US3133006A - Acid nickel plating bath - Google Patents

Acid nickel plating bath Download PDF

Info

Publication number
US3133006A
US3133006A US197860A US19786062A US3133006A US 3133006 A US3133006 A US 3133006A US 197860 A US197860 A US 197860A US 19786062 A US19786062 A US 19786062A US 3133006 A US3133006 A US 3133006A
Authority
US
United States
Prior art keywords
alkene
alkyne
bath
acid nickel
baths
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US197860A
Inventor
Barnet D Ostrow
Fred I Nobel
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to US197860A priority Critical patent/US3133006A/en
Application granted granted Critical
Publication of US3133006A publication Critical patent/US3133006A/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/12Electroplating: Baths therefor from solutions of nickel or cobalt
    • C25D3/14Electroplating: Baths therefor from solutions of nickel or cobalt from baths containing acetylenic or heterocyclic compounds
    • C25D3/16Acetylenic compounds

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)

Description

United States Patent Ofiice 3,133,005 Patented May 12, 1964 3,133,005 AQH) NICKEL PLATEJ G BATH Barnet D. Ostrow, 125 Redwood Drive, and Fred I. Nobel, 75 Fern Drive, both of Roslyn, N.Y. No Drawing. Filed May 28, 1962, Ser. No. 197,860 6 Claims. (Cl. M L-49) various types of substances in conjunction with aromatic and aliphatic sulfonates, sulfonamids and sulfonimids. These prior suggested substances included alkynes, alkenes, amines, alkyne amines, and alkene amines. Such substances had in the molecule an allylic or vinyl group only, an acetylenic group only, or an active amino group only. It has also been proposed to incorporate compounds having in the same molecule an amino and an allyl or vinyl group.
While some addition agents accomplished this purpose in some degree, they did not contribute to superior leveling coupled with the ease of control. Also, because of the high concentration of these compounds that were necessary to produce the desired brightness and leveling the ductility was impaired. In some cases as with the alkynols the deposit has a marked tendency to skip plate, i.e. to prevent deposition of nickel at the-low current densities.
The present invention has among its objects to introduce additives, for the above purpose, into aqueous acid nickel plating baths, which will result in excellent leveling of the deposit.
It is also among the objects of the invention to provide a bath for the purpose described which will reduce the low current density skip plate in the deposited film of nickel.
In practicing the invention, there is provided the usual aqueous acid nickel plating bath and there is incorporated therein an additive which consists of at least one compound which contains in the same molecule. an amino, an alkyne, and an alkene group. Substances having these three groups impart superior leveling characteristics to the bath, with a substantial improvement in low current density characteristics of the nickel deposit. Relatively small amounts of these substances are very effective, and they do not impair the ductility of the deposit.
These substances have the following structural forwherein R is an alkene group; R is an alkyne group; R and R are alkene, alkyne, H, CH C H C H phenyl and naphthyl and X is an acid group, such as halogen, SO H, or P0 Compounds (C) and (D) may be quaternized.
While alkene and alkyne carbon chains up to 8 carbon atoms may be present in the molecule, at present the lower carbon chains are considered to be more desirable. Together with the substances of the invention, the structural formulas of which are given above, other acetylenic compounds may be incorporated into the bath, thus employing a mixture of unsaturated compounds.
The structural formulas given below are illustrative of the substances included in the invention.
HCEC-CH2NCH2OHECH2 Allyl propargyl amine (2) CH2CH=CH HCEC-CH2N OHgCH=CH2 Diallyl propargyl amine CH2CH=CH2 nozo-om fi-onzon=orn CHzCH=CHn Triallyl 'propargyl amine The essence of the invention lies in the structures of the additives in which there are combined in a single molecule, the amino, alkyne and alkene radicals. The deposits resulting from baths containing these additives have high lustre and are smooth with excellent leveling. In addition, the deposits do not exhibit low current density greyness which often occurs when additives such as amines or polyamines are used in the bath.
