US20190341710A1 - Device for driving motor - Google Patents
Device for driving motor Download PDFInfo
- Publication number
- US20190341710A1 US20190341710A1 US16/279,219 US201916279219A US2019341710A1 US 20190341710 A1 US20190341710 A1 US 20190341710A1 US 201916279219 A US201916279219 A US 201916279219A US 2019341710 A1 US2019341710 A1 US 2019341710A1
- Authority
- US
- United States
- Prior art keywords
- board
- power
- motor
- driving device
- electrically connected
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02K—DYNAMO-ELECTRIC MACHINES
- H02K11/00—Structural association of dynamo-electric machines with electric components or with devices for shielding, monitoring or protection
- H02K11/30—Structural association with control circuits or drive circuits
- H02K11/33—Drive circuits, e.g. power electronics
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/7005—Guiding, mounting, polarizing or locking means; Extractors
- H01R12/7011—Locking or fixing a connector to a PCB
- H01R12/7047—Locking or fixing a connector to a PCB with a fastener through a screw hole in the coupling device
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02K—DYNAMO-ELECTRIC MACHINES
- H02K11/00—Structural association of dynamo-electric machines with electric components or with devices for shielding, monitoring or protection
- H02K11/20—Structural association of dynamo-electric machines with electric components or with devices for shielding, monitoring or protection for measuring, monitoring, testing, protecting or switching
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02K—DYNAMO-ELECTRIC MACHINES
- H02K9/00—Arrangements for cooling or ventilating
- H02K9/02—Arrangements for cooling or ventilating by ambient air flowing through the machine
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M7/00—Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
- H02M7/003—Constructional details, e.g. physical layout, assembly, wiring or busbar connections
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M7/00—Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
- H02M7/42—Conversion of dc power input into ac power output without possibility of reversal
- H02M7/44—Conversion of dc power input into ac power output without possibility of reversal by static converters
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02P—CONTROL OR REGULATION OF ELECTRIC MOTORS, ELECTRIC GENERATORS OR DYNAMO-ELECTRIC CONVERTERS; CONTROLLING TRANSFORMERS, REACTORS OR CHOKE COILS
- H02P27/00—Arrangements or methods for the control of AC motors characterised by the kind of supply voltage
- H02P27/04—Arrangements or methods for the control of AC motors characterised by the kind of supply voltage using variable-frequency supply voltage, e.g. inverter or converter supply voltage
- H02P27/06—Arrangements or methods for the control of AC motors characterised by the kind of supply voltage using variable-frequency supply voltage, e.g. inverter or converter supply voltage using dc to ac converters or inverters
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0215—Grounding of printed circuits by connection to external grounding means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
- H05K7/1422—Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
- H05K7/1427—Housings
- H05K7/1432—Housings specially adapted for power drive units or power converters
- H05K7/14322—Housings specially adapted for power drive units or power converters wherein the control and power circuits of a power converter are arranged within the same casing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
Definitions
- the present disclosure relates to a motor-driving device with an improved structure of a circuit module.
- a motor-driving device refers to a device that can control a speed of a motor with a high efficiency by varying a voltage and frequency of a power supplied from an external power supply and supplying the power with the varied voltage and frequency to the motor.
- FIG. 1 is a perspective view of a conventional motor-driving device.
- FIG. 2 shows a top view of a conventional power board.
- a conventional motor-driving device may include a base 10 , heat-dissipating means 20 disposed below the base 10 , and a board assembly 30 disposed above the base 10 .
- the board assembly 30 includes a power board 31 positioned on the base 10 , a cap board 32 (a filter board) disposed on the power board 31 , and a control board 33 disposed on side faces of the cap board 32 and power board 31 . Though not shown, the board assembly may further include an input/output (TO) board on the cap board 32 .
- TO input/output
- the conventional power board 31 receives power from the IO board (not shown).
- the power board 31 receives AC power from the outside through the IO board, and then converts the AC power into DC power and then rectifies the DC power and then converts the rectified DC power to AC power.
- the power from the external power supply may have two types of flows as follows in the motor-driving device.
- the AC power input to an input terminal block 1 of the power board 31 is converted trough a rectifying section 2 to DC power including ripple.
- the DC power smoothed by a DC link of the cap board 32 is again applied to an inverter 3 through a DC terminal 7 of the power board 31 .
- the inverter 3 converts the DC power to AC power and outputs the AC power to an output terminal block 4 .
- DC power generated from the DC link 7 may be used as a power source for controlling the motor-driving device.
- the DC power generated from the DC link 7 may be applied to the control board 33 , a gate drive, a sensing and protection circuit 5 , and the like.
