CN114814314B - Multi-contact high-current high-voltage test probe - Google Patents
Multi-contact high-current high-voltage test probe Download PDFInfo
- Publication number
- CN114814314B CN114814314B CN202210404903.0A CN202210404903A CN114814314B CN 114814314 B CN114814314 B CN 114814314B CN 202210404903 A CN202210404903 A CN 202210404903A CN 114814314 B CN114814314 B CN 114814314B
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- China
- Prior art keywords
- contact
- test probe
- test
- needle plate
- current
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- 238000012360 testing method Methods 0.000 title claims abstract description 93
- 239000000523 sample Substances 0.000 title claims abstract description 61
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims abstract description 14
- 239000010931 gold Substances 0.000 claims abstract description 14
- 229910052737 gold Inorganic materials 0.000 claims abstract description 14
- 238000007747 plating Methods 0.000 claims abstract description 11
- DECCZIUVGMLHKQ-UHFFFAOYSA-N rhenium tungsten Chemical compound [W].[Re] DECCZIUVGMLHKQ-UHFFFAOYSA-N 0.000 claims description 4
- 239000002245 particle Substances 0.000 claims description 3
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims description 3
- 229910052721 tungsten Inorganic materials 0.000 claims description 3
- 239000010937 tungsten Substances 0.000 claims description 3
- 238000005516 engineering process Methods 0.000 abstract description 5
- 238000005259 measurement Methods 0.000 abstract description 5
- 239000004065 semiconductor Substances 0.000 description 5
- 210000004907 gland Anatomy 0.000 description 4
- 239000000463 material Substances 0.000 description 3
- 238000004458 analytical method Methods 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 244000137852 Petrea volubilis Species 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000012812 general test Methods 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Measuring Leads Or Probes (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
The invention discloses a multi-contact high-current high-voltage test probe which comprises a needle plate, wherein the front end of the needle plate is provided with a plurality of pins, and a plurality of limiting holes and mounting holes are formed in the middle of the needle plate; and the whole surface of the multi-contact high-current high-voltage test probe is subjected to gold plating treatment. The invention adopts a multi-pin design to realize a multi-point contact technology, thereby realizing uniform current distribution, the contact resistance between the pin test area and the test pad is extremely small, and the single contact can realize the measurement work of high current up to 10kV high voltage and 300A pulse high current under the coaxial condition without a plurality of probes, so that the test work of high current and high voltage is simpler and more convenient. And damage to the test probes and the test pads can be reduced to the greatest extent.
Description
Technical Field
The invention relates to the technical field of integrated circuit testing, in particular to a multi-contact high-current high-voltage test probe.
Background
The semiconductor device of the semiconductor chip or wafer tests a measurement of its quality, the probe transmits a test signal (current or voltage) to the semiconductor device, and it is very important to stably transmit the test signal, the probe having a probe disposed therein to apply a predetermined test signal to a pad of the semiconductor device.
The quality of the general test probe is mainly characterized in the aspects of materials, plating layers and manufacturing processes, and the following defects exist:
1. when the test current is too large, the high current can burn out the test equipment, and the test effect cannot be achieved.
2. When the tested chip is a high-current chip, the power is larger, and the capability of conducting high current is not achieved.
3. Most of the probe tips are exposed, the probes are easy to damage, the probes are easy to burn out in a high-temperature test environment, the probe tips are worn out after the probes are used to the maximum extent, and the probes are forced to be discarded.
Disclosure of Invention
The invention solves the technical problem of providing a test probe which can withstand high current and high voltage by multipoint contact.
The technical scheme adopted for solving the technical problems is as follows:
the multi-contact high-current high-voltage test probe comprises a needle plate, wherein a plurality of pins are arranged at the front end of the needle plate, and a plurality of limiting holes and mounting holes are formed in the middle of the needle plate; and the whole surface of the multi-contact high-current high-voltage test probe is subjected to gold plating treatment to form a gold-coated layer.
