US20230204299A1 - Liquid-in and vapor-out composite liquid-vapor phase conversion heat dissipation device - Google Patents
Liquid-in and vapor-out composite liquid-vapor phase conversion heat dissipation device Download PDFInfo
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- US20230204299A1 US20230204299A1 US18/076,690 US202218076690A US2023204299A1 US 20230204299 A1 US20230204299 A1 US 20230204299A1 US 202218076690 A US202218076690 A US 202218076690A US 2023204299 A1 US2023204299 A1 US 2023204299A1
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 25
- 239000002131 composite material Substances 0.000 title claims abstract description 21
- 238000006243 chemical reaction Methods 0.000 title claims abstract description 20
- 239000012808 vapor phase Substances 0.000 title claims abstract description 20
- 239000007788 liquid Substances 0.000 claims abstract description 68
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 29
- 239000002184 metal Substances 0.000 claims description 5
- 229910052751 metal Inorganic materials 0.000 claims description 5
- 239000002245 particle Substances 0.000 claims description 3
- 238000005245 sintering Methods 0.000 claims 1
- 239000012530 fluid Substances 0.000 description 50
- 238000001704 evaporation Methods 0.000 description 13
- 230000008020 evaporation Effects 0.000 description 13
- 239000000463 material Substances 0.000 description 8
- 229910052802 copper Inorganic materials 0.000 description 6
- 239000010949 copper Substances 0.000 description 6
- 230000005494 condensation Effects 0.000 description 5
- 238000009833 condensation Methods 0.000 description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 239000000843 powder Substances 0.000 description 4
- 229920006395 saturated elastomer Polymers 0.000 description 3
- 238000001816 cooling Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009877 rendering Methods 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
Images
Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
- F28D15/043—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure forming loops, e.g. capillary pumped loops
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
- F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
Definitions
- the present disclosure relates in general to a heat dissipation device, and more particularly, to a liquid-in and vapor-out composite liquid-vapor phase conversion heat dissipation device.
- Taiwan Patent No. 1660151 discloses a loop heat pipe having an evaporation chamber, a vapor flow tube and a liquid flow tube connected to the evaporation chamber. The vapor flow tube and the liquid flow tube are then connected to a condensation section. The evaporation chamber, the vapor flow tube, the liquid flow tube and the condensation section together form a closed circulation channel, and an appropriate amount of working fluid (such as pure water) is provided inside the circulation channel. At least a capillary material is provided inside the evaporation chamber.
- the working fluid (e.g., pure water) is set inside this circulation channel, and at least the capillary material is set inside the evaporation chamber, and the evaporation chamber is affixed to a heating element (e.g., the central processing unit (CPU) of a computer).
- the condensation section is used to dissipate heat so that the vaporized working fluid can condense into a liquid in the condensation section and flow back into the evaporation chamber.
- the aforementioned circuit heat pipe is a known technology, with technical features that focus on having the condensed working fluid in the return flow contacting the capillary material set up in the evaporation chamber in order to address the return interruption problem. Therefore, the aforementioned circuit heat pipe is not only set up in the evaporation chamber capillary material, but also extend the capillary material to the liquid flow tube and condensing section. The reason why the aforementioned loop heat pipe must be set up in this way is because of a closed-loop design. When the evaporation chamber is heated, the evaporation turns into vapor working fluid, and the gas pressure generated is often insufficient to push the condensation in the condensing section and becomes working fluid. Therefore, after the aforementioned technology extends the capillary material into the condensing section, the capillary material can be directly used to absorb water to quickly divert the liquid into the evaporation chamber.
- the liquid-in and vapor-out composite liquid-vapor phase conversion heat dissipation device in the present disclosure includes: a housing having (a) a top, a bottom and a plurality of side walls, (b) a chamber inside the housing, and (c) an inlet and an outlet which are spatially connected to the chamber respectively.
- a capillary structure which is affixed to the top, the bottom and a plurality of side walls of the housing, occupies most of the space of the chamber.
- the capillary structure fills the chamber at a predetermined distance from both the inlet and the outlet, thereby spatially separating the chamber into a liquid inlet chamber, which is spatially connected to the inlet, and a vapor outlet chamber, which is spatially connected to the outlet; and a drainage structure, located at the top surface of the bottom of the housing, and affixed to the top surface of the bottom of the housing.
- the drainage structure is partially exposed to the liquid inlet chamber without being covered by the capillary structure, and the drainage structure is used to channel liquid from the liquid inlet chamber to the capillary structure below, whereby the bottom surface of the bottom of the housing is affixed to a heat source, and the drainage structure is located above the heat source.