- the power flow and the signal flow may have a noise-vulnerable structure in which an intersection occurs between an output of the rectifying section 2 and an output of the inverter 3 , and thus interference therebetween occurs.
- cap board 32 is connected to a grounding screw 6 of the power board through a grounding wire 34 formed on the cap board.
- the grounding wire 34 connected to the power board 31 extends and is connected to the heat-dissipating means 20 .
- Such a structure of the conventional motor-driving device may cause malfunction of the device because the grounding wire 34 may absorb a high-frequency noise signal.
- the grounding wire 34 touches the heat-dissipating means 20 or the SMPS a sheath thereof may melt. This may cause power flow or signal flow interruption. Thus, malfunction of the device and burnout of the device may occur.
- a purpose of the present disclosure is to provides a motor-driving device with an improved structure in which the noise-vulnerability structure is removed by separating a power flow path and a signal flow path, thereby to minimize interference between components and to enable miniaturization of the device and to improve durability of the device.
- a motor-driving device for varying a voltage and frequency of power supplied from an external power source and supplying the varied power to a motor
- the device comprising: a middle base; heat-dissipating means disposed below the middle base; a first board disposed above the middle base; power-related components disposed on the first board and in a first region thereof, wherein the power-related components include a power input terminal, a rectifying module, an initial charging circuit, an inverting module, and an output terminal block; signal-related components disposed on the first board and in a second region thereof opposite to the first region, wherein the signal-related components include a switching mode power supply (SMPS), a gate drive circuit, and a sensing and protection circuit; a second board electrically connected to the first board; a direct-current (DC) link stage mounted on the second board, wherein the DC link stage is configured for storing power from the initial charging circuit and for supplying the power to the inverting module or the SM
- SMPS switching mode power supply
- the second board is disposed below the first board, wherein the DC link stage is mounted on a bottom face of the second board and is adjacent the heat-dissipating means.
- the first board and the second board are electrically connected to each other via a first female connector and a first male connector, or are electrically connected to each other via a bolt coupling.
- the first board and the third board are electrically connected to each other via a second female connector and a second male connector.
- the device further comprises an input/output (IO) board electrically connected to the third board.
- IO input/output
- the first board and the third board are electrically connected to each other via a second female connector and a second male connector, wherein the third board and the IO board are electrically connected to each other via a third female connector 341 and a third male connector.
- the device further include an input board disposed above the first board.
- the IO board and the third board are connected to a ground via a third female connector and a third male connector, wherein the third board is connected to a ground via a bolt coupling thereof with the heat-dissipating means, wherein the heat dissipating means is connected to a ground via coupling thereof with the input board through a bolt or metal rod, wherein a grounding terminal block is disposed on the input board, wherein the grounding terminal block is connected to an external ground.
- the boards are coupled to each other via a connector or a bolt. This removes wires use, and reduces an assembly tolerance, thereby to improve the device productivity.
- the performance of the device may be improved by positioning the power-related elements and the signal-related elements in one region and the other region of the first board respectively in a separating manner, thereby eliminating mutual electrical interference therebetween.
- the present disclosure has an effect that the control performance of components temperature may be improved by disposing the second board below the first board and positioning the DC link stage adjacent to the heat dissipating means. Further, the durability of the device is improved. An overall space utilization in the device is also improved, so that the device may be downsized.
- FIG. 1 is a perspective view of a conventional motor-driving device.
- FIG. 2 shows a top view of a conventional power board.
- FIG. 3 is a perspective view of a motor-driving device according to an embodiment of the present disclosure.
- FIG. 4 is a schematic representation of a power flow path and a signal flow path of a motor-driving device according to an embodiment of the present disclosure.
- FIG. 5 shows an IO board according to an embodiment of the present disclosure.
- FIG. 6 shows a third board according to an embodiment of the present disclosure.
- FIG. 7 shows an input board according to an embodiment of the present disclosure.
- FIG. 3 is a perspective view of a motor-driving device according to an embodiment of the present disclosure.
- FIG. 4 is a schematic representation of a power flow path and a signal flow path of a motor-driving device according to an embodiment of the present disclosure.
- FIG. 5 shows an IO board according to an embodiment of the present disclosure.
- FIG. 6 shows a third board according to an embodiment of the present disclosure.
- FIG. 7 shows an input board according to an embodiment of the present disclosure.
- a motor-driving device may include a housing 100 , heat-dissipating means 200 , and a board assembly 300 .
- the housing 100 may include a lower base 110 and a middle base 120 .
- the lower base 110 may define a bottom of the motor-driving device.
