US20190183125A1 - Printed circuit assembly for a solenoid module for an automatic transmission - Google Patents
Printed circuit assembly for a solenoid module for an automatic transmission Download PDFInfo
- Publication number
- US20190183125A1 US20190183125A1 US16/107,755 US201816107755A US2019183125A1 US 20190183125 A1 US20190183125 A1 US 20190183125A1 US 201816107755 A US201816107755 A US 201816107755A US 2019183125 A1 US2019183125 A1 US 2019183125A1
- Authority
- US
- United States
- Prior art keywords
- printed circuit
- hole
- circuit board
- terminal
- assembly
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Images
Classifications
-
- A—HUMAN NECESSITIES
- A01—AGRICULTURE; FORESTRY; ANIMAL HUSBANDRY; HUNTING; TRAPPING; FISHING
- A01N—PRESERVATION OF BODIES OF HUMANS OR ANIMALS OR PLANTS OR PARTS THEREOF; BIOCIDES, e.g. AS DISINFECTANTS, AS PESTICIDES OR AS HERBICIDES; PEST REPELLANTS OR ATTRACTANTS; PLANT GROWTH REGULATORS
- A01N43/00—Biocides, pest repellants or attractants, or plant growth regulators containing heterocyclic compounds
- A01N43/90—Biocides, pest repellants or attractants, or plant growth regulators containing heterocyclic compounds having two or more relevant hetero rings, condensed among themselves or with a common carbocyclic ring system
-
- A—HUMAN NECESSITIES
- A01—AGRICULTURE; FORESTRY; ANIMAL HUSBANDRY; HUNTING; TRAPPING; FISHING
- A01N—PRESERVATION OF BODIES OF HUMANS OR ANIMALS OR PLANTS OR PARTS THEREOF; BIOCIDES, e.g. AS DISINFECTANTS, AS PESTICIDES OR AS HERBICIDES; PEST REPELLANTS OR ATTRACTANTS; PLANT GROWTH REGULATORS
- A01N43/00—Biocides, pest repellants or attractants, or plant growth regulators containing heterocyclic compounds
- A01N43/72—Biocides, pest repellants or attractants, or plant growth regulators containing heterocyclic compounds having rings with nitrogen atoms and oxygen or sulfur atoms as ring hetero atoms
- A01N43/74—Biocides, pest repellants or attractants, or plant growth regulators containing heterocyclic compounds having rings with nitrogen atoms and oxygen or sulfur atoms as ring hetero atoms five-membered rings with one nitrogen atom and either one oxygen atom or one sulfur atom in positions 1,3
- A01N43/76—1,3-Oxazoles; Hydrogenated 1,3-oxazoles
-
- A—HUMAN NECESSITIES
- A01—AGRICULTURE; FORESTRY; ANIMAL HUSBANDRY; HUNTING; TRAPPING; FISHING
- A01N—PRESERVATION OF BODIES OF HUMANS OR ANIMALS OR PLANTS OR PARTS THEREOF; BIOCIDES, e.g. AS DISINFECTANTS, AS PESTICIDES OR AS HERBICIDES; PEST REPELLANTS OR ATTRACTANTS; PLANT GROWTH REGULATORS
- A01N43/00—Biocides, pest repellants or attractants, or plant growth regulators containing heterocyclic compounds
- A01N43/72—Biocides, pest repellants or attractants, or plant growth regulators containing heterocyclic compounds having rings with nitrogen atoms and oxygen or sulfur atoms as ring hetero atoms
- A01N43/74—Biocides, pest repellants or attractants, or plant growth regulators containing heterocyclic compounds having rings with nitrogen atoms and oxygen or sulfur atoms as ring hetero atoms five-membered rings with one nitrogen atom and either one oxygen atom or one sulfur atom in positions 1,3
- A01N43/78—1,3-Thiazoles; Hydrogenated 1,3-thiazoles
-
- A—HUMAN NECESSITIES
- A01—AGRICULTURE; FORESTRY; ANIMAL HUSBANDRY; HUNTING; TRAPPING; FISHING
- A01N—PRESERVATION OF BODIES OF HUMANS OR ANIMALS OR PLANTS OR PARTS THEREOF; BIOCIDES, e.g. AS DISINFECTANTS, AS PESTICIDES OR AS HERBICIDES; PEST REPELLANTS OR ATTRACTANTS; PLANT GROWTH REGULATORS
- A01N47/00—Biocides, pest repellants or attractants, or plant growth regulators containing organic compounds containing a carbon atom not being member of a ring and having no bond to a carbon or hydrogen atom, e.g. derivatives of carbonic acid
- A01N47/02—Biocides, pest repellants or attractants, or plant growth regulators containing organic compounds containing a carbon atom not being member of a ring and having no bond to a carbon or hydrogen atom, e.g. derivatives of carbonic acid the carbon atom having no bond to a nitrogen atom
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07D—HETEROCYCLIC COMPOUNDS
- C07D401/00—Heterocyclic compounds containing two or more hetero rings, having nitrogen atoms as the only ring hetero atoms, at least one ring being a six-membered ring with only one nitrogen atom
- C07D401/02—Heterocyclic compounds containing two or more hetero rings, having nitrogen atoms as the only ring hetero atoms, at least one ring being a six-membered ring with only one nitrogen atom containing two hetero rings
- C07D401/04—Heterocyclic compounds containing two or more hetero rings, having nitrogen atoms as the only ring hetero atoms, at least one ring being a six-membered ring with only one nitrogen atom containing two hetero rings directly linked by a ring-member-to-ring-member bond
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07D—HETEROCYCLIC COMPOUNDS
- C07D413/00—Heterocyclic compounds containing two or more hetero rings, at least one ring having nitrogen and oxygen atoms as the only ring hetero atoms
- C07D413/02—Heterocyclic compounds containing two or more hetero rings, at least one ring having nitrogen and oxygen atoms as the only ring hetero atoms containing two hetero rings
- C07D413/04—Heterocyclic compounds containing two or more hetero rings, at least one ring having nitrogen and oxygen atoms as the only ring hetero atoms containing two hetero rings directly linked by a ring-member-to-ring-member bond
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07D—HETEROCYCLIC COMPOUNDS
- C07D417/00—Heterocyclic compounds containing two or more hetero rings, at least one ring having nitrogen and sulfur atoms as the only ring hetero atoms, not provided for by group C07D415/00
- C07D417/02—Heterocyclic compounds containing two or more hetero rings, at least one ring having nitrogen and sulfur atoms as the only ring hetero atoms, not provided for by group C07D415/00 containing two hetero rings
- C07D417/04—Heterocyclic compounds containing two or more hetero rings, at least one ring having nitrogen and sulfur atoms as the only ring hetero atoms, not provided for by group C07D415/00 containing two hetero rings directly linked by a ring-member-to-ring-member bond
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07D—HETEROCYCLIC COMPOUNDS
- C07D471/00—Heterocyclic compounds containing nitrogen atoms as the only ring hetero atoms in the condensed system, at least one ring being a six-membered ring with one nitrogen atom, not provided for by groups C07D451/00 - C07D463/00
- C07D471/02—Heterocyclic compounds containing nitrogen atoms as the only ring hetero atoms in the condensed system, at least one ring being a six-membered ring with one nitrogen atom, not provided for by groups C07D451/00 - C07D463/00 in which the condensed system contains two hetero rings
- C07D471/04—Ortho-condensed systems
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07D—HETEROCYCLIC COMPOUNDS
- C07D498/00—Heterocyclic compounds containing in the condensed system at least one hetero ring having nitrogen and oxygen atoms as the only ring hetero atoms
- C07D498/02—Heterocyclic compounds containing in the condensed system at least one hetero ring having nitrogen and oxygen atoms as the only ring hetero atoms in which the condensed system contains two hetero rings
- C07D498/04—Ortho-condensed systems
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07D—HETEROCYCLIC COMPOUNDS
- C07D513/00—Heterocyclic compounds containing in the condensed system at least one hetero ring having nitrogen and sulfur atoms as the only ring hetero atoms, not provided for in groups C07D463/00, C07D477/00 or C07D499/00 - C07D507/00
- C07D513/02—Heterocyclic compounds containing in the condensed system at least one hetero ring having nitrogen and sulfur atoms as the only ring hetero atoms, not provided for in groups C07D463/00, C07D477/00 or C07D499/00 - C07D507/00 in which the condensed system contains two hetero rings
- C07D513/04—Ortho-condensed systems
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
- F16K31/00—Actuating devices; Operating means; Releasing devices
- F16K31/02—Actuating devices; Operating means; Releasing devices electric; magnetic
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/119—Details of rigid insulating substrates therefor, e.g. three-dimensional details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3447—Lead-in-hole components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09854—Hole or via having special cross-section, e.g. elliptical
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/1003—Non-printed inductor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10295—Metallic connector elements partly mounted in a hole of the PCB
- H05K2201/10303—Pin-in-hole mounted pins
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10742—Details of leads
- H05K2201/1075—Shape details
- H05K2201/10818—Flat leads
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
Definitions
- the present invention pertains to methods for attaching a hydromechanical valve to a circuit assembly, and in particular to rebuilding a printed circuit assembly of an electrohydraulic assembly.
