US2712522A - Bright nickel plating - Google Patents

Bright nickel plating Download PDF

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Publication number
US2712522A
US2712522A US344481A US34448153A US2712522A US 2712522 A US2712522 A US 2712522A US 344481 A US344481 A US 344481A US 34448153 A US34448153 A US 34448153A US 2712522 A US2712522 A US 2712522A
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US
United States
Prior art keywords
nickel
per liter
group
compound
grams per
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US344481A
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English (en)
Inventor
Kardos Otto
Thomas J Menzel
James L Sweet
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hanson Van Winkle Munning Co
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Hanson Van Winkle Munning Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to NLAANVRAGE7805347,A priority Critical patent/NL185994B/xx
Priority to IT513086D priority patent/IT513086A/it
Application filed by Hanson Van Winkle Munning Co filed Critical Hanson Van Winkle Munning Co
Priority to US344481A priority patent/US2712522A/en
Priority to GB21895/53A priority patent/GB747908A/en
Priority to FR1096351D priority patent/FR1096351A/fr
Priority to DEH19752A priority patent/DE1063003B/de
Application granted granted Critical
Publication of US2712522A publication Critical patent/US2712522A/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/12Electroplating: Baths therefor from solutions of nickel or cobalt
    • C25D3/14Electroplating: Baths therefor from solutions of nickel or cobalt from baths containing acetylenic or heterocyclic compounds
    • C25D3/16Acetylenic compounds

