US2984604A - Platinum plating composition and process - Google Patents

Platinum plating composition and process Download PDF

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Publication number
US2984604A
US2984604A US753525A US75352558A US2984604A US 2984604 A US2984604 A US 2984604A US 753525 A US753525 A US 753525A US 75352558 A US75352558 A US 75352558A US 2984604 A US2984604 A US 2984604A
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US
United States
Prior art keywords
platinum
solution
sulfamic acid
bath
liter
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US753525A
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English (en)
Inventor
Duva Robert
Edwin C Rinker
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Occidental Chemical Corp
Sel Rex Corp
Original Assignee
Sel Rex Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to NL123540D priority Critical patent/NL123540C/xx
Priority to NL241991D priority patent/NL241991A/xx
Application filed by Sel Rex Corp filed Critical Sel Rex Corp
Priority to US753525A priority patent/US2984604A/en
Priority to GB22070/59A priority patent/GB856405A/en
Priority to FR801231A priority patent/FR1231410A/fr
Priority to ES0251564A priority patent/ES251564A1/es
Priority to CH7655959A priority patent/CH392195A/de
Priority to DES64330A priority patent/DE1144074B/de
Application granted granted Critical
Publication of US2984604A publication Critical patent/US2984604A/en
Anticipated expiration legal-status Critical
Assigned to OXY METAL INDUSTRIES CORPORATION reassignment OXY METAL INDUSTRIES CORPORATION CHANGE OF NAME (SEE DOCUMENT FOR DETAILS). 4-09-74 Assignors: OXY METAL FINISHING CORPORATION
Assigned to HOOKER CHEMICALS & PLASTICS CORP. reassignment HOOKER CHEMICALS & PLASTICS CORP. MERGER (SEE DOCUMENT FOR DETAILS). Assignors: OXY METAL INDUSTRIES CORPORATION
Assigned to OCCIDENTAL CHEMICAL CORPORATION reassignment OCCIDENTAL CHEMICAL CORPORATION CHANGE OF NAME (SEE DOCUMENT FOR DETAILS). EFFECTIVE MARCH 30, 1982. Assignors: HOOKER CHEMICAS & PLASTICS CORP.
Expired - Lifetime legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/50—Electroplating: Baths therefor from solutions of platinum group metals
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/922—Static electricity metal bleed-off metallic stock
    • Y10S428/9335—Product by special process
    • Y10S428/934—Electrical process
    • Y10S428/935—Electroplating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12535—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component
    • Y10T428/12625—Free carbon containing component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12861—Group VIII or IB metal-base component
    • Y10T428/12875—Platinum group metal-base component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12861—Group VIII or IB metal-base component
    • Y10T428/12944—Ni-base component

