US3380898A - Electrolyte and method for electrodepositing a pink gold alloy - Google Patents
Electrolyte and method for electrodepositing a pink gold alloy Download PDFInfo
- Publication number
- US3380898A US3380898A US465201A US46520165A US3380898A US 3380898 A US3380898 A US 3380898A US 465201 A US465201 A US 465201A US 46520165 A US46520165 A US 46520165A US 3380898 A US3380898 A US 3380898A
- Authority
- US
- United States
- Prior art keywords
- gold
- bath
- copper
- acid
- pink
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000000034 method Methods 0.000 title claims description 10
- 239000003353 gold alloy Substances 0.000 title description 7
- 229910001112 rose gold Inorganic materials 0.000 title description 4
- 239000003792 electrolyte Substances 0.000 title description 2
- 230000008569 process Effects 0.000 claims description 7
- QRJOYPHTNNOAOJ-UHFFFAOYSA-N copper gold Chemical compound [Cu].[Au] QRJOYPHTNNOAOJ-UHFFFAOYSA-N 0.000 claims description 6
- 239000004615 ingredient Substances 0.000 claims description 5
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 2
- 239000007864 aqueous solution Substances 0.000 claims description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 14
- 239000010931 gold Substances 0.000 description 14
- 229910052737 gold Inorganic materials 0.000 description 14
- 239000002253 acid Substances 0.000 description 13
- 150000003839 salts Chemical class 0.000 description 9
- KCXVZYZYPLLWCC-UHFFFAOYSA-N EDTA Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(O)=O)CC(O)=O KCXVZYZYPLLWCC-UHFFFAOYSA-N 0.000 description 8
- 239000010949 copper Substances 0.000 description 7
- 229960001484 edetic acid Drugs 0.000 description 7
- 239000011734 sodium Substances 0.000 description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 6
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- 229910001020 Au alloy Inorganic materials 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 229910052787 antimony Inorganic materials 0.000 description 4
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 4
- SZXAQBAUDGBVLT-UHFFFAOYSA-H antimony(3+);2,3-dihydroxybutanedioate Chemical compound [Sb+3].[Sb+3].[O-]C(=O)C(O)C(O)C([O-])=O.[O-]C(=O)C(O)C(O)C([O-])=O.[O-]C(=O)C(O)C(O)C([O-])=O SZXAQBAUDGBVLT-UHFFFAOYSA-H 0.000 description 3
- 238000009713 electroplating Methods 0.000 description 3
- 229940046892 lead acetate Drugs 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- FEWJPZIEWOKRBE-JCYAYHJZSA-N Dextrotartaric acid Chemical compound OC(=O)[C@H](O)[C@@H](O)C(O)=O FEWJPZIEWOKRBE-JCYAYHJZSA-N 0.000 description 2
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- 229920000388 Polyphosphate Polymers 0.000 description 2
- 150000007513 acids Chemical class 0.000 description 2
- 229910052783 alkali metal Inorganic materials 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 239000002738 chelating agent Substances 0.000 description 2
- 239000008139 complexing agent Substances 0.000 description 2
- 150000001879 copper Chemical class 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229910021645 metal ion Inorganic materials 0.000 description 2
- 239000001205 polyphosphate Substances 0.000 description 2
- 235000011176 polyphosphates Nutrition 0.000 description 2
- XTFKWYDMKGAZKK-UHFFFAOYSA-N potassium;gold(1+);dicyanide Chemical compound [K+].[Au+].N#[C-].N#[C-] XTFKWYDMKGAZKK-UHFFFAOYSA-N 0.000 description 2
- 229910052708 sodium Inorganic materials 0.000 description 2
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 description 1
- QGZKDVFQNNGYKY-UHFFFAOYSA-O Ammonium Chemical compound [NH4+] QGZKDVFQNNGYKY-UHFFFAOYSA-O 0.000 description 1
- 229910001369 Brass Inorganic materials 0.000 description 1
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 1
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 1
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical class [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 1
- 241000220317 Rosa Species 0.000 description 1
- 229910001245 Sb alloy Inorganic materials 0.000 description 1
- FEWJPZIEWOKRBE-UHFFFAOYSA-N Tartaric acid Natural products [H+].[H+].[O-]C(=O)C(O)C(O)C([O-])=O FEWJPZIEWOKRBE-UHFFFAOYSA-N 0.000 description 1
- FYULRWLBQGQQBB-UHFFFAOYSA-N [Sb][Cu][Au] Chemical compound [Sb][Cu][Au] FYULRWLBQGQQBB-UHFFFAOYSA-N 0.000 description 1
- 238000007792 addition Methods 0.000 description 1
- 238000013019 agitation Methods 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- -1 alkali metal salts Chemical class 0.000 description 1
- 150000001340 alkali metals Chemical class 0.000 description 1
