US2874449A - Method of providing an electrically conductive network on a support of insulating material - Google Patents

Method of providing an electrically conductive network on a support of insulating material Download PDF

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Publication number
US2874449A
US2874449A US555665A US55566555A US2874449A US 2874449 A US2874449 A US 2874449A US 555665 A US555665 A US 555665A US 55566555 A US55566555 A US 55566555A US 2874449 A US2874449 A US 2874449A
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US
United States
Prior art keywords
grid
metal
network
insulating support
crystalline material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US555665A
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English (en)
Inventor
Rooy Antonius Johannes De
Jonkers Johannes Jose Antonius
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
US Philips Corp
North American Philips Co Inc
Original Assignee
US Philips Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by US Philips Corp filed Critical US Philips Corp
Application granted granted Critical
Publication of US2874449A publication Critical patent/US2874449A/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
    • H05K3/046—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer
    • H05K3/048—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer using a lift-off resist pattern or a release layer pattern
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J29/00—Details of cathode-ray tubes or of electron-beam tubes of the types covered by group H01J31/00
    • H01J29/02—Electrodes; Screens; Mounting, supporting, spacing or insulating thereof
    • H01J29/08—Electrodes intimately associated with a screen on or from which an image or pattern is formed, picked-up, converted or stored, e.g. backing-plates for storage tubes or collecting secondary electrons
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J9/00—Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
    • H01J9/02—Manufacture of electrodes or electrode systems
    • H01J9/14—Manufacture of electrodes or electrode systems of non-emitting electrodes
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49162—Manufacturing circuit on or in base by using wire as conductive path

Definitions

  • memory tubes methd of deriving information from the charge image by means of an electron-beam without appreciablyreducing the chargeon the insulating surface as effected in electron tubes. These tubes permit light flashes or other transient, non-recurring phenomena to be studied. This also permits a bright image of articles of very low luminosity to be obtained.
  • Memory tubes which comprise a grid-shaped electrode consistingot an electrically conductive network unilaterally provided with a thin layer of insulating material, the network serving as a support'for the insulating layer.
  • the conductive network functions as a supportfor a layer of insulating material covering one side of the network throughout its surface and closing the openings of the network.
  • the screen has a closed surface at one side divided into partitions by the metal network.
  • Electrodes in which the conductive network functions as a support and the insulating layer is stretched in the form of a film over the network suffer from a limitation a in that the number of meshes per cm. of the network at a given ratio between the size of the openings and the metal surface is limited by the thickness of the material required to make the network sufficiently rigid.
  • a further limitation is that the network extends above the insulator surface.
  • the required potential difference between the grid and an electrode placed behind it may be smaller as the spacing between the electrode and the grid is smaller.
  • the distance within which the potential fields influencing the electron velocity are active depends upon the thickness of" the material, since the equipotential surface of the grid extends between the highest 5 United States Patent O aforesaid disadvantages.
  • the present invention has for its object to mitigate the It concerns a method of .making an electrode consisting of the combination of an insulator and a metal network, the insulator constituting the support and the network being provided in the form of an exceedingly thin metal deposit on the surface of the support.
  • the invention yields a print of a grid produced according to a conventional technique and known as a commercial product.
  • the grid is provided on the insulator.
  • mica is preferably used, but glass and oxidized aluminum are also suitable.
  • a thin layer of material is spread over the insulator-surface carrying the grid, said material consisting of a soluble fine-crystalline material.
  • a suitable material is barium chloride for which water may be used as a solvent.
  • the grain size of the material is preferably chosen to be smallerthan 1 micron.
  • a suitable layer is obtained by applying the material by vaporisation.
  • the grid is coated with it and the material deposits through openings of the grid onto the insulating surface.
  • the grid is carefully removed and the material applied by vaporisation remains in the openings on the insulating surface.
  • This surface then exhibits blocks of the material,f applied by vaporisation, sura reticulate pattern.
  • a thin metal layer is provided by cathode disintegration throughout the surface. It is required therefore that the metals used are capable of being pro .vided in the form of such a thin layer that the material applied by vaporisation dissolves through the metal layer.
  • the metal layer should be sufficiently electri- The metal must not be attacked by the solvent and should firmly adhere to the surface of the insulator. Suitable metals are gold, silver, platinum, palladium and iridium.
  • the material applied by vapori'sation is dissolved in a suitable liquid.
  • the insulating plate may be immersed in the solvent. Where the metal does not directly contact the insulating layer it does not adhere to the surface of the insulator after the intermediate layer is dissolved.
  • Fig. 1 shows an insulator-plate 1 carrying a grid 2 which should extend fiat throughout the surface of the plate 1. This is achieved by using an electro-static field. For this purpose the plate is placed on an electrically Patented Feb. 24,1959
  • Fig. 2 is a cross-section after covering the grid 2 and the insulator-plate 1 with a layer of fine-crystalline material.
  • barium chloride, calcium fluoride or an alkaline earth halide, which are also soluble in water, may be used for said material;
  • the wires of the grid 2 have a circular or substantially circular cross-section so that their surface contactingthe support 1 is smaller than, their thickness.
  • the vaporisers 7 are arranged laterally and directed to the surface at different angles. This .requires the use of four vaporisers, two of which are arranged in the plane of the drawing.
  • Fig. 3 shows a cross-section after removal. of. the
  • the size of the covered fields in proportion to the total surface is more favourable than when applying the material by vaporisation from a direction at right angles to the insulator, thus producing a better opening ratio.
  • the layer 6 of conductive material is pro-.
  • Fig. 5 shows the condition in which the material 5 applied by vaporisation has been removed so that the metal layer 6 is connected only by narrow strips to the surface Y
  • the invention may be extended to a method of manul l i i degree o'faccuracyj
  • the method in accordance with facturing such grids.
  • the insulator-plate together with the network formed thereon is immersed in an electrolytic copperbath, in which the conductive network is provided with a copper layer.
  • the cQPPer layer is allowed to .grow to thickness thus comprising sufiicient rigidity on the grids.
  • the thickened'layer of copper is taken from the insulator, the
  • a method of forming a copper metal grid comprising the steps, placing a finely-meshed metal grid on the surface of an insulating support, coating said surface and metal grid with a thin layer of a finely-divided soluble crystalline material, removing the grid thereby removing the crystalline material. that had been on the grid surfaceand exposing portions of the insulating support surface corresponding to the grid, coating the layer of.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electrolytic Production Of Metals (AREA)
  • Electrostatic Charge, Transfer And Separation In Electrography (AREA)
  • Cathode-Ray Tubes And Fluorescent Screens For Display (AREA)
US555665A 1954-12-30 1955-12-27 Method of providing an electrically conductive network on a support of insulating material Expired - Lifetime US2874449A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL338535X 1954-12-30

