US20200343654A1 - Conductive terminal and electrical connecting structure - Google Patents
Conductive terminal and electrical connecting structure Download PDFInfo
- Publication number
- US20200343654A1 US20200343654A1 US16/532,460 US201916532460A US2020343654A1 US 20200343654 A1 US20200343654 A1 US 20200343654A1 US 201916532460 A US201916532460 A US 201916532460A US 2020343654 A1 US2020343654 A1 US 2020343654A1
- Authority
- US
- United States
- Prior art keywords
- welding
- positioning
- outer diameter
- trench
- extending segment
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000003466 welding Methods 0.000 claims abstract description 99
- 229910000679 solder Inorganic materials 0.000 claims description 20
- 230000003247 decreasing effect Effects 0.000 claims description 7
- 238000010586 diagram Methods 0.000 description 10
- 238000000034 method Methods 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 4
- 230000008054 signal transmission Effects 0.000 description 4
- 230000008901 benefit Effects 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
- H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
- H01R12/58—Fixed connections for rigid printed circuits or like structures characterised by the terminals terminals for insertion into holes
- H01R12/585—Terminals having a press fit or a compliant portion and a shank passing through a hole in the printed circuit board
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
- H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
- H01R12/58—Fixed connections for rigid printed circuits or like structures characterised by the terminals terminals for insertion into holes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/02—Soldered or welded connections
- H01R4/029—Welded connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/184—Components including terminals inserted in holes through the printed circuit board and connected to printed contacts on the walls of the holes or at the edges thereof or protruding over or into the holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
- H05K3/3426—Leaded components characterised by the leads
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R2201/00—Connectors or connections adapted for particular applications
- H01R2201/12—Connectors or connections adapted for particular applications for medicine and surgery
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/10—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation effected solely by twisting, wrapping, bending, crimping, or other permanent deformation
- H01R4/18—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation effected solely by twisting, wrapping, bending, crimping, or other permanent deformation by crimping
- H01R4/183—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation effected solely by twisting, wrapping, bending, crimping, or other permanent deformation by crimping for cylindrical elongated bodies, e.g. cables having circular cross-section
- H01R4/184—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation effected solely by twisting, wrapping, bending, crimping, or other permanent deformation by crimping for cylindrical elongated bodies, e.g. cables having circular cross-section comprising a U-shaped wire-receiving portion
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10295—Metallic connector elements partly mounted in a hole of the PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10356—Cables
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Definitions
- the disclosure relates to a terminal and a connecting structure, and particularly relates to a conductive terminal and an electrical connecting structure.
- a common electrical connecting structure includes a circuit board and a conductive terminal welded to the circuit board.
- the circuit board has a through hole, and the conductive terminal is plugged in and passes through the through hole.
- the conductive terminal includes a cardioid holding portion configured to clamp an internal wire, and the cardioid holding portion is plugged in and passes through the through hole.
- the conductive terminal should be plugged in and pass through the through hole of the circuit board firstly, and let the cardioid holding portion be positioned in the through hole approximately. Then, coating solder to the through hole. Afterwards, the solder is heated, such that the conductive terminal is bonded to the circuit board through the solder.
- holes e.g., pin holes
- the pin holes formed it leads to insufficient bonding strength between the conductive terminal and the circuit board, such that the conductive terminal is easily detached from the through hole.
- the pin holes formed it leads to significantly decrease on stability of current or signal transmission between the conductive terminal and the circuit board.
- filling solders into the pin holes is the mostly seen repair, but it would increase time cost and lower efficiency.
- the disclosure provides a conductive terminal, which enhance yield rate and efficiency of the manufacturing process.
- the disclosure provides an electrical connecting structure has good reliability.
- a conductive terminal of an embodiment of the disclosure which includes a holding portion, a positioning portion, and a welding portion.
- the positioning portion is connected to a holding portion.
- the positioning portion includes two positioning branches separated by a first trench.
- the welding portion is connected to the positioning portion, and the positioning portion is located between the holding portion and the welding portion.
- the welding portion includes two welding branches separated by a second trench.
- the first trench is communicated with the second trench and each of the welding branches is connected to one of the positioning branches.
- the positioning portion has a first outer diameter, and a second outer diameter on at least part of the welding portion is greater than the first outer diameter.
- An electrical connecting structure of an embodiment of the disclosure which includes a circuit board and a conductive terminal.
- the circuit board has a through hole.
