US20210259099A1 - Stretchable conductor circuit - Google Patents
Stretchable conductor circuit Download PDFInfo
- Publication number
- US20210259099A1 US20210259099A1 US17/302,455 US202117302455A US2021259099A1 US 20210259099 A1 US20210259099 A1 US 20210259099A1 US 202117302455 A US202117302455 A US 202117302455A US 2021259099 A1 US2021259099 A1 US 2021259099A1
- Authority
- US
- United States
- Prior art keywords
- conductive wires
- mesh structure
- contact points
- stretchable
- manipulation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 title claims abstract description 72
- 230000001681 protective effect Effects 0.000 claims abstract description 16
- 239000004744 fabric Substances 0.000 claims description 9
- 239000000463 material Substances 0.000 claims description 6
- 238000005260 corrosion Methods 0.000 claims description 4
- 230000007797 corrosion Effects 0.000 claims description 4
- 230000003647 oxidation Effects 0.000 claims description 4
- 238000007254 oxidation reaction Methods 0.000 claims description 4
- 238000007747 plating Methods 0.000 claims description 4
- 230000007423 decrease Effects 0.000 claims description 3
- 239000000615 nonconductor Substances 0.000 claims description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims 4
- 239000012799 electrically-conductive coating Substances 0.000 claims 2
- 239000010931 gold Substances 0.000 claims 2
- 229910052737 gold Inorganic materials 0.000 claims 2
- 229910052759 nickel Inorganic materials 0.000 claims 2
- 238000004519 manufacturing process Methods 0.000 abstract description 2
- 238000004891 communication Methods 0.000 description 10
- 238000000034 method Methods 0.000 description 8
- 239000011248 coating agent Substances 0.000 description 5
- 238000000576 coating method Methods 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 238000005452 bending Methods 0.000 description 3
- 229920001940 conductive polymer Polymers 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 238000000059 patterning Methods 0.000 description 3
- 229920000642 polymer Polymers 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000002085 persistent effect Effects 0.000 description 2
- 239000002861 polymer material Substances 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000004433 Thermoplastic polyurethane Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- -1 for example Substances 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
- H01B5/12—Braided wires or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/06—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances
- H01B1/12—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances organic substances
- H01B1/124—Intrinsically conductive polymers
-
- A—HUMAN NECESSITIES
- A41—WEARING APPAREL
- A41D—OUTERWEAR; PROTECTIVE GARMENTS; ACCESSORIES
- A41D1/00—Garments
- A41D1/002—Garments adapted to accommodate electronic equipment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
- H01B13/0026—Apparatus for manufacturing conducting or semi-conducting layers, e.g. deposition of metal
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
- H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B7/00—Insulated conductors or cables characterised by their form
- H01B7/04—Flexible cables, conductors, or cords, e.g. trailing cables
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/0283—Stretchable printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/038—Textiles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
-
- A—HUMAN NECESSITIES
- A41—WEARING APPAREL
- A41D—OUTERWEAR; PROTECTIVE GARMENTS; ACCESSORIES
- A41D1/00—Garments
- A41D1/002—Garments adapted to accommodate electronic equipment
- A41D1/005—Garments adapted to accommodate electronic equipment with embedded cable or connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B7/00—Insulated conductors or cables characterised by their form
- H01B7/06—Extensible conductors or cables, e.g. self-coiling cords
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0275—Fibers and reinforcement materials
- H05K2201/0281—Conductive fibers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09218—Conductive traces
- H05K2201/09245—Crossing layout
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09681—Mesh conductors, e.g. as a ground plane
Definitions
- the present application relates generally to electrical conductors and, more specifically, to a stretchable conductor circuit.
- This disclosure provides a stretchable conductor circuit.
- a stretchable conductive structure in a first embodiment, includes a set of conductive wires and a stretchable laminate.
- the set of conductive wires each including a protective surface, the set of conductive wires patterned in a mesh structure to accommodate a manipulation while providing electrical conductivity across the set of conductive wires.
- the stretchable laminate encapsulates the mesh structure, the stretchable laminate is configured to return the mesh structure of the set of conductive wires to an original state after the manipulation.
- a garment in a second embodiment, includes a fabric and a flexible conductor structure disposed within or adjacent to the fabric.
- the flexible conductive circuit includes one or more circuit components and a stretchable conductor structure connecting the one or more circuit components.
- the stretchable conductor structure includes a set of conductive wires and a stretchable laminate.
- the set of conductive wires each including a protective surface, the set of conductive wires patterned in a mesh structure to accommodate a manipulation while providing electrical conductivity across the set of conductive wires.
- the stretchable laminate encapsulates the mesh structure, the stretchable laminate is configured to return the mesh structure of the set of conductive wires to an original state after the manipulation.
- a method provides for manufacturing a stretchable conductor structure.
- the method includes applying a protective surface to each of a set of conductive wires; patterning the set of conductive wires into a mesh structure that accommodates a manipulation while providing electrical conductivity across the set of conductive wires; and encapsulating the mesh structure in a stretchable laminate in a manner that the stretchable laminate returns the set of conductive wires to the mesh structure of the set of conductive wires to an original state after the manipulation ends.
- FIGS. 1A-1C illustrate example stretchable conductor structures according to this disclosure
- FIGS. 2A-2C illustrate exemplary manipulations of a conductor structure according to the embodiments of the present disclosure
- FIG. 3 illustrates an example process for a stretchable conductor structure according to this disclosure
- FIG. 4 illustrates an example enhanced garment according to this disclosure.
- FIG. 5 illustrates an example enhanced garment according to this disclosure.
- FIGS. 1 through 5 discussed below, and the various embodiments used to describe the principles of the present disclosure in this patent document are by way of illustration only and should not be construed in any way to limit the scope of the disclosure.
- FIGS. 1A-1C illustrate example stretchable conductor structure according to this disclosure.
- FIG. 1A illustrates an example stretchable conductor structure 100 according to this disclosure.
- FIG. 1B illustrates an example un-stretched conductor structure 101 according to various embodiments of the present disclosure.
- FIG. 1C illustrates an example stretched conductor structure 102 according to the embodiments of the present disclosure.
- the embodiments shown in FIGS. 1A-1C are for illustration only. Other embodiments could be used without departing from the scope of the present disclosure.
- FIGS. 1A-1C illustrate a novel flexible and stretchable conductor structure 100 capable of conducting relatively high electrical current.