- 238000005275 alloying Methods 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 239000002140 antimony alloy Substances 0.000 description 1
- 239000010953 base metal Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 229910000960 colored gold Inorganic materials 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 150000004699 copper complex Chemical class 0.000 description 1
- 229910001431 copper ion Inorganic materials 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005034 decoration Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 229940071106 ethylenediaminetetraacetate Drugs 0.000 description 1
- IZLAVFWQHMDDGK-UHFFFAOYSA-N gold(1+);cyanide Chemical compound [Au+].N#[C-] IZLAVFWQHMDDGK-UHFFFAOYSA-N 0.000 description 1
- 150000002611 lead compounds Chemical class 0.000 description 1
- 229910052744 lithium Inorganic materials 0.000 description 1
- 150000007522 mineralic acids Chemical class 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 235000016337 monopotassium tartrate Nutrition 0.000 description 1
- 150000007524 organic acids Chemical class 0.000 description 1
- 235000005985 organic acids Nutrition 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 1
- XAEFZNCEHLXOMS-UHFFFAOYSA-M potassium benzoate Chemical compound [K+].[O-]C(=O)C1=CC=CC=C1 XAEFZNCEHLXOMS-UHFFFAOYSA-M 0.000 description 1
- KYKNRZGSIGMXFH-ZVGUSBNCSA-M potassium bitartrate Chemical compound [K+].OC(=O)[C@H](O)[C@@H](O)C([O-])=O KYKNRZGSIGMXFH-ZVGUSBNCSA-M 0.000 description 1
- 229940081543 potassium bitartrate Drugs 0.000 description 1
- FHUOTRMCFQTSOA-UHFFFAOYSA-M potassium;acetic acid;acetate Chemical compound [K+].CC(O)=O.CC([O-])=O FHUOTRMCFQTSOA-UHFFFAOYSA-M 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 235000002906 tartaric acid Nutrition 0.000 description 1
- 239000011975 tartaric acid Substances 0.000 description 1
- 229940095064 tartrate Drugs 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/62—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of gold
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F20/00—Homopolymers and copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride, ester, amide, imide or nitrile thereof
- C08F20/02—Monocarboxylic acids having less than ten carbon atoms, Derivatives thereof
- C08F20/42—Nitriles
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S428/00—Stock material or miscellaneous articles
- Y10S428/922—Static electricity metal bleed-off metallic stock
- Y10S428/9335—Product by special process
- Y10S428/934—Electrical process
- Y10S428/935—Electroplating
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12771—Transition metal-base component
- Y10T428/12861—Group VIII or IB metal-base component
- Y10T428/12889—Au-base component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12771—Transition metal-base component
- Y10T428/12861—Group VIII or IB metal-base component
- Y10T428/12903—Cu-base component
Definitions
- This invention relates to an electroplating process and bath for the production of pink gold deposits consisting essentially of a copper-gold-antimony alloy.
- Acid gold piating baths for the deposition of gold operating at a pH of between 3 and 5 or 6.5 are known. It is also known that bright, hard gold deposits obtained when base metal ions capable of codepositing with the gold are added to such baths. See, for example, US. 2,905,601.
- One of the most difiicult colors to obtain by the acid gold plating process is a bright gold deposit with a pink coloration. This is difiicult because copper is the main metal ion producing pink coloration and with copper ions the bath is sensitive to changes in concentration, etc., so that uniformly-reproducible, copper-gold alloy deposits can be obtained only by careful regulation of the bath components and of the conditions of operation. Also, after a time, a slight haze develops in deposits obtained from such baths, the haze becoming more irnportant as the bath or solution ages.
- the copper complex is a copper salt of any suitable chelating or complexing agent having a negative logarithm of stability constant for copper of about 17 or less.
- suitable chelating or complexing agent include ethylenediamine tetracetic acid (EDTA), diethylenetriamino pentaacetic acid, N-hydroxyethylethylenediarnine triacetic acids or the sodium or other alkali metal salts thereof.
- EDTA ethylenediamine tetracetic acid
- diethylenetriamino pentaacetic acid diethylenetriamino pentaacetic acid
- N-hydroxyethylethylenediarnine triacetic acids or the sodium or other alkali metal salts thereof.
- the excess chelating agent is the same type of compound.
