US3042550A - Solid delay line improvements - Google Patents
Solid delay line improvements Download PDFInfo
- Publication number
- US3042550A US3042550A US737389A US73738958A US3042550A US 3042550 A US3042550 A US 3042550A US 737389 A US737389 A US 737389A US 73738958 A US73738958 A US 73738958A US 3042550 A US3042550 A US 3042550A
- Authority
- US
- United States
- Prior art keywords
- delay line
- layer
- transducer
- back electrode
- coating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000007787 solid Substances 0.000 title claims description 6
- 238000000576 coating method Methods 0.000 claims description 19
- 239000011651 chromium Substances 0.000 claims description 17
- 239000011248 coating agent Substances 0.000 claims description 16
- 229910052804 chromium Inorganic materials 0.000 claims description 12
- 238000000034 method Methods 0.000 claims description 9
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 8
- 238000000151 deposition Methods 0.000 claims description 3
- 238000001771 vacuum deposition Methods 0.000 claims description 2
- 239000000919 ceramic Substances 0.000 description 16
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 10
- 229910000679 solder Inorganic materials 0.000 description 8
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 7
- 239000010931 gold Substances 0.000 description 7
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 6
- 229910052737 gold Inorganic materials 0.000 description 6
- 229910052738 indium Inorganic materials 0.000 description 5
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 230000013011 mating Effects 0.000 description 5
- 229910000510 noble metal Inorganic materials 0.000 description 5
- 229910052697 platinum Inorganic materials 0.000 description 5
- 230000010287 polarization Effects 0.000 description 4
- 239000010453 quartz Substances 0.000 description 4
- 229910052709 silver Inorganic materials 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 2
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- 229910002112 ferroelectric ceramic material Inorganic materials 0.000 description 2
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- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 238000007738 vacuum evaporation Methods 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000002939 deleterious effect Effects 0.000 description 1
- 239000005350 fused silica glass Substances 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- RHZWSUVWRRXEJF-UHFFFAOYSA-N indium tin Chemical compound [In].[Sn] RHZWSUVWRRXEJF-UHFFFAOYSA-N 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- LQBJWKCYZGMFEV-UHFFFAOYSA-N lead tin Chemical compound [Sn].[Pb] LQBJWKCYZGMFEV-UHFFFAOYSA-N 0.000 description 1
- 229910000623 nickel–chromium alloy Inorganic materials 0.000 description 1
- 239000005304 optical glass Substances 0.000 description 1
- QHGVXILFMXYDRS-UHFFFAOYSA-N pyraclofos Chemical compound C1=C(OP(=O)(OCC)SCCC)C=NN1C1=CC=C(Cl)C=C1 QHGVXILFMXYDRS-UHFFFAOYSA-N 0.000 description 1
- 238000005488 sandblasting Methods 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- IHQKEDIOMGYHEB-UHFFFAOYSA-M sodium dimethylarsinate Chemical class [Na+].C[As](C)([O-])=O IHQKEDIOMGYHEB-UHFFFAOYSA-M 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 229910001174 tin-lead alloy Inorganic materials 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
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- Y10T428/12889—Au-base component
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12771—Transition metal-base component
- Y10T428/12861—Group VIII or IB metal-base component
- Y10T428/12896—Ag-base component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12771—Transition metal-base component
- Y10T428/12861—Group VIII or IB metal-base component
- Y10T428/12944—Ni-base component
Definitions
- the present invention relates to solid delay line improvements and particularly to the production of ferroelectric ceramic transducers that may be readily bonded in known manner for operation in the shear mode to a non-crystalline solid delay line medium and to a back electrode, such for example as a delay line composed of glass or fused silica, and a back electrode composed of a tin-lead alloy.
- a polarized ferroelectric ceramic transducer having a shear mode of vibration is obtained by slicing it from a block of ceramic material previously polarized in a direction parallel to its poling axis. This then presents the remaining problem of soldering the ceramic to the delay line facet with indium and soldering the back electrode to the back of the ceramic with tin-indium solder at temperatures which will not impair its polarity.
