US20210156886A1 - Conductive test probe - Google Patents
Conductive test probe Download PDFInfo
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- US20210156886A1 US20210156886A1 US17/013,412 US202017013412A US2021156886A1 US 20210156886 A1 US20210156886 A1 US 20210156886A1 US 202017013412 A US202017013412 A US 202017013412A US 2021156886 A1 US2021156886 A1 US 2021156886A1
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- probe
- tip
- conductive
- probe tip
- approximately
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06788—Hand-held or hand-manipulated probes, e.g. for oscilloscopes or for portable test instruments
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06733—Geometry aspects
- G01R1/06738—Geometry aspects related to tip portion
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06755—Material aspects
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
Definitions
- the present disclosure relates generally to electrical test equipment and, more particularly, to a conductive probe for a circuit tester or a jumper.
- Test equipment such as multi-meters and logic analyzers may generally communicate with the circuitry being tested via one or more conductive test probes.
- Test probes may be configured to pierce an insulated wire or contact an exposed electrical terminal. Measured parameters may include resistance, voltage, current, impedance, frequency, and digital waveforms.
- some multi-meters such as the multi-meter disclosed in U.S. Pat. No. 7,184,899, have a “power and measure” feature, allowing a technician to probe a circuit, initiate current sourcing, and simultaneously measure electrical parameters, thus enhancing test efficiency.
- Some important quality goals for test equipment may include collecting accurate measurements at the required resolution without interfering with the operating point of the circuit under test. Unfortunately, certain design aspects of conventional test equipment may result in poor measurement quality when diagnosing a circuit.
- one cause of poor measurement quality may be a test probe resistance that is higher than the required measurement resolution.
- a test probe resistance of 100 milliohms (m ⁇ ) would interfere with the accurate measurement of a circuit resistance requiring a resolution of 10 m ⁇ by adding 100 m ⁇ to the measurement result.
- Test probe resistance is measured across the conducting length of the test probe, and does not include the contact resistance occurring between the test probe and the circuit node.
- Test probe resistance may depend on the resistivity of the conductor used, on corrosion, and on any damage that occurs due to misuse or high current flow.
- the test probe may be fabricated from a metal material having a relatively low resistivity, which may be adequate for conducting moderate current flows of less than approximately 1 to 10 amps.
- brass an alloy of copper and zinc
- resistivity has a resistivity of approximately 6-7 ⁇ -cm, where metals in general may range from 1-300 ⁇ -cm in resistivity.
- many automotive circuits require testing with high current flows of from approximately 10 to 100 amps or more, which may require the alteration of the geometry or diameter of a brass or steel test probe to insure that test probe resistance remains small.
- Another cause of poor measurement quality may be electrical arcing that may occur between the test probe and the circuit node being measured. Arcing may generally begin during the making or breaking of contact involving a live circuit in close proximity.
- a live circuit may occur by either placing a test probe onto an energized circuit node having a voltage, or by placing an energized test probe onto a non-energized or passive circuit node, or both.
- a sustained arc having sufficient heat energy, i.e., sufficient current may melt steel.
- the effect of even momentary arcing may be a break down or damage in the conductor material such as brass or steel, causing heating, burning, melting, material migration, molecular voids, and a permanent rise in test probe resistance that begins to interfere with the quality of the measurement.
- Arcing may self-extinguish once the distance between electrical nodes increases.
- the availability of larger current flows may increase the heat energy within an arc, increasing the possibility of material damage.
- a test probe susceptible to arc damage may degrade progressively over time, attracting larger and longer arcs, and increasing test probe resistance further.
- Conventional metallic test probes may therefore require frequent replacement.
- test probe resistance may be a temporary heating of the sharpened tip through either arc heating or resistive heating.
- arc heating initiating an electrical contact may give rise to a momentary arc over the sharpened tip of the test probe, heating the surface of the probe tip. Since many metals, such as brass and steel, possess positive resistive temperature coefficients, their resistivity may increase upon the occurrence of an arc. A multi-meter measurement immediately following such an arc may experience increased test probe resistance that gives rise to measurement error.
- a substantial current flow through the sharpened tip during a measurement may give rise to resistive heating that also creates increased resistivity, building on any preceding arc heating and causing more measurement error.
- a sharpened tip comprised of a metal having a positive temperature coefficient may be required to conduct the flow of 100 amps through a very small volume of metal, generating heat and increased resistance, and subsequently measurement error.
- a 100° C. increase in the temperature of the tip of a copper test probe having a temperature coefficient of 0.0043/° C. causes tip resistance to increase by 43% (i.e., 100 ⁇ 0.0043), and causing an increase in overall test probe resistance.
- Another problem that may arise during measurements involving a conductive test probe relates to the arc detection circuitry disclosed in the above-mentioned application Ser. No. 13/404,644.
- high frequency spectra may be analyzed for evidence of arcing internal to the circuitry being powered and measured by the test equipment.
- the test may be terminated by a circuit breaker upon detection of an internal arc.
- the accuracy of the measurement depends on a fast rise time in the voltage or current, which requires a small test probe resistance.
- the occurrence of test probe arcing may interfere with the internal detection of arcing by interfering with the sense threshold causing arcing to increase before the sense threshold is achieved.
- the response may eventually become so delayed that the circuit breaker does not shut down at all, posing a fire hazard to a circuit that is external arcing.
- a further cause of excessive test probe resistance may be the use of test probe geometries that generate high resistive losses.
- the sharpened tip of the test probe may be the location of highest current density and may thereby contribute excessively to the overall test probe resistance if there is a long path from the probe tip to a conductive portion of the test probe having relatively low current density.
- local heating may occur near the tip due to current flow, further increasing path resistance.
- a durable conductive test probe that can withstand arcing over many cycles under high current conditions. Additionally, there exists a need in the art for a test probe that maintains a low resistance at high currents during arcing so that measurement resolution and accuracy are maintained. Furthermore, there exists a need in the art for a test probe that preserves the rise time of arc detection circuitry by preventing an increase in test probe resistance caused by arcing. There also exists a need in the art for a test probe that can withstand many contact cycles under live circuit conditions. In addition, there exists a need in the art for a conductive test probe that has a compact (i.e., small) geometry that minimizes test probe resistance.
- a conductive probe having a probe body for communicating with a circuit tester or a jumper.
- the probe body may be comprised of metal and has a free end.
- a probe tip comprised of thorium-tungsten may be mounted to the free end of the probe body.
- the probe tip may be configured for contacting a circuit node.
- a conductive probe may comprise a probe body for communicating with a circuit tester or a jumper.
- the probe body may be comprised of metal and may have a socket formed in a free end.
- a probe tip may be comprised of thorium-tungsten and may have a buried end mounted within the socket of the probe body.
- the socket may be shaped and sized complementary to the buried end in order to minimize the contact resistance between the probe body and the probe tip.
- the probe tip may have a narrowed end located opposite the buried end. The narrowed end may be narrowed to a contact surface for contacting a circuit node. The shortest distance between the contact surface and the probe body may be less than approximately 0.250 inch.
- a durable tip may comprise a probe tip receivable by a probe body configured for communicating with a circuit tester or a jumper.
- the probe tip may be comprised of thorium-tungsten and may have a buried end that may be receivable by the probe body in such a manner that contact resistance between the probe tip and the probe body is minimized.
- the probe tip may have a narrowed end located opposite the buried end. The narrowed end may be narrowed to a contact surface for contacting a circuit node. The shortest distance between the contact surface and the probe body may be less than approximately 0.250 inch.