- a typical solenoid module includes a hydraulic manifold and one or more electromechanical solenoids.
- the hydraulic manifold contains numerous fluid circuit passages that hydraulically communicate with the solenoids.
- the electromechanical solenoids control either the flow (on/off control) through the passages or regulate pressure within the passages.
- the solenoids are electrically connected to a terminal housing that provides for a removable connection to a wire harness, allowing for communication to the powertrain control unit (PCU).
- PCU powertrain control unit
- a device including five electrically actuated solenoid assemblies are situated on an aluminum manifold block including multiple fluid passageways.
- the connections for the solenoids includes round pins that extrude upwards through a circuit board and are soldered into place.
- the circuit board consists of strips of copper forming circuit tracks that are further encased in plastic, herein generally referred to as a circuit board assembly (CBA).
- CBA circuit board assembly
- the CBA interconnects to a terminal connector providing communication through a wire harness to the PCU.
- This particular solenoid module is used in the Ford E4OD and 4R100 automatic transmission since 1989. It has several well-known failure modes and is a common replacement item. These new modules typically cost $150-200 to the end user.
- a variation of the '908 design is the solenoid module 50 P produced by Bosch that is used in the 2002-2003 Ford 5R55 W, 2004-up 5R55S and the 1999-up 5R55N automatic transmissions.
- This module is shown in FIG. 1 .
- This solenoid module has high failure rates, similar to the E4OD/4R100 solenoid module described in the '006 and '049 patents.
- This solenoid module costs the end user between $200-300.
- There has been extensive interest in rebuilding this module as generally the failure is localized to an individual solenoid ( 56 P) ( 57 P) ( 58 P) or a broken circuit track ( 71 P) within the assembly.
- the major obstacle has been the CBA that cannot be easily removed in one piece for reuse.
- the CBA 70 P includes multiple circuit tracks 71 P that are placed within two plastic housings 72 P and 74 P that are snapped together, sandwiching the circuit tracks into place. During the removal process, the circuit assembly 71 P flexes, which releases the snapped connections between the two housings 72 P and 74 P, and results in the circuit tracks to fall out of location.
- FIG. 2 is a picture of the 5R55 module from the CBA side.
- FIG. 3 is a picture of a CBA without the top housing half, exposing the internal circuit tracks 71 P.
- FIG. 4 is an enlarged picture of the terminal connection area, which shows spring-loaded frictional fits in the form of the barbed, press-fit connections 78 P. In this figure, the rectangular configuration of the pins 77 P can be seen clearly.
- FIG. 5 is a picture of typical results when attempting removal of the CBA. In this figure, it can be seen that the circuit tracks have snapped out of position, and the barbed connection 78 P are no longer in reliable electrical communication with the internal circuitry of circuit tracks 71 P.
- FIG. 6 is a picture of the module 50 P after removal of the CBA 70 P and manifold 52 P.
- FIG. 7 is a picture of a failed circuit track within the assembly.
- Some embodiments of the present invention relates to a fluid control device including several actuators, such as but not limited to solenoids, arranged and secured within a manifold block.
- This solenoid block assembly or module is primarily adapted for automatic transmissions used in motor vehicles; however, the present invention is not so limited, and can be used in any application involving the interconnection of the electrical leads of any kind of actuator to a printed circuit assembly.
- PCA printed circuit assembly
- a new PCA replaces an original, non-soldered circuit assembly, providing for quicker replacement and improved connection.
- a printed circuit assembly (including etched circuit paths or circuit traces) replaces an existing circuit board assembly, such as a CBA including strips of conductive material placed within nonconductive material such as plastic.
- FIG. 1 An existing solenoid module
- FIG. 2 The solenoid module of FIG. 1 from circuit assembly side, with interconnections intact.
- FIG. 3 The solenoid module from circuit assembly side without top assembly housing
- FIG. 4 Circuit assembly barbed connection from FIG. 2 .
- FIG. 5 Typical results after circuit assembly removal for apparatus of FIG. 2 , with the interconnections broken.
- FIG. 6 Solenoid module of FIG. 1 from circuit assembly side after circuit assembly removal
- FIG. 7 Typical failure mode of a known CBA design.
- FIG. 7A is a partial view of the design depicted in FIG. 7 .
- FIG. 8 a Connection hole configuration according to one embodiment of the present invention.
- FIG. 8 b Connection hole configuration according to another embodiment of the present invention.
- FIG. 8 c Connection hole configuration according to another embodiment of the present invention.
- FIG. 9 shows the front side of one embodiment of the invention.
- FIG. 10 shows the back side of the apparatus of FIG. 9 .
- FIG. 11 a is a depiction a front side view of an interconnect area according to one embodiment of the present invention.
- FIG. 11 b is a cross-sectional view of an interconnect area opening according to one embodiment of the present invention.
- FIG. 11 c is a view of the apparatus of FIG. 11 a from the rear.
- FIG. 12 is a depiction of a backside view of an interconnect area according to one embodiment of the present invention.
- FIG. 13 is a depiction of a typical bolt clearance according to one embodiment of the present invention.
- FIG. 14 is a cross-sectional view of a PCA according to one embodiment of the present invention.
- FIG. 15 is a photographic representation of the PCA assembled on the solenoid module according to one embodiment of the present invention.
- FIG. 16 shows a side view of the apparatus of FIG. 15 .
- FIG. 17 Front side enlarged view of a PCA according to one embodiment of the present invention.
- FIG. 18 Back side enlarged view of the apparatus of FIG. 17 .
- FIG. 19 Cross sectional enlarged view of the apparatus of FIG. 17 showing conductive walls of interconnection holes.
- NXX.XX refers to an element that is the same as the non-prefixed element (XX.XX), except as shown and described thereafter.
- an element 1020 . 1 would be the same as element 20 . 1 , except for those different features of element 1020 . 1 shown and described.
- common elements and common features of related elements are drawn in the same manner in different figures, and/or use the same symbology in different figures. As such, it is not necessary to describe the features of 1020 . 1 and 20 . 1 that are the same, since these common features are apparent to a person of ordinary skill in the related field of technology.
- PCA printed circuit assembly
- a PCA includes a printed circuit board (PCB) including etched, conductive circuit paths, as well as other installed components such as electronic components including thermistors, diodes, resistors, etc.
- PCB printed circuit board
- CBA circuit board assembly
- a CBA includes individual strips of conductive material, such as copper, forming circuit paths and encased in plastic, for example either overmolded plastic or a plastic sandwich. Further, many CBAs include electrical connections to solenoids or other components that are chosen for the ability of the connector to withstand the harsh environment, but often these connections are intended to be made permanently and quickly in a high production environment. These CBA assemblies and connectors have been chosen for various reasons, including their ruggedness in the extreme vibration, temperature, and contamination environment within the inside of an automatic transmission, but the connectors in particular are seriously compromised with respect to reparability. However, reparability often becomes an issue because other components within the solenoid assembly are not as rugged as the CBA, and these other components may fail prematurely.
- FIGS. 8 to 19 One embodiment of the present invention is shown in FIGS. 8 to 19 .
- Solenoid Assembly 50 includes a printed circuit assembly 20 with connection features that are sufficiently rugged to withstand the transmission internal environment, yet still be repairable.
- FIGS. 8 a and 8 b show interconnect opening of PCA 20 according to two embodiments.
- the interconnect openings 23 of the PCA 20 can be soldered onto the terminal pins 77 of the existing solenoids 56 , which is a more secure connection and allows for ease of future servicing of the module.
- the embodiment is an improvement over existing designs by reducing the occurrence of broken circuit tracks, such as that shown in FIG. 7 .
