US20210055329A9 - Connector having contact members - Google Patents
Connector having contact members Download PDFInfo
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- US20210055329A9 US20210055329A9 US16/394,247 US201916394247A US2021055329A9 US 20210055329 A9 US20210055329 A9 US 20210055329A9 US 201916394247 A US201916394247 A US 201916394247A US 2021055329 A9 US2021055329 A9 US 2021055329A9
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- United States
- Prior art keywords
- assembly
- contact members
- contact
- electrical connector
- spacer
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/22—Contacts for co-operating by abutting
- H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
- H01R13/2435—Contacts for co-operating by abutting resilient; resiliently-mounted with opposite contact points, e.g. C beam
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
- G01R1/07378—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate adapter, e.g. space transformers
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06733—Geometry aspects
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07342—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
- H01R12/714—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit with contacts abutting directly the printed circuit; Button contacts therefore provided on the printed circuit
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/46—Bases; Cases
- H01R13/502—Bases; Cases composed of different pieces
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06716—Elastic
- G01R1/06727—Cantilever beams
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/18—Screening arrangements against electric or magnetic fields, e.g. against earth's field
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/66—Structural association with built-in electrical component
- H01R13/6608—Structural association with built-in electrical component with built-in single component
- H01R13/6625—Structural association with built-in electrical component with built-in single component with capacitive component
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R2201/00—Connectors or connections adapted for particular applications
- H01R2201/20—Connectors or connections adapted for particular applications for testing or measuring purposes
Definitions
- This invention relates generally to an electrical connector. More particularly, the present invention relates to an electrical connector having contact members configured as a modular unit.
- FIG. 1 shows a cross-sectional view of a conventional testing apparatus 9 .
- the testing apparatus 9 facilitates testing of a device under test (DUT) 900 .
- the DUT 900 can be any form of packaged integrated circuit (IC) derived from a wafer.
- the testing apparatus 9 includes a base 91 and a plurality of spring probes 92 . During testing, the plurality of spring probes 92 are electrically connected to the DUT 900 .
- the design of the testing apparatus 9 and locations of the plurality of spring probes 92 are determined based on the input and output locations of the DUT 900 .
- the type, size, and shape of DUT may vary which in turn requires various socket configurations to be considered. New test configurations result in specific testing apparatuses to be deployed to match DUT foot prints at the expense of additional manufacturing cost to the customer.
- the electrical connector of the present disclosure is its scalable nature.
- the electrical connector may be employed to test various electronic devices.
- An electrical connector comprises a bottom assembly, a first contact assembly, a first substrate assembly, a second contact assembly, a second substrate assembly, a third contact assembly, a top assembly and a plurality of conductive columns or vias.
- the bottom assembly, the first contact assembly, the first substrate assembly, the second contact assembly, the second substrate assembly, the third contact assembly, and the top assembly are arranged in the given order.
- Interspersed between the above-mentioned assemblies are a plurality of conductive columns or via structures that enable electrical connection throughout conductive layers or circuitry located in the bottom assembly, the first substrate assembly, the second substrate assembly, and the top assembly.
- the design and construction of such a connector (unit) provides a unique ability to manipulate electrical responses between the connector (unit) and the apparatus it is electrically connecting to.
- the bottom assembly comprises a bottom conductive layer and a bottom insulation layer.
- the first contact assembly comprises a first plurality of contact members
- the second contact assembly comprises a second plurality of contact members
- the third contact assembly comprises a third plurality of contact members.
- the first substrate assembly comprises a first substrate layer, a first conductive layer, and a first encapsulation layer.
- the second substrate assembly comprises a second encapsulation layer, a second conductive layer, and a second substrate layer.
- the top assembly comprises a top insulation layer and a top conductive layer.
- FIG. 1 is a cross-sectional view of a conventional testing apparatus.
- FIG. 2 is an exploded plot of an electrical connector in examples of the present disclosure.
- FIG. 3 is an assembled perspective view of the electrical connector of FIG. 2 .
- FIG. 4 is a top view of the electrical connector of FIG. 2 .
- FIG. 5 is a frontal view of one or more contact members in examples of the present disclosure.
- FIG. 6 is an end view of the electrical connector of FIG. 2 .
- FIG. 7 is a perspective view of an electrical connector showing contact members configured in a specific manner that connect to signal pads in examples of the present disclosure.
- FIG. 8 is a frontal view of deformed contact members in examples of the present disclosure.