- the present disclosure can be connected to a liquid tube and a vapor outlet tube, from which the liquid is continuously fed into the working fluid.
- the working fluid can be continuously transformed into a vapor state and moved outward from the vapor outlet tube to provide continuous heat dissipation.
- the working fluid can enter in a liquid state and directly flow outward from the vapor outlet tube in a liquid state.
- FIG. 1 is a perspective view according to a first exemplary embodiment of the present disclosure
- FIG. 2 is a cross-sectional view along section line 2 - 2 in Figs according to the first exemplary embodiment of the present disclosure
- FIG. 3 is a cross-sectional view along section line 3 - 3 in Figs according to the first exemplary embodiment of the present disclosure
- FIG. 4 is a sectional view according to the first exemplary embodiment of the present disclosure, showing the state of the inlet and outlet with inlet receiver and outlet receiver;
- FIG. 5 is a schematic diagram of the first exemplary embodiment of the present disclosure.
- FIG. 6 is a sectional view according to a second exemplary embodiment of the present disclosure.
- liquid-in and vapor-out composite liquid-vapor phase conversion heat dissipation device 10 housing 11 ; inlet channel 118 ; outlet channel 119 ; top 12 ; bottom 13 ; sidewall 14 ;
- the first preferred embodiment of the present disclosure provides a liquid-in and vapor-out composite liquid-vapor phase conversion heat dissipation device 10 , consisting mainly of a housing 11 , a capillary structure 21 , and a drainage structure 31 .
- the housing 11 has a top 12 , a bottom 13 and a number of side walls 14 .
- the housing 11 has an internal chamber 16 , and the housing 11 has an inlet 18 and an outlet 19 which are spatially connected to the chamber 16 .
- the bottom surface of the bottom 13 of the housing 11 is used to adhere to a heat source 99 (see FIG. 5 ).
- the housing 11 is in the shape of a rectangle, so the number of the plural side walls 14 is four, and the four side walls 14 are two to two.
- the inlet 18 is for the working fluid 91 (e.g., pure water) to enter
- the outlet 19 is for the vaporized working fluid 91 to be dispersed outward.
- the outlet 19 is set at the top 12 of the housing 11 , which helps the vapor working fluid 91 to disperse outwardly through the outlet 19 by the principle of rising hot air.
- the inlet 18 may also be located on one of the side walls 14 of the housing 11 as required, since this arrangement can be directly understood from FIGS. 1 to 3 of the present disclosure, and is therefore not shown in the figures.
- an inlet channel 118 as shown in FIG. 4 can be extended outwardly from the housing 11 to correspond to the inlet 18
- an outlet channel 119 can be extended outwardly to correspond to the outlet 19 .
- FIGS. 1 to 3 show an arrangement without the inlet channel 118 and outlet channel 119 , mainly to illustrate that the present disclosure is not limited to using the inlet channel 118 and outlet channel 119 .
- the housing 11 is not limited to a rectangular shape, and therefore other shapes such as square, polygon, circular, or cylindrical can be used. Since the housing structure in different shapes is directly understandable by those skilled in the art, such is not represented or shown.
- the capillary structure 21 is affixed to the top 12 , bottom 13 and aforementioned two opposite side walls 14 of the housing 11 , thereby occupying most of the space of the chamber 16 , which is filled with the chamber 16 but at a predetermined distance from the inlet 18 and the outlet 19 .
- the capillary structure 21 is further separated from the other two opposite side walls 14 that are not attached by the predetermined distance, thus separating the chamber 16 into a liquid inlet chamber 168 and a vapor outlet chamber 169 that are not connected in space.
- the liquid inlet chamber 168 is spatially communicated with the inlet 18
- the vapor outlet chamber 169 is spatially communicated with the outlet 19 .
- the capillary structure 21 is sintered with copper powder as an example.
- the drainage structure 31 is located on the top surface of the bottom 13 of the housing 11 , and attached to the bottom of the capillary structure 21 .
- the drainage structure 31 is partially uncovered by the capillary structure 21 and is exposed to the liquid inlet chamber 168 .
- the drainage structure 31 is formed by a number of grooves 311 , and the two ends of the grooves 311 are connected to the liquid inlet chamber 168 and the vapor outlet chamber 169 , respectively.
- the grooves 311 can be formed by setting copper strips on the bottom 13 of the housing 11 and spacing them parallel to one another.
