CH447394A - Heat sink for cylindrical, electrotechnical elements - Google Patents

Heat sink for cylindrical, electrotechnical elements

Info

Publication number
CH447394A
CH447394A CH1680866A CH1680866A CH447394A CH 447394 A CH447394 A CH 447394A CH 1680866 A CH1680866 A CH 1680866A CH 1680866 A CH1680866 A CH 1680866A CH 447394 A CH447394 A CH 447394A
Authority
CH
Switzerland
Prior art keywords
cylindrical
heat sink
electrotechnical elements
electrotechnical
elements
Prior art date
Application number
CH1680866A
Other languages
German (de)
Inventor
Jaeger Edwin
Original Assignee
Jaeger Edwin
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jaeger Edwin filed Critical Jaeger Edwin
Priority to CH1680866A priority Critical patent/CH447394A/en
Priority to DE19671589977 priority patent/DE1589977A1/en
Priority to GB50393/67A priority patent/GB1140307A/en
Priority to US689744A priority patent/US3480078A/en
Publication of CH447394A publication Critical patent/CH447394A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4093—Snap-on arrangements, e.g. clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
CH1680866A 1966-11-23 1966-11-23 Heat sink for cylindrical, electrotechnical elements CH447394A (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
CH1680866A CH447394A (en) 1966-11-23 1966-11-23 Heat sink for cylindrical, electrotechnical elements
DE19671589977 DE1589977A1 (en) 1966-11-23 1967-10-31 Radiator for cylindrical, electrotechnical elements
GB50393/67A GB1140307A (en) 1966-11-23 1967-11-06 Cooling devices for cylindrical electrical components
US689744A US3480078A (en) 1966-11-23 1967-11-21 Cooling device for cylindrical electrical components

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CH1680866A CH447394A (en) 1966-11-23 1966-11-23 Heat sink for cylindrical, electrotechnical elements

Publications (1)

Publication Number Publication Date
CH447394A true CH447394A (en) 1967-11-30

Family

ID=4420408

Family Applications (1)

Application Number Title Priority Date Filing Date
CH1680866A CH447394A (en) 1966-11-23 1966-11-23 Heat sink for cylindrical, electrotechnical elements

Country Status (4)

Country Link
US (1) US3480078A (en)
CH (1) CH447394A (en)
DE (1) DE1589977A1 (en)
GB (1) GB1140307A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0370806A2 (en) * 1988-11-22 1990-05-30 Varian Associates, Inc. Self-tightening heat sink

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6210925Y2 (en) * 1978-07-18 1987-03-14
GB2266989A (en) * 1992-05-15 1993-11-17 Eev Ltd Cooling magnetrons
TW200635490A (en) * 2005-03-25 2006-10-01 Tai Sol Electronics Co Ltd Combining method of heat dissipating device and conductivity bump and the combination assembly thereof

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR494135A (en) * 1917-11-21 1919-08-30 Escher Wyss & Cie Const Mec Finned body for heat exchanger devices
NL251457A (en) * 1959-05-18

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0370806A2 (en) * 1988-11-22 1990-05-30 Varian Associates, Inc. Self-tightening heat sink
EP0370806A3 (en) * 1988-11-22 1991-03-13 Varian Associates, Inc. Self-tightening heat sink

Also Published As

Publication number Publication date
DE1589977A1 (en) 1970-12-03
US3480078A (en) 1969-11-25
GB1140307A (en) 1969-01-15

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