- This embodiment enables the rebuilding of such solenoid modules, including repair or replacement of individual elements within the module, providing an alternative to the expensive new modules. It is estimated that a rebuilt module would cost about 50% of a new one.
- FIG. 8 a shows a pin 77 inserted within a hole 23 b of a printed circuit assembly 21 .
- An interconnect area 23 a comprising a conductive material surrounds opening 23 b .
- Opening 23 b includes generally parallel sides 23 b 1 and 23 b 2 interconnected at top and bottom (with reference to orientation of FIG. 8 a ) by rounded edges 23 b 3 and 23 b 4 .
- the rounded ends 23 b 3 and 23 b 4 of opening 23 b are semi-circular, although the present invention further contemplates those designs in which the ends are not rounded, but are any curved design that preferably avoids sharp corners. As another example, some embodiments of the present invention contemplate the use of a substantially rectangular opening in the PCA that includes rounded corners.
- connection opening 23 b are sufficiently large so as to provide clearance from respective end edges 77 - 3 and 77 - 4 of pin 77 .
- Typical clearance is about 0.05 mm/side along the parallel sides.
- Rounded ends of the connection opening 23 b are preferred in some embodiments in order to reduce corner stresses in the circuit card itself.
- FIG. 8 b shows an alternative embodiment.
- a connection opening 23 b ′ is defined within a printed circuit assembly 21 ′ for interconnection with a generally rectangular cross sectioned pin 77 .
- Opening 23 b ′ includes first and second parallel sides that are interconnected at either end with rounded ends 23 b 3 ′ and 23 b 4 ′. These rounded ends are generally circular in area. However, the diameter of the defined circular end is greater than the width between the parallel sides 23 b 1 ′ and 23 b 2 ′. By introducing a larger diameter at the ends, a further reduction in the concentration of flexing stresses within the printed circuit assembly can be expected.
- FIG. 8 c shows another alternative embodiment.
- a connection opening 23 b ′′ is defined within a printed circuit assembly 21 ′′ for interconnection with a generally rectangular cross sectioned pin 77 .
- Opening 23 b ′′ includes first and second parallel sides that are interconnected at either end with rounded corners 23 b 3 ′′, each pair of rounded corners being interconnected with a straight section 23 b 5 ′′. These rounded corners are generally circular.
- the preferred dimensions are shown in FIG. 8 only for illustrative purposes.
- the PCA connection openings allow for insertion onto a rectangular pin and soldered connections along the lengths.
- the clearance provided at the ends of the slot are not so great that a solder connection is not made.
- the printed circuit board (PCB) of described PCA is comprised of the Flame Retardant 4 (FR-4) epoxy resin material for the core.
- the board is plated with copper on one side to create the interconnection traces ( 22 ) between the solenoids and terminal connector 60 and the front side connection pads ( 23 a ).
- a further copper layer is deposited creating the back side connection pads ( 23 c ) and the thru hole wall ( 23 b ). This provides a conductive material on the through, interconnection holes for mating with the pins.
- a green solder mask is applied over both sides of the assembly, except in the areas of the connection openings ( 23 a )( 23 c ) and walls ( 23 b ).
- solder coating is applied over the copper. This coating assists the soldering process when installing the assembly on the module and protects the copper in these areas from oxidization.
- a thermistor ( 17 ) is inserted across the two pins denoted ( 29 ) in FIG. 9 .
- the thermistor preferably has a resistance of about 30 k ohm at 25° C. and is soldered into place. However, the thermistor may be crimped into place as well.
- the unit is herein referred to as a PCA.
- a cover may be inserted over the PCA to protect the assembly during installation into the vehicle.
- the preferred material of the cover is a thermoplastic such as Nylon 6/6 with 30% glass filler.
- One or more mechanical fasteners may also be used to provide mechanical connection of the PCA to the module assembly. This would relieve the soldered connections from physically supporting the PCA and help alleviate possible vibration.
- the printed circuit board (PCB) core ( 30 . 1 ) is comprised of Flame Retardant 4 (FR-4) epoxy resin material.
- the core is cut to form the geometry shown in FIGS. 9 and 10 , including bolt clearance holes ( 28 ), interconnect holes ( 23 ), thermistor holes ( 29 ), connector window hole ( 27 ) and miscellaneous module feature clearance holes ( 10 ).
- Six pairs of interconnect areas ( 23 ) can be seen in the general center of the PCA assembly ( 20 ).
- Interconnect areas ( 23 ) each include a front side interconnect pad ( 23 a ) comprising conductive material and in electrical communication with a circuit trace 22 ; a hole ( 23 b ) with electrically conductive surfaces; and an electrically conductive interconnect area ( 23 c ) on the backside of PCA ( 20 ).
- Six pairs of interconnect holes ( 23 ) provide electrical communication to the terminal housing ( 60 ).
- PCA ( 20 ) includes a plurality of other interconnect areas ( 23 ) throughout the area of the PCA.
- the PCB is plated with copper ( 31 ) on the front side to form the circuit traces ( 22 ), interconnect areas ( 23 ), and printed text areas ( 25 ) ( 26 ).
- the PCB is plated with copper ( 31 ) on the back side to form the interconnect areas ( 23 ).
- a green solder mask ( 32 ) is applied on both sides in all areas except in the interconnect areas ( 23 ).
- a solder layer is applied over exposed copper in the interconnect areas ( 23 ) to aid with solder connection to module solenoids and connector terminals. This layer forms an exposed front pad ( 23 a ), back pad ( 23 c ) and the walls of the through hole ( 23 b ).
- Final overall thickness of the PCB is approximately 1.6 mm.
- a thermistor ( 17 ) is inserted from the backside in the thermistor holes ( 29 ) and soldered in place, thermistor holes ( 29 ) include an electrically conductive area ( 29 a ) on the front side of PCB 20 ; a through hole ( 29 b ) having electrically conductive inner surfaces; and an interconnect area ( 29 c ) on the backside of PCB 20 .
- the preferred thermistor is a negative temperature coefficient (NTC) type that has a nominal resistance of 30 k ohms at 25° C. with a beta coefficient (K) of approximately 3900.
- the printed circuit assembly (PCA) is assembled onto the rebuilt solenoid module ( 50 ) and soldered in place. A complete functional testing of the assembly is performed.
- electro-hydromechanical assemblies such as the 5R55S, 5R55 W and 5R55N solenoid modules.
- the connection between the circuitry and the solenoids and connection terminals are more robust than the original barbed style connectors and better able to withstand vibration and mechanical loading.
- the masked circuit traces printed on the PCA are less susceptible to contamination.
- the circuit traces are not susceptible to the mechanical stress that cause the original circuit tracks to break, as shown in FIG. 7 .
- the preferred embodiment provides instructions to the end user that aids installation.
- the specified bolt torque of 8 N-m is communicated by text ( 25 ).
- the specified torque sequence is communicated by text ( 26 ). This eliminates the need for the end user to research the specifications or to install without the required information. It also helps to prevent returned assemblies because of improper installation.
Abstract
Description
- This application is a continuation of U.S. Design application Ser. No. 29/540,243, filed Sep. 22, 2015, which is a continuation of U.S. application Ser. No. 14/850,253, filed Sep. 10, 2015, now issued as U.S. Pat. No. 9,844,137, which is a continuation of U.S. application Ser. No. 13/119,041, filed Mar. 15, 2011, now issued as U.S. Pat. No. 9,198,301, which is the National Stage of International Application No. PCT/US2009/057514, filed Sep. 18, 2009, which claims the benefit of U.S. Provisional Application No. 61/098,117, filed Sep. 18, 2008, the entireties of which are hereby incorporated herein by reference. Any disclaimer that may have occurred during the prosecution of the above-referenced applications is hereby expressly rescinded.
- The present invention pertains to methods for attaching a hydromechanical valve to a circuit assembly, and in particular to rebuilding a printed circuit assembly of an electrohydraulic assembly.
- Within the field of the automotive aftermarket, there are numerous parts that are considered to be “non-serviceable” items. In such cases, a new part is purchased at a substantial cost to the end user. In the field of automatic transmissions, one such common device is the solenoid module assembly that controls hydraulic flow and pressure within the transmission. A typical solenoid module includes a hydraulic manifold and one or more electromechanical solenoids. The hydraulic manifold contains numerous fluid circuit passages that hydraulically communicate with the solenoids. The electromechanical solenoids control either the flow (on/off control) through the passages or regulate pressure within the passages. Typically, the solenoids are electrically connected to a terminal housing that provides for a removable connection to a wire harness, allowing for communication to the powertrain control unit (PCU).
