US20220167517A1 - Electronic device including rear plate and method for manufacturing same - Google Patents
Electronic device including rear plate and method for manufacturing same Download PDFInfo
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- US20220167517A1 US20220167517A1 US17/434,798 US202017434798A US2022167517A1 US 20220167517 A1 US20220167517 A1 US 20220167517A1 US 202017434798 A US202017434798 A US 202017434798A US 2022167517 A1 US2022167517 A1 US 2022167517A1
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- United States
- Prior art keywords
- pattern
- glass plate
- electronic device
- area
- rear plate
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- 238000000034 method Methods 0.000 title description 41
- 238000004519 manufacturing process Methods 0.000 title description 32
- 239000011521 glass Substances 0.000 claims abstract description 196
- 239000010410 layer Substances 0.000 claims abstract description 123
- 238000012545 processing Methods 0.000 claims abstract description 81
- 239000011247 coating layer Substances 0.000 claims abstract description 25
- 230000008021 deposition Effects 0.000 claims description 15
- 238000007639 printing Methods 0.000 claims description 9
- 239000012790 adhesive layer Substances 0.000 claims description 7
- 238000004891 communication Methods 0.000 description 41
- 230000008569 process Effects 0.000 description 30
- 238000003856 thermoforming Methods 0.000 description 27
- 238000005498 polishing Methods 0.000 description 20
- 230000006870 function Effects 0.000 description 17
- 239000000463 material Substances 0.000 description 15
- 238000000151 deposition Methods 0.000 description 13
- 230000015572 biosynthetic process Effects 0.000 description 10
- 238000013461 design Methods 0.000 description 10
- 238000003860 storage Methods 0.000 description 9
- 238000000059 patterning Methods 0.000 description 8
- 239000011347 resin Substances 0.000 description 6
- 229920005989 resin Polymers 0.000 description 6
- 238000012546 transfer Methods 0.000 description 6
- 238000001816 cooling Methods 0.000 description 5
- 229920000642 polymer Polymers 0.000 description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 4
- 238000004590 computer program Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 3
- 238000007781 pre-processing Methods 0.000 description 3
- 230000001133 acceleration Effects 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 229910052681 coesite Inorganic materials 0.000 description 2
- 229910052593 corundum Inorganic materials 0.000 description 2
- 229910052906 cristobalite Inorganic materials 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000010894 electron beam technology Methods 0.000 description 2
- 230000002708 enhancing effect Effects 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- 239000000446 fuel Substances 0.000 description 2
- 238000000227 grinding Methods 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 230000000116 mitigating effect Effects 0.000 description 2
- 238000010295 mobile communication Methods 0.000 description 2
- ZKATWMILCYLAPD-UHFFFAOYSA-N niobium pentoxide Chemical compound O=[Nb](=O)O[Nb](=O)=O ZKATWMILCYLAPD-UHFFFAOYSA-N 0.000 description 2
- 238000005240 physical vapour deposition Methods 0.000 description 2
- 229920006254 polymer film Polymers 0.000 description 2
- 230000035807 sensation Effects 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 235000012239 silicon dioxide Nutrition 0.000 description 2
- 230000005236 sound signal Effects 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 229910052682 stishovite Inorganic materials 0.000 description 2
- 229910052718 tin Inorganic materials 0.000 description 2
- 229910052905 tridymite Inorganic materials 0.000 description 2
- 230000000007 visual effect Effects 0.000 description 2
- 229910052724 xenon Inorganic materials 0.000 description 2
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 2
- 229910001845 yogo sapphire Inorganic materials 0.000 description 2
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 239000003522 acrylic cement Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000003570 air Substances 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 230000010267 cellular communication Effects 0.000 description 1
- 230000001413 cellular effect Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000004069 differentiation Effects 0.000 description 1
- 230000002996 emotional effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000006260 foam Substances 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 230000003155 kinesthetic effect Effects 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000002310 reflectometry Methods 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 230000001953 sensory effect Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- LIVNPJMFVYWSIS-UHFFFAOYSA-N silicon monoxide Inorganic materials [Si-]#[O+] LIVNPJMFVYWSIS-UHFFFAOYSA-N 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 229910052950 sphalerite Inorganic materials 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 229910052984 zinc sulfide Inorganic materials 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/03—Covers
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/1613—Constructional details or arrangements for portable computers
- G06F1/1628—Carrying enclosures containing additional elements, e.g. case for a laptop and a printer
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/1613—Constructional details or arrangements for portable computers
- G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
- G06F1/1656—Details related to functional adaptations of the enclosure, e.g. to provide protection against EMI, shock, water, or to host detachable peripherals like a mouse or removable expansions units like PCMCIA cards, or to provide access to internal components for maintenance or to removable storage supports like CDs or DVDs, or to mechanically mount accessories
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/133308—Support structures for LCD panels, e.g. frames or bezels
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/1613—Constructional details or arrangements for portable computers
- G06F1/1626—Constructional details or arrangements for portable computers with a single-body enclosure integrating a flat display, e.g. Personal Digital Assistants [PDAs]
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/1613—Constructional details or arrangements for portable computers
- G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
- G06F1/1635—Details related to the integration of battery packs and other power supplies such as fuel cells or integrated AC adapter
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
- G06F2200/16—Indexing scheme relating to G06F1/16 - G06F1/18
- G06F2200/163—Indexing scheme relating to constructional details of the computer
- G06F2200/1635—Stackable modules
Definitions
- Certain embodiments of the disclosure relate to a rear plate, an electronic device including the same, and a method for manufacturing a rear plate.
- the term “electronic device” may indicate a device capable of performing a particular function according to installed programs, and may include devices such as a home appliance, an electronic scheduler, a portable multimedia player, a mobile communication terminal, a tablet PC, a video/sound device, a desktop PC or laptop computer, a navigation for automobile, etc.
- electronic devices may output voice/audio or imagery.
- an electronic device includes integrated entertainment functionality, such as entertainment functions like playing video games, multimedia functions like replaying music/videos, communication and security functions such as mobile banking, scheduling functions and e-wallet functions.
- an external cover such as a glass cover, having a curved surface, and formed via thermoforming, may provide superior grip and aesthetic appeal.
- a pattern may be printed or laminated on as a film (e.g., Decofilm), to a particular area of the cover, such as the curved portion, to add aesthetic value to the product.
- thermoforming may result in limitations to visual and sensory design differentiations. Further, the additional process may consume materials and time, creating an obstacle to efficient production.
- a rear plate of an electronic device is provided as to include a cover in which a pattern is formed thereon during thermoforming, satisfying requirements of depth, demand and design.
- thermoforming process for the aforementioned rear plate and electronic device having the same, it is possible to reduce material and time costs by forming the curved surface and patterning the same during the thermoforming process.
- a rear plate covering a rear surface of an electronic device may include a glass plate including a pattern area including a pattern having a designated shape, in at least a partial area of the glass plate, a printed layer disposed on a first surface of the glass plate, a shielding layer stacked with the printed layer, and a coating layer disposed on a second surface, opposite to the first surface, of the glass plate.
- the pattern area of the glass plate may include a plurality of processing lines spaced apart from each other.
- an electronic device may include a housing including a front plate facing in a first direction and a rear plate facing in a second direction opposite to the front plate, at least a portion of the front plate including a transparent area, a battery disposed inside the housing, and a display disposed in the housing and including a screen area exposed through the front cover.
- the rear plate may include a glass plate including a pattern area including a pattern having a designated shape, in at least a partial area of the glass plate, a printed layer disposed on the glass plate in the first direction, a shielding layer stacked with the printed layer, and a coating layer disposed on the glass plate in the second direction opposite to the first direction.
- the pattern area of the glass plate may include a plurality of processing lines spaced apart from each other.
- a method for manufacturing a rear plate may include a step in which a glass plate is inserted into a mold structure and is seated in an area of a lower core structure of the mold structure, a step in which the glass plate is pre-heated at a high temperature, and an upper core structure of the mold structure descends toward the lower core structure, a step in which shape processing portions of the upper core structure and the lower core structure press the glass plate to form a curved surface, and a cooling step.
- an electronic device in an electronic device, it is possible to provide an exterior material with aesthetic design.
- a rear plate and an electronic device including the same it is possible to form processing lines in a pattern by forming a rear plate pattern during thermoforming.
- thermoforming it is possible to offer a cover enhanced in light of design.
- a rear plate and an electronic device including the same no additional process for patterning is needed, thereby saving costs due to material and time while minimizing defects that may occur after assembly.
- FIG. 1 is a block diagram illustrating an example electronic device in a network environment according to certain embodiments of the disclosure
- FIG. 2 is a front perspective view illustrating an example electronic device according to certain embodiments of the disclosure
- FIG. 3 is a rear perspective view illustrating an example electronic device according to certain embodiments of the disclosure.
- FIG. 4 is an exploded perspective view illustrating an example electronic device according to certain embodiments of the disclosure.
- FIG. 5 is a cross-sectional view taken along line A-A′ of the example electronic device FIG. 3 according to certain embodiments of the disclosure;
- FIG. 6 is an enlarged, cross-sectional view illustrating an area S of FIG. 5 according to an example embodiment of the disclosure
- FIG. 7 is an enlarged, cross-sectional view illustrating an area of FIG. 5 according to another example embodiment of the disclosure.
- FIG. 8 is an enlarged, cross-sectional view illustrating an area of FIG. 5 according to another example embodiment of the disclosure.
- FIG. 9A is an enlarged, cross-sectional view illustrating a pattern area of a rear plate of an example electronic device according to certain embodiments of the disclosure
- FIG. 9B is an enlarged, cross-sectional view illustrating a pattern area obtained by processing a rear plate using a laser according to an embodiment of the disclosure
- FIGS. 10A and 10B are drawings illustrating an example process for manufacturing a rear plate of an electronic device according to an embodiment of the disclosure
- FIG. 11 is a drawing illustrating an example process for manufacturing a rear plate of an electronic device according to another embodiment of the disclosure.
- FIG. 12 is a drawing illustrating an example process for manufacturing a rear plate of an electronic device according to another embodiment of the disclosure.
- FIG. 13 is a view illustrating an example mold structure for manufacturing a rear plate of an electronic device according to certain embodiments of the disclosure.
- FIG. 14 is a view illustrating an example mold structure for manufacturing a rear plate of an electronic device according to certain embodiments of the disclosure.
- FIG. 15 is a drawing illustrating an example post-thermoforming process according to certain embodiments of the disclosure.
- FIG. 16 is a drawing illustrating an example process for processing lines including slopes according to certain embodiments of the disclosure.
- FIG. 1 is a block diagram illustrating an electronic device 101 in a network environment 100 according to certain embodiments.
- the electronic device 101 in the network environment 100 may communicate with an electronic device 102 via a first network 198 (e.g., a short-range wireless communication network), or an electronic device 104 or a server 108 via a second network 199 (e.g., a long-range wireless communication network).
- the electronic device 101 may communicate with the electronic device 104 via the server 108 .
- the electronic device 101 may include a processor 120 , memory 130 , an input device 150 , a sound output device 155 , a display device 160 , an audio module 170 , a sensor module 176 , an interface 177 , a haptic module 179 , a camera module 180 , a power management module 188 , a battery 189 , a communication module 190 , a subscriber identification module (SIM) 196 , or an antenna module 197 .
- at least one (e.g., the display device 160 or the camera module 180 ) of the components may be omitted from the electronic device 101 , or one or more other components may be added in the electronic device 101 .
- the components may be implemented as single integrated circuitry.
- the sensor module 176 e.g., a fingerprint sensor, an iris sensor, or an illuminance sensor
- the display device 160 e.g., a display
- the processor 120 may execute, for example, software (e.g., a program 140 ) to control at least one other component (e.g., a hardware or software component) of the electronic device 101 coupled with the processor 120 , and may perform various data processing or computation. According to an embodiment, as at least part of the data processing or computation, the processor 120 may load a command or data received from another component (e.g., the sensor module 176 or the communication module 190 ) in volatile memory 132 , process the command or the data stored in the volatile memory 132 , and store resulting data in non-volatile memory 134 .
- software e.g., a program 140
- the processor 120 may load a command or data received from another component (e.g., the sensor module 176 or the communication module 190 ) in volatile memory 132 , process the command or the data stored in the volatile memory 132 , and store resulting data in non-volatile memory 134 .
- the processor 120 may include a main processor 121 (e.g., a central processing unit (CPU) or an application processor (AP)), and an auxiliary processor 123 (e.g., a graphics processing unit (GPU), an image signal processor (ISP), a sensor hub processor, or a communication processor (CP)) that is operable independently from, or in conjunction with, the main processor 121 .
- auxiliary processor 123 may be adapted to consume less power than the main processor 121 , or to be specific to a specified function.
- the auxiliary processor 123 may be implemented as separate from, or as part of the main processor 121 .
- the auxiliary processor 123 may control at least some of functions or states related to at least one component (e.g., the display device 160 , the sensor module 176 , or the communication module 190 ) among the components of the electronic device 101 , instead of the main processor 121 while the main processor 121 is in an inactive (e.g., sleep) state, or together with the main processor 121 while the main processor 121 is in an active state (e.g., executing an application).
- the auxiliary processor 123 e.g., an image signal processor or a communication processor
- the memory 130 may store various data used by at least one component (e.g., the processor 120 or the sensor module 176 ) of the electronic device 101 .
- the various data may include, for example, software (e.g., the program 140 ) and input data or output data for a command related thereto.
- the memory 130 may include the volatile memory 132 or the non-volatile memory 134 .
- the program 140 may be stored in the memory 130 as software, and may include, for example, an operating system (OS) 142 , middleware 144 , or an application 146 .
- OS operating system
- middleware middleware
- application application
- the input device 150 may receive a command or data to be used by other component (e.g., the processor 120 ) of the electronic device 101 , from an exterior (e.g., a user) of the electronic device 101 .
- the input device 150 may include, for example, a microphone, a mouse, a keyboard, or a digital pen (e.g., a stylus pen).
- the sound output device 155 may output sound signals to an exterior of the electronic device 101 .
- the sound output device 155 may include, for example, a speaker or a receiver.
- the speaker may be used for general purposes, such as playing multimedia or playing record, and the receiver may be used for an incoming calls. According to an embodiment, the receiver may be implemented as separate from, or as part of the speaker.
- the display device 160 may visually provide information to an exterior (e.g., a user) of the electronic device 101 .
- the display device 160 may include, for example, a display, a hologram device, or a projector and control circuitry to control a corresponding one of the display, hologram device, and projector.
- the display device 160 may include touch circuitry adapted to detect a touch, or sensor circuitry (e.g., a pressure sensor) adapted to measure the intensity of force incurred by the touch.
- the audio module 170 may convert a sound into an electrical signal and vice versa. According to an embodiment, the audio module 170 may obtain the sound via the input device 150 , or output the sound via the sound output device 155 or a headphone of an external electronic device (e.g., an electronic device 102 ) directly (e.g., wiredly) or wirelessly coupled with the electronic device 101 .
- an external electronic device e.g., an electronic device 102
- directly e.g., wiredly
- wirelessly e.g., wirelessly
- the sensor module 176 may detect an operational state (e.g., power or temperature) of the electronic device 101 or an environmental state (e.g., a state of a user) external to the electronic device 101 , and then generate an electrical signal or data value corresponding to the detected state.
- the sensor module 176 may include, for example, a gesture sensor, a gyro sensor, an atmospheric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.
- the interface 177 may support one or more specified protocols to be used for the electronic device 101 to be coupled with the external electronic device (e.g., the electronic device 102 ) directly (e.g., wiredly) or wirelessly.
- the interface 177 may include, for example, a high-definition multimedia interface (HDMI), a universal serial bus (USB) interface, a secure digital (SD) card interface, or an audio interface.
- HDMI high-definition multimedia interface
- USB universal serial bus
- SD secure digital
- a connecting terminal 178 may include a connector via which the electronic device 101 may be physically connected with the external electronic device (e.g., the electronic device 102 ).
- the connecting terminal 178 may include, for example, a HDMI connector, a USB connector, a SD card connector, or an audio connector (e.g., a headphone connector).
- the haptic module 179 may convert an electrical signal into a mechanical stimulus (e.g., a vibration or motion) or electrical stimulus which may be recognized by a user via his tactile sensation or kinesthetic sensation.
- the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electric stimulator.
- the camera module 180 may capture a still image or moving images.
- the camera module 180 may include one or more lenses, image sensors, image signal processors, or flashes.
- the power management module 188 may manage power supplied to the electronic device 101 .