- the flexible conductor structure 100 is suited for wearable electronics, but is also compatible with other applications requiring flex/stretch circuits.
- the flexible conductor structure 100 is comprised of a patterned conductive wire 105 in a mesh structure 110 , for example, woven or knitted, that is covered in a stretchable laminate 115 .
- a material for example, copper, aluminum, silver, etc. can be used for the set of conductive wires 105 .
- the conductive wires 105 may not be stretchable, but can be formed into a mesh structure 110 that provides a flexibility of the overall conductor structure 100 .
- the conductor wires 105 can include corrosion/oxidation protective surfaces (e.g., Ni/Au plating).
- the mesh structure 110 is stretchable in the axis 120 , 125 roughly diagonal (any angle but embodiment is 45 degrees) to the weft direction 130 and warp direction 135 .
- the conductive wires 105 include a first portion 145 of conductive wires aligned in the weft direction 130 and a second portion 150 of the conductive wires 145 aligned in the warp direction 135 .
- the first portion 145 and the second portion 150 can include different amounts of conductive wires 105 . While the first portion 145 and the second portion 150 of conductive wires 105 illustrated as perpendicularly aligned in FIGS. 1A and 1B , the first portion 145 and second portion 150 can be aligned at any angle.
- Using a mesh structure 110 also allows for using a pcb-type etching method to create the circuit patterns on a volume scale.
- a mesh circuit structured using the PCB-type etching can replace a copper foil or the conductive wires. While the term “mesh” is used throughout the Specification to describe the arrangement of conductive wires, the mesh structure is not limited to a mesh and further includes knits, braids, netting, etc. In certain embodiments, a shape of the cross section of the mesh structure 110 could be flat, round, tubular, etc. When the cross section of the mesh structure 110 is tubular, for example, could be formed around another component.
- the first portion 145 and the second portion 150 of the conductive wires 105 cross each other to form a plurality of contact points 140 .
- An adjacent contact point 155 is a contact point directly connected by a length of conductive wire 105 .
- Adjacent contact points 155 have alternate overlaps of the first portion 145 and the second portion 150 .
- each adjacent contact point 155 to a contact point 140 where a conductive wire 105 of the first portion 145 crosses over a conductive wire 105 of the second portion 150 , has a conductive wire 105 of the second portion 150 crossing over a conductive wire 105 of the first portion 145 .
- a diagonal contact point 160 , 165 is a contact point 140 that is directly across a gap between contact points.
- Diagonal contact points can be aligned contact points 160 or un-aligned contacts points 165 compared to the manipulation direction 120 .
- the aligned contact points 160 are contact points 140 directly across a gap that align with the manipulation direction 120 .
- the un-aligned contact points 165 are contact points 140 directly across a gap that are perpendicular or not aligned with the manipulation direction 120 .
- a distance 170 between aligned contact points 160 in an original state of the mesh structure 110 is relatively similar to a distance 175 between un-aligned contact points 165 .
- the distance 170 between the aligned contact points 160 increases and the distance 175 between the un-aligned contact points 165 decreases.
- the distances 170 , 175 return to the original state of the mesh structure 110 .
- FIG. 1B An example of the stretching is illustrated by the un-stretched conductor structure 101 where the mesh structure 110 is in an original state in FIG. 1B and the stretched conductor structure 102 where the mesh structure 110 is in a manipulated state in FIG. 1C .
- the ends of the conductive wires 105 and the stretchable laminate 115 could extend further than what is illustrated in FIGS. 1B and 1C .
- Conductor structure 102 illustrates the conductive wires 105 somewhat aligning with the stretch direction 120 from the original positions of the un-stretched conductor structure 101 .
- the mesh structure 110 allows each conductor strand to slide against adjacent conductor strands rather than plastically deform.
- the numerous metal to metal contact points 140 (preferably Ni/Au plated copper) provide low resistance means of transferring electrical current between adjacent conductor threads.
- the mesh structure 110 is laminated using stretchable material or stretchable laminate 115 .
- the mesh structure 110 can be embedded in the stretchable laminate 115 .
- the mesh structure 110 can be double-sided coated using a pressure sensitive adhesive on a stretchable polymer material (examples are silicone, thermoplastic polyurethane, etc.) that adheres to the mesh pattern and provides for the mesh structure to return to the original shape or the mesh structure 110 in the un-stretched conductor structure 101 after a manipulation, such as flexing or stretching.
- the polymer also can serve as an electrical insulator for the conductor wires 105 .
- a permanently adhered flexible and/or stretchable conductive coating such as a conductive ink, a conductive polymer, or a conductive epoxy (such as Dupont PE874) can be patterned on the mesh structure 110 , prior to encapsulation in the stretchable laminate 115 , for multiple purposes.
- a conductive polymer aids in further improving and reducing the point to point electrical contact of the individual strands in the mesh, while also allowing flexing and stretching.
- the polymer could also act as an etch mask during the circuit patterning step.
- the mesh structure 110 provides for a flexible and stretchable circuit material. However, it can also be patterned using meandering horseshoe/serpentine patterns (x and y axis) and wave patterns (z-axis) to further enhance flexibility. Patterning with this type of circuit further enhances both flexibility and stretchability by minimizing high stress concentrations in the pattern as it stretches (particularly along the curves).
- FIGS. 2A-2C illustrate exemplary manipulations of a flex conductor according to the embodiments of the present disclosure.
- the embodiment shown in FIG. 2 is for illustration only. Other embodiments could be used without departing from the scope of the present disclosure.
- FIG. 2A illustrates a stretching manipulation 200 according to the embodiments of the present disclosure.
- the stretch direction 120 corresponds to a horizontal direction in reference to FIG. 2A .
- the stretchable laminate 115 provides the function of returning the conductor structure to its original mesh structure.
- FIG. 2B illustrates a twisting manipulation 205 according to the embodiments of the present disclosure.
- the twisting manipulation 205 provides an inconsistent stretch across the conductor structure.
- Each connection point 140 allows different sections of the conductor structure to provide different amounts of “stretch” to allow the twisting of the conductor structure.
- FIG. 2C illustrates a bending manipulation 210 according to the embodiments of the present disclosure.
- the bending manipulation 210 involves one side of the flexible conductor structure stretching while the opposite side is in contraction.
- the flexibility of the conductor structure also for this manipulation and the return from to an un-bended mesh structure.
- FIG. 3 illustrates an example process for a stretchable flex conductor according to this disclosure.