- FIG. 1 is a perspective view of an embodiment of a circuit tester having a conductive probe attached thereto.
- FIG. 2 is an exploded side view of an embodiment of a conductive probe having a probe plug for mating with a circuit tester having a probe jack.
- FIG. 3 is a side view of an embodiment of the conductive probe of FIG. 2 mated to the circuit tester.
- FIG. 4 is a perspective view of an embodiment of a conductive probe.
- FIG. 5 is an exploded sectional view of an embodiment of a conductive probe comprising a probe body and a probe tip.
- FIG. 6 is a sectional view of the conductive probe of FIG. 5 showing the probe tip mated to the probe body.
- FIG. 7 is an end view of the embodiment of the conductive probe of FIG. 6 .
- FIG. 8A is a side sectional view of an embodiment of a conductive probe in a ready position above a circuit node to be measured.
- FIG. 8B is a side sectional view of the conductive probe in contact with the circuit node to be measured.
- FIG. 8C is a side sectional view of the conductive probe in energized contact with a circuit node and illustrating the density of current flow through the probe tip.
- FIG. 1 shown in FIG. 1 is an embodiment of a circuit tester 31 coupled to a conductive probe 10 for the purpose of making electrical contact with a circuit to be measured.
- Circuit tester 31 may comprise a multi-meter electrical circuit tester or other electrical test equipment or test device such as may be used to diagnose or repair an electrical circuit.
- Probe body 11 may conduct an electrical signal (not shown) between circuit tester 31 and probe tip 15 .
- the narrowed end 14 of probe tip 15 may be narrowed in at least one dimension relative to a contact surface 25 so that the probe tip 15 is capable of piercing the electrical insulation of a wire or to facilitate reliable contact of the probe tip 15 with a circuit node (not shown) such as an exposed electrical terminal.
- the probe tip 15 is shown having a conical narrowed end 14 (e.g., narrowed in two dimensions), the probe tip 15 may be provided with alternative geometries, such as a blade configuration (not shown) or a multiple prong configuration (not shown). In this regard, the probe tip 15 may be configured to achieve a low contact resistance with a circuit node while minimizing the electrical resistance of the conductive probe 10 .
- the circuit tester 31 may be configured to supply current to conductive probe 10 while retrieving and displaying measured electrical parameters such as voltage, current, resistance, frequency, or digital information.
- a technician operating the circuit tester 31 may press an actuating button (not shown) to begin current sourcing to provide current to a circuit under test, preferably after contacting the probe tip 15 with the circuit node (not shown) under test.
- a technician may prematurely actuate current sourcing from circuit tester 31 , making contact with what may be called a live (i.e., energized) circuit, and which may result in adverse consequences, as will be discussed below.
- the probe body 11 may be fabricated of brass, steel or other suitable metallic material or conductor and which may have a relatively low resistivity.
- Circuit tester 31 and conductive probe 10 may be configured to receive or supply relatively high current flows such as, for example, currents of approximately 10 to 100 amps or more, and which may be particularly relevant in the field of automotive electronics. At such relatively high current flows, it is preferable that the conductive probe 10 provides a very low resistance path in order to avoid excessive ohmic losses which may result in measurement errors such as measurement errors by the circuit tester 31 .
- narrowed end 14 may have a substantially smaller width than probe body 11 , probe tip 15 may dominate the overall resistance of conductive probe 10 .
- resistance increases in probe tip 15 caused by arcing damage may substantially increase the resistance of conductive probe 10 .
- brass, steel, and other conductors having relatively low to moderate melting temperatures may be particularly susceptible to tip damage during arcing.
- brass, steel, and other conductors or materials may meet the resistivity requirements of high current flows, such materials may not provide for a durable probe tip 15 , and may cause measurement errors.
- FIG. 2 shown is an embodiment of a conductive probe 10 configured with a probe plug 33 for electrically mating with circuit tester jack 34 of circuit tester 31 .
- the mating of the outer surface of probe plug 33 to the inner surface of circuit tester jack 34 may provide a low contact resistance to prevent measurement error, yet may allow for easy replacement of conductive probe 10 .
- a plug and jack arrangement is shown in this embodiment for attaching the conductive probe 10 to the circuit tester 31 , it is to be understood that other forms of temporary or permanent attachment are possible.
- the conductive probe 10 may be attached to a circuit tester by means of a threaded attachment or by means of sliding fit.
- the probe and jack assignments may be reversed, with the conductive probe 10 being outfitted with a jack instead of a probe plug 33 , and the circuit tester 31 being outfitted with a plug instead of a circuit tester jack 34 .
- an embodiment of a conductive probe 10 comprises probe body 11 which may conduct electrical current between probe plug 33 and probe tip 15 mounted to the end of probe body 11 .
- buried end width 20 FIG. 5
- narrowed end 14 may be conical in shape for contacting a circuit node (not shown) to be measured.
- Probe tip 15 may be comprised of thorium-tungsten having an immunity to material breakdown in the presence of electrical arcing, and which may have a relatively high melting temperature. For example, thorium-tungsten may have a melting temperature of approximately 3410° C.
- Probe body 11 may be comprised of a low-cost conductor material having relatively low resistivity.
- the probe body 11 may be formed of any one of a variety of different metallic materials, without limitation, including brass, copper, steel, or other metallic materials or alloys thereof.
- Probe tip 15 may be sized and configured to provide a relatively short distance, i.e., a shortest distance 23 ( FIG. 6 ), between contact surface 25 and a free end of the probe body 11 .
- the probe tip 15 may provide a shortest distance 23 in an embodiment wherein the probe tip 15 is press fit into the probe body 11 . Because thorium-tungsten may have substantially higher electrical resistance than the material of the probe body 11 , the shortest distance 23 may advantageously limit the overall path resistance through conductive probe 10 to be less than the measurement resolution required by circuit tester 31 , thereby preventing measurement errors.
- connection of the thorium-tungsten probe tip 15 to the low-resistivity probe body 11 along the shortest distance 23 advantageously provides for a durable conductive probe 10 capable of conducting high current flows and withstanding arcing without degradation or damage to the probe tip 15 or probe body 11 .
- the shortest distance 23 may be along a conical surface of the probe tip 15 assuming that the core of probe tip 15 extends into probe body 11 by a greater distance. It is to be understood however that the probe tip 15 may be provided in other geometries, shapes, or configurations, and/or in other mounting styles and which may alter the length of the shortest distance 23 between the contact surface 25 and the portion of probe body 11 nearest the contact surface 25 .
- a butted connection (not shown) between probe tip 15 and probe body 11 may define an axial path (i.e., along a direction parallel to an axis of the conductive probe) of the shortest distance 23 .
- shortest distance 23 may be less than approximately 0.250 inch in order to maintain a sufficiently low resistance for conductive probe 10 . In another embodiment, shortest distance 23 may be less than approximately 0.100 inch. However, shortest distance may be larger than 0.250 inch. Additionally, gold plating (not shown) may be applied to the probe tip 15 to improve contact resistance of the surface of the probe tip 15 or to prevent corrosion of the probe tip 15 .
- the thorium-tungsten of the probe tip 15 may have a concentration of between approximately 0.5% and approximately 5% (percent) thorium by weight, the remaining weight being tungsten. More typically, the concentration of thorium may be approximately 1-2% by weight. However, the thorium-tungsten of the probe tip 15 may be provided in any concentration of thorium by weight relative to the tungsten. Thorium, a radioactive material, may be added to tungsten in a process of doping using thorium oxide, or the thorium may be added to tungsten using other techniques known in metallurgy. Thorium-tungsten may also be referred to as thoriated-tungsten.