- the power management module 188 may be implemented as at least part of, for example, a power management integrated circuit (PMIC).
- PMIC power management integrated circuit
- the battery 189 may supply power to at least one component of the electronic device 101 .
- the battery 189 may include, for example, a primary cell which is not rechargeable, a secondary cell which is rechargeable, or a fuel cell.
- the communication module 190 may support establishing a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device 101 and the external electronic device (e.g., the electronic device 102 , the electronic device 104 , or the server 108 ) and performing communication via the established communication channel.
- the communication module 190 may include one or more communication processors that are operable independently from the processor 120 (e.g., the application processor (AP)) and supports a direct (e.g., wired) communication or a wireless communication.
- AP application processor
- the communication module 190 may include a wireless communication module 192 (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (e.g., a local area network (LAN) communication module or a power line communication (PLC) module).
- a wireless communication module 192 e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module
- GNSS global navigation satellite system
- wired communication module 194 e.g., a local area network (LAN) communication module or a power line communication (PLC) module.
- LAN local area network
- PLC power line communication
- a corresponding one of these communication modules may communicate with the external electronic device via the first network 198 (e.g., a short-range communication network, such as BluetoothTM, wireless-fidelity (Wi-Fi) direct, or infrared data association (IrDA)) or the second network 199 (e.g., a long-range communication network, such as a cellular network, the Internet, or a computer network (e.g., LAN or wide area network (WAN)).
- the first network 198 e.g., a short-range communication network, such as BluetoothTM, wireless-fidelity (Wi-Fi) direct, or infrared data association (IrDA)
- the second network 199 e.g., a long-range communication network, such as a cellular network, the Internet, or a computer network (e.g., LAN or wide area network (WAN)
- These various types of communication modules may be implemented as a single component (e.g., a single chip), or may be implemented as multi components (e.
- the wireless communication module 192 may identify and authenticate the electronic device 101 in a communication network, such as the first network 198 or the second network 199 , using subscriber information (e.g., international mobile subscriber identity (IMSI)) stored in the subscriber identification module 196 .
- subscriber information e.g., international mobile subscriber identity (IMSI)
- the antenna module 197 may transmit or receive a signal or power to or from an exterior (e.g., the external electronic device).
- the antenna module may include one antenna including a radiator formed of a conductor or conductive pattern formed on a substrate (e.g., a printed circuit board (PCB)).
- the antenna module 197 may include a plurality of antennas. In this case, at least one antenna appropriate for a communication scheme used in a communication network, such as the first network 198 or the second network 199 , may be selected from the plurality of antennas by, e.g., the communication module 190 . The signal or the power may then be transmitted or received between the communication module 190 and the external electronic device via the selected at least one antenna.
- other parts e.g., radio frequency integrated circuit (RFIC)
- RFIC radio frequency integrated circuit
- At least some of the above-described components may be coupled mutually and communicate signals (e.g., commands or data) therebetween via an inter-peripheral communication scheme (e.g., a bus, general purpose input and output (GPIO), serial peripheral interface (SPI), or mobile industry processor interface (MIPI)).
- an inter-peripheral communication scheme e.g., a bus, general purpose input and output (GPIO), serial peripheral interface (SPI), or mobile industry processor interface (MIPI)
- commands or data may be transmitted or received between the electronic device 101 and the external electronic device 104 via the server 108 coupled with the second network 199 .
- Each of the electronic devices 102 and 104 may be a device of a same type as, or a different type, from the electronic device 101 .
- all or some of operations to be executed at the electronic device 101 may be executed at one or more of the external electronic devices 102 , 104 , or 108 .
- the electronic device 101 may request the one or more external electronic devices to perform at least part of the function or the service.
- the one or more external electronic devices receiving the request may perform the at least part of the function or the service requested, or an additional function or an additional service related to the request, and transfer an outcome of the performing to the electronic device 101 .
- the electronic device 101 may provide the outcome, with or without further processing of the outcome, as at least part of a reply to the request.
- a cloud computing, distributed computing, or client-server computing technology may be used, for example.
- the electronic device may be one of various types of electronic devices.
- the electronic devices may include, for example, a portable communication device (e.g., a smart phone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a home appliance. According to an embodiment of the disclosure, the electronic devices are not limited to those described above.
- each of such phrases as “A or B,” “at least one of A and B,” “at least one of A or B,” “A, B, or C,” “at least one of A, B, and C,” and “at least one of A, B, or C,” may include all possible combinations of the items enumerated together in a corresponding one of the phrases.
- such terms as “1st” and “2nd,” or “first” and “second” may be used to simply distinguish a corresponding component from another, and does not limit the components in other aspect (e.g., importance or order).
- an element e.g., a first element
- the element may be coupled with the other element directly (e.g., wiredly), wirelessly, or via a third element.
- module may include a unit implemented in hardware, software, or firmware, and may interchangeably be used with other terms, for example, “logic,” “logic block,” “part,” or “circuitry”.
- a module may be a single integral component, or a minimum unit or part thereof, adapted to perform one or more functions.
- the module may be implemented in a form of an application-specific integrated circuit (ASIC).
- ASIC application-specific integrated circuit
- Certain embodiments as set forth herein may be implemented as software (e.g., the program 140 ) including one or more instructions that are stored in a storage medium (e.g., internal memory 136 or external memory 138 ) that is readable by a machine (e.g., the electronic device 101 ).
- a processor e.g., the processor 120
- the machine e.g., the electronic device 101
- the one or more instructions may include a code generated by a complier or a code executable by an interpreter.
- the machine-readable storage medium may be provided in the form of a non-transitory storage medium.
- the term “non-transitory” simply means that the storage medium is a tangible device, and does not include a signal (e.g., an electromagnetic wave), but this term does not differentiate between where data is semi-permanently stored in the storage medium and where the data is temporarily stored in the storage medium.
- a method may be included and provided in a computer program product.
- the computer program products may be traded as commodities between sellers and buyers.
- the computer program product may be distributed in the form of a machine-readable storage medium (e.g., compact disc read only memory (CD-ROM)), or be distributed (e.g., downloaded or uploaded) online via an application store (e.g., Play StoreTM), or between two user devices (e.g., smart phones) directly. If distributed online, at least part of the computer program product may be temporarily generated or at least temporarily stored in the machine-readable storage medium, such as memory of the manufacturer's server, a server of the application store, or a relay server.
- CD-ROM compact disc read only memory
- an application store e.g., Play StoreTM
- two user devices e.g., smart phones
- each component e.g., a module or a program of the above-described components may include a single entity or multiple entities. According to certain embodiments, one or more of the above-described components may be omitted, or one or more other components may be added. Alternatively or additionally, a plurality of components (e.g., modules or programs) may be integrated into a single component. In such a case, according to certain embodiments, the integrated component may still perform one or more functions of each of the plurality of components in the same or similar manner as they are performed by a corresponding one of the plurality of components before the integration.
- operations performed by the module, the program, or another component may be carried out sequentially, in parallel, repeatedly, or heuristically, or one or more of the operations may be executed in a different order or omitted, or one or more other operations may be added.
- a partial configuration of the electronic device may have an injection-molded surface resulting from injection molding.
- the injection-molded surface formed by the injection molding structure may include an outer surface of the electronic device or may support various electronic components inside the electronic device.
- FIG. 2 is a front perspective view illustrating an electronic device according to certain embodiments of the disclosure
- FIG. 3 is a rear perspective view illustrating an electronic device according to certain embodiments of the disclosure
- an electronic device 101 may include a housing 310 with a first (or front) surface 310 A, a second (or rear) surface 310 B, and a side surface 310 C surrounding a space between the first surface 310 A and the second surface 310 B.
- the housing may denote a structure forming part of the first surface 310 A, the second surface 310 B, and the side surface 310 C of FIG. 2 .
- at least part of the first surface 310 A may have a substantially transparent front plate 302 (e.g., a glass plate or polymer plate including various coat layers).
- the second surface 310 B may be formed by a rear plate 311 that is substantially opaque.
- the rear plate 311 may be formed of, e.g., laminated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two thereof.
- the side surface 310 C may be formed by a side bezel structure (or a “side member”) 318 that couples to the front plate 302 and the rear plate 311 and includes a metal and/or polymer.
- the rear plate 311 and the side bezel plate 318 may be integrally formed together and include the same material (e.g., a metal, such as aluminum).
- the front plate 302 may include two first regions 310 D, which seamlessly and bendingly extend from the first surface 310 A to the rear plate 311 , on both the long edges of the front plate 302 .
- the rear plate 311 may include two second regions 310 E, which seamlessly and bendingly extend from the second surface 310 B to the front plate, on both the long edges.
- the front plate 302 (or the rear plate 311 ) may include one of the first regions 310 D (or the second regions 310 E). Alternatively, the first regions 310 D or the second regions 301 E may partially be excluded.
- the side bezel structure 318 may have a first thickness (or width) for sides that do not have the first regions 310 D or the second regions 310 E and a second thickness, which is smaller than the first thickness, for sides that have the first regions 310 D or the second regions 310 E.
- the electronic device 101 may include at least one or more of a display 301 , audio modules 303 , 307 , and 314 , sensor modules 304 , 316 , and 319 , camera modules 305 , 312 , and 313 , key input devices 317 , a light emitting device 306 , and connector holes 308 and 309 .
- the electronic device 101 may exclude at least one (e.g., the key input device 317 or the light emitting device 306 ) of the components or may add other components.
- the display 301 may be exposed through, e.g., a majority portion of the front plate 302 . According to an embodiment, at least a portion of the display 301 may be exposed through the front plate 302 forming the first surface 310 A and the first regions 310 D of the side surface 310 C. According to an embodiment, the edge of the display 301 may be formed to be substantially the same in shape as an adjacent outer edge of the front plate 302 . According to an embodiment (not shown), the interval between the outer edge of the display 301 and the outer edge of the front plate 302 may remain substantially even to give a larger area of exposure the display 301 .
- the screen display region of the display 301 may have a recess or opening in a portion thereof, and at least one or more of the audio module 314 , sensor module 304 , camera module 305 , and light emitting device 306 may be aligned with the recess or opening.
- at least one or more of the audio module 314 , sensor module 304 , camera module 305 , fingerprint sensor 316 , and light emitting device 306 may be included on the rear surface of the screen display region of the display 301 .
- the display 301 may be disposed to be coupled with, or adjacent, a touch detecting circuit, a pressure sensor capable of measuring the strength (pressure) of touches, and/or a digitizer for detecting a magnetic field-type stylus pen.
- a touch detecting circuit capable of measuring the strength (pressure) of touches
- a digitizer for detecting a magnetic field-type stylus pen.
- at least part of the sensor modules 304 and 319 and/or at least part of the key input device 317 may be disposed in the first regions 310 D and/or the second regions 310 E.
- the audio modules 303 , 307 , and 314 may include a microphone hole and speaker holes.
- the microphone hole may have a microphone inside to obtain external sounds.
- there may be a plurality of microphones to be able to detect the direction of a sound.
- the speaker holes may include an external speaker hole and a phone receiver hole.
- the speaker holes and the microphone hole may be implemented as a single hole, or speakers may be rested without the speaker holes (e.g., piezo speakers).
- the sensor modules 304 , 316 , and 319 may generate an electrical signal or data value corresponding to an internal operating state or external environmental state of the electronic device 101 .
- the sensor modules 304 , 316 , and 319 may include a first sensor module 304 (e.g., a proximity sensor) and/or a second sensor module (not shown) (e.g., a fingerprint sensor) disposed on the first surface 310 A of the housing 310 and/or a third sensor module 319 (e.g., a heart-rate monitor (HRM) sensor) and/or a fourth sensor module 316 (e.g., a fingerprint sensor) disposed on the second surface 310 B of the housing 310 .
- HRM heart-rate monitor
- the fingerprint sensor may be disposed on the second surface 310 B as well as on the first surface 310 A (e.g., the display 301 ) of the housing 310 .
- the electronic device 101 may further include sensor modules not shown, e.g., at least one of a gesture sensor, a gyro sensor, an atmospheric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor 304 .
- the camera modules 305 , 312 , and 313 may include a first camera device 305 disposed on the first surface 310 A of the electronic device 101 , and a second camera device 312 and/or a flash 313 disposed on the second surface 310 B.
- the camera modules 305 and 312 may include one or more lenses, an image sensor, and/or an image signal processor.
- the flash 313 may include, e.g., a light emitting diode (LED) or a xenon lamp.
- two or more lenses an infrared (IR) camera, a wide-angle lens, and a telescopic lens
- image sensors may be disposed on one surface of the electronic device 101 .
- the key input device 317 may be disposed on the side surface 310 C of the housing 310 .
- the electronic device 101 may exclude all or some of the above-mentioned key input devices 317 and the excluded key input devices 317 may be implemented in other forms, e.g., as soft keys, on the display 301 .
- the key input device may include the sensor module 316 disposed on the second surface 310 B of the housing 310 .
- the light emitting device 306 may be disposed on, e.g., the first surface 310 A of the housing 310 .
- the light emitting device 306 may provide, e.g., information about the state of the electronic device 101 in the form of light.
- the light emitting device 306 may provide a light source that interacts with, e.g., the camera module 305 .
- the light emitting device 306 may include, e.g., a light emitting device (LED), an infrared (IR) LED, or a xenon lamp.
- the connector holes 308 and 309 may include a first connector hole 308 for receiving a connector (e.g., a universal serial bus (USB) connector) for transmitting or receiving power and/or data to/from an external electronic device and/or a second connector hole (e.g., an earphone jack) 309 for receiving a connector for transmitting or receiving audio signals to/from the external electronic device.
- a connector e.g., a universal serial bus (USB) connector
- USB universal serial bus
- FIG. 4 is an exploded perspective view illustrating an electronic device according to certain embodiments of the disclosure.
- an electronic device 101 may include a side bezel structure 331 , a first supporting member 332 (e.g., a bracket), a front plate 320 , a display 330 , a printed circuit board (PCB) 340 , a battery 350 , a second supporting member 360 (e.g., a rear case), an antenna 370 , and a rear plate 380 (e.g., the rear plate 311 of FIG. 3 ).
- the electronic device 101 may exclude at least one (e.g., the first supporting member 332 or second supporting member 360 ) of the components or may add other components. At least one of the components of the electronic device 101 may be the same or similar to at least one of the components of the electronic device 101 of FIG. 2 or 3 and no duplicate description is made below.
- the first supporting member 332 may be disposed inside the electronic device 101 to be connected with the side bezel structure 331 or integrated with the side bezel structure 331 .
- the first supporting member 332 may be formed of, e.g., a metal and/or non-metallic material (e.g., polymer).
- the display 330 may be joined onto one surface of the first supporting member 332
- the printed circuit board 340 may be joined onto the opposite surface of the first supporting member 311 .
- a processor, memory, and/or interface may be mounted on the printed circuit board 340 .
- the processor may include one or more of, e.g., a central processing unit, an application processor, a graphic processing device, an image signal processing, a sensor hub processor, or a communication processor.
- the memory may include, e.g., a volatile or non-volatile memory.
- the interface may include, for example, a high-definition multimedia interface (HDMI), a universal serial bus (USB) interface, a secure digital (SD) card interface, and/or an audio interface.
- HDMI high-definition multimedia interface
- USB universal serial bus
- SD secure digital
- the interface may electrically or physically connect, e.g., the electronic device 101 with an external electronic device and may include a USB connector, an SD card/multimedia card (MMC) connector, or an audio connector.
- MMC multimedia card
- the battery 350 may be a device for supplying power to at least one component of the electronic device 101 .
- the battery 189 may include, e.g., a primary cell which is not rechargeable, a secondary cell which is rechargeable, or a fuel cell. At least a portion of the battery 350 may be disposed on substantially the same plane as the printed circuit board 340 .
- the battery 350 may be integrally or detachably disposed inside the electronic device 101 .
- the antenna 370 may be disposed between the rear plate 380 and the battery 350 .
- the antenna 370 may include, e.g., a near-field communication (NFC) antenna, a wireless charging antenna, and/or a magnetic secure transmission (MST) antenna.
- the antenna 370 may perform short-range communication with, e.g., an external device or may wirelessly transmit or receive power utilized for charging.
- an antenna structure may be formed by a portion or combination of the side bezel structure 331 and/or the first supporting member 332 .
- FIG. 5 is a cross-sectional view taken along line A-A′ of the electronic device FIG. 3 according to certain embodiments of the disclosure.
- FIG. 6 is an enlarged, cross-sectional view illustrating an area S of FIG. 5 according to an embodiment of the disclosure.