- the process depicted in FIG. 3 may be performed to produce the enhanced garment in FIG. 4 or the enhanced garment in FIG. 5 .
- a protective surface is applied to the conductive wires 105 .
- the protective surface can be a Ni/Au plating for example.
- the protective surface provides a resilience to the conductive wires 105 to lengthen the over useful life of the conductor structure and also provide a greater transmission of current between adjacent conductive wires 105 .
- the protective surface can provide corrosion resistance and oxidation resistance.
- the protective surface is applied after the conductive wires 105 are patterned into the mesh structure in operation 310 .
- the conductive wires 105 are patterned into a mesh structure 110 .
- the conductive wires 105 can be woven or knitted in a mesh structure 110 .
- the mesh structure 110 can accommodate a manipulation, such as a stretching manipulation 200 , a twisting manipulation 205 , and a bending manipulation 210 .
- the mesh structure 110 can also include meandering horseshoe, meandering serpentine patterns, and wave patterns.
- a stretchable conductive coating can be applied on the mesh structure 110 .
- the conductive coating 110 can be applied as a pattern on the mesh structure 110 , or around the contact points of the mesh structure 110 .
- the conductive coating can be, for example, a conductive ink, a conductive polymer, or a conductive epoxy.
- the conductive coating enhances the electrical connection between strands of the conductive wires 105 .
- the mesh structure can be patterned into a circuit by processes such as etching pcbs.
- the mesh conductor is embedded in a stretchable laminate using a pressure sensitive adhesive.
- the stretchable laminate can be a stretchable polymer material.
- the stretchable laminate returns the un-stretched mesh structure after a manipulation ends.
- a liquid laminate is cast around the mesh structure and allowed to cure.
- the embedded mesh conductor is covered with a material to form an enhanced fabric.
- the conductor structure can spread across the entire fabric or portions of the fabric.
- the enhanced fabric is formed into a garment.
- the conductor structure could run in strands of the garment from specific components, connections, sensors, interfaces, etc.
- FIG. 3 illustrates an example a process for a stretchable flex conductor, respectively, various changes could be made to FIG. 3 .
- steps in each figure could overlap, occur in parallel, occur in a different order, or occur multiple times.
- FIG. 4 illustrates an example enhanced garment 400 according to this disclosure.
- the embodiment shown in FIG. 4 is for illustration only. Other embodiments could be used without departing from the scope of the present disclosure.
- the enhanced garment 400 is a garment 405 that includes a stretchable conductor structure 410 either embedded in the fabric of the garment 405 or external to the garment 405 .
- the stretchable conductor structure connects and powers electrical components in the garment 405 or around the garment 405 .
- the placement, routing, and directions of the stretchable conductor structure 410 and the component 415 , 420 and 425 are for illustration only and could be located anywhere along the garment 405 .
- the enhanced garment 400 can include connections 415 , sensors 420 , or other components 425 .
- the flexible conduct circuit 430 includes the flexible conductor structure 410 , the connections 415 , the sensors 420 and the other components 425 . Because the flexible conductor structure 410 is insulated, the components can provide interfaces or connections without exposing the flexible conductor structure 410 . These components allow user to not worry about the electrical current running through the flexible conductor structure 410 and also protect the flexible conductor structure 410 from being damaged.
- the connection of the components 415 , 420 and 425 are described in further detail below corresponding to the components of FIG. 5 .
- FIG. 5 illustrates an example enhanced garment 500 according to this disclosure.
- the embodiment shown in FIG. 5 is for illustration only. Other embodiments could be used without departing from the scope of the present disclosure.
- the enhanced garment 500 includes a flexible conductor structure 505 , which supports communication between at least one processing device 510 , at least one storage device 515 , at least one communications unit 520 , at least one input/output (I/O) unit 525 , at least one sensor 540 , and at least one power source 545 .
- a flexible conductor structure 505 which supports communication between at least one processing device 510 , at least one storage device 515 , at least one communications unit 520 , at least one input/output (I/O) unit 525 , at least one sensor 540 , and at least one power source 545 .
- the processing device 510 executes instructions that may be loaded into a memory 530 .
- the processing device 510 may include any suitable number(s) and type(s) of processors or other devices in any suitable arrangement.
- Example types of processing devices 510 include microprocessors, microcontrollers, digital signal processors, field programmable gate arrays, application specific integrated circuits, and discreet circuitry.
- the memory 530 and a persistent storage 535 are examples of storage devices 515 , which represent any structure(s) capable of storing and facilitating retrieval of information (such as data, program code, and/or other suitable information on a temporary or permanent basis).
- the memory 530 may represent a random access memory or any other suitable volatile or non-volatile storage device(s).
- the persistent storage 535 may contain one or more components or devices supporting longer-term storage of data, such as a ready only memory, hard drive, flash memory, or optical disc.
- the communications unit 520 supports communications with other systems or devices.
- the communications unit 520 could include a network interface card or a wireless transceiver facilitating communications over the network 102 .
- the communications unit 520 may support communications through any suitable physical or wireless communication link(s).
- the I/O unit 525 allows for input and output of data.
- the I/O unit 525 may provide a connection for user input through a keyboard, mouse, keypad, touchscreen, or other suitable input device.
- the I/O unit 525 may also send output to a display, printer, or other suitable output device.
- the I/O unit 525 can be the connections 415 illustrated in FIG. 4 .
- the sensor 540 can provide feedback to the user or stored in the storage device 515 .
- Sensors 540 can include temperature sensors, pressure sensors, biometric sensors, etc.
- the power source 545 provides the power to the components of the enhanced garment 500 through the stretchable conduct circuit 505 .
- the power source 545 for example, can be a rechargeable battery or wall supply.
- the power source 545 can be removably coupled to the enhanced garment or be built in to the enhanced garment 500 with an external connection.
- components of the enhanced garment 500 can be connected using a stretchable conductor structure 505 .
- the components of the electronic device can also be attached to an enhanced garment or external to the enhanced garment.
- the stretchable conductor structure 505 can also provide power to the different components of the enhanced garment.
- FIG. 5 illustrates an example of an enhanced garment 500
- various changes may be made to FIG. 5 .
- various components in FIG. 5 could be combined, further subdivided, or omitted and additional components could be added according to particular needs.
- the processing device 510 could be divided into multiple processors, such as one or more central processing units (CPUs) and one or more graphics processing units (GPUs).