- Adding thorium to tungsten may increase the current-carrying capacity of the tungsten by approximately 20% to 50%, enhancing the ability of the probe tip to conduct high current flows in the presence of arcing without material damage. Thorium may also increase tungsten's emissivity in vacuum tubes.
- arc detection circuitry e.g., of circuit tester 31
- the use of a compact press fit geometry of the probe tip 15 into the probe body 11 minimized the electrical resistance of conductive probe 10 to an amount below the measurement resolution.
- the performance tests of the probe tip demonstrated that the objectives of measurement accuracy, high resolution, arc immunity, proper arc detection, and non-interference with the operating point of the circuit under test may be achieved with a balanced thorium-tungsten design.
- probe tip 15 may temporarily raise the test probe resistance for probe tip materials having a positive temperature coefficient.
- the thermal coefficient of electrical conductivity of thorium-tungsten may be approximately 0.0045/° C. compared to approximately 0.0015/° C. for brass, meaning that the electrical resistance of thorium-tungsten may be much higher than the electrical resistance of brass when resistively heated.
- a balance in performance attributes may be achieved, including relatively high measurement resolution, improved durability of the probe tip in the presence of repeated arcing, relatively low cost, and relatively fast rise time performance for arc detection circuitry.
- arc heating nor resistive heating were measurably occurring.
- a conductive probe 10 electrically and mechanically mated via probe plug 33 to circuit tester 31 by inserting probe plug 33 into circuit tester jack 34 .
- the probe plug 33 may be slidably inserted into the circuit tester jack 34 or the probe plug may be threadably engaged (not shown) to the circuit tester 31 .
- the mating of the outer surface of probe plug 33 to the inner surface of circuit tester jack 34 may provide a low contact resistance which may minimize measurement error, yet allow for easy replacement of conductive probe 10 .
- Probe body 11 may, by virtue of a relatively large diameter shaft, provide a low resistance path to probe tip 15 between contact surface 25 and probe body 11 .
- Probe tip 15 extends from buried end width 20 to narrowed end 14 and may be conical in shape, or may have some other shape to facilitate contact of the probe tip to a circuit node (not shown). In an embodiment, the probe tip 15 may have a sharpened end terminating in a point or otherwise shaped to make reliable contact with a circuit node.
- the probe tip 15 may be configured to provide a shortest distance 23 between contact surface 25 and probe body 11 which may limit the resistance contribution from a probe tip 15 comprised preferably of thorium-tungsten, allowing good measurement resolution under all test conditions.
- the conductive probe 10 may be comprised substantially of probe body 11 made from a material of relatively low electrical resistivity in order that a relatively compact volume of thorium-tungsten may be used for probe tip 15 .
- at least approximately 80% by volume of the conductive probe 10 may be comprised of the probe body 11 .
- approximately 97% of the conductive probe 10 may be comprised of the probe body 11 , the remaining approximately 3% of the volume comprising the probe tip 15 . It is to be understood that this disclosure is not limited to the above-mentioned proportions of probe body volume to probe tip volume.
- the conductive probe 10 may be provided in any proportion of probe body volume to probe tip volume that provides a balance of a low conductive probe resistance with relatively high durability of the probe tip under arcing and high current flows.
- portions of the probe body 11 may be enclosed in an insulating layer (not shown) for preventing unintended electrical shorting to the test environment. Furthermore, a portion of the probe body 11 may be enclosed with a handle (not shown) for handling the conductive probe 10 conveniently.
- the handle (not shown) and insulating layer (not shown) functions may be combined.
- circuit tester 31 may be replaced with a jumper or test lead suitable for establishing a temporary connection between the circuit node in communication with contact surface 25 and another circuit node in the same or another electrical circuit.
- the probe tip 15 and probe body 11 configuration disclosed herein may be installed on or integrated into a jumper or a test lead. As indicated above, the thoriated-tungsten composition of the probe tip 15 may advantageously minimize degradation or damage that may otherwise occur in a conventional probe tip such as due to arcing.
- probe body 11 including a probe tip 15 which may include a cylindrically-shaped buried end (not shown) and including a conical shape narrowing to a narrowed end 14 .
- the buried end (not shown) of probe tip 15 may have a buried end width 20 that may extend into an interior of the probe body 11 .
- the buried end of the probe tip 15 may extend far enough into the probe body 11 such that the shortest distance 23 between the probe tip 15 terminal end and the probe body 11 is measured along the surface of the probe tip 15 .
- thorium-tungsten probe tip 15 may have a generally compact geometry and a small volume relative to probe body 11 , and which may advantageously give rise to a small path resistance through probe tip 15 and probe body 11 .
- Probe tip 15 may have a buried end 13 that may be sized to provide a press fit into the socket 16 along interference fit surface 12 within probe body 11 .
- the probe body 11 may be configured to communicate with (e.g., is mounted to or integrated with) a circuit tester, a jumper or test lead, or other electrical device or electrical component.
- Buried end 13 may have a buried end length 19 that may be greater than or approximately equal to socket length 18 along interference surface 12 .
- Buried end width 20 may be sized to form an interference fit of from approximately 0.0001 inch to approximately 0.005 inch with socket 16 .
- the socket 16 may have a diameter of approximately 0.249 inch.
- the buried end 13 width and the socket 16 width may be such that a negligible contact resistance occurs between probe tip 15 and probe body 11 , and such that the probe tip 15 is retained within the probe body 11 .
- Probe tip 15 may be sharpened or shaped to a narrowed end 14 , terminating at contact surface 25 and being configured for piercing an insulated electrical wire (not shown) and/or for penetrating an exposed electrical terminal (not shown).
- the probe tip 15 may be provided in any one of a variety of alternative shapes and configurations configured complementary to a specific application.
- the probe tip 15 may be provided with a generally blunt or flattened terminal end (not shown), a generally rounded end (not shown), a multi-pronged shape, or other shapes, and is not limited to the conical shape of the probe tip 15 shown in the figures.
- FIG. 5 may suggest that the buried end 13 and socket 16 has a cylindrical shape
- the buried end 13 and socket 16 may be provided in other geometries.
- buried end 13 and socket 16 may be rectangular (not shown), square, or other faceted cross-sectional shapes, or buried end 13 and socket 16 may be axially splined (not shown), helically threaded, ribbed, or provided with other mechanical surface features for interlocking the probe tip 15 to the probe body 11 .
- probe tip 15 may be provided with a socket (not shown) to mate with a plug (not shown) that may be formed on an end of the probe body 11 .
- buried end 13 may have a buried end width 20 of less than or no greater than approximately 0.250 inch for the purpose of minimizing the distance between contact surface 25 and the nearest portion of probe body 11 .
- buried end 13 may have a buried end width 20 of approximately 0.097 inch.
- buried end 13 may have a buried end width 20 of approximately 0.125 inch.
- the buried end 13 of the probe tip 15 may be provided in any buried end width 20 , without limitation.
- the ratio of buried end width 20 to socket length 18 may preferably range from approximately 1:1 to approximately 3:1.
- the ratio of buried end width 20 to socket length 18 may preferably be approximately 2:1.
- the probe tip 15 and probe body 11 may be configured to provide any ratio of buried end width 20 to socket length 18 .
- the buried end length 19 may be greater than the socket length 18 which may result in the start of the narrowed end 14 protruding (not shown) past the end of the probe body 11 by more than the length of the conical portion of probe tip 15 , leading to an increased distance between contact surface 25 and the free end of probe body 11 nearest the contact surface 25 .