Compounds of the present invention may be used singly or in mixtures or in the absence of other types of additives. They may be used in standard Watts baths, all chloride baths, or high chloride baths. Improved results are obtained where there is incorporated therewith in the bath a sulfonic acid, sulfonarnid or sulfonimid.
Typical standard nickel baths which are employed in the invention are as follows in grams per liter.
Watts bath:
NiSO .7H O -400 NiCl .7H O 5-80 Wetting agents 0-1 Boric acid 5-60 All chloride bath:
NiCl .7H O 50-200 Boric acid 0-50 Wetting agent Among typical wetting agents are sodium lauryl sul fates, sodiumZ-ethyl hexyl sulfate, and sodium octyl sulfonic acid. The range of pH is from 2.5 to 4.5 in usual practice.
The following are specific examples of baths according to the invention which are employed to obtain bright, level and ductile deposits; the amounts being in grams per liter of aqueous solution:
Nickel Sulfate Nickel Chloride Boric Acid. Saccharin Bromo BBHTQHB Sulfonate 1,5-Benzene Dislllfonate Vinyl Ben-".ene Sulfonate Sodium Allyl Sulfonate Sodium Ben ialdehyde Sulfona Dibenzene sulfonamid Allyl sulfonamid B-Diallyl amino propyne-l Triallyl propargyl amine chloride- 1-Al1yl3-amino dipropyne l-Allyl amino 2-buty-ne.
Allyl propargyl amine pH 3. 6 4. 0 Temp, F 140 135 Examples of amino vinyl acetylenic compounds are as follows:
The following sulfonic acids may be incorporated in the bath with the principal additive; they may be in the form of salts, such as of nickel, sodium, magnesium, etc.
Benzene sulfonic acid Di-benzene sulfonic acid Vinyl benzene sulfonic acid Allyl benzene sulfonic acid Bromo benzene sulfonic acid 1,5-naphthalene disulfonic acid 1,3,6 naphthalene trisulfonic acid Among the sulfonamids and sulfonimids which are suitable are the following:
Saccharin Na salt Benzene sulfonamid Dibenzene sulfonamid Allyl sulfonamid The baths of the invention may be operated over a wide range of concentration, pH, and current densities. A pH range of 3.0 to 4.8 is typical. The concentration of the additive may vary from about .001 to .50 gram per liter when used with cooperating sulfo oxygen type materials. The concentration of the sulfo oxygen will generally determine the concentration of the alkene-alkyne amine. When used alone, the concentration of the alkenealkyne amine generally ranges from about .001 to 1.0 gram per liter.
These baths may be operated with or without mechanical or air agitation. When air is used, a compatible lowfoaming or non-foaming type of wetting agent is employed in the bath; The invention may be used in all sulfate baths, that is baths substantially free from chlorides; and it is suitable for sulfamate baths also.
We claim: a
1. An aqueous acid nickel electroplating bath having incorporated therein an amine having as substituent groups an alkene and an alkyne radical attached to nitrogen and having the following structural formula:
I'M B1-N-R3 wherein R is an alkene group and R is a radical taken from the class consisting of alkene, alkyne, H, and lower alkyl, and R is alkyne.
2. An aqueous acid nickel electroplating bath having incorporated therein an amine having as substituent groups an alkene and an alkyne radical attached to nitrogen and having the following structural formula:
wherein R is alkene, R is alkyne, and R and R are taken from the class consisting of alkene, alkyne, H, and lower alkyl, and X is an acid group.
3. An aqueous acid nickel electroplating bath having incorporated therein an amine having as substituent groups an alkene and an alkyne radical attached to nitrogen and having the following structural formula:
wherein R is alkene, R is alkyne, and R and R are taken from the class consisting of alkene, alkyne, H, and lower alltyl.
4. An aqueous acid nickel electroplating bath having incorporated therein an amine having as substituent groups an alkene and an allcyne radical attached to nitrogen, and having the following structural formula:
terized in that said compounds are quaternized.
References Cited in the file of this patent UNITED STATES PATENTS UNITED STATES PATENT OFFICE CERTIFICATE OF CORRECTION Patent No, 3, 133,006 May 12 1964 Barnet D. Ostr'ow et a1"- that error appears in the above numbered pat- It is hereby certified that. the said Letters Patent should read as ent requiring correction and corrected below.
Column 2, lines 9 and 10, formula (1) should appear as shown below instead of as in the patent:
Signed and sealed this 29th day of December 1964,
(SEAL) Attest:
EDWARD J. BRENNER ERNEST W. SWIDER' Attesting Officer Commissioner of Patents

