US20220040802A1 - Soldering alloy, soldering paste, preform solder, soldering ball, wire solder, resin flux cored solder, solder joint, electronic circuit board, and multi-layer electronic circuit board - Google Patents

Soldering alloy, soldering paste, preform solder, soldering ball, wire solder, resin flux cored solder, solder joint, electronic circuit board, and multi-layer electronic circuit board Download PDF

Info

Publication number
US20220040802A1
US20220040802A1 US17/417,205 US202017417205A US2022040802A1 US 20220040802 A1 US20220040802 A1 US 20220040802A1 US 202017417205 A US202017417205 A US 202017417205A US 2022040802 A1 US2022040802 A1 US 2022040802A1
Authority
US
United States
Prior art keywords
soldering
soldering alloy
alloy
solder
solder joint
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US17/417,205
Other languages
English (en)
Inventor
Takashi Saito
Shunsaku Yoshikawa
Naoko IZUMITA
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Senju Metal Industry Co Ltd
Original Assignee
Senju Metal Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Senju Metal Industry Co Ltd filed Critical Senju Metal Industry Co Ltd
Assigned to SENJU METAL INDUSTRY CO., LTD. reassignment SENJU METAL INDUSTRY CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: IZUMITA, NAOKO, SAITO, TAKASHI, YOSHIKAWA, SHUNSAKU
Publication of US20220040802A1 publication Critical patent/US20220040802A1/en
Abandoned legal-status Critical Current

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0227—Rods, wires
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B23K35/025—Pastes, creams, slurries
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3463—Solder compositions in relation to features of the printed circuit board or the mounting process
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/144—Stacked arrangements of planar printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04—Assemblies of printed circuits
    • H05K2201/041—Stacked PCBs, i.e. having neither an empty space nor mounted components in between
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10378—Interposers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10734—Ball grid array [BGA]; Bump grid array
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/041—Solder preforms in the shape of solder balls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components