- Such protrusion of probe tip 15 beyond free end of probe body 11 may be desirable in extending a narrow tip deeper into a cramped region of circuitry to be tested.
- the shortest distance (not shown) between the contact surface 25 and the nearest portion of the probe body 11 may be along an interior of the probe tip 15 and not along an outer surface of probe tip 15 .
- FIG. 6 shown is a side sectional view of an embodiment of the conductive probe 10 showing the buried end 13 of the probe tip 15 press fit into the probe body 11 .
- the probe tip 15 is engaged to the probe body 11 along an interference fit surface 12 having an engagement length 22 .
- the probe body 11 may be configured to communicate with a circuit tester or jumper as indicated above.
- the probe tip 15 may be press fit into the probe body although other engagement configurations (e.g., threaded engagement or other mechanical interlocking) are possible.
- the probe tip 15 may have a buried end width 20 that may be less than an outer diameter of the probe body 11 .
- Probe tip 15 may be sharpened to a pointed contact surface 25 for contacting an electrical circuit to be tested.
- the contact surface 25 of the probe tip may be provided with multiple prong points, a blade having a narrowed linear edge, or other geometries which simultaneously provide for low electrical contact resistance with a circuit node (not shown) and low electrical path resistance within probe tip 15 .
- Circuit node 24 may be an insulated wire or an exposed electrical terminal or any other electrical system, electrical device, electrical assembly or electrical component.
- the buried end 13 of the probe tip 15 may be press fit into the probe body 11 along engagement length 22 .
- the probe tip 15 may be shaped to have a narrowed end 14 terminating at the contact surface 25 . Shortest distance 23 may provide the lowest resistance path from contact surface 25 to the nearest portion of probe body 11 .
- the conductive probe 10 in a “ready” position hovering over circuit node 24 in an unpowered (i.e., non-energized) state. No current is flowing through conductive probe 10 , and electrical path 27 may or may not be energized.
- the probe tip 15 may be comprised of thorium-tungsten to withstand any arcing that may occur in the “ready” position when the probe tip 15 is in relatively close proximity to the circuit node 24 .
- FIG. 8B shown is an embodiment of the conductive probe 10 unpowered and in a “contact” stage.
- the contact surface 25 of the probe tip 15 is shown contacting the circuit node 24 .
- No current is flowing through conductive probe 10 , and the electrical path 27 may or may not be energized.
- FIG. 8C shown is an embodiment of the conductive probe 10 in an “energized” stage wherein contact surface 25 of the probe tip 15 is contacting circuit node 24 .
- the circuit tester 31 FIG. 2
- electrical path 27 may be energized and circuit tester 31 may receive electrical current from the electrical path 27 as part of the measurement being performed, and resulting in lines of uniform current density 26 in the probe tip 15 .
- Lines of uniform current density 26 may be most closely packed along the shortest distance 23 path and more loosely packed along an axial direction of the probe tip because the axial path is a longer distance to the probe body 11 than the shortest distance 23 , and because the axial direction may have greater electrical resistance, and hence is less preferred by flowing electrons.
- the size, shape, configuration, and/or geometry of the conductive probe 10 may be optimized by evaluating the lines of uniform current density 26 in the probe tip 15 .
- the geometry for the conductive probe 10 may be selected to minimize the distance (i.e., shortest distance 23 ) between the contact surface of the probe tip 15 and the portion of the probe body 11 nearest the contact surface 25 , thereby minimizing the resistance of conductive probe 10 .
- the conductive probe 10 may be configured in consideration of the amount of surface area at the interface between the probe tip 15 and the probe body 11 .
- a larger surface area of the interference fit surface 12 may generate a smaller electrical resistance for the conductive probe 10 , and a smaller amount of surface area of the interference fit surface 12 may result in a larger electrical resistance for the conductive probe 10 .
- the electrical current may be made to flow in either direction with both directions providing the same electrical path.
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Abstract
Description
- This application is a continuation of and claims priority to co-pending U.S. patent application Ser. No. 15/707,909 entitled CONDUCTIVE TEST PROBE and filed on Sep. 18, 2017, which claimed priority to U.S. patent application Ser. No. 13/730,850 entitled CONDUCTIVE TEST PROBE and filed on Dec. 29, 2012, which issued as U.S. Pat. No. 9,766,269. Each of application Ser. No. 15/707,909 and U.S. Pat. No. 9,766,269 are expressly incorporated by reference herein. This application is related to U.S. patent application Ser. No. 15/334,085 entitled Electrical Test Device And Method filed Oct. 25, 2016, which is related to pending U.S. patent application Ser. No. 13/404,644 entitled ELECTRICAL TEST DEVICE AND METHOD and filed on Feb. 24, 2012, and to U.S. Pat. No. 7,184,899, issued on Feb. 27, 2007, and which is entitled ENERGIZABLE ELECTRICAL TEST DEVICE FOR MEASURING CURRENT AND RESISTANCE OF AN ELECTRICAL CIRCUIT, the entire contents of application Ser. No. 13/404,644 and U.S. Pat. No. 7,184,899 being expressly incorporated by reference herein.
- The present disclosure relates generally to electrical test equipment and, more particularly, to a conductive probe for a circuit tester or a jumper.
- The incidence and complexity of electronic circuitry continues to increase, requiring improvements in the efficiency and functionality of the test equipment necessary to diagnose and repair such circuitry. Test equipment such as multi-meters and logic analyzers may generally communicate with the circuitry being tested via one or more conductive test probes. Test probes may be configured to pierce an insulated wire or contact an exposed electrical terminal. Measured parameters may include resistance, voltage, current, impedance, frequency, and digital waveforms. In addition, some multi-meters, such as the multi-meter disclosed in U.S. Pat. No. 7,184,899, have a “power and measure” feature, allowing a technician to probe a circuit, initiate current sourcing, and simultaneously measure electrical parameters, thus enhancing test efficiency. Some important quality goals for test equipment may include collecting accurate measurements at the required resolution without interfering with the operating point of the circuit under test. Unfortunately, certain design aspects of conventional test equipment may result in poor measurement quality when diagnosing a circuit.
- For example, one cause of poor measurement quality may be a test probe resistance that is higher than the required measurement resolution. For example, a test probe resistance of 100 milliohms (mΩ) would interfere with the accurate measurement of a circuit resistance requiring a resolution of 10 mΩ by adding 100 mΩ to the measurement result. Test probe resistance is measured across the conducting length of the test probe, and does not include the contact resistance occurring between the test probe and the circuit node. Test probe resistance may depend on the resistivity of the conductor used, on corrosion, and on any damage that occurs due to misuse or high current flow. Often, the test probe may be fabricated from a metal material having a relatively low resistivity, which may be adequate for conducting moderate current flows of less than approximately 1 to 10 amps. For example, brass, an alloy of copper and zinc, has a resistivity of approximately 6-7 μΩ-cm, where metals in general may range from 1-300 μΩ-cm in resistivity. However, many automotive circuits require testing with high current flows of from approximately 10 to 100 amps or more, which may require the alteration of the geometry or diameter of a brass or steel test probe to insure that test probe resistance remains small.