- FIG. 9 is an exploded plot showing a device under test in examples of the present disclosure.
- FIG. 10 is an assembled frontal view of FIG. 9 showing an electrically connected apparatus in examples of the present disclosure.
- FIG. 11 is an end view of another electrical connector.
- FIG. 12 is an exploded plot of another electrical connector in examples of the present disclosure.
- FIG. 13 is an assembled perspective view of the electrical connector of FIG. 12 .
- FIG. 14 is a top view of the electrical connector of FIG. 12 .
- FIG. 15 is an end view of the electrical connector of FIG. 12 .
- FIG. 2 is an exploded plot
- FIG. 3 is an assembled perspective view
- FIG. 4 is a top view
- FIG. 6 is an end view of an electrical connector 200 in examples of the present disclosure.
- the electrical connector 200 includes a plurality of substrate assemblies 1 , a plurality of contact assemblies 2 comprising a plurality of bases 211 and a plurality of arms 212 , a plurality of spacers 22 , and a plurality of surface assemblies 3 .
- the electrical connector 200 comprises a bottom assembly 237 A, a first contact assembly 202 A, a first substrate assembly 201 A, a second contact assembly 202 B, a second substrate assembly 201 B, a third contact assembly 202 C, a top assembly 237 B and a plurality of conductive columns and vias 4 (for example, 241 A, 241 B, and 241 C).
- the bottom assembly 237 A extends along X-direction.
- the bottom assembly 237 A comprises a bottom conductive layer 32 and a bottom insulation layer 31 .
- the bottom conductive layer 32 has a constant thickness.
- the bottom insulation layer 31 has a constant thickness.
- the first contact assembly 202 A comprises a first plurality of contact members 21
- the second contact assembly 202 B comprises a second plurality of contact members 21
- the third contact assembly 202 C comprises a third plurality of contact members 21 .
- the first substrate assembly 201 A comprises a first substrate layer 11 , a first conductive layer 12 , and a first encapsulation layer 13 .
- the first substrate layer 11 has a constant thickness.
- the first conductive layer 12 has a constant thickness.
- the first encapsulation layer 13 has a constant thickness.
- a bottom surface of the first conductive layer 12 is directly attached to a top surface of the first substrate layer 11 .
- a bottom surface of the first encapsulation layer 13 is directly attached to a top surface of the first conductive layer 12 .
- the second substrate assembly 201 B comprises a second encapsulation layer 13 , a second conductive layer 12 , and a second substrate layer 11 .
- the second encapsulation layer 13 has a constant thickness.
- the second conductive layer 12 has a constant thickness.
- the second substrate layer 11 has a constant thickness.
- a bottom surface of the second conductive layer 12 is directly attached to a top surface of the second encapsulation layer 13 .
- a bottom surface of the second substrate layer 11 is directly attached to a top surface of the second conductive layer 12 .
- the top assembly 237 B extends along X-direction.
- the top assembly 237 B comprises a top insulation layer 31 and a top conductive layer 32 .
- the top insulation layer 31 has a constant thickness.
- the top conductive layer 32 has a constant thickness.
- the bottom assembly 237 A, the first contact assembly 202 A, the first substrate assembly 201 A, the second contact assembly 202 B, the second substrate assembly 201 B, the third contact assembly 202 C, and the top assembly 237 B are arranged in the given order in Y-direction.
- the plurality of conductive vias 4 comprising a plurality of separated vias 41 , penetrate and electrically connect to the bottom assembly 237 A, the first substrate assembly 201 A, the second substrate assembly 201 B, and the top assembly 237 B.
- the first contact assembly 202 A further comprises a first spacer assembly 223 A.
- the second contact assembly 202 B further comprises a second spacer assembly 223 B.
- the third contact assembly 202 C further comprises a third spacer assembly 223 C.
- each of the first spacer assembly 223 A, the second spacer assembly 223 B, and the third spacer assembly 223 C comprises a lower spacer 24 A, a center conductive disk 23 , and an upper spacer 24 B.
- a top surface of the lower spacer 24 A is directly attached to a bottom surface of the center conductive disk 23 .
- a bottom surface of the upper spacer 24 B is directly attached to a top surface of the center conductive disk 23 .
- the plurality of conductive vias 4 comprise a first conductive via 241 A, a center conductive via 241 B, and a second conductive via 241 C.
- the first conductive via 241 A, the center conductive via 241 B, and the second conductive via 241 C are arranged along the X-direction.