Definitions

  • a preferred process according to this invention for producing bright nickel deposits comprises electrodepositing nickel from an aqueous acidic solution of at least one nickel salt, in which there is dissolved from about 0.02 to 3 grams per liter of a water-soluble acetylenic compound, together with about /4 to about 80 grams per liter of a water-soluble sulfo-oxygen compound of the group consisting of unsaturated aliphatic sulfonic acids, mononuclear and binuclear aromatic sulfonic acids, heterocyclic sulfonic acids, mononuclear aromatic sulfinic acids, alkali metal, ammonium, magnesium and nickel salts of said acids, and mononuclear aromatic sult'onamides and imides.
  • any water-soluble acetylenic compound can be employed with success in the above-defined process for producing bright nickel deposits, we have had particular success, particularly as regards production of ductile bright electrodeposits, when using an acetylenic compound selected from the group consisting of Z-butyne- 1,4-diol, 4-methoxy-2-butyn-1-ol, diethylamino-2-butyn-l-ol, 4-(N-morpholinyl)-2-butyn-1- o1, 3-pentyn-l-ol, 2,4-heXadiyne-L6-diol, and l-diethylamino-Z-propyne.
  • an acetylenic compound selected from the group consisting of Z-butyne- 1,4-diol, 4-methoxy-2-butyn-1-ol, diethylamino-2-butyn-l-ol, 4-(N-morpholinyl)-2-but
  • R1 is a hydroxyl, hydroxymethyl or hydroxyethyl radical
  • R2 is a hydrogen or methyl radical
  • R3 is selected from the group consisting of methyl, hydroxymethyl, hydroxyethyl, methoxymethyl, diethylaminomethyl, morpholinomethyl, and hydroxypropyne radicals.
  • Compounds having this general formula, and other compounds in the group particularly specified above, are effective brighteners in nickel electroplating 3-hexyne-2,5-diol, 4-
  • the nickel deposit produced from such bath is brilliant, but at a thickness of about 0.001 inch (0.025 mm.), it is likely to be rather brittle, as indicated by slight cracking of the deposits and noise production when the article on which the deposit is formed is bent.
  • the acetylenic compound is used in the electroplating bath in combination with a suite-oxygen compound of the character described, the concentration of the acetylenic compound can be very considerably reduced (e. g.
  • Brightener additions according to this invention have of course been used successfully in the standard Watts nickel electroplating bath. However, these brightener additions are also efiective in all other acid nickel electroplating baths, and the invention thereforeis applicable to any nickel electrodepcsition operation from an aqueous acidic solution of one or more nickel salts.
  • Compound 1 (acetylene) gave bright and dull patches when bubbled (after purification by passage through water) over the test panel.
  • Compound 22 (acetylene dicarboxylic acid) was only moderately elfective as a brightener'.
  • the ineffective compounds 16 and 17 contain the following group:
  • Nickel deposits (0.001 inch thick) obtained with the ammo compound l0, l8, l9 and also with compounds 16 and 17 were somewhat brittle. The brightening action I of compound 1 (acetylene) was difficult to control. Hov
  • the compounds listed in Table Ill are examples of sulfo-oxygen compounds which, when used in combination with a water-soluble acetylenic (Group A) compound, promote formation of brilliant and adequately ductile nickel deposits.