- an electronic device (e.g., the electronic device 101 of FIGS. 1 to 3 ) includes a housing 310 for mounting electronic components.
- the housing 310 may include a front plate 320 , a rear plate 380 , a side bezel structure 331 , and a bracket 332 .
- the side bezel structure 331 and the bracket 332 may be integrally formed with each other.
- the front plate 320 , the rear plate 380 , the side bezel structure 331 , and the bracket 332 of FIGS. 5 and 6 may be identical in whole or part to the front plate 320 , the rear plate 380 , the side bezel structure 331 , and the first supporting member 332 of FIG. 4 .
- the bracket 332 provides a space for receiving a plurality of electronic components.
- the side bezel structure 331 may be formed to surround at least a portion of the bracket 332 , covering a side surface of the electronic device 101 .
- the bracket 332 and the side bezel structure 331 may be connected forward to a display (e.g., the display 330 of FIG. 3 ) and the front plate 320 and backward to the rear plate 380 of FIG. 3 .
- the front plate 320 and/or the rear plate 380 may include a flat portion and curved portions.
- the front plate 320 as depicted has a 1-1th curved portion 320 b and a 1-2th curved portion 320 c at two opposite ends thereof, which extend from a first flat portion 320 a disposed in the middle.
- the 1-1th curved portion 320 b and the 1-2th curved portion 320 c may be implemented in shapes corresponding to each other and may seamlessly extend to the rear plate 380 .
- the rear plate 380 has a 2-1th curved portion 380 b and a 2-2th curved portion 380 c at two opposite ends thereof, which extend from a second flat portion 380 a disposed in the middle.
- the 2-1th curved portion 380 b and the 2-2th curved portion 380 c may be implemented in shapes corresponding to each other and may seamlessly extend to the front plate 320 .
- the rear plate 380 may include a stack of a plurality of layers.
- the rear plate 380 may include a printed layer 382 and a shielding layer 383 disposed in a first direction +Z from a glass plate 381 .
- a coating layer 384 may be disposed in a second direction ( ⁇ Z), which is opposite to the first direction (Z), from the glass plate 381 .
- the front plate 320 may include a stack of a plurality of layers.
- the front plate 320 may include a printed layer and a shielding layer disposed in the second direction ⁇ Z from a glass plate.
- a coating layer may be disposed in the first direction (+Z), which is opposite to the second direction ( ⁇ Z), from the glass plate.
- the structure of the front plate 320 having the stack of the plurality of layers may be formed in an inactive region (e.g., a BM area), but not in an active area in which a display (e.g., the display 301 of FIGS. 2 and 3 ) is disposed.
- the structure of the rear plate 380 described below may be applied to the structure of the front plate 320 having the stack of the plurality of layers.
- the glass plate 381 may include a first surface 3811 facing in the first direction +Z and a second surface 3812 facing in the second direction ⁇ Z which is opposite to the first direction +Z.
- the first surface 3811 and/or the second surface 3812 of the glass plate 381 may include a base area 410 and a pattern area 421 .
- at least a partial area of the first surface 3811 includes a non-patterned base area 410 , and an area, other than the base area 410 , of the first surface 3811 may include a pattern region 421 having a designated first thickness.
- the pattern area 421 may be formed with a pattern having a designated shape, and may extend inwardly or from an end of the base area 410 .
- the first thickness may provide a sense of depth of the pattern formed in the pattern area 421 .
- the pattern may be defined as a plurality of repeated motifs, styles, or shapes. Various types of patterns may be formed by the worker.
- a designated shape of pattern formed in the pattern area 421 may be implemented with recesses (e.g., shapes recessed inward in the glass plate) formed in the first surface 3811 of the glass plate 381 and may be formed by an embossed pattern formed in a mold structure for forming.
- the embossed pattern formed in a pattern portion of the mold structure may form the pattern area 421 of the glass plate 381 as an engraved pattern.
- a plurality of processing lines 430 may be included in each designated shape pattern formed in the pattern area 421 .
- the plurality of processing lines 430 may form a regularly or repeatedly designated line structure.
- the processing lines 430 formed in the pattern area 421 may be formed along a direction (e.g., the first direction +Z or the second direction ⁇ Z) perpendicular to the surface where the pattern is formed along designated virtual lines L.
- the processing lines 430 may be spaced apart from each other at predetermined intervals.
- the plurality of processing lines 430 may be a pattern formed by thermoforming, and may be a feature that appears as a processing pattern of the machine processing the thermoforming mold is transferred into the pattern area 421 .
- the plurality of processing lines 430 together with the pattern of the designated shapes, may provide an aesthetic design to the glass plate 381 .
- the base area 410 and the pattern area 421 may be implemented simultaneously with the formation of the flat area and the curved area of the rear plate 380 .
- the process for pattern transfer (formation) of the glass plate 381 may engraving a designated pattern and form the overall shape of the glass plate 381 while simultaneously forming the pattern area in the glass plate 381 using a mold structure corresponding to the overall shape of the glass plate 381 .
- the glass plate 381 may implement a three-dimensional and emotional design. Details of the pattern transfer (formation) process of the glass plate 381 are described below.
- the printed layer 382 may be disposed on the glass plate 381 in the first direction +Z.
- the printed layer 382 includes at least one layer, and when including a plurality of layers, each layer may be formed of a different material.
- a background printed layer may be formed of a material using black ink and may be manufactured through a background printing process.
- a color printed layer may be formed of a material including any color and may be manufactured through a color printing process.
- the background printed layer may provide a three-dimensional effect to another layer providing color, and the color printed layer may directly provide a color to the rear plate 380 .
- At least a partial area of the printed layer 382 may be provided in a shape corresponding to the first surface 3811 of the glass plate 381 .
- the outer surface of the printed layer 382 corresponding to the pattern area 421 may be prepared in a protruding structure or recessed structure corresponding to the recesses or grooves, filling the space formed in the pattern area 421 .
- a transparent member layer 385 may be disposed between the glass plate 381 and the printed layer 382 .
- the transparent member layer 385 may include a dielectric layer, a base film layer, and a primer layer.
- the base film layer may be formed of a transparent insulating substrate, such as glass or a polymer film, and when the substrate is formed of a polymer film, it may include a flexible substrate.
- the dielectric layer may be disposed in contact with the glass plate 381 may be prepared by applying, e.g., a known composition without limitations, as an optically transparent adhesive layer.
- the dielectric layer may be formed of an acrylic adhesive.
- the dielectric layer may include at least one of silicon, air, foam, membrane, optical clear adhesive (OCA), sponge, rubber, ink, and polymer (PC or PET).
- a deposition layer (not shown) may be disposed between the transparent member layer 385 and the printed layer 382 .
- the deposition layer may be manufactured by a physical vapor deposition (PVD) method, such as sputtering.
- PVD physical vapor deposition
- the deposition layer may be formed of at least one or more layers.
- the deposition layer formed as a single layer may be manufactured to include In oxide and an additional additive, using an electron beam (E-beam) evaporator.
- the additional additive may include at least one of TiO2, SiO2, or Al2O3.
- the deposition layer formed as multi layers may be formed by alternately depositing two materials having different reflectivity (e.g., using In oxide and at least one of TiO2, SiO2, or Al2O3), using an electron beam (E-beam) evaporator.
- the deposition layer When the deposition layer is formed by sputtering, it may be deposited including at least one of a material, such as Nb2O5, ZnS, TiO, SiO, Al, Sn, or Tin.
- the printed layer 382 when the printed layer 382 is provided as a base layer, it may be stacked together with the deposition layer, and when provided as a color layer having an arbitrary color of the printed layer 382 , the deposition layer may be optionally removed.
- the shielding layer 383 may be disposed on the glass plate 381 in the first direction +Z.
- the shielding layer 383 may be stacked on the printed layer 382 and may include at least one layer.
- each layer may be formed of a different material.
- the shielding layer 383 may block a path of light directed to an exterior or the interior of the electronic device 101 .
- the shielding layer 383 may prevent light leakage of the electronic device 101 or block the light provided to the electronic device 101 from an exterior.
- the shielding layer 383 may be formed of a material using black ink, and may be manufactured through a light blocking printing process.
- the coating layer 384 may be disposed on the glass plate 381 in the second direction ⁇ Z.
- the coating layer 384 may be formed by being overall coated on the second surface 3812 of the glass plate 381 .
- the coating layer 384 has a thickness smaller than that of the glass plate 381 , and is disposed to surround the outer surface of the electronic device 101 to prevent penetration of foreign substances or contamination.
- FIG. 7 is an enlarged, cross-sectional view illustrating an area of FIG. 5 according to another embodiment of the disclosure.
- an electronic device (e.g., the electronic device 101 of FIGS. 1 to 3 ) includes a rear plate 380 , and the rear plate 380 may include a glass plate 381 , a printed layer 382 , and a shielding layer 383 sequentially arranged on a coating layer 384 in a first direction +Z.
- the configuration of the rear plate 380 of FIG. 7 may be identical in whole or part to the configuration of the rear plate 380 of FIGS. 5 and 6 .
- the following description focuses primarily on differences according to the pattern direction of the glass plate 381 .
- the glass plate 381 may include a first surface 3811 facing in the first direction +Z and a second surface 3812 facing in the second direction ⁇ Z which is opposite to the first direction +Z.
- the first surface 3811 of the glass plate 381 may include a base area 410 and a pattern area 422 .
- a designated shape of pattern formed in the pattern area 422 may have a shape protruding from the first plate 3811 of the glass plate 381 to an exterior (e.g., in the first direction +Z) and may be formed by an engraved pattern of a mold structure.
- the engraved pattern may form the pattern area 422 of the glass plate 381 as an embossed pattern.
- a plurality of processing lines 430 may be included in each designated shape pattern in the pattern area 422 , including the protruding structure.
- the printed layer 382 may be disposed on the glass plate 381 in the first direction +Z. At least a partial area of the printed layer 382 may be provided in a shape corresponding to the first surface 3811 of the glass plate 381 .
- the outer surface of the printed layer 382 may be prepared in a recessed or grooved structure corresponding to the protruding structure to surround the pattern area 422 .
- embodiments described in connection with FIG. 6 or 7 indicate that the designated shapes of pattern of the pattern area 421 or 422 of the first surface 3811 of the glass plate 381 are recessed or protruded, embodiments of the disclosure are not limited thereto, but various design changes may rather be made thereto. For example, various patterns formed in a recessed structure and protruding structure may be together formed on the first surface 3811 of the glass plate 381 .
- FIG. 8 is an enlarged, cross-sectional view illustrating an area of FIG. 5 according to another embodiment of the disclosure.
- an electronic device (e.g., the electronic device 101 of FIGS. 1 to 3 ) includes a rear plate 380 , and the rear plate 380 may include a glass plate 381 , a printed layer 382 , and a shielding layer 383 sequentially arranged on a coating layer 384 in a first direction +Z.
- the configuration of the rear plate 380 of FIG. 7 may be identical in whole or part to the configuration of the rear plate 380 of FIGS. 5 and 6 .
- the following description focuses primarily on differences according to the surface where the pattern area is formed and the pattern direction.
- the glass plate 381 may include a first surface 3811 facing in the first direction +Z and a second surface 3812 facing in the second direction ⁇ Z which is opposite to the first direction +Z.
- the first surface 3811 of the glass plate 381 may include a base area 410 and pattern areas 423 and 424 .
- a designated shape of pattern formed in the pattern area 423 may include a shape protruding from the second plate 3812 of the glass plate 381 to an exterior (e.g., in the second direction ⁇ Z) and may be formed by an engraved pattern in a mold structure.
- a designated shape of pattern formed in the pattern area 424 may be implemented with recesses (e.g., shapes recessed inward in the glass plate) formed in the second surface 3812 of the glass plate 381 , and may be formed by an embossed pattern formed in a mold structure for forming.
- a plurality of processing lines 430 may be included in each designated shape pattern formed in the pattern areas 423 and 424 .
- the coating layer 384 may be disposed on the glass plate 381 in the second direction ⁇ Z. At least a partial area of the printed layer 382 may be provided in a shape corresponding to the second surface 3812 of the glass plate 381 .
- the outer surface of the coating layer 384 may be prepared in a recessed or grooved structure corresponding to the protruding structure to surround the pattern area 423 .
- the outer surface of the coating layer 384 corresponding to the pattern area 424 may be prepared in a protruding structure or recessed structure corresponding to the recesses or grooves, filling the space formed in the pattern area 424 .
- FIG. 9A is an enlarged, cross-sectional view illustrating a pattern area of a rear plate of an electronic device according to certain embodiments of the disclosure.
- FIG. 9B is an enlarged, cross-sectional view illustrating a pattern area obtained by processing a rear plate using a laser according to an embodiment of the disclosure.
- an electronic device may include a rear plate 380 , and the rear plate 380 may include a glass plate 381 including a pattern area 421 .
- the configuration of the glass plate 381 of FIGS. 9A and 9B may be identical in whole or part to the configuration of the glass plate 381 of FIGS. 5 and 6 .
- the pattern area 421 of the glass plate 381 may include a pattern P having a designated shape and a plurality of processing lines 430 forming regular lines inside the pattern P.
- the processing lines 430 may be spaced apart from each other.
- the plurality of processing lines 430 may be a pattern formed by thermoforming, and may appear as a processing pattern of the machine processing the thermoforming mold is transferred into the pattern area 421 .
- the plurality of processing lines 430 together with the pattern of the designated shapes, may provide an aesthetic design to the glass plate 381 .
- a cross section of a glass plate including a pattern formed by a laser may be identified.
- the pattern formed by laser includes an irregular processed surface and exhibits cracks due to fusion by laser processing and, as compared with the present disclosure, is less aesthetic. Further, unlike the invention disclosed herein, the pattern formed by laser lacks thermoformed processing lines and thus fails to form a pattern area that gives a sense of depth.
- FIGS. 10A and 10B are drawings illustrating a process for manufacturing a rear plate of an electronic device according to an embodiment of the disclosure.
- the process of manufacturing a rear plate 380 may be performed in the order of computer numerical control (CNC) (cutting and processing), edge polishing, thermoforming, polishing, reinforcing, and coating layer formation.
- CNC computer numerical control
- an additional process such as printing film lamination for patterning, which used to be provided after coating layer formation, may be excluded, and patterning may be performed during thermoforming.
- a glass 381 a which is formed of an overall flat plate may be inserted into the mold structure and be formed into a plate having a specific structure.
- a glass including a flat area and a curved area hereinafter, referred to as a 3D glass 381
- a 3D glass 381 may be manufactured during thermoforming and be used in an electronic device.
- a pre-process glass 381 a may be inserted into the first mold structure 600 a .
- the first mold structure 600 a for manufacturing the rear plate 380 of the electronic device may include a first upper core structure 610 a and a first lower core structure 620 a .
- the first upper core structure 610 a and/or the first lower core structure 620 a may partially include shape processing portions 611 a and 621 a for forming the overall shape of the glass 381 .
- an engraved and/or embossed pattern portion 612 a or 613 a for forming a pattern in an area of the glass 381 may be formed.
- the shape processing portions 611 a and 621 a may be formed on the bottom of the first upper core structure 610 a and the top of the first lower core structure 620 a , respectively.
- the shape processing portions 611 a and 621 a have a flat surface in the middle and curved surfaces at the edges, so that the glass 381 a may be formed as a 3D glass 381 .
- the shape processing portion 611 a of the first upper core structure 610 a may protrude toward the first lower core structure 620 a , and the first lower core structure 620 a may be recessed corresponding to the protrusion.
- the pattern portion 612 a or 613 a may be formed on one surface of the shape processing portion 611 a of the first upper core structure 610 a .
- the first pattern portion 612 a may be a pattern shaped to have a single or uniform height.
- the second pattern portion 613 a may be a pattern formed in multiple steps or having a 3D shape including slopes.
- the glass 381 a may be positioned so that an area thereof, which utilizes a pattern, faces the first pattern portion 612 a or the second pattern portion 613 a.
- the first upper core structure 610 a may be lowered and coupled to the first lower core structure 620 a .
- the glass 381 a disposed between the first upper core structure 610 a and the first lower core structure 620 a may be expanded by internal high-temperature preheating.
- the glass 381 a may be molded into an overall shape according to the shape processing portions 611 a and 621 a .
- the pattern shape of the pattern portion 612 a or 613 a may be simultaneously formed in one area of the glass 381 a . For example, when the pattern of the first pattern portion 612 a is transferred according to FIG.
- the glass may have a pattern area in which a pattern of a single height is formed.