- Another cause of poor measurement quality may be electrical arcing that may occur between the test probe and the circuit node being measured. Arcing may generally begin during the making or breaking of contact involving a live circuit in close proximity. A live circuit may occur by either placing a test probe onto an energized circuit node having a voltage, or by placing an energized test probe onto a non-energized or passive circuit node, or both. A sustained arc having sufficient heat energy, i.e., sufficient current, may melt steel. The effect of even momentary arcing may be a break down or damage in the conductor material such as brass or steel, causing heating, burning, melting, material migration, molecular voids, and a permanent rise in test probe resistance that begins to interfere with the quality of the measurement. Arcing may self-extinguish once the distance between electrical nodes increases. However, the availability of larger current flows may increase the heat energy within an arc, increasing the possibility of material damage. A test probe susceptible to arc damage may degrade progressively over time, attracting larger and longer arcs, and increasing test probe resistance further. Conventional metallic test probes may therefore require frequent replacement.
- Another cause of excessive test probe resistance may be a temporary heating of the sharpened tip through either arc heating or resistive heating. During arc heating, initiating an electrical contact may give rise to a momentary arc over the sharpened tip of the test probe, heating the surface of the probe tip. Since many metals, such as brass and steel, possess positive resistive temperature coefficients, their resistivity may increase upon the occurrence of an arc. A multi-meter measurement immediately following such an arc may experience increased test probe resistance that gives rise to measurement error. In addition to arc heating, a substantial current flow through the sharpened tip during a measurement may give rise to resistive heating that also creates increased resistivity, building on any preceding arc heating and causing more measurement error. For example, a sharpened tip comprised of a metal having a positive temperature coefficient may be required to conduct the flow of 100 amps through a very small volume of metal, generating heat and increased resistance, and subsequently measurement error. For example, a 100° C. increase in the temperature of the tip of a copper test probe having a temperature coefficient of 0.0043/° C. causes tip resistance to increase by 43% (i.e., 100×0.0043), and causing an increase in overall test probe resistance.
- Another problem that may arise during measurements involving a conductive test probe relates to the arc detection circuitry disclosed in the above-mentioned application Ser. No. 13/404,644. During arc detection, high frequency spectra may be analyzed for evidence of arcing internal to the circuitry being powered and measured by the test equipment. The test may be terminated by a circuit breaker upon detection of an internal arc. The accuracy of the measurement depends on a fast rise time in the voltage or current, which requires a small test probe resistance. However, the occurrence of test probe arcing may interfere with the internal detection of arcing by interfering with the sense threshold causing arcing to increase before the sense threshold is achieved. Additionally, as the test probe resistance increases further and the rise time gets progressive slower, the response may eventually become so delayed that the circuit breaker does not shut down at all, posing a fire hazard to a circuit that is external arcing.
- A further cause of excessive test probe resistance may be the use of test probe geometries that generate high resistive losses. For example, the sharpened tip of the test probe may be the location of highest current density and may thereby contribute excessively to the overall test probe resistance if there is a long path from the probe tip to a conductive portion of the test probe having relatively low current density. In addition, local heating may occur near the tip due to current flow, further increasing path resistance.
- As can be seen, there exists a need in the art for a durable conductive test probe that can withstand arcing over many cycles under high current conditions. Additionally, there exists a need in the art for a test probe that maintains a low resistance at high currents during arcing so that measurement resolution and accuracy are maintained. Furthermore, there exists a need in the art for a test probe that preserves the rise time of arc detection circuitry by preventing an increase in test probe resistance caused by arcing. There also exists a need in the art for a test probe that can withstand many contact cycles under live circuit conditions. In addition, there exists a need in the art for a conductive test probe that has a compact (i.e., small) geometry that minimizes test probe resistance.
- The above-noted needs associated with conductive probes are specifically addressed and alleviated by the present disclosure which, in an embodiment, provides a conductive probe having a probe body for communicating with a circuit tester or a jumper. The probe body may be comprised of metal and has a free end. A probe tip comprised of thorium-tungsten may be mounted to the free end of the probe body. The probe tip may be configured for contacting a circuit node.
- Also disclosed is a conductive probe that may comprise a probe body for communicating with a circuit tester or a jumper. The probe body may be comprised of metal and may have a socket formed in a free end. A probe tip may be comprised of thorium-tungsten and may have a buried end mounted within the socket of the probe body. The socket may be shaped and sized complementary to the buried end in order to minimize the contact resistance between the probe body and the probe tip. The probe tip may have a narrowed end located opposite the buried end. The narrowed end may be narrowed to a contact surface for contacting a circuit node. The shortest distance between the contact surface and the probe body may be less than approximately 0.250 inch.
- Also disclosed is a durable tip that may comprise a probe tip receivable by a probe body configured for communicating with a circuit tester or a jumper. The probe tip may be comprised of thorium-tungsten and may have a buried end that may be receivable by the probe body in such a manner that contact resistance between the probe tip and the probe body is minimized. The probe tip may have a narrowed end located opposite the buried end. The narrowed end may be narrowed to a contact surface for contacting a circuit node. The shortest distance between the contact surface and the probe body may be less than approximately 0.250 inch.
- The features, functions and advantages that have been discussed can be achieved independently in various embodiments of the present disclosure or may be combined in yet other embodiments, further details of which can be seen with reference to the following description and drawings below.
- These and other features of the present disclosure will become more apparent upon reference to the drawings wherein like numbers refer to like parts throughout and wherein:
-
FIG. 1 is a perspective view of an embodiment of a circuit tester having a conductive probe attached thereto. -
FIG. 2 is an exploded side view of an embodiment of a conductive probe having a probe plug for mating with a circuit tester having a probe jack. -
FIG. 3 is a side view of an embodiment of the conductive probe ofFIG. 2 mated to the circuit tester. -
FIG. 4 is a perspective view of an embodiment of a conductive probe. -
FIG. 5 is an exploded sectional view of an embodiment of a conductive probe comprising a probe body and a probe tip. -
FIG. 6 is a sectional view of the conductive probe ofFIG. 5 showing the probe tip mated to the probe body. -
FIG. 7 is an end view of the embodiment of the conductive probe ofFIG. 6 . -
FIG. 8A is a side sectional view of an embodiment of a conductive probe in a ready position above a circuit node to be measured. -
FIG. 8B is a side sectional view of the conductive probe in contact with the circuit node to be measured. -
FIG. 8C is a side sectional view of the conductive probe in energized contact with a circuit node and illustrating the density of current flow through the probe tip. - Referring now to the drawings wherein the showings are for purposes of illustrating various aspects of the present disclosure, shown in
