US3179575A - Method of producing silver layer on non-metallic electrically non-conductive support - Google Patents

Method of producing silver layer on non-metallic electrically non-conductive support Download PDF

Info

Publication number
US3179575A
US3179575A US41730A US4173060A US3179575A US 3179575 A US3179575 A US 3179575A US 41730 A US41730 A US 41730A US 4173060 A US4173060 A US 4173060A US 3179575 A US3179575 A US 3179575A
Authority
US
United States
Prior art keywords
layer
support
compound
mercury
silver
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US41730A
Other languages
English (en)
Inventor
Dippel Cornelis Johannes
Johnker Hendrik
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
US Philips Corp
North American Philips Co Inc
Original Assignee
US Philips Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by US Philips Corp filed Critical US Philips Corp
Application granted granted Critical
Publication of US3179575A publication Critical patent/US3179575A/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03C—PHOTOSENSITIVE MATERIALS FOR PHOTOGRAPHIC PURPOSES; PHOTOGRAPHIC PROCESSES, e.g. CINE, X-RAY, COLOUR, STEREO-PHOTOGRAPHIC PROCESSES; AUXILIARY PROCESSES IN PHOTOGRAPHY
    • G03C5/00—Photographic processes or agents therefor; Regeneration of such processing agents
    • G03C5/58—Processes for obtaining metallic images by vapour deposition or physical development
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/922—Static electricity metal bleed-off metallic stock
    • Y10S428/9265—Special properties
    • Y10S428/927—Decorative informative
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/922—Static electricity metal bleed-off metallic stock
    • Y10S428/9265—Special properties
    • Y10S428/929—Electrical contact feature
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/922—Static electricity metal bleed-off metallic stock
    • Y10S428/9335—Product by special process
    • Y10S428/934—Electrical process
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12785—Group IIB metal-base component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12861—Group VIII or IB metal-base component
    • Y10T428/12896—Ag-base component

