US2615857A - Polyethylene-polyisobutylene composition - Google Patents

Polyethylene-polyisobutylene composition Download PDF

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Publication number
US2615857A
US2615857A US134784A US13478449A US2615857A US 2615857 A US2615857 A US 2615857A US 134784 A US134784 A US 134784A US 13478449 A US13478449 A US 13478449A US 2615857 A US2615857 A US 2615857A
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United States
Prior art keywords
polyethylene
per cent
molecular weight
potting
composition
Prior art date
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Expired - Lifetime
Application number
US134784A
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English (en)
Inventor
Walter J Clarke
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AT&T Corp
Original Assignee
Bell Telephone Laboratories Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to NL78456D priority Critical patent/NL78456C/xx
Priority to BE500203D priority patent/BE500203A/xx
Priority to NL6904900.A priority patent/NL157875B/nl
Application filed by Bell Telephone Laboratories Inc filed Critical Bell Telephone Laboratories Inc
Priority to US134784A priority patent/US2615857A/en
Priority to FR1027943D priority patent/FR1027943A/fr
Priority to GB31023/50A priority patent/GB697805A/en
Application granted granted Critical
Publication of US2615857A publication Critical patent/US2615857A/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/12—Protection against corrosion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
    • B29C70/68—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts by incorporating or moulding on preformed parts, e.g. inserts or layers, e.g. foam blocks
    • B29C70/70—Completely encapsulating inserts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
    • B29C70/68—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts by incorporating or moulding on preformed parts, e.g. inserts or layers, e.g. foam blocks
    • B29C70/84—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts by incorporating or moulding on preformed parts, e.g. inserts or layers, e.g. foam blocks by moulding material on preformed parts to be joined
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
    • C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
    • C08L23/04—Homopolymers or copolymers of ethene
    • C08L23/06—Polyethene
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
    • C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
    • C08L23/18—Homopolymers or copolymers of hydrocarbons having four or more carbon atoms
    • C08L23/20—Homopolymers or copolymers of hydrocarbons having four or more carbon atoms having four to nine carbon atoms
    • C08L23/22—Copolymers of isobutene; Butyl rubber ; Homo- or copolymers of other iso-olefins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/20—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances liquids, e.g. oils
    • H01B3/22—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances liquids, e.g. oils hydrocarbons
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/20—Dielectrics using combinations of dielectrics from more than one of groups H01G4/02 - H01G4/06
    • H01G4/22—Dielectrics using combinations of dielectrics from more than one of groups H01G4/02 - H01G4/06 impregnated
    • H01G4/221—Dielectrics using combinations of dielectrics from more than one of groups H01G4/02 - H01G4/06 impregnated characterised by the composition of the impregnant
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2023/00—Use of polyalkenes or derivatives thereof as moulding material
    • B29K2023/04—Polymers of ethylene
    • B29K2023/06—PE, i.e. polyethylene
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
    • B29L2031/3406—Components, e.g. resistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49169—Assembling electrical component directly to terminal or elongated conductor
    • Y10T29/49171—Assembling electrical component directly to terminal or elongated conductor with encapsulating