Further, the needle plate is a rectangular needle plate or a rectangular trapezoid-adding needle plate, and the rectangular trapezoid-adding needle plate is preferably adopted.
Further, the test probe adopts a tungsten or rhenium tungsten probe, and is subjected to overall gold plating treatment on the surface of the test probe.
Further, the number of pins is at most twelve pins.
Further, the stitch width is less than 250 μm.
Further, the stitch comprises a needle bar and a needle point, the front lower end of the needle point is a test contact area, the test contact area is polished, and the surface grain diameter of the test contact area is smaller than 0.5 mu m.
Further, the test area has a length of less than 250 μm and a width of less than 150 μm.
Further, the test probe has a thickness of less than 450 μm.
The beneficial effects of the invention are as follows:
1. the invention adopts a multi-pin design to realize a multi-point contact technology, thereby realizing uniform current distribution, the contact resistance between the pin test area and the test pad is extremely small, and the single contact can realize the measurement work of high current up to 10kV high voltage and 300A pulse high current under the coaxial condition without a plurality of probes, so that the test work of high current and high voltage is simpler and more convenient. And damage to the test probes and the test pads can be reduced to the greatest extent.
2. The surface of the multi-contact high-current high-voltage test probe needle body is subjected to gold plating treatment, so that safe, reliable and repeatable testing work with the highest 300A (pulse) high current and 10kV high voltage can be realized within the temperature range of-60 ℃ to 300 ℃.
3. The high voltage and high current conditions are tested through single drop detection, so that the measurement time can be reduced, and accurate characteristic analysis can be performed on a plurality of bonding pad sizes and test currents.
Drawings
FIG. 1 is a block diagram of a test probe according to the present invention;
FIG. 2 is a block diagram of the stitch portion of FIG. 1;
FIG. 3 is an enlarged view of portion A of FIG. 2;
FIG. 4 is a schematic illustration of an embodiment of the present invention;
marked in the figure as:
1. test probes, 101, needle plates, 102, pins, 1011, limit holes, 1012, mounting holes, 1021, needle bars, 1022, needle points, 1022a, test contact areas, 2, needle bases, 3 and gland.
Detailed Description
In order that the above objects, features and advantages of the invention will be readily understood, a more particular description of the invention will be rendered by reference to the appended drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. The present invention may be embodied in many other forms than described herein and similarly modified by those skilled in the art without departing from the spirit of the invention, whereby the invention is not limited to the specific embodiments disclosed below.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The term "and/or" as used herein includes any and all combinations of one or more of the associated listed items.
As shown in FIG. 1, the test probe 1 of the invention comprises a needle plate 101, a plurality of pins 102 are arranged at the front end of the needle plate 101, a plurality of limit holes 1011 and mounting holes 1012 are also formed in the middle of the needle plate 101, and the whole gold plating treatment of the surface of the test probe of the invention forms a gold-coated layer. The multi-contact high-current high-voltage test probe technology can realize safe, reliable and repeatable test work of highest 300A (pulse) high current and 10kV high voltage in a temperature range of-60 ℃ to 300 ℃, can complete the test of the high current and the high voltage by single contact, does not need a plurality of probes for testing, and is simpler and more convenient. The high voltage and high current conditions are tested through single drop detection, so that the measurement time can be reduced, and accurate characteristic analysis can be performed on a plurality of bonding pad sizes and test currents.
The limiting holes 1011 are arranged in two groups, and are respectively arranged left and right, and the mounting holes 1012 are arranged in one group and are arranged in the middle of the needle plate 101. The limiting hole is used for positioning the test probe of the invention, the mounting hole is used for mounting and fixing, as shown in fig. 4, the needle seat 2 is provided with the positioning pin, the multi-contact test probe of the invention is firstly positioned with the needle seat 2 through the cooperation of the limiting hole and the positioning pin, is covered by the gland 3, and is finally screwed and fixed by a screw. Through setting up the faller, open spacing hole and mounting hole on the faller, can conveniently replace the test probe.