- the center conductive via 241 B passes through a center hole of the lower spacer 24 A, a center hole 231 of the center conductive disk 23 , and a center hole of the upper spacer 24 B.
- the center conductive disk 23 is of a circular disk shape.
- the center conductive via 241 B is of a cylinder shape.
- the electrical connector 200 is symmetric with respect to a centerline 292 of the electrical connector 200 .
- the centerline 292 is parallel to X-direction.
- the electrical connector is symmetric with respect to a symmetric line 294 of the electrical connector 200 .
- the symmetric line 294 is perpendicular to the centerline 292 .
- the symmetric line 294 passes through a centroid of the center conductive via 241 B.
- the first substrate assembly 201 A and the second substrate assembly 201 B are of rectangular prism shapes.
- FIG. 5 is a frontal view of a contact member 21 in examples of the present disclosure.
- the contact member 21 comprises a base portion 522 , a first arm 542 , a second arm 544 , a first spacer 22 A of FIG. 6 , and second spacer 22 B of FIG. 6 .
- the first arm 542 ; the base portion 522 ; and the second arm 544 form a letter V shape.
- a top surface of the first spacer 22 A is directly attached to a bottom surface of the base portion 522 .
- a bottom surface of the second spacer 22 B is directly attached to a top surface of the base portion 522 .
- the first arm 542 and the second arm 544 are under in-plane flexural deflection.
- the center conductive via 241 B of FIG. 2 is located at an opening side of each letter V shape of FIGS. 2 and 5 .
- a top surface of each first arm 542 of the first contact assembly 202 A and a top surface of each second arm 544 of the first contact assembly 202 A are co-planar.
- a top surface of each first arm 542 of the second contact assembly 202 B and a top surface of each second arm 544 of the second contact assembly 202 B are co-planar.
- a top surface of each first arm 542 of the third contact assembly 202 C and a top surface of each second arm 544 of the third contact assembly 202 C are co-planar.
- each first arm 542 and second arm 544 comprises a slender portion 590 and an end portion 592 .
- a length of the slender portion 590 is larger than a length of the end portion 592 .
- a width of the slender portion 590 is smaller than a width of the end portion 592 .
- a majority portion of the end portion 592 is of an arc shape.
- a bottom surface of the first spacer 22 A of FIG. 6 of each of the first contact assembly 202 A directly contacts a top surface of the bottom insulation layer of the bottom assembly 237 A.
- a top surface of the second spacer 22 B of FIG. 6 of each of the first contact assembly 202 A directly contacts a bottom surface of the first substrate layer of the first substrate assembly 201 A.
- a bottom surface of the first spacer of each of the second contact assembly 202 B directly contacts a top surface of the first encapsulation layer of the first substrate assembly 201 A.
- a top surface of the second spacer of each of the second contact assembly 202 B directly contacts the second encapsulation layer of the second substrate assembly 201 B.
- a bottom surface of the first spacer of each of the third contact assembly 202 C directly contacts a top surface of the second substrate layer of the second substrate assembly 201 B.
- a top surface of the second spacer of each of the third contact assembly 202 C directly contacts a bottom surface of the top insulation layer of the top assembly 237 B.
- FIG. 7 is a perspective view of an electrical connector 700 showing contact members configured in a specific manner that connect to signal pads in examples of the present disclosure.
- a first selected contact member 721 A (shown in dark color) of the second plurality of contact members is connected to a first signal pad.
- a second selected contact member 721 B (shown in dark color) of the second plurality of contact members is connected to a second signal pad.
- a third selected contact member 721 C (shown in dark color) of the second plurality of contact members is connected to a third signal pad.
- a fourth selected contact member 721 D (shown in dark color) of the second plurality of contact members is connected to a fourth signal pad. Remaining contact members of the second plurality of contact members, the first plurality of contact members and the third plurality of contact members 741 are connected to a ground pad.
- FIG. 8 is a frontal view of deformed contact members in examples of the present disclosure. In examples of the present disclosure, under deformation, each contact member still does not touch adjacent contact member.
- FIG. 9 is an exploded plot and FIG. 10 is a side view showing a device under test in examples of the present disclosure.
- the electrical connector 200 is enclosed in an electrically shielded housing 8 and is above an actuation module 7 .
- the electrically shielded housing 8 has top and bottom shielded surfaces 81 .
- the top and bottom shielded surfaces 81 comprise a plurality of slots 810 .