- Specular bright deposits are obtained from such baths at thicknesses of 25 microns and over so that the gold layer is thick enough to provide corrosion resistance as well as the pink decoration.
- the weak acid is one, as defined in the literature, which has a pK value of over about 3 and such weak acids include the organic acids and phosphoric acid.
- the acid employed .is polybasic the partially 3,380,898 Patented Apr. 30, 1968 neutralized acid salts or mixtures thereof may be employed in place of the acid and salt.
- KH PO or corresponding salt of sodium, lithium or ammonium may be employed in the above bath as the weak acid and salt.
- the mono-potassium salt of citric acid may be employed as the acid and salt combination.
- the antimony as the tartrate
- it can also be added as other salts which are soluble in the bath.
- the antimony is also essential for the production of pink coloration and specular effects with the acid gold baths disclosed herein.
- the alloy deposits obtained from baths as described above consists essentially of to gold, 14 to 24% copper and 0.5 to 1.5% antimony.
- the alloy has a Knoop hardness of about 230-280 kg./mm. with a 25 g. load.
- the present invention is based on the discovery that minute additions of lead to such baths decrease a tendency which such baths have to form haze when the agitation and current density are not controlled properly.
- the bath contains the ingredients sets forth above and in addition the following:
- Lead (added as soluble lead salt as lead acetate) 15-200 mg./l. preferably 15 mg./l.
- the exact mechanism of this phenomenon is not understood, but in view of the small amounts needed, the effect would appear to be difiusion-controlled. It is preferred to add the lead as the acetate, a common water soluble lead salt, but any lead compound soluble in the bath, such as lead ethylenediamine-tetra-acetate, may be used.
- the lead content was increased to 200 mg./l., the only eifect being an increase in brightness and levelling action.
- An aqueous bath for plating hard, specularly bright copper-gold alloy consisting essentially of the following:
- An aqueous bath for plating hard, specularly bright copper-gold alloy consisting essentially of the following:
- Gold (added as potassium gold cyanide) g./l about 4 Copper salt of NagEDTA (calc. as Cu) g./l about 5 Antimony tartrate '(calc. as Sb) g./l about 1.5 Lead (added as lead acetate) mg./l about 15 Na EDTA g./l about 20 KH PO g./l about Adjusted to pH of 5.3.
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Engineering & Computer Science (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US465201A US3380898A (en) | 1965-06-18 | 1965-06-18 | Electrolyte and method for electrodepositing a pink gold alloy |
| GB01782/68A GB1224507A (en) | 1965-06-18 | 1968-03-11 | Electrodepositing a pink gold alloy |
| FR74001032A FR1558768A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1965-06-18 | 1968-03-18 |
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US465201A US3380898A (en) | 1965-06-18 | 1965-06-18 | Electrolyte and method for electrodepositing a pink gold alloy |
| GB01782/68A GB1224507A (en) | 1965-06-18 | 1968-03-11 | Electrodepositing a pink gold alloy |
| CH391268A CH476116A (fr) | 1968-03-15 | 1968-03-15 | Procédé pour le dépôt électrolytique d'alliages d'or er de cuivre, brillants et durs, de couleur rose, bain aqueux pour la mise en oeuvre de ce procédé, et article obtenu par la mise en oeuvre de ce procédé |
| FR74001032A FR1558768A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1965-06-18 | 1968-03-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| US3380898A true US3380898A (en) | 1968-04-30 |
Family
ID=27428699
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US465201A Expired - Lifetime US3380898A (en) | 1965-06-18 | 1965-06-18 | Electrolyte and method for electrodepositing a pink gold alloy |
Country Status (3)
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3460953A (en) * | 1966-05-27 | 1969-08-12 | Pennsalt Chemicals Corp | Process for depositing brasslike coatings and composition therefor |
| US3770596A (en) * | 1972-07-21 | 1973-11-06 | Auric Corp | Gold plating bath for barrel plating operations |
| JPS4972140A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * | 1972-11-13 | 1974-07-12 | ||