- CPUs central processing units
- GPUs graphics processing units
- electronic devices can come in a wide variety of configurations, and FIG. 5 does not limit this disclosure to any particular electronic device.
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Textile Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Woven Fabrics (AREA)
- Structure Of Printed Boards (AREA)
- Professional, Industrial, Or Sporting Protective Garments (AREA)
Abstract
Description
- This is a divisional of U.S. application Ser. No. 16/136,210, filed 19 Sep. 2018, which is incorporated herein by reference in its entirety.
- The present application relates generally to electrical conductors and, more specifically, to a stretchable conductor circuit.
- Current state of the art practice is to pattern solid copper foils in a meandering trace (horseshoe pattern) and embed in a polymer. Though this does provide for stretchable and flexible circuit (though typically in one axis of the conductor at a time), high stress concentration along the curves of the trace leading to plastic deformation of the conductor can develop that over time cause circuit failure (open circuit).
- This disclosure provides a stretchable conductor circuit.
- In a first embodiment, a stretchable conductive structure includes a set of conductive wires and a stretchable laminate. The set of conductive wires, each including a protective surface, the set of conductive wires patterned in a mesh structure to accommodate a manipulation while providing electrical conductivity across the set of conductive wires. The stretchable laminate encapsulates the mesh structure, the stretchable laminate is configured to return the mesh structure of the set of conductive wires to an original state after the manipulation.
- In a second embodiment, a garment includes a fabric and a flexible conductor structure disposed within or adjacent to the fabric. The flexible conductive circuit includes one or more circuit components and a stretchable conductor structure connecting the one or more circuit components. The stretchable conductor structure includes a set of conductive wires and a stretchable laminate. The set of conductive wires, each including a protective surface, the set of conductive wires patterned in a mesh structure to accommodate a manipulation while providing electrical conductivity across the set of conductive wires. The stretchable laminate encapsulates the mesh structure, the stretchable laminate is configured to return the mesh structure of the set of conductive wires to an original state after the manipulation.
- In a third embodiment, a method provides for manufacturing a stretchable conductor structure. The method includes applying a protective surface to each of a set of conductive wires; patterning the set of conductive wires into a mesh structure that accommodates a manipulation while providing electrical conductivity across the set of conductive wires; and encapsulating the mesh structure in a stretchable laminate in a manner that the stretchable laminate returns the set of conductive wires to the mesh structure of the set of conductive wires to an original state after the manipulation ends.
- Before undertaking the DETAILED DESCRIPTION below, it may be advantageous to set forth definitions of certain words and phrases used throughout this patent document: the terms “include” and “comprise,” as well as derivatives thereof, mean inclusion without limitation; the term “or,” is inclusive, meaning and/or; and the phrases “associated with” and “associated therewith,” as well as derivatives thereof, may mean to include, be included within, interconnect with, contain, be contained within, connect to or with, couple to or with, be communicable with, cooperate with, interleave, juxtapose, be proximate to, be bound to or with, have, have a property of, or the like. It should be noted that the functionality associated with any particular controller may be centralized or distributed, whether locally or remotely. Definitions for certain words and phrases are provided throughout this patent document, those of ordinary skill in the art should understand that in many, if not most instances, such definitions apply to prior, as well as future uses of such defined words and phrases.
- For a more complete understanding of the present disclosure and its advantages, reference is now made to the following description taken in conjunction with the accompanying drawings, in which like reference numerals represent like parts:
-
FIGS. 1A-1C illustrate example stretchable conductor structures according to this disclosure; -
FIGS. 2A-2C illustrate exemplary manipulations of a conductor structure according to the embodiments of the present disclosure; -
FIG. 3 illustrates an example process for a stretchable conductor structure according to this disclosure; -
FIG. 4 illustrates an example enhanced garment according to this disclosure; and -
FIG. 5 illustrates an example enhanced garment according to this disclosure. -
FIGS. 1 through 5 , discussed below, and the various embodiments used to describe the principles of the present disclosure in this patent document are by way of illustration only and should not be construed in any way to limit the scope of the disclosure. -
FIGS. 1A-1C illustrate example stretchable conductor structure according to this disclosure.FIG. 1A illustrates an examplestretchable conductor structure 100 according to this disclosure.FIG. 1B illustrates an example un-stretchedconductor structure 101 according to various embodiments of the present disclosure.FIG. 1C illustrates an example stretchedconductor structure 102 according to the embodiments of the present disclosure. The embodiments shown inFIGS. 1A-1C are for illustration only. Other embodiments could be used without departing from the scope of the present disclosure. -
FIGS. 1A-1C illustrate a novel flexible andstretchable conductor structure 100 capable of conducting relatively high electrical current. Theflexible conductor structure 100 is suited for wearable electronics, but is also compatible with other applications requiring flex/stretch circuits. Theflexible conductor structure 100 is comprised of a patternedconductive wire 105 in amesh structure 110, for example, woven or knitted, that is covered in astretchable laminate 115. - A material, for example, copper, aluminum, silver, etc. can be used for the set of
conductive wires 105. Theconductive wires 105 may not be stretchable, but can be formed into amesh structure 110 that provides a flexibility of theoverall conductor structure 100. Theconductor wires 105 can include corrosion/oxidation protective surfaces (e.g., Ni/Au plating). - The
mesh structure 110 is stretchable in theaxis weft direction 130 andwarp direction 135. Theconductive wires 105 include afirst portion 145 of conductive wires aligned in theweft direction 130 and asecond portion 150 of theconductive wires 145 aligned in thewarp direction 135. Thefirst portion 145 and thesecond portion 150 can include different amounts ofconductive wires 105. While thefirst portion 145 and thesecond portion 150 ofconductive wires 105 illustrated as perpendicularly aligned inFIGS. 1A and 1B , thefirst portion 145 andsecond portion 150 can be aligned at any angle. - Using a