- the device 909 under test has a plurality of pads 991 .
- four pads with dark color are signal pads. Remaining pads are ground pads.
- FIG. 11 is an end view of an electrical connector 1100 .
- the electrical connector 1100 is similar to the electrical connector 200 except that the electrical connector 1100 includes additional components.
- the first substrate assembly further comprises a first additional encapsulation layer 13 P, a first additional conductive layer 12 P, and a capacitor 14 .
- the second substrate assembly further comprises a second additional conductive layer 12 Q, a second additional encapsulation layer 13 Q, and a capacitor.
- the first additional encapsulation layer 13 P has a constant thickness.
- the first additional conductive layer 12 P has a constant thickness.
- the second additional conductive layer 12 Q has a constant thickness.
- the second additional encapsulation layer 13 Q has a constant thickness.
- FIG. 12 is an exploded plot of another electrical connector in examples of the present disclosure.
- An electrical connector 1200 of FIG. 12 is a variant of the electrical connector 200 of FIG. 2 .
- FIG. 13 is an assembled perspective view of the electrical connector of FIG. 12 .
- FIG. 14 is a top view of the electrical connector of FIG. 12 .
- FIG. 15 is an end view of the electrical connector of FIG. 12 .
- the electrical connector 1200 includes a plurality of substrate assemblies 1 , a plurality of contact assemblies 2 comprising a plurality of bases 211 and a plurality of arms 212 , a plurality of spacers 22 , a plurality of surface assemblies 3 , and a plurality of conductive columns or vias 41 A and 41 B interspersed between assemblies of the connector unit 1200 .
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- General Engineering & Computer Science (AREA)
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Abstract
Description
- This patent application claims priority of TW107121644 filed on Jun. 25, 2018. This patent application is a Continuation-in-part application of U.S. patent application Ser. No. 16/246,529 filed on Jan. 13, 2019. The disclosure made in U.S. Pat. No. 7,989,945 to Williams et al., the disclosure made in the Patent Application TW107121644, and the disclosure made in the patent application Ser. No. 16/246,529 are hereby incorporated by reference.
- This invention relates generally to an electrical connector. More particularly, the present invention relates to an electrical connector having contact members configured as a modular unit.
-
FIG. 1 shows a cross-sectional view of aconventional testing apparatus 9. Thetesting apparatus 9 facilitates testing of a device under test (DUT) 900. TheDUT 900 can be any form of packaged integrated circuit (IC) derived from a wafer. Thetesting apparatus 9 includes abase 91 and a plurality ofspring probes 92. During testing, the plurality ofspring probes 92 are electrically connected to theDUT 900. The design of thetesting apparatus 9 and locations of the plurality ofspring probes 92 are determined based on the input and output locations of theDUT 900. The type, size, and shape of DUT may vary which in turn requires various socket configurations to be considered. New test configurations result in specific testing apparatuses to be deployed to match DUT foot prints at the expense of additional manufacturing cost to the customer. - Current testing methods require the plurality of
spring probes 92 that directly contact pads or solder balls of theDUT 900 to test electrical signals. Certain testing methods further require a predetermined force to move the plurality ofspring probes 92 so as to generate frictional motion relative to the contact pads of theDUT 900. Certain testing methods still further require a predetermined pressure applied to the contact interfaces between the plurality ofspring probes 92 and the pads of theDUT 900. - One advantage of the electrical connector of the present disclosure is its scalable nature. The electrical connector may be employed to test various electronic devices.
- An electrical connector (unit) comprises a bottom assembly, a first contact assembly, a first substrate assembly, a second contact assembly, a second substrate assembly, a third contact assembly, a top assembly and a plurality of conductive columns or vias. The bottom assembly, the first contact assembly, the first substrate assembly, the second contact assembly, the second substrate assembly, the third contact assembly, and the top assembly are arranged in the given order. Interspersed between the above-mentioned assemblies are a plurality of conductive columns or via structures that enable electrical connection throughout conductive layers or circuitry located in the bottom assembly, the first substrate assembly, the second substrate assembly, and the top assembly. The design and construction of such a connector (unit) provides a unique ability to manipulate electrical responses between the connector (unit) and the apparatus it is electrically connecting to.