- the lower base 110 may be integrally formed with the heat-dissipating means 200 to be described later using injection molding or the like.
- the middle base 120 may be spaced from a top face of the lower base 110 by a predetermined spacing.
- the heat-dissipating means 200 may be disposed below the middle base 120 .
- the middle base 120 and the heat-dissipating means 200 may be fastened to each other via a hook coupling or bolt coupling 318 .
- the heat-dissipating means 200 refers to a heatsink. Heat generated from the board assembly 300 disposed on the middle base 120 may be absorbed and discharged out by the heat-dissipating means 200 .
- the board assembly 300 may include a first board 310 , a second board 320 , and a third board 330 .
- An IO board 340 and an input board 350 may be further included in the board assembly 300 .
- the first board 310 may be referred to as a power board, the second board 320 as a cap board, and the third board 330 as a control board.
- the first board 310 may be disposed on the middle base 120 .
- a fastening pin or fastening hook 121 may be formed on a periphery of the middle base 120 such that the first board 310 is spaced apart from a top face of the middle base 120 by a predetermined distance.
- a power input terminal 311 on the first board 310 and in one region thereof, a power input terminal 311 , a rectifying module 312 , an initial charging circuit 313 , an inverting module 314 , and an output terminal block 315 may be mounted.
- a Switching Mode Power Supply (SMPS) 316 On the first board 310 and in the other region thereof, a Switching Mode Power Supply (SMPS) 316 , a gate drive circuit, and a sensing and protection circuit 317 may be mounted.
- SMPS Switching Mode Power Supply
- the second board 320 may be arranged to be electrically connected to the first board 310 .
- a DC link stage 321 that stores power from the initial charging circuit 313 and transfers the power to the inverting module 314 or the SMPS 316 may be mounted on the second board 320 .
- the second board 320 may be disposed below the first board 310 .
- the DC link stage 321 may be mounted on a bottom face of the second board 320 so as to be adjacent to the heat-dissipating means 200 .
- the DC link stage 321 may be mounted in a space between the lower base 110 and the middle base 120 .
- the third board 330 is electrically connected to the first board 310 .
- the third board 330 may be oriented in a direction perpendicular to a top face of the lower base 110 .
- the third board 330 may receive a signal from the gate drive circuit, and sensing and protection circuit 317 mounted in the other region of the first board 310 .
- the IO board 340 may be electrically connected to the third board 330 .
- the user may control on and off of the board 340 .
- the input board 350 may be located on the first board 310 . Via the input board 350 , an external power may be input to the motor-driving device.
- the boards of the board assembly 300 of the motor-driving device according to an embodiment of the present disclosure may be interconnected as follows.
- the first board 310 and the second board 320 may be electrically connected to each other via a first male connector and a first female connector or may be electrically connected to each other via a bolt coupling 318 .
- the first board 310 and the third board 330 may be electrically connected to each other via a second male connector 319 and a second female connector 331 .
- the third board 330 and the IO board 340 may be electrically connected to each other via a third male connector 332 and a third female connector 341 .
- each of the first board 310 and the input board 350 is oriented horizontally and the first board 310 and the input board 350 are arranged vertically, the first board 310 and the input board 350 may be connected to each other via mutual coupling between terminals thereof.
- a power flow in a power flow path and a signal flow in a signal flow path according to the motor-driving device according to an embodiment of the present disclosure are as follows.
- the external AC power is input to the input board 350 and then this AC power is applied to the power input terminal 311 of the first board 310 .
- the AC power is applied to the power input terminal 311 in one region of the first board 310 , the AC power is rectified to the DC power through the rectifying module 312 . Thereafter, the DC power is moved to the initial charging circuit 313 .
- the DC power applied to the initial charging circuit 313 is applied to the DC link stage 321 of the second board 320 , and then applied to the inverting module 314 disposed in one region of the first board 310 and to the SMPS 316 disposed in the other region thereof.
- the inverting module 314 converts the DC power applied to the inverting module 314 into AC power, which then is applied to an external motor or the like through the output terminal block 315 .
- the DC power applied to the SMPS 316 may be applied to the gate drive circuit, and the sensing and protection circuit 317 , and the like, and finally applied to the third board 330 for control of the device.
- the motor-driving device includes, in a main power flow path, the rectifying module 312 , the initial charging circuit 313 , the DC link stage 321 , and the inverting module, all of which are mounted in one region of the first board 310 .
- the motor-driving device includes, in the signal flow path, the SMPS 316 , the gate drive circuit, and the sensing and protection circuit 317 , all of which are mounted in the other region of the first board 310 . In this manner, no electrical interference occurs between the components in the power flow path and the signal flow path, thereby reducing the noise.