FIG. 1 is an embodiment of acircuit tester 31 coupled to aconductive probe 10 for the purpose of making electrical contact with a circuit to be measured.Circuit tester 31 may comprise a multi-meter electrical circuit tester or other electrical test equipment or test device such as may be used to diagnose or repair an electrical circuit. Probebody 11 may conduct an electrical signal (not shown) betweencircuit tester 31 andprobe tip 15. Thenarrowed end 14 ofprobe tip 15 may be narrowed in at least one dimension relative to acontact surface 25 so that theprobe tip 15 is capable of piercing the electrical insulation of a wire or to facilitate reliable contact of theprobe tip 15 with a circuit node (not shown) such as an exposed electrical terminal. Although theprobe tip 15 is shown having a conical narrowed end 14 (e.g., narrowed in two dimensions), theprobe tip 15 may be provided with alternative geometries, such as a blade configuration (not shown) or a multiple prong configuration (not shown). In this regard, theprobe tip 15 may be configured to achieve a low contact resistance with a circuit node while minimizing the electrical resistance of theconductive probe 10. - In an embodiment, the circuit tester 31 (e.g.,
FIG. 1 ) may be configured to supply current toconductive probe 10 while retrieving and displaying measured electrical parameters such as voltage, current, resistance, frequency, or digital information. For example, a technician operating thecircuit tester 31 may press an actuating button (not shown) to begin current sourcing to provide current to a circuit under test, preferably after contacting theprobe tip 15 with the circuit node (not shown) under test. However, in embodiments, a technician may prematurely actuate current sourcing fromcircuit tester 31, making contact with what may be called a live (i.e., energized) circuit, and which may result in adverse consequences, as will be discussed below. - Referring still to
FIG. 1 , in an embodiment, theprobe body 11 may be fabricated of brass, steel or other suitable metallic material or conductor and which may have a relatively low resistivity.Circuit tester 31 andconductive probe 10 may be configured to receive or supply relatively high current flows such as, for example, currents of approximately 10 to 100 amps or more, and which may be particularly relevant in the field of automotive electronics. At such relatively high current flows, it is preferable that theconductive probe 10 provides a very low resistance path in order to avoid excessive ohmic losses which may result in measurement errors such as measurement errors by thecircuit tester 31. - At automotive voltages of approximately 12 volts and higher, electrical arcing may occur between the
narrowed end 14 and a circuit node (not shown) being contacted, such as when making or breaking contact in the presence of voltage (live contact). The effect of arcing atnarrowed end 14, especially when relatively high current flows are available, may be a breakdown, melting, or other damage to the material of theconductive probe 10. Such material breakdown may result in permanent and progressively higher resistance to test currents flowing throughconductive probe 10, and consequently may cause stronger arcs and multi-meter (e.g., circuit tester 31) measurement errors. Since narrowedend 14 may have a substantially smaller width thanprobe body 11,probe tip 15 may dominate the overall resistance ofconductive probe 10. Therefore, resistance increases inprobe tip 15 caused by arcing damage may substantially increase the resistance ofconductive probe 10. For example, brass, steel, and other conductors having relatively low to moderate melting temperatures may be particularly susceptible to tip damage during arcing. In this regard, while brass, steel, and other conductors or materials may meet the resistivity requirements of high current flows, such materials may not provide for adurable probe tip 15, and may cause measurement errors. - Referring now to
FIG. 2 , shown is an embodiment of aconductive probe 10 configured with aprobe plug 33 for electrically mating withcircuit tester jack 34 ofcircuit tester 31. The mating of the outer surface of probe plug 33 to the inner surface ofcircuit tester jack 34 may provide a low contact resistance to prevent measurement error, yet may allow for easy replacement ofconductive probe 10. While a plug and jack arrangement is shown in this embodiment for attaching theconductive probe 10 to thecircuit tester 31, it is to be understood that other forms of temporary or permanent attachment are possible. For example, theconductive probe 10 may be attached to a circuit tester by means of a threaded attachment or by means of sliding fit. In a further embodiment not shown, the probe and jack assignments may be reversed, with theconductive probe 10 being outfitted with a jack instead of aprobe plug 33, and thecircuit tester 31 being outfitted with a plug instead of acircuit tester jack 34. - Referring still to
FIG. 2 , an embodiment of aconductive probe 10 comprisesprobe body 11 which may conduct electrical current between probe plug 33 andprobe tip 15 mounted to the end ofprobe body 11. In an embodiment, buried end width 20 (FIG. 5 ) may define the diameter of a buried end (not shown) ofprobe tip 15 that may be sized and configured for an interference fit within theprobe body 11. In an embodiment, narrowedend 14 may be conical in shape for contacting a circuit node (not shown) to be measured. Probetip 15 may be comprised of thorium-tungsten having an immunity to material breakdown in the presence of electrical arcing, and which may have a relatively high melting temperature. For example, thorium-tungsten may have a melting temperature of approximately 3410°C. Probe body 11 may be comprised of a low-cost conductor material having relatively low resistivity. In an embodiment, theprobe body 11 may be formed of any one of a variety of different metallic materials, without limitation, including brass, copper, steel, or other metallic materials or alloys thereof. - Probe
tip 15 may be sized and configured to provide a relatively short distance, i.e., a shortest distance 23 (FIG. 6 ), betweencontact surface 25 and a free end of theprobe body 11. For example, theprobe tip 15 may provide ashortest distance 23 in an embodiment wherein theprobe tip 15 is press fit into theprobe body 11. Because thorium-tungsten may have substantially higher electrical resistance than the material of theprobe body 11, theshortest distance 23 may advantageously limit the overall path resistance throughconductive probe 10 to be less than the measurement resolution required bycircuit tester 31, thereby preventing measurement errors. Furthermore, the connection of the thorium-tungsten probe tip 15 to the low-resistivity probe body 11 along theshortest distance 23 advantageously provides for a durableconductive probe 10 capable of conducting high current flows and withstanding arcing without degradation or damage to theprobe tip 15 orprobe body 11. - In
FIG. 2 , theshortest distance 23 may be along a conical surface of theprobe tip 15 assuming that the core ofprobe tip 15 extends intoprobe body 11 by a greater distance. It is to be understood however that theprobe tip 15 may be provided in other geometries, shapes, or configurations, and/or in other mounting styles and which may alter the length of theshortest distance 23 between thecontact surface 25 and the portion ofprobe body 11 nearest thecontact surface 25. For example, a butted connection (not shown) betweenprobe tip 15 andprobe body 11 may define an axial path (i.e., along a direction parallel to an axis of the conductive probe) of theshortest distance 23. In an embodiment,shortest distance 23 may be less than approximately 0.250 inch in order to maintain a sufficiently low resistance forconductive probe 10. In another embodiment,shortest distance 23 may be less than approximately 0.100 inch. However, shortest distance may be larger than 0.250 inch. Additionally, gold plating (not shown) may be applied to theprobe tip 15 to improve contact resistance of the surface of theprobe tip 15 or to prevent corrosion of theprobe tip 15. - Referring still to
FIG. 2 , in an embodiment, the thorium-tungsten of theprobe tip 15 may have a concentration of between approximately 0.5% and approximately 5% (percent) thorium by weight, the remaining weight being tungsten. More typically, the concentration of thorium may be approximately 1-2% by weight. However, the thorium-tungsten of theprobe tip 15 may be provided in any concentration of thorium by weight relative to the tungsten. Thorium, a radioactive material, may be added to tungsten in a process of doping using thorium oxide, or the thorium may be added to tungsten using other techniques known in metallurgy. Thorium-tungsten may also be referred to as thoriated-tungsten. Adding thorium to tungsten may increase the current-carrying capacity of the tungsten by approximately 20% to 50%, enhancing the ability of the probe tip to conduct high current flows in the presence of arcing without material damage. Thorium may also increase tungsten's emissivity in vacuum tubes. - Performance tests on a 2% thoriated-