mesh structure 110 also allows for using a pcb-type etching method to create the circuit patterns on a volume scale. A mesh circuit structured using the PCB-type etching can replace a copper foil or the conductive wires. While the term “mesh” is used throughout the Specification to describe the arrangement of conductive wires, the mesh structure is not limited to a mesh and further includes knits, braids, netting, etc. In certain embodiments, a shape of the cross section of themesh structure 110 could be flat, round, tubular, etc. When the cross section of themesh structure 110 is tubular, for example, could be formed around another component. - The
first portion 145 and thesecond portion 150 of theconductive wires 105 cross each other to form a plurality ofcontact points 140. Anadjacent contact point 155 is a contact point directly connected by a length ofconductive wire 105.Adjacent contact points 155 have alternate overlaps of thefirst portion 145 and thesecond portion 150. For example, eachadjacent contact point 155 to acontact point 140, where aconductive wire 105 of thefirst portion 145 crosses over aconductive wire 105 of thesecond portion 150, has aconductive wire 105 of thesecond portion 150 crossing over aconductive wire 105 of thefirst portion 145. - A
diagonal contact point contact point 140 that is directly across a gap between contact points. Diagonal contact points can be aligned contact points 160 or un-aligned contacts points 165 compared to themanipulation direction 120. The aligned contact points 160 arecontact points 140 directly across a gap that align with themanipulation direction 120. The un-aligned contact points 165 arecontact points 140 directly across a gap that are perpendicular or not aligned with themanipulation direction 120. - In certain embodiments, a
distance 170 between aligned contact points 160 in an original state of themesh structure 110 is relatively similar to adistance 175 between un-aligned contact points 165. During astretching manipulation 200, thedistance 170 between the aligned contact points 160 increases and thedistance 175 between the un-aligned contact points 165 decreases. After the stretchingmanipulation 200 ends, thedistances mesh structure 110. - An example of the stretching is illustrated by the
un-stretched conductor structure 101 where themesh structure 110 is in an original state inFIG. 1B and the stretchedconductor structure 102 where themesh structure 110 is in a manipulated state inFIG. 1C . For ease of illustration, the ends of theconductive wires 105 and thestretchable laminate 115 could extend further than what is illustrated inFIGS. 1B and 1C .Conductor structure 102 illustrates theconductive wires 105 somewhat aligning with thestretch direction 120 from the original positions of theun-stretched conductor structure 101. Themesh structure 110 allows each conductor strand to slide against adjacent conductor strands rather than plastically deform. The numerous metal to metal contact points 140 (preferably Ni/Au plated copper) provide low resistance means of transferring electrical current between adjacent conductor threads. - Once the
conductive wires 105 are patterned inmesh structure 110, themesh structure 110 is laminated using stretchable material orstretchable laminate 115. Themesh structure 110 can be embedded in thestretchable laminate 115. Themesh structure 110 can be double-sided coated using a pressure sensitive adhesive on a stretchable polymer material (examples are silicone, thermoplastic polyurethane, etc.) that adheres to the mesh pattern and provides for the mesh structure to return to the original shape or themesh structure 110 in theun-stretched conductor structure 101 after a manipulation, such as flexing or stretching. The polymer also can serve as an electrical insulator for theconductor wires 105. - In one embodiment, a permanently adhered flexible and/or stretchable conductive coating such as a conductive ink, a conductive polymer, or a conductive epoxy (such as Dupont PE874) can be patterned on the
mesh structure 110, prior to encapsulation in thestretchable laminate 115, for multiple purposes. One purpose is that the conductive polymer aids in further improving and reducing the point to point electrical contact of the individual strands in the mesh, while also allowing flexing and stretching. Another purpose is that the polymer could also act as an etch mask during the circuit patterning step. - The
mesh structure 110 provides for a flexible and stretchable circuit material. However, it can also be patterned using meandering horseshoe/serpentine patterns (x and y axis) and wave patterns (z-axis) to further enhance flexibility. Patterning with this type of circuit further enhances both flexibility and stretchability by minimizing high stress concentrations in the pattern as it stretches (particularly along the curves). -
FIGS. 2A-2C illustrate exemplary manipulations of a flex conductor according to the embodiments of the present disclosure. The embodiment shown inFIG. 2 is for illustration only. Other embodiments could be used without departing from the scope of the present disclosure. -
FIG. 2A illustrates a stretchingmanipulation 200 according to the embodiments of the present disclosure. Thestretch direction 120 corresponds to a horizontal direction in reference toFIG. 2A . Thestretchable laminate 115 provides the function of returning the conductor structure to its original mesh structure. -
FIG. 2B illustrates a twistingmanipulation 205 according to the embodiments of the present disclosure. The twistingmanipulation 205 provides an inconsistent stretch across the conductor structure. Eachconnection point 140 allows different sections of the conductor structure to provide different amounts of “stretch” to allow the twisting of the conductor structure. -
FIG. 2C illustrates a bendingmanipulation 210 according to the embodiments of the present disclosure. The bendingmanipulation 210 involves one side of the flexible conductor structure stretching while the opposite side is in contraction. The flexibility of the conductor structure also for this manipulation and the return from to an un-bended mesh structure. -
FIG. 3 illustrates an example process for a stretchable flex conductor according to this disclosure. For example, the process depicted inFIG. 3 may be performed to produce the enhanced garment inFIG. 4 or the enhanced garment inFIG. 5 . - In
operation 305, a protective surface is applied to theconductive wires 105. The protective surface can be a Ni/Au plating for example. The protective surface provides a resilience to theconductive wires 105 to lengthen the over useful life of the conductor structure and also provide a greater transmission of current between adjacentconductive wires 105. In certain embodiments, the protective surface can provide corrosion resistance and oxidation resistance. In certain embodiments, the protective surface is applied after theconductive wires 105 are patterned into the mesh structure inoperation 310. - In