Definitions

  • the present invention relates to a soldering alloy of which a main component is Sn, a use of the soldering alloy, and an electronic circuit board in which the soldering alloy is used.
  • lead-free soldering alloy that does not contain lead has been used in consideration of environment.
  • Examples of the lead-free soldering alloy include SAC305 (Sn-3.0Ag-0.5Cu).
  • a melting point of SAC305 is about 220° C.
  • a peak temperature of a reflow oven is generally set to an intermediate temperature range of about 250° C.
  • the soldering performed in a low temperature range has also been required.
  • the lead-free soldering alloy having a low melting point is used.
  • Such the soldering alloy include Sn-58Bi and Sn-521n.
  • the melting point of Sn-58Bi is about 140° C.
  • That of Sn-52In is about 120° C.
  • the peak temperature of the reflow oven is generally set to 150-160° C.
  • Patent Document 1 discloses a lead-free soldering alloy consisting of three elements of Sn, Ag and In. This conventional soldering alloy has a solidus temperature of 167-212° C. and a liquidus temperature of 179-213° C.
  • Patent Document 2 discloses a lead-free soldering alloy consisting of Sn, In, Ag and Cu. Patent Document 2 discloses several examples in which these essential elements are different in content. Each of the solidus temperature of these examples is about 120° C.
  • Patent Document 3 discloses a lead-free soldering alloy consisting of 0.5 to 5 mass % of Ag, 0.5 to 20 mass % of In, 0.1 to 3 mass % of Bi, 3 mass % or less of an additive element, and balance Sn.
  • the additive element is at least one element selected from Sb, Zn, Ni, Ga, Ge and Cu.
  • Patent Document 3 discloses examples of the alloys that contain 0.5 and 1.5 weight % of Ni as the additive element.
  • the lead-free soldering alloy that simply has the low melting point is not suitable for a step-soldering including the soldering performed in the above-mentioned intermediate temperature range. That is, the property that melts at a temperature below the melting point of the low-temperature soldering alloy represented by Sn-58Bi leads to a possibility of being re-melted in the soldering step of the low-temperature soldering alloy. Therefore, the soldering alloy of Patent Document 2 having the solidus temperature lower than the melting point of the low-temperature soldering alloy cannot be subjected to the soldering step that is different from the soldering step of the said low-temperature soldering alloy.
  • soldering alloy of Patent Document 3 has not been developed focusing on its melting point. Therefore, it is not known whether or not the soldering alloy of Patent Document 3 is suitable for the soldering performed in the above-mentioned intermediate temperature range.
  • soldering alloy suitable for such the step-soldering not only meets the requirement on the melting point but also has excellent in a mechanical reliability. Therefore, there is room to develop the soldering alloy focusing on these viewpoints.
  • Inventors of the present invention started with a Sn—In alloy consisting of two elements, Sn and In. When a content of In exceeds a certain amount, this alloy forms an intermetallic compound phase called a ⁇ phase composed of In and Sn. However, since this ⁇ phase is brittle, there is a risk of lowering a ductility of the soldering alloy. Therefore, the content of In was set around 20 weight % such that a desired mechanical property could be achieved without decreasing the ductility.
  • a first invention is a soldering alloy having the following features.
  • the soldering alloy includes an alloy composition consisting of 13-22 mass % of In, 0.5-2.8 mass % of Ag, 0.5-5.0 mass % of Bi, 0.002-0.05% of Ni, and a balance of Sn.
  • a second invention has the following features in the first invention.
  • the alloy composition further contains, at least one selected from P, Ge and Ga in total of 0.09 mass % or less.
  • a third invention has the following features in the first or second invention.
  • the alloy composition further contains 0.005-0.1 mass % of Sb.
  • a fourth invention has the following features in any one of the first to third inventions.
  • the content of In is 15-20%.
  • a fifth invention has the following features in the fourth invention.
  • An upper limit of the content of In is 17%.
  • a sixth invention has the following features in any one of the first to fifth inventions.
  • the content of Ag is 1.0-2.5%.
  • a seventh invention has the following features in any one of the first to sixth inventions.
  • the content of Bi is 1.0-2.5%.
  • An eighth invention has the following features in any one of the first to seventh inventions.
  • Ni 0.003-0.04%.
  • a ninth invention has the following features in any one of the first to eighth inventions.
  • a tenth invention further has the following features in any one of the first to ninth inventions.
  • a solidus temperature of the soldering alloy is 160° C. or more.
  • a liquidus temperature of the soldering alloy is 210° C. or less.
  • An eleventh invention further has the following features in the tenth invention.
  • the solidus temperature is 165° C. or higher.
  • the liquidus temperature is 200° C. or less.
  • a twelfth invention is a soldering paste.
  • the soldering paste consists of the soldering alloy in any one of the first to eleventh inventions.
  • a thirteenth invention is a preform solder.
  • the preform solder consists of the soldering alloy in any one of the first to the eleventh inventions.
  • a fourteenth invention is a soldering ball.
  • the soldering ball consists of the soldering alloy in any one of the first to eleventh inventions.
  • a fifteenth invention is a wire solder.
  • the wire solder consists of the soldering alloy in any one of the first to eleventh inventions.
  • a sixteenth invention is a resin flux cored solder.
  • the resin flux cored solder consists of the soldering alloy in any one of the first to eleventh inventions.
  • a seventeenth invention is a solder joint.
  • the solder joint includes the soldering alloy in any one of the first to eleventh inventions (the solder joint does not include a soldering alloy other than the soldering alloy in any one of the first to eleventh inventions).
  • An eighteenth invention is an electronic circuit board.
  • the electronic circuit board is joined by using the solder joint of the seventeenth invention.
