US3483100A - Tin plating baths - Google Patents

Tin plating baths Download PDF

Info

Publication number
US3483100A
US3483100A US666983A US3483100DA US3483100A US 3483100 A US3483100 A US 3483100A US 666983 A US666983 A US 666983A US 3483100D A US3483100D A US 3483100DA US 3483100 A US3483100 A US 3483100A
Authority
US
United States
Prior art keywords
tin
group
brightener
baths
bath
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US666983A
Other languages
English (en)
Inventor
Jan Johannes Engelsman
Petrus Baeyens
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
US Philips Corp
Original Assignee
US Philips Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by US Philips Corp filed Critical US Philips Corp
Application granted granted Critical
Publication of US3483100A publication Critical patent/US3483100A/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/30Electroplating: Baths therefor from solutions of tin
    • C25D3/32Electroplating: Baths therefor from solutions of tin characterised by the organic bath constituents used

Definitions

  • R and R being hydrogen, alkyl or phenyl or 0R wherein R is alkyl where at least one hydrogen has been replaced by amino, alkylamino or hydroxyl groups or a secondary brightener of the formula n being 0-5 and possibly one or more hydrogen atoms in the CH group being replaced by hydroxyl groups.
  • these secondary brighteners are glyoxal, vinylacetate and N-vinyl carbazole.
  • the invention relates to an acid tin-plating bath containing sulphate, sulphonate or fluoborate anions and brighteners by means of which bright tin deposits can be obtained.
  • Acid tin-plating baths which contain as brightener a condensation product of an aliphatic aldehyde and an organic compound having a basic nitrogen-containing group, for example a reaction product of acetaldehyde and o-toluidine. These brighteners become resinous very soon, however, so that the bath has only a short stability.
  • acid tin-plating baths which contain as brightener an aromatic or heterocyclic aldehyde. These baths have the disadvantage, however, that they produce bright deposits only in a very limited current density range, only between about 5 and 20 A/sq. dm. This means that strongly profiled workpieces having sharp edges and small perforations, the electrolytic coating of which involves current density variations of a factor of even as low as 100, cannot be coated with a thin layer of uniform thickness and brightness. The current density variations are considerably larger if the electrolytic coating process is carried out in a drum.
  • CHO, -COOH, -CH OH, --R or OR is a corresponding nonsaturated ketone.
  • These baths moreover contain formalin, imidazolin or derivatives and mixtures thereof.
  • a number of organic compounds have been found which, when added instead of formalin together with a brightener to an electrolyte tin-plating bath, have the advantage that they have a larger brightening effect on the tin obtained and that they do not have disagreeable odors.
  • the usable com pounds can be found in a few chemical classes which are chemically not at all related to each other. However, the applicant has found a common electrochemical criterion which the said compounds must satisfy.
  • a non-ionic surface-active substance to a solution of sulfuric acid, an aryl sulphonate or a fluo borate, the overvoltage for the separation of hydrogen at a cathode of tin is raised.
  • the cell containing a platinum anode and a tin cathode; the EMF is measured between the tin cathode and the platinum anode or an auxiliary calomel electrode provided in the cell, a small quantity of the substance to be tested being added to the electrolyte liquid. If the EMF decreases after addition of X the substance, the latter suits the purpose of the invention.
  • R reprsents a hydrogen atom, an alkyl group or a phenyl group and R OH
  • n a value 0, 1, 2, 3, 4 or 5, while in the CH groups one or more hydrogen atoms are allowed to be replaced by OH groups.
  • each of the symbols R R and R represents a hydrogen atom, an aromatic, heterocyclic or aliphatic group or a similar group which may be entirely or partly hydrated and which may have substituents which cannot be ionized or cannot be reduced in this medium
  • R represents hydrogen, an alkyl group or an esterified carboxyl group, or where the combination represents a ring system, on the understanding that the group C:C-- has a purely non-saturated character.
  • a further improvement is obtained by the use of the last-mentioned baths, i.e. a larger brightness and an even larger current density range if instead of formalin such a compound which is capable of reducing the overvoltage for the evolution of hydrogen at a tin cathode, is added to the tin-plating bath.
  • Lissapol N is a non-ionic wetting agent which consists of a condensation product of polyoxyethylene and alkylphenol.
  • tin ion anions selected from the group consisting of sulfate, organic sulfonate and fluoborate ions, at non-ionic surface active agent and an olefinically unsaturated organic carbonyl primary brightener and as a secondary brightener a polymerizable organic compound capable of reducing the overvoltage for the evolution of hydrogen at a tin cathode
  • said polymerizable organic compound is selected from the group consisting of a compound of the formula wherein R is a member of the group consisting of hydrogen, alkyl and phenyl, R is a member selected from the group consisting of 011 and N R3 and R4 being selected from the group consisting of phenyl, hydrogen, alkyl and 0R wherein R is alkyl wherein at least one hydrogen atom has been replaced by a member selected from the group consisting of amino
  • a carbonyl compound selected from the group consisting of aromatic and heterocyclic ring containing aldehydes wherein the carbonyl group is directly attached to one of said rings and a, B olefinically unsaturated carbonyl compounds; said carbonyl compounds being free of ionizable and reducible substituents, nitrogen containing substituents and compounds hydrolyzable in said bath to said carbonyl com- References Cited pound.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
US666983A 1966-09-14 1967-09-11 Tin plating baths Expired - Lifetime US3483100A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL666612936A NL151449B (nl) 1966-09-14 1966-09-14 Werkwijze voor de bereiding van een zuur bad voor het elektrolytisch neerslaan van tin.