- The bottom assembly comprises a bottom conductive layer and a bottom insulation layer. The first contact assembly comprises a first plurality of contact members, the second contact assembly comprises a second plurality of contact members, and the third contact assembly comprises a third plurality of contact members. The first substrate assembly comprises a first substrate layer, a first conductive layer, and a first encapsulation layer. The second substrate assembly comprises a second encapsulation layer, a second conductive layer, and a second substrate layer. The top assembly comprises a top insulation layer and a top conductive layer.
-
FIG. 1 is a cross-sectional view of a conventional testing apparatus. -
FIG. 2 is an exploded plot of an electrical connector in examples of the present disclosure. -
FIG. 3 is an assembled perspective view of the electrical connector ofFIG. 2 . -
FIG. 4 is a top view of the electrical connector ofFIG. 2 . -
FIG. 5 is a frontal view of one or more contact members in examples of the present disclosure. -
FIG. 6 is an end view of the electrical connector ofFIG. 2 . -
FIG. 7 is a perspective view of an electrical connector showing contact members configured in a specific manner that connect to signal pads in examples of the present disclosure. -
FIG. 8 is a frontal view of deformed contact members in examples of the present disclosure. -
FIG. 9 is an exploded plot showing a device under test in examples of the present disclosure. -
FIG. 10 is an assembled frontal view ofFIG. 9 showing an electrically connected apparatus in examples of the present disclosure. -
FIG. 11 is an end view of another electrical connector. -
FIG. 12 is an exploded plot of another electrical connector in examples of the present disclosure. -
FIG. 13 is an assembled perspective view of the electrical connector ofFIG. 12 . -
FIG. 14 is a top view of the electrical connector ofFIG. 12 . -
FIG. 15 is an end view of the electrical connector ofFIG. 12 . -
FIG. 2 is an exploded plot,FIG. 3 is an assembled perspective view,FIG. 4 is a top view andFIG. 6 is an end view of anelectrical connector 200 in examples of the present disclosure. Theelectrical connector 200 includes a plurality ofsubstrate assemblies 1, a plurality ofcontact assemblies 2 comprising a plurality ofbases 211 and a plurality ofarms 212, a plurality ofspacers 22, and a plurality ofsurface assemblies 3. - In examples of the present disclosure, the
electrical connector 200 comprises abottom assembly 237A, afirst contact assembly 202A, afirst substrate assembly 201A, asecond contact assembly 202B, asecond substrate assembly 201B, athird contact assembly 202C, atop assembly 237B and a plurality of conductive columns and vias 4 (for example, 241A, 241B, and 241C). - In examples of the present disclosure, the
bottom assembly 237A extends along X-direction. Thebottom assembly 237A comprises a bottomconductive layer 32 and abottom insulation layer 31. In one example, the bottomconductive layer 32 has a constant thickness. In one example, thebottom insulation layer 31 has a constant thickness. - In examples of the present disclosure, the
first contact assembly 202A comprises a first plurality ofcontact members 21, thesecond contact assembly 202B comprises a second plurality ofcontact members 21, and thethird contact assembly 202C comprises a third plurality ofcontact members 21. - In examples of the present disclosure, the
first substrate assembly 201A comprises afirst substrate layer 11, a firstconductive layer 12, and afirst encapsulation layer 13. In one example, thefirst substrate layer 11 has a constant thickness. The firstconductive layer 12 has a constant thickness. Thefirst encapsulation layer 13 has a constant thickness. In examples of the present disclosure, a bottom surface of the firstconductive layer 12 is directly attached to a top surface of thefirst substrate layer 11. A bottom surface of thefirst encapsulation layer 13 is directly attached to a top surface of the firstconductive layer 12. - In examples of the present disclosure, the
second substrate assembly 201B comprises asecond encapsulation layer 13, a secondconductive layer 12, and asecond substrate layer 11. In one example, thesecond encapsulation layer 13 has a constant thickness. The secondconductive layer 12 has a constant thickness. Thesecond substrate layer 11 has a constant thickness. In examples of the present disclosure, a bottom surface of the secondconductive layer 12 is directly attached to a top surface of thesecond encapsulation layer 13. A bottom surface of thesecond substrate layer 11 is directly attached to a top surface of the secondconductive layer 12. - In examples of the present disclosure, the