- the DC link stage 321 which applies the DC power to the components in the power flow path and in the signal flow path, is located on the second board 320 , the electrical interference between the components in the power flow path and the signal flow path may be suppressed.
- the components in the power flow path and signal flow path are mounted on the single first board 310 .
- the second board 320 on which the DC link stage 321 is mounted may be disposed below the first board 310 . This may reduce the size of the device.
- a relatively bulky DC link stage 321 is placed adjacent to the heat-dissipating means 200 , which may improve miniaturization and heat-dissipating performance of the device.
- a grounding structure according to the motor-driving device according to an embodiment of the present disclosure is as follows.
- the IO board 340 and third board 330 are connected to a ground via the third female connector 332 and third male connector 341 , respectively.
- the third board 330 is grounded via coupling thereof with the heat-dissipating means 200 via a grounding bolt 333 .
- the heat-dissipating means 200 is connected to a ground via coupling thereof with the input board 350 through a bolt or metal rod 351 .
- a grounding terminal block 352 may be disposed on the input board 350 , and the grounding terminal block 352 may be connected to an external ground.
- the assembling time of the device may be shortened, and a durability of the device may be improved.
- minimizing the electrical interference between the components in the power flow path and the signal flow path may allow the heat-dissipating performance to be improved and allow the assemblability and durability of the device to be improved.
Abstract
Description
- Pursuant to 35 U.S.C. § 119(a), this application claims the benefit of earlier filing date and right of priority to Korean Application No. 10-2018-0050429, filed on May 2, 2018, in the Korean Intellectual Property Office, the disclosure of which is incorporated herein in its entirety by reference.
- The present disclosure relates to a motor-driving device with an improved structure of a circuit module.
- Generally, a motor-driving device refers to a device that can control a speed of a motor with a high efficiency by varying a voltage and frequency of a power supplied from an external power supply and supplying the power with the varied voltage and frequency to the motor.
-
FIG. 1 is a perspective view of a conventional motor-driving device.FIG. 2 shows a top view of a conventional power board. - Referring to
FIG. 1 andFIG. 2 , a conventional motor-driving device may include abase 10, heat-dissipating means 20 disposed below thebase 10, and aboard assembly 30 disposed above thebase 10. - The
board assembly 30 includes apower board 31 positioned on thebase 10, a cap board 32 (a filter board) disposed on thepower board 31, and acontrol board 33 disposed on side faces of thecap board 32 andpower board 31. Though not shown, the board assembly may further include an input/output (TO) board on thecap board 32. - The
conventional power board 31 receives power from the IO board (not shown). - Specifically, to supply power to a driver such as a motor, the
power board 31 receives AC power from the outside through the IO board, and then converts the AC power into DC power and then rectifies the DC power and then converts the rectified DC power to AC power. - In this connection, referring to
FIG. 2 , the power from the external power supply may have two types of flows as follows in the motor-driving device. - First, in a main power flow, the AC power input to an
input terminal block 1 of thepower board 31 is converted trough a rectifyingsection 2 to DC power including ripple. Thereafter, the DC power smoothed by a DC link of thecap board 32 is again applied to aninverter 3 through aDC terminal 7 of thepower board 31. Then, theinverter 3 converts the DC power to AC power and outputs the AC power to anoutput terminal block 4. - Second, in a signal flow, DC power generated from the
DC link 7 may be used as a power source for controlling the motor-driving device. The DC power generated from theDC link 7 may be applied to thecontrol board 33, a gate drive, a sensing andprotection circuit 5, and the like. - In this conventional motor-driving device, the power flow and the signal flow may have a noise-vulnerable structure in which an intersection occurs between an output of the rectifying
section 2 and an output of theinverter 3, and thus interference therebetween occurs. - Further, the
cap board 32 is connected to agrounding screw 6 of the power board through agrounding wire 34 formed on the cap board. Thegrounding wire 34 connected to thepower board 31 extends and is connected to the heat-dissipating means 20. - Such a structure of the conventional motor-driving device may cause malfunction of the device because the
grounding wire 34 may absorb a high-frequency noise signal. When thegrounding wire 34 touches the heat-dissipating means 20 or the SMPS, a sheath thereof may melt. This may cause power flow or signal flow interruption. Thus, malfunction of the device and burnout of the device may occur. - In order to solve the problem, a purpose of the present disclosure is to provides a motor-driving device with an improved structure in which the noise-vulnerability structure is removed by separating a power flow path and a signal flow path, thereby to minimize interference between components and to enable miniaturization of the device and to improve durability of the device.