- the glass may have a pattern area formed in multiple steps or in a 3D shape having slopes.
- the overall shape of the 3D glass 381 including the three patterns may be complete by cooling.
- thermoforming it is possible to form an overall shape of a rear plate of an electronic device while simultaneously forming a pattern in a portion by thermoforming as described above.
- no additional printing film lamination process is utilized, saving time and processing costs and providing an aesthetic design by a thermoformed pattern.
- FIG. 11 is a drawing illustrating a process for manufacturing a rear plate of an electronic device according to another embodiment of the disclosure.
- the process of manufacturing the rear plate 380 as shown in FIG. 10 may be applied to an overall manufacturing process for the rear plate 380 according to certain embodiments. However, according to an embodiment of the present disclosure, a different process for forming a 3D pattern from the sequence of steps of FIG. 10 may apply.
- a glass 381 a which is formed of an overall flat plate may be inserted into the mold structure and be formed into a plate having a specific structure.
- a glass including a flat area and a curved area hereinafter, referred to as a 3D glass 381
- a 3D glass 381 may be manufactured during thermoforming and be used in an electronic device.
- a step for forming a pattern may be performed.
- the pre-processing glass 381 a may be injected into the second mold structure 600 b .
- the second mold structure 600 b may include a second upper core structure 610 b and a second lower core structure 620 b .
- the pattern portion 612 b for transferring a pattern to the pre-processing glass 381 a may be formed on one surface of the second upper core structure 610 b .
- the pattern portion 612 b may be a pattern having a shape of a single height.
- the second pattern portion 613 a may be a pattern formed in multiple steps or having a 3D shape including slopes.
- the second lower core structure 620 b may be provided as a flat surface capable of supporting one entire surface of the pre-processing glass 381 a.
- the second upper core structure 610 b may descend to press the glass 381 a disposed in the second lower core structure 620 b .
- the pattern shape of the pattern portion 612 b may be formed in an area of the glass 381 a disposed between the second upper core structure 610 b and the second lower core structure 620 b by high-temperature preheating inside the mold and/or pressure transfer.
- the patterned glass 381 b may be inserted into a third mold structure 600 c according to step 22 .
- the third mold structure 600 c may include a third upper core structure 610 c and a third lower core structure 620 c .
- the shape processing portions 611 c and 621 c may be provided on the bottom of the third upper core structure 610 c and the top of the third lower core structure 620 c .
- the shape processing portions 611 c and 621 c have a flat surface in the middle and curved surfaces at the edges, so that the patterned glass 381 b may be formed as a 3D glass 381 .
- the third upper core structure 610 c may be coupled to the third lower core structure 620 c .
- the patterned glass 381 b disposed between the third upper core structure 610 c and the third lower core structure 610 c may be expanded by internal high-temperature preheating.
- the patterned glass 381 b may be subjected to formation of an overall shape according to the shape processing portions 611 c and 621 c.
- the overall shape of the 3D glass 381 including the pattern area may be complete by cooling.
- the pattern area may include a pattern having a shape of a single height formed in the second upper core structure 610 c or a pattern formed in multiple steps or having a 3D shape including slopes.
- FIG. 12 is a drawing illustrating a process for manufacturing a rear plate of an electronic device according to another embodiment of the disclosure.
- the process of manufacturing the rear plate 380 as shown in FIG. 10 may be applied to an overall manufacturing process for the rear plate 380 according to certain embodiments.
- the glass 381 b in which the pattern area 421 has already been included may be processed to form a 3D pattern in a manner different from that shown in FIG. 10 .
- a glass material may be prepared which has the pattern area 421 .
- the pattern formed in the glass material may be a pattern having a shape of a single height or a pattern formed in multiple steps or having a 3D shape including slopes.
- the patterned glass 381 b may be inserted into a third mold structure 600 c according to step 32 .
- the third mold structure 600 c may include a third upper core structure 610 c and a third lower core structure 620 c .
- the shape processing portions 611 c and 621 c may be provided on the bottom of the third upper core structure 610 c and the top of the third lower core structure 620 c .
- the shape processing portions 611 c and 621 c have a flat surface in the middle and curved surfaces at the edges, so that the patterned glass 381 b may be formed as a 3D glass 381 .
- the third upper core structure 610 c may be coupled to the third lower core structure 620 c .
- the patterned glass 381 b disposed between the third upper core structure 610 c and the third lower core structure 610 c may be expanded by internal high-temperature preheating.
- the patterned glass 381 b may be subjected to formation of an overall shape according to the shape processing portions 611 c and 621 c.
- the overall shape of the 3D glass 381 including the pattern may be complete by cooling.
- FIG. 13 is a view illustrating a mold structure for manufacturing a rear plate of an electronic device according to certain embodiments of the disclosure.
- the process of manufacturing the rear plate 380 as shown in FIGS. 10A, 10B, 11, and 12 may be applied to an overall manufacturing process for the rear plate 380 according to certain embodiments.
- a suction portion may be mounted on the mold structure to enhance patterning of the glass.
- thermoforming in thermoforming, a 3D glass including a flat portion and curved portions may be manufactured through a fourth mold structure 600 d and used.
- thermoforming using the fourth mold structure 600 d disclosed may be additionally provided in step 12 of FIGS. 10A and 10B .
- it may be added to step 23 of FIG. 11 .
- it may be added to step 33 of FIG. 12 .
- the glass 381 b including the pattern area 421 may be inserted into the fourth mold structure 600 d .
- the fourth mold structure 600 d may include a fourth upper core structure 610 d and a fourth lower core structure 620 d .
- the shape processing portions 611 d and 621 d may be provided on the bottom of the fourth upper core structure 610 d and the top of the fourth lower core structure 620 d .
- the shape processing portions 611 d and 621 d have a flat surface in the middle and curved surfaces at the edges, so that the glass may be formed as a 3D glass.
- the fourth upper core structure 610 d and the fourth lower core structure 620 d may include a suction portion 614 including at least one suction.
- the fourth upper core structure 610 d may include a plurality of suctions connected to an exterior through the shape processing portion 611 d .
- the plurality of suctions may operate in the pattern area 421 of the glass to enhance the transferability of the pattern during thermoforming.
- a suction operation or an exhaust operation may be performed according to the pattern shape (e.g., engraved or embossed) of the glass.
- the fourth upper core structure 620 d may include a plurality of suctions connected to an exterior through the shape processing portion 621 d .
- the plurality of suctions may operate in the pattern area 421 of the glass to enhance the transferability of the pattern during thermoforming.
- a suction operation or an exhaust operation may be performed according to the pattern shape (e.g., engraved or embossed) of the glass.
- the suction portions 614 individually disposed in the fourth upper core structure 610 d and the fourth lower core structure 620 d may be used simultaneously or sequentially, or one of them may be used singly.
- the suction portion 614 may operate to form the overall shape of the glass.
- FIG. 14 is a view illustrating a mold structure for manufacturing a rear plate of an electronic device according to certain embodiments of the disclosure.
- the process of manufacturing the rear plate 380 as shown in FIGS. 10A, 10B, 11, and 12 may be applied to an overall manufacturing process for the rear plate 380 according to certain embodiments.
- a position adjustment portion may be mounted on the mold structure to enhance patterning of the glass.
- a 3D glass including a flat portion and curved portions may be manufactured through a fifth mold structure 600 e and used.
- the configuration of the fifth mold structure 600 e including the position adjustment portion 617 as disclosed may be applied to the mold structure of FIGS. 10A and 10B, 11 and 12 , or 13 .
- a shape processing portion 611 e for forming an overall shape of the glass may be provided on one area of the fifth upper core structure 610 e of the fifth mold structure 600 e for manufacturing the rear plate of the electronic device 101 .
- a pattern portion 612 e engraved and/or embossed to form a patter in an area of the glass may be provided in another area of the upper core structure 610 .
- the pattern portion 612 e may be formed as a core that is separable from the shape processing portion 611 e , so that a pattern portion having various patterns desired by the worker may be selected and mounted according to his preference.
- the fifth upper core structure 610 e may further include a position adjustment portion 617 disposed on one surface of the pattern portion 612 e .
- the position adjustment portion 617 is manufactured to have a size corresponding to the pattern portion 612 e , adjusting the height to allow the pattern portion 612 e to stick beyond, or be indented from, the shape processing portion 611 e .
- the position adjustment portion 617 may be provided in an area where the pattern transfer to the glass is difficult, implementing a glass having an enhanced pattern shape.
- FIG. 15 is a drawing illustrating a post-thermoforming process according to certain embodiments of the disclosure.
- the process of manufacturing the rear plate 380 as shown in FIGS. 10A, 10B, 11, and 12 may be applied to an overall manufacturing process for the rear plate according to certain embodiments.
- the entire area of the glass is subjected to polishing, thereby providing a smooth surface, enhancing roughness, mitigating haze, and allowing for thickness grinding.
- polishing may be performed.
- resin coating and hardening may first be performed.
- a UV resin may be used for resin coating, and after a coating layer 801 is formed at a thickness capable of covering the recessed or protruding portion of the pattern area 421 of the glass, hardening may be performed.
- polishing using a polishing pad 802 may be performed.
- the polishing pad 802 may remove the resin coating layer 801 formed around the pattern having a designated shape while simultaneously polishing the entire top surface of the glass.
- one surface of the resin coating layer inserted into each shape of the pattern of the designated shape may be coplanar or flush with the top surface of the glass. Accordingly, the polishing pad 802 may be prevented from polishing the edge area of each shape of the pattern, and the shape of the pattern may be avoided from being crushed or polished out.
- An entire shape of the 3D glass including the polished 3D pattern may be complete by peeling off the resin coating layer inserted into each shape of the pattern according to step 43 after polishing.
- FIG. 16 is a drawing illustrating a process for processing lines including slopes according to certain embodiments of the disclosure.
- the process of manufacturing the rear plate 380 as shown in FIGS. 10A, 10B, 11, and 12 may be applied to an overall manufacturing process for the rear plate according to certain embodiments.
- the entire area of the glass is subjected to polishing, thereby providing a smooth surface, enhancing roughness, mitigating haze, and allowing for thickness grinding.
- polishing may be performed.
- a plurality of processing lines 430 may be formed in the pattern area of the rear plate.
- portions of the plurality of processing lines 430 which are relatively more exposed to an exterior, may be removed by polishing.
- each of the processing lines 430 which are shaped as rectangular or circular cylinders may be polished at sides to thus have a designated slope.
- each processing line 431 may have an upper end and a lower end different in area from each other. As polishing is conducted starting from the externally exposed area, each processing line 431 may be shaped so that the upper end is narrowed and the lower end is relatively wider than the upper end. For example, at cross sectional view of the processing lines 431 of FIG. 16 , the length of the upper end is t, and the length of the lower end is T, where T is larger than t.
- each processing line 431 may transform into a triangular or quadrangular pyramid as the difference between the upper end and the lower end increases.
- a rear plate covering a rear surface of an electronic device (e.g., the electronic device 101 of FIGS. 1 to 3 ) may include a glass plate (e.g., the glass plate 381 of FIG. 5 ) including a pattern area (e.g., the pattern area 421 of FIG. 5 ) including a pattern having a designated shape, in at least a partial area, a printed layer (e.g., the printed layer 382 of FIG. 5 ) disposed on a first surface of the glass plate, a shielding layer (e.g., the shielding layer 383 of FIG.
- a glass plate e.g., the glass plate 381 of FIG. 5
- a pattern area e.g., the pattern area 421 of FIG. 5
- a printed layer e.g., the printed layer 382 of FIG. 5
- a shielding layer e.g., the shielding layer 383 of FIG.
- the pattern area of the glass plate may include a plurality of processing lines (e.g., the processing lines 430 of FIG. 5 ) spaced apart from each other.
- the plurality of processing lines may be arranged in a direction substantially perpendicular to one surface on which the pattern having the designated shape is formed.
- the glass plate may include a first surface (e.g., the first surface 3811 ) facing in the first direction and a second surface (e.g., the second surface 3812 of FIG. 5 ) facing in the second direction.
- the pattern area may be formed on at least one of the first surface or the second surface.
- the pattern having the designated shape formed in the pattern area may include a shape of a single height.
- the pattern having the designated shape, formed in the pattern area may be formed in multiple steps or has a three-dimensional (3D) shape including a slope.
- the pattern having the designated shape formed in the pattern area may include a curved surface.
- the glass plate may include a flat area and curved areas formed along two opposite ends of the flat area.
- the pattern area may be formed in at least one of the flat area or the curved areas.
- a structure including the flat area and the curved areas of the glass plate and the pattern area may be shaped by thermoforming.
- the pattern area formed on the first surface may include a structure recessed inward of the glass plate or a structure protruding outward of the glass plate.
- the pattern area formed on the second surface may include a structure recessed inward of the glass plate or a structure protruding outward of the glass plate.
- the rear plate may further include a deposition layer disposed between the glass plate and the printed layer, and a transparent member layer (e.g., the transparent member layer 385 of FIG. 5 ) disposed between the glass plate and the deposition layer. At least a portion of the transparent member layer may be provided as an optically transparent adhesive layer to adhere the glass plate and the deposition layer.
- the rear plate may further include a transparent member layer disposed between the glass plate and the deposition layer. At least a portion of the transparent member layer may be provided as an optically transparent adhesive layer and directly coupled to the printed layer.
- the printed layer may be rendered to have a color by color printing.
- an electronic device may include a housing (e.g., the housing 310 of FIG. 2 ) including a front plate (e.g., the front plate 320 of FIG. 5 ) facing in a first direction and a rear plate (e.g., the rear plate 380 of FIG. 5 ) facing in a second direction opposite to the front plate, at least a portion of the front plate including a transparent area, a battery (e.g., the battery 350 of FIG. 4 ) disposed inside the housing, and a display (e.g., the display 330 of FIG. 4 ) disposed in the housing and including a screen area exposed through the front cover.
- a housing e.g., the housing 310 of FIG. 2
- a front plate e.g., the front plate 320 of FIG. 5
- a rear plate e.g., the rear plate 380 of FIG. 5
- the front plate e.g., the rear plate 380 of FIG. 5
- the front plate e.g.,
- the rear plate may include a glass plate (e.g., the glass plate 381 of FIG. 5 ) including a pattern area (e.g., the pattern area 421 of FIG. 5 ) including a pattern having a designated shape, in at least a partial area, a printed layer (e.g., the printed layer 382 of FIG. 5 ) disposed on the glass plate in the first direction, a shielding layer (e.g., the shielding layer 383 of FIG. 5 ) stacked with the printed layer, and a coating layer (e.g., the coating layer 384 of FIG. 5 ) disposed on the glass plate in the second direction opposite to the first direction.
- the pattern area of the glass plate may include a plurality of processing lines (e.g., the processing lines 430 of FIG. 5 ) spaced apart from each other.
- virtual lines e.g., the virtual lines L of FIG. 5
- respective centers of the plurality of processing lines may be arranged in parallel with one another.
- Each of the plurality of processing lines may have an upper end and a lower end different in area from each other.
- the glass plate may include a flat area and curved areas formed along two opposite ends of the flat area.
- the pattern area may be formed in at least one of the flat area or the curved areas.
- the rear plate may further include a transparent member layer disposed between the glass plate and the printed layer. At least a portion of the transparent member layer may be provided as an optically transparent adhesive layer and directly coupled to the printed layer.
- the printed layer may be rendered to have a color-by-color printing.
- a method for manufacturing a rear plate may include a step in which a glass plate is inserted into a mold structure and is seated in an area of a lower core structure of the mold structure, a step in which the glass plate is pre-heated at a high temperature, and an upper core structure of the mold structure descends toward the lower core structure, a step in which shape processing portions of the upper core structure and the lower core structure press the glass plate to form a curved surface, and a cooling step.
- the method may further include a step in which a pattern portion formed in the upper core structure or the lower core structure presses the glass plate to transfer a pattern having a designated shape while forming the curved surface of the glass plate in the forming step.
- the method may further include the step of forming a pattern having a designated shape on one surface or two opposite surfaces of the glass plate before the glass plate is inserted into the mold structure.
- the pattern having the designated shape of the glass plate may include a plurality of processing lines spaced apart from each other by thermoforming.
- the method may further include polishing after the pattern forming step and, during polishing, each of the plurality of processing lines may form a designated slope on at least one surface.
Abstract
Description
- Certain embodiments of the disclosure relate to a rear plate, an electronic device including the same, and a method for manufacturing a rear plate.