- the drainage structure 31 is located above the heat source 99 .
- the structure configuration of the first exemplary embodiment has been described above, and operational state of the first exemplary embodiment will be described hereinafter.
- the inlet 18 is connected to a liquid source 48 prior to use.
- an inlet tube 488 can be used to connect the inlet channel 118 and the liquid source 48 .
- An outlet tube 489 can be connected to the outlet channel 119 and the liquid source 48 , which provides a constant supply of working fluid 91 at a predetermined rate into the inlet 18 , which in turn provides a predetermined thrust to the working fluid 91 in the liquid inlet chamber 168 .
- the bottom surface of the bottom 13 of the housing 11 is affixed to a heat source 99 , which in FIG. 5 is the central processing unit as such as a computer.
- the liquid source 48 is driven to provide the working fluid 91 , which enters the liquid inlet chamber 168 and is then drawn in by the capillary structure 21 until the capillary structure 21 is saturated, and the working fluid 91 is diverted by the drainage structure 31 to the vapor outlet chamber 169 .
- the capillary structure 21 will occupy part of the space of the drainage structure 31 , and the working fluid 91 will have a large flow resistance to flow directly from the liquid inlet chamber 168 to the vapor outlet chamber 169 , which will cause the working fluid 91 to be saturated by the capillary structure 21 , but will not flow out from the capillary structure 21 to the vapor outlet chamber 169 without resistance.
- the working fluid 91 is saturated by the capillary structure 21 , but does not flow out from the capillary structure 21 to the vapor chamber 169 quickly without any resistance, but has only a little bit of leakage. Under such conditions, the heat emitted by the heat source 99 is conducted to the bottom 13 of the housing 11 , which heats the working fluid 91 on the drainage structure 31 , and the working fluid 91 in the vicinity of the drainage structure 31 is vaporized by the heat, and the vaporized working fluid 91 flows through the drainage structure 31 to the vapor outlet chamber 169 , and then disperses outwardly by the outlet 19 .
- the vaporized working fluid 91 is forced to flow only to the vapor outlet chamber 169 as the vaporized working fluid 91 enters the outlet tube 489 from the outlet 19 and then enters the liquid source 48 .
- the liquid source 48 is then condensed into a liquid state.
- the present disclosure provides the composite liquid-vapor phase conversion heat dissipation device that combines liquid and vapor. In this way, the present disclosure is based on the latent heat principle to dissipate heat, and has a better heat dissipation effect than the liquid cooling plate.
- a condensing chamber (not shown in the drawings) can be added to the outlet tube 489 as required to ensure that the working fluid 91 in vapor form can be condensed to a liquid state before entering the liquid source 48 .
- the condensing chamber is provided in the known circuit heat pipe and is therefore not shown in the drawings as it can be directly understood by the persons skilled in the art.
- the present disclosure uses a high heat absorption effect of the liquid state and vapor state of the working fluid 91 to dissipate heat, the amount of the working fluid 91 will not be very large because the amount of water in the process of transformation will not be very large, i.e., the supply rate of the liquid source 48 can be extremely low, and the rate of supplying the working fluid 91 only needs to be able to keep the capillary structure 21 from completely not absorbing the working fluid 91 .
- the heat source 99 as described above has a heating condition, that is, the condition of sufficient heat energy.
- the working fluid 91 will continue to leak in a liquid state into the vapor outlet chamber 169 , and will eventually fill the vapor outlet chamber 169 completely, and then flow to the outlet 19 .
- the working fluid 91 in the vicinity of the drainage structure 31 will still flow to the vapor outlet chamber 169 after being heated due to the hydraulic pressure, and the working fluid 91 in the vapor outlet chamber 169 will flow out from the outlet 19 at a higher rate than the aforementioned liquid supply rate.
- the working form of the present disclosure can be of one configuration in which the working fluid 91 enters in liquid form and the vapor flows out, or of another configuration in which the working fluid 91 enters in liquid form and still flows out in liquid form, thereby rendering the working form as a composite form.
- the present disclosure provides a second preferred embodiment of a liquid-in and vapor-out composite liquid-vapor phase conversion heat dissipation device 10 ′, which is mainly the same as the first embodiment, but differs in the following aspects.
- the capillary structure 21 ′ has two different particle sizes of copper powders 211 ′ and 212 ′, whereby the large diameter copper powders 211 ′ are located at the bottom of the capillary structure 21 ′ in contact with the drainage structure 31 ′, while the small diameter copper powders 212 ′ are the main component of the capillary structure 21 ′, and most of the small diameter copper powders 212 ′ are located above the large diameter copper powder 211 ′.