tungsten probe tip 15 that was press fit into abrass probe body 11 demonstrated that the thoriated-tungsten probe tip 15 may have substantial immunity to material break down during arcing and 100 amp current availability. After repeated cycles of live contact of theprobe tip 15 to a brass conductor wherein arcing was observed, the thoriated-tungsten probe tip 15 exhibited no measureable increase in the resistance of theconductive probe 10, demonstrating that thorium-tungsten advantageously serves as a durable material forprobe tip 15. Furthermore, the performance tests demonstrated that the functioning of arc detection circuitry (e.g., of circuit tester 31) is unimpaired by the use of the thoriated-tungsten probe tip 15. Advantageously, the use of a compact press fit geometry of theprobe tip 15 into theprobe body 11 minimized the electrical resistance ofconductive probe 10 to an amount below the measurement resolution. The performance tests of the probe tip demonstrated that the objectives of measurement accuracy, high resolution, arc immunity, proper arc detection, and non-interference with the operating point of the circuit under test may be achieved with a balanced thorium-tungsten design. - During the measurement of high current flow, and during arcing, local heating of
probe tip 15 may temporarily raise the test probe resistance for probe tip materials having a positive temperature coefficient. For example, the thermal coefficient of electrical conductivity of thorium-tungsten may be approximately 0.0045/° C. compared to approximately 0.0015/° C. for brass, meaning that the electrical resistance of thorium-tungsten may be much higher than the electrical resistance of brass when resistively heated. However, by using aprobe tip 15 having a compact geometry (e.g., a relatively small size or volume), a low resistivity material for theprobe body 11, and ashortest distance 23 between theprobe tip 15 and theprobe body 11, a balance in performance attributes may be achieved, including relatively high measurement resolution, improved durability of the probe tip in the presence of repeated arcing, relatively low cost, and relatively fast rise time performance for arc detection circuitry. Advantageously, in the performance tests mentioned above, neither arc heating nor resistive heating were measurably occurring. - Referring to
FIG. 3 , shown is an embodiment of aconductive probe 10 electrically and mechanically mated via probe plug 33 tocircuit tester 31 by insertingprobe plug 33 intocircuit tester jack 34. In an embodiment, theprobe plug 33 may be slidably inserted into thecircuit tester jack 34 or the probe plug may be threadably engaged (not shown) to thecircuit tester 31. The mating of the outer surface of probe plug 33 to the inner surface ofcircuit tester jack 34 may provide a low contact resistance which may minimize measurement error, yet allow for easy replacement ofconductive probe 10. Probebody 11 may, by virtue of a relatively large diameter shaft, provide a low resistance path to probetip 15 betweencontact surface 25 andprobe body 11. Probetip 15 extends from buriedend width 20 to narrowedend 14 and may be conical in shape, or may have some other shape to facilitate contact of the probe tip to a circuit node (not shown). In an embodiment, theprobe tip 15 may have a sharpened end terminating in a point or otherwise shaped to make reliable contact with a circuit node. Theprobe tip 15 may be configured to provide ashortest distance 23 betweencontact surface 25 andprobe body 11 which may limit the resistance contribution from aprobe tip 15 comprised preferably of thorium-tungsten, allowing good measurement resolution under all test conditions. - The
conductive probe 10 may be comprised substantially ofprobe body 11 made from a material of relatively low electrical resistivity in order that a relatively compact volume of thorium-tungsten may be used forprobe tip 15. In one embodiment, at least approximately 80% by volume of theconductive probe 10 may be comprised of theprobe body 11. In another embodiment, approximately 97% of theconductive probe 10 may be comprised of theprobe body 11, the remaining approximately 3% of the volume comprising theprobe tip 15. It is to be understood that this disclosure is not limited to the above-mentioned proportions of probe body volume to probe tip volume. In this regard, theconductive probe 10 may be provided in any proportion of probe body volume to probe tip volume that provides a balance of a low conductive probe resistance with relatively high durability of the probe tip under arcing and high current flows. - Referring still to
FIG. 3 , portions of theprobe body 11 may be enclosed in an insulating layer (not shown) for preventing unintended electrical shorting to the test environment. Furthermore, a portion of theprobe body 11 may be enclosed with a handle (not shown) for handling theconductive probe 10 conveniently. The handle (not shown) and insulating layer (not shown) functions may be combined. Additionally,circuit tester 31 may be replaced with a jumper or test lead suitable for establishing a temporary connection between the circuit node in communication withcontact surface 25 and another circuit node in the same or another electrical circuit. In this regard, theprobe tip 15 andprobe body 11 configuration disclosed herein may be installed on or integrated into a jumper or a test lead. As indicated above, the thoriated-tungsten composition of theprobe tip 15 may advantageously minimize degradation or damage that may otherwise occur in a conventional probe tip such as due to arcing. - Referring now to
FIG. 4 , shown is a cutaway perspective view of an embodiment ofprobe body 11 including aprobe tip 15 which may include a cylindrically-shaped buried end (not shown) and including a conical shape narrowing to anarrowed end 14. In an embodiment, the buried end (not shown) ofprobe tip 15 may have a buriedend width 20 that may extend into an interior of theprobe body 11. The buried end of theprobe tip 15 may extend far enough into theprobe body 11 such that theshortest distance 23 between theprobe tip 15 terminal end and theprobe body 11 is measured along the surface of theprobe tip 15. As may be more evident inFIG. 4 , thorium-tungsten probe tip 15 may have a generally compact geometry and a small volume relative to probebody 11, and which may advantageously give rise to a small path resistance throughprobe tip 15 andprobe body 11. - Referring now to
FIG. 5 , shown is an exploded side sectional view of an embodiment of theconductive probe 10. Probetip 15 may have a buriedend 13 that may be sized to provide a press fit into thesocket 16 along interferencefit surface 12 withinprobe body 11. As indicated above, theprobe body 11 may be configured to communicate with (e.g., is mounted to or integrated with) a circuit tester, a jumper or test lead, or other electrical device or electrical component.Buried end 13 may have a buriedend length 19 that may be greater than or approximately equal tosocket length 18 alonginterference surface 12.Buried end width 20 may be sized to form an interference fit of from approximately 0.0001 inch to approximately 0.005 inch withsocket 16. For example, for a buriedend 13 width of approximately 0.250 inch, thesocket 16 may have a diameter of approximately 0.249 inch. The buriedend 13 width and thesocket 16 width (e.g., diameter) may be such that a negligible contact resistance occurs betweenprobe tip 15 andprobe body 11, and such that theprobe tip 15 is retained within theprobe body 11. Probetip 15 may be sharpened or shaped to anarrowed end 14, terminating atcontact surface 25 and being configured for piercing an insulated electrical wire (not shown) and/or for penetrating an exposed electrical terminal (not shown). However, theprobe tip 15 may be provided in any one of a variety of alternative shapes and configurations configured complementary to a specific application. For example, theprobe tip 15 may be provided with a generally blunt or flattened terminal end (not shown), a generally rounded end (not shown), a multi-pronged shape, or other shapes, and is not limited to the conical shape of theprobe tip 15 shown in the figures. - Although