Definitions

  • This invention relates to a platinum electrolyte from which it is possible to plate thick layers of stress free platinum and to the process for making the same.
  • Thcse baths operate erratically, apparently due to inconsistent cathode efficiency and (in the case with the P-salt bath) occasionally cease operating altogether.
  • Among other objects of the invention is to provide a platinum plating bath suitable for making electroformed platinum articles plated in one continuous operation.
  • One phase of this invention is based on the discovery that when the P-salt, Pt(NH (NO) is heated with an aqueous solution of sulfamic acid it dissolves therein.
  • Another phase of the invention is based on the discovery that the solution obtained by heating the P-salt with the sulfamic acid can be diluted to provide a stable electrolytic solution for electroplating stress free platinum or for electroforming platinum articles.
  • the objects of the invention are attained by heating the platinum diamino dinitrite in a sulfamic acid aqueous solution in the proportions of about 10-40 or more g. of P-salt per -200 cc. of sulfamic acid solution containing about 2 to about 400 g./liter of sulfamic acid, until a clear solution is obtained. Thereafter, the solution is diluted to provide a solution containing at least about 6 g. per liter of platinum (which corresponds to about 10 g. per liter of the P-salt). Articles are then electroplated or electroformed from this solution by conventional processes.
  • Platinum plating of thick deposits of platinum in this low stress bath can be done in one operation, i.e., there is no need for intermittently scratch brushing or burnishing to produce a smooth deposit.
  • Platinum plating with this low stress bath can be performed on a specification basis, i.e.,
  • constant electrodeposition eificiency is obtained at constant temperature and platinum metal content. For example, uniform deposits will be obtained on a series of articles by electroplating each in the bath for one minute.
  • the sulfamic acid above is calculated as pure acid although it may be added as a solution, if desired.
  • Platinum metal replenishment is accomplished by the addition of the electrolyte as such to maintain the platinum metal at the desired concentration. Solution level is maintained by the additiot f both this replenisher and water.
  • the drawing is a reproduction of a photomicrograph of a specimen of platinum plated graphite made according to the invention.
  • Example 50 grams of a sulfamic acid (NH SO H) in 200 cc. of water is heated to about. C. whereupon 20 g. of platinum diamino dinitrite are added with stirring. The stirring and heating is continued until a clear solution is obtained. It has not been possible to determine the composition of the resulting salt in the solution at the present time but it is probably a fairly complex compound.
  • the resultant solution is diluted with water to make 1 liter of solution and is then ready for electroplating.
  • the platinum is plated at a voltage of about 1 volt to 3 volts and at a current density of about 20 amps. per square foot.
  • the proportion of sulfamic acid of P-salt can vary from about 1:10 to about 20:1.
  • the electroplating bath should have a concentration of at least about 6 g. of Pt per liter for otherwise spongy deposits result.
  • the bath of the invention is stable as long as it is operated.
  • the form may be coated with resist material where no plating is desired, the plating on the exposed surface is continued without interruption until the desired thickness is built-up and thereafter the original form is separated from the plated deposit.
  • the removal of the basis metal from the deposit results in the production of a continuous film of platinum metal showing the lack of internal stress of the plated metal. In other words the platinum metal does not disintegrate into flakes or small pieces.
  • an adherent layer of platinum has been plated on graphite.
  • the throwing power of the bath is excellent as can be seen from the fact that the platinum penetrated into the pores of the graphite as shown in the drawing. A protective layer of nickel was deposited thereon before cutting the section which was photographed.
  • a process for electroplating relatively thick layers of stress-free platinum comprisingdissolving platinum diamino dinitrite inan aqueous solution of sulfamicacid containing a sufiicient amountof sulfamic acid to dissolve said platinum diamino dinitrite, adding waterto the resultant solution to provide a solution containingat least 6 g./ liter of platinum metal andelectrolyzing said solution to plate out platinum therefrom.
  • a process for electroplating relatively thick layers of stress free platinum comprising providing a solution of about 10-40 g./liter of platinum diamino dinitrit'e in 15200 cc. of aqueous sulfamic acid solution containing about 2 to about 400 g./liter of sulfamic acid, adding water to said solution to provide a solution containing 6 g./ liter of platinum and electrolyzing said solution to plate out platinum therefrom.

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
US753525A 1958-08-06 1958-08-06 Platinum plating composition and process Expired - Lifetime US2984604A (en)

Priority Applications (8)

Application Number Priority Date Filing Date Title
NL123540D NL123540C (enrdf_load_stackoverflow) 1958-08-06
NL241991D NL241991A (enrdf_load_stackoverflow) 1958-08-06
US753525A US2984604A (en) 1958-08-06 1958-08-06 Platinum plating composition and process
GB22070/59A GB856405A (en) 1958-08-06 1959-06-26 Low stress platinum platings and composition
FR801231A FR1231410A (fr) 1958-08-06 1959-07-27 Procédé de dépôt électrolytique d'une couche de platine
ES0251564A ES251564A1 (es) 1958-08-06 1959-07-30 Un procedimiento de produccion por galvanoplastia de gruesas capas brillantes de platino
CH7655959A CH392195A (de) 1958-08-06 1959-08-04 Verfahren zur Herstellung eines Elektrolyten
DES64330A DE1144074B (de) 1958-08-06 1959-08-06 Bad zum galvanischen Abscheiden dicker, spannungsfreier Platinueberzuege