Definitions

  • This invention relates to novel compositions useful for potting or embedding electrical apparatus.
  • novel compositions of the present invention are particularly adapted to the potting of mechanically delicate and chemically sensitive apparatus such as germanium point contact rectifiers and transistors.
  • Such point contact rectifiers or transistors may be made up of a body of germanium, or silicon, to which one or more electrical contacts are made by means of fine pointed wires, held frictionally, or otherwise, against the body. Since displacement of these wires on the surface of the body may result in defective or inoperative devices, it is necessary that some means be employed to prevent such displacement by the jarrin incident to manufacture and handling.
  • the potting material must be capable of being reduced to a highly fluid state upon being heated to a moderately elevated temperature so that it can be poured into the container and caused to fill all the space in and around the device quickly and without the application of pressure. It must harden to a non-fluid state upon coolin to ordinary temperatures and must do so without setting up objectionable mechanical stresses which would tend to injure the device. It must be capable of withstanding the entire temperature range to which the device will be subjected in normal use, as from -40 C. to +85 C., without cracking, flowing or setting up undue mechanical stress.
  • the potting compounds of the present invention possess this requisite combination of properties to a greater degree than any material hitherto suggested for this purpose to applicants knowledge.
  • These compounds are, at ordinary temperatures, gels of normally solid ethylene polymers (polyethylene) in a normally liquid butene polymer (polybutene, or particularly polyisobutylene) Since these potting compounds are true gels and, therefore, possess finite static shear strengths, they will not fiow except upon the exerting of a finite pressure, as contrasted with extremely viscous liquids which, although giving the appearance of rigidity, nevertheless have the zero static shear strength which is characteristic of liquids and, therefore, flow under infinitesimal pressure if given suflicient time.
  • potting compounds may be contrasted with solids, on the other hand, in that they are soft and plastic and are, therefore, much more readily and permanently deformable under stress so that they do not set up undesirable mechanical strains and do not crack with temperature change.
  • these potting compounds are nonfiuid gels in the normal operating temperature range of the electrical apparatus, they are readily reduced to completely homogeneous liquids of sufficiently low viscosity to permit ready impregnation by heating to a moderately elevated temperature, such as slightly above C.
  • a moderately elevated temperature such as slightly above C.
  • the components of the potting compounds of the present invention are stable hydrocarbons which are available commercially in a form in which they are free from electrolyte impurities and possess excellent electrical properties. They are chemically inert and, therefore, they exert no undesirable corrosive effect upon the electrical apparatus and they do not degrade even the sensitive germanium surface in germanium rectifiers. v i
  • a wafer l of rectifier material such as germanium
  • the base 2 is screwed into one end of an internally threaded container 3.
  • an externally threaded, electrically insulating sleeve 0. through the center of which passes an electrically conducting lead 5 on the end of which is mounted a pointed contact wire so situated that its pointed end makes electrical contact with the surface of the wafer i
  • the space defined by the container 3 and the members closing each end is filled with the gel potting compound 7' described above.
  • This potting compound is applied by heating it to a temperature sufficient to convert it to a homogeneous liquid and it is poured into the opening 3 until the space is filled. The compound is then allowed to cool and to gel to its non-fluid state.
  • Devices of this type have been subjected to three drops from a height of 60 inches at room temperature without injury and have also withstood iive cycles from 55 C. to +80 C. without injury.
  • a very suitable potting gel according to the present invention is made up of 7.5 per cent by weight of polyethylene having a molecular weight of about 12,000, as determined by the Staudinger method, 92 cent polyisobutylene having a molecular weight of about 3,000 and 0.5 per cent of an antioxidant, such as polymerized trimethyl dihydroquinoline.
  • This composition is prepared by mixing the ingredients together at a tempera-- ture above the melting point of the polyethylene, such as 130 C. to 135 C., until a clear homogeneous mass is obtained.
  • Soft gels suitable for the present invention can be formed in similar manner from other low molecular weight polyethylenes having a molecular weight between 4,000 and 15,000 or preferably between 7,000 and 15,000. Any viscous liquid polybutene, as of molecular weight between 2,000 and 7,000, or preferably between 2,000 and 5,000, may be used. Particularly when the mixture is to be maintained at elevated temperatures in its state in contact with air, it is desirable that an antioxidant in suitable amount, as from 0.1 per cent to 1 per cent be added.
  • the gels of the present invention may be formed with widely varying proportions of polyethylene and polybutene.
  • the amount of polyethylene in the gel is between per cent and 35 per cent although gels of satisfactory properties may be produced when the amount of polyethylene is as high as 90 per cent, particularly when the lower molecular weight polyethylenes are used.
  • the remainder of the composition, aside from the antioxidant, if any, is polybutene, as discussed above, and therefore the proportions of this ingredient vary preferably from 65 per cent to 95 per cent, although as little as 10 per cent may be present.
  • Examples of other of the gels of the present invention are one formed from 90 per cent of polyethylene of molecular weight of about 4,000 and 10 per cent of polyisobutylene of molecular weight of about 3,000, together with 0.5 per cent of antioxidant added to this'mixture, and one formed from 60 per cent of polyethylene of molecular weight of about 7,000 and 40 per cent of polyisobutylene of molecular weight of about 3,000, together with 0.5 per cent of antioxidant added to this mixture.
  • a composition consisting essentially of a gel of between about 5 per cent and about 35 per cent of polyethylene having a molecular weight between about 4,000 and about 15,000 and the remainder a viscous, liquid polyisobutylene having a molecular weight between about 2,000 and about 7,000.
  • composition as described in claim 1 wherein the composition contains an antioxidant.
  • a composition consisting essentially of about 7.5 per cent of polyethylene of molecular weight of about 12,000 and the remainder po1yisobuty1- one or" molecular weight of about 3,000.
  • composition as described in claim 3 wherein the composition contains an antioxidant.
  • composition as described in claim 4 wherein the antioxidant is 0.5 per cent of polymerized trimethyl dihydroquinoline.
US134784A 1949-12-23 1949-12-23 Polyethylene-polyisobutylene composition Expired - Lifetime US2615857A (en)