- the problem is solved by the low temperature application to both broad surfaces of a ceramic transducer a thin, welladhered, solderable, four-layer coating, comprising a base layer of platinum or of silver, which preferably is baked in at a temperature of approximately 200 C., a second 2 layer of chromium, a layer of an alloy which is approximately 80% Ni and about 20% Cr laid down in a manner that produces a gradient coating in which the Cr content is the highest at the start and lowest at the end of the coating period respectively, and finally depositing a layer of Au thereon.
- FIG. 1 is a perspective representation of a polarized block of ferroelectric ceramic material.
- FIG. 2 is an exploded view, in side elevation, diagrammatically depicting the ceramic transducer and its respective coatings arranged between a back electrode and the coating of a facet of a delay line; the bonding materials for effecting union of the transducer with the back electrode and with the facet coating also being shown.
- the block of material 11 has conductive coatings 12 and 13 on its upper and lower surfaces respectively which have previously been connected to the terminals of a high volt-age direct current source to impart to it a poling axis transversely therethrough, as indicated by the arrows A, so that when a slice such as 15 is removed therefrom for use as a transducer and one of its broad sides mated with a delay line surface, it will be in shear mode relation thereto.
- the first or base layer of about 300 angstroms of platinum or silver is deposited on both sides of the slice 15 of the ceramic by vacuum evaporation at room temperature.
- This coating is preferably baked in an open atmosphere at a temperature of approximately 200 C. for from one to eighteen hours to provide good. adherence.
- the second layer of about 500 angstroms of chromium is then deposited by vacuum evaporation at room temperature.
- This metal which is insoluble in solder, is to serve as a barrier between the solder and the platinum, which is soluble.
- the third layer of about 500 angstroms of a nickelchrome alloy containing approximately Ni and 20% Cr is also applied at room temperature by the evaporation process in the vacuum maintained during application of the second layer.
- the fourth or final layer of about 500 angstroms of gold is applied in the vacuum maintained during application of the third layer to preserve the nickel-chromes metallic surface.
- the final layers of gold are almost instantly dissolvable by the solders employed.
- the solder penetrates the multi-layer coatings until it is stopped either at the high Cr part of the nickel-chrome layer or at the nickel-chrome Cr interface.
- the delay line bears a layer of platinum on its transducer mating facet 20. Fusion of its surface to the gold surface of 15 is effected by directing heat into the mating surfaces until they reach a temperature of 200 C. or thereabout and puddling pure indium thereon. Such surfaces are then swabbed with a vibrating fibre glass brush, tinned with pure indium from an auxiliary molten puddle thereof and the indium slowly spread over the respective mating surfaces substantially as described in the French patent. The respective surfaces are then permitted to cool down to a stabilized temperature of between 165 175 C. and after a final skin removal from such surfaces they are brought together into aligned contact and subjected to gradually increased pressure until cooled to approximately C.
- the mating surface of the transducer and the back electrode are swabbed with a fibre glass brush tinned with 65% In35% Sn solder, mated, and then 3 allowed to cool.
- the back electrode preferably is a preformed block of 60% tin-% lead, as in the referred-to patent and application.
- the method of preparing surfaces of a transducer for solder-able union with a solid delay line and its back electrode which comprises application to each of its two broad surfaces a base coat of a noble metal by vacuum deposition, depositing a layer of chromium on said base coat, overlaying the chromium with a gradient coating containing approximately Ni and 20% Cr with the content of Cr being highest at the chromium interface and lowest at the exposed surface, and finally overlaying the...
- the method of coating a transducer with a material solderable at a temperature of approximately 200 C. which comprises applying by vapor deposition in a vacuum successively and at temperatures under 200 C., films of the followin gmctallic materials: a ndble metal, chroa nickel-chromium alloy containing approximately 80% Ni and 20% Cr laid down in graded composition in which the Cr content is highest at the start and lowest at the completion of evaporation and gold.
- a method such as defined by the preceding claim which includes baking the noble metal coating at a temperature of approximately 200 C. for a substantial time period.
- a ferroelectric ceramic transducer having on a surface thereof parallel to its poling axis a coating through the medium of which it is solder-able to an indiumized mating facet of a delay line and a back electrode at a temperature below that at which the polarization of such transducer would be adversely affected said coating comprising layers of a noble metal, chromium, nickelch'rome and gold arranged thereon in the order named.