Further, the needle board 101 of the present invention adopts a rectangular needle board or a rectangular trapezoid-adding needle board, as shown in fig. 1, the needle board 102 in fig. 1 is a rectangular trapezoid-adding needle board, the present invention preferably adopts a rectangular trapezoid-adding needle board, a plurality of stitches are arranged at the front end of the trapezoid, and the rectangular trapezoid-adding needle board is adopted to facilitate the transition of the stitches, so as to increase the strength of the stitches, and improve the overall aesthetic feeling without being abrupt. The test probe adopts tungsten or rhenium tungsten material probes, preferably rhenium tungsten material, and is subjected to overall gold plating treatment on the surface of the test probe, so that the gold plating can not only improve the high and low temperature resistance of the test probe, but also improve the overall strength of the test probe so as to prolong the service life of the test probe.
As shown in fig. 1, the pins of the test probe of the present invention are provided with 12 pins to implement the multi-point contact technology, and in actual use, the pins can be customized according to the requirements. The width of the pin is less than 250 mu m, the interval between the pins is less than 600 mu m, the length of the needle plate is less than 10mm, and the thickness of the whole multi-contact test probe is less than 450 mu m. As shown in fig. 2 and 3, the pin 102 includes a shank 1021 and a needle tip 1022, and in the present invention, the overall length of the pin is 10mm, the front lower end portion of the needle tip is polished to form a test contact area 1022a, and the test contact area 1022a has a planar structure, and the length is the length of the pin 102, and the width is less than 250 μm.
In order to realize the testing work of 300A (pulse) high current and 10kV high voltage, the heating of the testing probe device is avoided as much as possible, the damage of the testing probe and the testing device is reduced, and on one hand, the high current and the high voltage are uniformly distributed by adopting the multipoint contact technology. On the other hand, the contact area between the test probe and the test PAD is expanded as much as possible, the contact resistance is reduced as much as possible, so as to reduce heat generation, in theory, the larger the contact area is, the smaller the resistance is, but the smaller the semiconductor is, the smaller the test PAD is, so that the diameter of the pin is not advisable to be increased, so that, in order to increase the contact area between the front lower end test contact area of the needle tip (the contact area with the test PAD) and the test PAD as much as possible, the test contact area is polished, and the polishing and polishing treatment is performed by using sand paper with the particle size of more than thirty thousand meshes, so that the surface of the test area at the front end is as smooth as possible, and the surface bulge particle size is smaller than 0.5 microns, thereby increasing the contact area between the test area and the test PAD. The invention can realize the contact resistance of the lowest 2mΩ, thereby further reducing the heating of the multi-contact of the invention and realizing the test work of high current and high voltage. The length of the needle point testing area at the front end of the stitch is less than 250 mu m, and the width is less than 150 mu m.
As shown in fig. 4, the surfaces of the needle seat 2 and the gland 3 are also subjected to integral gold plating treatment, so that the temperature generated by a plurality of pins can be quickly and uniformly conducted onto the needle plate through the gold-coated layer on the surface of the needle seat and the gland, and then the temperature of the test probe can be quickly reduced through the upper surface and the lower surface of the needle plate, thereby further improving the stability in the high-current and high-voltage test work.
The foregoing embodiments have been provided for the purpose of illustrating the general principles of the present invention, and are more fully described herein with reference to the accompanying drawings, in which the principles of the present invention are shown and described, and in which the general principles of the invention are defined by the appended claims.
Claims (8)
1. The utility model provides a high-current high voltage test probe of multicontact which characterized in that: the needle plate comprises a needle plate, wherein a plurality of pins are arranged at the front end of the needle plate, and a plurality of limiting holes and mounting holes are formed in the middle of the needle plate; the whole surface of the multi-contact high-current high-voltage test probe is subjected to gold plating treatment to form a gold-coated layer; the stitch comprises a needle bar and a needle point, wherein the front lower end of the needle point is a test contact area, and the test contact area is polished to form a planar structure.