Priority Applications (6)

Application Number Priority Date Filing Date Title
NL78456D NL78456C (nl) 1949-12-23
BE500203D BE500203A (nl) 1949-12-23
NL6904900.A NL157875B (nl) 1949-12-23 Vulelement voor een tegendrukvulinrichting.
US134784A US2615857A (en) 1949-12-23 1949-12-23 Polyethylene-polyisobutylene composition
FR1027943D FR1027943A (fr) 1949-12-23 1950-11-21 Matière d'enrobage ou d'imprégnation
GB31023/50A GB697805A (en) 1949-12-23 1950-12-20 Compositions suitable for filling electrical apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US134784A US2615857A (en) 1949-12-23 1949-12-23 Polyethylene-polyisobutylene composition

Publications (1)

Publication Number Publication Date
US2615857A true US2615857A (en) 1952-10-28

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Family Applications (1)

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US134784A Expired - Lifetime US2615857A (en) 1949-12-23 1949-12-23 Polyethylene-polyisobutylene composition

Country Status (5)

Country Link
US (1) US2615857A (nl)
BE (1) BE500203A (nl)
FR (1) FR1027943A (nl)
GB (1) GB697805A (nl)
NL (2) NL78456C (nl)

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2697268A (en) * 1950-12-30 1954-12-21 Sylvania Electric Prod Diode fabricating apparatus
US2726357A (en) * 1952-10-22 1955-12-06 Columbia Broadcasting Syst Inc Semiconductor device
US2768100A (en) * 1953-09-30 1956-10-23 Bell Telephone Labor Inc Surface treatment of germanium circuit elements
US2785349A (en) * 1951-06-08 1957-03-12 Int Standard Electric Corp Electric semi-conducting devices
US2924584A (en) * 1956-06-20 1960-02-09 Du Pont Composition comprising polyethylene and an ethylenically unsaturated aliphatic hydrocarbon of 20-35 carbon atoms and article thereof
US2993028A (en) * 1957-06-18 1961-07-18 Montedison Spa Isotactic polypropylene-polyisobutene blend and method for making same
US3132104A (en) * 1959-04-07 1964-05-05 Rockwell Mfg Co Plug valve lubricant and sealant compositions
US3283890A (en) * 1964-06-22 1966-11-08 United Shoe Machinery Corp Thermoplastic adhesive rods or strips
US3484533A (en) * 1966-09-29 1969-12-16 Texas Instruments Inc Method for fabricating semiconductor package and resulting article of manufacture
US3526522A (en) * 1967-10-18 1970-09-01 Gillette Co Ink follower composition and method therefor
US3656857A (en) * 1967-10-18 1972-04-18 Gillette Co A ball point pen ink reservoir containing an improved ink follower
US3964010A (en) * 1974-03-16 1976-06-15 Okazaki Tasuku Simple, small-sized fuse
US4622344A (en) * 1984-03-05 1986-11-11 Bend Research, Inc. Recovery of ammoniacal copper with novel organogels
US4771534A (en) * 1987-10-16 1988-09-20 Mold-Masters Limited Method of manufacture of injection molding nozzle electrical terminal
US5232113A (en) * 1991-10-11 1993-08-03 Aluminum Company Of America Venting resealable container closure and associated method of manufacture
US6028126A (en) * 1996-07-25 2000-02-22 Bic Corporation Ink follower compositions

Citations (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1934297A (en) * 1929-12-31 1933-11-07 Consortium Elektrochem Ind Compounds of polymerized vinyl esters and fatty oils
US1980483A (en) * 1931-11-17 1934-11-13 Ici Ltd Resin and resin forming compound
US2064752A (en) * 1934-03-12 1936-12-15 Monsanto Chemicals Preservation of rubber
US2129722A (en) * 1934-07-14 1938-09-13 Du Pont Esters of methacrylic acid
US2274031A (en) * 1938-02-25 1942-02-24 Standard Oil Dev Co Insulated electrical conductor
US2339958A (en) * 1939-09-14 1944-01-25 Jasco Inc Composition of matter containing polyethylene and polyisobutylene
US2342116A (en) * 1938-06-28 1944-02-22 Int Cigar Mach Co Vibrating feed for cigar machines
US2406405A (en) * 1941-05-19 1946-08-27 Sperry Gyroscope Co Inc Coaxial condenser crystal and method of making same
US2414300A (en) * 1943-02-02 1947-01-14 Callenders Cable & Const Co Electrical insulating compounds
US2432594A (en) * 1942-08-26 1947-12-16 Union Switch & Signal Co Rectifying detector for high-frequency alternating electric currents
US2435245A (en) * 1944-02-05 1948-02-03 Du Pont Stabilized polymers of ethylene
US2462977A (en) * 1945-03-28 1949-03-01 Western Union Telegraph Co Cable joint
US2472938A (en) * 1943-11-08 1949-06-14 Gen Electric Co Ltd Point-contact rectifier
US2475641A (en) * 1946-10-29 1949-07-12 John Archer Carter Prompting system