- The term “electronic device” may indicate a device capable of performing a particular function according to installed programs, and may include devices such as a home appliance, an electronic scheduler, a portable multimedia player, a mobile communication terminal, a tablet PC, a video/sound device, a desktop PC or laptop computer, a navigation for automobile, etc. For example, electronic devices may output voice/audio or imagery. As electronic devices are highly integrated, and high-speed, high-volume wireless communication becomes commonplace, such electronic device, such as smartphones and other mobile communication terminals, are increasingly equipped with various functions. For example, an electronic device includes integrated entertainment functionality, such as entertainment functions like playing video games, multimedia functions like replaying music/videos, communication and security functions such as mobile banking, scheduling functions and e-wallet functions.
- The recent trend to emphasize slimness and compactness for smartphones, laptop computers, or other electronic devices has led to adoption of elegant glass parts for use as exterior components for commercial electronic devices. Further, various surface treatment techniques have been developed to provide functional effects in addition to design effects.
- The portability of electronic devices such as smart phones or laptop computers is increasingly important. As a result, high strength components are utilized for exterior materials, and aesthetic considerations are more important, including through various visual or tactile patterns. For example, an external cover, such as a glass cover, having a curved surface, and formed via thermoforming, may provide superior grip and aesthetic appeal. Furthermore, a pattern may be printed or laminated on as a film (e.g., Decofilm), to a particular area of the cover, such as the curved portion, to add aesthetic value to the product.
- However, forming this pattern through additional processes performed after thermoforming may result in limitations to visual and sensory design differentiations. Further, the additional process may consume materials and time, creating an obstacle to efficient production.
- According to certain embodiments of the disclosure, a rear plate of an electronic device is provided as to include a cover in which a pattern is formed thereon during thermoforming, satisfying requirements of depth, demand and design.
- According to certain embodiments of the disclosure, for the aforementioned rear plate and electronic device having the same, it is possible to reduce material and time costs by forming the curved surface and patterning the same during the thermoforming process.
- According to certain embodiments of the disclosure, a rear plate covering a rear surface of an electronic device may include a glass plate including a pattern area including a pattern having a designated shape, in at least a partial area of the glass plate, a printed layer disposed on a first surface of the glass plate, a shielding layer stacked with the printed layer, and a coating layer disposed on a second surface, opposite to the first surface, of the glass plate. The pattern area of the glass plate may include a plurality of processing lines spaced apart from each other.
- According to certain embodiments of the disclosure, an electronic device may include a housing including a front plate facing in a first direction and a rear plate facing in a second direction opposite to the front plate, at least a portion of the front plate including a transparent area, a battery disposed inside the housing, and a display disposed in the housing and including a screen area exposed through the front cover. The rear plate may include a glass plate including a pattern area including a pattern having a designated shape, in at least a partial area of the glass plate, a printed layer disposed on the glass plate in the first direction, a shielding layer stacked with the printed layer, and a coating layer disposed on the glass plate in the second direction opposite to the first direction. The pattern area of the glass plate may include a plurality of processing lines spaced apart from each other.
- According to certain embodiments of the disclosure, a method for manufacturing a rear plate may include a step in which a glass plate is inserted into a mold structure and is seated in an area of a lower core structure of the mold structure, a step in which the glass plate is pre-heated at a high temperature, and an upper core structure of the mold structure descends toward the lower core structure, a step in which shape processing portions of the upper core structure and the lower core structure press the glass plate to form a curved surface, and a cooling step.
- According to certain embodiments of the disclosure, in an electronic device, it is possible to provide an exterior material with aesthetic design.
- According to certain embodiments of the disclosure, in a rear plate and an electronic device including the same, it is possible to form processing lines in a pattern by forming a rear plate pattern during thermoforming. Thus, it is possible to offer a cover enhanced in light of design.
- According to certain embodiments of the disclosure, in a rear plate and an electronic device including the same, no additional process for patterning is needed, thereby saving costs due to material and time while minimizing defects that may occur after assembly.
-
FIG. 1 is a block diagram illustrating an example electronic device in a network environment according to certain embodiments of the disclosure; -
FIG. 2 is a front perspective view illustrating an example electronic device according to certain embodiments of the disclosure; -
FIG. 3 is a rear perspective view illustrating an example electronic device according to certain embodiments of the disclosure; -
FIG. 4 is an exploded perspective view illustrating an example electronic device according to certain embodiments of the disclosure; -
FIG. 5 is a cross-sectional view taken along line A-A′ of the example electronic deviceFIG. 3 according to certain embodiments of the disclosure; -
FIG. 6 is an enlarged, cross-sectional view illustrating an area S ofFIG. 5 according to an example embodiment of the disclosure; -
FIG. 7 is an enlarged, cross-sectional view illustrating an area ofFIG. 5 according to another example embodiment of the disclosure; -
FIG. 8 is an enlarged, cross-sectional view illustrating an area ofFIG. 5 according to another example embodiment of the disclosure; -
FIG. 9A is an enlarged, cross-sectional view illustrating a pattern area of a rear plate of an example electronic device according to certain embodiments of the disclosure;FIG. 9B is an enlarged, cross-sectional view illustrating a pattern area obtained by processing a rear plate using a laser according to an embodiment of the disclosure; -
FIGS. 10A and 10B are drawings illustrating an example process for manufacturing a rear plate of an electronic device according to an embodiment of the disclosure; -
FIG. 11 is a drawing illustrating an example process for manufacturing a rear plate of an electronic device according to another embodiment of the disclosure; -
FIG. 12 is a drawing illustrating an example process for manufacturing a rear plate of an electronic device according to another embodiment of the disclosure; -
FIG. 13 is a view illustrating an example mold structure for manufacturing a rear plate of an electronic device according to certain embodiments of the disclosure; -
FIG. 14 is a view illustrating an example mold structure for manufacturing a rear plate of an electronic device according to certain embodiments of the disclosure; -
FIG. 15 is a drawing illustrating an example post-thermoforming process according to certain embodiments of the disclosure; and -
FIG. 16 is a drawing illustrating an example process for processing lines including slopes according to certain embodiments of the disclosure. -
FIG. 1 is a block diagram illustrating anelectronic device 101 in anetwork environment 100 according to certain embodiments. Referring toFIG. 1 , theelectronic device 101 in thenetwork environment 100 may communicate with anelectronic device 102 via a first network 198 (e.g., a short-range wireless communication network), or anelectronic device 104 or aserver 108 via a second network 199 (e.g., a long-range wireless communication network). According to an embodiment, theelectronic device 101 may communicate with theelectronic device 104 via theserver 108. According to an embodiment, theelectronic device 101 may include aprocessor 120,memory 130, aninput device 150, asound output device 155, adisplay device 160, anaudio module 170, asensor module 176, aninterface 177, ahaptic module 179, acamera module 180, apower management module 188, abattery 189, acommunication module 190, a subscriber identification module (SIM) 196, or anantenna module 197. In some embodiments, at least one (e.g., thedisplay device 160 or the camera module 180) of the components may be omitted from theelectronic device 101, or one or more other components may be added in theelectronic device 101. In some embodiments, some of the components may be implemented as single integrated circuitry. For example, the sensor module 176 (e.g., a fingerprint sensor, an iris sensor, or an illuminance sensor) may be implemented as embedded in the display device 160 (e.g., a display). - The
processor 120 may execute, for example, software (e.g., a program 140) to control at least one other component (e.g., a hardware or software component) of theelectronic device 101 coupled with theprocessor 120, and may perform various data processing or computation. According to an embodiment, as at least part of the data processing or computation, theprocessor 120 may load a command or data received from another component (e.g., thesensor module 176 or the communication module 190) involatile memory 132, process the command or the data stored in thevolatile memory 132, and store resulting data innon-volatile memory 134. According to an embodiment, theprocessor 120 may include a main processor 121 (e.g., a central processing unit (CPU) or an application processor (AP)), and an auxiliary processor 123 (e.g., a graphics processing unit (GPU), an image signal processor (ISP), a sensor hub processor, or a communication processor (CP)) that is operable independently from, or in conjunction with, themain processor 121. Additionally or alternatively, theauxiliary processor 123 may be adapted to consume less power than themain processor 121, or to be specific to a specified function. Theauxiliary processor 123 may be implemented as separate from, or as part of themain processor 121. - The
auxiliary processor 123 may control at least some of functions or states related to at least one component (e.g., thedisplay device 160, thesensor module 176, or the communication module 190) among the components of theelectronic device 101, instead of themain processor 121 while themain processor 121 is in an inactive (e.g., sleep) state, or together with themain processor 121 while themain processor 121 is in an active state (e.g., executing an application). According to an embodiment, the auxiliary processor 123 (e.g., an image signal processor or a communication processor) may be implemented as part of another component (e.g., thecamera module 180 or the communication module 190) functionally related to theauxiliary processor 123. - The
memory 130 may store various data used by at least one component (e.g., theprocessor 120 or the sensor module 176) of theelectronic device 101. The various data may include, for example, software (e.g., the program 140) and input data or output data for a command related thereto. Thememory 130 may include thevolatile memory 132 or thenon-volatile memory 134. - The
program 140 may be stored in thememory 130 as software, and may include, for example, an operating system (OS) 142,middleware 144, or anapplication 146. - The
input device 150 may receive a command or data to be used by other component (e.g., the processor 120) of theelectronic device 101, from an exterior (e.g., a user) of theelectronic device 101. Theinput device 150 may include, for example, a microphone, a mouse, a keyboard, or a digital pen (e.g., a stylus pen). - The
sound output device 155 may output sound signals to an exterior of theelectronic device 101. Thesound output device 155 may include, for example, a speaker or a receiver. The speaker may be used for general purposes, such as playing multimedia or playing record, and the receiver may be used for an incoming calls. According to an embodiment, the receiver may be implemented as separate from, or as part of the speaker. - The
display device 160 may visually provide information to an exterior (e.g., a user) of theelectronic device 101. Thedisplay device 160 may include, for example, a display, a hologram device, or a projector and control circuitry to control a corresponding one of the display, hologram device, and projector. According to an embodiment, thedisplay device 160 may include touch circuitry adapted to detect a touch, or sensor circuitry (e.g., a pressure sensor) adapted to measure the intensity of force incurred by the touch. - The
audio module 170 may convert a sound into an electrical signal and vice versa. According to an embodiment, theaudio module 170 may obtain the sound via theinput device 150, or output the sound via thesound output device 155 or a headphone of an external electronic device (e.g., an electronic device 102) directly (e.g., wiredly) or wirelessly coupled with theelectronic device 101. - The
sensor module 176 may detect an operational state (e.g., power or temperature) of theelectronic device 101 or an environmental state (e.g., a state of a user) external to theelectronic device 101, and then generate an electrical signal or data value corresponding to the detected state. According to an embodiment, thesensor module 176 may include, for example, a gesture sensor, a gyro sensor, an atmospheric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor. - The
interface 177 may support one or more specified protocols to be used for theelectronic device 101 to be coupled with the external electronic device (e.g., the electronic device 102) directly (e.g., wiredly) or wirelessly. According to an embodiment, theinterface 177 may include, for example, a high-definition multimedia interface (HDMI), a universal serial bus (USB) interface, a secure digital (SD) card interface, or an audio interface. - A connecting
terminal 178 may include a connector via which theelectronic device 101 may be physically connected with the external electronic device (e.g., the electronic device 102). According to an embodiment, the connectingterminal 178 may include, for example, a HDMI connector, a USB connector, a SD card connector, or an audio connector (e.g., a headphone connector). - The
haptic module 179 may convert an electrical signal into a mechanical stimulus (e.g., a vibration or motion) or electrical stimulus which may be recognized by a user via his tactile sensation or kinesthetic sensation. According to an embodiment, thehaptic module 179 may include, for example, a motor, a piezoelectric element, or an electric stimulator. - The
camera module 180 may capture a still image or moving images. According to an embodiment, thecamera module 180 may include one or more lenses, image sensors, image signal processors, or flashes. - The
power management module 188 may manage power supplied to theelectronic device 101. According to an embodiment, thepower management module 188 may be implemented as at least part of, for example, a power management integrated circuit (PMIC). - The
battery 189 may supply power to at least one component of theelectronic device 101. According to an embodiment, thebattery 189 may include, for example, a primary cell which is not rechargeable, a secondary cell which is rechargeable, or a fuel cell. - The
communication module 190 may support establishing a direct (e.g., wired) communication channel or a wireless communication channel between theelectronic device 101 and the external electronic device (e.g., theelectronic device 102, theelectronic device 104, or the server 108) and performing communication via the established communication channel. Thecommunication module 190 may include one or more communication processors that are operable independently from the processor 120 (e.g., the application processor (AP)) and supports a direct (e.g., wired) communication or a wireless communication. According to an embodiment, thecommunication module 190 may include a wireless communication module 192 (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (e.g., a local area network (LAN) communication module or a power line communication (PLC) module). A corresponding one of these communication modules may communicate with the external electronic device via the first network 198 (e.g., a short-range communication network, such as Bluetooth™, wireless-fidelity (Wi-Fi) direct, or infrared data association (IrDA)) or the second network 199 (e.g., a long-range communication network, such as a cellular network, the Internet, or a computer network (e.g., LAN or wide area network (WAN)). These various types of communication modules may be implemented as a single component (e.g., a single chip), or may be implemented as multi components (e.g., multi chips) separate from each other. Thewireless communication module 192 may identify and authenticate theelectronic device 101 in a communication network, such as thefirst network 198 or thesecond network 199, using subscriber information (e.g., international mobile subscriber identity (IMSI)) stored in thesubscriber identification module 196. - The
antenna module 197 may transmit or receive a signal or power to or from an exterior (e.g., the external electronic device). According to an embodiment, the antenna module may include one antenna including a radiator formed of a conductor or conductive pattern formed on a substrate (e.g., a printed circuit board (PCB)). According to an embodiment, theantenna module 197 may include a plurality of antennas. In this case, at least one antenna appropriate for a communication scheme used in a communication network, such as thefirst network 198 or thesecond network 199, may be selected from the plurality of antennas by, e.g., thecommunication module 190. The signal or the power may then be transmitted or received between thecommunication module 190 and the external electronic device via the selected at least one antenna. According to an embodiment, other parts (e.g., radio frequency integrated circuit (RFIC)) than the radiator may be further formed as part of theantenna module 197. - At least some of the above-described components may be coupled mutually and communicate signals (e.g., commands or data) therebetween via an inter-peripheral communication scheme (e.g., a bus, general purpose input and output (GPIO), serial peripheral interface (SPI), or mobile industry processor interface (MIPI)).
- According to an embodiment, commands or data may be transmitted or received between the
electronic device 101 and the externalelectronic device 104 via theserver 108 coupled with thesecond network 199. Each of theelectronic devices electronic device 101. According to an embodiment, all or some of operations to be executed at theelectronic device 101 may be executed at one or more of the externalelectronic devices electronic device 101 should perform a function or a service automatically, or in response to a request from a user or another device, theelectronic device 101, instead of, or in addition to, executing the function or the service, may request the one or more external electronic devices to perform at least part of the function or the service. The one or more external electronic devices receiving the request may perform the at least part of the function or the service requested, or an additional function or an additional service related to the request, and transfer an outcome of the performing to theelectronic device 101. Theelectronic device 101 may provide the outcome, with or without further processing of the outcome, as at least part of a reply to the request. To that end, a cloud computing, distributed computing, or client-server computing technology may be used, for example. - The electronic device according to certain embodiments may be one of various types of electronic devices. The electronic devices may include, for example, a portable communication device (e.g., a smart phone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a home appliance. According to an embodiment of the disclosure, the electronic devices are not limited to those described above.
- It should be appreciated that certain embodiments of the present disclosure and the terms used therein are not intended to limit the technological features set forth herein to particular embodiments and include various changes, equivalents, or replacements for a corresponding embodiment. With regard to the description of the drawings, similar reference numerals may be used to refer to similar or related elements. It is to be understood that a singular form of a noun corresponding to an item may include one or more of the things, unless the relevant context clearly indicates otherwise. As used herein, each of such phrases as “A or B,” “at least one of A and B,” “at least one of A or B,” “A, B, or C,” “at least one of A, B, and C,” and “at least one of A, B, or C,” may include all possible combinations of the items enumerated together in a corresponding one of the phrases. As used herein, such terms as “1st” and “2nd,” or “first” and “second” may be used to simply distinguish a corresponding component from another, and does not limit the components in other aspect (e.g., importance or order). It is to be understood that if an element (e.g., a first element) is referred to, with or without the term “operatively” or “communicatively”, as “coupled with,” “coupled to,” “connected with,” or “connected to” another element (e.g., a second element), it means that the element may be coupled with the other element directly (e.g., wiredly), wirelessly, or via a third element.