- the drainage structure 31 ′ is a metal woven mesh, which can be substantially a copper woven mesh, and the mesh of the metal woven mesh can be larger than the particle size of the large diameter copper powder 211 ′ of the capillary structure 21 ′.
- the inlet 18 ′ is provided with a check valve 189 ′ to prevent the working fluid 91 in the liquid inlet chamber 168 ′ from flowing backwards.
- the large diameter copper powder 211 ′ of the capillary structure 21 ′ is located below, a large gap can be formed together with the drainage structure 31 ′, which helps to provide more space for the vapor working fluid 91 to flow in the heated evaporated state, and therefore flowing more easily to the vapor chamber 169 ′ in the vapor state.
- the drainage structure 31 ′ is a woven metal mesh, which also provides space for the vapor working fluid 91 to flow.
- the working fluid 91 After the working fluid 91 is heated and evaporates into vapor state, the working fluid 91 will not only move to the vapor outlet chamber 169 ′, but also to the liquid inlet chamber 168 ′ from a thrust formed so the check valve 189 ′ can further provide to prevent the working fluid 91 in the liquid inlet chamber 168 ′ from flowing back into the liquid inlet tube 488 ′.
- the rest of the second exemplary embodiment is the same as the first exemplary embodiment, and will therefore not be repeated.
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Abstract
A liquid-in and vapor-out composite liquid-vapor phase conversion heat dissipation device that includes a housing with a chamber connected to an inlet and outlet; a capillary structure in the chamber for maintaining a predetermined distance from the inlet and outlet, and separating the chamber into an liquid inlet chamber and a vapor outlet chamber. The liquid inlet chamber is spatially connected to the inlet, and the vapor outlet chamber is spatially connected to the outlet. A drainage structure located at the top surface of the bottom of the housing is affixed to the bottom of the capillary structure for diverting liquid from the liquid inlet chamber to the underside of the capillary structure. The bottom surface of the bottom of the housing is affixed to a heat source, and when the heat source is attached, the drainage structure is located above the heat source.
Description
- The present disclosure relates in general to a heat dissipation device, and more particularly, to a liquid-in and vapor-out composite liquid-vapor phase conversion heat dissipation device.
- Taiwan Patent No. 1660151 discloses a loop heat pipe having an evaporation chamber, a vapor flow tube and a liquid flow tube connected to the evaporation chamber. The vapor flow tube and the liquid flow tube are then connected to a condensation section. The evaporation chamber, the vapor flow tube, the liquid flow tube and the condensation section together form a closed circulation channel, and an appropriate amount of working fluid (such as pure water) is provided inside the circulation channel. At least a capillary material is provided inside the evaporation chamber. The working fluid (e.g., pure water) is set inside this circulation channel, and at least the capillary material is set inside the evaporation chamber, and the evaporation chamber is affixed to a heating element (e.g., the central processing unit (CPU) of a computer). The condensation section is used to dissipate heat so that the vaporized working fluid can condense into a liquid in the condensation section and flow back into the evaporation chamber.
- The aforementioned circuit heat pipe is a known technology, with technical features that focus on having the condensed working fluid in the return flow contacting the capillary material set up in the evaporation chamber in order to address the return interruption problem. Therefore, the aforementioned circuit heat pipe is not only set up in the evaporation chamber capillary material, but also extend the capillary material to the liquid flow tube and condensing section. The reason why the aforementioned loop heat pipe must be set up in this way is because of a closed-loop design. When the evaporation chamber is heated, the evaporation turns into vapor working fluid, and the gas pressure generated is often insufficient to push the condensation in the condensing section and becomes working fluid. Therefore, after the aforementioned technology extends the capillary material into the condensing section, the capillary material can be directly used to absorb water to quickly divert the liquid into the evaporation chamber.
- Moreover, there is currently no design, including the known loop heat pipe which is of the closed-loop design that can provide a pre-determined pressure liquid from the outside. Even if such conventional design is modified, then the relative relationship and role of the capillary material inside the evaporation chamber would need to have a corresponding structure to match when the working fluid is heated and evaporates into vapor working fluid, and such matching structure simply does not exist in the conventional technology.
- In addition, currently there are cold plates on the market that use only liquids (i.e., liquid-in and liquid-out) to carry away the heat. Compared with the latent heat required to transform a liquid into a vapor, the amount of heat that can be carried away by a liquid cooling plate is less. Also, the temperature of the liquid will rise during the working process, so the amount of heat that can be carried away is less than the aforementioned sensible heat principle.