operation 310, theconductive wires 105 are patterned into amesh structure 110. Theconductive wires 105 can be woven or knitted in amesh structure 110. Themesh structure 110 can accommodate a manipulation, such as a stretchingmanipulation 200, a twistingmanipulation 205, and a bendingmanipulation 210. Themesh structure 110 can also include meandering horseshoe, meandering serpentine patterns, and wave patterns. - In operation 315 a stretchable conductive coating can be applied on the
mesh structure 110. Theconductive coating 110 can be applied as a pattern on themesh structure 110, or around the contact points of themesh structure 110. The conductive coating can be, for example, a conductive ink, a conductive polymer, or a conductive epoxy. The conductive coating enhances the electrical connection between strands of theconductive wires 105. In certain embodiments, the mesh structure can be patterned into a circuit by processes such as etching pcbs. - In
operation 320, the mesh conductor is embedded in a stretchable laminate using a pressure sensitive adhesive. The stretchable laminate can be a stretchable polymer material. The stretchable laminate returns the un-stretched mesh structure after a manipulation ends. In certain embodiments, a liquid laminate is cast around the mesh structure and allowed to cure. - In
operation 325, the embedded mesh conductor is covered with a material to form an enhanced fabric. The conductor structure can spread across the entire fabric or portions of the fabric. - In
operation 330, the enhanced fabric is formed into a garment. The conductor structure could run in strands of the garment from specific components, connections, sensors, interfaces, etc. - Although
FIG. 3 illustrates an example a process for a stretchable flex conductor, respectively, various changes could be made toFIG. 3 . For example, while shown as a series of steps, various steps in each figure could overlap, occur in parallel, occur in a different order, or occur multiple times. -
FIG. 4 illustrates an example enhanced garment 400 according to this disclosure. The embodiment shown inFIG. 4 is for illustration only. Other embodiments could be used without departing from the scope of the present disclosure. - The enhanced garment 400 is a
garment 405 that includes astretchable conductor structure 410 either embedded in the fabric of thegarment 405 or external to thegarment 405. The stretchable conductor structure connects and powers electrical components in thegarment 405 or around thegarment 405. The placement, routing, and directions of thestretchable conductor structure 410 and thecomponent garment 405. - The enhanced garment 400 can include
connections 415,sensors 420, orother components 425. Theflexible conduct circuit 430 includes theflexible conductor structure 410, theconnections 415, thesensors 420 and theother components 425. Because theflexible conductor structure 410 is insulated, the components can provide interfaces or connections without exposing theflexible conductor structure 410. These components allow user to not worry about the electrical current running through theflexible conductor structure 410 and also protect theflexible conductor structure 410 from being damaged. The connection of thecomponents FIG. 5 . -
FIG. 5 illustrates an exampleenhanced garment 500 according to this disclosure. The embodiment shown inFIG. 5 is for illustration only. Other embodiments could be used without departing from the scope of the present disclosure. - As shown in
FIG. 5 , theenhanced garment 500 includes aflexible conductor structure 505, which supports communication between at least oneprocessing device 510, at least onestorage device 515, at least onecommunications unit 520, at least one input/output (I/O)unit 525, at least onesensor 540, and at least onepower source 545. - The
processing device 510 executes instructions that may be loaded into amemory 530. Theprocessing device 510 may include any suitable number(s) and type(s) of processors or other devices in any suitable arrangement. Example types ofprocessing devices 510 include microprocessors, microcontrollers, digital signal processors, field programmable gate arrays, application specific integrated circuits, and discreet circuitry. - The
memory 530 and apersistent storage 535 are examples ofstorage devices 515, which represent any structure(s) capable of storing and facilitating retrieval of information (such as data, program code, and/or other suitable information on a temporary or permanent basis). Thememory 530 may represent a random access memory or any other suitable volatile or non-volatile storage device(s). Thepersistent storage 535 may contain one or more components or devices supporting longer-term storage of data, such as a ready only memory, hard drive, flash memory, or optical disc. - The
communications unit 520 supports communications with other systems or devices. For example, thecommunications unit 520 could include a network interface card or a wireless transceiver facilitating communications over thenetwork 102. Thecommunications unit 520 may support communications through any suitable physical or wireless communication link(s). - The I/
O unit 525 allows for input and output of data. For example, the I/O unit 525 may provide a connection for user input through a keyboard, mouse, keypad, touchscreen, or other suitable input device. The I/O unit 525 may also send output to a display, printer, or other suitable output device. The I/O unit 525 can be theconnections 415 illustrated inFIG. 4 . - The
sensor 540 can provide feedback to the user or stored in thestorage device 515.Sensors 540 can include temperature sensors, pressure sensors, biometric sensors, etc. - The
power source 545 provides the power to the components of theenhanced garment 500 through thestretchable conduct circuit 505. Thepower source 545, for example, can be a rechargeable battery or wall supply. Thepower source 545 can be removably coupled to the enhanced garment or be built in to theenhanced garment 500 with an external connection. - As described in more detail above, components of the
enhanced garment 500 can be connected using astretchable conductor structure 505. The components of the electronic device can also be attached to an enhanced garment or external to the enhanced garment. - The
stretchable conductor structure 505 can also provide power to the different components of the enhanced garment. - Although
FIG. 5 illustrates an example of anenhanced garment 500, various changes may be made toFIG. 5 . For example, various components inFIG. 5 could be combined, further subdivided, or omitted and additional components could be added according to particular needs. As a particular example, theprocessing device 510 could be divided into multiple processors, such as one or more central processing units (CPUs) and one or more graphics processing units (GPUs). In addition, as with computing and communication networks, electronic devices can come in a wide variety of configurations, andFIG. 5 does not limit this disclosure to any particular electronic device. - Although the present disclosure has been described with exemplary embodiments, various changes and modifications may be suggested to one skilled in the art. It is intended that the present disclosure encompass such changes and modifications as fall within the scope of the appended claims.