- the conductive terminal includes a holding portion, a positioning portion, and a welding portion.
- the holding portion clamps an internal wire.
- the positioning portion is connected to the holding portion, and plugged in the through hole.
- the positioning portion includes two positioning branches separated by the first trench.
- the welding portion is connected to the positioning portion, and the positioning portion is located between the holding portion and the welding portion.
- the welding portion and the holding portion are located outside of the through hole, and are located at two opposite sides of the circuit board respectively.
- the welding portion includes two welding branches separated by the second trench.
- the first trench is communicated with the second trench and each of the welding branches is connected to one of the positioning branches.
- the positioning portion has a first outer diameter, and a second outer diameter on at least part of the welding portion is greater than the first outer diameter.
- the conductive terminal of the disclosure is configured with a trench.
- the trench may be configured as a flow path of solder and let the solder be more completely coated and filled.
- holes e.g., pin holes
- the stability of current or signal transmission between the conductive terminal and the circuit board is also enhanced, such that the electrical connecting structure of the disclosure has good reliability.
- FIG. 1A is a schematic diagram illustrating an electrical connecting structure of an embodiment of the disclosure.
- FIG. 1B is a schematic diagram illustrating the electrical connecting structure of FIG. 1A in another perspective.
- FIG. 2 is a schematic exploded diagram illustrating the electrical connecting structure of FIG. 1A .
- FIG. 3A and FIG. 3B are schematic diagrams illustrating the electrical connecting structure of FIG. 1A along two different cross-sections.
- FIG. 4 is a schematic diagram illustrating the electrical connecting structure of FIG. 3A after welding.
- FIG. 1A is a schematic diagram illustrating an electrical connecting structure of an embodiment of the disclosure.
- FIG. 1B is a schematic diagram illustrating the electrical connecting structure of FIG. 1A in another perspective.
- FIG. 2 is a schematic exploded diagram illustrating the electrical connecting structure of FIG. 1A .
- an electrical connecting structure 100 may be applied to any kind of electronic devices, such as a laptop, a desktop, a server, or a power supply, etc., to transmit current or signal.
- the electrical connecting structure 100 may include a circuit board 110 and a conductive terminal 120 .
- the circuit board 110 may be a rigid circuit board, a flexible circuit board, or a rigid-flex circuit board, and has a through hole 111 which is configured to mount the conductive terminal 120 .
- the conductive terminal 120 may be an integrally formed structure, and manufactured by a metal or an alloy having good conductivity.
- the conductive terminal 120 includes a holding portion 121 , a positioning portion 122 , and a welding portion 123 .
- the holding portion 121 is configured to clamp an internal wire 10
- the holding portion 121 may be a cardioid holding portion.
- the positioning portion 122 is connected to the holding portion 121 , and is extended from one side of the holding portion 121 .
- the welding portion 123 is connected to the positioning portion 122 .
- the welding portion 123 is extended from one side of the positioning portion 122 , and the positioning portion 122 is located between the holding portion 121 and the welding portion 123 .
- FIG. 3A and FIG. 3B are schematic diagrams illustrating the electrical connecting structure of FIG. 1A along two different cross-sections.
- FIG. 4 is a schematic diagram illustrating the electrical connecting structure of FIG. 3A after welding. Please refer to FIG. 1A , FIG. 1B , and FIG. 3A , after the conductive terminal 120 is mounted to the through hole 111 , the positioning portion 122 is plugged in the through hole 111 , and the welding portion 123 and the holding portion 121 are located outside of the through hole 111 , and the welding portion 123 and the holding portion 121 are located at two opposite sides of the circuit board 110 respectively.
- the positioning portion 122 has a first outer diameter D 1 .
- the first outer diameter D 1 is slightly smaller than an inner diameter I 1 of the through hole 111
- at least part of the second outer diameter D 2 of the welding portion 123 is greater than the first outer diameter D 1 and the inner diameter I 1 .
- the welding portion 123 passes through the circuit board 110 and the positioning portion 122 is plugged in the through hole 111 , the welding portion 123 that is located outside of the through hole 111 and moved toward the circuit board 110 would be structurally interfered with the circuit board 110 , such that the conductive terminal 120 would not be easily detached from the through hole 111 .
- the conductive terminal 120 is configured with a trench 124 .
- the trench 124 penetrates from a terminal end of the welding portion 123 to the positioning portion 122 , and stops before the holding portion 121 .
