US20190039941A1 - Shaping a glass substrate after cutting - Google Patents
Shaping a glass substrate after cutting Download PDFInfo
- Publication number
- US20190039941A1 US20190039941A1 US15/729,042 US201715729042A US2019039941A1 US 20190039941 A1 US20190039941 A1 US 20190039941A1 US 201715729042 A US201715729042 A US 201715729042A US 2019039941 A1 US2019039941 A1 US 2019039941A1
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- United States
- Prior art keywords
- glass substrate
- energy
- edge
- column
- laser beam
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Classifications
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/10—Glass-cutting tools, e.g. scoring tools
- C03B33/102—Glass-cutting tools, e.g. scoring tools involving a focussed radiation beam, e.g. lasers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K10/00—Welding or cutting by means of a plasma
- B23K10/003—Scarfing, desurfacing or deburring
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/0006—Working by laser beam, e.g. welding, cutting or boring taking account of the properties of the material involved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
- B23K26/042—Automatically aligning the laser beam
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
- B23K26/046—Automatically focusing the laser beam
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0643—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
- B23K26/0676—Dividing the beam into multiple beams, e.g. multifocusing into dependently operating sub-beams, e.g. an array of spots with fixed spatial relationship or for performing simultaneously identical operations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/083—Devices involving movement of the workpiece in at least one axial direction
- B23K26/0853—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
- B23K26/3568—Modifying rugosity
- B23K26/3576—Diminishing rugosity, e.g. grinding; Polishing; Smoothing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/361—Removing material for deburring or mechanical trimming
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
- B23K26/402—Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/0222—Scoring using a focussed radiation beam, e.g. laser
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/08—Severing cooled glass by fusing, i.e. by melting through the glass
- C03B33/082—Severing cooled glass by fusing, i.e. by melting through the glass using a focussed radiation beam, e.g. laser
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
- B23K2103/54—Glass
Definitions
- a method that includes projecting a first energy beam onto an annular edge of a glass substrate. A first portion of the annular edge of the glass substrate is removed with the first energy beam. Removing the first portion increases the roundness of the annular edge of the glass substrate. A second energy beam is projected onto the annular edge of the glass substrate. A second portion of the annular edge of the glass substrate is removed with the second energy beam. Removing the second portion increases the roundness of the annular edge of the glass substrate.
- FIGS. 1A-1E show a system configured to cut and shape a glass substrate according to one aspect of the present embodiments.
- FIGS. 2A-2B show a system including a Diffractive Optics, Micro-lens Arrays and Spatial Light Modulator (SLM) configured to cut and shape a glass substrate according to one aspect of the present embodiments.
- SLM Spatial Light Modulator
- FIGS. 3A-3F shows a system including an optical multiplexer box configured to cut and shape a glass substrate according to one aspect of the present embodiments.
- FIG. 4 shows a system including an optical multiplexer box configured to chemically alter a glass substrate into a shape defined by the chemical alteration according to one aspect of the present embodiments.
- FIG. 5 shows an exemplary flow diagram in accordance with one aspect of the present embodiments.
- FIGS. 6A, 6B, and 6C show a system for shaping an exposed edge of a previously cut glass substrate according to one aspect of the present embodiments.
- FIGS. 7A and 7B show a system for shaping an exposed edge with an energy source that is tangential to the exposed edge according to one aspect of the present embodiments.
- FIG. 8 shows a system for shaping an exposed edge with plasma according to one aspect of the present embodiments.
- FIG. 9 shows another exemplary flow diagram in accordance with one aspect of the present embodiments.
- FIG. 10 shows an additional exemplary flow diagram in accordance with one aspect of the present embodiments.
- ordinal numbers e.g., first, second, third, etc. are used to distinguish or identify different elements or steps in a group of elements or steps, and do not supply a serial or numerical limitation on the elements or steps of the embodiments thereof.
- first, second, and “third” elements or steps need not necessarily appear in that order, and the embodiments thereof need not necessarily be limited to three elements or steps.
- any labels such as “left,” “right,” “front,” “back,” “top,” “middle,” “bottom,” “beside,” “forward,” “reverse,” “overlying,” “underlying,” “up,” “down,” or other similar terms such as “upper,” “lower,” “above,” “below,” “under,” “between,” “over,” “vertical,” “horizontal,” “proximal,” “distal,” and the like are used for convenience and are not intended to imply, for example, any particular fixed location, orientation, or direction. Instead, such labels are used to reflect, for example, relative location, orientation, or directions. It should also be understood that the singular forms of “a,” “an,” and “the” include plural references unless the context clearly dictates otherwise.