- a ferroelectric ceramic transducer such as defined by claim 4 wherein the noble metal comprises silver.
- a ferroelectric ceramic transducer such as defined by claim 4 wherein the noble metal comprises platinum.
Priority Applications (8)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US737389A US3042550A (en) | 1958-05-23 | 1958-05-23 | Solid delay line improvements |
GB17199/59A GB890813A (en) | 1958-05-23 | 1959-05-20 | Ultrasonic delay line improvements |
NL239431A NL124189C (xx) | 1958-05-23 | 1959-05-22 | |
BE578941A BE578941A (fr) | 1958-05-23 | 1959-05-22 | Perfectionnements aux lignes à retard solides. |
FR795267A FR1224785A (fr) | 1958-05-23 | 1959-05-22 | Perfectionnements aux lignes à retard solides |
DE19591416028 DE1416028B2 (de) | 1958-05-23 | 1959-05-22 | Verfahren zur Herstellung eines als Dickenscherungsschwinger wirkender Wandlers |
US85944A US3111741A (en) | 1958-05-23 | 1960-10-27 | Solid delay line improvements |
US83605A US3206698A (en) | 1958-05-23 | 1961-01-11 | Electro-mechanical delay line having ferroelectric transducer bonded to solid delay medium |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US737389A US3042550A (en) | 1958-05-23 | 1958-05-23 | Solid delay line improvements |
US85944A US3111741A (en) | 1958-05-23 | 1960-10-27 | Solid delay line improvements |
US83605A US3206698A (en) | 1958-05-23 | 1961-01-11 | Electro-mechanical delay line having ferroelectric transducer bonded to solid delay medium |
Publications (1)
Publication Number | Publication Date |
---|---|
US3042550A true US3042550A (en) | 1962-07-03 |
Family
ID=33314085
Family Applications (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US737389A Expired - Lifetime US3042550A (en) | 1958-05-23 | 1958-05-23 | Solid delay line improvements |
US85944A Expired - Lifetime US3111741A (en) | 1958-05-23 | 1960-10-27 | Solid delay line improvements |
US83605A Expired - Lifetime US3206698A (en) | 1958-05-23 | 1961-01-11 | Electro-mechanical delay line having ferroelectric transducer bonded to solid delay medium |
Family Applications After (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US85944A Expired - Lifetime US3111741A (en) | 1958-05-23 | 1960-10-27 | Solid delay line improvements |
US83605A Expired - Lifetime US3206698A (en) | 1958-05-23 | 1961-01-11 | Electro-mechanical delay line having ferroelectric transducer bonded to solid delay medium |
Country Status (6)
Country | Link |
---|---|
US (3) | US3042550A (xx) |
BE (1) | BE578941A (xx) |
DE (1) | DE1416028B2 (xx) |
FR (1) | FR1224785A (xx) |
GB (1) | GB890813A (xx) |
NL (1) | NL124189C (xx) |
Cited By (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3131459A (en) * | 1959-11-09 | 1964-05-05 | Corning Glass Works | Method of bonding absorbing material to a delay line |
US3173201A (en) * | 1961-08-23 | 1965-03-16 | James F Motson | Method of sealing a glass element within a metal member |
US3178271A (en) * | 1960-02-26 | 1965-04-13 | Philco Corp | High temperature ohmic joint for silicon semiconductor devices and method of forming same |
US3206698A (en) * | 1958-05-23 | 1965-09-14 | Corning Glass Works | Electro-mechanical delay line having ferroelectric transducer bonded to solid delay medium |
US3247473A (en) * | 1959-11-09 | 1966-04-19 | Corning Glass Works | Cold diffusion bond between acoustic delay line and back electrode or acoustic absorber |
US3252722A (en) * | 1959-11-09 | 1966-05-24 | Corning Glass Works | Delay line bond |
US3276097A (en) * | 1963-12-19 | 1966-10-04 | Bell Telephone Labor Inc | Semiconductor device and method of making |
US3590467A (en) * | 1968-11-15 | 1971-07-06 | Corning Glass Works | Method for bonding a crystal to a solid delay medium |