- the trench 124 may be generally divided into a first trench 124 a and a second trench 124 b communicated with each other.
- the positioning portion 122 is divided by the first trench 124 a into two positioning branches 122 a separated from each other, and the welding portion 123 is divided by the second trench 124 b into two welding branches 123 a separated from each other.
- the two positioning branches 122 a and the two welding branches 123 a are in a one-to-one configuration. That is, each of the welding branches 123 a is connected to one of the positioning branches 122 a.
- the trench 124 may be configured as a flow path of a solder 20 and let the solder 20 be more completely coated and filled.
- holes e.g., pin holes
- the stability of current or signal transmission between the conductive terminal 120 and the circuit board 110 is also enhanced, such that the electrical connecting structure of the disclosure has good reliability.
- the solder 20 completely encapsulates the welding portion 123 and the positioning portion 122 .
- the solder 20 is not only filled into the through hole 111 and filled up the trench 124 , but filled into the holding portion 121 to encapsulate the internal wire 10 . Therefore, the joint area and the bonding strength of the conductive terminal 120 and the solder 20 may be greatly enhanced.
- the welding portion 123 includes a first extending segment 1231 connected to the positioning portion 122 and a second extending segment 1232 connected to the first extending segment 1231 .
- the conductive terminal 120 is a hollow structure.
- the conductive terminal 120 has a central axis AX, and the first extending segment 1231 and the second extending segment 1232 are tilted to the AX.
- a second outer diameter D 21 of the welding portion 123 on the first extending segment 1231 is gradually increased from the positioning portion 122 toward the inflection 1233 .
- a second outer diameter D 22 of the welding portion 123 on the inflection 1233 is greater than the second outer diameter D 21 .
- the second outer diameter D 22 and the second outer diameter D 21 may be severed as a part of the second outer diameter D 2 , and is greater than the inner diameter I 1 of the through hole 111 and the first outer diameter D 1 of the positioning portion 122 .
- the greatest outer diameter of the welding portion 123 substantially falls on the inflection 1233 , and a second outer diameter D 23 of the welding portion 123 on the second extending segment 1232 is gradually decreased from the inflection 1233 toward a direction away from the first extending segment 1231 .
- the outer diameter of the welding portion 123 of the conductive terminal 120 is gradually increased from a terminal end 1232 a of the second extending segment 1232 to the inflection 1233 , and is gradually decreased from the inflection 1233 to the positioning portion 122 .
- the outer diameter design facilitates the process of plugging the conductive terminal 120 to the circuit board 110 .
- the second extending segment 1232 of the welding portion 123 is a forward guiding structure.
- the second outer diameter D 23 on the terminal end 1232 a of the second extending segment 1232 is smaller than or equal to the first outer diameter D 1 of the positioning portion 122
- the second outer diameter D 23 on the terminal end 1232 a of the second extending segment 1232 is smaller than the inner diameter I 1 of the through hole 111 .
- the welding portion 123 Based on the outer diameter of the welding portion 123 is gradually increased from the terminal end 1232 a of the second extending segment 1232 to the inflection 1233 , and the welding portion 123 is elastically deformed because of the trench 124 as the depth of the welding portion 123 plugged into the through hole 111 increased, the welding portion 123 can thus successfully pass through the through hole 111 . After the welding portion 123 passes through the through hole 111 , the welding portion 123 elastically returns to the state without enduring force and deforming, and the positioning portion 122 is thus plugged in the through hole 111 .
- each of the positioning branches 122 a of the positioning portion 122 has an outer wall surface 122 b facing an inner wall surface 111 a of the through hole 111 , and the ratio of the arc length of the outer wall surface 122 b of each of the positioning branches 122 a to the circumference of the inner wall surface 111 a of the through hole 111 is greater than or equal to 40%.
- the two positioning branches 122 a push against the inner wall 111 a of the through hole 111 and drive the positioning portion 122 to reset, such that the positioning portion 122 substantially remains in the center of the through hole 111 .
- the conductive terminal 120 further includes a position-limiting protrusion 125 .
- the position-limiting protrusion 125 is located between the positioning portion 122 and the holding portion 121 .
- the number of the position-limiting protrusions 125 may be two or increase/decrease based on design needs. After the positioning portion 122 plugged into the through hole 111 , the position-limiting protrusion 125 can achieve a stopping effect and thus prevent the holding portion 121 from being plugged into the through hole 111 . At this time, the position-limiting protrusion 125 is located outsides of the through hole 111 .
