US2577365A - Rhodium plating - Google Patents

Rhodium plating Download PDF

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Publication number
US2577365A
US2577365A US44979A US4497948A US2577365A US 2577365 A US2577365 A US 2577365A US 44979 A US44979 A US 44979A US 4497948 A US4497948 A US 4497948A US 2577365 A US2577365 A US 2577365A
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US
United States
Prior art keywords
rhodium
electrolyte
acid
lead
per liter
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
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US44979A
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English (en)
Inventor
Reid Frank Herbert
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Huntington Alloys Corp
Original Assignee
International Nickel Co Inc
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Filing date
Publication date
Application filed by International Nickel Co Inc filed Critical International Nickel Co Inc
Application granted granted Critical
Publication of US2577365A publication Critical patent/US2577365A/en
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Classifications

    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/50Electroplating: Baths therefor from solutions of platinum group metals

Definitions

  • the electrodeposition of rhodium onto other metals for decorative or tarnish-resisting purposes is commonly effected with the use of electrolytes of the kind containin as the essential constituent rhodium sulphate or rhodium phosphate or a mixture of those two compounds together with varying proportions of free sulphuric acid or free phosphoric acid or a mixture thereof.
  • the free acid is necessary to prevent hydrolysis of the rhodium compounds in the electrolyte with consequent precipitation of rhodium hydroxide.
  • An object of this invention is to provide a rhodium-plating process by which light deposits thicker than the prior art deposits can be produced.
  • Another object of this invention is to produce improved rhodium deposits by means of a critical amount of lead in the electrolyte.
  • a further object of the invention is to provide a novel lead-containing electrolyte for use in rhodium plating.
  • the amount of lead lies between 0.001 and 0.02 gram per liter. Below a concentration of 0.001 gram per liter the lead is practically inefiective in increasing the thickness before milkiness appears and if the lead concentration exceeds 0,02
  • the deposits tend to show milky streaks at thicknesses little, if any, greater than when no lead is used.
  • rhodium concentration 2 grams per liter of electrolyte, a current density of from 2 to 4 amperes per square decimeter and an operating temperature of from room temperature to about C. but more usually from 35 to 45 C.
  • the rhodium concentration may vary between, say, about 0.5 and about 5 grams per liter. The free acid must always be enough to prevent hydrolysis of rhodium compounds, as those skilled in the art will understand.
  • EXAMPLE I An electrolyte of the phosphate-sulphate type was prepared by dissolving rhodium hydroxide in phosphoric acid and adding the phosphate solution to dilute sulphuric acid, the resulting solution containing 2 grams of rhodium per liter andZO milliliters of concentrated sulphuric acid per liter. On working with a current density of 4 amps./dm. the results shown in Table I were obtained.
  • An electrolyte of the phosphate type was prepared by dissolving rhodium hydroxide in phosphoric acid and diluting the solution to give a concentration of 2 grams of rhodium per liter and milliliters of phosphoric acid per liter. This solution was electrolysed with a current density of 4 amps./dm. and gave the results shown in- Table III.
  • the metals onto which rhodium may be plated according to the invention are any that are compatible with the acid electrolytes and include, besides nickel, nickel silver, gold, platinum, palladium, copper and brass.
  • said electrolyte with about 0.5 to about 5 grams per liter of rhodium, free acid from the group consisting of sulfuric acid and phosphoric acid in an amount suflicient to 1 vent hydroysis of the rhodium compound but not exceeding about 20 milliliters per liter of electrolyte with the balance essentially water; the improvement which comprises incorporating in said electrolyte about 0.001 to about 0.02 gram of lead as an acid-soluble lead compound whereby" thick, bright rhodium electro-deposits are obtained on metal surfaces by employing the aforesaid lead-containing acid electrolyte.
  • a process for the production of thick, bright electroplates or rhodium onto metal which comprises establishing a rhodium-plating electrolyte consisting essentially of an aqueous acid solution of a rhodium salt from the. group consisting of rhodium sulfate and rhodium phosphate such that said solution contains about 0.5 to 5 grams of rhodium per liter, acid from the group consisting of sulfuric acid and phosphoric acid in an amount suflicient to prevent hydrolysis of said rhodium but not exceeding more than about20 milliliters, per liter, about 0.061 to about 0.02 gram per liter of lead added as a soluble lead compound; and electrolytically depositing rhodium from said electrolyte onto said metal at a current density from about 2 to about 4 a l-- peres per square decimeter and at a temperature between about room temperature and about 66 C. to produce thick, bright, rhodium electro-depc
  • An electrolyte for use in obtaining bright electro-deposits of rhodium on metal which comprises an acid bath containing at least one rhodium compound from the group consisting of rhodium sulfate and rhodium phosphatelin an amount to provide about 0.5 to about 5 grams per liter of rhodium, acid from the group consisting of sulfuric acid and phosphoric acid in an amount suflicient to prevent hydrolysis of the rhodium compound but not exceeding about 20 milliliters per liter of electrolyte, at least one soluble lead compound in an amount toprovide aboutl0.001 to about 0.02 gram per liter of lead, with the balance essentially water, whereby thick, brightv rhodium electro-deposits can be obtained on metal surfaces when employing the aforesaid lead-containing aqueous acid bath in electro-depositing rhodium onto metal surfaces.
  • An electrolyte for use in obtaining bright electro-deposits of rhodium on metal which consists essentially of an aqueous acid solutions of a material from the group consisting of rhodium sulfate and rhodium phosphate in an amount provide about 2 grams per liter of rhodium, acid from the group'consisting ofsulfuric acid and phosphoric acid in an amount sufilcient to preventhydrolysis of the rhodium compound but 5 6 not exceeding about 20- milliliters per liter of UNITED STATES PATENTS electrolyte, and at least one soluble lead com Number Name Date pound in an amount to provide about 0.001 to 1,981,820 Zimmerman 20, 1934 about 0.02 gram per liter of lead.

