US3483100A - Tin plating baths - Google Patents
Tin plating baths Download PDFInfo
- Publication number
- US3483100A US3483100A US666983A US3483100DA US3483100A US 3483100 A US3483100 A US 3483100A US 666983 A US666983 A US 666983A US 3483100D A US3483100D A US 3483100DA US 3483100 A US3483100 A US 3483100A
- Authority
- US
- United States
- Prior art keywords
- tin
- group
- brightener
- baths
- bath
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/30—Electroplating: Baths therefor from solutions of tin
- C25D3/32—Electroplating: Baths therefor from solutions of tin characterised by the organic bath constituents used
Definitions
- R and R being hydrogen, alkyl or phenyl or 0R wherein R is alkyl where at least one hydrogen has been replaced by amino, alkylamino or hydroxyl groups or a secondary brightener of the formula n being 0-5 and possibly one or more hydrogen atoms in the CH group being replaced by hydroxyl groups.
- these secondary brighteners are glyoxal, vinylacetate and N-vinyl carbazole.
- the invention relates to an acid tin-plating bath containing sulphate, sulphonate or fluoborate anions and brighteners by means of which bright tin deposits can be obtained.
- Acid tin-plating baths which contain as brightener a condensation product of an aliphatic aldehyde and an organic compound having a basic nitrogen-containing group, for example a reaction product of acetaldehyde and o-toluidine. These brighteners become resinous very soon, however, so that the bath has only a short stability.
- acid tin-plating baths which contain as brightener an aromatic or heterocyclic aldehyde. These baths have the disadvantage, however, that they produce bright deposits only in a very limited current density range, only between about 5 and 20 A/sq. dm. This means that strongly profiled workpieces having sharp edges and small perforations, the electrolytic coating of which involves current density variations of a factor of even as low as 100, cannot be coated with a thin layer of uniform thickness and brightness. The current density variations are considerably larger if the electrolytic coating process is carried out in a drum.
- CHO, -COOH, -CH OH, --R or OR is a corresponding nonsaturated ketone.
- These baths moreover contain formalin, imidazolin or derivatives and mixtures thereof.
- a number of organic compounds have been found which, when added instead of formalin together with a brightener to an electrolyte tin-plating bath, have the advantage that they have a larger brightening effect on the tin obtained and that they do not have disagreeable odors.
- the usable com pounds can be found in a few chemical classes which are chemically not at all related to each other. However, the applicant has found a common electrochemical criterion which the said compounds must satisfy.
- a non-ionic surface-active substance to a solution of sulfuric acid, an aryl sulphonate or a fluo borate, the overvoltage for the separation of hydrogen at a cathode of tin is raised.
- the cell containing a platinum anode and a tin cathode; the EMF is measured between the tin cathode and the platinum anode or an auxiliary calomel electrode provided in the cell, a small quantity of the substance to be tested being added to the electrolyte liquid. If the EMF decreases after addition of X the substance, the latter suits the purpose of the invention.
- R reprsents a hydrogen atom, an alkyl group or a phenyl group and R OH
- n a value 0, 1, 2, 3, 4 or 5, while in the CH groups one or more hydrogen atoms are allowed to be replaced by OH groups.
- each of the symbols R R and R represents a hydrogen atom, an aromatic, heterocyclic or aliphatic group or a similar group which may be entirely or partly hydrated and which may have substituents which cannot be ionized or cannot be reduced in this medium
- R represents hydrogen, an alkyl group or an esterified carboxyl group, or where the combination represents a ring system, on the understanding that the group C:C-- has a purely non-saturated character.
- a further improvement is obtained by the use of the last-mentioned baths, i.e. a larger brightness and an even larger current density range if instead of formalin such a compound which is capable of reducing the overvoltage for the evolution of hydrogen at a tin cathode, is added to the tin-plating bath.
- Lissapol N is a non-ionic wetting agent which consists of a condensation product of polyoxyethylene and alkylphenol.
- tin ion anions selected from the group consisting of sulfate, organic sulfonate and fluoborate ions, at non-ionic surface active agent and an olefinically unsaturated organic carbonyl primary brightener and as a secondary brightener a polymerizable organic compound capable of reducing the overvoltage for the evolution of hydrogen at a tin cathode
- said polymerizable organic compound is selected from the group consisting of a compound of the formula wherein R is a member of the group consisting of hydrogen, alkyl and phenyl, R is a member selected from the group consisting of 011 and N R3 and R4 being selected from the group consisting of phenyl, hydrogen, alkyl and 0R wherein R is alkyl wherein at least one hydrogen atom has been replaced by a member selected from the group consisting of amino
- a carbonyl compound selected from the group consisting of aromatic and heterocyclic ring containing aldehydes wherein the carbonyl group is directly attached to one of said rings and a, B olefinically unsaturated carbonyl compounds; said carbonyl compounds being free of ionizable and reducible substituents, nitrogen containing substituents and compounds hydrolyzable in said bath to said carbonyl com- References Cited pound.