Definitions

  • the invention relates to a method of manufacturing external, electrically conductive noble-metal layers on non-metallic, electrically non-conductive, at least superficially hydrophilized supports and to products manufactured by this method.
  • noble-metal layers is to be understood to mean herein not only layers having an uninterrupted surface of noble metal but also those having patterns, the portions of which may be discontinuous, for example, station-name dials for radio apparatus, ornamental objects, wiring patterns, circuit patterns, and so on.
  • an external, electrically conductive noble-metal layer is produced on a non-metallic, electrically non-conductive, slightly hydrophilic or at least superficially hydrophilized support by activating said support by causing to take place on the support a reaction between a mercurous compound and agent capable of reacting with this mercurous compound, in the presence of water, to form metallic mercury, either by reduction or by disproportionating one of the reaction components being located in the support or at least in the surface thereof, and produce thereby an at least partly external, hardly visible layer of mercury germs on the support.
  • the hardly visible mercury germ layer is then treated with a non-stabilized noble metal intensifying bath comprising a non-stabilized aqueous solution of a metal compound more noble than copper and a reducing agent for the noble metal compound.
  • a non-stabilized noble metal intensifying bath comprising a non-stabilized aqueous solution of a metal compound more noble than copper and a reducing agent for the noble metal compound.
  • the conventional baths for chemical silver deposition there may be used the conventional baths for chemical silver deposition, but preferably use will be made of the purely physical developers usually intended for photographic purposes, since, in view of their great selectivity, they may be more easily controlled. Purely physical developers are distinguished from the so-called chemical silver deposition baths by the use of photographic reducing agents, i.e., compounds of which the reducing eifect in the physical developer under the prevailing conditions, owing to the presence of the photographic metal germ image, is accelerated so that a sufliciently selective noble-metal deposition on this metal germ image is obtained.
  • photographic reducing agents i.e., compounds of which the reducing eifect in the physical developer under the prevailing conditions, owing to the presence of the photographic metal germ image, is accelerated so that a sufliciently selective noble-metal deposition on this metal germ image is obtained.
  • a frequently used physical developer is, for example, a solution of silver nitrate in water, to which is added metol, hydroquinone or p-phenylene-diamine.
  • a developer contains, furthermore, usually substances to improve the preservability thereof or to control the speed of development, for instance, organic acids, buffer mixtures or substances reacting with the noble-metal compound, while forming a complex.
  • non-stabilized noble-metal intensifying bath in the instant case is meant a noble-metal depositing bath, as defined supra, free of ionic surfactants added to prevent the noble-metal compound from being spontaneously reduced to metal in the aqueous solution.
  • the present invention is concerned with the manufacture of external, electrically conductive noble-metal layers by the intensification of external mercury germs, which lies on the support and which are obtained during the activation of the support by a reaction between a mercurous compound and an agent capable of reacting with this mercurous compound in the presence of water, to separate mercury metal, it will be obvious that care must be taken, by choosing the ratio between the concentrations of the mercurous compound solutions and the solutions of the mercurous reacting compound, that the reaction takes place indeed mainly at the surface of the support. A partial deposition in or below the surface is conducive to the adhesion of the noble-metal layer to the support.
  • a range of concentrations of the second bath at a given concentration of the first bath to obtain an at least partly external layer of mercury germs on the support, on which is to be deposited subsequently an external noble-metal layer with a resistance of not more than 10 ohms per square by treatment with the nonstabilized noble-metal intensifying bath.
  • the limits of the said range may differ slightly with the individual compounds and supports. Therefore, the active range of concentrations of the second bath, with a given concentration of the first bath, must be fixed by a simple sequence of experiments, while the concentrations of the second bath are varied by a given factor (for example 2 to 3). It has been found that, at least when the support is dried intermediately between the two treatments,
  • the concentration of the first bath must, as a rule, exceed that of the second bath.
  • materially higher concentrations of the first bath are to be employed than in the case of drying.
  • the method according to the invention can yield high-gloss, excellently reproduceable, external, electrically conductive noblemetal layers by adding to the second bath, together with the mercurous compound, one or more organic hydroxy acids, selected from the group of citric acid, tartaric acid, glycolic acid, glycerol acid and malic acid.
  • one or more organic hydroxy acids selected from the group of citric acid, tartaric acid, glycolic acid, glycerol acid and malic acid.
  • such a quantity of the acid concerned is to be added, that an initially formed precipitate with the said mercurous compound is re-dissolved.
  • the method according to the invention may be employed for the manufacture of uninterrupted surfaces of noble-metal or non-metallic supports as Well as for the manufacture of noble-metal patterns thereon, such as used for decoration, electrical and electro-technical purposes.
  • the whole support surface is to be sub- 'jected to the activation.
  • the pattern may be applied previously by activating the surface in accordance with the pattern either directly by means of a printing technique or indirectly with the aid of a known mechanical or photographic masking technique, or the pattern may be obtained on the uninterrupted noble-metal layer finally obtained in accordance with the invention by etching away the redundant noble metal subsequent to covering by the noble-metal layer. All kinds of known methods of photo-engraving and graphics may be used in this case to apply a mask resisting the chemical treatment to be employed.