  • a nineteenth invention further has the following features in the eighteenth invention.
  • the electronic circuit board further includes a high thermal resistance electronic part which has a higher thermal resistance temperature than the electronic part.
  • the high thermal resistance electronic part is joined to the electronic circuit board by using another solder joint.
  • the another solder joint includes another soldering alloy having a melting point higher than the liquidus temperature of the soldering alloy included in the solder joint.
  • a twentieth invention further has the following features in the eighteenth invention.
  • the electronic circuit board further includes a low thermal resistance electronic part which has a lower thermal resistance temperature than the electronic part.
  • the low thermal resistance electronic part is joined to the electronic circuit board by using another solder joint.
  • the another solder joint includes another soldering alloy having a melting point lower than the solidus temperature of the soldering alloy included in the solder joint.
  • a twenty-first invention is a multi-layer electronic circuit board.
  • the multi-layer electronic circuit board includes a first board and a second board.
  • the first board includes an electronic part joined by using the solder joint of the seventeenth invention.
  • the second board is laminated on the first board.
  • the second board includes a high thermal resistance electronic part which has a higher thermal resistance temperature than the electronic part.
  • the high thermal resistance electronic part and the second board are joined by using another solder joint.
  • the another solder joint includes another soldering alloy having a melting point higher than the liquidus temperature of the soldering alloy included in the solder joint.
  • a twenty-second invention is a multi-layer electronic circuit board.
  • the multi-layer electronic circuit board includes a first board and a second board.
  • the first board includes an electronic part joined by using the solder joint of the seventeenth invention.
  • the second board is laminated on the first board.
  • the second board includes a low thermal resistance electronic part which has a lower thermal resistance temperature than the electronic part.
  • the low thermal resistance electronic part and the second board are joined by using another solder joint.
  • the another solder joint includes another soldering alloy having a melting point lower than solidus temperature of soldering alloy included in the solder joint.
  • FIG. 1 is a diagram showing a relationship between a content of In in Sn—In based alloy and a melting point thereof;
  • FIG. 2 is a diagram showing a relationship between a content of Ag in Sn-20In-Ag based alloy and the melting point thereof;
  • FIG. 3 is a diagram showing a relationship between a content of Bi in Sn-20In—Bi based alloy and the melting point thereof;
  • FIG. 4 is a schematic view showing a first example of an electronic circuit board
  • FIG. 5 is a schematic view showing a second example of the electronic circuit board
  • FIG. 6 is a schematic diagram showing a first example of a multi-layer electronic circuit board
  • FIG. 7 is a schematic diagram showing a first example of a multi-layer electronic circuit board
  • FIG. 8 is a diagram including cross-sectional SEM photographs of Example 2 and Referential example 2;
  • FIG. 9 is a diagram including cross-sectional SEM photographs of Example 3 and Referential example 4;
  • FIG. 10 is a diagram including cross-sectional SEM photographs of Example 2 and Referential example 2;
  • FIG. 11 is a diagram including cross-sectional SEM photographs of Example 3 and Referential example 4.
  • the intermediate to low temperature range represents a temperature range from 160 to 210° C.
  • An intermediate temperature range represents a temperature range above an upper limit of the intermediate to low temperature range (i.e., 210° C.).
  • a low temperature range represents a temperature range below a lower limit of the intermediate to low temperature range (i.e., 160° C.).
  • a melting point represents a solidus temperature or a liquidus temperature.
  • the soldering alloy according to the present invention includes an alloy composition consisting of 13-22% of In, 0.5-2.8% of Ag, 0.5-5.0% of Bi, 0.002-0.05% of Ni, and a balance Sn.
  • an alloy composition consisting of 13-22% of In, 0.5-2.8% of Ag, 0.5-5.0% of Bi, 0.002-0.05% of Ni, and a balance Sn.
  • FIG. 1 is a graph showing a relationship between content of In in a Sn—In based alloy and the melting point thereof.
  • the melting point of the Sn—In based alloy tends to decrease as the content of In increases.
  • the content of In is more than 20%
  • the solidus temperature starts to decrease rapidly.
  • the content of In is greater than 25%
  • the solidus temperature drops to about 117° C. Therefore, the soldering alloy based on an alloy of which the content of In is more than 25% is not suitable as the soldering alloy for the soldering performed in the intermediate temperature range.
  • an upper limit of the content of In is about 22%, the solidus temperature condition is satisfied. Therefore, this upper limit is 22%. From a viewpoint to satisfy the condition on the solidus temperature, a preferable upper limit is 21%, and a more preferable upper limit is 20%.
  • the alloy of which the content of In is less than 5% forms a Sn-rich phase called a ⁇ -Sn phase.
  • the alloy forms a phase of InSn 4 compound called a ⁇ phase.
  • This ⁇ phase is stably formed when the content of In is 5-25%.
  • the content of In decreases, there is a risk that a phase transformation occurs between the ⁇ phase and the ⁇ -Sn phase in accompany with temperature change.
  • the phase transformation occurs, there is a risk that a mechanical reliability of the alloy will decrease because a deformation of the alloy will occur due to changes in volume.
  • the lower limit of the content of In is 13%, this transformation can be suppressed. Therefore, this lower limit is 13%. From the viewpoint of the mechanical reliability, a preferable lower limit is 15%.
  • the ⁇ phase has a brittle property as compared with SAC305. Therefore, if the content of In in the ⁇ phase is increased, there is a risk that ductility of the soldering alloy may be lowered and the mechanical reliability of the soldering alloy may be lowered. Therefore, from the viewpoint to ensure the ductility, it is preferable that the upper limit of the content of In is not too large. A specific preferred upper limit is 17%.
