US3480078A - Cooling device for cylindrical electrical components - Google Patents

Cooling device for cylindrical electrical components Download PDF

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Publication number
US3480078A
US3480078A US689744A US3480078DA US3480078A US 3480078 A US3480078 A US 3480078A US 689744 A US689744 A US 689744A US 3480078D A US3480078D A US 3480078DA US 3480078 A US3480078 A US 3480078A
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cooling device
segments
cylindrical
cooling
electrical component
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US689744A
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Edwin Jager
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4093Snap-on arrangements, e.g. clips
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention relates to cooling devices for cylindrical electrical components, e.g. transistors and other semiconductor devices or electrical discharge tubes. These electrical components are usually arranged in a cylindrical casing which it is necessary or desirable to cool.
  • the present invention provides a cooling device for a cylindrical electrical component, comprising at least two cylindrical envelope segments which together form an at least almost complete cylindrical envelope for abutment against the electrical component with good surface contact, and which are provided with axially parallel cooling ribs having at the outer edges of the ribs recesses which are situated in a diametral plane of the cylindrical envelope, an open spring ring being engageable in the recesses for pressing the segments in the radial sense.
  • Each cylindrical envelope segment may be extruded in one piece with its cooling ribs.
  • the cylindrical envelope segments and the cooling ribs preferably comprise aluminum. At least the outer sides of the cylindrical envelope segments and the cooling ribs are preferably blackened.
  • the spring ring may be an open wire ring.
  • the cylindrical envelope segments may be intended to abut over their entire inner surfaces against the cylindrical electrical component, in which case the recesses at the edges of the cooling ribs of the cylindrical envelope segments may be arranged midway along the axial length of the cooling device.
  • the axial length of the cooling device may be greater than the axial length of the cylindrical electrical component, the cylindrical envelope segments being intended to abut along part of their length against the cylindrical electrical component, in which case the recesses are at least approximately midway along the length of said part.
  • FIGURE 1 is a plan view of a transistor with a cooling device
  • FIGURE 2 is a sectional view taken on the line II-Il of FIGURE 1,
  • FIGURE 3 is a view corresponding to FIGURE 2 showing a modification of the cooling device of FIGURES 1 and 2.
  • reference numeral 1 designates the cylindrical casing of a transistor the cooling of which is effected by the cooling device which will be described hereinafter.
  • This cooling device comprises two cylindrical envelope segments 2 with cooling ribs 3 and an open spring ring 4.
  • the segments 2 together form an almost complete cylindrical envelope; they abut on the cylindrical casing -1 of the transistor, for which purpose their inner side has the same radius of curvature as the outer side of the casing 1. Since the segments form only an almost complete cylindrical envelope, they are separated from one another by narrow gaps 5.
  • the cooling ribs 3 extend parallel to the geometric axis 6 of the segments 2.
  • Each of the segments 2 is made together with its cooling ribs 3 from a single aluminum extrusion and is blackened in order to improve heat radiation.
  • the cooling ribs 3 each have a recess 7 at the outer edge. These recesses 7 are situated in a diametral plane of the cylindrical envelope midway along the axial length of the segments 2, which corresponds to the axial length of the casing 1.
  • the spring ring 4 is an open wire ring which is arranged in the recesses 7 and presses the segments 2 with the cooling ribs 3 in the radial sense, whereby these are pressed against the casing 1 of the transistor in order to establish thermal contact therewith.
  • the modification shown in FIGURE 3 differs from the embodiment shown in FIGURES 1 and 2 in that the axial length of the segments 12 and cooling ribs 13 is greater than the axial length of the casing 1 of the transistor, and the diametral plane in which the recesses 17, in which the spring ring 4 is situated, are arranged is not situated midway along the axial length of the segments 12 but that of the axial length of the casing 1.
  • This modification shown in FIGURE 3 has a greater cooling capacity than the embodiment shown in FIGURES 1 and 2.
  • the cooling device described is simple and correspondingly cheap to produce, since it consists only of parts which can easily be extruded, and a spring ring.
  • This cooling device is simple to use; it can easily be applied to a cylindrical electrical circuit component and removed therefrom again e.g. if such an element is replaced by another. Since the cooling device described comprises two parts held together resiliently, reliable thermal contact is guaranteed even if the diameter of the cylindrical electrical circuit component deviates within certain tolerance limits from the nominal diameter which the segments of the cooling device are intended to match.
  • a cooling device for a cylindrical electrical component which is readily connectable thereto and removable therefrom, comprising at least a pair of unitized similar cylindrical envelope body segments having inner and outer wall portions with the same radius of curvature as the electrical component, the inner wall portions of said body segments together forming a cylindrical envelope adapted for intimate abutment against the electrical component with good surface contact between the electrical component and said inner wall portions, more than a pair of cooling ribs integrally extruded in one piece with each body segment, said cooling ribs of each body segment being coextensive therewith and extending radially outwardly from and spaced circumferentially about the respective outer wall portion in axially parallel relation, each cooling rib having an outer free edge, and opposite ends, a recess in the outer free edge of each cooling rib of each body segment intermediate the opposite ends thereof thereby providing a plurality of recesses about said cooling device in a diametrical plane of the envelope which plane is in a medial portion of the cylindrical envelope, and an open spring ring resiliently engaged
  • a cooling device according to claim 1, wherein the cylindrical envelope body segments and the integral cooling ribs are comprised of aluminum.
  • a cooling device according to claim 1, wherein at least the outer wall portions of said envelope body segments and the cooling ribs are blackened.
  • a cooling device according to claim 1, wherein the spring ring is an open wire ring.
  • a cooling device according to claim 1, wherein the recesses at the edges of the cooling ribs of the cylindrical envelope body segments, which are intended to abut over their entire wall portions against the cylindrical electrical component, are arranged midway along the axial length of the cooling device.
  • a cooling device according to claim 1, wherein the recesses at the edges of the cooling ribs of the cylindrical envelope body segments, which are intended to abut along part of their axial length against the cylindrical electrical component, are arranged at least approximately midway along the length of said axial length part.