  • the external noble-metal layers obtained by the method according to the invention often have electric resistances which are many times higher than is calculated from the resistivity of the metal concerned in a compact state.
  • a thermal and/ or chemical after-treatment and/or a mechanical polishing treatment the excessively high resistance of the layer can be considerably reduced, which is desirable for various electrical uses.
  • non-metallic substances may, in addition, be included in the layer as impurities which affect particularly the electric resistance and the hardness of the layer.
  • the high resistance of such a layer can be reduced by a thermal treatment in excess of a given temperature so that it approaches that value which can be calculated from the resistivity of the compact, pure metal.
  • heating of the external noble-metal layer obtained by intensification of an external layer of mercury germs to a temperature of at least 80 C. may result in a reduction of an excessively high resistance value of the layer.
  • This heating may be performed, for instance, in a furnace with the aid of an infrared radiator, by electric current passing through the layer or by means of rinsing in a hot, chemically indifferent liquid (water or glycerol, fo example).
  • the desired effect is attained more rapidly as the temperature of the after-treatment is higher, but it must, of course, be considered that the material of the support constitutes a limit to the temperature that may be employed.
  • any important reduction in electric resistance of the external silver layer obtained subsequent to intensification may be obtained by contacting this layer with an aqueous solution of one or more compounds separating off a hydrogen ion or an anion potential being determining with respect to the silver metal, for example, the chloride, bromide, iodide, thiocyanate, cyanide, sulphide, sulphite, thiosulphate or hydroxyl ion.
  • compounds separating oif hydrogen or hydroxyl ions use may be made, not only of a diluted, non-oxidizing acid or a diluted base, but also of a solution of an acid or an alkali-reacting salt.
  • the resistance reducing effect is obtained more rapidly as the active compound is provided in a higher concentration, while with respect to the extent of the activity of the various anions the following sequence may be established:
  • the said reduction in resistance may be obtained by mechanical polishing.
  • the external, electrically conductive noblemetal layer obtained by the method according to the invention should be electro-chemically after-treated, which may be followed by a superficial chemical conversion or coloration.
  • electrolytic polishing electrolytic deposition of metals, while using or not using an external current source, electrolytic coloration of the deposited metal or electrophoretic coating with a protective or insulating or photo-conductive and/or semi-conductive surface layer.
  • the portions of the uninterrupted noble-metal layer not associated with the final pattern will be provided, preferably prior to the required treatment, with a resistant mask with the aid of a mechanical or photographic technique.
  • the uncovered portions of the layer are then intensified or coated, while the uninterrupted layer provides a conductive contact between the parts of the final pattern.
  • the pattern may be produced by etching away the redundant noble metal.
  • the mask may, of course, also be applied subsequent to the electro-chemical after-treatment, the pattern being then obtained by etching away the metal of the uncovered portions of the layer. However, this is economically less advantageous.
  • a few, important, suitable after-treatments of this kind are, inter alia: mechanical polishing of the surface of the layer, application of a lacquer or varnish layer to the layer surface, embedding of the layer together with the support in an insulating envelope of thermo-hardening or thermoplastic material, transfer of the layer, if desired together with the support, to a diflerent support of high electric qualities, also of thermo-hardening or thermo-plastic material, application of electric connections by soldering (for example, dip soldering).
  • non-metallic, electrically nonconductive support materials which are, as such, not quite accessible for the various baths for after-treatment may, fre quently with the aid of known methods, be rendered hy drophilic to some extent, at least superficially, which suffices, either by given chemical surface treatments or by applying a thin, slightly hydrophilic coating.
  • polystyrene, polyacrylate, bakelite and various other high-polymer products may be rendered accessible for a surface treatment with chlorosulphonic acid (T. Westermark, Acts. Chem. Scand. 6, 1194-1199 (1952)).
  • Cellulose esters, polyvinyl acetate and -chloride and so on may be rendered suitable by superficial saponification; glass may be provided by a chemical surface treatment or by coating with a thin layer of silica gel (F. L. Burmistrow, Phot. Journ. 76, 452-459, 1936). Gelatin, regenerated cellulose, paper, wood, polyvinyl alcohol and so on may be used without the need for further means.
  • the mercurous compound or the agent capable of reacting with the mercurous compound in the presence of water while separating out mercury can be absorbed directly therein.
  • the strips are dipped, for a few seconds, in an aqueous solution containing, per litre, 0.005 mol of mercurous nitrate and 0.005 mol of nitric acid. Then they were washed, for sec., in distilled water and, for 10 min., treated in an intensifying bath containing 0.5 g. of metol, 2 g. of citric acid and 0.2 g. of silver nitrate in 100 g. of distilled water. Finally, the strips were again washed in water and dried in air.
  • Table I a sign -I indicates that external, electrically conductive silver layers were obtained on the strips with an electric resistance of not more than 10 ohm per square. The sign indicates that no external, electrically conductive silver layers according to the invention were obtained, so that the concentrations concerned cannot be used for the activation of the strips.
  • Solution 1 1 g. of silver nitrate, 2.5 g. of ammonium nitrate, 100 g. of distilled water,