- In one aspect of the present disclosure, there is provided a motor-driving device for varying a voltage and frequency of power supplied from an external power source and supplying the varied power to a motor, the device comprising: a middle base; heat-dissipating means disposed below the middle base; a first board disposed above the middle base; power-related components disposed on the first board and in a first region thereof, wherein the power-related components include a power input terminal, a rectifying module, an initial charging circuit, an inverting module, and an output terminal block; signal-related components disposed on the first board and in a second region thereof opposite to the first region, wherein the signal-related components include a switching mode power supply (SMPS), a gate drive circuit, and a sensing and protection circuit; a second board electrically connected to the first board; a direct-current (DC) link stage mounted on the second board, wherein the DC link stage is configured for storing power from the initial charging circuit and for supplying the power to the inverting module or the SMPS; and a third board electrically connected to the first board, wherein the third board is configured for receiving a sign DC link stage DC link stage al from the gate drive circuit, and the sensing and protection circuit.
- In one implementation, the second board is disposed below the first board, wherein the DC link stage is mounted on a bottom face of the second board and is adjacent the heat-dissipating means.
- In one implementation, the first board and the second board are electrically connected to each other via a first female connector and a first male connector, or are electrically connected to each other via a bolt coupling.
- In one implementation, the first board and the third board are electrically connected to each other via a second female connector and a second male connector.
- In one implementation, the device further comprises an input/output (IO) board electrically connected to the third board.
- In one implementation, the first board and the third board are electrically connected to each other via a second female connector and a second male connector, wherein the third board and the IO board are electrically connected to each other via a third
female connector 341 and a third male connector. - In one implementation, the device further include an input board disposed above the first board.
- In one implementation, the IO board and the third board are connected to a ground via a third female connector and a third male connector, wherein the third board is connected to a ground via a bolt coupling thereof with the heat-dissipating means, wherein the heat dissipating means is connected to a ground via coupling thereof with the input board through a bolt or metal rod, wherein a grounding terminal block is disposed on the input board, wherein the grounding terminal block is connected to an external ground.
- According to the present disclosure, the boards are coupled to each other via a connector or a bolt. This removes wires use, and reduces an assembly tolerance, thereby to improve the device productivity.
- Further, In accordance with the present disclosure, the performance of the device may be improved by positioning the power-related elements and the signal-related elements in one region and the other region of the first board respectively in a separating manner, thereby eliminating mutual electrical interference therebetween.
- Further, the present disclosure has an effect that the control performance of components temperature may be improved by disposing the second board below the first board and positioning the DC link stage adjacent to the heat dissipating means. Further, the durability of the device is improved. An overall space utilization in the device is also improved, so that the device may be downsized.
- Further specific effects of the present disclosure as well as the effects as described above will be described in conduction with illustrations of specific details for carrying out the invention.
-
FIG. 1 is a perspective view of a conventional motor-driving device. -
FIG. 2 shows a top view of a conventional power board. -
FIG. 3 is a perspective view of a motor-driving device according to an embodiment of the present disclosure. -
FIG. 4 is a schematic representation of a power flow path and a signal flow path of a motor-driving device according to an embodiment of the present disclosure. -
FIG. 5 shows an IO board according to an embodiment of the present disclosure. -
FIG. 6 shows a third board according to an embodiment of the present disclosure. -
FIG. 7 shows an input board according to an embodiment of the present disclosure. - Hereinafter, a motor-driving device with an improved structure in accordance with the present disclosure will be described with reference to the accompanying drawings.
- The above objects, features and advantages will become apparent from the detailed description with reference to the accompanying drawings. Embodiments are described in sufficient detail to enable those skilled in the art in the art to easily practice the technical idea of the present disclosure. Detailed descriptions of well-known functions or configurations may be omitted in order not to unnecessarily obscure the gist of the present disclosure. Hereinafter, embodiments of the present disclosure will be described in detail with reference to the accompanying drawings. Throughout the drawings, like reference numerals refer to like elements.
- Unless defined otherwise, all terms used herein have the same meaning as commonly understood by one of ordinary skill in the art. When the terms used herein are in conflict with a general meaning of the term, the meaning of the term is in accordance with a definition used herein.
- Examples of various embodiments are illustrated and described further below. It will be understood that the description herein is not intended to limit the claims to the specific embodiments described. On the contrary, it is intended to cover alternatives, modifications, and equivalents as may be included within the spirit and scope of the present disclosure as defined by the appended claims.