  • concentration values set opposite each compound in Table III were found to give good results when that compound was used in combination with 0.1 gram per liter of butynediol in a bath containing 330 grams per liter nickel sulfate, grams per liter nickel chloride, and 37.5 grams per liter boric acid at a pH of 3.5, at C., and 40 amperes per square foot average current density, using bent cathodes and with air agitation.
  • Benzene monosulionic acid C@H5SO3H 2 and 4 g./l.
  • Nickel benzene monosulfonate (CEHGS 0021351 i 2 and 4 g./l.
  • HOCOC6H4SO3NH4 "Um” ,..l. .r. W... 2 g./l. 1-amino-2,5-benzenc disulfonic acid, HZNC5H3( S 033)! 2 and 4 g./l. Ortho-am'mooenzene sulfuric acid, HgNCfiILSOiH. Z and 4 gJl.
  • Table IV shows the results obtained on a bent cathode in a standard Watts sulfate-chloride-boric acid nickel plating bath under varying operating conditions at a pH of 3.5 and with air agitation:
  • the concentration of the naphthalene trisulfonic acid (or other Group B compound) should be kept rather low in order to avoid milkiness of the deposit in the low current density areas, especially if the butynediol (or other Group A compound) concentration is very low (say only 0.1 g./l.).
  • the concentration limits for naphthalene trisulfonate are extremely wide.
  • nickel sulfate-chloride-boric acid bath at a pH of 3.5, at 50 C., and at 40 amps. per sq. ft., in the presence of 0.15 g./l.
  • ylenic (Group A) compound do the sulfo-oxygen (Group B) compounds produce really brilliant nickel deposits. Also a leveling (smoothing) action is produced only in presence of a Group A (acetylenic) compound.
  • the roughness values root mean square values in microinches shown in Table V were obtained with a brush surface analyzer on roughened panels before and after plating 0.001 inch of nickel.
  • the concentration of Group A compounds should be kept at the minimum required to produce the desired degree of brilliancy, which is approximately the value given in Table II.
  • concentrations of Group A brighteners up to e. g. 0.4 or even up to a maximum of 1.0 grams per liter may be used with advantage.
  • the concentration range or" Group B addition agents is rather wide. There is a certain minimum Group B compound concentration, depending on the concentration of the Group A compound, the bath composition, and operating conditions, below which maximum brilliancy is not obtained. Increase in the concentration of Group B compound beyond this minirnum frequently produces more ductile nickel deposits.
  • the bath composition itself has some influence on the brightening effect of the Group A and Group B addition agents.
  • Standard Watts baths containing 330 grams per liter sulfate, grams per liter chloride, 37.5 grams per liter boric acid and operated at a pH of 3.5, C., and 40 amperes per square foot, with air agitation, in which 25% to 100% of the nickel was replaced by cobalt, showed rather increased sensitivity to butynediol, when this Group A compound was used alone, but almost no sensitivity to naphthalene trisulfonic acid when this Group B compound was used alone or in combination with butynediol. Baths high in chloride ion concentration behaved similarly.
  • K comprises electrodepositing nickel from an aqueous acidic solution of at least one nickel salt in which there is dissolved TABLE VI Bath concentrations in grams per liter Bath 1 Bath 2 Bath 3 Bath 4 Bath 5 Bath 6 Bath 7 Nickel Sulfate, N iSO4.7H2O 240-330 330 240 Nickel chloride, YiOl fiHzO Nickel tormate, N i(OOCH)2.2H2O Nickel fluoborate, N i(BF-1)z Nickel sulfamate, Ni(OaSNH2)2 c Sodium chloride, No.01 Sodium bromide, NaBr Boric acid, H3BO3 2-Butyne-1,-4-diol 1,3,6-Naphthalene trisulfonate. Temp, C
  • the optimum pH value is in the range from 3.0 to 5.0.