- the welding portion 123 and the position-limiting protrusion 125 are located at two opposite sides of the circuit board 110 .
- the number of the positioning branches 122 a of the positioning portion 122 is the same as the number of the welding branches 123 a of the welding portion 123 .
- the number of the positioning branches 122 a and the number of the welding branches 123 a of the welding portion 123 are at least two.
- the positioning branches 122 a and the welding portions 123 are in symmetric arrangement, isometric arrangement, or ring arrangement according to the central axis AX of the conductive terminal 120 that is served as a basis.
- the conductive terminal of the disclosure is configured with a trench.
- the trench may be configured as a flow path of solder and let the solder be more completely coated and filled.
- holes e.g., pin holes
- the stability of current or signal transmission between the conductive terminal and the circuit board is also enhanced, such that the electrical connecting structure of the disclosure has good reliability.
- the outer diameter of the welding portion of the conductive terminal of the disclosure is gradually increased from terminal end thereof to the inflection, and is gradually decreased from the inflection to the positioning portion, the outer diameter design facilitates the process of plugging the conductive terminal to the circuit board. Furthermore, since at least part of the second outer diameter of the welding portion is greater than the inner diameter of the through hole, when the welding portion passes through the circuit board and the positioning portion is plugged in the through hole, the welding portion that is located outside of the through hole and moved toward the circuit board would be structurally interfered with the circuit board, such that the conductive terminal would not be easily detached from the through hole.
- the ratio of the arc length of the outer wall surface of each of the positioning branches to the circumference of the inner wall surface of the through hole is greater than or equal to 40%. Accordingly, if the positioning portion is shifted in the through hole, the two positioning branches push against the inner wall of the through hole and drive the positioning portion to reset, such that the positioning portion substantially remains in the center of the through hole.
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
Abstract
Description
- This application claims the priority benefit of Chinese patent application serial no. 201910352871.2, filed on Apr. 29, 2019. The entirety of the above-mentioned patent application is hereby incorporated by reference herein and made a part of this specification.
- The disclosure relates to a terminal and a connecting structure, and particularly relates to a conductive terminal and an electrical connecting structure.
- A common electrical connecting structure includes a circuit board and a conductive terminal welded to the circuit board. The circuit board has a through hole, and the conductive terminal is plugged in and passes through the through hole. Furthermore, the conductive terminal includes a cardioid holding portion configured to clamp an internal wire, and the cardioid holding portion is plugged in and passes through the through hole. During the process of welding the conductive terminal to the circuit board, the conductive terminal should be plugged in and pass through the through hole of the circuit board firstly, and let the cardioid holding portion be positioned in the through hole approximately. Then, coating solder to the through hole. Afterwards, the solder is heated, such that the conductive terminal is bonded to the circuit board through the solder.
- However, since there is an excessive gap between the cardioid holding portion and an inner wall of the through hole, holes (e.g., pin holes) are easily formed on the cured solder, which seriously affect reliability of the electrical connecting structure. For example, with the pin holes formed, it leads to insufficient bonding strength between the conductive terminal and the circuit board, such that the conductive terminal is easily detached from the through hole. Or, with the pin holes formed, it leads to significantly decrease on stability of current or signal transmission between the conductive terminal and the circuit board. Currently, filling solders into the pin holes is the mostly seen repair, but it would increase time cost and lower efficiency.
- The disclosure provides a conductive terminal, which enhance yield rate and efficiency of the manufacturing process.
- The disclosure provides an electrical connecting structure has good reliability.
- A conductive terminal of an embodiment of the disclosure, which includes a holding portion, a positioning portion, and a welding portion. The positioning portion is connected to a holding portion. The positioning portion includes two positioning branches separated by a first trench. The welding portion is connected to the positioning portion, and the positioning portion is located between the holding portion and the welding portion. The welding portion includes two welding branches separated by a second trench. The first trench is communicated with the second trench and each of the welding branches is connected to one of the positioning branches. The positioning portion has a first outer diameter, and a second outer diameter on at least part of the welding portion is greater than the first outer diameter.