-
FIG. 3 is a perspective view of a motor-driving device according to an embodiment of the present disclosure.FIG. 4 is a schematic representation of a power flow path and a signal flow path of a motor-driving device according to an embodiment of the present disclosure.FIG. 5 shows an IO board according to an embodiment of the present disclosure.FIG. 6 shows a third board according to an embodiment of the present disclosure.FIG. 7 shows an input board according to an embodiment of the present disclosure. - Referring to
FIG. 3 toFIG. 7 , a motor-driving device according to an embodiment of the present disclosure may include ahousing 100, heat-dissipatingmeans 200, and aboard assembly 300. - The
housing 100 may include alower base 110 and amiddle base 120. - The
lower base 110 may define a bottom of the motor-driving device. Thelower base 110 may be integrally formed with the heat-dissipatingmeans 200 to be described later using injection molding or the like. - The
middle base 120 may be spaced from a top face of thelower base 110 by a predetermined spacing. The heat-dissipatingmeans 200 may be disposed below themiddle base 120. - The
middle base 120 and the heat-dissipatingmeans 200 may be fastened to each other via a hook coupling orbolt coupling 318. - The heat-dissipating
means 200 refers to a heatsink. Heat generated from theboard assembly 300 disposed on themiddle base 120 may be absorbed and discharged out by the heat-dissipatingmeans 200. - The
board assembly 300 may include afirst board 310, asecond board 320, and athird board 330. AnIO board 340 and aninput board 350 may be further included in theboard assembly 300. - The
first board 310 may be referred to as a power board, thesecond board 320 as a cap board, and thethird board 330 as a control board. - The
first board 310 may be disposed on themiddle base 120. In this connection, a fastening pin orfastening hook 121 may be formed on a periphery of themiddle base 120 such that thefirst board 310 is spaced apart from a top face of themiddle base 120 by a predetermined distance. - Further, referring to
FIG. 4 , on thefirst board 310 and in one region thereof, apower input terminal 311, arectifying module 312, aninitial charging circuit 313, aninverting module 314, and anoutput terminal block 315 may be mounted. On thefirst board 310 and in the other region thereof, a Switching Mode Power Supply (SMPS) 316, a gate drive circuit, and a sensing andprotection circuit 317 may be mounted. - The
second board 320 may be arranged to be electrically connected to thefirst board 310. ADC link stage 321 that stores power from theinitial charging circuit 313 and transfers the power to theinverting module 314 or theSMPS 316 may be mounted on thesecond board 320. - Further, the
second board 320 may be disposed below thefirst board 310. In this case, theDC link stage 321 may be mounted on a bottom face of thesecond board 320 so as to be adjacent to the heat-dissipatingmeans 200. Thus, theDC link stage 321 may be mounted in a space between thelower base 110 and themiddle base 120. - The
third board 330 is electrically connected to thefirst board 310. Thethird board 330 may be oriented in a direction perpendicular to a top face of thelower base 110. - The
third board 330 may receive a signal from the gate drive circuit, and sensing andprotection circuit 317 mounted in the other region of thefirst board 310. - The
IO board 340 may be electrically connected to thethird board 330. The user may control on and off of theboard 340. - The
input board 350 may be located on thefirst board 310. Via theinput board 350, an external power may be input to the motor-driving device. - The boards of the
board assembly 300 of the motor-driving device according to an embodiment of the present disclosure may be interconnected as follows. - The
first board 310 and thesecond board 320 may be electrically connected to each other via a first male connector and a first female connector or may be electrically connected to each other via abolt coupling 318. - The
first board 310 and thethird board 330 may be electrically connected to each other via a secondmale connector 319 and a secondfemale connector 331. - The
third board 330 and theIO board 340 may be electrically connected to each other via a thirdmale connector 332 and a thirdfemale connector 341. - Since each of the
first board 310 and theinput board 350 is oriented horizontally and thefirst board 310 and theinput board 350 are arranged vertically, thefirst board 310 and theinput board 350 may be connected to each other via mutual coupling between terminals thereof. - A power flow in a power flow path and a signal flow in a signal flow path according to the motor-driving device according to an embodiment of the present disclosure are as follows.