  • FIG. 2 is a graph showing a relationship between the content of Ag in a Sn-20In-Ag based alloy and the melting point thereof.
  • the liquidus temperature is located in the intermediate to low temperature range.
  • the content of Ag is 2.8% or less, this liquidus temperature tends to decrease as the content increases.
  • the content of Ag is greater than 2.8%, the liquidus temperature will start to rise. Therefore, when the content of Ag is more than 2.8%, it may prevent the melting point from decreasing due to the addition of In. Therefore, the upper limit of the content of Ag is 2.8%. From the viewpoint to suppress the increase in the liquidus temperature, the preferable upper limit is 2.5%.
  • the phase of this intermetallic compound is precipitated, the modification of the soldering alloy can be suppressed.
  • the lower limit of the content of Ag is 0.5%.
  • the preferable lower limit is 1.0%.
  • FIG. 3 is a graph showing a relationship between content of Bi in a Sn-20In—Bi based alloy and the melting point thereof.
  • the liquidus temperature is located in the intermediate to low temperature range. This liquidus temperature tends to decrease as the content of Bi increases.
  • the upper limit of the content of Bi is 5.0%. From the viewpoint to suppress the decrease in the liquidus temperature, the preferable upper limit is 2.5%.
  • Bi is dissolved in Sn in a certain amount.
  • the solid solution of Bi makes it possible to suppress modification of soldering alloy. From the viewpoint to exert this effect, the lower limit of the content of Bi has been set to 0.5%. The preferable lower limit is 1.0% In addition, an excessive solid solution of Bi may reduce the ductility of the soldering alloy. From this viewpoint, it is preferable that the upper limit of the content of Bi is not too large. The specific preferred upper limit is 2.5%.
  • Ni has a property of fining an alloy organization.
  • the mechanical property of the soldering alloy is improved.
  • the lower limit of the content of Ni has been set to 0.002%.
  • the preferable lower limit is 0.003% and the more preferable lower limit is 0.004%
  • an excessive miniaturization by Ni has a risk to lower the ductility of the soldering alloy.
  • an excessive addition of Ni raise the liquidus temperature of the soldering alloy. From this viewpoint, it is desirable that the content of Ni is not too high. Therefore, the upper limit of the content of Ni is 0.05%.
  • the preferable upper limit is 0.04% and the more preferable upper limit is 0.03%.
  • a balance of the soldering alloy of the present invention is composed of S n. Further, in addition to the essential elements described above, an unavoidable impurity may be contained in the soldering alloy Even if the unavoidable impurity is contained, it does not affect the effects due to the soldering alloy Examples of the unavoidable impurity include Pb and As.
  • each content of In, Ag, Bi and Ni is as described above. However, from results of Examples described later, it is preferable that a relationship of these contents satisfies the following relationship (1).
  • the soldering alloy of which the content of In, Ag, Bi and Ni is within the above described range and also satisfies the relationship (1) is preferred from the viewpoint of the melting point and the mechanical property. From the viewpoint of an intended melting point and mechanical property, an upper limit value of the relationship (1) is more preferably 2.55.
  • the following element may be optionally contained in the soldering alloy according to the present invention.
  • Sn constitutes the balance of the soldering alloy to which the optional element has been added.
  • soldering alloy according to the present invention has properties of suppressing an oxidation of Sn and improving a wettability of the soldering alloy. Therefore, these elements are optionally added to the soldering alloy according to the present invention. In particular, when the soldering alloy according to the present invention is used as a preform solder, at least one selected from these elements is preferably added because it is possible to suppress a discoloration of a surface of the soldering alloy.
  • the upper limit of the content is 0.09% in total. When the total content exceeds 0.09%, a fluidity of the soldering alloy on the solder surface may be inhibited.
  • Each content of the respective elements is not particularly limited. However, a preferable content of P is 0.005-0.06% and a more preferable content is 0.005-0.01%.
  • the preferable content of Ge is 0.003-0.06% and the more preferable content is 0.003-0.01%.
  • the preferable content of Ga is 0.005-0.06% and the more preferable content is 0.005-0.01%.
  • Sb has a property of fining the alloy organization. Therefore, Sb is optionally added to the soldering alloy according to the present invention When Sb is added, its content is 0.005-0.1%. When the content of Sb is less than 0.005%, the miniaturization effect is not exerted. When the content of Sb is more than 0.1%, the liquidus temperature of the soldering alloy is increased.
  • the melting point of the soldering alloy according to the present invention is not particularly limited as long as it is within the intermediate to low temperature range.
  • the solidus temperature of the soldering alloy according to the present invention is preferably 160° C. or more.
  • the following effect is expected in the step-soldering including the soldering performed in the intermediate to low temperature range. That is, it is possible to prevent the soldering alloy according to the present invention which has been subjected to the soldering and has been soldered from being re-melted during the soldering performed for a low temperature soldering alloy.
  • the low temperature soldering alloy include Sn-58Bi and Sn-521n.
  • the preferable solidus temperature is 165° C. or more.
  • the liquidus temperature of the soldering alloy according to the present invention is preferably 210° C. or less.
  • the liquidus temperature is not exceed 210° C., the following effect is expected in the step-soldering including the soldering performed in the intermediate to low temperature range. That is, it is possible to prevent an intermediate or high temperature soldering alloy which has been soldered from being re-melted during the soldering performed for the soldering alloy according to the present invention.