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
NL666612936A NL151449B (nl) | 1966-09-14 | 1966-09-14 | Werkwijze voor de bereiding van een zuur bad voor het elektrolytisch neerslaan van tin. |
Publications (1)
Publication Number | Publication Date |
---|---|
US3483100A true US3483100A (en) | 1969-12-09 |
Family
ID=19797659
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US666983A Expired - Lifetime US3483100A (en) | 1966-09-14 | 1967-09-11 | Tin plating baths |
Country Status (7)
Country | Link |
---|---|
US (1) | US3483100A (nl) |
AT (1) | AT278462B (nl) |
BE (1) | BE703841A (nl) |
CH (1) | CH519581A (nl) |
FR (1) | FR1536736A (nl) |
GB (1) | GB1199634A (nl) |
NL (1) | NL151449B (nl) |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3755096A (en) * | 1971-07-01 | 1973-08-28 | M & T Chemicals Inc | Bright acid tin plating |
FR2428686A1 (fr) * | 1978-06-16 | 1980-01-11 | M & T Chemicals Inc | Nouveau bain de depot electrolytique d'etain brillant |
US5814202A (en) * | 1997-10-14 | 1998-09-29 | Usx Corporation | Electrolytic tin plating process with reduced sludge production |
US20090098398A1 (en) * | 2006-04-14 | 2009-04-16 | C. Uyemura & Co., Ltd. | Tin electroplating bath, tin plating film, tin electroplating method, and electronic device component |
US8440065B1 (en) * | 2009-06-07 | 2013-05-14 | Technic, Inc. | Electrolyte composition, method, and improved apparatus for high speed tin-silver electroplating |
US20150122661A1 (en) * | 2013-11-05 | 2015-05-07 | Rohm And Haas Electronic Materials Llc | Plating bath and method |
CN106222710A (zh) * | 2016-08-29 | 2016-12-14 | 昆明理工大学 | 一种酸性半光亮镀锡溶液及其制备方法 |
CN115058762A (zh) * | 2022-08-11 | 2022-09-16 | 深圳市板明科技股份有限公司 | 一种电镀锡工艺用锡沉降剂及其使用方法 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL6501841A (nl) * | 1965-02-13 | 1966-08-15 | ||
US3361652A (en) * | 1963-08-28 | 1968-01-02 | Max Schlotter Dr Ing | Electrodeposition of bright tin |
-
1966
- 1966-09-14 NL NL666612936A patent/NL151449B/nl not_active IP Right Cessation
-
1967
- 1967-09-11 CH CH1263867A patent/CH519581A/de not_active IP Right Cessation
- 1967-09-11 AT AT828767A patent/AT278462B/de not_active IP Right Cessation
- 1967-09-11 US US666983A patent/US3483100A/en not_active Expired - Lifetime
- 1967-09-13 FR FR120832A patent/FR1536736A/fr not_active Expired
- 1967-09-13 BE BE703841D patent/BE703841A/xx not_active IP Right Cessation
- 1967-09-14 GB GB42001/67A patent/GB1199634A/en not_active Expired
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3361652A (en) * | 1963-08-28 | 1968-01-02 | Max Schlotter Dr Ing | Electrodeposition of bright tin |
NL6501841A (nl) * | 1965-02-13 | 1966-08-15 |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3755096A (en) * | 1971-07-01 | 1973-08-28 | M & T Chemicals Inc | Bright acid tin plating |
FR2428686A1 (fr) * | 1978-06-16 | 1980-01-11 | M & T Chemicals Inc | Nouveau bain de depot electrolytique d'etain brillant |
US5814202A (en) * | 1997-10-14 | 1998-09-29 | Usx Corporation | Electrolytic tin plating process with reduced sludge production |
US20090098398A1 (en) * | 2006-04-14 | 2009-04-16 | C. Uyemura & Co., Ltd. | Tin electroplating bath, tin plating film, tin electroplating method, and electronic device component |
US8440066B2 (en) * | 2006-04-14 | 2013-05-14 | C. Uyemura & Co., Ltd. | Tin electroplating bath, tin plating film, tin electroplating method, and electronic device component |
US8440065B1 (en) * | 2009-06-07 | 2013-05-14 | Technic, Inc. | Electrolyte composition, method, and improved apparatus for high speed tin-silver electroplating |
US20150122661A1 (en) * | 2013-11-05 | 2015-05-07 | Rohm And Haas Electronic Materials Llc | Plating bath and method |
CN106222710A (zh) * | 2016-08-29 | 2016-12-14 | 昆明理工大学 | 一种酸性半光亮镀锡溶液及其制备方法 |
CN115058762A (zh) * | 2022-08-11 | 2022-09-16 | 深圳市板明科技股份有限公司 | 一种电镀锡工艺用锡沉降剂及其使用方法 |
CN115058762B (zh) * | 2022-08-11 | 2022-11-08 | 深圳市板明科技股份有限公司 | 一种电镀锡工艺用锡沉降剂及其使用方法 |
Also Published As
Publication number | Publication date |
---|---|
GB1199634A (en) | 1970-07-22 |
NL6612936A (nl) | 1968-03-15 |
NL151449B (nl) | 1976-11-15 |
FR1536736A (fr) | 1968-08-16 |
DE1621127B2 (de) | 1972-11-09 |
CH519581A (de) | 1972-02-29 |
BE703841A (nl) | 1968-03-13 |
AT278462B (de) | 1970-02-10 |
DE1621127A1 (de) | 1971-05-13 |
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