- It is therefore an object of the present disclosure to provide a liquid-in and vapor-out composite liquid-vapor phase conversion heat dissipation device, which can be connected to a liquid tube and a vapor outlet tube, from which the liquid is continuously fed into the working fluid, and when heated, the thermal energy can make the working fluid continuously change into a vapor state and move outward from the vapor outlet tube, so as to provide continuous heat dissipation effect. Conversely, when the heat is low, the working fluid can enter into a liquid state and directly flow outward from the vapor outlet tube in the liquid state.
- In order to achieve the above-mentioned object, the liquid-in and vapor-out composite liquid-vapor phase conversion heat dissipation device in the present disclosure includes: a housing having (a) a top, a bottom and a plurality of side walls, (b) a chamber inside the housing, and (c) an inlet and an outlet which are spatially connected to the chamber respectively. A capillary structure, which is affixed to the top, the bottom and a plurality of side walls of the housing, occupies most of the space of the chamber. Specifically, the capillary structure fills the chamber at a predetermined distance from both the inlet and the outlet, thereby spatially separating the chamber into a liquid inlet chamber, which is spatially connected to the inlet, and a vapor outlet chamber, which is spatially connected to the outlet; and a drainage structure, located at the top surface of the bottom of the housing, and affixed to the top surface of the bottom of the housing. The drainage structure is partially exposed to the liquid inlet chamber without being covered by the capillary structure, and the drainage structure is used to channel liquid from the liquid inlet chamber to the capillary structure below, whereby the bottom surface of the bottom of the housing is affixed to a heat source, and the drainage structure is located above the heat source.
- With the above technical features, the present disclosure can be connected to a liquid tube and a vapor outlet tube, from which the liquid is continuously fed into the working fluid. When the heat is high, the working fluid can be continuously transformed into a vapor state and moved outward from the vapor outlet tube to provide continuous heat dissipation. When the heat is low, the working fluid can enter in a liquid state and directly flow outward from the vapor outlet tube in a liquid state.
- In order to illustrate the technical features of the present disclosure in detail, an exemplary embodiment is illustrated with drawings, wherein:
-
FIG. 1 is a perspective view according to a first exemplary embodiment of the present disclosure; -
FIG. 2 is a cross-sectional view along section line 2-2 in Figs according to the first exemplary embodiment of the present disclosure; -
FIG. 3 is a cross-sectional view along section line 3-3 in Figs according to the first exemplary embodiment of the present disclosure; -
FIG. 4 is a sectional view according to the first exemplary embodiment of the present disclosure, showing the state of the inlet and outlet with inlet receiver and outlet receiver; -
FIG. 5 is a schematic diagram of the first exemplary embodiment of the present disclosure; and -
FIG. 6 is a sectional view according to a second exemplary embodiment of the present disclosure. - Reference numbers in the figures are as follows: liquid-in and vapor-out composite liquid-vapor phase conversion
heat dissipation device 10;housing 11;inlet channel 118;outlet channel 119;top 12;bottom 13;sidewall 14; -
capacity chamber 16;liquid inlet chamber 168;vapor outlet chamber 169;inlet 18;outlet 19;capillary structure 21;drainage structure 31;grooves 311;liquid source 48;inlet tube 488; outlet tube; 489; liquid-in and vapor-out composite liquid-vapor phase conversionheat dissipation device 10′,liquid inlet chamber 168′;vapor outlet chamber 169′;inlet 18′;check valve 189′;capillary structure 21′; largediameter copper powder 211′; smalldiameter copper powder 212′;drainage structure 31′; working fluid 91; andheat source 99. - In order to illustrate the technical features of the present disclosure in detail, the following exemplary embodiments are cited and illustrated with accompanying drawings, among others.