Publications (1)

Publication Number Publication Date
US2874449A true US2874449A (en) 1959-02-24

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ID=19784618

Family Applications (1)

Application Number Title Priority Date Filing Date
US555665A Expired - Lifetime US2874449A (en) 1954-12-30 1955-12-27 Method of providing an electrically conductive network on a support of insulating material

Country Status (7)

Country Link
US (1) US2874449A (da)
BE (1) BE544021A (da)
CH (1) CH338535A (da)
DE (1) DE1014154B (da)
FR (1) FR1139135A (da)
GB (1) GB788342A (da)
NL (1) NL193679A (da)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3069585A (en) * 1958-10-16 1962-12-18 Siemens And Halske Ag Berlin A Tensioned cross wire grid having soldered crossing points
US3099874A (en) * 1958-02-06 1963-08-06 Telefunken Gmbh Method of manufacturing magnetic core matrices
US3102847A (en) * 1957-07-23 1963-09-03 Csf Storage tube targets
US3362804A (en) * 1965-05-17 1968-01-09 Mc Donnell Douglas Corp Method of making cathode ray tube with integral light trapping filter
US3474511A (en) * 1966-03-16 1969-10-28 Fernseh Gmbh Method of making image orthicon pickup tube with high storage capacity
US3688359A (en) * 1969-09-05 1972-09-05 Hitachi Ltd Method for producing a composite shadow mask
US4214025A (en) * 1976-08-25 1980-07-22 English Electric Valve Company Limited Mesh electrodes and method of making them

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1298542B (de) * 1967-07-27 1969-07-03 Fernseh Gmbh Fernsehaufnahmeroehre vom SEC-Typ und Verfahren zu deren Herstellung

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2047369A (en) * 1934-12-21 1936-07-14 Rca Corp Photoelectric device
US2160510A (en) * 1935-11-14 1939-05-30 Firm Fernseh Ag Cathode ray tube with photocell mosaic
US2618762A (en) * 1945-04-12 1952-11-18 Rca Corp Target and circuit for storage tubes
US2644208A (en) * 1950-05-24 1953-07-07 Gen Electronique Soc Method for the manufacture of a screen for a television apparatus or the like
US2706264A (en) * 1949-12-17 1955-04-12 Bell Telephone Labor Inc Storage tube circuit

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2047369A (en) * 1934-12-21 1936-07-14 Rca Corp Photoelectric device
US2160510A (en) * 1935-11-14 1939-05-30 Firm Fernseh Ag Cathode ray tube with photocell mosaic
US2618762A (en) * 1945-04-12 1952-11-18 Rca Corp Target and circuit for storage tubes
US2706264A (en) * 1949-12-17 1955-04-12 Bell Telephone Labor Inc Storage tube circuit
US2644208A (en) * 1950-05-24 1953-07-07 Gen Electronique Soc Method for the manufacture of a screen for a television apparatus or the like

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3102847A (en) * 1957-07-23 1963-09-03 Csf Storage tube targets
US3099874A (en) * 1958-02-06 1963-08-06 Telefunken Gmbh Method of manufacturing magnetic core matrices
US3069585A (en) * 1958-10-16 1962-12-18 Siemens And Halske Ag Berlin A Tensioned cross wire grid having soldered crossing points
US3362804A (en) * 1965-05-17 1968-01-09 Mc Donnell Douglas Corp Method of making cathode ray tube with integral light trapping filter
US3474511A (en) * 1966-03-16 1969-10-28 Fernseh Gmbh Method of making image orthicon pickup tube with high storage capacity
US3688359A (en) * 1969-09-05 1972-09-05 Hitachi Ltd Method for producing a composite shadow mask
US4214025A (en) * 1976-08-25 1980-07-22 English Electric Valve Company Limited Mesh electrodes and method of making them

Also Published As

Publication number Publication date
BE544021A (da)
FR1139135A (fr) 1957-06-25
GB788342A (en) 1957-12-23
NL193679A (da)
CH338535A (de) 1959-05-31
DE1014154B (de) 1957-08-22

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