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US753525A US2984604A (en) 1958-08-06 1958-08-06 Platinum plating composition and process

Publications (1)

Publication Number Publication Date
US2984604A true US2984604A (en) 1961-05-16

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ID=25031005

Family Applications (1)

Application Number Title Priority Date Filing Date
US753525A Expired - Lifetime US2984604A (en) 1958-08-06 1958-08-06 Platinum plating composition and process

Country Status (7)

Country Link
US (1) US2984604A (enrdf_load_stackoverflow)
CH (1) CH392195A (enrdf_load_stackoverflow)
DE (1) DE1144074B (enrdf_load_stackoverflow)
ES (1) ES251564A1 (enrdf_load_stackoverflow)
FR (1) FR1231410A (enrdf_load_stackoverflow)
GB (1) GB856405A (enrdf_load_stackoverflow)
NL (2) NL241991A (enrdf_load_stackoverflow)

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3122424A (en) * 1961-12-13 1964-02-25 King L D Percival Graphite bonding method
US3206382A (en) * 1959-09-30 1965-09-14 Johnson Matthey Co Ltd Electrodeposition of platinum or palladium
US3235392A (en) * 1960-10-11 1966-02-15 Automatic Telephone & Elect Electroless deposition of palladium
US3296102A (en) * 1961-08-01 1967-01-03 Exxon Research Engineering Co Catalysts and electrodes for electrochemical cells
US3309292A (en) * 1964-02-28 1967-03-14 Richard L Andrews Method for obtaining thick adherent coatings of platinum metals on refractory metals
US3366464A (en) * 1962-12-17 1968-01-30 Snecma Method of coating graphite with a refractory coating and products obtained by such method
US3433682A (en) * 1965-07-06 1969-03-18 American Standard Inc Silicon coated graphite
US3484210A (en) * 1964-10-19 1969-12-16 Henry J Pinter Alloy coated carbon and graphite members having conductors soldered thereto
US3671408A (en) * 1971-05-25 1972-06-20 Sel Rex Corp Rhodium-platinum plating bath and process
US4895750A (en) * 1988-03-28 1990-01-23 General Dynamics Corp., Pomona Division High-temperature tensile test specimen and methods of fabrication
EP0358375A1 (en) * 1988-09-07 1990-03-14 Johnson Matthey Public Limited Company Platinum or platinum alloy plating bath
US5078843A (en) * 1988-03-28 1992-01-07 General Dynamics Corporation Air Defense Systems Division Method for fabricating high-temperature tensile test specimens
US5620583A (en) * 1995-04-15 1997-04-15 Degussa Aktiengesellschaft Platinum plating bath
WO2022129461A1 (de) * 2020-12-18 2022-06-23 Umicore Galvanotechnik Gmbh Stabilisierung der abscheiderate von platinelektrolyten
CN115925449A (zh) * 2022-12-30 2023-04-07 浙江朗德电子科技有限公司 一种尾气传感器芯片用功能电极的制备方法

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1356353A (fr) * 1963-02-12 1964-03-27 Louyot Comptoir Lyon Alemand Procédé de dépôt électrolytique d'une couche de platine et électrolyte pour lamise en oeuvre du procédé
NL124423C (enrdf_load_stackoverflow) * 1963-03-20
US4673472A (en) * 1986-02-28 1987-06-16 Technic Inc. Method and electroplating solution for deposition of palladium or alloys thereof
DE19547900C2 (de) * 1995-04-15 1997-10-02 Degussa Galvanisches Platinbad

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1779436A (en) * 1929-07-02 1930-10-28 Baker & Co Inc Process of electrodepositing metals of the platinum group
US1921941A (en) * 1931-03-12 1933-08-08 Johnson Matthey Co Ltd Electrodeposition of palladium
US2027358A (en) * 1931-03-12 1936-01-07 Johnson Matthey Co Ltd Electrodeposition of metals of the platinum group