US3599123A (en) * | 1969-09-24 | 1971-08-10 | Bell Telephone Labor Inc | High temperature ultrasonic device |
US3857161A (en) * | 1973-02-09 | 1974-12-31 | T Hutchins | Method of making a ductile hermetic indium seal |
US3999263A (en) * | 1974-11-14 | 1976-12-28 | Litton Systems, Inc. | Method of forming a micro-array multibeam grid assembly for a cathode ray tube |
US4726507A (en) * | 1984-08-29 | 1988-02-23 | The United States Of America As Represented By The Secretary Of The Air Force | Cryogenic glass-to-metal seal |
DE3638342A1 (de) * | 1986-11-10 | 1988-05-19 | Siemens Ag | Elektrisches bauelement aus keramik mit mehrlagenmetallisierung und verfahren zu seiner herstellung |
US4837928A (en) * | 1986-10-17 | 1989-06-13 | Cominco Ltd. | Method of producing a jumper chip for semiconductor devices |
US6188162B1 (en) * | 1999-08-27 | 2001-02-13 | Product Systems Incorporated | High power megasonic transducer |
US6222305B1 (en) | 1999-08-27 | 2001-04-24 | Product Systems Incorporated | Chemically inert megasonic transducer system |
US20020190608A1 (en) * | 2001-04-23 | 2002-12-19 | Product Systems Incorporated | Indium or tin bonded megasonic transducer systems |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3187412A (en) * | 1963-04-26 | 1965-06-08 | Gen Electric | Method of mounting and aligning transducers on delay lines |
US3391447A (en) * | 1964-06-10 | 1968-07-09 | Agriculture Usa | Soldering nonmetals to metals |
US3367755A (en) * | 1965-02-26 | 1968-02-06 | Gen Dynamics Corp | Laminar conductive material having coats of gold and indium |
US3846649A (en) * | 1973-06-18 | 1974-11-05 | Rca Corp | Piezoelectric transducer comprising oriented zinc oxide film and method of manufacture |
US3867108A (en) * | 1973-10-10 | 1975-02-18 | Rca Corp | Acousto-optic devices and process for making same |
US4033503A (en) * | 1976-08-27 | 1977-07-05 | Nasa | Method for attaching a fused-quartz mirror to a conductive metal substrate |
US4077558A (en) * | 1976-12-06 | 1978-03-07 | International Business Machines Corporation | Diffusion bonding of crystals |
KR840004185A (ko) * | 1982-03-15 | 1984-10-10 | 세파드 드라진 | 금속의 킬레이트화 |
US4582240A (en) * | 1984-02-08 | 1986-04-15 | Gould Inc. | Method for low temperature, low pressure metallic diffusion bonding of piezoelectric components |
US5076486A (en) * | 1989-02-28 | 1991-12-31 | Rockwell International Corporation | Barrier disk |
US5476726A (en) * | 1992-01-22 | 1995-12-19 | Hitachi, Ltd. | Circuit board with metal layer for solder bonding and electronic circuit device employing the same |
WO1998024296A2 (en) * | 1996-11-20 | 1998-06-11 | The Regents Of The University Of California | Multilaminate piezoelectric high voltage stack |
CN111844215B (zh) * | 2019-04-25 | 2021-10-08 | 旭泰精密机械股份有限公司 | 超音波刀柄 |
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US3042550A (en) * | 1958-05-23 | 1962-07-03 | Corning Glass Works | Solid delay line improvements |
-
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- 1958-05-23 US US737389A patent/US3042550A/en not_active Expired - Lifetime
-
1959
- 1959-05-20 GB GB17199/59A patent/GB890813A/en not_active Expired
- 1959-05-22 DE DE19591416028 patent/DE1416028B2/de active Pending
- 1959-05-22 NL NL239431A patent/NL124189C/xx active
- 1959-05-22 FR FR795267A patent/FR1224785A/fr not_active Expired
- 1959-05-22 BE BE578941A patent/BE578941A/fr unknown
-
1960
- 1960-10-27 US US85944A patent/US3111741A/en not_active Expired - Lifetime
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1961