- One such apparatus is described in U.S. Pat. Nos. 4,678,006 and 4,783,049. In the disclosure, a device including five electrically actuated solenoid assemblies are situated on an aluminum manifold block including multiple fluid passageways. The connections for the solenoids includes round pins that extrude upwards through a circuit board and are soldered into place. The circuit board consists of strips of copper forming circuit tracks that are further encased in plastic, herein generally referred to as a circuit board assembly (CBA). The CBA interconnects to a terminal connector providing communication through a wire harness to the PCU. This particular solenoid module is used in the Ford E4OD and 4R100 automatic transmission since 1989. It has several well-known failure modes and is a common replacement item. These new modules typically cost $150-200 to the end user.
- Another such apparatus is described in U.S. Pat. No. 6,056,908. The disclosure is for a method of producing a solenoid module assembly with similar features to the '006 and '049 patents. In this design, an overmolded circuit assembly is described where circuit tracks are formed from strips of beryllium copper and overmolded with plastic. Furthermore, connection with the solenoids and terminal connection is preferably through the use of M shaped slots in which the solenoid terminals are pressed through, creating a friction type connection. The connection between the solenoid terminal and circuit track is made by the pressure generated from the displaced slot. This forms a one-way barbed type connection that prevents easy removal of the circuit track. This may prevent the slot from “backing off” the solenoid terminal. However, this connection style inhibits the removal of the circuit assembly for servicing. One feature of this style of connection is that rectangular pins are used.
- A variation of the '908 design is the
solenoid module 50P produced by Bosch that is used in the 2002-2003 Ford 5R55 W, 2004-up 5R55S and the 1999-up 5R55N automatic transmissions. This module is shown inFIG. 1 . This solenoid module has high failure rates, similar to the E4OD/4R100 solenoid module described in the '006 and '049 patents. This solenoid module costs the end user between $200-300. There has been extensive interest in rebuilding this module as generally the failure is localized to an individual solenoid (56P) (57P) (58P) or a broken circuit track (71P) within the assembly. However, the major obstacle has been the CBA that cannot be easily removed in one piece for reuse. - The CBA 70P includes
multiple circuit tracks 71P that are placed within twoplastic housings circuit assembly 71P flexes, which releases the snapped connections between the twohousings -
FIG. 2 is a picture of the 5R55 module from the CBA side.FIG. 3 is a picture of a CBA without the top housing half, exposing theinternal circuit tracks 71P.FIG. 4 is an enlarged picture of the terminal connection area, which shows spring-loaded frictional fits in the form of the barbed, press-fit connections 78P. In this figure, the rectangular configuration of thepins 77P can be seen clearly.FIG. 5 is a picture of typical results when attempting removal of the CBA. In this figure, it can be seen that the circuit tracks have snapped out of position, and thebarbed connection 78P are no longer in reliable electrical communication with the internal circuitry ofcircuit tracks 71P.FIG. 6 is a picture of themodule 50P after removal of the CBA 70P andmanifold 52P.FIG. 7 is a picture of a failed circuit track within the assembly. - What is needed is a reliable, low cost method to rebuild electro-hydromechanical assemblies. Various embodiments of the present invention do this in novel and nonobvious ways.
- Some embodiments of the present invention relates to a fluid control device including several actuators, such as but not limited to solenoids, arranged and secured within a manifold block. This solenoid block assembly or module is primarily adapted for automatic transmissions used in motor vehicles; however, the present invention is not so limited, and can be used in any application involving the interconnection of the electrical leads of any kind of actuator to a printed circuit assembly.
- Yet other embodiments pertain to a printed circuit assembly (PCA) that allows for rebuilding a solenoid module. In some embodiments a new PCA replaces an original, non-soldered circuit assembly, providing for quicker replacement and improved connection. In yet other embodiments, a printed circuit assembly (including etched circuit paths or circuit traces) replaces an existing circuit board assembly, such as a CBA including strips of conductive material placed within nonconductive material such as plastic.
- It will be appreciated that the various apparatus and methods described in this summary section, as well as elsewhere in this application, can be expressed as a large number of different combinations and subcombinations. All such useful, novel, and inventive combinations and subcombinations are contemplated herein, it being recognized that the explicit expression of each of these combinations is excessive and unnecessary.
-
FIG. 1 : An existing solenoid module -
FIG. 2 : The solenoid module ofFIG. 1 from circuit assembly side, with interconnections intact. -
FIG. 3 : The solenoid module from circuit assembly side without top assembly housing -
FIG. 4 : Circuit assembly barbed connection fromFIG. 2 . -
FIG. 5 : Typical results after circuit assembly removal for apparatus ofFIG. 2 , with the interconnections broken. -
FIG. 6 : Solenoid module ofFIG. 1 from circuit assembly side after circuit assembly removal -
FIG. 7 : Typical failure mode of a known CBA design. -
FIG. 7A is a partial view of the design depicted inFIG. 7 . -
FIG. 8a : Connection hole configuration according to one embodiment of the present invention. -
FIG. 8b : Connection hole configuration according to another embodiment of the present invention. -
FIG. 8c : Connection hole configuration according to another embodiment of the present invention. -
FIG. 9 shows the front side of one embodiment of the invention. -
FIG. 10 shows the back side of the apparatus ofFIG. 9 . -
FIG. 11a is a depiction a front side view of an interconnect area according to one embodiment of the present invention. -
FIG. 11b is a cross-sectional view of an interconnect area opening according to one embodiment of the present invention. -
FIG. 11c is a view of the apparatus ofFIG. 11a from the rear. -
FIG. 12 is a depiction of a backside view of an interconnect area according to one embodiment of the present invention. -
FIG. 13 is a depiction of a typical bolt clearance according to one embodiment of the present invention. -
FIG. 14 is a cross-sectional view of a PCA according to one embodiment of the present invention. -
FIG. 15 is a photographic representation of the PCA assembled on the solenoid module according to one embodiment of the present invention. -
FIG. 16 shows a side view of the apparatus ofFIG. 15 . -
FIG. 17 —Front side enlarged view of a PCA according to one embodiment of the present invention. -
FIG. 18 —Back side enlarged view of the apparatus ofFIG. 17 . -
FIG. 19 —Cross sectional enlarged view of the apparatus ofFIG. 17 showing conductive walls of interconnection holes. - For the purposes of promoting an understanding of the principles of the invention, reference will now be made to the embodiments illustrated in the drawings and specific language will be used to describe the same. It will nevertheless be understood that no limitation of the scope of the invention is thereby intended, such alterations and further modifications in the illustrated device, and such further applications of the principles of the invention as illustrated therein being contemplated as would normally occur to one skilled in the art to which the invention relates. At least one embodiment of the present invention will be described and shown, and this application may show and/or describe other embodiments of the present invention. It is understood that any reference to “the invention” is a reference to an embodiment of a family of inventions, with no single embodiment including an apparatus, process, or composition that must be included in all embodiments, unless otherwise stated.
- The use of an N-series prefix for an element number (NXX.XX) refers to an element that is the same as the non-prefixed element (XX.XX), except as shown and described thereafter. As an example, an element 1020.1 would be the same as element 20.1, except for those different features of element 1020.1 shown and described. Further, common elements and common features of related elements are drawn in the same manner in different figures, and/or use the same symbology in different figures. As such, it is not necessary to describe the features of 1020.1 and 20.1 that are the same, since these common features are apparent to a person of ordinary skill in the related field of technology. Although various specific quantities (spatial dimensions, temperatures, pressures, times, force, resistance, current, voltage, concentrations, wavelengths, frequencies, heat transfer coefficients, dimensionless parameters, etc.) may be stated herein, such specific quantities are presented as examples only. Further, with discussion pertaining to a specific composition of matter, that description is by example only, and does not limit the applicability of other species of that composition, nor does it limit the applicability of other compositions unrelated to the cited composition.
- Those element numbers that are followed with “P” refer to elements pertaining to known designs.
- One embodiment of the present invention is a printed circuit assembly (PCA) with an interconnect opening that allows for the rectangular style terminal pins to connect to the assembly instead of a CBA. Whereas
- A PCA includes a printed circuit board (PCB) including etched, conductive circuit paths, as well as other installed components such as electronic components including thermistors, diodes, resistors, etc.