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1779436A (en) * 1929-07-02 1930-10-28 Baker & Co Inc Process of electrodepositing metals of the platinum group
US1921941A (en) * 1931-03-12 1933-08-08 Johnson Matthey Co Ltd Electrodeposition of palladium
US2027358A (en) * 1931-03-12 1936-01-07 Johnson Matthey Co Ltd Electrodeposition of metals of the platinum group

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3206382A (en) * 1959-09-30 1965-09-14 Johnson Matthey Co Ltd Electrodeposition of platinum or palladium
US3235392A (en) * 1960-10-11 1966-02-15 Automatic Telephone & Elect Electroless deposition of palladium
US3296102A (en) * 1961-08-01 1967-01-03 Exxon Research Engineering Co Catalysts and electrodes for electrochemical cells
US3122424A (en) * 1961-12-13 1964-02-25 King L D Percival Graphite bonding method
US3366464A (en) * 1962-12-17 1968-01-30 Snecma Method of coating graphite with a refractory coating and products obtained by such method
US3309292A (en) * 1964-02-28 1967-03-14 Richard L Andrews Method for obtaining thick adherent coatings of platinum metals on refractory metals
US3484210A (en) * 1964-10-19 1969-12-16 Henry J Pinter Alloy coated carbon and graphite members having conductors soldered thereto
US3433682A (en) * 1965-07-06 1969-03-18 American Standard Inc Silicon coated graphite
US3671408A (en) * 1971-05-25 1972-06-20 Sel Rex Corp Rhodium-platinum plating bath and process
US4895750A (en) * 1988-03-28 1990-01-23 General Dynamics Corp., Pomona Division High-temperature tensile test specimen and methods of fabrication
US5078843A (en) * 1988-03-28 1992-01-07 General Dynamics Corporation Air Defense Systems Division Method for fabricating high-temperature tensile test specimens
EP0358375A1 (en) * 1988-09-07 1990-03-14 Johnson Matthey Public Limited Company Platinum or platinum alloy plating bath
US5620583A (en) * 1995-04-15 1997-04-15 Degussa Aktiengesellschaft Platinum plating bath
WO2022129461A1 (de) * 2020-12-18 2022-06-23 Umicore Galvanotechnik Gmbh Stabilisierung der abscheiderate von platinelektrolyten
CN115925449A (zh) * 2022-12-30 2023-04-07 浙江朗德电子科技有限公司 一种尾气传感器芯片用功能电极的制备方法
CN115925449B (zh) * 2022-12-30 2023-11-07 浙江朗德电子科技有限公司 一种尾气传感器芯片用功能电极的制备方法

Also Published As

Publication number Publication date
GB856405A (en) 1960-12-14
DE1144074B (de) 1963-02-21
NL123540C (enrdf_load_stackoverflow)
NL241991A (enrdf_load_stackoverflow)
FR1231410A (fr) 1960-09-29
ES251564A1 (es) 1959-12-16
CH392195A (de) 1965-05-15

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Date Code Title Description
AS Assignment

Owner name: OXY METAL INDUSTRIES CORPORATION

Free format text: CHANGE OF NAME;ASSIGNOR:OXY METAL FINISHING CORPORATION;REEL/FRAME:003967/0084

Effective date: 19741220

AS Assignment

Owner name: HOOKER CHEMICALS & PLASTICS CORP.

Free format text: MERGER;ASSIGNOR:OXY METAL INDUSTRIES CORPORATION;REEL/FRAME:004075/0885

Effective date: 19801222

AS Assignment

Owner name: OCCIDENTAL CHEMICAL CORPORATION

Free format text: CHANGE OF NAME;ASSIGNOR:HOOKER CHEMICAS & PLASTICS CORP.;REEL/FRAME:004126/0054

Effective date: 19820330