- As shown in
FIGS. 1 to 4 , the first preferred embodiment of the present disclosure provides a liquid-in and vapor-out composite liquid-vapor phase conversionheat dissipation device 10, consisting mainly of ahousing 11, acapillary structure 21, and adrainage structure 31. - In particular, the
housing 11 has atop 12, abottom 13 and a number ofside walls 14. Thehousing 11 has aninternal chamber 16, and thehousing 11 has aninlet 18 and anoutlet 19 which are spatially connected to thechamber 16. The bottom surface of thebottom 13 of thehousing 11 is used to adhere to a heat source 99 (seeFIG. 5 ). In the first exemplary embodiment, thehousing 11 is in the shape of a rectangle, so the number of theplural side walls 14 is four, and the fourside walls 14 are two to two. In addition, theinlet 18 is for the working fluid 91 (e.g., pure water) to enter, and theoutlet 19 is for the vaporized working fluid 91 to be dispersed outward. Theoutlet 19 is set at thetop 12 of thehousing 11, which helps the vapor working fluid 91 to disperse outwardly through theoutlet 19 by the principle of rising hot air. However, theinlet 18 may also be located on one of theside walls 14 of thehousing 11 as required, since this arrangement can be directly understood fromFIGS. 1 to 3 of the present disclosure, and is therefore not shown in the figures. In addition, for the convenience of the connection line, aninlet channel 118 as shown inFIG. 4 can be extended outwardly from thehousing 11 to correspond to theinlet 18, and anoutlet channel 119 can be extended outwardly to correspond to theoutlet 19.FIGS. 1 to 3 show an arrangement without theinlet channel 118 andoutlet channel 119, mainly to illustrate that the present disclosure is not limited to using theinlet channel 118 andoutlet channel 119. - In addition, it should be added that the
housing 11 is not limited to a rectangular shape, and therefore other shapes such as square, polygon, circular, or cylindrical can be used. Since the housing structure in different shapes is directly understandable by those skilled in the art, such is not represented or shown. - The
capillary structure 21 is affixed to thetop 12,bottom 13 and aforementioned twoopposite side walls 14 of thehousing 11, thereby occupying most of the space of thechamber 16, which is filled with thechamber 16 but at a predetermined distance from theinlet 18 and theoutlet 19. In addition, thecapillary structure 21 is further separated from the other twoopposite side walls 14 that are not attached by the predetermined distance, thus separating thechamber 16 into aliquid inlet chamber 168 and avapor outlet chamber 169 that are not connected in space. Theliquid inlet chamber 168 is spatially communicated with theinlet 18, and thevapor outlet chamber 169 is spatially communicated with theoutlet 19. In the first exemplary embodiment, thecapillary structure 21 is sintered with copper powder as an example. - The
drainage structure 31 is located on the top surface of thebottom 13 of thehousing 11, and attached to the bottom of thecapillary structure 21. Thedrainage structure 31 is partially uncovered by thecapillary structure 21 and is exposed to theliquid inlet chamber 168. In the first exemplary embodiment, thedrainage structure 31 is formed by a number ofgrooves 311, and the two ends of thegrooves 311 are connected to theliquid inlet chamber 168 and thevapor outlet chamber 169, respectively. In another embodiment, thegrooves 311 can be formed by setting copper strips on thebottom 13 of thehousing 11 and spacing them parallel to one another. Thedrainage structure 31 is located above theheat source 99. - The structure configuration of the first exemplary embodiment has been described above, and operational state of the first exemplary embodiment will be described hereinafter.
- As shown in
FIG. 5 , theinlet 18 is connected to aliquid source 48 prior to use. In fact, aninlet tube 488 can be used to connect theinlet channel 118 and theliquid source 48. Anoutlet tube 489 can be connected to theoutlet channel 119 and theliquid source 48, which provides a constant supply of working fluid 91 at a predetermined rate into theinlet 18, which in turn provides a predetermined thrust to the working fluid 91 in theliquid inlet chamber 168. In addition, the bottom surface of the bottom 13 of thehousing 11 is affixed to aheat source 99, which inFIG. 5 is the central processing unit as such as a computer. - During use, the
liquid source 48 is driven to provide the working fluid 91, which enters theliquid inlet chamber 168 and is then drawn in by thecapillary structure 21 until thecapillary structure 21 is saturated, and the working fluid 91 is diverted by thedrainage structure 31 to thevapor outlet chamber 169. Thecapillary structure 21 will occupy part of the space of thedrainage structure 31, and the working fluid 91 will have a large flow resistance to flow directly from theliquid inlet chamber 168 to thevapor outlet chamber 169, which will cause the working fluid 91 to be saturated by thecapillary structure 21, but will not flow out from thecapillary structure 21 to thevapor outlet chamber 169 without resistance. The working fluid 91 is saturated by thecapillary structure 21, but does not flow out from thecapillary structure 21 to thevapor chamber 169 quickly without any resistance, but has only a little bit of leakage. Under such conditions, the heat emitted by theheat source 99 is conducted to the bottom 13 of thehousing 11, which heats the working fluid 91 on thedrainage structure 31, and the working fluid 91 in the vicinity of thedrainage structure 31 is vaporized by the heat, and the vaporized working fluid 91 flows through thedrainage structure 31 to thevapor outlet chamber 169, and then disperses outwardly by theoutlet 19. The vaporized working fluid 91 is forced to flow only to thevapor outlet chamber 169 as the vaporized working fluid 91 enters theoutlet tube 489 from theoutlet 19 and then enters theliquid source 48. Theliquid source 48 is then condensed into a liquid state. - In view of the above description, an external access is provided in the first exemplary embodiment to the