  • Solution 2 1.6 g. of sodium hydroxide and 100 g. of
  • Solution 3 1.25 g. of hydrazine sulphate and 100 g. of
  • Table III relates to strips of a superficially saponified cellulose tri-acetate foil treated in the manner described in Example I with the exception that, after impregnation in the solution of the agents capable of-reacting with a mercurous compound in the presence of water, while separating out metallic mercury, the strips were wiped off but dipped Without intermediate drying in the solution of mercurous nitrate.
  • the signs of Table III have the same meanings as those of the preceding Example.
  • a comparison of results of Table III with those of Table I shows that the omission of the drying process results in that, as a rule, materially higher concentrations ofpthe first activating solution are required than in the case of drying.
  • Strips of the support material of Example I were dipped, for two minutes, in aqueous solutions containing, per litre, 0.0040.008-0.0l6 and 0.032 mol of sodium carbonate and sodium thiosulphate respectively. After wiping off and drying the rear side of the support was covered with a lacquer layer. Subsequently, the strips were dipped, for a few seconds, in the mercurous nitrate solution of Example IV. After washing in distilled water, for a short time, the strips were intensified, for 10 minutes, .in a physical developer obtained by dissolving in distilled water: metol (0.025 mol/litre), citric acid (0.1 mol/litre) and silver nitrate (0.01 mol/litre).
  • the silver layer on the strip treated with solution (B) had a resistance of 180 ohms per square which dropped to 0.25 ohm per square by a chemical after-treatment for 2 minutes with a solution of potassium chloride (0.1 mol per litre).
  • solutions of sodium bromide, sodium iodide, sodium thiosulphate, sodium sulphite, sulphuric acid, potassium hydroxide, potassium thiocyanate or sodium sulphide instead of the KCl solution material reductions in the original resistance values may be obtained.
  • the silver layer on the strip treated with solution (C) had a resistance of 180 ohms per square. This value was reduced to 13 ohms per square by rubbing with a plug of cottonwool. A further piece of the layer was subjected to a thermal after-treatment at 150 C. for one hour. Then the resistance amounted to 0.7 ohm per square.
  • EXAMPLE VII An external silver layer on cellulose tri-acetate, obtained in the manner described in Example VI by activation with thiourea and mercurous nitrate, was electrolytically intensified with a few microns of copper by using an aqueous copper-deposition bath of the following composition:
  • Copper sulphate (SH O) 200 g. per litre
  • Concentrated sulphuric acid 50 g. per litre
  • Phenolsulphonic acid sodium 0.5 g. per litre
  • the current density was 5 a./dm. and the time of copper deposition was 2 min.
  • This copper layer was then covered electrophoretically with a layer of aluminum oxide by using a suspension of of alundum in methanol with a field intensity of 37.5 v./ cm. for 6 sec. and a current of 70 ma.
  • EXAMPLE VIII layer was washed in water and dried in air.
  • the electric resistance of the silver layer amounted to 500 ohms per square, which value dropped to 7 ohms per square, after a treatment at C. for one hour.
  • Example IX On the support material of Example VIII, there was stamped the desired pattern with the aid of a rubber stamp.
  • the rubber stamp was wetted by means of an inking pad with a 0.05 mol solution of sodium carbonate in water.
  • the sodium carbonate solution had been rendered slightly viscous with the aid of a thickening agent.
  • the activation and the intensification of the mercury germ layer took place in the manner described in Example VIII. By this means there was obtained on the paper an external, electrically conductive silver pattern.
  • EXAMPLE X An external silver layer formed on the support material of Example I in the manner described in Example VIII was covered with a uniform layer of Kodak Photoresist by pouring it out or spraying it. After drying in air, the light-sensitive layer was exposed, for 5 min. behind a pattern (line grid) with the aid of a high-pressure mercury-vapour lamp of 500 w. at a distance of about 50 c.m.s. After the exposure, the layer was developed with Kodak Photoresist Developer or with trichloroethylene. Then, the mask thus obtained was hardened by treating it at 150 C. for about 10 min. The uncovered portions of the silver layer were then plated with copper for 15 minutes with a current density of 4 a./dm.
  • the metal layer may finally be provided with a protective lacquer layer or with a protective layer of thermo-hardening or thermo-plastic material. In this manner, screening grids may be manufactured.
  • a method of producing a permanently adhering external, electrically conductive silver layer on a non-metallic, electrically non-conductive support, at least the surface of said support being hydrophilic comprising the steps of applying to said support a mercurous compound, water and a compound capable of converting said mercurous compound in the presence of water to free metallic mercury thereby forming a barely visible, at least partially external germ layer of mercury metal on said support, said compound capable of converting said mercurous compound being selected from the group consisting of compounds that reduce mercurous compounds to free mercury metal and compounds that form free mercury metal from mercurous compounds by a disproportionating reaction, said mercury germ layer extending at least partially into the hydrophilic portion of said support, and then treating said mercury germ layer on said support with a silver metal intensifying bath, said bath comprising an aqueous solution of a water soluble silver compound and a water soluble reducing agent for said silver compound to thereby cause a visible, permanently adhering, electrically conducting silver layer to be deposited on
  • the compound capable of converting the mercurous compound is a compound which converts the mercurous compound into a mercuric compound and free mercury metal by a disproportionating reaction.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
  • Laminated Bodies (AREA)
US41730A 1959-07-11 1960-07-11 Method of producing silver layer on non-metallic electrically non-conductive support Expired - Lifetime US3179575A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL241195 1959-07-11