2. A multi-contact high current high voltage test probe as defined in claim 1, wherein: the needle plate is a rectangular needle plate or a rectangular trapezoid needle plate.
3. A multi-contact high current high voltage test probe as defined in claim 1, wherein: the test probe adopts a tungsten or rhenium tungsten probe, and is subjected to overall gold plating treatment on the surface of the test probe.
4. A multi-contact high current high voltage test probe as defined in claim 1, wherein: the number of the pins is at most twelve pins.
5. A multi-contact high current high voltage test probe as defined in claim 1, wherein: the stitch width is less than 250 μm.
6. A multi-contact high current high voltage test probe according to any of claims 1-5, wherein: the surface particle size of the test contact area is less than 0.5 μm.
7. A multi-contact high current high voltage test probe as defined in claim 6, wherein: the test area has a length of less than 250 μm and a width of less than 150 μm.
8. A multi-contact high current high voltage test probe as defined in claim 6, wherein: the thickness of the test probe is less than 450 μm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210404903.0A CN114814314B (en) | 2022-04-18 | 2022-04-18 | Multi-contact high-current high-voltage test probe |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210404903.0A CN114814314B (en) | 2022-04-18 | 2022-04-18 | Multi-contact high-current high-voltage test probe |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN114814314A CN114814314A (en) | 2022-07-29 |
| CN114814314B true CN114814314B (en) | 2024-02-13 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210404903.0A Active CN114814314B (en) | 2022-04-18 | 2022-04-18 | Multi-contact high-current high-voltage test probe |
Country Status (1)
| Country | Link |
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| CN (1) | CN114814314B (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002040052A (en) * | 2000-07-19 | 2002-02-06 | Mitsubishi Materials Corp | Contact probe and manufacturing method thereof |
| JP2006337229A (en) * | 2005-06-03 | 2006-12-14 | Micronics Japan Co Ltd | Probe for burn-in test |
| CN103000546A (en) * | 2011-09-15 | 2013-03-27 | 台湾积体电路制造股份有限公司 | Test probe card |
| CN103674924A (en) * | 2012-09-13 | 2014-03-26 | 福州高意光学有限公司 | Raman spectrum test probe and manufacturing method thereof |
| CN106597035A (en) * | 2016-11-18 | 2017-04-26 | 武汉新芯集成电路制造有限公司 | Nanoprobe and nanoprobe tester |
| TW202009492A (en) * | 2018-08-09 | 2020-03-01 | 旺矽科技股份有限公司 | Probe head |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| ATE373830T1 (en) * | 1998-07-08 | 2007-10-15 | Capres Aps | MULTI-TIP SENSOR |
| JP2004085247A (en) * | 2002-08-23 | 2004-03-18 | Mitsubishi Electric Corp | Probe card |
| US9766269B2 (en) * | 2012-12-29 | 2017-09-19 | Power Probe TEK, LLC | Conductive test probe |
-
2022
- 2022-04-18 CN CN202210404903.0A patent/CN114814314B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002040052A (en) * | 2000-07-19 | 2002-02-06 | Mitsubishi Materials Corp | Contact probe and manufacturing method thereof |
| JP2006337229A (en) * | 2005-06-03 | 2006-12-14 | Micronics Japan Co Ltd | Probe for burn-in test |
| CN103000546A (en) * | 2011-09-15 | 2013-03-27 | 台湾积体电路制造股份有限公司 | Test probe card |
| CN103674924A (en) * | 2012-09-13 | 2014-03-26 | 福州高意光学有限公司 | Raman spectrum test probe and manufacturing method thereof |
| CN106597035A (en) * | 2016-11-18 | 2017-04-26 | 武汉新芯集成电路制造有限公司 | Nanoprobe and nanoprobe tester |
| TW202009492A (en) * | 2018-08-09 | 2020-03-01 | 旺矽科技股份有限公司 | Probe head |
Also Published As
| Publication number | Publication date |
|---|---|
| CN114814314A (en) | 2022-07-29 |
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