Publications (1)

Publication Number Publication Date
US3483100A true US3483100A (en) 1969-12-09

Family

ID=19797659

Family Applications (1)

Application Number Title Priority Date Filing Date
US666983A Expired - Lifetime US3483100A (en) 1966-09-14 1967-09-11 Tin plating baths

Country Status (7)

Country Link
US (1) US3483100A (nl)
AT (1) AT278462B (nl)
BE (1) BE703841A (nl)
CH (1) CH519581A (nl)
FR (1) FR1536736A (nl)
GB (1) GB1199634A (nl)
NL (1) NL151449B (nl)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3755096A (en) * 1971-07-01 1973-08-28 M & T Chemicals Inc Bright acid tin plating
FR2428686A1 (fr) * 1978-06-16 1980-01-11 M & T Chemicals Inc Nouveau bain de depot electrolytique d'etain brillant
US5814202A (en) * 1997-10-14 1998-09-29 Usx Corporation Electrolytic tin plating process with reduced sludge production
US20090098398A1 (en) * 2006-04-14 2009-04-16 C. Uyemura & Co., Ltd. Tin electroplating bath, tin plating film, tin electroplating method, and electronic device component
US8440065B1 (en) * 2009-06-07 2013-05-14 Technic, Inc. Electrolyte composition, method, and improved apparatus for high speed tin-silver electroplating
US20150122661A1 (en) * 2013-11-05 2015-05-07 Rohm And Haas Electronic Materials Llc Plating bath and method
CN106222710A (zh) * 2016-08-29 2016-12-14 昆明理工大学 一种酸性半光亮镀锡溶液及其制备方法
CN115058762A (zh) * 2022-08-11 2022-09-16 深圳市板明科技股份有限公司 一种电镀锡工艺用锡沉降剂及其使用方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL6501841A (nl) * 1965-02-13 1966-08-15
US3361652A (en) * 1963-08-28 1968-01-02 Max Schlotter Dr Ing Electrodeposition of bright tin

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3361652A (en) * 1963-08-28 1968-01-02 Max Schlotter Dr Ing Electrodeposition of bright tin
NL6501841A (nl) * 1965-02-13 1966-08-15

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3755096A (en) * 1971-07-01 1973-08-28 M & T Chemicals Inc Bright acid tin plating
FR2428686A1 (fr) * 1978-06-16 1980-01-11 M & T Chemicals Inc Nouveau bain de depot electrolytique d'etain brillant
US5814202A (en) * 1997-10-14 1998-09-29 Usx Corporation Electrolytic tin plating process with reduced sludge production
US20090098398A1 (en) * 2006-04-14 2009-04-16 C. Uyemura & Co., Ltd. Tin electroplating bath, tin plating film, tin electroplating method, and electronic device component
US8440066B2 (en) * 2006-04-14 2013-05-14 C. Uyemura & Co., Ltd. Tin electroplating bath, tin plating film, tin electroplating method, and electronic device component
US8440065B1 (en) * 2009-06-07 2013-05-14 Technic, Inc. Electrolyte composition, method, and improved apparatus for high speed tin-silver electroplating
US20150122661A1 (en) * 2013-11-05 2015-05-07 Rohm And Haas Electronic Materials Llc Plating bath and method
CN106222710A (zh) * 2016-08-29 2016-12-14 昆明理工大学 一种酸性半光亮镀锡溶液及其制备方法
CN115058762A (zh) * 2022-08-11 2022-09-16 深圳市板明科技股份有限公司 一种电镀锡工艺用锡沉降剂及其使用方法
CN115058762B (zh) * 2022-08-11 2022-11-08 深圳市板明科技股份有限公司 一种电镀锡工艺用锡沉降剂及其使用方法

Also Published As

Publication number Publication date
GB1199634A (en) 1970-07-22
NL6612936A (nl) 1968-03-15
NL151449B (nl) 1976-11-15
FR1536736A (fr) 1968-08-16
DE1621127B2 (de) 1972-11-09
CH519581A (de) 1972-02-29
BE703841A (nl) 1968-03-13
AT278462B (de) 1970-02-10
DE1621127A1 (de) 1971-05-13

Similar Documents

Publication Publication Date Title
US8920623B2 (en) Method for replenishing tin and its alloying metals in electrolyte solutions
CA1115654A (en) Bright tin-lead alloy plating
US4167460A (en) Trivalent chromium plating bath composition and process
US4075066A (en) Electroplating zinc, ammonia-free acid zinc plating bath therefor and additive composition therefor
US3483100A (en) Tin plating baths
GB2062009A (en) Electroplacting Bath and Process
US3616306A (en) Tin plating bath and method
US2313371A (en) Electrodeposition of tin and its alloys
US3730853A (en) Electroplating bath for depositing tin-lead alloy plates
US4543166A (en) Zinc-alloy electrolyte and process
US3661730A (en) Process for the formation of a super-bright solder coating
US4994155A (en) High speed tin, lead or tin/lead alloy electroplating
US3692641A (en) Electrodeposition of low stress ruthenium alloy
US3637474A (en) Electrodeposition of palladium
US4880507A (en) Tin, lead or tin/lead alloy electrolytes for high speed electroplating
US20040195107A1 (en) Electrolytic solution for electrochemical deposition gold and its alloys
GB2179676A (en) Zinc alloy electroplating
US3500537A (en) Method of making palladium coated electrical contacts
GB2117408A (en) Nickel electroplating bath and process
US4069113A (en) Electroplating gold alloys and electrolytes therefor
US4199417A (en) Electrodeposition of black deposit and electrolytes therefor
US4496439A (en) Acidic zinc-plating bath
WO1993018211A1 (en) Cyanide-free copper plating bath and process
GB2101634A (en) Process and composition for the electrodeposition of tin
US3577328A (en) Method and bath for electroplating tin