Publications (1)

Publication Number Publication Date
US3179575A true US3179575A (en) 1965-04-20

Family

ID=19751825

Family Applications (1)

Application Number Title Priority Date Filing Date
US41730A Expired - Lifetime US3179575A (en) 1959-07-11 1960-07-11 Method of producing silver layer on non-metallic electrically non-conductive support

Country Status (5)

Country Link
US (1) US3179575A (OSRAM)
ES (1) ES259538A1 (OSRAM)
FR (1) FR1262879A (OSRAM)
GB (1) GB953432A (OSRAM)
NL (1) NL241195A (OSRAM)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3271119A (en) * 1964-03-13 1966-09-06 Paul T Woodberry Foamed plastic structure having a uniform continuous metal coating integrally bonded to the surface thereof
US3296013A (en) * 1963-10-30 1967-01-03 Exxon Research Engineering Co Process for metal coating cellulose triacetate
US3523875A (en) * 1967-03-15 1970-08-11 Hooker Chemical Corp Process for metal coating substrate pretreated with alkali metal sulfide and resultant product
US3529961A (en) * 1966-12-27 1970-09-22 Gen Electric Formation of thin films of gold,nickel or copper by photolytic deposition
US3533918A (en) * 1967-04-18 1970-10-13 John C Smith Method of making electrodes for fuel cells
US3650825A (en) * 1969-06-19 1972-03-21 Schaltbau Gmbh Method for manufacture of an electrical contact
US4247596A (en) * 1979-05-10 1981-01-27 Yee Tin B Electrical fiber conductor

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US168442A (en) * 1875-10-05 Improvement in electroplated figures
US641709A (en) * 1899-03-10 1900-01-23 William H Legate Process of plating aluminium.
GB509965A (en) * 1937-09-22 1939-07-25 British Thomson Houston Co Ltd Improvements in and relating to methods of coating metals
US2195231A (en) * 1937-09-22 1940-03-26 Gen Electric Art of coating metals
US2906682A (en) * 1954-09-09 1959-09-29 Vitro Corp Of America Information storage systems and methods for producing same
US2940018A (en) * 1955-04-11 1960-06-07 Gen Am Transport Printed electric circuits