- An electrical connecting structure of an embodiment of the disclosure, which includes a circuit board and a conductive terminal. The circuit board has a through hole. The conductive terminal includes a holding portion, a positioning portion, and a welding portion. The holding portion clamps an internal wire. The positioning portion is connected to the holding portion, and plugged in the through hole. The positioning portion includes two positioning branches separated by the first trench. The welding portion is connected to the positioning portion, and the positioning portion is located between the holding portion and the welding portion. The welding portion and the holding portion are located outside of the through hole, and are located at two opposite sides of the circuit board respectively. The welding portion includes two welding branches separated by the second trench. The first trench is communicated with the second trench and each of the welding branches is connected to one of the positioning branches. The positioning portion has a first outer diameter, and a second outer diameter on at least part of the welding portion is greater than the first outer diameter.
- Based on the above, the conductive terminal of the disclosure is configured with a trench. During the process of mounting and welding the conductive terminal to the circuit board, the trench may be configured as a flow path of solder and let the solder be more completely coated and filled. As such, holes (e.g., pin holes) formed on the cured solder can be avoided, which enhance yield rate and efficiency of the manufacturing process. In this way, not only is the bonding strength between the conductive terminal and the circuit board enhanced, the stability of current or signal transmission between the conductive terminal and the circuit board is also enhanced, such that the electrical connecting structure of the disclosure has good reliability.
- To provide a further understanding of the aforementioned and other features and advantages of the disclosure, exemplary embodiments, together with the reference drawings, are described in detail below.
- The accompanying drawings are included to provide a further understanding of the disclosure, and are incorporated in and constitute a part of this specification. The drawings illustrate exemplary embodiments of the disclosure and, together with the description, serve to explain the principles of the disclosure.
-
FIG. 1A is a schematic diagram illustrating an electrical connecting structure of an embodiment of the disclosure. -
FIG. 1B is a schematic diagram illustrating the electrical connecting structure ofFIG. 1A in another perspective. -
FIG. 2 is a schematic exploded diagram illustrating the electrical connecting structure ofFIG. 1A . -
FIG. 3A andFIG. 3B are schematic diagrams illustrating the electrical connecting structure ofFIG. 1A along two different cross-sections. -
FIG. 4 is a schematic diagram illustrating the electrical connecting structure ofFIG. 3A after welding. -
FIG. 1A is a schematic diagram illustrating an electrical connecting structure of an embodiment of the disclosure.FIG. 1B is a schematic diagram illustrating the electrical connecting structure ofFIG. 1A in another perspective.FIG. 2 is a schematic exploded diagram illustrating the electrical connecting structure ofFIG. 1A . Please refer toFIG. 1A ,FIG. 1B , andFIG. 2 , in this embodiment, an electrical connectingstructure 100 may be applied to any kind of electronic devices, such as a laptop, a desktop, a server, or a power supply, etc., to transmit current or signal. The electrical connectingstructure 100 may include acircuit board 110 and aconductive terminal 120. Thecircuit board 110 may be a rigid circuit board, a flexible circuit board, or a rigid-flex circuit board, and has a throughhole 111 which is configured to mount theconductive terminal 120. - The
conductive terminal 120 may be an integrally formed structure, and manufactured by a metal or an alloy having good conductivity. Specifically, theconductive terminal 120 includes a holdingportion 121, apositioning portion 122, and awelding portion 123. The holdingportion 121 is configured to clamp aninternal wire 10, and the holdingportion 121 may be a cardioid holding portion. On the other hand, thepositioning portion 122 is connected to the holdingportion 121, and is extended from one side of the holdingportion 121. Thewelding portion 123 is connected to thepositioning portion 122. Thewelding portion 123 is extended from one side of thepositioning portion 122, and thepositioning portion 122 is located between the holdingportion 121 and thewelding portion 123. -
FIG. 3A andFIG. 3B are schematic diagrams illustrating the electrical connecting structure ofFIG. 1A along two different cross-sections.FIG. 4 is a schematic diagram illustrating the electrical connecting structure ofFIG. 3A after welding. Please refer toFIG. 1A ,FIG. 1B , andFIG. 3A , after theconductive terminal 120 is mounted to the throughhole 111, thepositioning portion 122 is plugged in the throughhole 111, and thewelding portion 123 and the holdingportion 121 are located outside of the throughhole 111, and thewelding portion 123 and the holdingportion 121 are located at two opposite sides of thecircuit board 110 respectively. On the other hand, theinternal wire 10 is clamped to the holdingportion 121, and theinternal wire 10 is thus located outside of the throughhole 111. Furthermore, thepositioning portion 122 has a first outer diameter D1. The first outer diameter D1 is slightly smaller than an inner diameter I1 of the throughhole 111, and at least part of the second outer diameter D2 of thewelding portion 123 is greater than the first outer diameter D1 and the inner diameter I1. Hence, when thewelding portion 123 passes through thecircuit board 110 and thepositioning portion 122 is plugged in the throughhole 111, thewelding portion 123 that is located outside of the throughhole 111 and moved toward thecircuit board 110 would be structurally interfered with thecircuit board 110, such that theconductive terminal 120 would not be easily detached from the throughhole 111. - In this embodiment, the
conductive terminal 120 is configured with atrench 124. Thetrench 124 penetrates from a terminal end of thewelding portion 123 to thepositioning portion 122, and stops before the holdingportion 121. Specifically, thetrench 124 may be generally divided into afirst trench 124 a and asecond trench 124 b communicated with each other. Thepositioning portion 122 is divided by thefirst trench 124 a into two positioningbranches 122 a separated from each other, and thewelding portion 123 is divided by thesecond trench 124 b into two weldingbranches 123 a separated from each other. The twopositioning branches 122 a and the twowelding branches 123 a are in a one-to-one configuration. That is, each of thewelding branches 123 a is connected to one of thepositioning branches 122 a. - During the process of mounting and welding the
conductive terminal 120 to thecircuit board 110, thetrench 124 may be configured as a flow path of asolder 20 and let thesolder 20 be more completely coated and filled. As such, holes (e.g., pin holes) formed on the curedsolder 20 can be avoided, which enhance yield rate and efficiency of the manufacturing process, as illustrated inFIG. 3A andFIG. 4 . In this way, not only is the bonding strength between theconductive terminal 120 and thecircuit board 110 enhanced, the stability of current or signal transmission between theconductive terminal 120 and thecircuit board 110 is also enhanced, such that the electrical connecting structure of the disclosure has good reliability. - As illustrated in
FIG. 3A andFIG. 4 , thesolder 20 completely encapsulates thewelding portion 123 and thepositioning portion 122. Thesolder 20 is not only filled into the throughhole 111 and filled up thetrench 124, but filled into the holdingportion 121 to encapsulate theinternal wire 10. Therefore, the joint area and the bonding strength of theconductive terminal 120 and thesolder 20 may be greatly enhanced. - Please refer to
FIG. 3A , thewelding portion 123 includes a first extendingsegment 1231 connected to thepositioning portion 122 and a second extendingsegment 1232 connected to the first extendingsegment 1231. In addition, there is aninflection 1233 between the first extendingsegment 1231 and the second extendingsegment 1232. Specifically, theconductive terminal 120 is a hollow structure. Theconductive terminal 120 has a central axis AX, and the first extendingsegment 1231 and the second extendingsegment 1232 are tilted to the AX. In this embodiment, a second outer diameter D21 of thewelding portion 123 on the first extendingsegment 1231 is gradually increased from thepositioning portion 122 toward theinflection 1233. A second outer diameter D22 of thewelding portion 123 on theinflection 1233 is greater than the second outer diameter D21. On the other hand, the second outer diameter D22 and the second outer diameter D21 may be severed as a part of the second outer diameter D2, and is greater than the inner diameter I1 of the throughhole 111 and the first outer diameter D1 of thepositioning portion 122. - Continued to the above, the greatest outer diameter of the
welding portion 123 substantially falls on theinflection 1233, and a second outer diameter D23 of thewelding portion 123 on the second extendingsegment 1232 is gradually decreased from theinflection 1233 toward a direction away from the first extendingsegment 1231. In other words, the outer diameter of thewelding portion 123 of theconductive terminal 120 is gradually increased from aterminal end 1232 a of the second extendingsegment 1232 to theinflection 1233, and is gradually decreased from theinflection 1233 to thepositioning portion 122. The outer diameter design facilitates the process of plugging theconductive terminal 120 to thecircuit board 110. - Moreover, the second extending