- As used herein, the term “module” may include a unit implemented in hardware, software, or firmware, and may interchangeably be used with other terms, for example, “logic,” “logic block,” “part,” or “circuitry”. A module may be a single integral component, or a minimum unit or part thereof, adapted to perform one or more functions. For example, according to an embodiment, the module may be implemented in a form of an application-specific integrated circuit (ASIC).
- Certain embodiments as set forth herein may be implemented as software (e.g., the program 140) including one or more instructions that are stored in a storage medium (e.g.,
internal memory 136 or external memory 138) that is readable by a machine (e.g., the electronic device 101). For example, a processor (e.g., the processor 120) of the machine (e.g., the electronic device 101) may invoke at least one of the one or more instructions stored in the storage medium, and execute it, with or without using one or more other components under the control of the processor. This allows the machine to be operated to perform at least one function according to the at least one instruction invoked. The one or more instructions may include a code generated by a complier or a code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Wherein, the term “non-transitory” simply means that the storage medium is a tangible device, and does not include a signal (e.g., an electromagnetic wave), but this term does not differentiate between where data is semi-permanently stored in the storage medium and where the data is temporarily stored in the storage medium. - According to an embodiment, a method according to certain embodiments of the disclosure may be included and provided in a computer program product. The computer program products may be traded as commodities between sellers and buyers. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., compact disc read only memory (CD-ROM)), or be distributed (e.g., downloaded or uploaded) online via an application store (e.g., Play Store™), or between two user devices (e.g., smart phones) directly. If distributed online, at least part of the computer program product may be temporarily generated or at least temporarily stored in the machine-readable storage medium, such as memory of the manufacturer's server, a server of the application store, or a relay server.
- According to certain embodiments, each component (e.g., a module or a program) of the above-described components may include a single entity or multiple entities. According to certain embodiments, one or more of the above-described components may be omitted, or one or more other components may be added. Alternatively or additionally, a plurality of components (e.g., modules or programs) may be integrated into a single component. In such a case, according to certain embodiments, the integrated component may still perform one or more functions of each of the plurality of components in the same or similar manner as they are performed by a corresponding one of the plurality of components before the integration. According to certain embodiments, operations performed by the module, the program, or another component may be carried out sequentially, in parallel, repeatedly, or heuristically, or one or more of the operations may be executed in a different order or omitted, or one or more other operations may be added.
- According to an embodiment, a partial configuration of the electronic device may have an injection-molded surface resulting from injection molding. The injection-molded surface formed by the injection molding structure may include an outer surface of the electronic device or may support various electronic components inside the electronic device.
-
FIG. 2 is a front perspective view illustrating an electronic device according to certain embodiments of the disclosure;FIG. 3 is a rear perspective view illustrating an electronic device according to certain embodiments of the disclosure; - Referring to
FIGS. 2 and 3 , according to an embodiment, anelectronic device 101 may include ahousing 310 with a first (or front)surface 310A, a second (or rear)surface 310B, and aside surface 310C surrounding a space between thefirst surface 310A and thesecond surface 310B. According to another embodiment (not shown), the housing may denote a structure forming part of thefirst surface 310A, thesecond surface 310B, and theside surface 310C ofFIG. 2 . According to an embodiment, at least part of thefirst surface 310A may have a substantially transparent front plate 302 (e.g., a glass plate or polymer plate including various coat layers). Thesecond surface 310B may be formed by arear plate 311 that is substantially opaque. Therear plate 311 may be formed of, e.g., laminated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two thereof. Theside surface 310C may be formed by a side bezel structure (or a “side member”) 318 that couples to thefront plate 302 and therear plate 311 and includes a metal and/or polymer. According to an embodiment, therear plate 311 and theside bezel plate 318 may be integrally formed together and include the same material (e.g., a metal, such as aluminum). - In the embodiment illustrated, the
front plate 302 may include twofirst regions 310D, which seamlessly and bendingly extend from thefirst surface 310A to therear plate 311, on both the long edges of thefront plate 302. In the embodiment (refer toFIG. 3 ) illustrated, therear plate 311 may include twosecond regions 310E, which seamlessly and bendingly extend from thesecond surface 310B to the front plate, on both the long edges. According to an embodiment, the front plate 302 (or the rear plate 311) may include one of thefirst regions 310D (or thesecond regions 310E). Alternatively, thefirst regions 310D or the second regions 301E may partially be excluded. According to an embodiment, at side view of theelectronic device 101, theside bezel structure 318 may have a first thickness (or width) for sides that do not have thefirst regions 310D or thesecond regions 310E and a second thickness, which is smaller than the first thickness, for sides that have thefirst regions 310D or thesecond regions 310E. - According to an embodiment, the
electronic device 101 may include at least one or more of adisplay 301,audio modules sensor modules camera modules key input devices 317, alight emitting device 306, andconnector holes electronic device 101 may exclude at least one (e.g., thekey input device 317 or the light emitting device 306) of the components or may add other components. - According to an embodiment, the
display 301 may be exposed through, e.g., a majority portion of thefront plate 302. According to an embodiment, at least a portion of thedisplay 301 may be exposed through thefront plate 302 forming thefirst surface 310A and thefirst regions 310D of theside surface 310C. According to an embodiment, the edge of thedisplay 301 may be formed to be substantially the same in shape as an adjacent outer edge of thefront plate 302. According to an embodiment (not shown), the interval between the outer edge of thedisplay 301 and the outer edge of thefront plate 302 may remain substantially even to give a larger area of exposure thedisplay 301. - According to an embodiment (not shown), the screen display region of the
display 301 may have a recess or opening in a portion thereof, and at least one or more of theaudio module 314,sensor module 304,camera module 305, and light emittingdevice 306 may be aligned with the recess or opening. According to an embodiment (not shown), at least one or more of theaudio module 314,sensor module 304,camera module 305,fingerprint sensor 316, and light emittingdevice 306 may be included on the rear surface of the screen display region of thedisplay 301. According to an embodiment (not shown), thedisplay 301 may be disposed to be coupled with, or adjacent, a touch detecting circuit, a pressure sensor capable of measuring the strength (pressure) of touches, and/or a digitizer for detecting a magnetic field-type stylus pen. According to an embodiment, at least part of thesensor modules key input device 317 may be disposed in thefirst regions 310D and/or thesecond regions 310E. - According to an embodiment, the
audio modules - According to an embodiment, the
sensor modules electronic device 101. Thesensor modules first surface 310A of thehousing 310 and/or a third sensor module 319 (e.g., a heart-rate monitor (HRM) sensor) and/or a fourth sensor module 316 (e.g., a fingerprint sensor) disposed on thesecond surface 310B of thehousing 310. The fingerprint sensor may be disposed on thesecond surface 310B as well as on thefirst surface 310A (e.g., the display 301) of thehousing 310. Theelectronic device 101 may further include sensor modules not shown, e.g., at least one of a gesture sensor, a gyro sensor, an atmospheric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or anilluminance sensor 304. - According to an embodiment, the
camera modules first camera device 305 disposed on thefirst surface 310A of theelectronic device 101, and asecond camera device 312 and/or aflash 313 disposed on thesecond surface 310B. Thecamera modules flash 313 may include, e.g., a light emitting diode (LED) or a xenon lamp. According to an embodiment, two or more lenses (an infrared (IR) camera, a wide-angle lens, and a telescopic lens) and image sensors may be disposed on one surface of theelectronic device 101. - According to an embodiment, the
key input device 317 may be disposed on theside surface 310C of thehousing 310. According to an embodiment, theelectronic device 101 may exclude all or some of the above-mentionedkey input devices 317 and the excludedkey input devices 317 may be implemented in other forms, e.g., as soft keys, on thedisplay 301. According to an embodiment, the key input device may include thesensor module 316 disposed on thesecond surface 310B of thehousing 310. - According to an embodiment, the
light emitting device 306 may be disposed on, e.g., thefirst surface 310A of thehousing 310. Thelight emitting device 306 may provide, e.g., information about the state of theelectronic device 101 in the form of light. According to an embodiment, thelight emitting device 306 may provide a light source that interacts with, e.g., thecamera module 305. Thelight emitting device 306 may include, e.g., a light emitting device (LED), an infrared (IR) LED, or a xenon lamp. - According to an embodiment, the connector holes 308 and 309 may include a
first connector hole 308 for receiving a connector (e.g., a universal serial bus (USB) connector) for transmitting or receiving power and/or data to/from an external electronic device and/or a second connector hole (e.g., an earphone jack) 309 for receiving a connector for transmitting or receiving audio signals to/from the external electronic device. -
FIG. 4 is an exploded perspective view illustrating an electronic device according to certain embodiments of the disclosure. - Referring to
FIG. 4 , an electronic device 101 (e.g., theelectronic device 101 ofFIGS. 1 to 3 ) may include aside bezel structure 331, a first supporting member 332 (e.g., a bracket), afront plate 320, adisplay 330, a printed circuit board (PCB) 340, abattery 350, a second supporting member 360 (e.g., a rear case), anantenna 370, and a rear plate 380 (e.g., therear plate 311 ofFIG. 3 ). According to an embodiment, theelectronic device 101 may exclude at least one (e.g., the first supportingmember 332 or second supporting member 360) of the components or may add other components. At least one of the components of theelectronic device 101 may be the same or similar to at least one of the components of theelectronic device 101 ofFIG. 2 or 3 and no duplicate description is made below. - According to an embodiment, the first supporting
member 332 may be disposed inside theelectronic device 101 to be connected with theside bezel structure 331 or integrated with theside bezel structure 331. The first supportingmember 332 may be formed of, e.g., a metal and/or non-metallic material (e.g., polymer). Thedisplay 330 may be joined onto one surface of the first supportingmember 332, and the printedcircuit board 340 may be joined onto the opposite surface of the first supportingmember 311. A processor, memory, and/or interface may be mounted on the printedcircuit board 340. The processor may include one or more of, e.g., a central processing unit, an application processor, a graphic processing device, an image signal processing, a sensor hub processor, or a communication processor. - According to an embodiment, the memory may include, e.g., a volatile or non-volatile memory.
- According to an embodiment, the interface may include, for example, a high-definition multimedia interface (HDMI), a universal serial bus (USB) interface, a secure digital (SD) card interface, and/or an audio interface. The interface may electrically or physically connect, e.g., the
electronic device 101 with an external electronic device and may include a USB connector, an SD card/multimedia card (MMC) connector, or an audio connector. - According to an embodiment, the
battery 350 may be a device for supplying power to at least one component of theelectronic device 101. Thebattery 189 may include, e.g., a primary cell which is not rechargeable, a secondary cell which is rechargeable, or a fuel cell. At least a portion of thebattery 350 may be disposed on substantially the same plane as the printedcircuit board 340. Thebattery 350 may be integrally or detachably disposed inside theelectronic device 101. - According to an embodiment, the
antenna 370 may be disposed between therear plate 380 and thebattery 350. Theantenna 370 may include, e.g., a near-field communication (NFC) antenna, a wireless charging antenna, and/or a magnetic secure transmission (MST) antenna. Theantenna 370 may perform short-range communication with, e.g., an external device or may wirelessly transmit or receive power utilized for charging. According to an embodiment, an antenna structure may be formed by a portion or combination of theside bezel structure 331 and/or the first supportingmember 332. -
FIG. 5 is a cross-sectional view taken along line A-A′ of the electronic deviceFIG. 3 according to certain embodiments of the disclosure.FIG. 6 is an enlarged, cross-sectional view illustrating an area S ofFIG. 5 according to an embodiment of the disclosure. - Referring to
FIGS. 5 and 6 , an electronic device (e.g., theelectronic device 101 ofFIGS. 1 to 3 ) includes ahousing 310 for mounting electronic components. Thehousing 310 may include afront plate 320, arear plate 380, aside bezel structure 331, and abracket 332. Theside bezel structure 331 and thebracket 332 may be integrally formed with each other. Thefront plate 320, therear plate 380, theside bezel structure 331, and thebracket 332 ofFIGS. 5 and 6 may be identical in whole or part to thefront plate 320, therear plate 380, theside bezel structure 331, and the first supportingmember 332 ofFIG. 4 . - According to certain embodiments, the
bracket 332 provides a space for receiving a plurality of electronic components. Theside bezel structure 331 may be formed to surround at least a portion of thebracket 332, covering a side surface of theelectronic device 101. To cover the internal space where the plurality of electronic components are received, thebracket 332 and theside bezel structure 331 may be connected forward to a display (e.g., thedisplay 330 ofFIG. 3 ) and thefront plate 320 and backward to therear plate 380 ofFIG. 3 . - According to certain embodiments, the
front plate 320 and/or therear plate 380 may include a flat portion and curved portions. For example, thefront plate 320 as depicted has a 1-1thcurved portion 320 b and a 1-2thcurved portion 320 c at two opposite ends thereof, which extend from a firstflat portion 320 a disposed in the middle. The 1-1thcurved portion 320 b and the 1-2thcurved portion 320 c may be implemented in shapes corresponding to each other and may seamlessly extend to therear plate 380. As another example, therear plate 380 has a 2-1thcurved portion 380 b and a 2-2thcurved portion 380 c at two opposite ends thereof, which extend from a secondflat portion 380 a disposed in the middle. The 2-1thcurved portion 380 b and the 2-2thcurved portion 380 c may be implemented in shapes corresponding to each other and may seamlessly extend to thefront plate 320. - According to certain embodiments, the
rear plate 380 may include a stack of a plurality of layers. For example, therear plate 380 may include a printedlayer 382 and ashielding layer 383 disposed in a first direction +Z from aglass plate 381. As another example, acoating layer 384 may be disposed in a second direction (−Z), which is opposite to the first direction (Z), from theglass plate 381. - As another example, the
front plate 320 may include a stack of a plurality of layers. For example, thefront plate 320 may include a printed layer and a shielding layer disposed in the second direction −Z from a glass plate. As another example, a coating layer may be disposed in the first direction (+Z), which is opposite to the second direction (−Z), from the glass plate. The structure of thefront plate 320 having the stack of the plurality of layers may be formed in an inactive region (e.g., a BM area), but not in an active area in which a display (e.g., thedisplay 301 ofFIGS. 2 and 3 ) is disposed. The structure of therear plate 380 described below may be applied to the structure of thefront plate 320 having the stack of the plurality of layers. - According to certain embodiments, the
glass plate 381 may include afirst surface 3811 facing in the first direction +Z and asecond surface 3812 facing in the second direction −Z which is opposite to the first direction +Z. Thefirst surface 3811 and/or thesecond surface 3812 of theglass plate 381 may include abase area 410 and apattern area 421. For example, at least a partial area of thefirst surface 3811 includes anon-patterned base area 410, and an area, other than thebase area 410, of thefirst surface 3811 may include apattern region 421 having a designated first thickness. Thepattern area 421 may be formed with a pattern having a designated shape, and may extend inwardly or from an end of thebase area 410. The first thickness may provide a sense of depth of the pattern formed in thepattern area 421. The pattern may be defined as a plurality of repeated motifs, styles, or shapes. Various types of patterns may be formed by the worker. - According to certain embodiments, a designated shape of pattern formed in the