Claims (19)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US17/302,455 US20210259099A1 (en) | 2018-09-19 | 2021-05-03 | Stretchable conductor circuit |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US16/136,210 US10999925B2 (en) | 2018-09-19 | 2018-09-19 | Stretchable conductor circuit |
US17/302,455 US20210259099A1 (en) | 2018-09-19 | 2021-05-03 | Stretchable conductor circuit |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US16/136,210 Division US10999925B2 (en) | 2018-09-19 | 2018-09-19 | Stretchable conductor circuit |
Publications (1)
Publication Number | Publication Date |
---|---|
US20210259099A1 true US20210259099A1 (en) | 2021-08-19 |
Family
ID=69646902
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US16/136,210 Active US10999925B2 (en) | 2018-09-19 | 2018-09-19 | Stretchable conductor circuit |
US17/302,455 Pending US20210259099A1 (en) | 2018-09-19 | 2021-05-03 | Stretchable conductor circuit |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US16/136,210 Active US10999925B2 (en) | 2018-09-19 | 2018-09-19 | Stretchable conductor circuit |
Country Status (4)
Country | Link |
---|---|
US (2) | US10999925B2 (en) |
CN (1) | CN110931146B (en) |
CA (1) | CA3055119C (en) |
DE (1) | DE102019214048A1 (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP4329611A4 (en) * | 2021-04-30 | 2024-09-04 | Delsys Incorporated | Detecting and processing biopotentials |
Citations (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4132828A (en) * | 1976-11-26 | 1979-01-02 | Toho Beslon Co., Ltd. | Assembly of metal-coated carbon fibers, process for production thereof, and method for use thereof |
US4520562A (en) * | 1979-11-20 | 1985-06-04 | Shin-Etsu Polymer Co., Ltd. | Method for manufacturing an elastic composite body with metal wires embedded therein |
US6216546B1 (en) * | 1998-06-13 | 2001-04-17 | Volkswagen Ag | Sensor arrangement for spatially and temporally varying measurements of force or pressure |
US20040029451A1 (en) * | 2000-11-20 | 2004-02-12 | Karl Froschl | Method for producing flat cables |
US20110272181A1 (en) * | 2010-05-07 | 2011-11-10 | Samsung Electronics Co., Ltd. | Multilayer Stretchable Cable |
US8146171B2 (en) * | 2008-02-26 | 2012-04-03 | Korea Institute Of Industrial Technology | Digital garment using digital band and fabricating method thereof |
US20120103657A1 (en) * | 2010-11-02 | 2012-05-03 | Empire Technology Development Llc | High-speed card cable |
US8723043B2 (en) * | 2007-02-28 | 2014-05-13 | W.E.T. Automotive Systems Ag | Electric conductor |
US9788789B2 (en) * | 2013-08-30 | 2017-10-17 | Thalmic Labs Inc. | Systems, articles, and methods for stretchable printed circuit boards |
US20190327829A1 (en) * | 2016-07-12 | 2019-10-24 | Fujikura Ltd. | Stretchable board |
US10854355B2 (en) * | 2017-06-12 | 2020-12-01 | 3M Innovative Properties Company | Method of making a stretchable conductor |
Family Cites Families (37)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3149406A (en) * | 1958-11-10 | 1964-09-22 | Eisler Paul | Method of making electrical heating and conducting devices |
US3414666A (en) * | 1963-10-14 | 1968-12-03 | Electromechanical Devices Inc | Weaved electronic equipment |
US3571647A (en) * | 1969-03-19 | 1971-03-23 | Astronics Luminescent Inc | Flexible electroluminescent structures |
US3711627A (en) * | 1969-12-12 | 1973-01-16 | K Maringulov | Device for electrical connection of electric and electronic components and method of its manufacture |
US3699590A (en) * | 1972-01-24 | 1972-10-24 | Brunswick Corp | Antistatic garment |
FR2371117A2 (en) * | 1976-07-06 | 1978-06-09 | Rhone Poulenc Ind | RADIANT ELEMENT FOR HEATING DEVICE |
US5000178A (en) * | 1986-05-23 | 1991-03-19 | Lti Biomedical, Inc. | Shielded electromagnetic transducer |
US5906004A (en) * | 1998-04-29 | 1999-05-25 | Motorola, Inc. | Textile fabric with integrated electrically conductive fibers and clothing fabricated thereof |
NO311317B1 (en) * | 1999-04-30 | 2001-11-12 | Thin Film Electronics Asa | Apparatus comprising electronic and / or optoelectronic circuits and method of realizing and / or integrating circuits of this kind in the apparatus |
US7283636B2 (en) * | 2002-02-28 | 2007-10-16 | The Furukawa Electric Co., Ltd. | Planar speaker |
DE10325883A1 (en) * | 2003-06-06 | 2004-12-30 | Infineon Technologies Ag | Process for contacting conductive fibers |
GB0329566D0 (en) * | 2003-12-20 | 2004-01-28 | Koninkl Philips Electronics Nv | Woven material and display device constructed therefrom |
CN1934302B (en) * | 2004-03-08 | 2011-04-06 | Kb世联株式会社 | Woven or knitted fabric, diaphragm for speaker, and speaker |
US20060160450A1 (en) * | 2005-01-19 | 2006-07-20 | Sheng-Teng Chou | Structure of carbon cloth |
CN101146595B (en) * | 2005-01-28 | 2012-07-04 | 杜克大学 | Apparatuses and methods for manipulating droplets on a printed circuit board |
US20090057290A1 (en) * | 2007-09-05 | 2009-03-05 | Cole Williams | Electrically heated articles of apparel having variable heating characteristics and methods of making same |
US8739397B2 (en) * | 2007-09-25 | 2014-06-03 | Nihon Kohden Corporation | Electrode sheet and process for producing electrode sheet |
TWI370714B (en) * | 2008-01-09 | 2012-08-11 | Ind Tech Res Inst | Circuit structure and menufacturing method thereof |
KR100972006B1 (en) * | 2008-02-26 | 2010-07-22 | 한국생산기술연구원 | Textile digital band and fabriticating method thereof |
CN102511203A (en) * | 2009-09-24 | 2012-06-20 | 皇家飞利浦电子股份有限公司 | Electronic textile with local energy supply devices |
JP2014510347A (en) * | 2011-03-24 | 2014-04-24 | タグシス・エスアーエス | RFID tag assembly and label process |
DE102011050250A1 (en) * | 2011-04-08 | 2012-10-11 | Sefar Ag | Electrode substrate and planar optoelectronic device |
US9018532B2 (en) * | 2011-06-09 | 2015-04-28 | Multi-Fineline Electronix, Inc. | Stretchable circuit assemblies |
US10321873B2 (en) * | 2013-09-17 | 2019-06-18 | Medibotics Llc | Smart clothing for ambulatory human motion capture |
US9043004B2 (en) * | 2012-12-13 | 2015-05-26 | Nike, Inc. | Apparel having sensor system |
US10840536B2 (en) * | 2013-02-06 | 2020-11-17 | The Board Of Trustees Of The University Of Illinois | Stretchable electronic systems with containment chambers |
US20160000374A1 (en) * | 2013-03-05 | 2016-01-07 | Drexel University | Smart knitted fabrics |
WO2015052853A1 (en) * | 2013-10-10 | 2015-04-16 | Panasonic Intellectual Property Management Co., Ltd. | Resin composition and film using same |