  • the butynediol concentration must be increased (say, to 0.2 to 0.3 gram per liter) in order to produce a deposit of full brightness.
  • a process for producing bright nickel deposits which comprises electrodeposit'ing nickel from an aqueous acidic solution of at least one nickel salt in which there is dissolved from about 0.2 to about 3 grams per liter of an acetylenic compound selected from the group consisting of 2-butyne-l,4-diol, 4-methoxy-2-butyn-l-ol, 3- hexyne-2,5-diol, 4-diethylamino-2-butyn-l-ol, 4-(N-n1orpholinyl)-2butyn-l-ol, 3pentyn-l-ol, 2,4-heXadiyne-L6- diol, and l-diethylamino-2-propyne.
  • an acetylenic compound selected from the group consisting of 2-butyne-l,4-diol, 4-methoxy-2-butyn-l-ol, 3- hexyne-2,5
  • a process for producing bright nickel deposits which comprises electrodepositing nickel from an aqueous acidic solution of at least one nickel salt in which there is dissolved from about 0.2 to about 3 grams per liter of a acidic solution of at least one nickel salt and containing (31% as an addition agent from about 0.3 to about 1.5 grams per liter of 2-butyne-1,4-diol.
  • a process for producing bright nickel deposits which comprises electrodepositing nickel from an aqueous acidic solution of at least one nickel salt in which there is dissolved trcrn about 0.02 to 1 gram per liter of a watersoluble acetylenic compound and from about /11 to about 30 grams per liter of a Water-soluble sulfo-oxygen compound of the group consisting of unsaturated aliphatic sulfonicacids, mononuclear and binuclear aromatic sulfonic acids, heterocyclic sulfonic acids, mononuclear aromatic sulfinic acids, alkali metal, ammonium, magnesium and nickel salts of said acids, and mononuclear aromatic sulfonamides and imides.
  • a process for producing bright nickel deposits which from about 0.02 to about 1 gram per liter of a Watersoluble acetylenic compound selected from the group consisting of acetylene, Z-propyn-l-ol, 3-butyn-l-ol, Z-methyl- 3-butyn-2-oi, l-pentyn-S-ol, 3-rnethyl-l-pentyn-3-ol, 3,5- dimethyl-1-heXyn-3-ol, 3-ethyl-l-heptyn-3-ol, l-ethynylcyclohexanol, l-diethylamino 2'- propyne, 2-butyne-1,4- diol, 4-methoxy-2-butyn-l-ol, 1,4-dimethoxy 2 butyne, 3-hexyne 2,5 diol, 4-octyne 3,6 diol, 2,5-dimethyl-3- hexy
  • benzene sulthydroxarnic acid N,N dimethyl para-toluene sulfonaniide, N,N dicarboxyethyl benzene sulfonamide, Z-naphthalene monosulfonic acid, 1,5-naphthalene disulfonic acid, 2,7-naphthalene disulfonic acid, 1,5-naphthalene disulfonic acid nickel salt, 2,7-naphthalene disulfonic acid nickel salt, naphthalene trisulfonic acid, naphthalene trisulfonic acid trisodium salt, diphenyl pp disuifonic acid, 2-naphthol-3,6-disulfonic acid, Z-naphthol- 3,6-disulfonic acid sodium salt, l-naphthylamine 3,6,8- trisulfonic acid, thiophene sulfonic acid, sodium thiophene sulf
  • a process for producing bright nickel deposits which comprises electrodepositing nickel from an aqueous acidic solution of at least one nickel salt in which there is dissolved from about 0.1 to about 1 gram per liter of 2-butynel,4-diol and from about 1 to about 40 grams per liter of a water-soluble aromatic sulfonic acid.
  • a process for producing bright nickel deposits which comprises electrodepositing nickel from an aqueous acidic solution of at least one nickel salt in which there is dissolved from about 0.1 to about 1 gram per liter of 2-butync-l,4-diol and from about 1 to about 40 grams per liter of a water-soluble salt selected from the group consisting of alkali metal, ammonium, magnesium and nickel salts of an aromatic sulfonic acid.