- First, the external AC power is input to the
input board 350 and then this AC power is applied to thepower input terminal 311 of thefirst board 310. - That is, when the AC power is applied to the
power input terminal 311 in one region of thefirst board 310, the AC power is rectified to the DC power through the rectifyingmodule 312. Thereafter, the DC power is moved to theinitial charging circuit 313. - Thereafter, the DC power applied to the
initial charging circuit 313 is applied to theDC link stage 321 of thesecond board 320, and then applied to theinverting module 314 disposed in one region of thefirst board 310 and to theSMPS 316 disposed in the other region thereof. - Then, the
inverting module 314 converts the DC power applied to theinverting module 314 into AC power, which then is applied to an external motor or the like through theoutput terminal block 315. The DC power applied to theSMPS 316 may be applied to the gate drive circuit, and the sensing andprotection circuit 317, and the like, and finally applied to thethird board 330 for control of the device. - In brief, the motor-driving device according to an embodiment of the present disclosure includes, in a main power flow path, the rectifying
module 312, theinitial charging circuit 313, theDC link stage 321, and the inverting module, all of which are mounted in one region of thefirst board 310. The motor-driving device includes, in the signal flow path, theSMPS 316, the gate drive circuit, and the sensing andprotection circuit 317, all of which are mounted in the other region of thefirst board 310. In this manner, no electrical interference occurs between the components in the power flow path and the signal flow path, thereby reducing the noise. - Furthermore, because the
DC link stage 321, which applies the DC power to the components in the power flow path and in the signal flow path, is located on thesecond board 320, the electrical interference between the components in the power flow path and the signal flow path may be suppressed. - Further, the components in the power flow path and signal flow path are mounted on the single
first board 310. Thesecond board 320 on which theDC link stage 321 is mounted may be disposed below thefirst board 310. This may reduce the size of the device. - Further, a relatively bulky
DC link stage 321 is placed adjacent to the heat-dissipatingmeans 200, which may improve miniaturization and heat-dissipating performance of the device. - A grounding structure according to the motor-driving device according to an embodiment of the present disclosure is as follows.
- The
IO board 340 andthird board 330 are connected to a ground via the thirdfemale connector 332 and thirdmale connector 341, respectively. Thethird board 330 is grounded via coupling thereof with the heat-dissipatingmeans 200 via agrounding bolt 333. The heat-dissipatingmeans 200 is connected to a ground via coupling thereof with theinput board 350 through a bolt ormetal rod 351. Further, a groundingterminal block 352 may be disposed on theinput board 350, and the groundingterminal block 352 may be connected to an external ground. - Therefore, since a wire for grounding is unnecessary, the assembling time of the device may be shortened, and a durability of the device may be improved.
- In brief, according to the structure of the motor-driving device according to the embodiments of the present disclosure, minimizing the electrical interference between the components in the power flow path and the signal flow path may allow the heat-dissipating performance to be improved and allow the assemblability and durability of the device to be improved.
- It will be apparent to those skilled in the art that various modifications and variations may be made in the present invention without departing from the spirit of the present disclosure. The technical scope of the present disclosure is not limited to the contents described in the embodiments but should be determined by the claims and equivalents thereof
Claims (8)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020180050429A KR102082207B1 (en) | 2018-05-02 | 2018-05-02 | Device for driving motor |
KR10-2018-0050429 | 2018-05-02 |
Publications (2)
Publication Number | Publication Date |
---|---|
US20190341710A1 true US20190341710A1 (en) | 2019-11-07 |
US10490917B1 US10490917B1 (en) | 2019-11-26 |
Family
ID=65628709
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US16/279,219 Active US10490917B1 (en) | 2018-05-02 | 2019-02-19 | Device for driving motor |
Country Status (6)
Country | Link |
---|---|
US (1) | US10490917B1 (en) |
EP (1) | EP3565393B1 (en) |
JP (1) | JP6768856B2 (en) |
KR (1) | KR102082207B1 (en) |
CN (1) | CN110445447B (en) |