pattern area 421 may be implemented with recesses (e.g., shapes recessed inward in the glass plate) formed in thefirst surface 3811 of theglass plate 381 and may be formed by an embossed pattern formed in a mold structure for forming. For example, the embossed pattern formed in a pattern portion of the mold structure may form thepattern area 421 of theglass plate 381 as an engraved pattern. - According to certain embodiments, a plurality of
processing lines 430 may be included in each designated shape pattern formed in thepattern area 421. The plurality ofprocessing lines 430 may form a regularly or repeatedly designated line structure. For example, theprocessing lines 430 formed in thepattern area 421 may be formed along a direction (e.g., the first direction +Z or the second direction −Z) perpendicular to the surface where the pattern is formed along designated virtual lines L. As another example, theprocessing lines 430 may be spaced apart from each other at predetermined intervals. The plurality ofprocessing lines 430 may be a pattern formed by thermoforming, and may be a feature that appears as a processing pattern of the machine processing the thermoforming mold is transferred into thepattern area 421. The plurality ofprocessing lines 430, together with the pattern of the designated shapes, may provide an aesthetic design to theglass plate 381. - According to certain embodiments, the
base area 410 and thepattern area 421 may be implemented simultaneously with the formation of the flat area and the curved area of therear plate 380. For example, the process for pattern transfer (formation) of theglass plate 381 may engraving a designated pattern and form the overall shape of theglass plate 381 while simultaneously forming the pattern area in theglass plate 381 using a mold structure corresponding to the overall shape of theglass plate 381. Accordingly, theglass plate 381 may implement a three-dimensional and emotional design. Details of the pattern transfer (formation) process of theglass plate 381 are described below. - According to certain embodiments, the printed
layer 382 may be disposed on theglass plate 381 in the first direction +Z. The printedlayer 382 includes at least one layer, and when including a plurality of layers, each layer may be formed of a different material. For example, a background printed layer may be formed of a material using black ink and may be manufactured through a background printing process. As another example, a color printed layer may be formed of a material including any color and may be manufactured through a color printing process. The background printed layer may provide a three-dimensional effect to another layer providing color, and the color printed layer may directly provide a color to therear plate 380. - According to an embodiment, at least a partial area of the printed
layer 382 may be provided in a shape corresponding to thefirst surface 3811 of theglass plate 381. For example, when the pattern, in the designated shape, of thepattern area 421 of theglass plate 381 has a recessed structure or a protruding structure in theglass plate 381, the outer surface of the printedlayer 382 corresponding to thepattern area 421 may be prepared in a protruding structure or recessed structure corresponding to the recesses or grooves, filling the space formed in thepattern area 421. - According to certain embodiments, a
transparent member layer 385 may be disposed between theglass plate 381 and the printedlayer 382. Thetransparent member layer 385 may include a dielectric layer, a base film layer, and a primer layer. The base film layer may be formed of a transparent insulating substrate, such as glass or a polymer film, and when the substrate is formed of a polymer film, it may include a flexible substrate. The dielectric layer may be disposed in contact with theglass plate 381 may be prepared by applying, e.g., a known composition without limitations, as an optically transparent adhesive layer. For example, the dielectric layer may be formed of an acrylic adhesive. As another example, the dielectric layer may include at least one of silicon, air, foam, membrane, optical clear adhesive (OCA), sponge, rubber, ink, and polymer (PC or PET). - According to certain embodiments, a deposition layer (not shown) may be disposed between the
transparent member layer 385 and the printedlayer 382. The deposition layer may be manufactured by a physical vapor deposition (PVD) method, such as sputtering. The deposition layer may be formed of at least one or more layers. For example, the deposition layer formed as a single layer may be manufactured to include In oxide and an additional additive, using an electron beam (E-beam) evaporator. The additional additive may include at least one of TiO2, SiO2, or Al2O3. As another example, the deposition layer formed as multi layers may be formed by alternately depositing two materials having different reflectivity (e.g., using In oxide and at least one of TiO2, SiO2, or Al2O3), using an electron beam (E-beam) evaporator. When the deposition layer is formed by sputtering, it may be deposited including at least one of a material, such as Nb2O5, ZnS, TiO, SiO, Al, Sn, or Tin. - According to an embodiment of the disclosure, when the printed
layer 382 is provided as a base layer, it may be stacked together with the deposition layer, and when provided as a color layer having an arbitrary color of the printedlayer 382, the deposition layer may be optionally removed. - According to certain embodiments, the
shielding layer 383 may be disposed on theglass plate 381 in the first direction +Z. Theshielding layer 383 may be stacked on the printedlayer 382 and may include at least one layer. When theshielding layer 383 includes a plurality of layers, each layer may be formed of a different material. Theshielding layer 383 may block a path of light directed to an exterior or the interior of theelectronic device 101. For example, theshielding layer 383 may prevent light leakage of theelectronic device 101 or block the light provided to theelectronic device 101 from an exterior. According to an embodiment, theshielding layer 383 may be formed of a material using black ink, and may be manufactured through a light blocking printing process. - According to certain embodiments, the
coating layer 384 may be disposed on theglass plate 381 in the second direction −Z. Thecoating layer 384 may be formed by being overall coated on thesecond surface 3812 of theglass plate 381. Thecoating layer 384 has a thickness smaller than that of theglass plate 381, and is disposed to surround the outer surface of theelectronic device 101 to prevent penetration of foreign substances or contamination. -
FIG. 7 is an enlarged, cross-sectional view illustrating an area ofFIG. 5 according to another embodiment of the disclosure. - Referring to
FIG. 7 , an electronic device (e.g., theelectronic device 101 ofFIGS. 1 to 3 ) includes arear plate 380, and therear plate 380 may include aglass plate 381, a printedlayer 382, and ashielding layer 383 sequentially arranged on acoating layer 384 in a first direction +Z. The configuration of therear plate 380 ofFIG. 7 may be identical in whole or part to the configuration of therear plate 380 ofFIGS. 5 and 6 . - The following description focuses primarily on differences according to the pattern direction of the
glass plate 381. - According to certain embodiments, the
glass plate 381 may include afirst surface 3811 facing in the first direction +Z and asecond surface 3812 facing in the second direction −Z which is opposite to the first direction +Z. Thefirst surface 3811 of theglass plate 381 may include abase area 410 and apattern area 422. - According to certain embodiments, a designated shape of pattern formed in the
pattern area 422 may have a shape protruding from thefirst plate 3811 of theglass plate 381 to an exterior (e.g., in the first direction +Z) and may be formed by an engraved pattern of a mold structure. For example, the engraved pattern may form thepattern area 422 of theglass plate 381 as an embossed pattern. According to an embodiment, a plurality ofprocessing lines 430 may be included in each designated shape pattern in thepattern area 422, including the protruding structure. - According to certain embodiments, the printed
layer 382 may be disposed on theglass plate 381 in the first direction +Z. At least a partial area of the printedlayer 382 may be provided in a shape corresponding to thefirst surface 3811 of theglass plate 381. For example, when the designated shape of pattern of thepattern area 422 of theglass plate 381 has a structure protruding outward of theglass plate 381, the outer surface of the printedlayer 382 may be prepared in a recessed or grooved structure corresponding to the protruding structure to surround thepattern area 422. - Although the embodiments described in connection with
FIG. 6 or 7 indicate that the designated shapes of pattern of thepattern area first surface 3811 of theglass plate 381 are recessed or protruded, embodiments of the disclosure are not limited thereto, but various design changes may rather be made thereto. For example, various patterns formed in a recessed structure and protruding structure may be together formed on thefirst surface 3811 of theglass plate 381. -
FIG. 8 is an enlarged, cross-sectional view illustrating an area ofFIG. 5 according to another embodiment of the disclosure. - Referring to
FIG. 8 , an electronic device (e.g., theelectronic device 101 ofFIGS. 1 to 3 ) includes arear plate 380, and therear plate 380 may include aglass plate 381, a printedlayer 382, and ashielding layer 383 sequentially arranged on acoating layer 384 in a first direction +Z. The configuration of therear plate 380 ofFIG. 7 may be identical in whole or part to the configuration of therear plate 380 ofFIGS. 5 and 6 . - The following description focuses primarily on differences according to the surface where the pattern area is formed and the pattern direction.
- According to certain embodiments, the
glass plate 381 may include afirst surface 3811 facing in the first direction +Z and asecond surface 3812 facing in the second direction −Z which is opposite to the first direction +Z. Thefirst surface 3811 of theglass plate 381 may include abase area 410 andpattern areas - According to certain embodiments, a designated shape of pattern formed in the
pattern area 423 may include a shape protruding from thesecond plate 3812 of theglass plate 381 to an exterior (e.g., in the second direction −Z) and may be formed by an engraved pattern in a mold structure. According to another embodiment, a designated shape of pattern formed in thepattern area 424 may be implemented with recesses (e.g., shapes recessed inward in the glass plate) formed in thesecond surface 3812 of theglass plate 381, and may be formed by an embossed pattern formed in a mold structure for forming. According to an embodiment, a plurality ofprocessing lines 430 may be included in each designated shape pattern formed in thepattern areas - According to certain embodiments, the
coating layer 384 may be disposed on theglass plate 381 in the second direction −Z. At least a partial area of the printedlayer 382 may be provided in a shape corresponding to thesecond surface 3812 of theglass plate 381. For example, when the pattern shape formed in thepattern area 422 of theglass plate 381 has a structure protruding outward of theglass plate 381, the outer surface of thecoating layer 384 may be prepared in a recessed or grooved structure corresponding to the protruding structure to surround thepattern area 423. As another example, when the pattern, in the designated shape, of thepattern area 424 of theglass plate 381 has a recessed structure or a protruding structure in theglass plate 381, the outer surface of thecoating layer 384 corresponding to thepattern area 424 may be prepared in a protruding structure or recessed structure corresponding to the recesses or grooves, filling the space formed in thepattern area 424. -
FIG. 9A is an enlarged, cross-sectional view illustrating a pattern area of a rear plate of an electronic device according to certain embodiments of the disclosure.FIG. 9B is an enlarged, cross-sectional view illustrating a pattern area obtained by processing a rear plate using a laser according to an embodiment of the disclosure. - According to certain embodiments, an electronic device (e.g., the
electronic device 101 ofFIGS. 1 to 3 ) may include arear plate 380, and therear plate 380 may include aglass plate 381 including apattern area 421. The configuration of theglass plate 381 ofFIGS. 9A and 9B may be identical in whole or part to the configuration of theglass plate 381 ofFIGS. 5 and 6 . - Referring to
FIG. 9A , thepattern area 421 of theglass plate 381 may include a pattern P having a designated shape and a plurality ofprocessing lines 430 forming regular lines inside the pattern P. The processing lines 430 may be spaced apart from each other. The plurality ofprocessing lines 430 may be a pattern formed by thermoforming, and may appear as a processing pattern of the machine processing the thermoforming mold is transferred into thepattern area 421. The plurality ofprocessing lines 430, together with the pattern of the designated shapes, may provide an aesthetic design to theglass plate 381. - On the other hand, referring to
FIG. 9B , a cross section of a glass plate including a pattern formed by a laser may be identified. The pattern formed by laser includes an irregular processed surface and exhibits cracks due to fusion by laser processing and, as compared with the present disclosure, is less aesthetic. Further, unlike the invention disclosed herein, the pattern formed by laser lacks thermoformed processing lines and thus fails to form a pattern area that gives a sense of depth. - A process for manufacturing a rear plate of an electronic device is described below.
-
FIGS. 10A and 10B are drawings illustrating a process for manufacturing a rear plate of an electronic device according to an embodiment of the disclosure. - According to certain embodiments, the process of manufacturing a
rear plate 380 may be performed in the order of computer numerical control (CNC) (cutting and processing), edge polishing, thermoforming, polishing, reinforcing, and coating layer formation. - According to certain embodiments of the disclosure, an additional process, such as printing film lamination for patterning, which used to be provided after coating layer formation, may be excluded, and patterning may be performed during thermoforming.
- According to certain embodiments, by thermoforming, a
glass 381 a which is formed of an overall flat plate may be inserted into the mold structure and be formed into a plate having a specific structure. For example, a glass including a flat area and a curved area (hereinafter, referred to as a 3D glass 381) may be manufactured during thermoforming and be used in an electronic device. - Referring to
FIGS. 10A and 10B , according to step 11, apre-process glass 381 a may be inserted into thefirst mold structure 600 a. According to an embodiment, thefirst mold structure 600 a for manufacturing therear plate 380 of the electronic device may include a firstupper core structure 610 a and a firstlower core structure 620 a. The firstupper core structure 610 a and/or the firstlower core structure 620 a may partially includeshape processing portions glass 381. As another example, in an areas of theshape processing portion upper core structure 610 a and/or thelower core structure 620 a, an engraved and/or embossedpattern portion glass 381 may be formed. - According to an embodiment, the
shape processing portions upper core structure 610 a and the top of the firstlower core structure 620 a, respectively. Theshape processing portions glass 381 a may be formed as a3D glass 381. For example, theshape processing portion 611 a of the firstupper core structure 610 a may protrude toward the firstlower core structure 620 a, and the firstlower core structure 620 a may be recessed corresponding to the protrusion. - According to an embodiment, the
pattern portion shape processing portion 611 a of the firstupper core structure 610 a. For example, referring toFIG. 10A , thefirst pattern portion 612 a may be a pattern shaped to have a single or uniform height. As another example, referring toFIG. 10B , thesecond pattern portion 613 a may be a pattern formed in multiple steps or having a 3D shape including slopes. Theglass 381 a may be positioned so that an area thereof, which utilizes a pattern, faces thefirst pattern portion 612 a or thesecond pattern portion 613 a. - According to step 12, the first
upper core structure 610 a may be lowered and coupled to the firstlower core structure 620 a. Theglass 381 a disposed between the firstupper core structure 610 a and the firstlower core structure 620 a may be expanded by internal high-temperature preheating. As the firstupper core structure 610 a and the firstlower core structure 620 a are coupled and pressure is transmitted, theglass 381 a may be molded into an overall shape according to theshape processing portions pattern portion glass 381 a. For example, when the pattern of thefirst pattern portion 612 a is transferred according toFIG. 10A , the glass may have a pattern area in which a pattern of a single height is formed. As another example, when the pattern of thesecond pattern portion 613 a is transferred according toFIG. 10B , the glass may have a pattern area formed in multiple steps or in a 3D shape having slopes. - According to step 13, when the formation of the glass is complete, the overall shape of the
3D glass 381 including the three patterns may be complete by cooling. - According to an embodiment of the present disclosure, it is possible to form an overall shape of a rear plate of an electronic device while simultaneously forming a pattern in a portion by thermoforming as described above. Thus, no additional printing film lamination process is utilized, saving time and processing costs and providing an aesthetic design by a thermoformed pattern.