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
US344481A 1953-03-24 1953-03-24 Bright nickel plating Expired - Lifetime US2712522A (en)

Priority Applications (6)

Application Number Priority Date Filing Date Title
NLAANVRAGE7805347,A NL185994B (nl) 1953-03-24 Koppelingskop voor een persluchtleiding.
IT513086D IT513086A (en, 2012) 1953-03-24
US344481A US2712522A (en) 1953-03-24 1953-03-24 Bright nickel plating
GB21895/53A GB747908A (en) 1953-03-24 1953-08-07 Improvements in bright nickel plating
FR1096351D FR1096351A (fr) 1953-03-24 1954-02-18 Procédé de formation de dépôts électrolytiques de nickel brillant
DEH19752A DE1063003B (de) 1953-03-24 1954-03-24 Verfahren zur elektrolytischen Herstellung hochglaenzender Nickelueberzuege

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US344481A US2712522A (en) 1953-03-24 1953-03-24 Bright nickel plating

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US (1) US2712522A (en, 2012)
DE (1) DE1063003B (en, 2012)
FR (1) FR1096351A (en, 2012)
GB (1) GB747908A (en, 2012)
IT (1) IT513086A (en, 2012)
NL (1) NL185994B (en, 2012)

Cited By (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2800440A (en) * 1955-10-04 1957-07-23 Udylite Res Corp Electrodeposition of nickel
US2800442A (en) * 1955-10-04 1957-07-23 Udylite Res Corp Electrodeposition of nickel
US2800441A (en) * 1955-10-04 1957-07-23 Udylite Res Corp Electrodeposition of nickel
US2818376A (en) * 1956-12-28 1957-12-31 Hanson Van Winkle Munning Co Nickel plating
US2836549A (en) * 1955-01-21 1958-05-27 Elechem Corp Nickel plating bath containing acetylenic polyamines
US2849353A (en) * 1955-02-08 1958-08-26 Hanson Van Winkle Munning Co Bright nickel plating
US2879211A (en) * 1956-11-16 1959-03-24 Hanson Van Winkle Munning Co Electroplating duplex nickel coatings
US2970425A (en) * 1956-05-21 1961-02-07 Walter A Kluttz Plated spinning ring and method of making same
US2986500A (en) * 1959-04-21 1961-05-30 Metal & Thermit Corp Electrodeposition of bright nickel
US3002903A (en) * 1958-09-26 1961-10-03 Hanson Van Winkle Munning Co Electrodeposition of nickel
US3002902A (en) * 1958-09-26 1961-10-03 Hanson Van Winkle Munning Co Electrodeposition of nickel
US3002904A (en) * 1958-09-26 1961-10-03 Hanson Van Winkle Munning Co Electrodeposition of nickel
US3006822A (en) * 1957-05-08 1961-10-31 Langbein Pfanhauser Werke Ag Electro-deposition of nickel coatings
US3041256A (en) * 1960-07-12 1962-06-26 Hanson Van Winkle Munning Co Electrodeposition of nickel
US3054733A (en) * 1957-06-05 1962-09-18 Langbein Pfanhauser Werke Ag Composition for the electrolytic deposition of well levelled and ductile nickel coatings of mirror-like luster
US3095362A (en) * 1960-11-21 1963-06-25 Incar Inc Zinc plating composition and process
US3111466A (en) * 1959-03-11 1963-11-19 Hanson Van Winkle Munning Co Electrodeposition of nickel
US3152975A (en) * 1961-02-07 1964-10-13 Hanson Van Winkle Munning Co Electrodeposition of nickel
US3219559A (en) * 1958-04-23 1965-11-23 Barnet D Ostrow Additive for level nickel plating
US3255096A (en) * 1963-11-01 1966-06-07 Harshaw Chem Corp Electrodeposition of nickel
DE1221873B (de) * 1961-07-08 1966-07-28 Dehydag Gmbh Galvanische Nickelbaeder
US3305462A (en) * 1965-09-02 1967-02-21 Barnet D Ostrow Acid nickel electroplating bath
US3305461A (en) * 1963-08-23 1967-02-21 Barnet D Ostrow Nickel electroplating bath with additives
US3366557A (en) * 1958-07-22 1968-01-30 Hanson Van Winkle Munning Co Electrodeposition of nickel
US3414491A (en) * 1965-10-22 1968-12-03 Kewanee Oil Co Electrodeposition of nickel
US3429789A (en) * 1965-10-19 1969-02-25 Lea Ronal Inc Carbamate containing acid nickel plating bath
US3506548A (en) * 1966-09-23 1970-04-14 Allied Res Prod Inc Electrodeposition of nickel
US3779874A (en) * 1971-10-29 1973-12-18 Basf Ag Nickel electroplating baths
US4016051A (en) * 1975-05-02 1977-04-05 Starlite Chemicals, Inc. Additives for bright plating nickel, cobalt and nickel-cobalt alloys
US4416741A (en) * 1981-03-06 1983-11-22 Langbein-Pfanhauser Werke Ag Method and bath for the electrodeposition of palladium/nickel alloys
US20080308429A1 (en) * 2007-06-18 2008-12-18 Cvrd Inco Limited Method for improving cathode morphology

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4221970C2 (de) * 1992-06-30 1996-01-18 Atotech Deutschland Gmbh Verfahren zur Vermeidung der Halogengasentwicklung in Metallabscheidungsbädern mit mindestens zwei Elektrolyträumen

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE499729A (en, 2012) * 1950-09-27 1951-03-16 Kampschulte & Cie Dr W

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2635076A (en) * 1947-01-29 1953-04-14 Harshaw Chem Corp Bright nickel plating
DE863159C (de) * 1950-09-11 1953-01-15 Hydrierwerke A G Deutsche Verfahren zur Erzeugung festhaftender und glaenzender galvanischer Metallueberzuege
DE874100C (de) * 1952-01-01 1953-04-20 Guenter Mueschenig Verfahren zur elektrolytischen Herstellung hochglaenzender Kupferschichten aus cyanalkalischen Baedern

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE499729A (en, 2012) * 1950-09-27 1951-03-16 Kampschulte & Cie Dr W