Patent Citations (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1934297A (en) * 1929-12-31 1933-11-07 Consortium Elektrochem Ind Compounds of polymerized vinyl esters and fatty oils
US1980483A (en) * 1931-11-17 1934-11-13 Ici Ltd Resin and resin forming compound
US2064752A (en) * 1934-03-12 1936-12-15 Monsanto Chemicals Preservation of rubber
US2129722A (en) * 1934-07-14 1938-09-13 Du Pont Esters of methacrylic acid
US2274031A (en) * 1938-02-25 1942-02-24 Standard Oil Dev Co Insulated electrical conductor
US2342116A (en) * 1938-06-28 1944-02-22 Int Cigar Mach Co Vibrating feed for cigar machines
US2339958A (en) * 1939-09-14 1944-01-25 Jasco Inc Composition of matter containing polyethylene and polyisobutylene
US2406405A (en) * 1941-05-19 1946-08-27 Sperry Gyroscope Co Inc Coaxial condenser crystal and method of making same
US2432594A (en) * 1942-08-26 1947-12-16 Union Switch & Signal Co Rectifying detector for high-frequency alternating electric currents
US2414300A (en) * 1943-02-02 1947-01-14 Callenders Cable & Const Co Electrical insulating compounds
US2472938A (en) * 1943-11-08 1949-06-14 Gen Electric Co Ltd Point-contact rectifier
US2435245A (en) * 1944-02-05 1948-02-03 Du Pont Stabilized polymers of ethylene
US2462977A (en) * 1945-03-28 1949-03-01 Western Union Telegraph Co Cable joint
US2475641A (en) * 1946-10-29 1949-07-12 John Archer Carter Prompting system

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2697268A (en) * 1950-12-30 1954-12-21 Sylvania Electric Prod Diode fabricating apparatus
US2785349A (en) * 1951-06-08 1957-03-12 Int Standard Electric Corp Electric semi-conducting devices
US2726357A (en) * 1952-10-22 1955-12-06 Columbia Broadcasting Syst Inc Semiconductor device
US2768100A (en) * 1953-09-30 1956-10-23 Bell Telephone Labor Inc Surface treatment of germanium circuit elements
US2924584A (en) * 1956-06-20 1960-02-09 Du Pont Composition comprising polyethylene and an ethylenically unsaturated aliphatic hydrocarbon of 20-35 carbon atoms and article thereof
US2993028A (en) * 1957-06-18 1961-07-18 Montedison Spa Isotactic polypropylene-polyisobutene blend and method for making same
US3132104A (en) * 1959-04-07 1964-05-05 Rockwell Mfg Co Plug valve lubricant and sealant compositions
US3283890A (en) * 1964-06-22 1966-11-08 United Shoe Machinery Corp Thermoplastic adhesive rods or strips
US3484533A (en) * 1966-09-29 1969-12-16 Texas Instruments Inc Method for fabricating semiconductor package and resulting article of manufacture
US3526522A (en) * 1967-10-18 1970-09-01 Gillette Co Ink follower composition and method therefor
US3656857A (en) * 1967-10-18 1972-04-18 Gillette Co A ball point pen ink reservoir containing an improved ink follower
US3964010A (en) * 1974-03-16 1976-06-15 Okazaki Tasuku Simple, small-sized fuse
US4622344A (en) * 1984-03-05 1986-11-11 Bend Research, Inc. Recovery of ammoniacal copper with novel organogels
US4771534A (en) * 1987-10-16 1988-09-20 Mold-Masters Limited Method of manufacture of injection molding nozzle electrical terminal
US5232113A (en) * 1991-10-11 1993-08-03 Aluminum Company Of America Venting resealable container closure and associated method of manufacture
US6028126A (en) * 1996-07-25 2000-02-22 Bic Corporation Ink follower compositions

Also Published As

Publication number Publication date
NL78456C (nl)
GB697805A (en) 1953-09-30
FR1027943A (fr) 1953-05-18
NL157875B (nl)
BE500203A (nl)

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