  • the medium temperature soldering alloy include SAC305.
  • the high temperature soldering alloy include a soldering alloy of Sn-90Pb.
  • the preferable liquidus temperature is 200° C. or less.
  • the soldering alloy according to present invention is suitably used as a soldering paste.
  • the soldering paste is produced by mixing a powdery soldering alloy with a flux containing a Rosin-based resin, an activator, a solvent, or the like.
  • the flux is not particularly limited as long as it is commonly used in the art, and materials used therefor and blending ratio thereof are not particularly limited.
  • the blending ratio (mass ratio) of the powdery soldering alloy and the flux is generally 90:10. However, this blending ratio is appropriately adjusted according to an end-usage of the soldering paste.
  • the soldering alloy according to the present invention is also suitably used as a preform solder molded into a ribbon-shape, a disk-shape, a washer-shape, a tip-shape, or a ring-shape.
  • the preform solder is produced by methods commonly known in the art.
  • the shape of the preform solder is not limited to the above described shapes, and may be appropriately changed according to its end-usage.
  • the preform solder may include the flux therein.
  • the preform solder may be coated with the flux on its surface.
  • the soldering alloy according to the present invention is also suitably used as a soldering ball.
  • the soldering ball is used to form a hemispherical bump in a semiconductor package such as ball-grid arrays (BGAs).
  • BGAs ball-grid arrays
  • the soldering ball is produced by methods commonly known in the art.
  • the soldering alloy according to the present invention is used as the soldering ball, its diameter is preferably in a range of 1-1000 ⁇ m. Further, a sphericity is preferably 0.90 or more, more preferably 0.95 or more, and most preferably 0.99 or more.
  • the soldering alloy according to the present invention is also suitably used as a wire solder processed into a wire. Further, the wire solder is also suitably used as a resin flux cored solder having the flux therein.
  • the wire solder and resin flux cored solder are suitable for the soldering with a solder iron.
  • the wire solder and resin flux cored solder are produced in a manner generally known in the art.
  • the soldering alloy according to the present invention is also suitably used as a solder joint.
  • the solder joint connects an electronic part such as an integrated circuit (IC) chip and a printed board (e.g., an interposer) in a semiconductor package.
  • IC integrated circuit
  • a printed board e.g., an interposer
  • the solder joint joints to connect the semiconductor package and the printed circuit board.
  • the solder joint is a connecting portion formed at a bonding portion.
  • the solder joint is formed under common soldering conditions.
  • soldering alloy according to the present invention functions as the solder joint
  • an electronic circuit board where an electronic part is joined via this solder joint corresponds to an electronic circuit board according to the present invention.
  • FIG. 4 is a schematic diagram illustrating a first example of the electronic circuit board according to the present invention.
  • a board 10 shown in FIG. 4 includes electronic parts 11 and 12 .
  • the board 10 is, for example, a printed-circuit board.
  • the electronic parts 11 and 12 are, for example, IC chips.
  • a maximum use temperature of the electronic part 11 is within the intermediate to low temperature range.
  • the maximum use temperature of the electronic part 12 is above the lower limit of the intermediate temperature range (i.e., 210° C.). That is, a thermal resistance of the electronic part 12 is higher than that of the electronic part 11 .
  • the electronic part 11 is joined to the board 10 via a solder joint 13 .
  • the solder joint 13 is composed of the soldering alloy according to the present invention.
  • the electronic part 12 is joined to the board 10 via a solder joint 14 .
  • the solder joint 14 is composed of the intermediate temperature soldering alloy or the high-temperature soldering alloy. That is, the solder joint 14 is composed of another soldering alloy having the melting point (more precisely, the solidus temperature) higher than the liquidus temperature of the soldering alloy according to the present invention.
  • FIG. 5 is a schematic diagram illustrating a second example of the electronic circuit board according to the present invention. Note that the electronic part 11 and the solder joint 13 shown in FIG. 5 are common to those shown in FIG. 4 . Therefore, the descriptions for these elements are omitted.
  • a board 20 shown in FIG. 5 includes an electronic part 21 .
  • the board 20 is, for example, a printed-circuit board.
  • the electronic part 21 is, for example, an IC-chip.
  • the maximum use temperature of the electronic part 21 is below the lower limit of the low temperature range (i.e., 160° C.). That is, the thermal resistance of the electronic part 21 is lower than that of the electronic part 11 .
  • the electronic part 21 is joined to the board 20 via a solder joint 22 .
  • the solder joint 22 is composed of a low temperature soldering alloy. That is, the solder joint 22 is composed of another soldering alloy having the melting point (more precisely, the liquidus temperature) lower than the solidus temperature of the soldering alloy according to the present invention.
  • FIG. 6 is a schematic diagram illustrating a first example of a multi-layer electronic circuit board according to the present invention.
  • a board 30 shown in FIG. 6 is a multi-layer board in which aboard 32 and an interposer 33 are laminated on aboard 31 .
  • the board 31 is, for example, a printed-circuit board.
  • the board 32 is, for example, a packaging board.
  • the board 32 includes an interposer 33 and an electronic part 34 .
  • the board 32 and the interposer 33 corresponds to a first board or a second board.
  • the interposer 33 includes an electronic part 35 .
  • the electronic parts 34 and 35 are, for example, integrated circuit chips.
  • the maximum use temperature of the electronic part 34 is above the lower limit of the intermediate temperature range.