liquid inlet tube 488 and thevapor outlet tube 489 to continuously provide the working fluid 91, and thehousing 11 can absorb a large amount of heat energy when the liquid and vapor state of the working fluid 91 changes state when heated, thus achieving an excellent and continuous heat dissipation effect. Therefore, the present disclosure provides the composite liquid-vapor phase conversion heat dissipation device that combines liquid and vapor. In this way, the present disclosure is based on the latent heat principle to dissipate heat, and has a better heat dissipation effect than the liquid cooling plate. - It should be added that a condensing chamber (not shown in the drawings) can be added to the
outlet tube 489 as required to ensure that the working fluid 91 in vapor form can be condensed to a liquid state before entering theliquid source 48. The condensing chamber is provided in the known circuit heat pipe and is therefore not shown in the drawings as it can be directly understood by the persons skilled in the art. - In addition, since the present disclosure uses a high heat absorption effect of the liquid state and vapor state of the working fluid 91 to dissipate heat, the amount of the working fluid 91 will not be very large because the amount of water in the process of transformation will not be very large, i.e., the supply rate of the
liquid source 48 can be extremely low, and the rate of supplying the working fluid 91 only needs to be able to keep thecapillary structure 21 from completely not absorbing the working fluid 91. - It should be further added that the
heat source 99 as described above has a heating condition, that is, the condition of sufficient heat energy. However, if theliquid source 48 continues to supply the working fluid 91, but theheat source 99 does not heat up, i.e., when computer is turned off, the working fluid 91 will continue to leak in a liquid state into thevapor outlet chamber 169, and will eventually fill thevapor outlet chamber 169 completely, and then flow to theoutlet 19. The working fluid 91 in the vicinity of thedrainage structure 31 will still flow to thevapor outlet chamber 169 after being heated due to the hydraulic pressure, and the working fluid 91 in thevapor outlet chamber 169 will flow out from theoutlet 19 at a higher rate than the aforementioned liquid supply rate. After a period of time, the vapor working fluid 91 in thevapor outlet chamber 169 will be completely discharged, and then the liquid supply rate of theliquid source 48 will be adjusted back to the normal value to return to the normal working condition as described above. It can be seen that the working form of the present disclosure can be of one configuration in which the working fluid 91 enters in liquid form and the vapor flows out, or of another configuration in which the working fluid 91 enters in liquid form and still flows out in liquid form, thereby rendering the working form as a composite form. - As shown in
FIG. 6 , the present disclosure provides a second preferred embodiment of a liquid-in and vapor-out composite liquid-vapor phase conversionheat dissipation device 10′, which is mainly the same as the first embodiment, but differs in the following aspects. - The
capillary structure 21′ has two different particle sizes ofcopper powders 211′ and 212′, whereby the large diameter copper powders 211′ are located at the bottom of thecapillary structure 21′ in contact with thedrainage structure 31′, while the small diameter copper powders 212′ are the main component of thecapillary structure 21′, and most of the small diameter copper powders 212′ are located above the largediameter copper powder 211′. - The
drainage structure 31′ is a metal woven mesh, which can be substantially a copper woven mesh, and the mesh of the metal woven mesh can be larger than the particle size of the largediameter copper powder 211′ of thecapillary structure 21′. - The
inlet 18′ is provided with acheck valve 189′ to prevent the working fluid 91 in theliquid inlet chamber 168′ from flowing backwards. - In the second exemplary embodiment, since the large
diameter copper powder 211′ of thecapillary structure 21′ is located below, a large gap can be formed together with thedrainage structure 31′, which helps to provide more space for the vapor working fluid 91 to flow in the heated evaporated state, and therefore flowing more easily to thevapor chamber 169′ in the vapor state. - The
drainage structure 31′ is a woven metal mesh, which also provides space for the vapor working fluid 91 to flow. - After the working fluid 91 is heated and evaporates into vapor state, the working fluid 91 will not only move to the
vapor outlet chamber 169′, but also to theliquid inlet chamber 168′ from a thrust formed so thecheck valve 189′ can further provide to prevent the working fluid 91 in theliquid inlet chamber 168′ from flowing back into theliquid inlet tube 488′. - The rest of the second exemplary embodiment is the same as the first exemplary embodiment, and will therefore not be repeated.