| US3833487A (en) * | 1972-12-22 | 1974-09-03 | Bell Telephone Labor Inc | Electrolytic soft gold plating |
| US3833488A (en) * | 1971-08-20 | 1974-09-03 | Auric Corp | Gold electroplating baths and process |
| US3873428A (en) * | 1974-02-19 | 1975-03-25 | Bell Telephone Labor Inc | Preferential gold electroplating |
| US4547436A (en) * | 1982-11-19 | 1985-10-15 | E. I. Du Pont De Nemours And Company | Conductive element metallized with a thick film gold composition |
| US4670107A (en) * | 1986-03-05 | 1987-06-02 | Vanguard Research Associates, Inc. | Electrolyte solution and process for high speed gold plating |
| US4717459A (en) * | 1985-05-30 | 1988-01-05 | Shinko Electric Industries Co., Ltd. | Electrolytic gold plating solution |
| US20060283714A1 (en) * | 2005-06-02 | 2006-12-21 | Rohm And Haas Electronic Materials Llc | Gold alloy electrolytes |
| US20090104463A1 (en) * | 2006-06-02 | 2009-04-23 | Rohm And Haas Electronic Materials Llc | Gold alloy electrolytes |
| CN110699713A (zh) * | 2019-11-21 | 2020-01-17 | 长春黄金研究院有限公司 | 一种无氰金合金电铸液及其使用方法 |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8795885B2 (en) * | 2008-02-22 | 2014-08-05 | Colorado State University Research Foundation | Lithium-ion battery |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2724687A (en) * | 1952-05-08 | 1955-11-22 | Spreter Victor | Baths for the deposit of gold alloys by electroplating |
| US2905601A (en) * | 1957-08-13 | 1959-09-22 | Sel Rex Corp | Electroplating bright gold |
| US2967135A (en) * | 1960-06-08 | 1961-01-03 | Barnet D Ostrow | Electroplating baths for hard bright gold deposits |
| US3020217A (en) * | 1956-10-19 | 1962-02-06 | Sel Rex Precious Metals Inc | Mirror bright gold alloy electroplating |
-
1965
- 1965-06-18 US US465201A patent/US3380898A/en not_active Expired - Lifetime
-
1968
- 1968-03-11 GB GB01782/68A patent/GB1224507A/en not_active Expired
- 1968-03-18 FR FR74001032A patent/FR1558768A/fr not_active Expired
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2724687A (en) * | 1952-05-08 | 1955-11-22 | Spreter Victor | Baths for the deposit of gold alloys by electroplating |
| US3020217A (en) * | 1956-10-19 | 1962-02-06 | Sel Rex Precious Metals Inc | Mirror bright gold alloy electroplating |
| US2905601A (en) * | 1957-08-13 | 1959-09-22 | Sel Rex Corp | Electroplating bright gold |
| US2967135A (en) * | 1960-06-08 | 1961-01-03 | Barnet D Ostrow | Electroplating baths for hard bright gold deposits |
Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3460953A (en) * | 1966-05-27 | 1969-08-12 | Pennsalt Chemicals Corp | Process for depositing brasslike coatings and composition therefor |
| US3833488A (en) * | 1971-08-20 | 1974-09-03 | Auric Corp | Gold electroplating baths and process |
| US3770596A (en) * | 1972-07-21 | 1973-11-06 | Auric Corp | Gold plating bath for barrel plating operations |
| JPS4972140A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * | 1972-11-13 | 1974-07-12 | ||
| US3833487A (en) * | 1972-12-22 | 1974-09-03 | Bell Telephone Labor Inc | Electrolytic soft gold plating |
| US3873428A (en) * | 1974-02-19 | 1975-03-25 | Bell Telephone Labor Inc | Preferential gold electroplating |
| US4547436A (en) * | 1982-11-19 | 1985-10-15 | E. I. Du Pont De Nemours And Company | Conductive element metallized with a thick film gold composition |
| US4717459A (en) * | 1985-05-30 | 1988-01-05 | Shinko Electric Industries Co., Ltd. | Electrolytic gold plating solution |
| US4670107A (en) * | 1986-03-05 | 1987-06-02 | Vanguard Research Associates, Inc. | Electrolyte solution and process for high speed gold plating |
| US20060283714A1 (en) * | 2005-06-02 | 2006-12-21 | Rohm And Haas Electronic Materials Llc | Gold alloy electrolytes |
| US7465385B2 (en) | 2005-06-02 | 2008-12-16 | Rohm And Haas Electronic Materials Llc | Gold alloy electrolytes |
| US8142637B2 (en) | 2005-06-02 | 2012-03-27 | Rohm And Haas Electronic Materials Llc | Gold alloy electrolytes |
| US20090104463A1 (en) * | 2006-06-02 | 2009-04-23 | Rohm And Haas Electronic Materials Llc | Gold alloy electrolytes |
| CN110699713A (zh) * | 2019-11-21 | 2020-01-17 | 长春黄金研究院有限公司 | 一种无氰金合金电铸液及其使用方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| GB1224507A (en) | 1971-03-10 |
| FR1558768A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1969-02-28 |
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