-
FIG. 11 is a drawing illustrating a process for manufacturing a rear plate of an electronic device according to another embodiment of the disclosure. - The process of manufacturing the
rear plate 380 as shown inFIG. 10 may be applied to an overall manufacturing process for therear plate 380 according to certain embodiments. However, according to an embodiment of the present disclosure, a different process for forming a 3D pattern from the sequence of steps ofFIG. 10 may apply. - According to certain embodiments, using a process of thermoforming, a
glass 381 a which is formed of an overall flat plate may be inserted into the mold structure and be formed into a plate having a specific structure. For example, a glass including a flat area and a curved area (hereinafter, referred to as a 3D glass 381) may be manufactured during thermoforming and be used in an electronic device. - According to step 21, a step for forming a pattern may be performed. The
pre-processing glass 381 a may be injected into thesecond mold structure 600 b. According to an embodiment, thesecond mold structure 600 b may include a secondupper core structure 610 b and a secondlower core structure 620 b. Thepattern portion 612 b for transferring a pattern to thepre-processing glass 381 a may be formed on one surface of the secondupper core structure 610 b. For example, thepattern portion 612 b may be a pattern having a shape of a single height. As another example, thesecond pattern portion 613 a may be a pattern formed in multiple steps or having a 3D shape including slopes. The secondlower core structure 620 b may be provided as a flat surface capable of supporting one entire surface of thepre-processing glass 381 a. - According to an embodiment, the second
upper core structure 610 b may descend to press theglass 381 a disposed in the secondlower core structure 620 b. The pattern shape of thepattern portion 612 b may be formed in an area of theglass 381 a disposed between the secondupper core structure 610 b and the secondlower core structure 620 b by high-temperature preheating inside the mold and/or pressure transfer. - The patterned
glass 381 b may be inserted into athird mold structure 600 c according tostep 22. According to an embodiment, thethird mold structure 600 c may include a thirdupper core structure 610 c and a thirdlower core structure 620 c. Theshape processing portions upper core structure 610 c and the top of the thirdlower core structure 620 c. Theshape processing portions glass 381 b may be formed as a3D glass 381. - According to step 23, the third
upper core structure 610 c may be coupled to the thirdlower core structure 620 c. The patternedglass 381 b disposed between the thirdupper core structure 610 c and the thirdlower core structure 610 c may be expanded by internal high-temperature preheating. As the thirdupper core structure 610 c and the thirdlower core structure 620 c are coupled and pressure is transferred, the patternedglass 381 b may be subjected to formation of an overall shape according to theshape processing portions - According to step 24, when the formation of the glass is complete, the overall shape of the
3D glass 381 including the pattern area may be complete by cooling. The pattern area may include a pattern having a shape of a single height formed in the secondupper core structure 610 c or a pattern formed in multiple steps or having a 3D shape including slopes. -
FIG. 12 is a drawing illustrating a process for manufacturing a rear plate of an electronic device according to another embodiment of the disclosure. - The process of manufacturing the
rear plate 380 as shown inFIG. 10 may be applied to an overall manufacturing process for therear plate 380 according to certain embodiments. According to certain embodiments of the disclosure, theglass 381 b in which thepattern area 421 has already been included may be processed to form a 3D pattern in a manner different from that shown inFIG. 10 . - According to step 31, a glass material may be prepared which has the
pattern area 421. For example, the pattern formed in the glass material may be a pattern having a shape of a single height or a pattern formed in multiple steps or having a 3D shape including slopes. - The patterned
glass 381 b may be inserted into athird mold structure 600 c according tostep 32. According to an embodiment, thethird mold structure 600 c may include a thirdupper core structure 610 c and a thirdlower core structure 620 c. Theshape processing portions upper core structure 610 c and the top of the thirdlower core structure 620 c. Theshape processing portions glass 381 b may be formed as a3D glass 381. - According to step 33, the third
upper core structure 610 c may be coupled to the thirdlower core structure 620 c. The patternedglass 381 b disposed between the thirdupper core structure 610 c and the thirdlower core structure 610 c may be expanded by internal high-temperature preheating. As the thirdupper core structure 610 c and the thirdlower core structure 620 c are coupled and pressure is transferred, the patternedglass 381 b may be subjected to formation of an overall shape according to theshape processing portions - According to step 34, when the formation of the glass is complete, the overall shape of the
3D glass 381 including the pattern may be complete by cooling. -
FIG. 13 is a view illustrating a mold structure for manufacturing a rear plate of an electronic device according to certain embodiments of the disclosure. - According to certain embodiments, the process of manufacturing the
rear plate 380 as shown inFIGS. 10A, 10B, 11, and 12 may be applied to an overall manufacturing process for therear plate 380 according to certain embodiments. According to certain embodiments of the disclosure, a suction portion may be mounted on the mold structure to enhance patterning of the glass. - According to certain embodiments, in thermoforming, a 3D glass including a flat portion and curved portions may be manufactured through a
fourth mold structure 600 d and used. Referring toFIG. 13 , thermoforming using thefourth mold structure 600 d disclosed may be additionally provided instep 12 ofFIGS. 10A and 10B . As another example, it may be added to step 23 ofFIG. 11 . As another example, it may be added to step 33 ofFIG. 12 . - According to an embodiment, the
glass 381 b including thepattern area 421 may be inserted into thefourth mold structure 600 d. Thefourth mold structure 600 d may include a fourthupper core structure 610 d and a fourthlower core structure 620 d. Theshape processing portions upper core structure 610 d and the top of the fourthlower core structure 620 d. Theshape processing portions - According to an embodiment, the fourth
upper core structure 610 d and the fourthlower core structure 620 d may include asuction portion 614 including at least one suction. For example, the fourthupper core structure 610 d may include a plurality of suctions connected to an exterior through theshape processing portion 611 d. The plurality of suctions may operate in thepattern area 421 of the glass to enhance the transferability of the pattern during thermoforming. A suction operation or an exhaust operation may be performed according to the pattern shape (e.g., engraved or embossed) of the glass. As another example, the fourthupper core structure 620 d may include a plurality of suctions connected to an exterior through theshape processing portion 621 d. The plurality of suctions may operate in thepattern area 421 of the glass to enhance the transferability of the pattern during thermoforming. A suction operation or an exhaust operation may be performed according to the pattern shape (e.g., engraved or embossed) of the glass. - According to an embodiment, the
suction portions 614 individually disposed in the fourthupper core structure 610 d and the fourthlower core structure 620 d may be used simultaneously or sequentially, or one of them may be used singly. As another example, thesuction portion 614 may operate to form the overall shape of the glass. -
FIG. 14 is a view illustrating a mold structure for manufacturing a rear plate of an electronic device according to certain embodiments of the disclosure. - According to certain embodiments, the process of manufacturing the
rear plate 380 as shown inFIGS. 10A, 10B, 11, and 12 may be applied to an overall manufacturing process for therear plate 380 according to certain embodiments. According to certain embodiments of the disclosure, a position adjustment portion may be mounted on the mold structure to enhance patterning of the glass. - According to certain embodiments, in thermoforming, a 3D glass including a flat portion and curved portions may be manufactured through a
fifth mold structure 600 e and used. Referring toFIG. 14 , the configuration of thefifth mold structure 600 e including theposition adjustment portion 617 as disclosed may be applied to the mold structure ofFIGS. 10A and 10B, 11 and 12 , or 13. - According to certain embodiments, a
shape processing portion 611 e for forming an overall shape of the glass may be provided on one area of the fifthupper core structure 610 e of thefifth mold structure 600 e for manufacturing the rear plate of theelectronic device 101. As another example, apattern portion 612 e engraved and/or embossed to form a patter in an area of the glass may be provided in another area of the upper core structure 610. - According to an embodiment, the
pattern portion 612 e may be formed as a core that is separable from theshape processing portion 611 e, so that a pattern portion having various patterns desired by the worker may be selected and mounted according to his preference. - According to an embodiment, the fifth
upper core structure 610 e may further include aposition adjustment portion 617 disposed on one surface of thepattern portion 612 e. Theposition adjustment portion 617 is manufactured to have a size corresponding to thepattern portion 612 e, adjusting the height to allow thepattern portion 612 e to stick beyond, or be indented from, theshape processing portion 611 e. For example, theposition adjustment portion 617 may be provided in an area where the pattern transfer to the glass is difficult, implementing a glass having an enhanced pattern shape. -
FIG. 15 is a drawing illustrating a post-thermoforming process according to certain embodiments of the disclosure. - According to certain embodiments, the process of manufacturing the
rear plate 380 as shown inFIGS. 10A, 10B, 11, and 12 may be applied to an overall manufacturing process for the rear plate according to certain embodiments. According to certain embodiments of the disclosure, after glass patterning, the entire area of the glass is subjected to polishing, thereby providing a smooth surface, enhancing roughness, mitigating haze, and allowing for thickness grinding. - According to certain embodiments, after thermoforming, polishing may be performed. For polishing, according to step 41, resin coating and hardening may first be performed. According to an embodiment, a UV resin may be used for resin coating, and after a
coating layer 801 is formed at a thickness capable of covering the recessed or protruding portion of thepattern area 421 of the glass, hardening may be performed. - Thereafter, according to step 42, polishing using a
polishing pad 802 may be performed. Thepolishing pad 802 may remove theresin coating layer 801 formed around the pattern having a designated shape while simultaneously polishing the entire top surface of the glass. In polishing, one surface of the resin coating layer inserted into each shape of the pattern of the designated shape may be coplanar or flush with the top surface of the glass. Accordingly, thepolishing pad 802 may be prevented from polishing the edge area of each shape of the pattern, and the shape of the pattern may be avoided from being crushed or polished out. - An entire shape of the 3D glass including the polished 3D pattern may be complete by peeling off the resin coating layer inserted into each shape of the pattern according to step 43 after polishing.
-
FIG. 16 is a drawing illustrating a process for processing lines including slopes according to certain embodiments of the disclosure. - According to certain embodiments, the process of manufacturing the
rear plate 380 as shown inFIGS. 10A, 10B, 11, and 12 may be applied to an overall manufacturing process for the rear plate according to certain embodiments. According to certain embodiments of the disclosure, after glass patterning, the entire area of the glass is subjected to polishing, thereby providing a smooth surface, enhancing roughness, mitigating haze, and allowing for thickness grinding. - According to certain embodiments, after thermoforming, polishing may be performed. A plurality of
processing lines 430 may be formed in the pattern area of the rear plate. To make the rear plate aesthetic, portions of the plurality ofprocessing lines 430, which are relatively more exposed to an exterior, may be removed by polishing. For example, each of theprocessing lines 430 which are shaped as rectangular or circular cylinders may be polished at sides to thus have a designated slope. - According to certain embodiments, each
processing line 431 may have an upper end and a lower end different in area from each other. As polishing is conducted starting from the externally exposed area, eachprocessing line 431 may be shaped so that the upper end is narrowed and the lower end is relatively wider than the upper end. For example, at cross sectional view of theprocessing lines 431 ofFIG. 16 , the length of the upper end is t, and the length of the lower end is T, where T is larger than t. - According to certain embodiments, as polishing proceeds, the depth of the
processing lines 431 may decrease, and the angle of the designated slope may increase. For example, eachprocessing line 431 may transform into a triangular or quadrangular pyramid as the difference between the upper end and the lower end increases. - According to certain embodiments of the disclosure, a rear plate (e.g., the
rear plate 380 ofFIG. 5 ) covering a rear surface of an electronic device (e.g., theelectronic device 101 ofFIGS. 1 to 3 ) may include a glass plate (e.g., theglass plate 381 ofFIG. 5 ) including a pattern area (e.g., thepattern area 421 ofFIG. 5 ) including a pattern having a designated shape, in at least a partial area, a printed layer (e.g., the printedlayer 382 ofFIG. 5 ) disposed on a first surface of the glass plate, a shielding layer (e.g., theshielding layer 383 ofFIG. 5 ) stacked with the printed layer, and a coating layer (e.g., thecoating layer 384 ofFIG. 5 ) disposed on a second surface, opposite to the first surface, of the glass plate. The pattern area of the glass plate may include a plurality of processing lines (e.g., theprocessing lines 430 ofFIG. 5 ) spaced apart from each other. - According to certain embodiments, the plurality of processing lines may be arranged in a direction substantially perpendicular to one surface on which the pattern having the designated shape is formed.
- According to certain embodiments, the glass plate may include a first surface (e.g., the first surface 3811) facing in the first direction and a second surface (e.g., the
second surface 3812 ofFIG. 5 ) facing in the second direction. The pattern area may be formed on at least one of the first surface or the second surface. - According to certain embodiments, the pattern having the designated shape formed in the pattern area may include a shape of a single height.
- According to certain embodiments, the pattern having the designated shape, formed in the pattern area, may be formed in multiple steps or has a three-dimensional (3D) shape including a slope.
- According to certain embodiments, the pattern having the designated shape formed in the pattern area may include a curved surface.
- According to certain embodiments, the glass plate may include a flat area and curved areas formed along two opposite ends of the flat area. The pattern area may be formed in at least one of the flat area or the curved areas.
- According to certain embodiments, a structure including the flat area and the curved areas of the glass plate and the pattern area may be shaped by thermoforming.
- According to certain embodiments, the pattern area formed on the first surface may include a structure recessed inward of the glass plate or a structure protruding outward of the glass plate.
- According to certain embodiments, the pattern area formed on the second surface may include a structure recessed inward of the glass plate or a structure protruding outward of the glass plate.
- According to certain embodiments, the rear plate may further include a deposition layer disposed between the glass plate and the printed layer, and a transparent member layer (e.g., the
transparent member layer 385 ofFIG. 5 ) disposed between the glass plate and the deposition layer. At least a portion of the transparent member layer may be provided as an optically transparent adhesive layer to adhere the glass plate and the deposition layer. - According to certain embodiments, the rear plate may further include a transparent member layer disposed between the glass plate and the deposition layer. At least a portion of the transparent member layer may be provided as an optically transparent adhesive layer and directly coupled to the printed layer. The printed layer may be rendered to have a color by color printing.
- According to certain embodiments of the disclosure, an electronic device (e.g., the
electronic device 101 ofFIGS. 1 to 3 ) may include a housing (e.g., thehousing 310 ofFIG. 2 ) including a front plate (e.g., thefront plate 320 ofFIG. 5 ) facing in a first direction and a rear plate (e.g., therear plate 380 ofFIG. 5 ) facing in a second direction opposite to the front plate, at least a portion of the front plate including a transparent area, a battery (e.g., thebattery 350 ofFIG. 4 ) disposed inside the housing, and a display (e.g., thedisplay 330 ofFIG. 4 ) disposed in the housing and including a screen area exposed through the front cover. The rear plate may include a glass plate (e.g., theglass plate 381 ofFIG. 5 ) including a pattern area (e.g., thepattern area 421 ofFIG. 5 ) including a pattern having a designated shape, in at least a partial area, a printed layer (e.g., the printedlayer 382 ofFIG. 5 ) disposed on the glass plate in the first direction, a shielding layer (e.g., theshielding layer 383 ofFIG. 5 ) stacked with the printed layer, and a coating layer (e.g., thecoating layer 384 ofFIG. 5 ) disposed on the glass plate in the second direction opposite to the first direction. The pattern area of the glass plate may include a plurality of processing lines (e.g., theprocessing lines 430 ofFIG. 5 ) spaced apart from each other. - According to certain embodiments, virtual lines (e.g., the virtual lines L of
FIG. 5 ) formed along respective centers of the plurality of processing lines may be arranged in parallel with one another. Each of the plurality of processing lines may have an upper end and a lower end different in area from each other. - According to certain embodiments, the glass plate may include a flat area and curved areas formed along two opposite ends of the flat area. The pattern area may be formed in at least one of the flat area or the curved areas.
- According to certain embodiments, the rear plate may further include a transparent member layer disposed between the glass plate and the printed layer. At least a portion of the transparent member layer may be provided as an optically transparent adhesive layer and directly coupled to the printed layer. The printed layer may be rendered to have a color-by-color printing.
- According to certain embodiments of the disclosure, a method for manufacturing a rear plate may include a step in which a glass plate is inserted into a mold structure and is seated in an area of a lower core structure of the mold structure, a step in which the glass plate is pre-heated at a high temperature, and an upper core structure of the mold structure descends toward the lower core structure, a step in which shape processing portions of the upper core structure and the lower core structure press the glass plate to form a curved surface, and a cooling step.
- According to certain embodiments, the method may further include a step in which a pattern portion formed in the upper core structure or the lower core structure presses the glass plate to transfer a pattern having a designated shape while forming the curved surface of the glass plate in the forming step.
- According to certain embodiments, the method may further include the step of forming a pattern having a designated shape on one surface or two opposite surfaces of the glass plate before the glass plate is inserted into the mold structure.
- According to certain embodiments, the pattern having the designated shape of the glass plate may include a plurality of processing lines spaced apart from each other by thermoforming.
- According to certain embodiments, the method may further include polishing after the pattern forming step and, during polishing, each of the plurality of processing lines may form a designated slope on at least one surface.
- It is apparent to one of ordinary skill in the art that an electronic device including a rear plate and a method for manufacturing the same according to certain embodiments of the present disclosure as described above are not limited to the above-described embodiments and those shown in the drawings, and various changes, modifications, or alterations may be made thereto without departing from the present disclosure.
Claims (15)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2019-0032364 | 2019-03-21 | ||
KR1020190032364A KR20200112228A (en) | 2019-03-21 | 2019-03-21 | Electronic device including back surface plate and manufacturing method of back surface plate |
PCT/KR2020/003257 WO2020189938A1 (en) | 2019-03-21 | 2020-03-09 | Electronic device comprising rear plate and method for manufacturing same |
Publications (2)
Publication Number | Publication Date |
---|---|
US20220167517A1 true US20220167517A1 (en) | 2022-05-26 |
US11877411B2 US11877411B2 (en) | 2024-01-16 |
Family
ID=72519312
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US17/434,798 Active 2040-08-26 US11877411B2 (en) | 2019-03-21 | 2020-03-09 | Electronic device including rear plate and method for manufacturing same |
Country Status (4)
Country | Link |
---|---|
US (1) | US11877411B2 (en) |
KR (1) | KR20200112228A (en) |
CN (1) | CN113614672A (en) |
WO (1) | WO2020189938A1 (en) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
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WO2022119356A1 (en) * | 2020-12-04 | 2022-06-09 | 삼성전자 주식회사 | Method for engraving cover and electronic device including same cover |
CN114726935A (en) * | 2020-12-22 | 2022-07-08 | 华为技术有限公司 | Electronic equipment |
KR20220167569A (en) * | 2021-06-14 | 2022-12-21 | 삼성전자주식회사 | Electronic device including back surface plate and manufacturing method of back surface plate |
KR20230011714A (en) * | 2021-07-14 | 2023-01-25 | 삼성전자주식회사 | Electronic device comprising cover |
KR20230055199A (en) * | 2021-10-18 | 2023-04-25 | 삼성전자주식회사 | Electronic device including housing and manufacturing method thereof |
WO2023224238A1 (en) * | 2022-05-16 | 2023-11-23 | 삼성전자주식회사 | Electronic device comprising engraved layer having color independent of color of printed layer |
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Also Published As
Publication number | Publication date |
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CN113614672A (en) | 2021-11-05 |
KR20200112228A (en) | 2020-10-05 |
US11877411B2 (en) | 2024-01-16 |
WO2020189938A1 (en) | 2020-09-24 |
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