxides and soil which might obstruct the etching action.
- a conventional aluminum cleaner which may be of the alkaline or acid type to remove oxides and soil which might obstruct the etching action.
- the aluminum is rinsed with water, preferably warm, and is then immersed in or sprayed with the etching solution held at a temperature within the range of 150 to 200 F. However, at temperatures less than 150 F. the solutions are effective in preventing the unwanted effect known in the industry as galvanizing.
- the preferred temperature range for securing the preferred architectural finish is within the range of 160 to 180 F.
- the metal workpiece is allowed to remain in contact with the etchant solution until the desired etch is obtained. Generally this will vary from one to minutes depending on the concentration of the ingredients in the bath and the temperatures used. Suitable etching is often obtained in about 3 to 7 minutes.
- the work piece is then rinsed at least once with water, preferably warm, and then the work piece is desmutted to remove the metal particles which are insoluble in the etching solution. Since the present etching solutions have a considerable concentration of chromium contained therein it is unnecessary to use a chromated desmutter, and in fact, a nonchromated desmutter is preferred.
- tEtchant baths were prepared having the following compositions wherein the proportions are expressed in grams of ingredient per liter of aqueous solution and in weight percent based on a dry composition basis.
- a Bath B type composition was used for two weeks with appropriate replenishment before an unacceptable increase in viscosity and lack of etching efficiency required its disposal.
- a Bath C composition was used for some nine weeks with appropriate replenishment before disposal became necessary.
- a composition for the etching of aluminum and aluminum alloys comprised of an aqueous solution of (A) from 3.75 to 209 grams per liter of alkali metal hydroxide, (B) water-soluble hexavalent chromium ion ranging in amount of at least 0.035% by weight of the alkali metal hydroxide and up to 11 grams per liter, (C) chelating agent ranging in amount of at least 3% by weight of the alkali metal hydroxide and up to 44 grams per liter and (D) fluoroalkyl surfactant ranging in amount of at least 0.0002% by weight of the alkali metal hydroxide and up to 0.44 gramper liter.
- the solid granular composition capable of forming References Cited the aqueous etching solution of claim 1 comprised of (A) UNITED STATES PATENTS from 80% to 95% of alkali metal hydroxide, (B) from 0.002% to 0.2% of fluoroalkyl surfactant, hte precent- 3314890 4/1967 Smlth (C) from 3% to 20% Of chelating agent and (D) from 5 JACOB H STEINBERG i E i 0.0002% to 002% of fluoroalkyl surfactant, the percentages of (B), (C) and (D) being based on the Weight of US. Cl. XJR.
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- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- ing And Chemical Polishing (AREA)
- Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US76975568A | 1968-10-22 | 1968-10-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| US3557000A true US3557000A (en) | 1971-01-19 |
Family
ID=25086410
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US769755A Expired - Lifetime US3557000A (en) | 1968-10-22 | 1968-10-22 | Alkali etchant composition for aluminum having extended bath life |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US3557000A (enrdf_load_stackoverflow) |
| JP (1) | JPS4843020B1 (enrdf_load_stackoverflow) |
| BE (1) | BE740553A (enrdf_load_stackoverflow) |
| CH (1) | CH508739A (enrdf_load_stackoverflow) |
| DE (1) | DE1952425C3 (enrdf_load_stackoverflow) |
| FR (1) | FR2021214A1 (enrdf_load_stackoverflow) |
| GB (1) | GB1227070A (enrdf_load_stackoverflow) |
| NL (1) | NL6915915A (enrdf_load_stackoverflow) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4028205A (en) * | 1975-09-29 | 1977-06-07 | Kaiser Aluminum & Chemical Corporation | Surface treatment of aluminum |
| US4477290A (en) * | 1983-01-10 | 1984-10-16 | Pennwalt Corporation | Cleaning and etching process for aluminum containers |
| US4588474A (en) * | 1981-02-03 | 1986-05-13 | Chem-Tronics, Incorporated | Chemical milling processes and etchants therefor |
| US4915782A (en) * | 1988-12-21 | 1990-04-10 | Mcdonnell Douglas Corporation | Aluminum lithium etchant |
| US5186790A (en) * | 1990-11-13 | 1993-02-16 | Aluminum Company Of America | Chemical milling of aluminum-lithium alloys |
| US5700383A (en) * | 1995-12-21 | 1997-12-23 | Intel Corporation | Slurries and methods for chemical mechanical polish of aluminum and titanium aluminide |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111593349B (zh) * | 2020-06-03 | 2022-03-04 | 江苏富乐华半导体科技股份有限公司 | 一种用于制备超薄钛箔的化学铣切液及铣切方法 |
-
1968
- 1968-10-22 US US769755A patent/US3557000A/en not_active Expired - Lifetime
-
1969
- 1969-10-15 GB GB1227070D patent/GB1227070A/en not_active Expired
- 1969-10-17 DE DE1952425A patent/DE1952425C3/de not_active Expired
- 1969-10-17 CH CH1553869A patent/CH508739A/fr not_active IP Right Cessation
- 1969-10-20 JP JP44083298A patent/JPS4843020B1/ja active Pending
- 1969-10-20 FR FR6935837A patent/FR2021214A1/fr not_active Withdrawn
- 1969-10-21 BE BE740553D patent/BE740553A/xx unknown
- 1969-10-22 NL NL6915915A patent/NL6915915A/xx not_active Application Discontinuation
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4028205A (en) * | 1975-09-29 | 1977-06-07 | Kaiser Aluminum & Chemical Corporation | Surface treatment of aluminum |
| US4588474A (en) * | 1981-02-03 | 1986-05-13 | Chem-Tronics, Incorporated | Chemical milling processes and etchants therefor |
| US4477290A (en) * | 1983-01-10 | 1984-10-16 | Pennwalt Corporation | Cleaning and etching process for aluminum containers |
| US4915782A (en) * | 1988-12-21 | 1990-04-10 | Mcdonnell Douglas Corporation | Aluminum lithium etchant |
| US5186790A (en) * | 1990-11-13 | 1993-02-16 | Aluminum Company Of America | Chemical milling of aluminum-lithium alloys |
| US5700383A (en) * | 1995-12-21 | 1997-12-23 | Intel Corporation | Slurries and methods for chemical mechanical polish of aluminum and titanium aluminide |
Also Published As
| Publication number | Publication date |
|---|---|
| FR2021214A1 (enrdf_load_stackoverflow) | 1970-07-17 |
| NL6915915A (enrdf_load_stackoverflow) | 1970-04-24 |
| JPS4843020B1 (enrdf_load_stackoverflow) | 1973-12-15 |
| BE740553A (enrdf_load_stackoverflow) | 1970-04-21 |
| DE1952425A1 (de) | 1970-04-30 |
| GB1227070A (enrdf_load_stackoverflow) | 1971-03-31 |
| CH508739A (fr) | 1971-06-15 |
| DE1952425B2 (de) | 1978-10-19 |
| DE1952425C3 (de) | 1979-06-21 |
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