  • the maximum use temperature of the electronic part 35 is within the intermediate to low temperature range. That is, the thermal resistance of the electronic part 34 is higher than that of the electronic part 35 .
  • the electronic part 35 is joined to the interposer 33 via a solder joint 36 .
  • the solder joint 36 is composed of the soldering alloy according to the present invention.
  • the electronic part 34 is joined to the board 32 via a solder joint 37 .
  • the solder joint 37 is also used for a junction between the boards 31 and 32 and the junction between the board 32 and the interposer 33 .
  • the solder joint 37 is composed of the intermediate and high soldering alloy. That is, the solder joint 37 is composed of another soldering alloy having the melting point (more precisely, the solidus temperature) higher than liquidus temperature of the soldering alloy according to the present invention.
  • FIG. 7 is a schematic diagram illustrating a second example of the multi-layer electronic circuit board according to the present invention. Note that the boards 31 and 32 and the interposer 33 shown in FIG. 7 are common to those shown in FIG. 6 . Therefore, the descriptions for these elements are omitted.
  • a board 40 shown in FIG. 7 includes an electronic part 41 .
  • the interposer 33 includes an electronic part 42 .
  • the electronic parts 41 and 42 are, for example, integrated circuit chips.
  • the maximum use temperature of the electronic part 41 is within the intermediate to low temperature range.
  • the maximum use temperature of the electronic part 42 is below the lower limit of the low temperature range. That is, the thermal resistance of the electronic part 42 is lower than that of the electronic part 41 .
  • the electronic part 41 is joined to the board 32 via a solder joint 43 .
  • the solder joint 43 is composed of the soldering alloy according to the present invention.
  • the solder joint 43 is also used for the junction between the boards 31 and 32 and the junction between the board 32 and the interposer 33 .
  • the electronic part 42 is joined to the interposer 33 via a solder joint 44 .
  • the solder joint 44 is composed of the low-temperature soldering alloy. That is, the solder joint 44 is composed of another soldering alloy having the melting point (more precisely, the solidus temperature) lower than the liquidus temperature of the soldering alloy according to the present invention.
  • the soldering by using a soldering alloy having a relatively higher melting point is performed earlier.
  • the soldering by using a soldering alloy having a relatively lower melting point is performed later.
  • the step soldering is performed using, for example, a reflow method.
  • a reflow soldering it is preferable to raise an ambient temperature to a temperature about 5 to 20° C. higher than the liquidus temperature of the soldering alloy to be subjected to the soldering. Then, it is preferred to cool the ambient temperature at 2-3° C./sec.
  • soldering alloy consisting of alloy composition shown in Table 1 was prepared and the melting point of soldering alloy was measured. The reliability of these soldering alloy was evaluated by a shear test with cryogenic cycles.
  • Solidus temperature and liquidus temperature were carried out by the same DSC (Differential scanning calorimetry) method as JISZ 3198-1 measuring method. Samples of which the solidus temperature are above 160° C. were evaluated as “GD”, whereas those of which the solidus temperature are lower than 160° C. were evaluated as “PR”. Samples with solidus temperature above 165° C. were evaluated as “EC”. Samples with liquidus temperature below 210° C. were evaluated as “GD”. Samples higher than 210° C. were evaluated as “PR”. Samples with liquidus temperature below 200° C. were evaluated as “EC”.
  • Solder alloy was atomized to give a solder powder. Solder powder was mixed with fluxes to produce a soldering paste. This soldering paste was printed on a 0.8-mm-thick printed board (material: FR-4) using a 100- ⁇ m-thick metal mask. The BGA component was mounted on the print board using a mounter. Then, reflow soldering was performed at a maximum temperature of 200° C. for a holding time of 60 seconds to obtain board samples.
  • Example 1 had the solidus temperature of 180° C. and the liquidus temperature of 196° C.
  • Example 2 had the solidus temperature of 173° C. and the liquidus temperature of 195° C.
  • Example 3 had the solidus temperature of 167° C. and the liquidus temperature of 191° C.
  • the result in the melting point of Referential example 6 showed that the solidus temperature of Referential example 6 was 135° C. and it was found that the solidus temperature was lower than 160° C. This result indicates that the solidus temperature drops sharply when the added amount of In is higher than 25%.
  • soldering alloy of Examples 2 and 3 and the soldering alloys of Referential examples 2 and 4 were prepared.
  • the soldering alloy of Referential example 2 has a composition obtained by removing Ni from that of Example 2.
  • the soldering alloy of Referential example 4 has a composition obtained by removing Ni from that of Example 3.
  • FIG. 8 is a cross-sectional SEM photography of Example 2 and Referential example 2.
  • FIG. 9 is a cross-sectional SEM photography of Example 3 and Referential example 4. It was found from FIGS. 8 and 9 that the alloy organization of Example 2 or 3 in which Ni is included was fined as compared to that of the corresponding referential examples. This results indicate that the considerations discussed in Referential examples 2-4 may be reasonable. Note that the black portions shown in FIGS. 8 and 9 represent intermetallic compounds lost by the polishing.
  • solder powders prepared from these soldering alloys was used to obtain board samples.
  • the method for preparing the board samples was performed according to that in the shear test. Then, a bonding interface of the BGA terminal and the printed board was photographed with the FE-SEM at a magnification of 1000 times.
  • FIG. 10 is a cross-sectional SEM photography of Example 2 and Referential example 2.
  • FIG. 11 is a cross-sectional SEM photography of Example 3 and Referential example 4. It was found from FIGS. 11 and 12 that the miniaturization of the alloy organization in Example 2 or 3 were maintained even in a state of the BGA terminal. The results indicate that soldering alloy according to present invention may be useful as the BGA terminal and the solder joint.