- HAMR Heat Assisted Magnetic Recording
- PMR perpendicular media recording
- the glass substrates used in HAMR and PMR have stringent surface roughness with tight dimensional precision.
- the glass substrates are mechanically cut and grinded, causing fracturing and other surface anomalies.
- mechanically cutting the glass substrate results in large dimensional errors, which require subsequent edging to bring the glass substrate within the final tolerances.
- subsequent grinding is not only costly but also time consuming, thereby adversely impacting the throughput.
- an apparatus cuts and shapes the glass substrate in a non-mechanical fashion.
- laser technology is used to simultaneously cut and shape a glass substrate.
- the apparatus may include a beam splitter and a plurality of mirrors.
- the beam splitter is positioned to receive a laser beam from a source and split the received laser beam to a first plurality of split laser beams and a second plurality of split laser beams.
- the plurality of mirrors is configured to direct the first plurality of split laser beams and further configured to direct the second plurality of split laser beams.
- the first plurality of split laser beams directed by the plurality of mirrors is configured to cut a glass substrate.
- the second plurality of split laser beams directed by the plurality of mirrors is configured to shape the glass substrate.
- the apparatus may further include a Diffractive Optics, Micro-lens Arrays and Spatial Light Modulator (SLM) configured to receive a laser beam from the source, or from the plurality of mirrors, or from the beam splitter.
- the Diffractive Optics, Micro-lens Arrays and Spatial Light Modulator (SLM) is configured to bend the received laser beam that shapes the glass substrate. It is appreciated that in some embodiments, the Diffractive Optics, Micro-lens Arrays and Spatial Light Modulator (SLM) is configured to cut the glass substrate.
- FIGS. 1A-1E a system configured to cut and shape a glass substrate according to one aspect of the present embodiments is shown. More specifically, referring to FIG. 1A , a system 100 A is shown.
- the system 100 A includes a laser source 110 and an optical multiplexer box 180 .
- the laser source 110 is configured to generate one or more laser beams, e.g., laser beam 112 , that are received by the optical multiplexer box 180 .
- the optical multiplexer box 180 is positioned to manipulate the received laser beam to generate a modified laser beam(s), e.g., laser beams 126 , 133 , and 135 .
- the modified laser beam(s) is emitted onto a glass substrate.
- the modified laser beam(s) cuts and/or shapes the glass substrate.
- the glass substrate is cut and shaped simultaneously.
- references made to the laser beam being modified is a reference to one or more of the angle (e.g., incident/reflection/diffraction/refraction) of the laser beam changing, the coherency of the laser beam changing, the polarization of the laser beam changing, the magnitude of the laser beam changing, the wavelength of the laser beam changing, the intensity of the laser beam changing, the spot diameter of the laser beam changing, the pulse duration of the laser beam changing, the pulse shape of the laser beam changing, etc.
- the optical multiplexer box 180 includes a beam splitter 120 , and a plurality of mirrors, e.g., mirrors 132 and 134 .
- the beam splitter 120 is positioned to receive the laser beam 112 from the laser source 110 .
- the beam splitter 120 is configured to split the received laser beam 112 into more than one laser beam, e.g., laser beams 122 , 124 , and 126 . It is appreciated that some of the split laser beams may be directed using the mirrors 132 and 134 . For example, split laser beams 122 and 124 are emitted onto the mirrors 132 and 134 respectively at their respective incident angle.
- the incident angles for the split laser beams 122 and 124 may or may not be the same.
- the mirrors 132 and 134 therefore reflect the split laser beams 122 and 124 at their respective angle of reflection, e.g., reflected laser beams 133 and 135 .
- some split laser beam(s) may not be directed using mirrors, e.g., split laser beam 126 .
- the positioning of the mirrors 132 and/or 134 may be fixed or it may be modifiable, e.g., one or more mirrors may be rotated to change the angle of incident and the angle of reflection.
- the laser beams 126 , 133 and 135 may be emitted from the optical multiplexer box 180 onto the glass substrate.
- the glass substrate may be cut and shaped through means other than mechanical cutting and shaping.
- the laser beams 126 , 133 , and 135 may cut and shape the glass substrate simultaneously.
- a component e.g., diffractive optics, micro-lens arrays, spatial light modulator (SLM) for phase, wave front, and polarization control over the transverse direction of the laser, highly silvered mirrors on a linear piezo stage, pitch and yaw rotation stage, beam expander, beam compression, pulse stretching device, pulse shortening device, polarizing filter, polarizing rotator, photo-detector, beam shaping device (without shortening/stretching the pulse), fiber optic couplers, etc., may be positioned prior to or after the beam splitter 120 receiving the laser beam in order to modify the received laser beam, e.g., changing the coherency of the laser beam, changing the polarization of the laser beam, changing the magnitude of the laser beam, changing the wavelength of the laser beam, changing the intensity of the laser beam, changing the spot diameter of the laser beam, changing the pulse duration of the laser beam, changing the pulse shape of the laser beam, etc.
- SLM spatial light modulator
- a component may be positioned prior to or after the mirrors 132 and/or 134 receiving the split laser beams from the beam splitter 120 in order to modify the split laser beam, e.g., changing the coherency of the laser beam, changing the polarization of the laser beam, changing the magnitude of the laser beam, changing the wavelength of the laser beam, changing the intensity of the laser beam, changing the spot diameter of the laser beam, changing the pulse duration of the laser beam, changing the pulse shape of the laser beam, etc.
- a glass substrate 190 being cut/shaped is shown, as discussed in FIG. 1A .
- the modified laser beams e.g., laser beams 126 , 133 , and/or 135 , cut/shape the glass substrate 190 simultaneously in some embodiments. It is appreciated that in some embodiments, the cutting and shaping may occur sequentially but shortly after one another.
- the beam splitter 120 split the received laser beams into four split laser beams, e.g., laser beams 122 , 124 , 126 , and 128 .
- Split laser beams 126 and 128 are emitted onto the glass substrate directly without being directed by a mirror.
- the beam splitter 120 splits the received laser beams into a plurality of split laser beams 129 .
- the mirror 134 is replaced with a mirror 174 that has a plurality of mirrors.
- the mirror 132 is replaced with a mirror 172 that includes a plurality of mirrors.
- the mirror 172 receives a subset of the split laser beams and reflects a number of reflected split laser beams 136 .
- the mirror 174 receives a subset of the split laser beams and reflects a number of reflected split laser beams 137 .
- split laser beams may be emitted from the beam splitter 120 without being directed by a mirror.
- the split laser beams either being emitted from the beam splitter 120 and/or reflected from the mirrors are emitted from the optical multiplexer box 180 , thereby cutting and/or shaping the glass substrate.
- the mirrors 174 and 172 may be controlled using control signals 141 - 148 .
- the control signal 141 may control a mirror within the mirror 174 to move, therefore changing the angle of incident and as result changing the angle of reflection.
- Other mirrors may similarly be controlled.
- the mirrors are controlled using the control signal using a microelectrical component, e.g., a micro-electro mechanical device, piezo electric components, etc. to change their position in order to control the angle of incident and reflection.
- FIGS. 2A-2B a system including a Diffractive Optics, Micro-lens Arrays and Spatial Light Modulator (SLM) configured to cut and shape a glass substrate according to one aspect of the present embodiments is shown.
- FIG. 2A shows a system 200 A.
- the system 200 A includes a laser source 110 and an optical multiplexer box 280 .
- the laser source 110 is configured to generate one or more laser beams, e.g., laser beam 112 , that are received by the optical multiplexer box 280 .
- the optical multiplexer box 280 is positioned to manipulate the received laser beam to generate a modified laser beam(s).
- the modified laser beam(s) is emitted onto a glass substrate.
- the modified laser beam(s) cuts and/or shapes the glass substrate.
- the glass substrate is cut and shaped simultaneously.
- references made to the laser beam being modified is a reference to the angle (e.g., incident/reflection/diffraction/refraction) of the laser beam changing, the coherency of the laser beam changing, the polarization of the laser beam changing, the magnitude of the laser beam changing, the wavelength of the laser beam changing, the intensity of the laser beam changing, the spot diameter of the laser beam changing, the pulse duration of the laser beam changing, the pulse shape of the laser beam changing, etc.
- the optical multiplexer box 280 includes a Diffractive Optics, Micro-lens Arrays and Spatial Light Modulator (SLM) 210 .
- the Diffractive Optics, Micro-lens Arrays and Spatial Light Modulator (SLM) 210 may bend the received laser beam 112 , e.g., laser beam 212 .
- the Diffractive Optics, Micro-lens Arrays and Spatial Light Modulator (SLM) 210 may be configured to transmit the received laser beam 112 without bending it, e.g., laser beam 214 .
- the laser beams 212 and 214 output from the optical multiplexer box 280 may cut and/or shape the substrate glass.
- the laser beams 212 and 214 may cut and shape the substrate glass simultaneously.
- the Diffractive Optics, Micro-lens Arrays and Spatial Light Modulator (SLM) 210 may include a Gaussian diffractive optics, a Bessel diffractive optics, an Airy diffractive optics, or any combination thereof.
- the glass substrate 190 may be cut using two bended laser beams 216 and 218 .
- the glass substrate 190 once cut and shaped is shown as the glass substrate 192 .
- System 300 A includes a laser source 110 and an optical multiplexer box 380 .
- the laser source 110 is configured to generate one or more laser beams, e.g., laser beam 112 , that are received by the optical multiplexer box 380 .
- the optical multiplexer box 380 is positioned to manipulate the received laser beam(s) to generate a modified laser beam(s), e.g., laser beams 126 , 133 , 212 , and 135 .
- the modified laser beam(s) is emitted onto a glass substrate.
- the modified laser beam(s) cuts and/or shapes the glass substrate. In some embodiments, the glass substrate is cut and shaped simultaneously.
- references made to the laser beam being modified is a reference to the angle (e.g., incident/reflection/diffraction/refraction) of the laser beam changing, the coherency of the laser beam changing, the polarization of the laser beam changing, the magnitude of the laser beam changing, the wavelength of the laser beam changing, the intensity of the laser beam changing, the spot diameter of the laser beam changing, the pulse duration of the laser beam changing, the pulse shape of the laser beam changing, etc.
- the optical multiplexer box 380 includes a beam splitter 120 , a Diffractive Optics, Micro-lens Arrays and Spatial Light Modulator (SLM) 210 , and a plurality of mirrors, e.g., mirrors 132 and 134 .
- the beam splitter 120 is positioned to receive the laser beam 112 from the laser source 110 .
- the beam splitter 120 is configured to split the received laser beam 112 into more than one laser beam, e.g., laser beams 122 , 124 , 126 , and 312 . It is appreciated that some of the split laser beams may be directed using the mirrors 132 and 134 .
- split laser beams 122 and 124 are emitted onto the mirrors 132 and 134 respectively at their respective incident angle. It is appreciated that the incident angles for the split laser beams 122 and 124 may or may not be the same.
- the mirrors 132 and 134 therefore reflect the split laser beams 122 and 124 at their respective angle of reflection, e.g., reflected laser beams 133 and 135 . It is appreciated that some split laser beam(s) may not be directed using mirrors, e.g., split laser beam 126 . It is appreciated that the positioning of the mirrors 132 and/or 134 may be fixed or it may be modifiable, e.g., one or more mirrors may be rotated to change the angle of incident and the angle of reflection.
- the split laser beam 312 is emitted from the beam splitter 120 to the Diffractive Optics, Micro-lens Arrays and Spatial Light Modulator (SLM) 210 .
- the diffractive optics array 210 may bend the received split laser beam 312 to generate a bent laser beam 212 .
- the laser beams 126 , 133 , 135 , and 212 may be emitted from the optical multiplexer box 380 onto the glass substrate. As such, the glass substrate may be cut and shaped through means other than mechanical cutting and shaping. In some embodiments, the laser beams 126 , 133 , 135 , and 212 may cut and shape the glass substrate simultaneously.
- a component e.g., diffractive optics, micro-lens arrays, spatial light modulator (SLM) for phase, wave front, and polarization control over the transverse direction of the laser, highly silvered mirrors on a linear piezo stage, pitch and yaw rotation stage, beam expander, beam compression, pulse stretching device, pulse shortening device, polarizing filter, polarizing rotator, photo-detector, beam shaping device (without shortening/stretching the pulse), fiber optic couplers, etc., may be positioned prior to or after the beam splitter 120 receiving the laser beam in order to modify the received laser beam, e.g., changing the coherency of the laser beam, changing the polarization of the laser beam, changing the magnitude of the laser beam, changing the wavelength of the laser beam, changing the intensity of the laser beam, changing the spot diameter of the laser beam, changing the pulse duration of the laser beam, changing the pulse shape of the laser beam, etc.
- SLM spatial light modulator
- a component may be positioned prior to or after the mirrors 132 and/or 134 receiving the split laser beams from the beam splitter 120 in order to modify the split laser beam, e.g., changing the coherency of the laser beam, changing the polarization of the laser beam, changing the magnitude of the laser beam, changing the wavelength of the laser beam, changing the intensity of the laser beam, changing the spot diameter of the laser beam, changing the pulse duration of the laser beam, changing the pulse shape of the laser beam, etc.
- a component may be positioned prior to or after the Diffractive Optics, Micro-lens Arrays and Spatial Light Modulator (SLM) 210 receiving the split laser beams from the beam splitter 120 in order to modify the split laser beam, e.g., changing the coherency of the laser beam, changing the polarization of the laser beam, changing the magnitude of the laser beam, changing the wavelength of the laser beam, changing the intensity of the laser beam, changing the spot diameter of the laser beam, changing the pulse duration of the laser beam, changing the pulse shape of the laser beam, etc.
- SLM Spatial Light Modulator
- system 300 B is shown that operates substantially similar to that of FIG. 3A .
- the mirrors 132 and 134 are replaced with a plurality of mirrors 172 and 174 , similar to system 100 D discussed in FIG. 1D .
- system 300 C is shown that operates substantially similar to that of FIG. 3B .
- the mirrors 174 and 172 may be controlled using the control signals 141 - 148 , similar to system 100 E discussed in FIG. 1E .
- system 300 D is shown that operates substantially similar to that of FIG. 3A .
- the mirror 134 emits the reflected laser beam 135 to the Diffractive Optics, Micro-lens Arrays and Spatial Light Modulator (SLM) 210 instead of emitting it onto the glass substrate.
- the reflected laser beam 135 may be bent using the Diffractive Optics, Micro-lens Arrays and Spatial Light Modulator (SLM) 210 .
- the Diffractive Optics, Micro-lens Arrays and Spatial Light Modulator (SLM) 210 may bend the reflected laser beam 135 and output the bent laser beam 219 onto the glass substrate.
- the optical multiplexer box 380 may output laser beams 126 , 133 , 212 , and 219 to cut and/or shape the glass substrate. In some embodiments, the optical multiplexer box 380 may output laser beams 126 , 133 , 212 , and 219 to cut and shape the glass substrate simultaneously.
- system 300 E is shown that operates substantially similar to that of FIG. 3D .
- the mirrors 132 and 134 are replaced with mirrors 172 and 174 where each may include a plurality of mirrors, as discussed in system 100 D discussed in FIG. 1D .
- system 300 F is shown that operates substantially similar to that of FIG. 3E .
- the mirrors 172 and 174 may be controlled using the control signals 141 - 148 , similar to system 100 E discussed in FIG. 1E .
- FIG. 4 a system including an optical multiplexer box configured to chemically alter a glass substrate into a shape defined by the chemical alteration according to one aspect of the present embodiments is shown.
- a system including an optical multiplexer box may be used to chemically alter the glass substrate into a shape defined by the chemical alteration rather than cut the glass substrate.
- the output of the optical multiplexer box may focus the emitted laser beams onto the glass substrate 190 in order to alter the chemical properties of the glass substrate where the laser beam is focused.
- the chemical alteration delineates a desired cut/shape within the transparent glass substrate.
- the glass substrate 190 is placed in a chemical bath 410 , e.g., Potassium Hydroxide (KOH) ⁇ 1 um/s with selectivity of 350, Sodium Hydroxide (NaOH), Hydrofluoric acid (HF) ⁇ 1 um/s with selectivity of 100, etc.
- KOH Potassium Hydroxide
- NaOH Sodium Hydroxide
- HF Hydrofluoric acid
- the glass substrate 190 separates according to the shape defined by the chemical alteration.
- the glass substrate 190 separates at positioned on the glass substrate 190 where the laser beam was focused.
- the glass substrate may be formed and shaped without using mechanical cutting and grinding.
- a laser beam is generated, e.g., by a laser source.
- the generated laser beam is received by the optical multiplexer box 520 , e.g., as described in FIGS. 1A-4 .
- the optical multiplexer box 520 may manipulate the received laser beam, in step 530 , as described in FIGS. 1A-4 .
- the laser beam may be split into multiple laser beams, e.g., using a beam splitter.
- the received laser beam or one or more of the split laser beams may be bent, e.g., using Diffractive Optics, Micro-lens Arrays and Spatial Light Modulator (SLM).
- the received laser beam and/or the split laser beam(s) and/or the bent laser beam(s) may be directed, e.g., using one or mirrors. It is appreciated that the mirrors may be controlled using one or more control signals, as described above.
- the manipulated laser beam(s) is emitted from the optical multiplexer box 520 onto a glass substrate. As such, the glass substrate may be cut and shaped without using mechanical cutting and grinding.
- the glass substrate may be cut and shaped simultaneously.
- the optical multiplexer box may chemically alter the glass substrate into a shape defined by the chemical alteration rather than cut the glass substrate.
- the output of the optical multiplexer box may focus the emitted laser beams onto the glass substrate in order to alter the chemical properties of the glass substrate where the laser beam is focused.
- the chemical alteration delineates a desired cut/shape within the transparent glass substrate.
- the glass substrate is placed in a chemical bath, e.g., Aqueous solutions of Potassium Hydroxide (KOH) (concentrations of 5-20 mol/(dm)3, Sodium Hydroxide (NaOH) (concentrations of 5-20 mol/(dm)3), Hydrofluoric acid (HF) (concentrations of 1-10%), Muriatic acid (HCL) (concentrations of 10-80%).
- Bath times 5 min-100 min
- etch rates (1 um/min up to 20 um/min) can be adjusted by varying the chemical bath concentrations, bath temperature (between 20 and 90 degree Celsius), etc.
- the glass substrate 190 separates according to the shape defined by the chemical alteration. Further enhancement of etch rates can be achieved by applying ultrasonic or megasonic waves to the chemical bath.
- the glass substrate may be formed and shaped without using mechanical cutting and grinding.
- An energy source 602 is positioned to create an energy beam 604 (e.g. laser, plasma, etc.) along an exposed edge 606 of a glass substrate 608 .
- the energy beam 604 shapes the exposed edge 606 of the glass substrate 608 by removing portions of the exposed edge 606 of the glass substrate 608 .
- the glass substrate 608 may have been previously cut (e.g. by mechanical, laser, chemical, etc.) into an annular shape (e.g. a disc), thereby forming the exposed edge 606 .
- the exposed edge 606 extends annularly around the glass substrate 608 .
- the energy beam 604 may also be referred to as an energy column.
- a number of energy sources may be used to shape the exposed edge 606 .
- an additional energy source 610 may also be positioned to create an additional energy beam 612 along the exposed edge 606 of the glass substrate 608 .
- the additional energy beam 612 further shapes the exposed edge 606 of the glass substrate 608 by removing additional portions of the exposed edge 606 of the glass substrate 608 .
- any number of energy sources and energy beams may be used.
- one or more of the energy sources may be stationary and the glass substrate 608 may be rotatable. As such, the glass substrate 608 may rotate through the energy beams, thereby rotating the exposed edge 606 through the energy beams.
- a beam splitter may be positioned to create a number of energy beams from an energy source.
- a beam splitter may be positioned between the energy source 602 and the substrate 608 .
- the energy source 602 may project an incoming energy beam into the beam splitter.
- the beam splitter may then split the incoming energy beam into a first energy beam (e.g. energy beam 604 ) and a second energy beam (e.g. additional energy beam 612 ). It is understood that if a beam splitter is used to create the additional energy beam 612 , the additional energy source 610 will not be needed.
- one or more mirrors may be positioned to direct one or more of the energy beams along the exposed edge 606 of the glass substrate 608 .
- FIG. 6B illustrates a smooth and rounded exposed edge 606 .
- a number of energy beams may be directed along the exposed edge 606 of the glass substrate 608 .
- the roundness of the exposed edge 606 may also increase.
- the exposed edge 606 may be very angular (e.g. not round and pointed with corners), as illustrated by angular portion 614 .
- the exposed edge 606 is shaped by one or more energy beams the roundness increases, as illustrated by rounded portion 616 .
- the energy beams may be moved by one or more mirrors (as previously described) in order to increase the roundness of the exposed edge 606 .