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US2702427A (en) * | 1948-03-13 | 1955-02-22 | Roberts Shepard | Method of making electromechanically sensitive material |
US2672590A (en) * | 1950-03-22 | 1954-03-16 | Bell Telephone Labor Inc | Delay line |
US2767336A (en) * | 1951-05-22 | 1956-10-16 | David L Arenberg | Cement for bonding elements of a delay line with low transmission losses using mixtures of inorganic salts |
US2777997A (en) * | 1951-11-06 | 1957-01-15 | David L Arenberg | Ultrasonic delay lines |
US2787520A (en) * | 1952-03-07 | 1957-04-02 | California Research Corp | Process for producing piezoelectric transducers |
US2859415A (en) * | 1952-09-03 | 1958-11-04 | Bell Telephone Labor Inc | Ultrasonic acoustic wave transmission delay lines |
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Cited By (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3206698A (en) * | 1958-05-23 | 1965-09-14 | Corning Glass Works | Electro-mechanical delay line having ferroelectric transducer bonded to solid delay medium |
US3131459A (en) * | 1959-11-09 | 1964-05-05 | Corning Glass Works | Method of bonding absorbing material to a delay line |
US3247473A (en) * | 1959-11-09 | 1966-04-19 | Corning Glass Works | Cold diffusion bond between acoustic delay line and back electrode or acoustic absorber |
US3252722A (en) * | 1959-11-09 | 1966-05-24 | Corning Glass Works | Delay line bond |
US3178271A (en) * | 1960-02-26 | 1965-04-13 | Philco Corp | High temperature ohmic joint for silicon semiconductor devices and method of forming same |
US3173201A (en) * | 1961-08-23 | 1965-03-16 | James F Motson | Method of sealing a glass element within a metal member |
US3276097A (en) * | 1963-12-19 | 1966-10-04 | Bell Telephone Labor Inc | Semiconductor device and method of making |
US3590467A (en) * | 1968-11-15 | 1971-07-06 | Corning Glass Works | Method for bonding a crystal to a solid delay medium |
US3599123A (en) * | 1969-09-24 | 1971-08-10 | Bell Telephone Labor Inc | High temperature ultrasonic device |
US3857161A (en) * | 1973-02-09 | 1974-12-31 | T Hutchins | Method of making a ductile hermetic indium seal |
US3999263A (en) * | 1974-11-14 | 1976-12-28 | Litton Systems, Inc. | Method of forming a micro-array multibeam grid assembly for a cathode ray tube |
US4726507A (en) * | 1984-08-29 | 1988-02-23 | The United States Of America As Represented By The Secretary Of The Air Force | Cryogenic glass-to-metal seal |
US4837928A (en) * | 1986-10-17 | 1989-06-13 | Cominco Ltd. | Method of producing a jumper chip for semiconductor devices |
DE3638342A1 (de) * | 1986-11-10 | 1988-05-19 | Siemens Ag | Elektrisches bauelement aus keramik mit mehrlagenmetallisierung und verfahren zu seiner herstellung |
US6188162B1 (en) * | 1999-08-27 | 2001-02-13 | Product Systems Incorporated | High power megasonic transducer |
US6222305B1 (en) | 1999-08-27 | 2001-04-24 | Product Systems Incorporated | Chemically inert megasonic transducer system |
US6722379B2 (en) | 1999-08-27 | 2004-04-20 | Product Systems Incorporated | One-piece cleaning tank with indium bonded megasonic transducer |
US20020190608A1 (en) * | 2001-04-23 | 2002-12-19 | Product Systems Incorporated | Indium or tin bonded megasonic transducer systems |
US6904921B2 (en) | 2001-04-23 | 2005-06-14 | Product Systems Incorporated | Indium or tin bonded megasonic transducer systems |
Also Published As
Publication number | Publication date |
---|---|
BE578941A (fr) | 1959-11-23 |
DE1416028A1 (de) | 1970-01-22 |
NL124189C (xx) | 1968-05-15 |
GB890813A (en) | 1962-03-07 |
FR1224785A (fr) | 1960-06-27 |
US3206698A (en) | 1965-09-14 |
DE1416028B2 (de) | 1970-08-13 |
US3111741A (en) | 1963-11-26 |
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