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
US17/417,205 2019-05-27 2020-05-11 Soldering alloy, soldering paste, preform solder, soldering ball, wire solder, resin flux cored solder, solder joint, electronic circuit board, and multi-layer electronic circuit board Abandoned US20220040802A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019098427A JP6708942B1 (ja) 2019-05-27 2019-05-27 はんだ合金、はんだペースト、プリフォームはんだ、はんだボール、線はんだ、脂入りはんだ、はんだ継手、電子回路基板および多層電子回路基板
JP2019-098427 2019-05-27
PCT/JP2020/018837 WO2020241225A1 (ja) 2019-05-27 2020-05-11 はんだ合金、はんだペースト、プリフォームはんだ、はんだボール、線はんだ、脂入りはんだ、はんだ継手、電子回路基板および多層電子回路基板

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2020/018837 A-371-Of-International WO2020241225A1 (ja) 2019-05-27 2020-05-11 はんだ合金、はんだペースト、プリフォームはんだ、はんだボール、線はんだ、脂入りはんだ、はんだ継手、電子回路基板および多層電子回路基板

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US18/126,695 Continuation US20230226648A1 (en) 2019-05-27 2023-03-27 Method for step-soldering

Publications (1)

Publication Number Publication Date
US20220040802A1 true US20220040802A1 (en) 2022-02-10

Family

ID=70976379

Family Applications (2)

Application Number Title Priority Date Filing Date
US17/417,205 Abandoned US20220040802A1 (en) 2019-05-27 2020-05-11 Soldering alloy, soldering paste, preform solder, soldering ball, wire solder, resin flux cored solder, solder joint, electronic circuit board, and multi-layer electronic circuit board
US18/126,695 Pending US20230226648A1 (en) 2019-05-27 2023-03-27 Method for step-soldering

Family Applications After (1)

Application Number Title Priority Date Filing Date
US18/126,695 Pending US20230226648A1 (en) 2019-05-27 2023-03-27 Method for step-soldering

Country Status (11)

Country Link
US (2) US20220040802A1 (US07803786-20100928-C00028.png)
EP (1) EP3888840A4 (US07803786-20100928-C00028.png)
JP (1) JP6708942B1 (US07803786-20100928-C00028.png)
KR (1) KR102342394B1 (US07803786-20100928-C00028.png)
CN (1) CN113677477B (US07803786-20100928-C00028.png)
BR (1) BR112021012348B1 (US07803786-20100928-C00028.png)
MX (1) MX2021007954A (US07803786-20100928-C00028.png)
MY (1) MY195069A (US07803786-20100928-C00028.png)
SG (1) SG11202107118QA (US07803786-20100928-C00028.png)
TW (1) TWI744907B (US07803786-20100928-C00028.png)
WO (1) WO2020241225A1 (US07803786-20100928-C00028.png)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112621020B (zh) * 2020-12-25 2022-06-21 中机智能装备创新研究院(宁波)有限公司 一种镍基药芯钎料、制备方法及应用
CN113996967B (zh) * 2021-08-19 2023-04-28 苏州优诺电子材料科技有限公司 一种中温熔点合金及其应用

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5256370B1 (en) * 1992-05-04 1996-09-03 Indium Corp America Lead-free alloy containing tin silver and indium
JP2002096191A (ja) * 2000-09-18 2002-04-02 Matsushita Electric Ind Co Ltd はんだ材料およびこれを利用する電気・電子機器
ES2541439T3 (es) * 2001-03-01 2015-07-20 Senju Metal Industry Co., Ltd Pasta de soldadura sin plomo
JP2004188453A (ja) * 2002-12-11 2004-07-08 Harima Chem Inc Ｓｎ系はんだ合金
JP5696173B2 (ja) 2005-08-12 2015-04-08 アンタヤ・テクノロジーズ・コープ はんだ組成物
JP4618089B2 (ja) * 2005-10-12 2011-01-26 千住金属工業株式会社 Ｓｎ−Ｉｎ系はんだ合金
EP2131450B1 (en) * 2007-03-12 2013-08-07 Senju Metal Industry Co., Ltd Anisotropic electroconductive material
JP4962570B2 (ja) * 2007-07-18 2012-06-27 千住金属工業株式会社 車載電子回路用Ｉｎ入り鉛フリーはんだ
US8975757B2 (en) * 2008-03-05 2015-03-10 Senju Metal Industry Co., Ltd. Lead-free solder connection structure and solder ball
EP2679334B1 (en) * 2011-02-25 2020-05-27 Senju Metal Industry Co., Ltd Use of a solder alloy and soldered joint of high current density
ES2658593T3 (es) * 2012-12-18 2018-03-12 Senju Metal Industry Co., Ltd Aleación de soldadura libre de plomo
CN103341699A (zh) * 2013-07-04 2013-10-09 浙江亚通焊材有限公司 一种取代锡铅钎料的Sn-In-Ag无铅钎料
CN105431253A (zh) * 2014-06-24 2016-03-23 播磨化成株式会社 焊料合金、焊料组合物、钎焊膏以及电子线路基板
US10322471B2 (en) * 2014-07-21 2019-06-18 Alpha Assembly Solutions Inc. Low temperature high reliability alloy for solder hierarchy
CN113146093A (zh) * 2015-05-05 2021-07-23 铟泰公司 用于严苛环境电子器件应用的高可靠性无铅焊料合金
CN105665956A (zh) * 2016-03-23 2016-06-15 徐宏达 一种用于钎焊铝及其合金的软钎料合金
CN107877031A (zh) * 2017-11-27 2018-04-06 东莞市千岛金属锡品有限公司 一种无铅低温焊料及其制备方法
CN108971793B (zh) * 2018-08-24 2021-04-23 云南科威液态金属谷研发有限公司 一种低温无铅焊料
US10833050B1 (en) * 2019-05-22 2020-11-10 Lenovo (Singapore) Pte. Ltd. Interposer, electronic substrate, and method for producing electronic substrate