ES (1) | ES2875864T3 (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102548248B1 (en) * | 2021-03-25 | 2023-06-26 | 엘에스일렉트릭(주) | Apparatus for driving motor |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100542566B1 (en) * | 2003-08-04 | 2006-01-11 | 삼성전자주식회사 | Inverter power module for electric/electronic machine |
JP2010245910A (en) * | 2009-04-08 | 2010-10-28 | Hitachi Automotive Systems Ltd | Electric power conversion apparatus and on-vehicle electric system using the same |
JP2012065376A (en) * | 2010-09-14 | 2012-03-29 | Panasonic Corp | Three-phase inverter device, and motor drive device or air conditioner using the same |
KR101189451B1 (en) | 2010-12-24 | 2012-10-09 | 엘지전자 주식회사 | Inverter stack |
JP2012210048A (en) * | 2011-03-29 | 2012-10-25 | Azbil Corp | Surge protected power supply |
ES2555121T3 (en) * | 2013-07-08 | 2015-12-29 | Fagor, S. Coop. | Electric drive device |
KR101466032B1 (en) | 2013-08-02 | 2014-11-28 | 엘에스산전 주식회사 | Inverter |
WO2015025451A1 (en) * | 2013-08-23 | 2015-02-26 | パナソニックIpマネジメント株式会社 | Gate drive circuit |
JP6378642B2 (en) * | 2015-04-23 | 2018-08-22 | モレックス エルエルシー | connector |
JP6200457B2 (en) | 2015-06-29 | 2017-09-20 | ファナック株式会社 | Motor driving device having means for detecting abnormal heat generation in initial charging circuit |
KR102499259B1 (en) * | 2015-10-05 | 2023-02-14 | 삼성전자주식회사 | Motor driving apparatus, controlling method of the same, inverter and power supply |
GB2545425B (en) * | 2015-12-14 | 2019-03-27 | Ge Aviat Systems Ltd | Distributed wiring board connections |
KR101821878B1 (en) * | 2016-02-24 | 2018-01-24 | 엘에스산전 주식회사 | Inverter |
WO2017212940A1 (en) * | 2016-06-06 | 2017-12-14 | 日本端子株式会社 | Surface mounting type connector |
JP6601328B2 (en) * | 2016-07-01 | 2019-11-06 | 株式会社デンソー | Motor equipment |
JP6672228B2 (en) * | 2017-09-05 | 2020-03-25 | 株式会社東芝 | Disk unit |
-
2018
- 2018-05-02 KR KR1020180050429A patent/KR102082207B1/en active IP Right Grant
-
2019
- 2019-02-15 JP JP2019025764A patent/JP6768856B2/en active Active
- 2019-02-19 US US16/279,219 patent/US10490917B1/en active Active
- 2019-02-27 EP EP19159786.3A patent/EP3565393B1/en active Active
- 2019-02-27 ES ES19159786T patent/ES2875864T3/en active Active
- 2019-03-12 CN CN201910183767.5A patent/CN110445447B/en active Active
Also Published As
Publication number | Publication date |
---|---|
KR20190126492A (en) | 2019-11-12 |
CN110445447B (en) | 2023-05-12 |
US10490917B1 (en) | 2019-11-26 |
JP6768856B2 (en) | 2020-10-14 |
CN110445447A (en) | 2019-11-12 |
EP3565393B1 (en) | 2021-04-07 |
ES2875864T3 (en) | 2021-11-11 |
EP3565393A1 (en) | 2019-11-06 |
KR102082207B1 (en) | 2020-02-27 |
JP2019195253A (en) | 2019-11-07 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US10917999B2 (en) | Power module, power module assembly and assembling method thereof | |
JP6497213B2 (en) | Power converter | |
US9698507B2 (en) | Package structure of power module | |
US10264695B2 (en) | Power converter | |
US9030825B2 (en) | Springy clip type apparatus for fastening power semiconductor | |
US11011996B2 (en) | Power converter | |
US11114946B2 (en) | Voltage regulator module | |
JP2004342325A (en) | Discharge lamp lighting device | |
US10490917B1 (en) | Device for driving motor | |
KR102213128B1 (en) | Device for driving motor | |
US6314001B1 (en) | Desktop computer with external power supply module | |
CN110474535B (en) | Power conversion system and method of assembly | |
US9652008B2 (en) | Power module | |
US10321612B2 (en) | Power conversion device | |
CN103930986A (en) | Power conversion apparatus | |
JPH06351260A (en) | Inverter | |
US20210050153A1 (en) | Capacitor | |
JP6851999B2 (en) | Power converter | |
US10461659B2 (en) | Semiconductor device and power converting device | |
CN113874752A (en) | Radar device and mobile device | |
US20240120812A1 (en) | Integrated motor and drive assembly | |
CN213750305U (en) | Radar device and mobile device | |
JP2011166175A (en) | Motor control apparatus | |
WO2021214846A1 (en) | Power conversion device | |
JP2003060143A (en) | Semiconductor module |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
FEPP | Fee payment procedure |
Free format text: ENTITY STATUS SET TO UNDISCOUNTED (ORIGINAL EVENT CODE: BIG.); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY |
|
AS | Assignment |
Owner name: LSIS CO., LTD., KOREA, REPUBLIC OF Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:KIM, HONG-SEOK;YANG, CHUN-SUK;KIM, DONG-SIK;SIGNING DATES FROM 20181226 TO 20190115;REEL/FRAME:048457/0737 |
|
STCF | Information on status: patent grant |
Free format text: PATENTED CASE |
|
MAFP | Maintenance fee payment |
Free format text: PAYMENT OF MAINTENANCE FEE, 4TH YEAR, LARGE ENTITY (ORIGINAL EVENT CODE: M1551); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY Year of fee payment: 4 |