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
US44979A 1947-08-19 1948-08-18 Rhodium plating Expired - Lifetime US2577365A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB23023/47A GB626430A (en) 1947-08-19 1947-08-19 Improvements relating to rhodium plating

Publications (1)

Publication Number Publication Date
US2577365A true US2577365A (en) 1951-12-04

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Family Applications (1)

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US44979A Expired - Lifetime US2577365A (en) 1947-08-19 1948-08-18 Rhodium plating

Country Status (5)

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US (1) US2577365A (pt)
BE (1) BE484443A (pt)
DE (1) DE813914C (pt)
FR (1) FR970543A (pt)
GB (1) GB626430A (pt)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2866740A (en) * 1956-05-10 1958-12-30 Int Nickel Co Electrodeposition of rhodium
US3515651A (en) * 1966-02-07 1970-06-02 Katsuhiro Ohkubo Plating solutions for rhodium and rhodium alloy platings having low internal stress
US5156721A (en) * 1990-12-03 1992-10-20 Whewell Christopher J Process for extraction and concentration of rhodium
US5522932A (en) * 1993-05-14 1996-06-04 Applied Materials, Inc. Corrosion-resistant apparatus
US5891253A (en) * 1993-05-14 1999-04-06 Applied Materials, Inc. Corrosion resistant apparatus

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3833487A (en) * 1972-12-22 1974-09-03 Bell Telephone Labor Inc Electrolytic soft gold plating
DE2329578C3 (de) * 1973-06-09 1981-11-12 Degussa Ag, 6000 Frankfurt Galvanisches Bad zum Abscheiden glänzender Rhodiumüberzüge

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1981820A (en) * 1931-08-27 1934-11-20 Baker & Co Inc Process of electrodepositing rhodium, bath and method of preparing the same
US2119304A (en) * 1935-08-01 1938-05-31 Eaton Detroit Metal Company Electroplating
US2250556A (en) * 1940-11-26 1941-07-29 United Chromium Inc Electrodeposition of copper and bath therefor
US2401331A (en) * 1944-05-29 1946-06-04 Nasa Acid rhodium plating

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1981820A (en) * 1931-08-27 1934-11-20 Baker & Co Inc Process of electrodepositing rhodium, bath and method of preparing the same
US2119304A (en) * 1935-08-01 1938-05-31 Eaton Detroit Metal Company Electroplating
US2250556A (en) * 1940-11-26 1941-07-29 United Chromium Inc Electrodeposition of copper and bath therefor
US2401331A (en) * 1944-05-29 1946-06-04 Nasa Acid rhodium plating

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2866740A (en) * 1956-05-10 1958-12-30 Int Nickel Co Electrodeposition of rhodium
US3515651A (en) * 1966-02-07 1970-06-02 Katsuhiro Ohkubo Plating solutions for rhodium and rhodium alloy platings having low internal stress
US5156721A (en) * 1990-12-03 1992-10-20 Whewell Christopher J Process for extraction and concentration of rhodium
US5522932A (en) * 1993-05-14 1996-06-04 Applied Materials, Inc. Corrosion-resistant apparatus
US5593541A (en) * 1993-05-14 1997-01-14 Applied Materials, Inc. Method of manufacturing using corrosion-resistant apparatus comprising rhodium
US5891253A (en) * 1993-05-14 1999-04-06 Applied Materials, Inc. Corrosion resistant apparatus

Also Published As

Publication number Publication date
FR970543A (fr) 1951-01-05
BE484443A (pt)
GB626430A (en) 1949-07-14
DE813914C (de) 1951-09-17

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