top assembly 237B extends along X-direction. Thetop assembly 237B comprises atop insulation layer 31 and a topconductive layer 32. In one example, thetop insulation layer 31 has a constant thickness. In one example, the topconductive layer 32 has a constant thickness. - In examples of the present disclosure, the
bottom assembly 237A, thefirst contact assembly 202A, thefirst substrate assembly 201A, thesecond contact assembly 202B, thesecond substrate assembly 201B, thethird contact assembly 202C, and thetop assembly 237B are arranged in the given order in Y-direction. - In examples of the present disclosure, the plurality of
conductive vias 4, comprising a plurality of separatedvias 41, penetrate and electrically connect to thebottom assembly 237A, thefirst substrate assembly 201A, thesecond substrate assembly 201B, and thetop assembly 237B. - In examples of the present disclosure, the
first contact assembly 202A further comprises afirst spacer assembly 223A. Thesecond contact assembly 202B further comprises asecond spacer assembly 223B. Thethird contact assembly 202C further comprises athird spacer assembly 223C. In examples of the present disclosure, each of thefirst spacer assembly 223A, thesecond spacer assembly 223B, and thethird spacer assembly 223C comprises alower spacer 24A, a centerconductive disk 23, and anupper spacer 24B. A top surface of thelower spacer 24A is directly attached to a bottom surface of the centerconductive disk 23. A bottom surface of theupper spacer 24B is directly attached to a top surface of the centerconductive disk 23. - In examples of the present disclosure, the plurality of
conductive vias 4 comprise a first conductive via 241A, a center conductive via 241B, and a second conductive via 241C. The first conductive via 241A, the center conductive via 241B, and the second conductive via 241C are arranged along the X-direction. The center conductive via 241B passes through a center hole of the lower spacer 24A, acenter hole 231 of the centerconductive disk 23, and a center hole of theupper spacer 24B. - In examples of the present disclosure, the center
conductive disk 23 is of a circular disk shape. The center conductive via 241B is of a cylinder shape. - In examples of the present disclosure, the
electrical connector 200 is symmetric with respect to acenterline 292 of theelectrical connector 200. Thecenterline 292 is parallel to X-direction. The electrical connector is symmetric with respect to asymmetric line 294 of theelectrical connector 200. Thesymmetric line 294 is perpendicular to thecenterline 292. Thesymmetric line 294 passes through a centroid of the center conductive via 241B. - In examples of the present disclosure, the
first substrate assembly 201A and thesecond substrate assembly 201B are of rectangular prism shapes. -
FIG. 5 is a frontal view of acontact member 21 in examples of the present disclosure. In examples of the present disclosure, thecontact member 21 comprises abase portion 522, afirst arm 542, asecond arm 544, afirst spacer 22A ofFIG. 6 , andsecond spacer 22B ofFIG. 6 . Thefirst arm 542; thebase portion 522; and thesecond arm 544 form a letter V shape. A top surface of thefirst spacer 22A is directly attached to a bottom surface of thebase portion 522. A bottom surface of thesecond spacer 22B is directly attached to a top surface of thebase portion 522. - In examples of the present disclosure, the
first arm 542 and thesecond arm 544 are under in-plane flexural deflection. - In examples of the present disclosure, the center conductive via 241B of
FIG. 2 is located at an opening side of each letter V shape ofFIGS. 2 and 5 . - In examples of the present disclosure, a top surface of each
first arm 542 of thefirst contact assembly 202A and a top surface of eachsecond arm 544 of thefirst contact assembly 202A are co-planar. A top surface of eachfirst arm 542 of thesecond contact assembly 202B and a top surface of eachsecond arm 544 of thesecond contact assembly 202B are co-planar. A top surface of eachfirst arm 542 of thethird contact assembly 202C and a top surface of eachsecond arm 544 of thethird contact assembly 202C are co-planar. - In examples of the present disclosure, each
first arm 542 andsecond arm 544 comprises aslender portion 590 and anend portion 592. A length of theslender portion 590 is larger than a length of theend portion 592. A width of theslender portion 590 is smaller than a width of theend portion 592. In examples of the present disclosure, a majority portion of theend portion 592 is of an arc shape. - From