EP3133654A4 (en) * | 2014-04-16 | 2017-04-19 | Teijin Limited | Transducer which uses fibers and uses electric signal as output or input |
WO2016009251A1 (en) * | 2014-07-15 | 2016-01-21 | Comftech S.R.L. | Sensor for measurement of physiological electrical signals |
JP6220985B2 (en) * | 2014-09-11 | 2017-10-25 | 富士フイルム株式会社 | Laminated structure, touch panel, display device with touch panel, and manufacturing method thereof |
US10945663B2 (en) * | 2014-11-04 | 2021-03-16 | North Carolina State University | Smart sensing systems and related methods |
KR102375190B1 (en) * | 2014-11-24 | 2022-03-17 | 삼성디스플레이 주식회사 | Stretchable conductive pattern and stretchable device |
KR101657895B1 (en) * | 2015-05-14 | 2016-09-19 | 광운대학교 산학협력단 | Plasma Pad |
CN105895199B (en) * | 2016-06-14 | 2018-07-06 | 珠海安润普科技有限公司 | A kind of washable conducting connecting part of flexible extensible |
JP6799817B2 (en) * | 2016-11-28 | 2020-12-16 | パナソニックIpマネジメント株式会社 | Flexible wiring boards, electronic devices, textile products |
CN107488915A (en) * | 2017-10-10 | 2017-12-19 | 东华大学 | A kind of machine-knitted structure Stretchable fabric circuit board and wearable device |
-
2018
- 2018-09-19 US US16/136,210 patent/US10999925B2/en active Active
-
2019
- 2019-09-11 CA CA3055119A patent/CA3055119C/en active Active
- 2019-09-16 DE DE102019214048.3A patent/DE102019214048A1/en active Pending
- 2019-09-19 CN CN201910885752.3A patent/CN110931146B/en active Active
-
2021
- 2021-05-03 US US17/302,455 patent/US20210259099A1/en active Pending
Patent Citations (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4132828A (en) * | 1976-11-26 | 1979-01-02 | Toho Beslon Co., Ltd. | Assembly of metal-coated carbon fibers, process for production thereof, and method for use thereof |
US4520562A (en) * | 1979-11-20 | 1985-06-04 | Shin-Etsu Polymer Co., Ltd. | Method for manufacturing an elastic composite body with metal wires embedded therein |
US6216546B1 (en) * | 1998-06-13 | 2001-04-17 | Volkswagen Ag | Sensor arrangement for spatially and temporally varying measurements of force or pressure |
US20040029451A1 (en) * | 2000-11-20 | 2004-02-12 | Karl Froschl | Method for producing flat cables |
US8723043B2 (en) * | 2007-02-28 | 2014-05-13 | W.E.T. Automotive Systems Ag | Electric conductor |
US8146171B2 (en) * | 2008-02-26 | 2012-04-03 | Korea Institute Of Industrial Technology | Digital garment using digital band and fabricating method thereof |
US20110272181A1 (en) * | 2010-05-07 | 2011-11-10 | Samsung Electronics Co., Ltd. | Multilayer Stretchable Cable |
US20120103657A1 (en) * | 2010-11-02 | 2012-05-03 | Empire Technology Development Llc | High-speed card cable |
US9788789B2 (en) * | 2013-08-30 | 2017-10-17 | Thalmic Labs Inc. | Systems, articles, and methods for stretchable printed circuit boards |
US20190327829A1 (en) * | 2016-07-12 | 2019-10-24 | Fujikura Ltd. | Stretchable board |
US10854355B2 (en) * | 2017-06-12 | 2020-12-01 | 3M Innovative Properties Company | Method of making a stretchable conductor |
Also Published As
Publication number | Publication date |
---|---|
US20200092988A1 (en) | 2020-03-19 |
US10999925B2 (en) | 2021-05-04 |
CN110931146B (en) | 2023-06-23 |
DE102019214048A1 (en) | 2020-03-19 |
CA3055119A1 (en) | 2020-03-19 |
CA3055119C (en) | 2023-10-17 |
CN110931146A (en) | 2020-03-27 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US8883287B2 (en) | Structured material substrates for flexible, stretchable electronics | |
US8269112B2 (en) | Flexible circuit structure | |
KR101737428B1 (en) | Flexible electronic system with wire bonds | |
US9814134B2 (en) | Elastic flexible substrate and manufacturing method thereof | |
CN105824481B (en) | Touch sensor device | |
US9378864B1 (en) | Stretchable metal wire assembly using elastic tube | |
CN112750363B (en) | Display assembly, display module, manufacturing method and electronic equipment | |
JP2019216273A (en) | Flexible board | |
JP5151025B2 (en) | Flexible circuit board | |
US20210259099A1 (en) | Stretchable conductor circuit | |
CN110767350B (en) | Preparation method of lead applied to extensible electronic device | |
US11646272B2 (en) | Packaging method of panel-level chip device | |
CN103000274B (en) | Band shielded flat cable, bunch of cables and flexible flat cable manufacture method | |
US10149381B2 (en) | Textile integration of electronic circuits | |
WO2008047619A1 (en) | Circuit substrate device and circuit substrate module device | |
KR100657434B1 (en) | Electronic assembly with laterally connected capacitors and manufacturing method | |
EP3306621A1 (en) | Elastic conductor | |
US20150241915A1 (en) | Conductive structures for a flexible substrate in a wearable device | |
CN109616449B (en) | Flexible electronic device and manufacturing method thereof | |
US10609820B2 (en) | Electronic component module, DC-DC converter, and electronic device | |
CN111727505A (en) | Flexible electronic device | |
KR101958094B1 (en) | Transparent electrode structure and method of forming the same | |
KR20080093230A (en) | Touch sensor module and manufacturing method thereof | |
CN109219239A (en) | Flexible circuit board | |
CN220122055U (en) | Battery protection plate, battery and electronic equipment |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
STPP | Information on status: patent application and granting procedure in general |
Free format text: DOCKETED NEW CASE - READY FOR EXAMINATION |
|
AS | Assignment |
Owner name: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT, NEW YORK Free format text: SECURITY INTEREST;ASSIGNORS:II-VI INCORPORATED;II-VI DELAWARE, INC.;M CUBED TECHNOLOGIES, INC.;AND OTHERS;REEL/FRAME:060562/0254 Effective date: 20220701 |
|
AS | Assignment |
Owner name: II-VI DELAWARE, INC., DELAWARE Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:MOCZYGEMBA, JOSH;REEL/FRAME:061621/0449 Effective date: 20180918 |
|
STPP | Information on status: patent application and granting procedure in general |
Free format text: NON FINAL ACTION MAILED |
|
STPP | Information on status: patent application and granting procedure in general |
Free format text: RESPONSE TO NON-FINAL OFFICE ACTION ENTERED AND FORWARDED TO EXAMINER |
|
STPP | Information on status: patent application and granting procedure in general |
Free format text: FINAL REJECTION MAILED |
|
STPP | Information on status: patent application and granting procedure in general |
Free format text: ADVISORY ACTION MAILED |