FIG. 5 may suggest that the buriedend 13 andsocket 16 has a cylindrical shape, the buriedend 13 andsocket 16 may be provided in other geometries. For example, buriedend 13 andsocket 16 may be rectangular (not shown), square, or other faceted cross-sectional shapes, or buriedend 13 andsocket 16 may be axially splined (not shown), helically threaded, ribbed, or provided with other mechanical surface features for interlocking theprobe tip 15 to theprobe body 11. Alternatively,probe tip 15 may be provided with a socket (not shown) to mate with a plug (not shown) that may be formed on an end of theprobe body 11. In one embodiment, buriedend 13 may have a buriedend width 20 of less than or no greater than approximately 0.250 inch for the purpose of minimizing the distance betweencontact surface 25 and the nearest portion ofprobe body 11. In another embodiment, buriedend 13 may have a buriedend width 20 of approximately 0.097 inch. In a further embodiment, buriedend 13 may have a buriedend width 20 of approximately 0.125 inch. In this regard, the buriedend 13 of theprobe tip 15 may be provided in any buriedend width 20, without limitation. In an embodiment, the ratio of buriedend width 20 tosocket length 18 may preferably range from approximately 1:1 to approximately 3:1. In another embodiment, the ratio of buriedend width 20 tosocket length 18 may preferably be approximately 2:1. However, theprobe tip 15 andprobe body 11 may be configured to provide any ratio of buriedend width 20 tosocket length 18. - In an embodiment (not shown), the buried
end length 19 may be greater than thesocket length 18 which may result in the start of thenarrowed end 14 protruding (not shown) past the end of theprobe body 11 by more than the length of the conical portion ofprobe tip 15, leading to an increased distance betweencontact surface 25 and the free end ofprobe body 11 nearest thecontact surface 25. Such protrusion ofprobe tip 15 beyond free end ofprobe body 11 may be desirable in extending a narrow tip deeper into a cramped region of circuitry to be tested. In the case where the start of thenarrowed end 14 protrudes past the end of theprobe body 11, the shortest distance (not shown) between thecontact surface 25 and the nearest portion of theprobe body 11 may be along an interior of theprobe tip 15 and not along an outer surface ofprobe tip 15. - Referring to
FIG. 6 , shown is a side sectional view of an embodiment of theconductive probe 10 showing the buriedend 13 of theprobe tip 15 press fit into theprobe body 11. Theprobe tip 15 is engaged to theprobe body 11 along an interferencefit surface 12 having anengagement length 22. Theprobe body 11 may be configured to communicate with a circuit tester or jumper as indicated above. - Referring to
FIG. 7 , shown is an end view of an embodiment of theprobe tip 15 mated to theprobe body 11. As indicated above, theprobe tip 15 may be press fit into the probe body although other engagement configurations (e.g., threaded engagement or other mechanical interlocking) are possible. In an embodiment, theprobe tip 15 may have a buriedend width 20 that may be less than an outer diameter of theprobe body 11. Probetip 15 may be sharpened to apointed contact surface 25 for contacting an electrical circuit to be tested. In a further embodiment, thecontact surface 25 of the probe tip may be provided with multiple prong points, a blade having a narrowed linear edge, or other geometries which simultaneously provide for low electrical contact resistance with a circuit node (not shown) and low electrical path resistance withinprobe tip 15. - Referring to
FIGS. 8A, 8B, and 8C , shown are embodiments of aconductive probe 10 in progressive stages of interacting with acircuit node 24 of anelectrical path 27.Circuit node 24 may be an insulated wire or an exposed electrical terminal or any other electrical system, electrical device, electrical assembly or electrical component. As indicated above, the buriedend 13 of theprobe tip 15 may be press fit into theprobe body 11 alongengagement length 22. In the embodiments shown, theprobe tip 15 may be shaped to have a narrowedend 14 terminating at thecontact surface 25.Shortest distance 23 may provide the lowest resistance path fromcontact surface 25 to the nearest portion ofprobe body 11. - Referring to
FIG. 8A , shown is an embodiment of theconductive probe 10 in a “ready” position hovering overcircuit node 24 in an unpowered (i.e., non-energized) state. No current is flowing throughconductive probe 10, andelectrical path 27 may or may not be energized. Advantageously, theprobe tip 15 may be comprised of thorium-tungsten to withstand any arcing that may occur in the “ready” position when theprobe tip 15 is in relatively close proximity to thecircuit node 24. - Referring to
FIG. 8B , shown is an embodiment of theconductive probe 10 unpowered and in a “contact” stage. Thecontact surface 25 of theprobe tip 15 is shown contacting thecircuit node 24. No current is flowing throughconductive probe 10, and theelectrical path 27 may or may not be energized. - Referring to
FIG. 8C , shown is an embodiment of theconductive probe 10 in an “energized” stage whereincontact surface 25 of theprobe tip 15 is contactingcircuit node 24. In an embodiment, the circuit tester 31 (FIG. 2 ) may be engaged to transmit electrical current to thecircuit node 24, creating lines of uniformcurrent density 26. In another embodiment,electrical path 27 may be energized andcircuit tester 31 may receive electrical current from theelectrical path 27 as part of the measurement being performed, and resulting in lines of uniformcurrent density 26 in theprobe tip 15. Lines of uniformcurrent density 26 may be most closely packed along theshortest distance 23 path and more loosely packed along an axial direction of the probe tip because the axial path is a longer distance to theprobe body 11 than theshortest distance 23, and because the axial direction may have greater electrical resistance, and hence is less preferred by flowing electrons. - Referring still to
FIG. 8C , the size, shape, configuration, and/or geometry of the conductive probe 10 (e.g., theprobe body 11 and/or probe tip 15) may be optimized by evaluating the lines of uniformcurrent density 26 in theprobe tip 15. In this regard, the geometry for theconductive probe 10 may be selected to minimize the distance (i.e., shortest distance 23) between the contact surface of theprobe tip 15 and the portion of theprobe body 11 nearest thecontact surface 25, thereby minimizing the resistance ofconductive probe 10. In addition, theconductive probe 10 may be configured in consideration of the amount of surface area at the interface between theprobe tip 15 and theprobe body 11. For example, a larger surface area of the interferencefit surface 12 may generate a smaller electrical resistance for theconductive probe 10, and a smaller amount of surface area of the interferencefit surface 12 may result in a larger electrical resistance for theconductive probe 10. In addition, the electrical current may be made to flow in either direction with both directions providing the same electrical path. - Additional modifications and improvements of the present disclosure may be apparent to those of ordinary skill in the art. Thus, the particular combination of parts described and illustrated herein is intended to represent only certain embodiments of the present disclosure and is not intended to serve as limitations of alternative embodiments or devices within the spirit and scope of the disclosure.
Claims (20)
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US13/730,850 Active 2034-04-05 US9766269B2 (en) | 2012-12-29 | 2012-12-29 | Conductive test probe |
US15/707,909 Active US10768205B2 (en) | 2012-12-29 | 2017-09-18 | Conductive test probe |
US17/013,412 Abandoned US20210156886A1 (en) | 2012-12-29 | 2020-09-04 | Conductive test probe |
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US13/730,850 Active 2034-04-05 US9766269B2 (en) | 2012-12-29 | 2012-12-29 | Conductive test probe |
US15/707,909 Active US10768205B2 (en) | 2012-12-29 | 2017-09-18 | Conductive test probe |
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US10094858B1 (en) * | 2016-06-29 | 2018-10-09 | Christopher James Lahowetz | Electrical test assembly shielding user from energized equipment |
HUP1700051A2 (en) * | 2017-02-02 | 2018-08-28 | Equip Test Kft | Contact device and headunit, and method of contact device and headunit production |
CN109419533B (en) * | 2017-08-28 | 2022-01-28 | 深圳市理邦精密仪器股份有限公司 | Monitor and interface switching method and device thereof |
US10578647B2 (en) * | 2017-09-29 | 2020-03-03 | Intel Corporation | Probes for wafer sorting |
WO2020159480A1 (en) * | 2019-01-29 | 2020-08-06 | Klein Tools, Inc. | Circuit energization status test device and method |
CN114814314B (en) * | 2022-04-18 | 2024-02-13 | 苏州伊欧陆系统集成有限公司 | Multi-contact high-current high-voltage test probe |
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-
2012
- 2012-12-29 US US13/730,850 patent/US9766269B2/en active Active
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2017
- 2017-09-18 US US15/707,909 patent/US10768205B2/en active Active
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2020
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US9766269B2 (en) | 2017-09-19 |
US10768205B2 (en) | 2020-09-08 |
US20180003738A1 (en) | 2018-01-04 |
US20140184260A1 (en) | 2014-07-03 |
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