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Description

Nov. 25, 1969 E. JAGER 3,480,078
COOLING DEVICE FOR CYLINDRICAL ELECTRICAL COMPONENTS "Filed Nov. 21. 1967 In van/0r:
EDWIN JAG-ER BY 3%, W "92222;
ATTORNEYS Unitcd States Patent U.S. Cl. 165-185 6 Claims ABSTRACT OF THE DISCLOSURE At least a pair of longitudinally extending semi-cylindrical envelope segments, each provided with a plurality of axially extending cooling ribs, with the segments adapted to be fitted together about a cylindrical electrical component to form a substantially complete cylindrical envelope about the component, the inner bore of which is in intimate abutting contact with the cylindrical surface of the electrical component to form a heat dissipating and cooling device, and the outer edges of the cooling ribs provided with recesses into which a spring ring is engageable for holding the segments in intimate contact with the electrical component.
The present invention relates to cooling devices for cylindrical electrical components, e.g. transistors and other semiconductor devices or electrical discharge tubes. These electrical components are usually arranged in a cylindrical casing which it is necessary or desirable to cool.
It is an object of the present invention to provide a cooling device for this purpose which is simple to produce and use.
The present invention provides a cooling device for a cylindrical electrical component, comprising at least two cylindrical envelope segments which together form an at least almost complete cylindrical envelope for abutment against the electrical component with good surface contact, and which are provided with axially parallel cooling ribs having at the outer edges of the ribs recesses which are situated in a diametral plane of the cylindrical envelope, an open spring ring being engageable in the recesses for pressing the segments in the radial sense.
Each cylindrical envelope segment may be extruded in one piece with its cooling ribs. The cylindrical envelope segments and the cooling ribs preferably comprise aluminum. At least the outer sides of the cylindrical envelope segments and the cooling ribs are preferably blackened.
The spring ring may be an open wire ring.
The cylindrical envelope segments may be intended to abut over their entire inner surfaces against the cylindrical electrical component, in which case the recesses at the edges of the cooling ribs of the cylindrical envelope segments may be arranged midway along the axial length of the cooling device. To improve the cooling effect, the axial length of the cooling device may be greater than the axial length of the cylindrical electrical component, the cylindrical envelope segments being intended to abut along part of their length against the cylindrical electrical component, in which case the recesses are at least approximately midway along the length of said part.
The invention will be more readily understood from the following description, given by way of example, of the embodiments thereof illustrated in the accompanying drawing, in which:
FIGURE 1 is a plan view of a transistor with a cooling device,
ice
FIGURE 2 is a sectional view taken on the line II-Il of FIGURE 1,
FIGURE 3 is a view corresponding to FIGURE 2 showing a modification of the cooling device of FIGURES 1 and 2.
In FIGURES 1 and 2 reference numeral 1 designates the cylindrical casing of a transistor the cooling of which is effected by the cooling device which will be described hereinafter. This cooling device comprises two cylindrical envelope segments 2 with cooling ribs 3 and an open spring ring 4. The segments 2 together form an almost complete cylindrical envelope; they abut on the cylindrical casing -1 of the transistor, for which purpose their inner side has the same radius of curvature as the outer side of the casing 1. Since the segments form only an almost complete cylindrical envelope, they are separated from one another by narrow gaps 5. The cooling ribs 3 extend parallel to the geometric axis 6 of the segments 2. Each of the segments 2 is made together with its cooling ribs 3 from a single aluminum extrusion and is blackened in order to improve heat radiation. The cooling ribs 3 each have a recess 7 at the outer edge. These recesses 7 are situated in a diametral plane of the cylindrical envelope midway along the axial length of the segments 2, which corresponds to the axial length of the casing 1. The spring ring 4 is an open wire ring which is arranged in the recesses 7 and presses the segments 2 with the cooling ribs 3 in the radial sense, whereby these are pressed against the casing 1 of the transistor in order to establish thermal contact therewith.
The modification shown in FIGURE 3 differs from the embodiment shown in FIGURES 1 and 2 in that the axial length of the segments 12 and cooling ribs 13 is greater than the axial length of the casing 1 of the transistor, and the diametral plane in which the recesses 17, in which the spring ring 4 is situated, are arranged is not situated midway along the axial length of the segments 12 but that of the axial length of the casing 1. The spring ring 4 acting offset from the midpoint of the length of the segments 12, but midway along the length of the casing 1, exerts a constant pressure in the region of the contact surface between the segments and the casing 1. This modification shown in FIGURE 3 has a greater cooling capacity than the embodiment shown in FIGURES 1 and 2.
The cooling device described is simple and correspondingly cheap to produce, since it consists only of parts which can easily be extruded, and a spring ring. This cooling device is simple to use; it can easily be applied to a cylindrical electrical circuit component and removed therefrom again e.g. if such an element is replaced by another. Since the cooling device described comprises two parts held together resiliently, reliable thermal contact is guaranteed even if the diameter of the cylindrical electrical circuit component deviates within certain tolerance limits from the nominal diameter which the segments of the cooling device are intended to match.
What I claim is:
1. A cooling device for a cylindrical electrical component which is readily connectable thereto and removable therefrom, comprising at least a pair of unitized similar cylindrical envelope body segments having inner and outer wall portions with the same radius of curvature as the electrical component, the inner wall portions of said body segments together forming a cylindrical envelope adapted for intimate abutment against the electrical component with good surface contact between the electrical component and said inner wall portions, more than a pair of cooling ribs integrally extruded in one piece with each body segment, said cooling ribs of each body segment being coextensive therewith and extending radially outwardly from and spaced circumferentially about the respective outer wall portion in axially parallel relation, each cooling rib having an outer free edge, and opposite ends, a recess in the outer free edge of each cooling rib of each body segment intermediate the opposite ends thereof thereby providing a plurality of recesses about said cooling device in a diametrical plane of the envelope which plane is in a medial portion of the cylindrical envelope, and an open spring ring resiliently engaged in said recesses for pressing the body segments radially inwardly to provide intimate contact between said inner wall portions and the electrical component, whereby the unitized body segments of the cooling device are resiliently movable relative to each other for ease in connecting said device to and removing it from an electrical component.
2. A cooling device according to claim 1, wherein the cylindrical envelope body segments and the integral cooling ribs are comprised of aluminum.
3; A cooling device according to claim 1, wherein at least the outer wall portions of said envelope body segments and the cooling ribs are blackened.
4. A cooling device according to claim 1, wherein the spring ring is an open wire ring.
5. A cooling device according to claim 1, wherein the recesses at the edges of the cooling ribs of the cylindrical envelope body segments, which are intended to abut over their entire wall portions against the cylindrical electrical component, are arranged midway along the axial length of the cooling device.
6. A cooling device according to claim 1, wherein the recesses at the edges of the cooling ribs of the cylindrical envelope body segments, which are intended to abut along part of their axial length against the cylindrical electrical component, are arranged at least approximately midway along the length of said axial length part.
References Cited UNITED STATES PATENTS 5/1920 Guyer 165-183 2/ 1962 Allison 16580
US689744A 1966-11-23 1967-11-21 Cooling device for cylindrical electrical components Expired - Lifetime US3480078A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CH1680866A CH447394A (en) 1966-11-23 1966-11-23 Heat sink for cylindrical, electrotechnical elements