- Many existing solenoid assemblies of automatic transmissions use a circuit board assembly (CBA) to interface electrical signals from a computer controller to the electrohydraulic valves that turn the electrical signals into fluid power within the automatic transmission. Since the transmission fluid is hot (in excess of 300 F) and the transmission's internal environment is mechanically challenging (from gear train vibration and engine vibration), the solenoid assembly needs to be rugged.
- A CBA includes individual strips of conductive material, such as copper, forming circuit paths and encased in plastic, for example either overmolded plastic or a plastic sandwich. Further, many CBAs include electrical connections to solenoids or other components that are chosen for the ability of the connector to withstand the harsh environment, but often these connections are intended to be made permanently and quickly in a high production environment. These CBA assemblies and connectors have been chosen for various reasons, including their ruggedness in the extreme vibration, temperature, and contamination environment within the inside of an automatic transmission, but the connectors in particular are seriously compromised with respect to reparability. However, reparability often becomes an issue because other components within the solenoid assembly are not as rugged as the CBA, and these other components may fail prematurely. When these failures take place, even when the failures are simple and readily identifiable, the entire solenoid assembly is often discarded because the electrical connections of the CBA are irreparably damaged during disassembly. Discarding these solenoid assemblies is an economic problem and an environmental problem.
- One embodiment of the present invention is shown in
FIGS. 8 to 19 .Solenoid Assembly 50 includes a printedcircuit assembly 20 with connection features that are sufficiently rugged to withstand the transmission internal environment, yet still be repairable.FIGS. 8a and 8b show interconnect opening ofPCA 20 according to two embodiments. Theinterconnect openings 23 of thePCA 20 can be soldered onto the terminal pins 77 of the existing solenoids 56, which is a more secure connection and allows for ease of future servicing of the module. In addition, the embodiment is an improvement over existing designs by reducing the occurrence of broken circuit tracks, such as that shown inFIG. 7 . This embodiment enables the rebuilding of such solenoid modules, including repair or replacement of individual elements within the module, providing an alternative to the expensive new modules. It is estimated that a rebuilt module would cost about 50% of a new one. - An apparatus according to one embodiment of the present invention comprises a PCA that has connection openings according to
FIGS. 8a and 8b .FIG. 8a shows apin 77 inserted within ahole 23 b of a printed circuit assembly 21. Aninterconnect area 23 a comprising a conductive material surroundsopening 23 b.Opening 23 b includes generallyparallel sides 23 b 1 and 23 b 2 interconnected at top and bottom (with reference to orientation ofFIG. 8a ) by roundededges 23 b 3 and 23 b 4. Preferably, the rounded ends 23 b 3 and 23 b 4 of opening 23 b are semi-circular, although the present invention further contemplates those designs in which the ends are not rounded, but are any curved design that preferably avoids sharp corners. As another example, some embodiments of the present invention contemplate the use of a substantially rectangular opening in the PCA that includes rounded corners. - Preferably, the opposing ends of connection opening 23 b are sufficiently large so as to provide clearance from respective end edges 77-3 and 77-4 of
pin 77. Typical clearance is about 0.05 mm/side along the parallel sides. Rounded ends of theconnection opening 23 b are preferred in some embodiments in order to reduce corner stresses in the circuit card itself. -
FIG. 8b shows an alternative embodiment. Aconnection opening 23 b′ is defined within a printed circuit assembly 21′ for interconnection with a generally rectangular cross sectionedpin 77.Opening 23 b′ includes first and second parallel sides that are interconnected at either end with rounded ends 23 b 3′ and 23 b 4′. These rounded ends are generally circular in area. However, the diameter of the defined circular end is greater than the width between theparallel sides 23 b 1′ and 23 b 2′. By introducing a larger diameter at the ends, a further reduction in the concentration of flexing stresses within the printed circuit assembly can be expected. -
FIG. 8c shows another alternative embodiment. Aconnection opening 23 b″ is defined within a printed circuit assembly 21″ for interconnection with a generally rectangular cross sectionedpin 77.Opening 23 b″ includes first and second parallel sides that are interconnected at either end withrounded corners 23 b 3″, each pair of rounded corners being interconnected with astraight section 23 b 5″. These rounded corners are generally circular. By introducing a larger diameter corners at the ends of a substantiallyrectangular hole 23″, a further reduction in the concentration of flexing stresses within the printed circuit assembly can be expected. - The preferred dimensions (in millimeters) are shown in
FIG. 8 only for illustrative purposes. The PCA connection openings allow for insertion onto a rectangular pin and soldered connections along the lengths. Preferably, the clearance provided at the ends of the slot (between the ends of the pin and the facing edges of the connection opening) are not so great that a solder connection is not made. - In one embodiment, the printed circuit board (PCB) of described PCA is comprised of the Flame Retardant 4 (FR-4) epoxy resin material for the core. The board is plated with copper on one side to create the interconnection traces (22) between the solenoids and
terminal connector 60 and the front side connection pads (23 a). A further copper layer is deposited creating the back side connection pads (23 c) and the thru hole wall (23 b). This provides a conductive material on the through, interconnection holes for mating with the pins. A green solder mask is applied over both sides of the assembly, except in the areas of the connection openings (23 a)(23 c) and walls (23 b). In the areas around the connection openings (23 a)(23 c) and walls (23 b), a solder coating is applied over the copper. This coating assists the soldering process when installing the assembly on the module and protects the copper in these areas from oxidization. - A thermistor (17) is inserted across the two pins denoted (29) in
FIG. 9 . The thermistor preferably has a resistance of about 30 k ohm at 25° C. and is soldered into place. However, the thermistor may be crimped into place as well. After insertion and connection of the thermistor with the PCB, the unit is herein referred to as a PCA. - After insertion of the PCA on the module and the subsequent soldering of the terminal pins, a cover may be inserted over the PCA to protect the assembly during installation into the vehicle. The preferred material of the cover is a thermoplastic such as Nylon 6/6 with 30% glass filler. One or more mechanical fasteners may also be used to provide mechanical connection of the PCA to the module assembly. This would relieve the soldered connections from physically supporting the PCA and help alleviate possible vibration.
- Referring to
FIG. 14 , which includes a cross sectional view of a typical circuit trace (22), the printed circuit board (PCB) core (30.1) is comprised of Flame Retardant 4 (FR-4) epoxy resin material. The core is cut to form the geometry shown inFIGS. 9 and 10 , including bolt clearance holes (28), interconnect holes (23), thermistor holes (29), connector window hole (27) and miscellaneous module feature clearance holes (10). Six pairs of interconnect areas (23) can be seen in the general center of the PCA assembly (20). Interconnect areas (23) each include a front side interconnect pad (23 a) comprising conductive material and in electrical communication with acircuit trace 22; a hole (23 b) with electrically conductive surfaces; and an electrically conductive interconnect area (23 c) on the backside of PCA (20). Six pairs of interconnect holes (23) provide electrical communication to the terminal housing (60). PCA (20) includes a plurality of other interconnect areas (23) throughout the area of the PCA. - The PCB is plated with copper (31) on the front side to form the circuit traces (22), interconnect areas (23), and printed text areas (25) (26). The PCB is plated with copper (31) on the back side to form the interconnect areas (23). A green solder mask (32) is applied on both sides in all areas except in the interconnect areas (23). A solder layer is applied over exposed copper in the interconnect areas (23) to aid with solder connection to module solenoids and connector terminals. This layer forms an exposed front pad (23 a), back pad (23 c) and the walls of the through hole (23 b). Final overall thickness of the PCB is approximately 1.6 mm.
- In the preferred embodiment of the invention, a thermistor (17) is inserted from the backside in the thermistor holes (29) and soldered in place, thermistor holes (29) include an electrically conductive area (29 a) on the front side of
PCB 20; a through hole (29 b) having electrically conductive inner surfaces; and an interconnect area (29 c) on the backside ofPCB 20. The preferred thermistor is a negative temperature coefficient (NTC) type that has a nominal resistance of 30 k ohms at 25° C. with a beta coefficient (K) of approximately 3900. - Upon assembly of the thermistor with the PCB, the printed circuit assembly (PCA) is assembled onto the rebuilt solenoid module (50) and soldered in place. A complete functional testing of the assembly is performed. There are several aspects to the use of various embodiments of the present invention with electro-hydromechanical assemblies, such as the 5R55S, 5R55 W and 5R55N solenoid modules. First, the connection between the circuitry and the solenoids and connection terminals are more robust than the original barbed style connectors and better able to withstand vibration and mechanical loading. Second, the masked circuit traces printed on the PCA are less susceptible to contamination. Third, the circuit traces are not susceptible to the mechanical stress that cause the original circuit tracks to break, as shown in
FIG. 7 . Fourth, the preferred embodiment provides instructions to the end user that aids installation. For example, the specified bolt torque of 8 N-m is communicated by text (25). Also, the specified torque sequence is communicated by text (26). This eliminates the need for the end user to research the specifications or to install without the required information. It also helps to prevent returned assemblies because of improper installation. - While the inventions have been illustrated and described in detail in the drawings and foregoing description, the same is to be considered as illustrative and not restrictive in character, it being understood that only the preferred embodiment has been shown and described and that all changes and modifications that come within the spirit of the invention are desired to be protected.
Claims (16)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US16/107,755 US20190183125A1 (en) | 2008-09-18 | 2018-08-21 | Printed circuit assembly for a solenoid module for an automatic transmission |
Applications Claiming Priority (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US9811708P | 2008-09-18 | 2008-09-18 | |
PCT/US2009/057514 WO2010033827A1 (en) | 2008-09-18 | 2009-09-18 | Printed circuit assembly for a solenoid module for an automatic transmission |
US201113119041A | 2011-06-27 | 2011-06-27 | |
US14/850,243 US9364000B2 (en) | 2012-05-30 | 2015-09-10 | Method of controlling pests with fused heterocyclic compound |
US29/540,243 USD883240S1 (en) | 2008-09-18 | 2015-09-22 | Printed circuit for an automatic transmission solenoid module |
US16/107,755 US20190183125A1 (en) | 2008-09-18 | 2018-08-21 | Printed circuit assembly for a solenoid module for an automatic transmission |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/540,243 Continuation USD883240S1 (en) | 2008-09-18 | 2015-09-22 | Printed circuit for an automatic transmission solenoid module |
Publications (1)
Publication Number | Publication Date |
---|---|
US20190183125A1 true US20190183125A1 (en) | 2019-06-20 |
Family
ID=42039892
Family Applications (4)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US13/119,041 Active 2032-07-27 US9198301B2 (en) | 2008-09-18 | 2009-09-18 | Printed circuit assembly for a solenoid module for an automatic transmission |
US14/850,253 Active US9844137B2 (en) | 2008-09-18 | 2015-09-10 | Printed circuit assembly for a solenoid module for an automatic transmission |
US29/540,243 Active USD883240S1 (en) | 2008-09-18 | 2015-09-22 | Printed circuit for an automatic transmission solenoid module |
US16/107,755 Abandoned US20190183125A1 (en) | 2008-09-18 | 2018-08-21 | Printed circuit assembly for a solenoid module for an automatic transmission |
Family Applications Before (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US13/119,041 Active 2032-07-27 US9198301B2 (en) | 2008-09-18 | 2009-09-18 | Printed circuit assembly for a solenoid module for an automatic transmission |
US14/850,253 Active US9844137B2 (en) | 2008-09-18 | 2015-09-10 | Printed circuit assembly for a solenoid module for an automatic transmission |
US29/540,243 Active USD883240S1 (en) | 2008-09-18 | 2015-09-22 | Printed circuit for an automatic transmission solenoid module |
Country Status (3)
Country | Link |
---|---|
US (4) | US9198301B2 (en) |
CA (1) | CA2745720A1 (en) |
WO (1) | WO2010033827A1 (en) |
Families Citing this family (35)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2010033827A1 (en) | 2008-09-18 | 2010-03-25 | Advanced Powertrain Engineering, Llc | Printed circuit assembly for a solenoid module for an automatic transmission |
US9224999B2 (en) * | 2008-10-30 | 2015-12-29 | Infineon Technologies Americas Corp. | Vehicle battery module |
CA2717752C (en) | 2009-10-15 | 2018-01-23 | Advanced Powertrain Engineering, Llc | Method of rebuilding solenoids for automatic transmissions |
CN102468374A (en) * | 2010-11-11 | 2012-05-23 | 展晶科技(深圳)有限公司 | Manufacturing method for light-emitting diode |
US9970533B2 (en) | 2013-11-27 | 2018-05-15 | Advanced Powertrain Engineering, Llc | Solenoid rebuilding method for automatic transmissions |
DE102015206616A1 (en) * | 2015-04-14 | 2016-10-20 | Zf Friedrichshafen Ag | Printed circuit board for electronic function control for a vehicle |
WO2018010814A1 (en) | 2016-07-15 | 2018-01-18 | Hewlett-Packard Development Company, L.P. | Electrical device and shielding method |
WO2018132093A1 (en) * | 2017-01-11 | 2018-07-19 | Borgwarner Inc. | Solenoid body with integrated lead frame |
US11662698B2 (en) | 2018-07-23 | 2023-05-30 | CACI, Inc.—Federal | Methods and apparatuses for detecting tamper using machine learning models |
USD915310S1 (en) * | 2019-02-12 | 2021-04-06 | Analog Devices, Inc. | Circuit board |
USD920937S1 (en) * | 2019-03-29 | 2021-06-01 | Shindengen Electric Manufacturing Co., Ltd. | Power module device containing semiconductor elements |
JP1659673S (en) * | 2019-08-29 | 2020-05-18 | ||
JP1659716S (en) * | 2019-08-29 | 2020-05-18 | ||
JP1659675S (en) | 2019-08-29 | 2020-05-18 | ||
JP1659676S (en) | 2019-08-29 | 2020-05-18 | ||
JP1659678S (en) | 2019-08-29 | 2020-05-18 | ||
JP1659674S (en) * | 2019-08-29 | 2020-05-18 | ||
JP1659677S (en) * | 2019-08-29 | 2020-05-18 | ||
USD958762S1 (en) * | 2019-09-09 | 2022-07-26 | The Noco Company | Circuit board |
USD945008S1 (en) * | 2019-11-05 | 2022-03-01 | Oyak Global Investments S.A. | Tubing support plate and microfluidic disc |
USD952178S1 (en) * | 2019-11-05 | 2022-05-17 | Oyak Global Investments S.A. | Tubing support plate |
USD933823S1 (en) * | 2019-11-05 | 2021-10-19 | Oyak Global Investments S.A. | Tubing support plate |
USD951474S1 (en) * | 2019-11-05 | 2022-05-10 | Oyak Global Investments S.A. | Tubing support plate |
JP1678672S (en) * | 2019-11-07 | 2021-02-08 | ||
USD941786S1 (en) * | 2019-11-22 | 2022-01-25 | T-Worx Holdings, LLC | Circuit board |
USD937230S1 (en) * | 2019-12-20 | 2021-11-30 | Fleece Performance Engineering, Inc. | Circuit board |
USD941788S1 (en) * | 2020-03-06 | 2022-01-25 | Norman R. Byrne | Circuit board |
USD909319S1 (en) | 2020-07-08 | 2021-02-02 | Impact Ip, Llc | Circuit board |
USD995457S1 (en) | 2021-06-18 | 2023-08-15 | Fleece Performance Engineering, Inc. | Circuit board |
USD995456S1 (en) | 2021-06-18 | 2023-08-15 | Fleece Performance Engineering, Inc. | Circuit board |
USD1022931S1 (en) * | 2021-08-02 | 2024-04-16 | Hewlett-Packard Development Company, L.P. | Integrated circuit |
USD999748S1 (en) * | 2021-12-02 | 2023-09-26 | Ace Technologies Corporation | Printed circuit board |
JP1730244S (en) * | 2021-12-21 | 2022-11-21 | flexible printed circuit board | |
USD986191S1 (en) * | 2023-01-12 | 2023-05-16 | Lincun Wen | Circuit board |
USD986192S1 (en) * | 2023-01-12 | 2023-05-16 | Lincun Wen | Circuit board |
Family Cites Families (89)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3477055A (en) * | 1967-12-22 | 1969-11-04 | Gen Motors Corp | Thermistor construction |
US4160503A (en) | 1978-08-07 | 1979-07-10 | Ohlbach Ralph C | Shipping container for printed circuit boards and other items |
US4429459A (en) | 1981-06-17 | 1984-02-07 | Amp Incorporated | Electrical terminal with cavity compensator |
US4783049A (en) * | 1986-03-24 | 1988-11-08 | Lectron Products, Inc. | Electrically operated automatic transmission controller assembly |
US4678006A (en) | 1986-03-24 | 1987-07-07 | Lectron Products, Inc. | Electrically operated automatic transmission controller assembly |
JPS62229896A (en) * | 1986-03-29 | 1987-10-08 | 株式会社東芝 | Printed wiring board |
DE3634349C1 (en) | 1986-10-09 | 1987-05-21 | Daimler Benz Ag | Assembly of several directional valves that can be switched electromagnetically independently |
DE3720925A1 (en) | 1987-06-25 | 1989-01-05 | Wabco Westinghouse Fahrzeug | PCB |
EP0350504B1 (en) | 1987-12-14 | 1993-06-16 | ALFRED TEVES GmbH | Valve block aggregate |
US4980217A (en) * | 1988-07-29 | 1990-12-25 | Grundfest Michael A | Printed circuit board fabrication |
US4932439A (en) | 1988-12-12 | 1990-06-12 | Colt Industries Inc. | Solenoid actuated three-way valve |
US4947893A (en) | 1989-02-28 | 1990-08-14 | Lectron Products, Inc. | Variable force solenoid pressure regulator for electronic transmission controller |
JPH03157576A (en) | 1989-11-15 | 1991-07-05 | Aisin Aw Co Ltd | Three-way solenoid valve and manufacture thereof |
US5093183A (en) | 1990-09-13 | 1992-03-03 | Sundstrand Corporation | Printed circuit board with layer and order of assembly identification |
US5090109A (en) | 1991-02-12 | 1992-02-25 | Milton Haas | Method to replace a solenoid unit in a starter motor assembly |
US5184644A (en) | 1991-05-30 | 1993-02-09 | Coltec Industries Inc. | Solenoid operated pressure regulating valve |
US5217047A (en) | 1991-05-30 | 1993-06-08 | Coltec Industries Inc. | Solenoid operated pressure regulating valve |
US5121769A (en) | 1991-05-30 | 1992-06-16 | Coltec Industries Inc. | Solenoid operated pressure regulating valve |
US5129145A (en) | 1991-07-29 | 1992-07-14 | Westinghouse Air Brake Company | Valve reconditioning process |
DE4344584C2 (en) | 1993-12-24 | 1996-12-12 | Kostal Leopold Gmbh & Co Kg | Arrangement of solenoid valves, a central plug and a circuit board on a control housing of an automatic switching device of a gear change transmission |
US5449227A (en) | 1994-07-08 | 1995-09-12 | Ford Motor Company | Solenoid attachment for antilock brake system |
JPH0854080A (en) | 1994-08-09 | 1996-02-27 | Nisshinbo Ind Inc | Pressure control device integral with electronic control device |
US5452948A (en) * | 1994-10-07 | 1995-09-26 | The Whitaker Corporation | Apparatus and method for electronically controlled hydraulic actuator |
US5611370A (en) | 1994-11-10 | 1997-03-18 | Saturn Electronics & Engineering, Inc. | Proportional variable force solenoid control valve and transmission fluid control device |
DE19529550A1 (en) | 1995-08-11 | 1997-02-13 | Hydraulik Ring Gmbh | Control device, in particular for transmissions of motor vehicles, and method for producing a control device |
JP3412360B2 (en) | 1995-10-06 | 2003-06-03 | アイシン・エィ・ダブリュ株式会社 | Automatic transmission |
USD443123S1 (en) | 1996-01-24 | 2001-05-29 | Citec Environnement | Waste paper basket |
US5855229A (en) | 1996-03-18 | 1999-01-05 | Lectron Products, Inc. | Solenoid manifold assembly |
US5680883A (en) | 1996-04-24 | 1997-10-28 | Eaton Corporation | Manifold and valve assembly and filter/gasket therefor |
US5651391A (en) | 1996-05-06 | 1997-07-29 | Borg-Warner Automotive, Inc. | Three-way solenoid valve |
US5823071A (en) | 1996-10-31 | 1998-10-20 | Borg-Warner Automotive, Inc. | Integrated transmission control system |
US6019120A (en) | 1996-12-19 | 2000-02-01 | Saturn Electronics & Engineering, Inc. | Single stage variable force solenoid pressure regulating valve |
US6045025A (en) * | 1997-02-03 | 2000-04-04 | Fuji Photo Film Co., Ltd. | Method and apparatus for soldering and soldering land of a printed circuit board |
USD397093S (en) * | 1997-07-30 | 1998-08-18 | Il Kim | Printed circuit board with mounted components |
JP3627485B2 (en) | 1997-12-17 | 2005-03-09 | 三菱電機株式会社 | Vehicle pressure control device |
US6038918A (en) | 1997-12-22 | 2000-03-21 | William T. Newton | Instrument for testing automatic transmission fluid control devices |
US6713685B1 (en) * | 1998-09-10 | 2004-03-30 | Viasystems Group, Inc. | Non-circular micro-via |
US6057027A (en) * | 1998-09-24 | 2000-05-02 | Lucent Technologies Inc. | Method of making peripheral low inductance interconnects with reduced contamination |
US6315210B1 (en) | 1998-10-02 | 2001-11-13 | Lawler Manufacturing Co., Inc. | Thermostatic mixing valve |
DE19855547A1 (en) | 1998-12-02 | 2000-06-08 | Bosch Gmbh Robert | Electromagnetically actuated valve |
US6354674B1 (en) | 1998-12-11 | 2002-03-12 | Denso Corporation | Hydraulic control apparatus integrated with motor driving circuit unit |
USD429704S (en) * | 1999-03-10 | 2000-08-22 | Keonil Kang | Printed circuit board for wireless telephones |
US6161577A (en) | 1999-03-31 | 2000-12-19 | Daimlerchrysler Corporation | Solenoid assembly for an automatic transmission of a motor vehicle |
US6164160A (en) | 1999-04-21 | 2000-12-26 | Daimlerchrysler Corporation | Integrated solenoid circuit assembly |
US6155137A (en) | 1999-04-21 | 2000-12-05 | Daimlerchrysler Corporation | Adjustable solenoid assembly for an automatic transmission |
USD440209S1 (en) * | 1999-07-28 | 2001-04-10 | Keonil Kang | Board of wireless frequency for amplification of transmitting and receiving electric wave |
US6269827B1 (en) | 1999-10-07 | 2001-08-07 | Eaton Corporation | Electrically operated pressure control valve |
USD442149S1 (en) * | 2000-03-30 | 2001-05-15 | Keonil Kang | Printed circuit board for a wireless telephone |
USD442567S1 (en) * | 2000-05-30 | 2001-05-22 | Keonil Kang | Printed circuit board for a wireless telephone |
JP3814467B2 (en) | 2000-06-28 | 2006-08-30 | 株式会社日立製作所 | Electronic control device for vehicle |
USD442150S1 (en) * | 2000-07-24 | 2001-05-15 | Keonil Kang | RF module board of wireless telephone |
USD457146S1 (en) * | 2000-11-29 | 2002-05-14 | Kabushiki Kaisha Toshiba | Substrate for a semiconductor element |
US6612202B2 (en) | 2000-12-15 | 2003-09-02 | Siemens Vdo Automotive Corporation | Mechatronics sensor |
US6544138B2 (en) | 2001-05-08 | 2003-04-08 | Borg-Warner Automotive, Inc. | Electro-hydraulic module for automatic transmission control |
DE10127334A1 (en) * | 2001-06-06 | 2002-12-12 | Patent Treuhand Ges Fuer Elektrische Gluehlampen Mbh | circuit board |
US6832632B1 (en) | 2002-01-23 | 2004-12-21 | Sonnax Industries, Inc. | Boost valve assembly |
US6642460B2 (en) * | 2002-01-23 | 2003-11-04 | Eaton Corporation | Switch assembly employing an external customizing printed circuit board |
DE10211798A1 (en) | 2002-03-16 | 2004-05-19 | Festo Ag & Co. | Contacting device for valve drives and thus equipped valve assembly |
US6715510B2 (en) | 2002-06-10 | 2004-04-06 | Eaton Corporation | Electro-hydraulic controller for automatic transmissions |
US6653856B1 (en) | 2002-06-12 | 2003-11-25 | United Microelectronics Corp. | Method of determining reliability of semiconductor products |
JP3971667B2 (en) | 2002-06-25 | 2007-09-05 | 矢崎総業株式会社 | transmission |
JP4206855B2 (en) | 2002-09-03 | 2009-01-14 | 株式会社アドヴィックス | Electronic control unit housing |
USD490798S1 (en) | 2002-11-04 | 2004-06-01 | Disney Enterprises, Inc. | Clock radio |
US6922049B2 (en) * | 2003-02-04 | 2005-07-26 | Mitac International Corp. | Testing method for a printed circuit board formed with conductive traces for high-frequency differential signal transmission |
US7104273B1 (en) | 2003-04-28 | 2006-09-12 | Sonnax Industries, Inc. | Torque converter clutch regulator valve assembly and method of installation |
TWI246640B (en) | 2003-06-06 | 2006-01-01 | Aopen Inc | Fixing device of computer and motherboard |
US7220085B2 (en) | 2003-09-17 | 2007-05-22 | Sonnax Industries, Inc. | Universal jig/work holding fixture and method of use |
US7055549B2 (en) | 2004-01-08 | 2006-06-06 | Husco International, Inc. | Electrohydraulic valve assembly for controlling operation of engine cylinders |
US7180397B1 (en) * | 2004-02-20 | 2007-02-20 | Tyco Electronics Power Systems, Inc. | Printed wiring board having edge plating interconnects |
US7051993B2 (en) * | 2004-03-10 | 2006-05-30 | Eaton Corporation | Solenoid operated valve and method of making same |
US7572402B2 (en) | 2004-08-17 | 2009-08-11 | Borgwarner Inc. | Method of overmolding circuit |
TW200609711A (en) | 2004-09-15 | 2006-03-16 | Benq Corp | Assembled structure and clamping device thereof |
US7771144B1 (en) | 2004-09-17 | 2010-08-10 | Sonnax Industries, Inc. | Universal jig/work holding fixture and method of use |
CN1956625A (en) * | 2005-10-24 | 2007-05-02 | 鸿富锦精密工业(深圳)有限公司 | Printed circuit board |
USD552048S1 (en) * | 2005-10-26 | 2007-10-02 | Hon Hai Precision Industry Co., Ltd. | Printed circuit board |
US7707872B2 (en) * | 2006-09-25 | 2010-05-04 | Eaton Corporation | Method for testing a hydraulic manifold |
GB0619488D0 (en) | 2006-10-03 | 2006-11-08 | Cross Mfg 1938 Company Ltd | Brush seal assembly |
US20080089044A1 (en) | 2006-10-16 | 2008-04-17 | Raybestos Powertrain, Llc | Spacer block for rebuilt electrically operated automatic transmission controller assembly |
USD570800S1 (en) | 2006-11-27 | 2008-06-10 | Uniband Electronic Corp. | ISM-band printed antenna for a portion of a circuit board |
US7983024B2 (en) * | 2007-04-24 | 2011-07-19 | Littelfuse, Inc. | Fuse card system for automotive circuit protection |
US7645943B2 (en) * | 2007-07-11 | 2010-01-12 | Delphi Technologies, Inc. | Configurable printed circuit board |
TWM331763U (en) * | 2007-11-14 | 2008-05-01 | Simplo Technology Co Ltd | A PCB with advanced soldering holes and the same implemented on a battery set |
US8291927B2 (en) | 2008-02-28 | 2012-10-23 | Caterpillar Inc. | Remanufactured machine component and valve body remanufacturing process |
WO2010033827A1 (en) | 2008-09-18 | 2010-03-25 | Advanced Powertrain Engineering, Llc | Printed circuit assembly for a solenoid module for an automatic transmission |
CA2717752C (en) | 2009-10-15 | 2018-01-23 | Advanced Powertrain Engineering, Llc | Method of rebuilding solenoids for automatic transmissions |
US20130333218A1 (en) | 2010-10-15 | 2013-12-19 | Advanced Powertrain Engineering, Llc | Rebuilding solenoid assemblies for automatic transmissions |
USD642546S1 (en) * | 2010-07-16 | 2011-08-02 | Dbg Group Investments, Llc | Circuit board with LEDS for an integrated ozone laundry system |
USD639756S1 (en) * | 2010-07-16 | 2011-06-14 | Dbg Group Investments, Llc | Circuit board for integrated ozone laundry system |
USD676004S1 (en) | 2011-12-19 | 2013-02-12 | Mikhail LYUBACHEV | Printed circuit board for a mobile speaker unit |
-
2009
- 2009-09-18 WO PCT/US2009/057514 patent/WO2010033827A1/en active Application Filing
- 2009-09-18 CA CA2745720A patent/CA2745720A1/en not_active Abandoned
- 2009-09-18 US US13/119,041 patent/US9198301B2/en active Active
-
2015
- 2015-09-10 US US14/850,253 patent/US9844137B2/en active Active
- 2015-09-22 US US29/540,243 patent/USD883240S1/en active Active
-
2018
- 2018-08-21 US US16/107,755 patent/US20190183125A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
WO2010033827A1 (en) | 2010-03-25 |
US20160198573A1 (en) | 2016-07-07 |
US9844137B2 (en) | 2017-12-12 |
US20110248200A1 (en) | 2011-10-13 |
CA2745720A1 (en) | 2010-03-25 |
US9198301B2 (en) | 2015-11-24 |
USD883240S1 (en) | 2020-05-05 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US20190183125A1 (en) | Printed circuit assembly for a solenoid module for an automatic transmission | |
JP5969405B2 (en) | Automotive electronic module | |
US7713096B2 (en) | Modular electrical connector | |
US9520659B2 (en) | Connector device for a printed circuit board of a control device for a vehicle transmission, control system for a vehicle transmission and method for assembling a control system for a vehicle transmission | |
AU2015312015B2 (en) | Overmolded contact wafer and connector | |
US20090053943A1 (en) | Bringing a cable into contact with a flexible strip conductor | |
US7554230B2 (en) | Control circuit device for motor, method for manufacturing the device, and motor having the device | |
EP2796022B1 (en) | Control device and method for producing a control device for a motor vehicle | |
EP1915037A1 (en) | Bending-type rigid printed wiring board and process for producing the same | |
US20120214330A1 (en) | Device for fastening and contacting actuators | |
JP2010216552A (en) | Hydraulic control device for transmission | |
US20150064962A1 (en) | Sealed and un-mated electrical connection system using single insertion press fit pins | |
CN107852837A (en) | Electronic equipment with the circuit carrier in cassette housing | |
US9769945B2 (en) | Covering device for a contacting portion of a printed circuit board, control system for a mechatronic module and method for assembling a control system | |
DE102011085054A1 (en) | Control device for controlling oil pump motor in car, has isolation unit covered with punched grids and connected with floor structure and lid structure, where one of punched grids is electrically connected with circuit carrier | |
US7607924B2 (en) | Electronic control unit and method of manufacturing the same | |
US7943434B2 (en) | Monolithic molded flexible electronic assemblies without solder and methods for their manufacture | |
US7331795B2 (en) | Spring probe-compliant pin connector | |
MXPA04011700A (en) | Connecting a solenoid to a lead frame. | |
US9837773B2 (en) | Electrical connector | |
US9093799B2 (en) | Connector apparatus | |
JP3086471U (en) | Ignition coil for internal combustion engine | |
WO2012146457A2 (en) | Controller, control system and method for connecting a controller for a transmission of a vehicle to further transmission control elements | |
KR20140048936A (en) | Connector module, in particular for window lifter drives, and method for producing said module | |
EP3799545A1 (en) | On-board diagnostics connector device |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
STPP | Information on status: patent application and granting procedure in general |
Free format text: APPLICATION DISPATCHED FROM PREEXAM, NOT YET DOCKETED |
|
STPP | Information on status: patent application and granting procedure in general |
Free format text: DOCKETED NEW CASE - READY FOR EXAMINATION |
|
AS | Assignment |
Owner name: ADVANCED POWERTRAIN ENGINEERING, LLC, INDIANA Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:FATHAUER, PAUL;REEL/FRAME:051512/0193 Effective date: 20110616 |
|
STPP | Information on status: patent application and granting procedure in general |
Free format text: NON FINAL ACTION MAILED |
|
AS | Assignment |
Owner name: ADVANCED POWERTRAIN ENGINEERING, LLC, INDIANA Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:FATHAUER, PAUL;REEL/FRAME:053227/0878 Effective date: 20200716 |
|
STCB | Information on status: application discontinuation |
Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION |
|
AS | Assignment |
Owner name: SONNAX TRANSMISSION COMPANY, VERMONT Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:ADVANCED POWERTRAIN ENGINEERING, LLC;REEL/FRAME:053673/0496 Effective date: 20200824 |