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US168442A (en) * 1875-10-05 Improvement in electroplated figures
US641709A (en) * 1899-03-10 1900-01-23 William H Legate Process of plating aluminium.
GB509965A (en) * 1937-09-22 1939-07-25 British Thomson Houston Co Ltd Improvements in and relating to methods of coating metals
US2195231A (en) * 1937-09-22 1940-03-26 Gen Electric Art of coating metals
US2906682A (en) * 1954-09-09 1959-09-29 Vitro Corp Of America Information storage systems and methods for producing same
US2940018A (en) * 1955-04-11 1960-06-07 Gen Am Transport Printed electric circuits

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3296013A (en) * 1963-10-30 1967-01-03 Exxon Research Engineering Co Process for metal coating cellulose triacetate
US3271119A (en) * 1964-03-13 1966-09-06 Paul T Woodberry Foamed plastic structure having a uniform continuous metal coating integrally bonded to the surface thereof
US3529961A (en) * 1966-12-27 1970-09-22 Gen Electric Formation of thin films of gold,nickel or copper by photolytic deposition
US3523875A (en) * 1967-03-15 1970-08-11 Hooker Chemical Corp Process for metal coating substrate pretreated with alkali metal sulfide and resultant product
US3658661A (en) * 1967-03-15 1972-04-25 Hooker Chemical Corp Metal plating of substrates
US3533918A (en) * 1967-04-18 1970-10-13 John C Smith Method of making electrodes for fuel cells
US3650825A (en) * 1969-06-19 1972-03-21 Schaltbau Gmbh Method for manufacture of an electrical contact
US4247596A (en) * 1979-05-10 1981-01-27 Yee Tin B Electrical fiber conductor

Also Published As

Publication number Publication date
ES259538A1 (es) 1960-10-16
GB953432A (en) 1964-03-25
FR1262879A (fr) 1961-06-05
NL241195A (OSRAM)

Similar Documents

Publication Publication Date Title
US3772078A (en) Process for the formation of real images and products produced thereby
US3223525A (en) Method of manufacturing, by photographic means, external, electrically conductive noble-metal patterns on non-metallic, electrically non-conductive, macromolecular supports and products obtained by these methods
US3925578A (en) Sensitized substrates for chemical metallization
US2699424A (en) Electroplating process for producing printed circuits
US3562038A (en) Metallizing a substrate in a selective pattern utilizing a noble metal colloid catalytic to the metal to be deposited
US3994727A (en) Formation of metal images using reducible non-noble metal salts and light sensitive reducing agents
US3873359A (en) Method of depositing a metal on a surface of a substrate
US3900614A (en) Method of depositing a metal on a surface of a substrate
NO136617B (OSRAM)
US3959547A (en) Process for the formation of real images and products produced thereby
HU208715B (en) Method for forming printed circuits with selectively etchable metal layers, as well as method for final forming pattern of high definition
GB1560417A (en) Printed circuit coard production
US2079516A (en) Aluminum electrode and method of preparing
US3179575A (en) Method of producing silver layer on non-metallic electrically non-conductive support
US3619285A (en) Method of making a patterned metal film article
US3240684A (en) Method of etching rhodium plated metal layers and of making rhodium plated printed circuit boards
DE2725096C2 (de) Verfahren zur Vorbehandlung der Oberfläche eines dielektrischen Materials für das stromlose Aufbringen von Metallschichten
US3886415A (en) Capacitor with photo-conductive dielectric
US4618568A (en) Chemical metallization process with radiation sensitive chromium (III) complex
US3929483A (en) Metal-plated images formed by bleaching silver images with alkali metal hypochlorite prior to metal plating
US4242438A (en) Photomask material
US3192137A (en) Method of manufacturing external, electrically conductive noble-metal layers on non-metallic, electrically non-conductive supports
US3960564A (en) Physical development process utilizing a physical developer containing a specific reducing agent, a thiol compound
IE50821B1 (en) Process for the selective chemical deposition and/or electrodeposition of metal coatings,especially for the production of printed circuits
US3476658A (en) Method of making microcircuit pattern masks