FIGS. 2-6 , a bottom surface of thefirst spacer 22A ofFIG. 6 of each of thefirst contact assembly 202A directly contacts a top surface of the bottom insulation layer of thebottom assembly 237A. A top surface of thesecond spacer 22B ofFIG. 6 of each of thefirst contact assembly 202A directly contacts a bottom surface of the first substrate layer of thefirst substrate assembly 201A. A bottom surface of the first spacer of each of thesecond contact assembly 202B directly contacts a top surface of the first encapsulation layer of thefirst substrate assembly 201A. A top surface of the second spacer of each of thesecond contact assembly 202B directly contacts the second encapsulation layer of thesecond substrate assembly 201B. A bottom surface of the first spacer of each of thethird contact assembly 202C directly contacts a top surface of the second substrate layer of thesecond substrate assembly 201B. A top surface of the second spacer of each of thethird contact assembly 202C directly contacts a bottom surface of the top insulation layer of thetop assembly 237B. -
FIG. 7 is a perspective view of anelectrical connector 700 showing contact members configured in a specific manner that connect to signal pads in examples of the present disclosure. A first selectedcontact member 721A (shown in dark color) of the second plurality of contact members is connected to a first signal pad. A second selectedcontact member 721B (shown in dark color) of the second plurality of contact members is connected to a second signal pad. A third selectedcontact member 721C (shown in dark color) of the second plurality of contact members is connected to a third signal pad. A fourth selected contact member 721D (shown in dark color) of the second plurality of contact members is connected to a fourth signal pad. Remaining contact members of the second plurality of contact members, the first plurality of contact members and the third plurality ofcontact members 741 are connected to a ground pad. -
FIG. 8 is a frontal view of deformed contact members in examples of the present disclosure. In examples of the present disclosure, under deformation, each contact member still does not touch adjacent contact member. -
FIG. 9 is an exploded plot andFIG. 10 is a side view showing a device under test in examples of the present disclosure. In examples of the present disclosure, theelectrical connector 200 is enclosed in an electrically shieldedhousing 8 and is above anactuation module 7. The electrically shieldedhousing 8 has top and bottom shielded surfaces 81. The top and bottom shieldedsurfaces 81 comprise a plurality ofslots 810. Thedevice 909 under test has a plurality ofpads 991. In examples of the present disclosure, four pads with dark color are signal pads. Remaining pads are ground pads. -
FIG. 11 is an end view of anelectrical connector 1100. Theelectrical connector 1100 is similar to theelectrical connector 200 except that theelectrical connector 1100 includes additional components. The first substrate assembly further comprises a firstadditional encapsulation layer 13P, a first additional conductive layer 12P, and acapacitor 14. The second substrate assembly further comprises a second additionalconductive layer 12Q, a second additional encapsulation layer 13Q, and a capacitor. In examples of the present disclosure, the firstadditional encapsulation layer 13P has a constant thickness. The first additional conductive layer 12P has a constant thickness. The second additionalconductive layer 12Q has a constant thickness. The second additional encapsulation layer 13Q has a constant thickness. -
FIG. 12 is an exploded plot of another electrical connector in examples of the present disclosure. Anelectrical connector 1200 ofFIG. 12 is a variant of theelectrical connector 200 ofFIG. 2 .FIG. 13 is an assembled perspective view of the electrical connector ofFIG. 12 .FIG. 14 is a top view of the electrical connector ofFIG. 12 .FIG. 15 is an end view of the electrical connector ofFIG. 12 . Theelectrical connector 1200 includes a plurality ofsubstrate assemblies 1, a plurality ofcontact assemblies 2 comprising a plurality ofbases 211 and a plurality ofarms 212, a plurality ofspacers 22, a plurality ofsurface assemblies 3, and a plurality of conductive columns orvias connector unit 1200. - Those of ordinary skill in the art may recognize that modifications of the embodiments disclosed herein are possible. For example, a total number of contact members in an electrical connector and the approach in which they are electrically configured may vary. Other modifications may occur to those of ordinary skill in this art, and all such modifications are deemed to fall within the purview of the present invention, as defined by the claims.