Claims (10)
1. A liquid-in and vapor-out composite liquid-vapor phase conversion heat dissipation device, comprising:
a housing having (a) a top, a bottom and a plurality of side walls, (b) a chamber inside the housing, and (c) an inlet and an outlet spatially connected to the chamber, respectively;
a capillary structure affixed to the top, bottom and side walls of the housing, thereby occupying a substantial portion of the space in the chamber, the capillary structure in the chamber maintaining a predetermined distance from both the inlet and the outlet, thereby spatially separating the chamber into a liquid inlet chamber, which is spatially connected to the inlet, and the vapor outlet chamber, which is spatially connected to the outlet; and
a drainage structure disposed on a top surface of the bottom of the housing, and affixed to the bottom of the capillary structure, the drainage structure being partially uncovered by the capillary structure and exposed to the liquid inlet chamber, the drainage structure being used to divert liquid from the liquid inlet chamber to the bottom of the capillary structure,
wherein a bottom surface of the bottom of the housing is affixed to a heat source, and the drainage structure is located above the heat source.
2. The liquid-in and vapor-out composite liquid-vapor phase conversion heat dissipation device according to claim 1 , wherein the housing is of a rectangular shape, and the number of the sidewalls is four, and wherein the four sidewalls are opposite to each other, and the capillary structure is attached to two of the opposite sidewalls, and separated from the other two sidewalls by a predetermined distance.
3. The liquid-in and vapor-out composite liquid-vapor phase conversion heat dissipation device according to claim 1 , wherein the housing is one of a square, polygon, circular, or cylindrical shape.
4. The liquid-in and vapor-out composite liquid-vapor phase conversion heat dissipation device according to claim 1 , wherein the inlet and the outlet are installed at the top of the housing.
5. The liquid-in and vapor-out composite liquid-vapor phase conversion heat dissipation device according to claim 1 , wherein the inlet is pierced through one of the side walls of the housing.
6. The liquid-in and vapor-out composite liquid-vapor phase conversion heat dissipation device according to claim 1 , wherein the capillary structure is a copper powder sintering structure having at least two different sizes in diameter, and wherein the large diameter copper powder is located at the bottom of the capillary structure in contact with the induced flow structure, and the small diameter copper powder is a main component of the capillary structure, and the small diameter copper powder is located above the aforementioned large diameter copper powder.
7. The liquid-in and vapor-out composite liquid-vapor phase conversion heat dissipation device according to claim 1 , wherein the induced flow structure is composed of a plurality of grooves, and the two ends of the grooves are connected to the liquid-in chamber and the vapor-out chamber respectively.
8. The liquid-in and vapor-out composite liquid-vapor phase conversion heat dissipation device according to claim 1 , wherein the drainage structure is a metal woven mesh, the capillary structure is a copper powder sintered structure, and the mesh of the metal woven mesh is larger than the copper powder particle size of the capillary structure.
9. The liquid-in and vapor-out composite liquid-vapor phase conversion heat dissipation device according to claim 1 , wherein the inlet is equipped with a check valve.
10. The liquid-in and vapor-out composite liquid-vapor phase conversion heat dissipation device according to claim 1 , wherein the housing has an inlet pipe extending outward to the inlet, and an outlet pipe extending outward to the outlet.
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TW110148534A TWI815257B (en) | 2021-12-23 | 2021-12-23 | Composite liquid-vapor phase conversion radiator with liquid inlet and vapor outlet |
TW110148534 | 2021-12-23 |
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CN105352349B (en) * | 2015-11-27 | 2017-12-22 | 华中科技大学 | A kind of secondary core evaporator and its application |
CN107702574A (en) * | 2017-09-25 | 2018-02-16 | 华中科技大学 | A kind of longitudinal liquid-supply evaporator |
TWI733272B (en) * | 2019-12-12 | 2021-07-11 | 國立清華大學 | Vapor chamber device |
TWI743945B (en) * | 2020-08-14 | 2021-10-21 | 大陸商廣州力及熱管理科技有限公司 | Thin vapor chamber wick structure element and manufacturing method thereof |
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