Cited By (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2836549A (en) * 1955-01-21 1958-05-27 Elechem Corp Nickel plating bath containing acetylenic polyamines
US2849353A (en) * 1955-02-08 1958-08-26 Hanson Van Winkle Munning Co Bright nickel plating
US2800440A (en) * 1955-10-04 1957-07-23 Udylite Res Corp Electrodeposition of nickel
US2800441A (en) * 1955-10-04 1957-07-23 Udylite Res Corp Electrodeposition of nickel
US2800442A (en) * 1955-10-04 1957-07-23 Udylite Res Corp Electrodeposition of nickel
US2970425A (en) * 1956-05-21 1961-02-07 Walter A Kluttz Plated spinning ring and method of making same
US2879211A (en) * 1956-11-16 1959-03-24 Hanson Van Winkle Munning Co Electroplating duplex nickel coatings
US2818376A (en) * 1956-12-28 1957-12-31 Hanson Van Winkle Munning Co Nickel plating
US3006822A (en) * 1957-05-08 1961-10-31 Langbein Pfanhauser Werke Ag Electro-deposition of nickel coatings
US3054733A (en) * 1957-06-05 1962-09-18 Langbein Pfanhauser Werke Ag Composition for the electrolytic deposition of well levelled and ductile nickel coatings of mirror-like luster
US3219559A (en) * 1958-04-23 1965-11-23 Barnet D Ostrow Additive for level nickel plating
US3366557A (en) * 1958-07-22 1968-01-30 Hanson Van Winkle Munning Co Electrodeposition of nickel
US3002903A (en) * 1958-09-26 1961-10-03 Hanson Van Winkle Munning Co Electrodeposition of nickel
US3002902A (en) * 1958-09-26 1961-10-03 Hanson Van Winkle Munning Co Electrodeposition of nickel
US3002904A (en) * 1958-09-26 1961-10-03 Hanson Van Winkle Munning Co Electrodeposition of nickel
US3111466A (en) * 1959-03-11 1963-11-19 Hanson Van Winkle Munning Co Electrodeposition of nickel
US2986500A (en) * 1959-04-21 1961-05-30 Metal & Thermit Corp Electrodeposition of bright nickel
US3041256A (en) * 1960-07-12 1962-06-26 Hanson Van Winkle Munning Co Electrodeposition of nickel
US3095362A (en) * 1960-11-21 1963-06-25 Incar Inc Zinc plating composition and process
US3152975A (en) * 1961-02-07 1964-10-13 Hanson Van Winkle Munning Co Electrodeposition of nickel
DE1221873B (de) * 1961-07-08 1966-07-28 Dehydag Gmbh Galvanische Nickelbaeder
US3305461A (en) * 1963-08-23 1967-02-21 Barnet D Ostrow Nickel electroplating bath with additives
US3255096A (en) * 1963-11-01 1966-06-07 Harshaw Chem Corp Electrodeposition of nickel
US3305462A (en) * 1965-09-02 1967-02-21 Barnet D Ostrow Acid nickel electroplating bath
US3429789A (en) * 1965-10-19 1969-02-25 Lea Ronal Inc Carbamate containing acid nickel plating bath
US3414491A (en) * 1965-10-22 1968-12-03 Kewanee Oil Co Electrodeposition of nickel
US3506548A (en) * 1966-09-23 1970-04-14 Allied Res Prod Inc Electrodeposition of nickel
US3779874A (en) * 1971-10-29 1973-12-18 Basf Ag Nickel electroplating baths
US4016051A (en) * 1975-05-02 1977-04-05 Starlite Chemicals, Inc. Additives for bright plating nickel, cobalt and nickel-cobalt alloys
US4416741A (en) * 1981-03-06 1983-11-22 Langbein-Pfanhauser Werke Ag Method and bath for the electrodeposition of palladium/nickel alloys
US20080308429A1 (en) * 2007-06-18 2008-12-18 Cvrd Inco Limited Method for improving cathode morphology
WO2008154722A1 (en) * 2007-06-18 2008-12-24 Vale Inco Limited Method for improving nickel cathode morphology
JP2010525170A (ja) * 2007-06-18 2010-07-22 ヴァーレ、インコ、リミテッド カソード構造を改良する方法

Also Published As

Publication number Publication date
GB747908A (en) 1956-04-18
IT513086A (en, 2012)
NL185994B (nl)
DE1063003B (de) 1959-08-06
FR1096351A (fr) 1955-06-20

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