Claims (13)
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US16/394,247 US11067603B2 (en) | 2018-04-30 | 2019-04-25 | Connector having contact members |
US16/513,188 US10985480B2 (en) | 2018-04-30 | 2019-07-16 | Transformation connector |
US17/179,405 US11522306B2 (en) | 2018-04-30 | 2021-02-19 | Transformation connector |
US18/055,577 US11996642B2 (en) | 2018-04-30 | 2022-11-15 | Transformation connector |
Applications Claiming Priority (8)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW107114634A TWI672871B (en) | 2018-04-30 | 2018-04-30 | Electrical connector and electrical test device |
TW107114634 | 2018-04-30 | ||
CN201810474999.1 | 2018-05-17 | ||
CN201810474999.1A CN110504571B (en) | 2018-05-17 | 2018-05-17 | Electrical connector and electrical property testing device |
TW107121644A TWI668451B (en) | 2018-06-25 | 2018-06-25 | Conduction device |
TW107121644 | 2018-06-25 | ||
US16/246,529 US11047878B2 (en) | 2018-04-30 | 2019-01-13 | Electrical connector |
US16/394,247 US11067603B2 (en) | 2018-04-30 | 2019-04-25 | Connector having contact members |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
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US16/246,529 Continuation-In-Part US11047878B2 (en) | 2018-04-30 | 2019-01-13 | Electrical connector |
Related Child Applications (2)
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US16/246,529 Continuation-In-Part US11047878B2 (en) | 2018-04-30 | 2019-01-13 | Electrical connector |
US16/513,188 Continuation-In-Part US10985480B2 (en) | 2018-04-30 | 2019-07-16 | Transformation connector |
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US20190391180A1 US20190391180A1 (en) | 2019-12-26 |
US20210055329A9 true US20210055329A9 (en) | 2021-02-25 |
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US16/394,247 Active 2039-06-30 US11067603B2 (en) | 2018-04-30 | 2019-04-25 | Connector having contact members |
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US10985480B2 (en) | 2018-04-30 | 2021-04-20 | GITech Inc. | Transformation connector |
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US5415559A (en) * | 1992-05-18 | 1995-05-16 | Japan Aviation Electronics Industry, Ltd. | Electrical connector having a plurality of contact pin springs |
US5259781A (en) * | 1992-11-18 | 1993-11-09 | International Business Machines Corporation | Electrical connector alignment and actuation assembly |
US5358411A (en) * | 1993-08-09 | 1994-10-25 | The Whitaker Corporation | Duplex plated epsilon compliant beam contact and interposer |
US20020053734A1 (en) * | 1993-11-16 | 2002-05-09 | Formfactor, Inc. | Probe card assembly and kit, and methods of making same |
JPH07254469A (en) | 1994-03-16 | 1995-10-03 | Texas Instr Japan Ltd | Socket |
US6046597A (en) | 1995-10-04 | 2000-04-04 | Oz Technologies, Inc. | Test socket for an IC device |
US6242932B1 (en) | 1999-02-19 | 2001-06-05 | Micron Technology, Inc. | Interposer for semiconductor components having contact balls |
JP3942823B2 (en) * | 2000-12-28 | 2007-07-11 | 山一電機株式会社 | Inspection device |
FR2831018B1 (en) * | 2001-10-17 | 2003-12-19 | Bull Sa | DEVICE FOR MAINTAINING AT LEAST TWO ELECTRONIC COMPONENTS POSITIONED OPPOSITE ON EITHER SIDE OF A CONNECTION BOARD |
US7244125B2 (en) | 2003-12-08 | 2007-07-17 | Neoconix, Inc. | Connector for making electrical contact at semiconductor scales |
US7113408B2 (en) | 2003-06-11 | 2006-09-26 | Neoconix, Inc. | Contact grid array formed on a printed circuit board |
US6945788B2 (en) | 2003-07-31 | 2005-09-20 | Tyco Electronics Corporation | Metal contact LGA socket |
US7445465B2 (en) | 2005-07-08 | 2008-11-04 | Johnstech International Corporation | Test socket |
CN2927364Y (en) | 2006-05-15 | 2007-07-25 | 番禺得意精密电子工业有限公司 | Electric connector |
TWM342638U (en) | 2008-03-10 | 2008-10-11 | Hon Hai Prec Ind Co Ltd | Electrical connector |
CN201438572U (en) | 2009-01-05 | 2010-04-14 | 富士康(昆山)电脑接插件有限公司 | electrical connector |
TW201112505A (en) | 2009-09-22 | 2011-04-01 | Quan Geo Entpr Co Ltd | Conducting wire type electrical connector |
TWM377746U (en) | 2009-09-30 | 2010-04-01 | Hon Hai Prec Ind Co Ltd | Electrical connector |
US8622764B2 (en) | 2011-02-09 | 2014-01-07 | Intel Corporation | Integrated translational land-grid array sockets and loading mechanisms for semiconductive devices |
CN203871520U (en) | 2014-01-26 | 2014-10-08 | 番禺得意精密电子工业有限公司 | Electric connector |
JP6821522B2 (en) | 2017-06-27 | 2021-01-27 | モレックス エルエルシー | socket |
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2019
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US20190391180A1 (en) | 2019-12-26 |
US11067603B2 (en) | 2021-07-20 |
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