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
Partial Translation of JP 2007-105750 A. (Year: 2007) *

Also Published As

Publication number Publication date
MX2021007954A (es) 2022-06-28
JP6708942B1 (ja) 2020-06-10
KR20210083367A (ko) 2021-07-06
SG11202107118QA (en) 2021-07-29
CN113677477A (zh) 2021-11-19
EP3888840A1 (en) 2021-10-06
EP3888840A4 (en) 2022-09-21
BR112021012348A2 (US07803786-20100928-C00028.png) 2021-11-16
JP2020192552A (ja) 2020-12-03
WO2020241225A1 (ja) 2020-12-03
KR102342394B1 (ko) 2021-12-22
BR112021012348B1 (pt) 2022-05-03
TWI744907B (zh) 2021-11-01
MY195069A (en) 2023-01-06
TW202104607A (zh) 2021-02-01
CN113677477B (zh) 2022-10-14
US20230226648A1 (en) 2023-07-20

Similar Documents

Publication Publication Date Title
JP4968381B2 (ja) 鉛フリーはんだ
KR102566561B1 (ko) 땜납 합금, 솔더 페이스트 및 전자 회로 기판
JP6145164B2 (ja) 鉛フリーはんだ、鉛フリーはんだボール、この鉛フリーはんだを使用したはんだ継手およびこのはんだ継手を有する半導体回路
US20230226648A1 (en) Method for step-soldering
EP3666453B1 (en) Solder alloy, solder paste, solder ball, resin-flux cored solder, and solder joint
EP3715040B1 (en) Solder alloy, solder paste, solder ball, resin cored solder, and solder joint
KR20170005511A (ko) Ｂｉ-Ｓｎ계 고온 땜납 합금으로 이루어진 고온 땜납 이음
US11607752B2 (en) Solder alloy, solder joint material, and electronic circuit board
JP2010029868A (ja) 無鉛はんだペースト、それを用いた電子回路基板及びその製造方法
TWI695893B (zh) 銲錫膏
JP3782743B2 (ja) ハンダ用組成物、ハンダ付け方法および電子部品
JP2019141881A (ja) 鉛フリーはんだ合金
KR102525848B1 (ko) 땜납 합금, 땜납 페이스트, 땜납 볼, 땜납 프리폼 및 납땜 이음
JP3992107B2 (ja) 無鉛はんだ合金

Legal Events

Date Code Title Description
AS Assignment

Owner name: SENJU METAL INDUSTRY CO., LTD., JAPAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:SAITO, TAKASHI;YOSHIKAWA, SHUNSAKU;IZUMITA, NAOKO;SIGNING DATES FROM 20210323 TO 20210401;REEL/FRAME:056619/0587

STPP Information on status: patent application and granting procedure in general

Free format text: NON FINAL ACTION MAILED

STPP Information on status: patent application and granting procedure in general

Free format text: NON FINAL ACTION MAILED

STPP Information on status: patent application and granting procedure in general

Free format text: FINAL REJECTION MAILED

STPP Information on status: patent application and granting procedure in general

Free format text: DOCKETED NEW CASE - READY FOR EXAMINATION

STPP Information on status: patent application and granting procedure in general

Free format text: NON FINAL ACTION MAILED

STCV Information on status: appeal procedure

Free format text: APPEAL BRIEF (OR SUPPLEMENTAL BRIEF) ENTERED AND FORWARDED TO EXAMINER

STPP Information on status: patent application and granting procedure in general

Free format text: NON FINAL ACTION MAILED

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION