US20200312354A1 - Heat Sink Structure for Microwave-Assisted Magnetic Recording (MAMR) Head - Google Patents
Heat Sink Structure for Microwave-Assisted Magnetic Recording (MAMR) Head Download PDFInfo
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- US20200312354A1 US20200312354A1 US16/371,507 US201916371507A US2020312354A1 US 20200312354 A1 US20200312354 A1 US 20200312354A1 US 201916371507 A US201916371507 A US 201916371507A US 2020312354 A1 US2020312354 A1 US 2020312354A1
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Classifications
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- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/127—Structure or manufacture of heads, e.g. inductive
- G11B5/31—Structure or manufacture of heads, e.g. inductive using thin films
- G11B5/3109—Details
- G11B5/313—Disposition of layers
- G11B5/3133—Disposition of layers including layers not usually being a part of the electromagnetic transducer structure and providing additional features, e.g. for improving heat radiation, reduction of power dissipation, adaptations for measurement or indication of gap depth or other properties of the structure
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- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/127—Structure or manufacture of heads, e.g. inductive
- G11B5/31—Structure or manufacture of heads, e.g. inductive using thin films
- G11B5/3109—Details
- G11B5/313—Disposition of layers
- G11B5/3143—Disposition of layers including additional layers for improving the electromagnetic transducing properties of the basic structure, e.g. for flux coupling, guiding or shielding
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- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/127—Structure or manufacture of heads, e.g. inductive
- G11B5/33—Structure or manufacture of flux-sensitive heads, i.e. for reproduction only; Combination of such heads with means for recording or erasing only
- G11B5/39—Structure or manufacture of flux-sensitive heads, i.e. for reproduction only; Combination of such heads with means for recording or erasing only using magneto-resistive devices or effects
- G11B5/3903—Structure or manufacture of flux-sensitive heads, i.e. for reproduction only; Combination of such heads with means for recording or erasing only using magneto-resistive devices or effects using magnetic thin film layers or their effects, the films being part of integrated structures
- G11B5/3906—Details related to the use of magnetic thin film layers or to their effects
- G11B5/3929—Disposition of magnetic thin films not used for directly coupling magnetic flux from the track to the MR film or for shielding
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- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/455—Arrangements for functional testing of heads; Measuring arrangements for heads
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- G—PHYSICS
- G11—INFORMATION STORAGE
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- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B2005/0002—Special dispositions or recording techniques
- G11B2005/0005—Arrangements, methods or circuits
- G11B2005/0024—Microwave assisted recording
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- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/127—Structure or manufacture of heads, e.g. inductive
- G11B5/1278—Structure or manufacture of heads, e.g. inductive specially adapted for magnetisations perpendicular to the surface of the record carrier
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- G11B5/127—Structure or manufacture of heads, e.g. inductive
- G11B5/31—Structure or manufacture of heads, e.g. inductive using thin films
- G11B5/3163—Fabrication methods or processes specially adapted for a particular head structure, e.g. using base layers for electroplating, using functional layers for masking, using energy or particle beams for shaping the structure or modifying the properties of the basic layers
Definitions
- the present disclosure relates to a design for a MAMR head in which a PMR writer has a spin torque oscillator (STO) formed between a main pole trailing side and a write shield, and a heat sink layer formed adjacent to the STO and in the write gap on each side of a center plane that bisects the MP trailing side thereby enabling heat dissipation through the write shield and side shields, and permitting a higher buffer head voltage (BHV) used on the STO to enhance the microwave-assist recording effect when writing transitions on the magnetic media.
- STO spin torque oscillator
- BHV buffer head voltage
- TAMR thermally assisted magnetic recording
- MAMR microwave assisted magnetic recording
- J-G. Zhu et al. J-G. Zhu et al. in “Microwave Assisted Magnetic Recording”, IEEE Trans. Magn., vol. 44, pp. 125-131 (2008).
- MAMR uses a spin torque device to generate a high frequency field that reduces the coercive field of media grains thereby allowing the grains to be switched with a lower main pole field.
- STT devices are based on a spin-torque transfer effect that arises from the spin dependent electron transport properties of ferromagnetic-spacer-ferromagnetic multilayers.
- the first ferromagnetic layer (FM1) will generate spin polarized current as the electron traverses in the material.
- FM2 spin angular moment of electrons incident on a second ferromagnetic
- FM2 second ferromagnetic
- the electrons transfer a portion of their angular momentum to the FM2 layer.
- spin-polarized current can switch the magnetization direction of the FM2 layer if the current density is sufficiently high.
- MAMR typically operates with the application of a bias current from the main pole (MP) across a spin torque oscillator (STO) device to a trailing shield also known as the write shield, or in the opposite direction, in order to generate a high frequency RF field (from an oscillation layer) while a magnetic field is applied from the writer, which typically consists an main pole and write shield structure at an air bearing surface (ABS), to the magnetic medium.
- STO spin torque oscillator
- OL oscillation layer
- the spin polarized current is from a spin polarization (SP) layer, and produces a spin torque on the OL that drives OL magnetization into a precessional state, which in turn produces a RF field near the location where an transition is being written in a magnetic medium.
- SP spin polarization
- the rotating field assists the flipping of the magnetization in the grains being written.
- higher buffer head voltage (BHV) is desirable as the assist field is proportional to the number of total spin polarized electrons being transmitted to the OL, which is in turn proportional to the bias current.
- usable BHV is limited by potential breakdown of the STO element due to electromigration.
- One objective of the present disclosure is to provide a MAMR head design with higher BHV allowance compared with current designs to enhance the microwave-assist effect without degrading device reliability, or to provide a temperature reduction at the same BHV level used in current designs to deliver a longer lifetime than present designs
- a second objective of the present disclosure is to provide a method of fabricating the PMR writer with a MAMR element according to the first objective.
- these objectives are achieved with a PMR writer layout wherein a STO device is formed between a main pole tapered trailing side and a trailing shield, and within a write gap (WG).
- STO thickness is less than or equal to the WG thickness
- STO width is less than or equal to the physical pole width (PW) of the MP on the tapered trailing side.
- Leads from the main pole and trailing shield are connected to a direct current (dc) source that provides an applied current (I a ) across the STO device during a write process.
- dc direct current
- the STO device is comprised of at least a first non-magnetic and spin polarization preserving spacer (NM1), a spin polarization layer (SP) on a first side of NM1, and an oscillation layer (OL) on a second side of NM1 that is opposite to the first side.
- NM1 non-magnetic and spin polarization preserving spacer
- SP spin polarization layer
- OL oscillation layer
- NM2 which does not preserve the spin polarization when polarized electrons traverse through it, to give a MP/NM2/OL/NM1/SP/TS configuration where l a is applied from the TS to MP, or a MP/SP/NM1/OL/NM2/TS configuration where l a is applied from the MP to TS.
- a second SP layer that is antiferromagnetically (AF) coupled to a SP1 layer through an AF coupling (AFC) layer may be added to give a MP/SP1/AFC/SP2/NM2/OL/NM1/SP/TS configuration or a MP/SP/NM1/OL/NM2/SP2/AFC/SP1/TS configuration.
- the second SP layer provides additional spin torque to the OL thereby enhancing the MAMR effect.
- the aforementioned embodiments have a common STO feature where at least one SP layer transmits spin torque onto an OL so that the OL is driven into a precessional state to generate a RF field, which can be used for assisted transition writing on the media.
- the SP layer may be merged into either the MP or TS depending on the direction of the applied current so that a portion of the MP near the STO bottom surface, or a portion of the TS proximate to the STO top surface applies spin torque to the OL to drive the OL into a precessional state.
- a key feature in all embodiments of the present disclosure is a heat sink layer hereinafter referred to as the “heat sink” is formed adjacent to each side of a STO device at the ABS and separated from the STO sides by an insulator layer such as alumina.
- the heat sink is preferably made of a material with a thermal conductivity >100 Watts per meter-Kelvin (W/m-k) such as Ru, Cu, Au, W, Pt, Pd, diamond-like carbon, or diamond, and enables efficient heat dissipation away from the STO element because of the improved thermal conductivity when compared to prior art where a single layer of insulator is normally used.
- the heat sink bottom surface is formed on top of the side shields and main pole area beyond the STO element, and has a thickness less than that of the STO and intended write gap (WG).
- the heat sink top surface contacts a hot seed layer in the trailing shield structure to allow heat dissipation.
- the heat sink has a stripe height substantially equal to that of the STO.
- An insulator layer adjoins the STO backside in order to ensure current flow through the STO.
- the heat sink may wrap around the insulator layer surrounding the STO to provide a continuous layer from the ABS on one side of the STO to the ABS on the other STO side.
- the present disclosure also encompasses a process flow for forming a heat sink at an ABS and adjacent to each side of a STO device according to an embodiment described herein.
- FIG. 1 is a perspective view of a head arm assembly of the present disclosure.
- FIG. 2 is side view of a head stack assembly of the present disclosure.
- FIG. 3 is a plan view of a magnetic recording apparatus of the present disclosure.
- FIG. 4 is a down-track cross-sectional view of a combined read-write head with complete leading and trailing loop pathways for magnetic flux return to the main pole according to an embodiment of the present disclosure.
- FIG. 5 is an ABS view of a MAMR writer known to the inventors wherein a STO device is formed within a write gap and between a main pole and trailing shield.
- FIG. 6A is an ABS view of a MAMR writer wherein a heat sink is formed within the WG adjacent to each side of a STO device according to an embodiment of the present disclosure.
- FIGS. 6B-6C are top-down views of the MAMR writer in FIG. 6A according to a first embodiment where the heat sink has a height essentially equal to the stripe height of the STO device, and according to a second embodiment where the heat sink wraps around the STO device, respectively.
- FIG. 7A shows a first configuration for the STO device in FIG. 6A where I a is applied from the MP to TS to induce a precessional state in an OL, which in turn generates a RF field near the grains where a bit is written according to an embodiment of the present disclosure.
- FIG. 7B depicts an OL precessional state that may flip to an opposite direction (opposing the write gap magnetic flux field) when the applied current reaches a sufficient magnitude.
- FIGS. 8-10 depict second through fourth configurations for the STO device in FIG. 6A of the present disclosure where l a is applied from the MP to TS, or in the reverse direction, to induce a precessional state in an OL, which in turn generates a RF field proximate to the bit that is being written on the media.
- FIG. 11A and FIG. 11B show an ABS view and down-track cross-sectional view, respectively, of a first step in the process of forming a MAMR writer of the present disclosure where a tapered trailing side is formed on the main pole.
- FIG. 12 shows an ABS view of the MAMR writer structure in FIG. 11A after a STO stack of layers is deposited and is patterned to establish a cross-track width for the STO device, and then a first portion of the WG layer is deposited that adjoins the STO sides.
- FIG. 13 depicts a top-view of the MAMR writer structure in FIG. 12 after a heat sink is deposited on the WG layer on opposite sides of the STO device according to an embodiment of the present disclosure.
- FIG. 14 is an ABS view of the MAMR writer structure in FIG. 13 after a photoresist stripping process is performed to remove the photoresist.
- FIG. 15 is a down-track cross-sectional view of the MAMR writer structure in FIG. 14 after a second photoresist mask is formed on the STO device, and an insulation layer is deposited behind the STO device.
- FIG. 16 is an ABS view of the MAMR writer in FIG. 15 after a first TS (hot seed) layer is deposited and patterned on the STO/WG/heat sink structure, and an etch transfers the pattern downward to form far sides on the heat sink and hot seed.
- TS hot seed
- FIGS. 17-18 are down-track cross-sectional views of the MAMR writer in FIG. 16 after a second TS (write shield) is deposited, and then a patterning and etching process is performed to establish a backside on each of the hot seed and overlying write shield (WS) according to an embodiment described herein.
- TS write shield
- the present disclosure is a MAMR writer structure wherein a heat sink is formed within a write gap and adjacent to each side of a STO device that is formed between a main pole and a trailing shield structure, and a process for making the same.
- Various configurations are provided for the STO device.
- the benefits of the head sink are not limited to a specific STO configuration.
- the y-axis is in a cross-track direction
- the z-axis is in a down-track direction
- the x-axis is in a direction orthogonal to the ABS and towards a back end of the writer structure.
- Thickness refers to a down-track distance, width is a cross-track distance, and height is a distance from the ABS in the x-axis direction.
- a magnetic bit comprises a plurality of grains and is considerably enlarged in the drawings over an actual size in order to more easily depict a magnetization therein.
- the terms “MP field” and “write field” may be used interchangeably.
- a head gimbal assembly (HGA) 100 includes a magnetic recording head 1 comprised of a slider and a PMR writer structure formed thereon, and a suspension 103 that elastically supports the magnetic recording head.
- the suspension has a plate spring-like load beam 222 formed with stainless steel, a flexure 104 provided at one end portion of the load beam, and a base plate 224 provided at the other end portion of the load beam.
- the slider portion of the magnetic recording head is joined to the flexure, which gives an appropriate degree of freedom to the magnetic recording head.
- a gimbal part (not shown) for maintaining a posture of the magnetic recording head at a steady level is provided in a portion of the flexure to which the slider is mounted.
- HGA 100 is mounted on an arm 230 formed in the head arm assembly 103 .
- the arm moves the magnetic recording head 1 in the cross-track direction y of the magnetic recording medium 140 .
- One end of the arm is mounted on base plate 224 .
- a coil 231 that is a portion of a voice coil motor is mounted on the other end of the arm.
- a bearing part 233 is provided in the intermediate portion of arm 230 .
- the arm is rotatably supported using a shaft 234 mounted to the bearing part 233 .
- the arm 230 and the voice coil motor that drives the arm configure an actuator.
- the head stack assembly 250 is a member to which a first HGA 100 - 1 and second HGA 100 - 2 are mounted to arms 230 - 1 , 230 - 2 , respectively, on carriage 251 .
- a HGA is mounted on each arm at intervals so as to be aligned in the perpendicular direction (orthogonal to magnetic medium 140 ).
- the coil portion ( 231 in FIG. 1 ) of the voice coil motor is mounted at the opposite side of each arm in carriage 251 .
- the voice coil motor has a permanent magnet 263 arranged at an opposite position across the coil 231 .
- the head stack assembly 250 is incorporated in a magnetic recording apparatus 260 .
- the magnetic recording apparatus has a plurality of magnetic media 140 mounted to spindle motor 261 .
- the head stack assembly and actuator except for the magnetic recording heads 1 correspond to a positioning device, and support the magnetic recording heads, and position the magnetic recording heads relative to the magnetic recording medium.
- the magnetic recording heads are moved in a cross-track of the magnetic recording medium by the actuator.
- the magnetic recording head records information into the magnetic recording media with a PMR writer element (not shown) and reproduces the information recorded in the magnetic recording media by a magnetoresistive (MR) sensor element (not shown).
- PMR writer element not shown
- MR magnetoresistive
- magnetic recording head 1 comprises a combined read-write head.
- the down-track cross-sectional view is taken along a center plane ( 44 - 44 in FIG. 5 ) formed orthogonal to the ABS 30 - 30 , and that bisects the main pole layer 14 .
- the read head is formed on a substrate 81 that may be comprised of AITiC (alumina+TiC) with an overlying insulation layer 82 that is made of a dielectric material such as alumina.
- the substrate is typically part of a slider formed in an array of sliders on a wafer. After the combined read head/write head is fabricated, the wafer is sliced to form rows of sliders. Each row is typically lapped to afford an ABS before dicing to fabricate individual sliders that are used in a magnetic recording device.
- a bottom shield 84 is formed on insulation layer 82 .
- a magnetoresistive (MR) element also known as MR sensor 86 is formed on bottom shield 84 at the ABS 30 - 30 and typically includes a plurality of layers (not shown) including a tunnel barrier formed between a pinned layer and a free layer where the free layer has a magnetization (not shown) that rotates in the presence of an applied magnetic field to a position that is parallel or antiparallel to the pinned layer magnetization.
- Insulation layer 85 adjoins the backside of the MR sensor, and insulation layer 83 contacts the backsides of the bottom shield and top shield 87 .
- the top shield is formed on the MR sensor.
- An insulation layer 88 and a top shield (S2B) layer 89 are sequentially formed on the top magnetic shield.
- the S2B layer 89 may serve as a flux return path (RTP) in the write head portion of the combined read/write head.
- RTP flux return path
- the portion of the combined read/write head structure formed below layer 89 in FIG. 4 is typically considered as the read head.
- the read head may have a dual reader design with two MR sensors, or a multiple reader design with multiple MR sensors.
- magnetic flux 70 in main pole (MP) layer 14 is generated with flowing a current through bucking coil 80 b and driving coil 80 d that are below and above the MP layer, respectively, and are connected by interconnect 51 .
- Magnetic flux 70 exits the MP layer at pole tip 14 p at the ABS 30 - 30 and is used to write a plurality of bits on magnetic medium 140 .
- Magnetic flux 70 b returns to the MP through a trailing loop comprised of trailing shields 17 , 18 , PP3 shield 26 , and top yoke 18 x.
- leading return loop for magnetic flux 70 a that includes leading shield 11 , leading shield connector (LSC) 33 , S2 connector (S2C) 32 , return path 89 , and back gap connection (BGC) 62 .
- the magnetic core may also comprise a bottom yoke 35 below the MP layer.
- Dielectric layers 10 , 11 , 13 , 36 - 39 , and 47 - 49 are employed as insulation layers around magnetic and electrical components.
- a protection layer 27 covers the PP3 trailing shield and is made of an insulating material such as alumina.
- Above the protection layer and recessed a certain distance u from the ABS 30 - 30 is an optional cover layer 29 that is preferably comprised of a low coefficient of thermal expansion (CTE) material such as SiC.
- Overcoat layer 28 is formed as the uppermost layer in the write head.
- FIG. 5 an ABS view of an existing MAMR writer known to the inventors is shown where there is all wrap around (AWA) shield structure surrounding the MP 14 .
- MP trailing side 14 t 1 is bisected by center plane 44 - 44 that also passes through MP leading side 14 b 1 .
- AWA wrap around
- a first trailing shield (hot seed layer) 17 is formed on the WG and has a width w 2 equal to that of the WG where w 2 >track width (TW) also known as the pole width (PW).
- a second trailing shield (write shield) 18 is formed on side shields 12 at plane 41 - 41 , on hot seed top surface 17 t, and adjoins sides 17 s and 16 s of the hot seed layer and WG, respectively.
- LS 11 may have a top layer 11 b called a leading edge taper (LET), and a bottom layer 11 a. The LET contacts a bottom surface of each side shield at plane 42 - 42 that is parallel to plane 41 - 41 , and is orthogonal to the ABS and the center plane.
- STO device 22 is formed within the WG and between the MP trailing side and hot seed layer.
- the WG is made of an electrically insulating layer 16 a that is a composite of a dielectric material with another material having high thermal conductivity that is not restricted to be an insulator.
- the insulating layer may be an ALD layer comprised of alumina and diamond.
- the insulating layer is preferably a conformal layer of thickness/width b from 5 Angstroms to 80 Angstroms that adjoins STO device sides 22 s and is formed on top surfaces of each side shield 12 and side gap 15 at plane 41 - 41 .
- Each heat sink has a first inner side 19 s 2 that is separated from a STO side by insulating layer width b, and an outer side 19 s 1 that contacts write shield (WS) 18 at a width a from 0.05 micron to 1 micron from the inner side.
- WS write shield
- Heat sink 19 is made of a material such as Ru, Cu, Au, Pt, Pd, W, Ir, diamond-like carbon, or atomic layer deposited diamond with a thermal conductivity that is preferably >100 Watts per meter-Kelvin (W/m-k) to enable efficient heat dissipation through hot seed layer 17 , WS 18 , and side shields 12 .
- Top surface 19 t of each heat sink at the ABS is at plane 45 - 45 that includes the STO top surface 22 t, and insulating layer top surface 16 t where plane 45 - 45 is parallel to plane 41 - 41 .
- the heat sink top surface adjoins a bottom surface of the hot seed layer that is also referred to as a high moment trailing shield preferably made of FeCo, FeCoNi, FeCoN, or NiFe with a magnetization saturation (Ms) from 19 kiloGauss (kG) to 24 kG.
- Ms magnetization saturation
- each heat sink 19 adjacent to STO 22 is shown at plane 45 - 45 with the hot seed layer and overlying MAMR writer layers removed.
- STO 22 has sides 22 s that extend from a front side 22 f at the ABS 30 - 30 to a backside 22 b, and have a stripe height (SH) of 10 nm to 100 nm.
- Insulating layer 16 a has a front side 16 f at the ABS, and each heat sink 19 has the SH between a front side 19 f at the ABS to a backside 19 b.
- Insulation layer 47 may be considered part of the composite WG and adjoins the STO backside and heat sink backsides, and is formed between WS 18 on each side of center plane 44 - 44 .
- the heat sink backside may be at a greater distance than SH from the ABS.
- heat sink 19 forms a continuous layer around STO 22 .
- insulating layer 16 a may wrap around STO 22 and form a continuous layer of width b that adjoins STO sides 22 s and backside 22 b.
- the heat sink now has a backside 19 e that extends in a cross-track direction from WS 18 on one side of center plane 44 - 44 to the WS on the other side of the center plane.
- Heat sink backside 19 e is at height h preferably >100 nm from a heat sink second inner side 19 s 3 that is adjacent and parallel to the STO backside.
- This heat sink embodiment has the advantage of better heat dissipation compared with the heat sink in FIG. 6B , but requires additional fabrication steps.
- a STO device is described wherein a SP layer is formed between a seed layer and a non-magnetic (NM) spacer, and an OL is between the NM spacer and a cap layer.
- NM non-magnetic
- a MAMR writer having a STO device 22 - 1 is shown and features a STO stack wherein a second non-magnetic (NM2) layer 4 , SP layer 5 , first non-magnetic (NM1) layer 2 , and OL 3 are sequentially formed on MP tapered trailing side 14 t 1 , and where the OL top surface contacts a portion of hot seed layer 17 .
- This STO configuration was previously described in related application Ser. No. 16/197,586.
- MP 14 has a sufficiently large local magnetic field 70 to write the media bit 9 with magnetization 9 m on magnetic medium 140 .
- Magnetic flux 70 in the MP proceeds through the ABS 30 - 30 and into medium layer 142 and soft underlayer (SUL) 141 .
- a portion of the flux 70 b is collected by hot seed layer 17 and then returns to the MP through a trailing loop (such as one shown in FIG. 4 ).
- STO 22 - 1 is at the ABS and is formed on the MP tapered trailing side 14 t 1 , which connects with a MP top surface 14 t 2 that is aligned orthogonal to the ABS.
- the MP leading side 14 b 1 is also tapered and connects with the MP bottom surface 14 b 2 .
- Write gap field flux 70 g is shown across the STO in the general direction from the MP to hot seed layer.
- the microwave assisted magnetic recording (MAMR) aspect involves applying current I a from a direct current (dc) source 50 through lead 57 to the MP 14 and through STO 22 - 1 to hot seed layer 17 and then returning through lead 58 to the dc source.
- the applied current is spin polarized by SP layer 5 , and produces a spin torque on OL 3 that drives OL magnetization into a precessional state 3 p, which in turn produces a RF field 77 on bit magnetization 9 m.
- Bit magnetization oscillates into a precessional state (not shown) thereby reducing a switching field of medium bit 9 so that the bit can be switched using a smaller MP field 70 .
- MP magnetization 70 m proximate to MP tapered trailing side 14 t 1 is substantially parallel to SP magnetization 5 m and in the general direction of the WG field flux 70 g from the MP 14 to hot seed layer 17 .
- the oscillation in OL 3 is in a dynamic state called a precessional state 3 p where the cone angle a increases with increasing applied current density.
- OL magnetization 3 m In a first range of relatively low current density shown on the left side of the drawing, OL magnetization 3 m is in a direction pointing substantially toward the hot seed layer (not shown). However, if the applied current increases to a second range of relatively high current density, magnetization 3 m flips to a direction substantially pointing away from the hot seed layer as depicted on the right side of the drawing.
- Precessional state 3 p′ has a cone angle ⁇ that decreases with increasing current density. At sufficiently high current density, angle ⁇ is proximate to 0 degrees (pointing toward the MP tapered trailing side).
- precessional state 3 p′ in both precessional states 3 p and 3 p′, the MAMR effect increases with increasing angle ⁇ and ⁇ , respectively. Furthermore, magnetization “flipping” is reversible. Thus, precessional state 3 p′ will return to precessional state 3 p if applied current density is reduced by a sufficient amount.
- FIG. 9 an alternative STO configuration is shown that was disclosed in related application Ser. No. 16/197,586 and represents a modification of STO device 22 - 2 .
- spin torque on OL magnetization is enhanced with the insertion of a second SP layer on an opposite side of OL 3 with respect to SP layer 5 , and where the second SP layer has a magnetization that is substantially anti-parallel to magnetization 5 m.
- seed layer 8 , and a SP1/AF coupling/SP2 stack of layers 7 a/ 7 b/ 7 c are sequentially formed on MP tapered trailing side 14 t 1 where SP2 layer 7 c adjoins a bottom surface of NM1 spacer 2 .
- OL magnetization is driven into a precessional state 3 p (or 3 p′ ) because of additive spin torque from SP2 layer 7 c and SP layer 5 .
- SP1 layer 7 a with magnetization 7 m 1 and SP2 layer with magnetization 7 m 2 are driven into precessional states, and together with the OL 3 precessional state produce a cumulative RF field 77 x that is typically greater than RF field 77 in previous embodiments to further reduce the MP field 70 required to switch bit magnetization 9 m.
- FIG. 10 depicts another STO device 22 - 4 that may be used in the MAMR writer of the present disclosure.
- NM2 spacer 4 , OL 3 , NM1 spacer 2 , SP2 layer 7 c, AF coupling layer 7 b, SP1 layer 7 a, and capping layer 8 c are sequentially formed on MP tapered trailing side 14 t 1 .
- SP layer 5 is effectively merged into the MP proximate to STO 22 - 4 such that applied current I a is spin polarized by MP magnetization 70 m to exert a spin torque on OL 3 that together with spin torque from the SP2 layer drives the OL into precessional state 3 p (or 3 p′ depending on I a current density).
- precessional state 3 p together with precessional magnetizations 7 m 1 , 7 m 2 in SP1 and SP2 layers, respectively, provides a cumulative RF field 77 x on bit magnetization 9 m thereby requiring a lower MP field 70 to switch the bit magnetization during a write process.
- NM1 and NM2 spacers 2 and 4 may be single layer or multilayer films as appreciated by those skilled in the art, and are preferably a non-magnetic metal with a long spin diffusion length such as Cu, Ag, or Au so that current polarized by the adjacent SP layer 5 and SP2 layer 7 c (when present) do not encounter strong spin-flip scattering in the spacers.
- one or both NM spacers may be a metal oxide layer similar to the metal oxide spacer that was disclosed in related U.S. Pat. No. 9,230,571. The spacers also have sufficient thickness to prevent strong ferromagnetic coupling between magnetic layers on each side thereof.
- Each of SP5, OL 3 , and SP1 layer 7 a and SP2 layer 7 b may be a single layer or alloy that is Fe, Co, Ni, CoFe, NiFe, or CoFeNi, for example, or a multilayer of one or more of the aforementioned elements and alloys.
- a finite element modeling (FEM) simulation was performed to confirm the quantitative reduction of STO device temperature rise during a typical 140 mV operation.
- the following STO dimensions were used in the FEM simulation: 40 nm width; 17 nm thickness, and 40 nm stripe height (SH) where SH is essentially equal to a throat height dimension in the MAMR writer.
- the STO was modeled as a single column of electrical conductor and its resistivity was tuned to match with the assumed STO device resistance and lead resistance of 20.6 ohm and 10.5 ohm, respectively.
- the results in Table 1 show that replacing alumina with AIN only generated a modest decrease in the temperature rise within the STO device.
- an ALD insulator having a 2 nm width, and a Ru or Cu heat sink is formed behind and adjacent to the STO as in the second embodiment (Emb. 2), there is an 11% and 20% improvement, respectively, in the temperature rise. Note that when a Ru heat sink layer in combination with an ALD insulator is formed only behind the STO device, there is no improvement over the pure AlN insulator example.
- the results demonstrate that the heat sink structure provides a significant temperature rise reduction in the adjacent STO device when the MAMR writer of the present disclosure is operated at the same BHV compared with a MAMR writer without the heat sink.
- the MAMR writer disclosed herein allows higher BHV to enhance performance and enable higher area density capability (ADC).
- the present disclosure also encompasses a process sequence for fabricating a heat sink adjacent to a STO device according to an embodiment described herein.
- a partially formed MAMR writer structure including MP tip 14 p that adjoins side gaps 15 and leading gap 13 in FIG. 11A is provided according to a conventional process sequence.
- Side shield top surfaces 12 t are coplanar with a trailing edge of the MP tapered trailing side 14 t 1 at plane 41 - 41 , which is orthogonal to the subsequently formed ABS plane.
- FIG. 11B shows the down-track cross-sectional view at plane 44 - 44 in FIG. 11A .
- MP tapered trailing side 14 t 1 has a taper angle ⁇ and is coplanar with a tapered front side 47 f of dielectric layer 47 a made of Al 2 O 3 or SiO 2 that is formed on MP top surface 14 t 2 .
- ABS plane 30 - 30 is not determined until a lapping process is performed after all layers in the MAMR writer structure are formed.
- a STO stack of layers 22 that may have one of the configurations described previously is deposited on the MP tapered trailing side 14 t 1 and on dielectric layer 47 .
- the stack of layers is preferably conformal to the underlying topography and has a uniform thickness.
- a first photoresist layer is coated on the STO stack of layers, and is patternwise exposed and developed to provide a photoresist mask 72 having sides 72 s and a cross-track width TW that is bisected by plane 44 - 44 .
- the photoresist mask pattern is etch transferred through the STO stack of layers using one or both of an ion beam etch (IBE) and reactive ion etch (RIE) process, for example, thereby forming STO device 22 with sides 22 s separated by track width TW.
- IBE ion beam etch
- RIE reactive ion etch
- the IBE/RIE process may simultaneously generate a backside on the STO device.
- insulator 16 a having thickness b is conformally deposited on each side shield 12 , and on side gaps 15 , and with a width b on STO device sides 22 s using an atomic layer deposition (ALD) method, for example.
- ALD atomic layer deposition
- a top-down view is depicted of the partially formed MAMR writer after the first photoresist is removed by a conventional method, and a second photoresist layer is patternwise exposed and developed to form a front portion 73 a of the second photoresist layer above the STO device between the ABS plane 30 - 30 and up to a stripe height (SH).
- SH stripe height
- Heat sink 19 is deposited on insulator 16 a on each side of the center plane 44 - 44 in regions not covered by the second photoresist layer 73 a/ 73 b. At this point, heat sink 19 extends from the ABS plane to a backside 19 b at the SH, and has an inner side 19 s 2 adjoining insulator 16 a at a width b from each STO side 22 s.
- FIG. 14 an ABS view of the MAMR writer in FIG. 13 is shown after the second photoresist layer is removed by conventional means.
- Each heat sink 19 has a thickness t 1 .
- a down-track cross-sectional view at plane 44 - 44 is depicted for the partially formed MAMR writer structure after a third photoresist is patternwise exposed and patterned to form photoresist mask 74 that extends from the ABS plane 30 - 30 to a backside 74 e at the SH from the ABS plane.
- photoresist backside 74 e is aligned above STO backside 22 b.
- insulation layer 47 b having thickness dl is deposited on top surface 47 t of insulation layer 47 a and on portions of MP tapered trailing side 14 t 1 that are not covered by the photoresist mask.
- insulation layers 47 a, 47 b may be comprised of the same material and designated as insulation layer 47 .
- photoresist mask 74 is removed by a conventional method, hot seed layer 17 is deposited on STO top surface 22 t and on heat sink top surface 19 t.
- a fourth photoresist layer is coated on the hot seed layer and is patterned to form photoresist mask 75 having sides 75 s and a width w 2 where w 2 >TW.
- Another IBE or RIE step is employed to transfer the photoresist mask pattern through exposed portions of the hot seed layer, heat sink 19 , and insulator 16 a, and stops on side shield top surface 12 t at plane 41 - 41 thereby generating hot seed layer side 17 s, heat sink far (outer) side 19 s 1 , and insulator side 16 s on each side of center plane 44 - 44 .
- photoresist mask 75 is removed. Then, WS 18 is deposited on hot seed layer 17 and on side shields 12 . A fifth photoresist layer is coated and patterned on the WS to provide photoresist mask 76 having a backside 76 e at height s from the ABS plane 30 - 30 where s is generally larger than height c of MP edge 14 x described earlier.
- FIG. 18 depicts the partially formed MAMR writer structure in FIG. 17 after a third RIE or IBE step is performed to transfer the photoresist mask pattern through exposed regions of hot seed layer 17 and WS 18 , and stops at top surface 47 t 2 of insulation layer 47 thereby forming hot seed backside 17 e and WS backside 18 e at height s from the ABS plane 30 - 30 . Thereafter, a conventional process flow is followed to complete the MAMR writer structure. According to one embodiment, a combined read-write head 1 shown in FIG. 4 is formed after a lapping process is completed.
Abstract
Description
- This application is related to the following: U.S. Pat. No. 9,230,571; Docket # HT18-020, Ser. No. 16/197,586, filed on Nov. 21, 2018; and Docket # HT18-021, Ser. No. 16/209,151, filed on Dec. 4, 2018; assigned to a common assignee, and herein incorporated by reference in their entirety.
- The present disclosure relates to a design for a MAMR head in which a PMR writer has a spin torque oscillator (STO) formed between a main pole trailing side and a write shield, and a heat sink layer formed adjacent to the STO and in the write gap on each side of a center plane that bisects the MP trailing side thereby enabling heat dissipation through the write shield and side shields, and permitting a higher buffer head voltage (BHV) used on the STO to enhance the microwave-assist recording effect when writing transitions on the magnetic media.
- As the data areal density in hard disk drive (HDD) writing increases, critical dimensions of write heads and dimensions of media bits are both required to shrink. However, as the write head critical dimension shrinks, its writability degrades rapidly. To improve writability, new technologies are being developed that assists writing transitions on the media. Two main approaches currently being investigated are thermally assisted magnetic recording (TAMR) and microwave assisted magnetic recording (MAMR). The latter is described by J-G. Zhu et al. in “Microwave Assisted Magnetic Recording”, IEEE Trans. Magn., vol. 44, pp. 125-131 (2008). MAMR uses a spin torque device to generate a high frequency field that reduces the coercive field of media grains thereby allowing the grains to be switched with a lower main pole field.
- Spin torque transfer (STT) devices are based on a spin-torque transfer effect that arises from the spin dependent electron transport properties of ferromagnetic-spacer-ferromagnetic multilayers. When a current passes through a magnetic multilayer in a CPP (current perpendicular to plane) configuration, the first ferromagnetic layer (FM1) will generate spin polarized current as the electron traverses in the material. When the spin polarized current is transmitted through a polarization preservation spacer, the spin angular moment of electrons incident on a second ferromagnetic (FM2) layer interacts with magnetic moments of the FM2 layer near the interface between the FM2 layer and non-magnetic spacer. Through this interaction, the electrons transfer a portion of their angular momentum to the FM2 layer. As a result, spin-polarized current can switch the magnetization direction of the FM2 layer if the current density is sufficiently high.
- MAMR typically operates with the application of a bias current from the main pole (MP) across a spin torque oscillator (STO) device to a trailing shield also known as the write shield, or in the opposite direction, in order to generate a high frequency RF field (from an oscillation layer) while a magnetic field is applied from the writer, which typically consists an main pole and write shield structure at an air bearing surface (ABS), to the magnetic medium. In existing designs, spin torque from spin polarized electrons in a magnetic layer is applied to the oscillation layer (OL) in the STO device. In many cases, the spin polarized current is from a spin polarization (SP) layer, and produces a spin torque on the OL that drives OL magnetization into a precessional state, which in turn produces a RF field near the location where an transition is being written in a magnetic medium. The rotating field assists the flipping of the magnetization in the grains being written. To enhance the microwave-assisted recording effect, higher buffer head voltage (BHV) is desirable as the assist field is proportional to the number of total spin polarized electrons being transmitted to the OL, which is in turn proportional to the bias current. On the other hand, usable BHV is limited by potential breakdown of the STO element due to electromigration. As it is well known, element temperature and local current density are the two key factors in order to control electro-migration. Therefore, an improved MAMR design is needed where BHV may be increased above currently acceptable levels to improve performance without comprising device reliability, or where greater cooling is provided when using a BHV typical of current MAMR schemes so that device lifetime is increased.
- One objective of the present disclosure is to provide a MAMR head design with higher BHV allowance compared with current designs to enhance the microwave-assist effect without degrading device reliability, or to provide a temperature reduction at the same BHV level used in current designs to deliver a longer lifetime than present designs
- A second objective of the present disclosure is to provide a method of fabricating the PMR writer with a MAMR element according to the first objective.
- According to one embodiment of the present invention, these objectives are achieved with a PMR writer layout wherein a STO device is formed between a main pole tapered trailing side and a trailing shield, and within a write gap (WG). STO thickness is less than or equal to the WG thickness, and STO width is less than or equal to the physical pole width (PW) of the MP on the tapered trailing side. Leads from the main pole and trailing shield are connected to a direct current (dc) source that provides an applied current (Ia) across the STO device during a write process. The STO device is comprised of at least a first non-magnetic and spin polarization preserving spacer (NM1), a spin polarization layer (SP) on a first side of NM1, and an oscillation layer (OL) on a second side of NM1 that is opposite to the first side. There is a second non-magnetic spacer (NM2), which does not preserve the spin polarization when polarized electrons traverse through it, to give a MP/NM2/OL/NM1/SP/TS configuration where la is applied from the TS to MP, or a MP/SP/NM1/OL/NM2/TS configuration where la is applied from the MP to TS. In an alternative embodiment, a second SP layer (SP2) that is antiferromagnetically (AF) coupled to a SP1 layer through an AF coupling (AFC) layer may be added to give a MP/SP1/AFC/SP2/NM2/OL/NM1/SP/TS configuration or a MP/SP/NM1/OL/NM2/SP2/AFC/SP1/TS configuration. The second SP layer provides additional spin torque to the OL thereby enhancing the MAMR effect.
- Thus, the aforementioned embodiments have a common STO feature where at least one SP layer transmits spin torque onto an OL so that the OL is driven into a precessional state to generate a RF field, which can be used for assisted transition writing on the media.
- According to other embodiments, the SP layer may be merged into either the MP or TS depending on the direction of the applied current so that a portion of the MP near the STO bottom surface, or a portion of the TS proximate to the STO top surface applies spin torque to the OL to drive the OL into a precessional state.
- A key feature in all embodiments of the present disclosure is a heat sink layer hereinafter referred to as the “heat sink” is formed adjacent to each side of a STO device at the ABS and separated from the STO sides by an insulator layer such as alumina. The heat sink is preferably made of a material with a thermal conductivity >100 Watts per meter-Kelvin (W/m-k) such as Ru, Cu, Au, W, Pt, Pd, diamond-like carbon, or diamond, and enables efficient heat dissipation away from the STO element because of the improved thermal conductivity when compared to prior art where a single layer of insulator is normally used. The heat sink bottom surface is formed on top of the side shields and main pole area beyond the STO element, and has a thickness less than that of the STO and intended write gap (WG). The heat sink top surface contacts a hot seed layer in the trailing shield structure to allow heat dissipation.
- In one embodiment, the heat sink has a stripe height substantially equal to that of the STO. An insulator layer adjoins the STO backside in order to ensure current flow through the STO. According to an alternative embodiment, the heat sink may wrap around the insulator layer surrounding the STO to provide a continuous layer from the ABS on one side of the STO to the ABS on the other STO side.
- The present disclosure also encompasses a process flow for forming a heat sink at an ABS and adjacent to each side of a STO device according to an embodiment described herein.
-
FIG. 1 is a perspective view of a head arm assembly of the present disclosure. -
FIG. 2 is side view of a head stack assembly of the present disclosure. -
FIG. 3 is a plan view of a magnetic recording apparatus of the present disclosure. -
FIG. 4 is a down-track cross-sectional view of a combined read-write head with complete leading and trailing loop pathways for magnetic flux return to the main pole according to an embodiment of the present disclosure. -
FIG. 5 is an ABS view of a MAMR writer known to the inventors wherein a STO device is formed within a write gap and between a main pole and trailing shield. -
FIG. 6A is an ABS view of a MAMR writer wherein a heat sink is formed within the WG adjacent to each side of a STO device according to an embodiment of the present disclosure. -
FIGS. 6B-6C are top-down views of the MAMR writer inFIG. 6A according to a first embodiment where the heat sink has a height essentially equal to the stripe height of the STO device, and according to a second embodiment where the heat sink wraps around the STO device, respectively. -
FIG. 7A shows a first configuration for the STO device inFIG. 6A where Ia is applied from the MP to TS to induce a precessional state in an OL, which in turn generates a RF field near the grains where a bit is written according to an embodiment of the present disclosure. -
FIG. 7B depicts an OL precessional state that may flip to an opposite direction (opposing the write gap magnetic flux field) when the applied current reaches a sufficient magnitude. -
FIGS. 8-10 depict second through fourth configurations for the STO device inFIG. 6A of the present disclosure where la is applied from the MP to TS, or in the reverse direction, to induce a precessional state in an OL, which in turn generates a RF field proximate to the bit that is being written on the media. -
FIG. 11A andFIG. 11B show an ABS view and down-track cross-sectional view, respectively, of a first step in the process of forming a MAMR writer of the present disclosure where a tapered trailing side is formed on the main pole. -
FIG. 12 shows an ABS view of the MAMR writer structure inFIG. 11A after a STO stack of layers is deposited and is patterned to establish a cross-track width for the STO device, and then a first portion of the WG layer is deposited that adjoins the STO sides. -
FIG. 13 depicts a top-view of the MAMR writer structure inFIG. 12 after a heat sink is deposited on the WG layer on opposite sides of the STO device according to an embodiment of the present disclosure. -
FIG. 14 is an ABS view of the MAMR writer structure inFIG. 13 after a photoresist stripping process is performed to remove the photoresist. -
FIG. 15 is a down-track cross-sectional view of the MAMR writer structure inFIG. 14 after a second photoresist mask is formed on the STO device, and an insulation layer is deposited behind the STO device. -
FIG. 16 is an ABS view of the MAMR writer inFIG. 15 after a first TS (hot seed) layer is deposited and patterned on the STO/WG/heat sink structure, and an etch transfers the pattern downward to form far sides on the heat sink and hot seed. -
FIGS. 17-18 are down-track cross-sectional views of the MAMR writer inFIG. 16 after a second TS (write shield) is deposited, and then a patterning and etching process is performed to establish a backside on each of the hot seed and overlying write shield (WS) according to an embodiment described herein. - The present disclosure is a MAMR writer structure wherein a heat sink is formed within a write gap and adjacent to each side of a STO device that is formed between a main pole and a trailing shield structure, and a process for making the same. Various configurations are provided for the STO device. However, the benefits of the head sink are not limited to a specific STO configuration. In the drawings, the y-axis is in a cross-track direction, the z-axis is in a down-track direction, and the x-axis is in a direction orthogonal to the ABS and towards a back end of the writer structure. Thickness refers to a down-track distance, width is a cross-track distance, and height is a distance from the ABS in the x-axis direction. A magnetic bit comprises a plurality of grains and is considerably enlarged in the drawings over an actual size in order to more easily depict a magnetization therein. The terms “MP field” and “write field” may be used interchangeably.
- Referring to
FIG. 1 , a head gimbal assembly (HGA) 100 includes amagnetic recording head 1 comprised of a slider and a PMR writer structure formed thereon, and asuspension 103 that elastically supports the magnetic recording head. The suspension has a plate spring-like load beam 222 formed with stainless steel, aflexure 104 provided at one end portion of the load beam, and abase plate 224 provided at the other end portion of the load beam. The slider portion of the magnetic recording head is joined to the flexure, which gives an appropriate degree of freedom to the magnetic recording head. A gimbal part (not shown) for maintaining a posture of the magnetic recording head at a steady level is provided in a portion of the flexure to which the slider is mounted. -
HGA 100 is mounted on anarm 230 formed in thehead arm assembly 103. The arm moves themagnetic recording head 1 in the cross-track direction y of themagnetic recording medium 140. One end of the arm is mounted onbase plate 224. Acoil 231 that is a portion of a voice coil motor is mounted on the other end of the arm. Abearing part 233 is provided in the intermediate portion ofarm 230. The arm is rotatably supported using ashaft 234 mounted to thebearing part 233. Thearm 230 and the voice coil motor that drives the arm configure an actuator. - Next, a side view of a head stack assembly (
FIG. 2 ) and a plan view of a magnetic recording apparatus (FIG. 3 ) wherein themagnetic recording head 1 is incorporated are depicted. Thehead stack assembly 250 is a member to which a first HGA 100-1 and second HGA 100-2 are mounted to arms 230-1, 230-2, respectively, oncarriage 251. A HGA is mounted on each arm at intervals so as to be aligned in the perpendicular direction (orthogonal to magnetic medium 140). The coil portion (231 inFIG. 1 ) of the voice coil motor is mounted at the opposite side of each arm incarriage 251. The voice coil motor has apermanent magnet 263 arranged at an opposite position across thecoil 231. - With reference to
FIG. 3 , thehead stack assembly 250 is incorporated in amagnetic recording apparatus 260. The magnetic recording apparatus has a plurality ofmagnetic media 140 mounted tospindle motor 261. For every magnetic recording medium, there are two magnetic recording heads arranged opposite one another across the magnetic recording medium. The head stack assembly and actuator except for the magnetic recording heads 1 correspond to a positioning device, and support the magnetic recording heads, and position the magnetic recording heads relative to the magnetic recording medium. The magnetic recording heads are moved in a cross-track of the magnetic recording medium by the actuator. The magnetic recording head records information into the magnetic recording media with a PMR writer element (not shown) and reproduces the information recorded in the magnetic recording media by a magnetoresistive (MR) sensor element (not shown). - Referring to
FIG. 4 ,magnetic recording head 1 comprises a combined read-write head. The down-track cross-sectional view is taken along a center plane (44-44 inFIG. 5 ) formed orthogonal to the ABS 30-30, and that bisects themain pole layer 14. The read head is formed on asubstrate 81 that may be comprised of AITiC (alumina+TiC) with anoverlying insulation layer 82 that is made of a dielectric material such as alumina. The substrate is typically part of a slider formed in an array of sliders on a wafer. After the combined read head/write head is fabricated, the wafer is sliced to form rows of sliders. Each row is typically lapped to afford an ABS before dicing to fabricate individual sliders that are used in a magnetic recording device. Abottom shield 84 is formed oninsulation layer 82. - A magnetoresistive (MR) element also known as MR sensor 86 is formed on
bottom shield 84 at the ABS 30-30 and typically includes a plurality of layers (not shown) including a tunnel barrier formed between a pinned layer and a free layer where the free layer has a magnetization (not shown) that rotates in the presence of an applied magnetic field to a position that is parallel or antiparallel to the pinned layer magnetization.Insulation layer 85 adjoins the backside of the MR sensor, andinsulation layer 83 contacts the backsides of the bottom shield andtop shield 87. The top shield is formed on the MR sensor. An insulation layer 88 and a top shield (S2B) layer 89 are sequentially formed on the top magnetic shield. Note that the S2B layer 89 may serve as a flux return path (RTP) in the write head portion of the combined read/write head. Thus, the portion of the combined read/write head structure formed below layer 89 inFIG. 4 is typically considered as the read head. In other embodiments (not shown), the read head may have a dual reader design with two MR sensors, or a multiple reader design with multiple MR sensors. - The present disclosure anticipates that various configurations of a write head may be employed with the read head portion. In the exemplary embodiment,
magnetic flux 70 in main pole (MP)layer 14 is generated with flowing a current through bucking coil 80 b and drivingcoil 80 d that are below and above the MP layer, respectively, and are connected by interconnect 51.Magnetic flux 70 exits the MP layer atpole tip 14 p at the ABS 30-30 and is used to write a plurality of bits onmagnetic medium 140. Magnetic flux 70 b returns to the MP through a trailing loop comprised of trailingshields PP3 shield 26, andtop yoke 18 x. There is also a leading return loop formagnetic flux 70 a that includes leadingshield 11, leading shield connector (LSC) 33, S2 connector (S2C) 32, return path 89, and back gap connection (BGC) 62. The magnetic core may also comprise abottom yoke 35 below the MP layer.Dielectric layers protection layer 27 covers the PP3 trailing shield and is made of an insulating material such as alumina. Above the protection layer and recessed a certain distance u from the ABS 30-30 is anoptional cover layer 29 that is preferably comprised of a low coefficient of thermal expansion (CTE) material such as SiC.Overcoat layer 28 is formed as the uppermost layer in the write head. - Referring to
FIG. 5 , an ABS view of an existing MAMR writer known to the inventors is shown where there is all wrap around (AWA) shield structure surrounding theMP 14. MP trailing side 14t 1 is bisected by center plane 44-44 that also passes through MP leading side 14b 1. There areside gaps 15 made of a dielectric material adjoining each MP side 14s, a leadinggap 13 between the MP leading side and leading shield (LS) 11, and write gap (WG) 16 formed on plane 41-41 that includes the MP trailing side, and a top surface of side shields 12. A first trailing shield (hot seed layer) 17 is formed on the WG and has a width w2 equal to that of the WG where w2>track width (TW) also known as the pole width (PW). A second trailing shield (write shield) 18 is formed onside shields 12 at plane 41-41, on hot seedtop surface 17 t, and adjoinssides LS 11 may have a top layer 11 b called a leading edge taper (LET), and abottom layer 11 a. The LET contacts a bottom surface of each side shield at plane 42-42 that is parallel to plane 41-41, and is orthogonal to the ABS and the center plane.STO device 22 is formed within the WG and between the MP trailing side and hot seed layer. - Referring to
FIG. 6A , a first embodiment of the present disclosure is illustrated where the MAMR writer inFIG. 5 is modified with the insertion of ahead sink 19 within the WG on each side of center plane 44-44. Preferably, the WG is made of an electrically insulatinglayer 16 a that is a composite of a dielectric material with another material having high thermal conductivity that is not restricted to be an insulator. For example, the insulating layer may be an ALD layer comprised of alumina and diamond. The insulating layer is preferably a conformal layer of thickness/width b from 5 Angstroms to 80 Angstroms that adjoins STO device sides 22 s and is formed on top surfaces of eachside shield 12 andside gap 15 at plane 41-41. Each heat sink has a first inner side 19s 2 that is separated from a STO side by insulating layer width b, and an outer side 19s 1 that contacts write shield (WS) 18 at a width a from 0.05 micron to 1 micron from the inner side. -
Heat sink 19 is made of a material such as Ru, Cu, Au, Pt, Pd, W, Ir, diamond-like carbon, or atomic layer deposited diamond with a thermal conductivity that is preferably >100 Watts per meter-Kelvin (W/m-k) to enable efficient heat dissipation throughhot seed layer 17,WS 18, and side shields 12. STO thickness t is typically from 5 Angstroms to 250 Angstroms at the ABS. Note that heat sink thickness t1=(t−b) in the exemplary embodiment. In an alternative embodiment, t1>(t−b) so that heat sink thickness may be optimized independently of STO thickness and provide flexibility to improve performance.Top surface 19 t of each heat sink at the ABS is at plane 45-45 that includes theSTO top surface 22 t, and insulating layertop surface 16 t where plane 45-45 is parallel to plane 41-41. The heat sink top surface adjoins a bottom surface of the hot seed layer that is also referred to as a high moment trailing shield preferably made of FeCo, FeCoNi, FeCoN, or NiFe with a magnetization saturation (Ms) from 19 kiloGauss (kG) to 24 kG. - Referring to
FIG. 6B , a top view of eachheat sink 19 adjacent toSTO 22 is shown at plane 45-45 with the hot seed layer and overlying MAMR writer layers removed. According to the exemplary embodiment,STO 22 hassides 22 s that extend from afront side 22 f at the ABS 30-30 to abackside 22 b, and have a stripe height (SH) of 10 nm to 100 nm. Insulatinglayer 16 a has a front side 16 f at the ABS, and eachheat sink 19 has the SH between a front side 19 f at the ABS to a backside 19 b.Insulation layer 47 may be considered part of the composite WG and adjoins the STO backside and heat sink backsides, and is formed betweenWS 18 on each side of center plane 44-44. In other embodiments (not shown), the heat sink backside may be at a greater distance than SH from the ABS. - According to another embodiment of the present disclosure depicted in a top-down view in
FIG. 6C ,heat sink 19 forms a continuous layer aroundSTO 22. In particular, insulatinglayer 16 a may wrap aroundSTO 22 and form a continuous layer of width b that adjoins STO sides 22 s andbackside 22 b. The heat sink now has abackside 19 e that extends in a cross-track direction fromWS 18 on one side of center plane 44-44 to the WS on the other side of the center plane.Heat sink backside 19 e is at height h preferably >100 nm from a heat sink second inner side 19s 3 that is adjacent and parallel to the STO backside. This heat sink embodiment has the advantage of better heat dissipation compared with the heat sink inFIG. 6B , but requires additional fabrication steps. - The inventors have previously disclosed multiple configurations for STO devices that may be employed to generate a RF field on the magnetic grains near the transition being written in a magnetic medium during a write process. For example, in related U.S. Pat. No. 9,230,571, a STO device is described wherein a SP layer is formed between a seed layer and a non-magnetic (NM) spacer, and an OL is between the NM spacer and a cap layer.
- Referring to
FIG. 7A , a MAMR writer having a STO device 22-1 is shown and features a STO stack wherein a second non-magnetic (NM2)layer 4,SP layer 5, first non-magnetic (NM1)layer 2, andOL 3 are sequentially formed on MP tapered trailing side 14t 1, and where the OL top surface contacts a portion ofhot seed layer 17. This STO configuration was previously described in related application Ser. No. 16/197,586. Here,MP 14 has a sufficiently large localmagnetic field 70 to write themedia bit 9 withmagnetization 9 m onmagnetic medium 140.Magnetic flux 70 in the MP proceeds through the ABS 30-30 and intomedium layer 142 and soft underlayer (SUL) 141. A portion of the flux 70 b is collected byhot seed layer 17 and then returns to the MP through a trailing loop (such as one shown inFIG. 4 ). STO 22-1 is at the ABS and is formed on the MP tapered trailing side 14t 1, which connects with a MP top surface 14t 2 that is aligned orthogonal to the ABS. The MP leading side 14b 1 is also tapered and connects with the MP bottom surface 14b 2. Writegap field flux 70 g is shown across the STO in the general direction from the MP to hot seed layer. - The microwave assisted magnetic recording (MAMR) aspect involves applying current Ia from a direct current (dc)
source 50 throughlead 57 to theMP 14 and through STO 22-1 tohot seed layer 17 and then returning throughlead 58 to the dc source. The applied current is spin polarized bySP layer 5, and produces a spin torque onOL 3 that drives OL magnetization into aprecessional state 3 p, which in turn produces a RF field 77 onbit magnetization 9 m. Bit magnetization oscillates into a precessional state (not shown) thereby reducing a switching field ofmedium bit 9 so that the bit can be switched using asmaller MP field 70. Note thatMP magnetization 70 m proximate to MP tapered trailing side 14t 1 is substantially parallel toSP magnetization 5 m and in the general direction of theWG field flux 70 g from theMP 14 tohot seed layer 17. - As indicated in
FIG. 7B , the oscillation inOL 3 is in a dynamic state called aprecessional state 3 p where the cone angle a increases with increasing applied current density. In a first range of relatively low current density shown on the left side of the drawing,OL magnetization 3 m is in a direction pointing substantially toward the hot seed layer (not shown). However, if the applied current increases to a second range of relatively high current density,magnetization 3 m flips to a direction substantially pointing away from the hot seed layer as depicted on the right side of the drawing.Precessional state 3 p′ has a cone angle β that decreases with increasing current density. At sufficiently high current density, angle β is proximate to 0 degrees (pointing toward the MP tapered trailing side). It should be understood, that in bothprecessional states precessional state 3 p′ will return toprecessional state 3 p if applied current density is reduced by a sufficient amount. - In an alternative STO configuration 22-2 shown in
FIG. 8 , the MAMR writer structure and STO layers inFIG. 7A are retained except the positions ofSP layer 5 andFGL 3 are switched so thatNM1 spacer 2,OL 3,NM2 spacer 4, andSP layer 5 are sequentially formed on the MP tapered trailing side 14t 1. Again,MP magnetization 70 m,OL magnetization 3 m, andSP magnetization 5 m are substantially towardhot seed layer 17 while OL magnetization hasprecessional state 3 p when a first range of current density for current Ia is applied. In this case, I. is applied from the hot seed layer toMP 14 in order forSP layer 5 to generate spin torque on the OL that drives the OL into aprecessional state 3 p (or 3 p′) to provide a MAMR effect onbit magnetization 9 m during a write process. As a result, asmaller MP field 70 is needed to switch the bit magnetization. - In
FIG. 9 , an alternative STO configuration is shown that was disclosed in related application Ser. No. 16/197,586 and represents a modification of STO device 22-2. In particular, spin torque on OL magnetization is enhanced with the insertion of a second SP layer on an opposite side ofOL 3 with respect toSP layer 5, and where the second SP layer has a magnetization that is substantially anti-parallel tomagnetization 5 m. In STO device 22-3, seed layer 8, and a SP1/AF coupling/SP2 stack oflayers 7 a/ 7 b/ 7 c are sequentially formed on MP tapered trailing side 14t 1 whereSP2 layer 7 c adjoins a bottom surface ofNM1 spacer 2. Therefore, when Ia is applied fromhot seed layer 17 toMP 14, OL magnetization is driven into aprecessional state 3 p (or 3 p′) because of additive spin torque fromSP2 layer 7 c andSP layer 5.SP1 layer 7 a with magnetization 7m 1 and SP2 layer with magnetization 7m 2 are driven into precessional states, and together with theOL 3 precessional state produce acumulative RF field 77 x that is typically greater than RF field 77 in previous embodiments to further reduce theMP field 70 required to switchbit magnetization 9 m. -
FIG. 10 depicts another STO device 22-4 that may be used in the MAMR writer of the present disclosure. In this embodiment,NM2 spacer 4,OL 3,NM1 spacer 2,SP2 layer 7 c, AF coupling layer 7 b,SP1 layer 7 a, andcapping layer 8 c are sequentially formed on MP tapered trailing side 14t 1. Accordingly,SP layer 5 is effectively merged into the MP proximate to STO 22-4 such that applied current Ia is spin polarized byMP magnetization 70 m to exert a spin torque onOL 3 that together with spin torque from the SP2 layer drives the OL intoprecessional state 3 p (or 3 p′ depending on Ia current density). As in the previous embodiment,precessional state 3 p together with precessional magnetizations 7m 1, 7m 2 in SP1 and SP2 layers, respectively, provides acumulative RF field 77 x onbit magnetization 9 m thereby requiring alower MP field 70 to switch the bit magnetization during a write process. - In related patent application Ser. No. 16/209,151, additional STO designs are described where both of the MAMR effect and a MP field enhancement (as a result of OL flipping to
precessional state 3 p′ that reducesWG field flux 70 g) are simultaneously optimized rather than enlarging one at the expense of the other. As mentioned earlier, the advantage of the heat sink structure of the present disclosure is not limited to a specific STO design but is beneficial to any MAMR writer wherein the elevated temperature of the STO is affecting the reliability of the STO element. - In all embodiments, NM1 and
NM2 spacers adjacent SP layer 5 andSP2 layer 7 c (when present) do not encounter strong spin-flip scattering in the spacers. In other embodiments, one or both NM spacers may be a metal oxide layer similar to the metal oxide spacer that was disclosed in related U.S. Pat. No. 9,230,571. The spacers also have sufficient thickness to prevent strong ferromagnetic coupling between magnetic layers on each side thereof. Each of SP5,OL 3, andSP1 layer 7 a and SP2 layer 7 b (when present) may be a single layer or alloy that is Fe, Co, Ni, CoFe, NiFe, or CoFeNi, for example, or a multilayer of one or more of the aforementioned elements and alloys. - In order to demonstrate the benefit of a MAMR writer having a heat sink formed adjacent to a STO device as disclosed herein, a finite element modeling (FEM) simulation was performed to confirm the quantitative reduction of STO device temperature rise during a typical 140 mV operation. The following STO dimensions were used in the FEM simulation: 40 nm width; 17 nm thickness, and 40 nm stripe height (SH) where SH is essentially equal to a throat height dimension in the MAMR writer. The heat sink in rows 3-6 of Table 1 below has a thickness (t1)=17 nm (
FIG. 6A ), and a cross-track width “a”=500 nm, and the ALD (alumina+diamond)insulator 16 a has width “b”=2 nm as shown inFIG. 6C . -
TABLE 1 FEM simulation results for MAMR writer configurations using SH = 40 nm, total resistance of 31.1 ohm = 20.6 ohm from STO device + 10.5 ohm from leads Temp. rise (deg. C.) Thermal @140 mV conductivity Heat sink configuration in STO (W/m-K) None - all alumina WG 129 None - all AIN in WG 122 AIN = 40 Ru at back of STO with 2 nm 122 Ru = 117 ALD insulator Ru at back of STO & at ABS 115 (Emb. 2) with 2 nm ALD insulator Cu at back of STO & at ABS 103 Cu = 387 (Emb. 2) with 2 nm ALD insulator Diamond at back of STO & at ABS 79 Diamond = 2000 (Emb. 2) - The STO was modeled as a single column of electrical conductor and its resistivity was tuned to match with the assumed STO device resistance and lead resistance of 20.6 ohm and 10.5 ohm, respectively. The results in Table 1 show that replacing alumina with AIN only generated a modest decrease in the temperature rise within the STO device. When an ALD insulator having a 2 nm width, and a Ru or Cu heat sink is formed behind and adjacent to the STO as in the second embodiment (Emb. 2), there is an 11% and 20% improvement, respectively, in the temperature rise. Note that when a Ru heat sink layer in combination with an ALD insulator is formed only behind the STO device, there is no improvement over the pure AlN insulator example. Optimum performance (40% temperature rise reduction) is achieved when a heat sink made of diamond with a thermal conductivity=2000 W/m-K is employed that is considerably greater than the values for Ru (117 W/m-K) and Cu (387 W/m-K). The results demonstrate that the heat sink structure provides a significant temperature rise reduction in the adjacent STO device when the MAMR writer of the present disclosure is operated at the same BHV compared with a MAMR writer without the heat sink. Alternatively, for the same EM reliability (same temperature rise as a MAMR writer without the heat sink), the MAMR writer disclosed herein allows higher BHV to enhance performance and enable higher area density capability (ADC).
- The present disclosure also encompasses a process sequence for fabricating a heat sink adjacent to a STO device according to an embodiment described herein. A partially formed MAMR writer structure including
MP tip 14 p that adjoinsside gaps 15 and leadinggap 13 inFIG. 11A is provided according to a conventional process sequence. Side shield top surfaces 12 t are coplanar with a trailing edge of the MP tapered trailing side 14t 1 at plane 41-41, which is orthogonal to the subsequently formed ABS plane.FIG. 11B shows the down-track cross-sectional view at plane 44-44 inFIG. 11A . MP tapered trailing side 14t 1 has a taper angle θ and is coplanar with a tapered front side 47 f ofdielectric layer 47 a made of Al2O3 or SiO2 that is formed on MP top surface 14t 2. Note that the eventual ABS, hereafter referred to as ABS plane 30-30, is not determined until a lapping process is performed after all layers in the MAMR writer structure are formed. - In
FIG. 12 , a STO stack oflayers 22 that may have one of the configurations described previously is deposited on the MP tapered trailing side 14t 1 and ondielectric layer 47. The stack of layers is preferably conformal to the underlying topography and has a uniform thickness. Next, a first photoresist layer is coated on the STO stack of layers, and is patternwise exposed and developed to provide aphotoresist mask 72 havingsides 72 s and a cross-track width TW that is bisected by plane 44-44. The photoresist mask pattern is etch transferred through the STO stack of layers using one or both of an ion beam etch (IBE) and reactive ion etch (RIE) process, for example, thereby formingSTO device 22 withsides 22 s separated by track width TW. In some embodiments, the IBE/RIE process may simultaneously generate a backside on the STO device. Thereafter,insulator 16 a having thickness b is conformally deposited on eachside shield 12, and onside gaps 15, and with a width b on STO device sides 22 s using an atomic layer deposition (ALD) method, for example. - Referring to
FIG. 13 , a top-down view is depicted of the partially formed MAMR writer after the first photoresist is removed by a conventional method, and a second photoresist layer is patternwise exposed and developed to form afront portion 73 a of the second photoresist layer above the STO device between the ABS plane 30-30 and up to a stripe height (SH). There is also a back portion 73 b of the second photoresist layer extending from afront side 73 f at the SH toward a backside (not shown) of the MAMR writer.Heat sink 19 is deposited oninsulator 16 a on each side of the center plane 44-44 in regions not covered by thesecond photoresist layer 73 a/ 73 b. At this point,heat sink 19 extends from the ABS plane to a backside 19 b at the SH, and has an inner side 19s 2 adjoininginsulator 16 a at a width b from eachSTO side 22 s. - Referring to
FIG. 14 , an ABS view of the MAMR writer inFIG. 13 is shown after the second photoresist layer is removed by conventional means. A heat sinktop surface 19 t that is coplanar withSTO top surface 22 t at plane 45-45 is formed. Eachheat sink 19 has a thickness t1. - In
FIG. 15 , a down-track cross-sectional view at plane 44-44 is depicted for the partially formed MAMR writer structure after a third photoresist is patternwise exposed and patterned to formphotoresist mask 74 that extends from the ABS plane 30-30 to abackside 74 e at the SH from the ABS plane. Preferably,photoresist backside 74 e is aligned aboveSTO backside 22 b. Thereafter, insulation layer 47 b having thickness dl is deposited ontop surface 47 t ofinsulation layer 47 a and on portions of MP tapered trailing side 14t 1 that are not covered by the photoresist mask. Note that the SH may be less than height c atedge 14 x where the MP tapered trailing side 14t 1 joins MP top surface 14t 2. Also, insulation layers 47 a, 47 b may be comprised of the same material and designated asinsulation layer 47. - Referring to
FIG. 16 , afterphotoresist mask 74 is removed by a conventional method,hot seed layer 17 is deposited onSTO top surface 22 t and on heat sinktop surface 19 t. Next, a fourth photoresist layer is coated on the hot seed layer and is patterned to formphotoresist mask 75 havingsides 75 s and a width w2 where w2>TW. Another IBE or RIE step is employed to transfer the photoresist mask pattern through exposed portions of the hot seed layer,heat sink 19, andinsulator 16 a, and stops on side shieldtop surface 12 t at plane 41-41 thereby generating hotseed layer side 17 s, heat sink far (outer) side 19s 1, andinsulator side 16 s on each side of center plane 44-44. - Referring to
FIG. 17 ,photoresist mask 75 is removed. Then,WS 18 is deposited onhot seed layer 17 and on side shields 12. A fifth photoresist layer is coated and patterned on the WS to providephotoresist mask 76 having abackside 76 e at height s from the ABS plane 30-30 where s is generally larger than height c ofMP edge 14 x described earlier. -
FIG. 18 depicts the partially formed MAMR writer structure inFIG. 17 after a third RIE or IBE step is performed to transfer the photoresist mask pattern through exposed regions ofhot seed layer 17 andWS 18, and stops attop surface 47t 2 ofinsulation layer 47 thereby forminghot seed backside 17 e andWS backside 18 e at height s from the ABS plane 30-30. Thereafter, a conventional process flow is followed to complete the MAMR writer structure. According to one embodiment, a combined read-write head 1 shown inFIG. 4 is formed after a lapping process is completed. - While the present disclosure has been particularly shown and described with reference to, the preferred embodiments thereof, it will be understood by those skilled in the art that various changes in form and details may be made without departing from the spirit and scope of this disclosure.
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Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10923145B2 (en) * | 2017-10-02 | 2021-02-16 | Western Digital Technologies, Inc. | Microwave-assisted magnetic recording (MAMR) write head with compensation for DC shunting field |
US10997989B1 (en) * | 2019-06-11 | 2021-05-04 | Western Digital Technologies, Inc. | Bilayer hot seed to reduce gap field for magnetic recording heads |
US11011193B1 (en) | 2020-02-04 | 2021-05-18 | Headway Technologies, Inc. | Dual flux change layer (FCL) assisted magnetic recording |
US11043232B1 (en) * | 2020-02-04 | 2021-06-22 | Headway Technologies, Inc. | Spin torque reversal assisted magnetic recording (STRAMR) device having a width substantially equal to that of a traililng shield |
US11043234B2 (en) | 2019-08-21 | 2021-06-22 | Headway Technologies, Inc. | Spin transfer torque oscillator (STO) with spin torque injection to a flux generating layer (FGL) from two sides |
US11152021B1 (en) * | 2020-11-12 | 2021-10-19 | Headway Technologies, Inc. | Perpendicular magnetic recording (PMR) writer with tunable pole protrusion (TPP) designs for 2 terabytes/platter (TB/P) and beyond |
US11170802B2 (en) | 2019-07-10 | 2021-11-09 | Headway Technologies, Inc. | Writer with HMTS (high moment trailing shield) aligned with spin layer |
US11257514B2 (en) * | 2020-06-25 | 2022-02-22 | Western Digital Technologies, Inc. | Magnetic recording devices having negative polarization layer to enhance spin-transfer torque |
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US11355141B2 (en) * | 2019-07-10 | 2022-06-07 | Headway Technologies, Inc. | Writer with narrower high moment trailing shield |
US11417356B1 (en) * | 2019-07-12 | 2022-08-16 | Western Digital Technologies, Inc. | Write assist stack to reduce resistance and improve reliability |
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Family Cites Families (76)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6710973B2 (en) | 2000-09-18 | 2004-03-23 | Hitachi, Ltd. | Single pole type recording head including tapered edges |
JP3740361B2 (en) | 2000-10-23 | 2006-02-01 | 株式会社日立グローバルストレージテクノロジーズ | Magnetic head for perpendicular recording and magnetic disk drive equipped with the same |
JP2002298309A (en) | 2001-01-26 | 2002-10-11 | Alps Electric Co Ltd | Magnetic head and its manufacturing method |
US6954340B2 (en) | 2001-05-23 | 2005-10-11 | Seagate Technology Llc | Perpendicular magnetic recording head with nonmagnetic write gap greater than twice side shield gap distance |
CN100520915C (en) | 2001-07-24 | 2009-07-29 | 希捷科技有限公司 | Write head for high anisotropy media |
US6809899B1 (en) | 2001-08-20 | 2004-10-26 | Western Digital (Fremont), Inc. | Magnetic heads for perpendicular recording with trapezoidal pole tips |
US7009812B2 (en) | 2003-09-29 | 2006-03-07 | Hitachi Global Storage Technologies Netherlands B.V. | Magnetic transducer for perpendicular magnetic recording with single pole write head with trailing shield |
US7233457B2 (en) | 2003-12-16 | 2007-06-19 | Seagate Technology Llc | Head for perpendicular recording with reduced erasure |
JP4260002B2 (en) | 2003-12-24 | 2009-04-30 | ヒタチグローバルストレージテクノロジーズネザーランドビーブイ | Magnetic head, manufacturing method thereof, and magnetic recording / reproducing apparatus |
US7649712B2 (en) | 2004-08-31 | 2010-01-19 | Hitachi Global Storage Technologies Netherlands B.V. | Self aligned wrap around shield for perpendicular magnetic recording |
JP4763264B2 (en) | 2004-10-25 | 2011-08-31 | ヒタチグローバルストレージテクノロジーズネザーランドビーブイ | Magnetic head for perpendicular recording |
US7898773B2 (en) | 2006-02-02 | 2011-03-01 | Headway Technologies, Inc. | Perpendicular magnetic recording head with a side write shield |
US7551394B2 (en) | 2006-07-12 | 2009-06-23 | Headway Technologies, Inc. | Magnetic head for perpendicular magnetic recording having a multilayer shield structure and method of manufacturing same |
US8467147B2 (en) | 2006-10-13 | 2013-06-18 | Headway Technologies, Inc. | Magnetic head for perpendicular magnetic recording and method of manufacturing same |
US7589600B2 (en) | 2006-10-31 | 2009-09-15 | Seagate Technology Llc | Spin oscillator device |
US7724469B2 (en) | 2006-12-06 | 2010-05-25 | Seagate Technology Llc | High frequency field assisted write device |
US7835111B2 (en) | 2007-02-15 | 2010-11-16 | Hitachi Global Storage Technologies Netherlands B.V. | Magnetic write head with upper return pole optimization for reduced trailing shield protrusion |
JP4358279B2 (en) | 2007-08-22 | 2009-11-04 | 株式会社東芝 | Magnetic recording head and magnetic recording apparatus |
US7924528B2 (en) | 2007-09-05 | 2011-04-12 | Headway Technologies, Inc. | Magnetic head for perpendicular magnetic recording and method of manufacturing same |
JP4929108B2 (en) | 2007-09-25 | 2012-05-09 | 株式会社東芝 | Magnetic head and magnetic recording apparatus |
JP2009080878A (en) | 2007-09-25 | 2009-04-16 | Toshiba Corp | Magnetic recording head and magnetic recording device |
JP2009080875A (en) | 2007-09-25 | 2009-04-16 | Toshiba Corp | Magnetic head and magnetic recording system |
US7978442B2 (en) | 2007-10-03 | 2011-07-12 | Tdk Corporation | CPP device with a plurality of metal oxide templates in a confining current path (CCP) spacer |
US7963024B2 (en) | 2007-10-10 | 2011-06-21 | Hitachi Global Storage Technologies Netherlands B.V. | Method of manufacturing a magnetic write head for perpendicular magnetic recording |
US8068312B2 (en) | 2007-11-21 | 2011-11-29 | Hitachi Global Technologies Netherlands B.V. | Perpendicular magnetic write head with stitched notched trailing shield |
US8057925B2 (en) | 2008-03-27 | 2011-11-15 | Magic Technologies, Inc. | Low switching current dual spin filter (DSF) element for STT-RAM and a method for making the same |
US8077433B2 (en) | 2008-06-03 | 2011-12-13 | Headway Technologies, Inc. | Thin-film magnetic head, method of manufacturing the same, head gimbal assembly, and hard disk drive |
JP5377893B2 (en) | 2008-06-19 | 2013-12-25 | 株式会社東芝 | Magnetic head assembly and magnetic recording / reproducing apparatus |
US20110211271A1 (en) | 2008-11-03 | 2011-09-01 | Ka Wei Ng | Trapping electron assisted magnetic recording system and method |
US8270110B2 (en) | 2008-12-29 | 2012-09-18 | Headway Technologies, Inc. | Magnetic head for perpendicular magnetic recording having side shield layer and method of manufacturing same |
US8264792B2 (en) | 2009-05-04 | 2012-09-11 | Headway Technologies, Inc. | PMR writer device with multi-level tapered write pole |
US8446690B2 (en) | 2009-08-17 | 2013-05-21 | HGST Netherlands B.V. | Perpendicular magnetic recording write head with spin torque oscillator for fast switching of write pole magnetization |
US8310786B2 (en) | 2009-09-09 | 2012-11-13 | Hitachi Global Storage Technologies Netherlands B.V. | Asymmetric writer for shingled magnetic recording |
US7982996B2 (en) | 2009-12-07 | 2011-07-19 | Hitachi Global Storage Technologies Netherlands B.V. | Perpendicular magnetic recording write head and system with improved spin torque oscillator for microwave-assisted magnetic recording |
US8027110B1 (en) | 2010-07-27 | 2011-09-27 | Tdk Corporation | Apparatus for measuring magnetic field of microwave-assisted head |
JP4956659B2 (en) | 2010-10-14 | 2012-06-20 | 株式会社東芝 | Head gimbal assembly and disk device provided with the same |
US8203389B1 (en) | 2010-12-06 | 2012-06-19 | Headway Technologies, Inc. | Field tunable spin torque oscillator for RF signal generation |
US8493687B2 (en) | 2010-12-09 | 2013-07-23 | Headway Technologies, Inc. | Magnetic head for perpendicular magnetic recording with shield around main pole |
US8749919B2 (en) | 2010-12-09 | 2014-06-10 | Headway Technologies, Inc. | Magnetic head for perpendicular magnetic recording with shield around main pole |
US8477452B2 (en) | 2010-12-09 | 2013-07-02 | Headway Technologies, Inc. | Magnetic head for perpendicular magnetic recording having a tapered main pole |
US8604886B2 (en) | 2010-12-20 | 2013-12-10 | Intel Corporation | Spin torque oscillator having multiple fixed ferromagnetic layers or multiple free ferromagnetic layers |
US8460805B1 (en) | 2010-12-23 | 2013-06-11 | Seagate Technology Llc | Magnetic layers |
SG185900A1 (en) | 2011-05-20 | 2012-12-28 | Agency Science Tech & Res | Magnetoresistive device |
US8462461B2 (en) | 2011-07-05 | 2013-06-11 | HGST Netherlands B.V. | Spin-torque oscillator (STO) with magnetically damped free layer |
US8295008B1 (en) | 2011-07-22 | 2012-10-23 | Headway Technologies, Inc. | Magnetic head for perpendicular magnetic recording having a main pole and a shield |
US8634163B2 (en) | 2011-07-27 | 2014-01-21 | HGST Netherlands B.V. | Dual reverse microwave assisted magnetic recording (MAMR) and systems thereof |
US8310787B1 (en) | 2011-09-27 | 2012-11-13 | Headway Technologies, Inc. | Thin-film magnetic head, method of manufacturing the same, head gimbal assembly, and hard disk drive |
US8582241B1 (en) | 2012-05-23 | 2013-11-12 | Western Digital (Fremont), Llc | Method and system for providing a magnetic transducer having a high moment bilayer magnetic seed layer for a trailing shield |
US8427781B1 (en) | 2012-08-08 | 2013-04-23 | Headway Technologies, Inc. | Magnetic head for perpendicular magnetic recording having a main pole and a shield |
US8582240B1 (en) | 2012-08-29 | 2013-11-12 | Headway Technologies, Inc. | Magnetic recording assisted by spin torque oscillator with a radio frequency current bias |
US9047888B2 (en) | 2012-12-20 | 2015-06-02 | HGST Netherlands B.V. | MAMR head adapted for high speed switching |
US8767347B1 (en) | 2013-05-28 | 2014-07-01 | Headway Technologies, Inc. | Magnetic head for perpendicular magnetic recording having two side shields |
US9076463B2 (en) | 2013-08-09 | 2015-07-07 | Kabushiki Kaisha Toshiba | Magnetic recording head and disk device with the same |
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US9361912B1 (en) | 2015-04-20 | 2016-06-07 | Headway Technologies, Inc. | High moment side shield design for area density improvement of perpendicular magnetic recording (PMR) writer |
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US9406317B1 (en) | 2015-08-06 | 2016-08-02 | Headway Technologies, Inc. | Perpendicular magnetic recording (PMR) write head with improved shapes of side shield and main pole |
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US10032469B2 (en) | 2015-11-05 | 2018-07-24 | Headway Technologies, Inc. | Perpendicular magnetic recording (PMR) writer with improved trailing shield design |
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US9824701B2 (en) | 2016-04-26 | 2017-11-21 | Tdk Corporation | Microwave assisted magnetic recording head with spin torque oscillator corner angle relationship, head gimbal assembly, and magnetic recording device |
US9805746B1 (en) | 2016-06-28 | 2017-10-31 | Western Digital Technologies, Inc. | Low magnetic flux density interface layer for spin torque oscillator |
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