Claims (1)

1. AN AQUEOUS ACID NICKEL ELECTROPLATING BATH HAVING INCORPORATED THEREIN AN AMINE HAVING AS SUBSTITUENT GROUPS AN ALKENE AND AN ALKYNE RADICAL ATTACHED TO NITROGEN AND HAVING THE FOLLOWING STRUCTURAL FORMULA: R1-N(-R4)-R3 WHEREIN R1 IS AN ALKENE GROUP AND R4 IS A RADICAL TAKEN FROM THE CLASS CONSISTING OF ALKENE, ALKYNE, H, AND LOWER ALKYL, AND R3 IS ALKYNE.
US197860A 1962-05-28 1962-05-28 Acid nickel plating bath Expired - Lifetime US3133006A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US197860A US3133006A (en) 1962-05-28 1962-05-28 Acid nickel plating bath

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US197860A US3133006A (en) 1962-05-28 1962-05-28 Acid nickel plating bath

Publications (1)

Publication Number Publication Date
US3133006A true US3133006A (en) 1964-05-12

Family

ID=22731032

Family Applications (1)

Application Number Title Priority Date Filing Date
US197860A Expired - Lifetime US3133006A (en) 1962-05-28 1962-05-28 Acid nickel plating bath

Country Status (1)

Country Link
US (1) US3133006A (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3261772A (en) * 1963-12-17 1966-07-19 Sture Granberger Fa Nickel electroplating bath and process
US3428536A (en) * 1966-05-09 1969-02-18 Kewanee Oil Co Process of and electrolytes for bright nickel electroplating
US3471271A (en) * 1965-08-16 1969-10-07 Udylite Corp Electrodeposition of a micro-cracked corrosion resistant nickel-chromium plate
US3718549A (en) * 1971-06-14 1973-02-27 Kewanee Oil Co Alkaline nickel plating solutions
US4016051A (en) * 1975-05-02 1977-04-05 Starlite Chemicals, Inc. Additives for bright plating nickel, cobalt and nickel-cobalt alloys
US4416740A (en) * 1981-03-06 1983-11-22 Langbein-Pfanhauser Werke Ag Method and bath for the electrodeposition of palladium/nickel alloys
US20040154928A1 (en) * 2003-02-07 2004-08-12 Pavco, Inc. Use of N-allyl substituted amines and their salts as brightening agents in nickel plating baths

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2800442A (en) * 1955-10-04 1957-07-23 Udylite Res Corp Electrodeposition of nickel
GB858718A (en) * 1957-04-12 1961-01-11 Schering Ag Improvements in and relating to the electro-deposition of nickel coatings
US2978391A (en) * 1958-08-25 1961-04-04 Harshaw Chem Corp Nickel plating process and solution
US3006822A (en) * 1957-05-08 1961-10-31 Langbein Pfanhauser Werke Ag Electro-deposition of nickel coatings

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2800442A (en) * 1955-10-04 1957-07-23 Udylite Res Corp Electrodeposition of nickel
GB858718A (en) * 1957-04-12 1961-01-11 Schering Ag Improvements in and relating to the electro-deposition of nickel coatings
US3006822A (en) * 1957-05-08 1961-10-31 Langbein Pfanhauser Werke Ag Electro-deposition of nickel coatings
US2978391A (en) * 1958-08-25 1961-04-04 Harshaw Chem Corp Nickel plating process and solution

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3261772A (en) * 1963-12-17 1966-07-19 Sture Granberger Fa Nickel electroplating bath and process
US3471271A (en) * 1965-08-16 1969-10-07 Udylite Corp Electrodeposition of a micro-cracked corrosion resistant nickel-chromium plate
US3428536A (en) * 1966-05-09 1969-02-18 Kewanee Oil Co Process of and electrolytes for bright nickel electroplating
US3718549A (en) * 1971-06-14 1973-02-27 Kewanee Oil Co Alkaline nickel plating solutions
US4016051A (en) * 1975-05-02 1977-04-05 Starlite Chemicals, Inc. Additives for bright plating nickel, cobalt and nickel-cobalt alloys
US4416740A (en) * 1981-03-06 1983-11-22 Langbein-Pfanhauser Werke Ag Method and bath for the electrodeposition of palladium/nickel alloys
US20040154928A1 (en) * 2003-02-07 2004-08-12 Pavco, Inc. Use of N-allyl substituted amines and their salts as brightening agents in nickel plating baths
US7300563B2 (en) * 2003-02-07 2007-11-27 Pavco, Inc. Use of N-alllyl substituted amines and their salts as brightening agents in nickel plating baths

Similar Documents

Publication Publication Date Title
US2910413A (en) Brighteners for electroplating baths
US4053373A (en) Electroplating of nickel, cobalt, nickel-cobalt, nickel-iron, cobalt-iron and nickel-iron-cobalt deposits
US3133006A (en) Acid nickel plating bath
US2842488A (en) Process for the production of metal electrodeposits
US2644789A (en) Electrodeposition of nickel
US3812566A (en) Composite nickel iron electroplate and method of making said electroplate
US3471271A (en) Electrodeposition of a micro-cracked corrosion resistant nickel-chromium plate
US3878067A (en) Electrolyte and method for electrodepositing of bright nickel-iron alloy deposits
US2882208A (en) Electrodeposition of nickel
US3862019A (en) Composition of electroplating bath for the electrodeposition of bright nickel
US2255057A (en) Electroplating copper
US2978391A (en) Nickel plating process and solution
US1564414A (en) Cadmium plating
US3220940A (en) Electrodeposition of nickel
US2466677A (en) Electrodeposition of nickel from an acid bath
US2427280A (en) Nickel electroplating composition
US2644788A (en) Electrodeposition of nickel
US2994648A (en) Nickel plating additives
US2836549A (en) Nickel plating bath containing acetylenic polyamines
US3219559A (en) Additive for level nickel plating
US2648628A (en) Electroplating of nickel
US2757133A (en) Electrodeposition of nickel
US2972571A (en) Nickel plating solutions
US3000799A (en) Nickel plating solutions
US2784152A (en) Electrodeposition of nickel