segment 1232 of thewelding portion 123 is a forward guiding structure. The second outer diameter D23 on theterminal end 1232 a of the second extendingsegment 1232 is smaller than or equal to the first outer diameter D1 of thepositioning portion 122, and the second outer diameter D23 on theterminal end 1232 a of the second extendingsegment 1232 is smaller than the inner diameter I1 of the throughhole 111. Thus, during the process that thewelding portion 123 passes through the throughhole 111, theterminal end 1232 a of thewelding portion 123 would not be interfered with thecircuit board 110 or the throughhole 111. Based on the outer diameter of thewelding portion 123 is gradually increased from theterminal end 1232 a of the second extendingsegment 1232 to theinflection 1233, and thewelding portion 123 is elastically deformed because of thetrench 124 as the depth of thewelding portion 123 plugged into the throughhole 111 increased, thewelding portion 123 can thus successfully pass through the throughhole 111. After thewelding portion 123 passes through the throughhole 111, thewelding portion 123 elastically returns to the state without enduring force and deforming, and thepositioning portion 122 is thus plugged in the throughhole 111. - Please refer to
FIG. 1A ,FIG. 1B , andFIG. 3B , in this embodiment, each of thepositioning branches 122 a of thepositioning portion 122 has anouter wall surface 122 b facing aninner wall surface 111 a of the throughhole 111, and the ratio of the arc length of theouter wall surface 122 b of each of thepositioning branches 122 a to the circumference of theinner wall surface 111 a of the throughhole 111 is greater than or equal to 40%. Accordingly, if thepositioning portion 122 is shifted in the throughhole 111, the two positioningbranches 122 a push against theinner wall 111 a of the throughhole 111 and drive thepositioning portion 122 to reset, such that thepositioning portion 122 substantially remains in the center of the throughhole 111. - Please refer to
FIG. 1A ,FIG. 1B , andFIG. 2 , theconductive terminal 120 further includes a position-limitingprotrusion 125. The position-limitingprotrusion 125 is located between the positioningportion 122 and the holdingportion 121. In addition, the number of the position-limitingprotrusions 125 may be two or increase/decrease based on design needs. After thepositioning portion 122 plugged into the throughhole 111, the position-limitingprotrusion 125 can achieve a stopping effect and thus prevent the holdingportion 121 from being plugged into the throughhole 111. At this time, the position-limitingprotrusion 125 is located outsides of the throughhole 111. Besides, thewelding portion 123 and the position-limitingprotrusion 125 are located at two opposite sides of thecircuit board 110. - It should be specifically noted that the number of the
positioning branches 122 a of thepositioning portion 122 is the same as the number of thewelding branches 123 a of thewelding portion 123. The number of thepositioning branches 122 a and the number of thewelding branches 123 a of thewelding portion 123 are at least two. In addition, the positioningbranches 122 a and thewelding portions 123 are in symmetric arrangement, isometric arrangement, or ring arrangement according to the central axis AX of theconductive terminal 120 that is served as a basis. - In summary of the foregoing, the conductive terminal of the disclosure is configured with a trench. During the process of mounting and welding the conductive terminal to the circuit board, the trench may be configured as a flow path of solder and let the solder be more completely coated and filled. As such, holes (e.g., pin holes) formed on the cured solder can be avoided, which enhance yield rate and efficiency of the manufacturing process. In this way, not only is the bonding strength between the conductive terminal and the circuit board enhanced, the stability of current or signal transmission between the conductive terminal and the circuit board is also enhanced, such that the electrical connecting structure of the disclosure has good reliability.
- On the other hand, since the outer diameter of the welding portion of the conductive terminal of the disclosure is gradually increased from terminal end thereof to the inflection, and is gradually decreased from the inflection to the positioning portion, the outer diameter design facilitates the process of plugging the conductive terminal to the circuit board. Furthermore, since at least part of the second outer diameter of the welding portion is greater than the inner diameter of the through hole, when the welding portion passes through the circuit board and the positioning portion is plugged in the through hole, the welding portion that is located outside of the through hole and moved toward the circuit board would be structurally interfered with the circuit board, such that the conductive terminal would not be easily detached from the through hole. In addition, the ratio of the arc length of the outer wall surface of each of the positioning branches to the circumference of the inner wall surface of the through hole is greater than or equal to 40%. Accordingly, if the positioning portion is shifted in the through hole, the two positioning branches push against the inner wall of the through hole and drive the positioning portion to reset, such that the positioning portion substantially remains in the center of the through hole.
- Although the disclosure is disclosed as the embodiments above, the embodiments are not meant to limit the disclosure. Any person skilled in the art may make slight modifications and variations without departing from the spirit and scope of the disclosure. Therefore, the protection scope of the disclosure shall be defined by the claims attached below.
Claims (16)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201910352871.2 | 2019-04-29 | ||
CN201910352871.2A CN111864428A (en) | 2019-04-29 | 2019-04-29 | Conductive terminal and electric connection structure |
CN201910352871 | 2019-04-29 |
Publications (2)
Publication Number | Publication Date |
---|---|
US20200343654A1 true US20200343654A1 (en) | 2020-10-29 |
US10826206B1 US10826206B1 (en) | 2020-11-03 |
Family
ID=72917453
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US16/532,460 Active US10826206B1 (en) | 2019-04-29 | 2019-08-05 | Conductive terminal and electrical connecting structure |
Country Status (2)
Country | Link |
---|---|
US (1) | US10826206B1 (en) |
CN (1) | CN111864428A (en) |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3963316A (en) * | 1972-10-19 | 1976-06-15 | Amp Incorporated | Electrical connector for a printed circuit board |
US5427546A (en) * | 1993-12-16 | 1995-06-27 | Methode Electronics, Inc. | Flexible jumper with snap-in stud |
TWI276257B (en) | 2005-10-13 | 2007-03-11 | Zippy Tech Corp | Electric wire connecting terminal socket |
CN101652902B (en) | 2007-02-02 | 2013-02-13 | 富加宜汽车控股公司 | Connection device |
KR20140003605U (en) * | 2012-12-05 | 2014-06-13 | 동아베스텍 주식회사 | electric wire connecting terminal |
JP6877738B2 (en) * | 2017-04-03 | 2021-05-26 | 日本圧着端子製造株式会社 | Terminal |
-
2019
- 2019-04-29 CN CN201910352871.2A patent/CN111864428A/en active Pending
- 2019-08-05 US US16/532,460 patent/US10826206B1/en active Active
Also Published As
Publication number | Publication date |
---|---|
US10826206B1 (en) | 2020-11-03 |
CN111864428A (en) | 2020-10-30 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US8575745B2 (en) | Power semiconductor device, printed wiring board, and mechanism for connecting the power semiconductor device and the printed wiring board | |
JP5011562B2 (en) | Semiconductor device and manufacturing method thereof | |
JP2012028042A (en) | Surface mounted contact and connector using the same | |
US10826206B1 (en) | Conductive terminal and electrical connecting structure | |
JP2015173005A (en) | Circuit board and manufacturing method of the same | |
US20090097211A1 (en) | Circuit module and circuit board assembly having sip connector | |
KR101676747B1 (en) | Flexible Bonding Structure including Flexible-Joints and FPCB | |
JP2012169477A (en) | Semiconductor device | |
JP6984257B2 (en) | Electronic device | |
JP2002009217A (en) | Resin-sealed semiconductor device | |
US7794287B1 (en) | Electrical connector configured by wafer having coupling foil and method for making the same | |
CN217036022U (en) | Novel contact element with double-layer connecting plate | |
WO2014010334A1 (en) | Spring terminal | |
US11081289B2 (en) | Tantalum capacitor | |
TWI695551B (en) | Conductive terminal and electrical connecting structure | |
US7393217B2 (en) | Surface mount connector and circuit board assembly with same | |
JP5121421B2 (en) | Optical semiconductor device package and optical semiconductor device | |
JP4901669B2 (en) | Semiconductor package and semiconductor package manufacturing method | |
KR101625889B1 (en) | Cable connectors for electronics board | |
US10333238B2 (en) | Surface mount contact, electronic device assembly, and test probe pin tool | |
JP2018142400A (en) | Cable mounting substrate, substrate with cables, and method for connecting cables to cable mounting substrate | |
CN212443649U (en) | Circuit board welding tool | |
CN106255017B (en) | Loudspeaker module | |
CN218957719U (en) | Paster diode with pin direction 180 degrees adjustable | |
JP2015534286A (en) | Semiconductor axial package |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
FEPP | Fee payment procedure |
Free format text: ENTITY STATUS SET TO UNDISCOUNTED (ORIGINAL EVENT CODE: BIG.); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY |
|
AS | Assignment |
Owner name: LITE-ON TECHNOLOGY CORPORATION, TAIWAN Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:FAN, PAO-HSIU;REEL/FRAME:049964/0091 Effective date: 20190805 Owner name: LITE-ON ELECTRONICS (GUANGZHOU) LIMITED, CHINA Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:FAN, PAO-HSIU;REEL/FRAME:049964/0091 Effective date: 20190805 |
|
STCF | Information on status: patent grant |
Free format text: PATENTED CASE |
|
MAFP | Maintenance fee payment |
Free format text: PAYMENT OF MAINTENANCE FEE, 4TH YEAR, LARGE ENTITY (ORIGINAL EVENT CODE: M1551); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY Year of fee payment: 4 |