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GB (1) GB1140307A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4982783A (en) * 1988-11-22 1991-01-08 Varian Associates, Inc. Self-tightening heat sink
US20060213642A1 (en) * 2005-03-25 2006-09-28 Tai-Sol Electroncs Co., Ltd. Method of combining heat sink and heat conductor and combination assembly of the same

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6210925Y2 (en) * 1978-07-18 1987-03-14
GB2266989A (en) * 1992-05-15 1993-11-17 Eev Ltd Cooling magnetrons

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1339385A (en) * 1917-11-21 1920-05-11 Escher Wyss Maschf Ag Ribbed body for heat-interchange devices
US3023264A (en) * 1959-05-18 1962-02-27 Cool Fin Electronics Corp Heat-dissipating shield

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1339385A (en) * 1917-11-21 1920-05-11 Escher Wyss Maschf Ag Ribbed body for heat-interchange devices
US3023264A (en) * 1959-05-18 1962-02-27 Cool Fin Electronics Corp Heat-dissipating shield

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4982783A (en) * 1988-11-22 1991-01-08 Varian Associates, Inc. Self-tightening heat sink
US20060213642A1 (en) * 2005-03-25 2006-09-28 Tai-Sol Electroncs Co., Ltd. Method of combining heat sink and heat conductor and combination assembly of the same

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Publication number Publication date
CH447394A (en) 1967-11-30
DE1589977A1 (en) 1970-12-03
GB1140307A (en) 1969-01-15

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