- one or more Diffractive Optics, Micro-lens Arrays and Spatial Light Modulator (SLM)s may be positioned to bend one or more energy beams to shape the exposed edge 606 of the glass substrate 608 .
- the glass substrate 608 may rotate through the bent portion of the one or more energy beams, thereby directing the removal of portions of the glass substrate 608 along the exposed edge 606 .
- FIG. 6C illustrates a complex shaped exposed edge 606 .
- energy beams may be used to create any number of shapes (both simple and complex) in the exposed edge 606 of the glass substrate 608 .
- the exposed edge 606 may be shaped by any combination of linear energy beam(s) and/or bent energy beam(s).
- the exposed edge 606 may include a uniform shape around the circumference of the glass substrate 608 , or the exposed edge 606 may include a non-uniform shape around the circumference of the glass substrate 608 .
- a system 700 is shown for shaping an exposed edge with an energy source that is tangential to the exposed edge according to one aspect of the present embodiments.
- An energy source 702 is positioned to create an energy beam 704 (e.g. laser, plasma, etc.) along an exposed edge 706 of a glass substrate 708 .
- the energy beam 704 is tangential to the exposed edge 706 of the glass substrate 708 .
- the energy source 702 may also be positioned tangential to the exposed edge 706 of the glass substrate 708 .
- the energy source 702 may be positioned anywhere and the energy beam 704 may be directed tangentially to the exposed edge 706 through the use of various components described above (e.g. mirror, beam splitter, special diffractive optics array, etc.).
- the energy beam 704 shapes the exposed edge 706 of the glass substrate 708 by removing portions of the exposed edge 706 of the glass substrate 708 .
- the energy source 702 may include a mask feature 710 to shape a profile of the energy beam 704 .
- the energy beam 704 may be shaped to create any shape in the exposed edge 706 .
- the energy beam 704 may form a simple rounded edge, as illustrated in FIG. 7A .
- the energy beam 704 may form more complex shapes, as illustrated in FIG. 7B .
- High voltage electrodes 802 create a high density discharge 804 (e.g. plasma).
- the high density discharge 804 interacts with an exposed edge 806 of a glass substrate 808 , removing any material extending into the high density discharge 804 .
- lasers 810 may be used to guide and shape the high density discharge 804 into any shape.
- the high density discharge may be formed into a curvature.
- additional lasers may also be used to remove material from the exposed edge 806 .
- the high density discharge 804 may remove some material from the exposed edge 806 , and one or more additional lasers may also remove material from the exposed edge 806 .
- an energy source generates an energy column, wherein the energy source is stationary.
- an edge of a glass substrate is rotated through the energy column.
- portions of the edge of the glass substrate are removed with the energy column.
- a first energy beam is projected onto an annular edge of a glass substrate.
- a first portion of the annular edge of the glass substrate is removed with the first energy beam, wherein the removing the first portion increases the roundness of the annular edge of the glass substrate.
- a second energy beam is projected onto the annular edge of the glass substrate.
- a second portion of the annular edge of the glass substrate is removed with the second energy beam, wherein the removing the second portion increases the roundness of the annular edge of the glass substrate.
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Abstract
Description
- This application claims the benefit and priority to the U.S. Provisional Patent Application No. 62/542,216, filed on Aug. 7, 2017, U.S. Provisional Patent Application No. 62/542,232, filed on Aug. 7, 2017, and U.S. Provisional Patent Application No. 62/542,235, filed on Aug. 7, 2017, which are incorporated by reference herein in their entirety.
- Provided herein is a method that includes projecting a first energy beam onto an annular edge of a glass substrate. A first portion of the annular edge of the glass substrate is removed with the first energy beam. Removing the first portion increases the roundness of the annular edge of the glass substrate. A second energy beam is projected onto the annular edge of the glass substrate. A second portion of the annular edge of the glass substrate is removed with the second energy beam. Removing the second portion increases the roundness of the annular edge of the glass substrate.
- These and other features and advantages will be apparent from a reading of the following detailed description.
-
FIGS. 1A-1E show a system configured to cut and shape a glass substrate according to one aspect of the present embodiments. -
FIGS. 2A-2B show a system including a Diffractive Optics, Micro-lens Arrays and Spatial Light Modulator (SLM) configured to cut and shape a glass substrate according to one aspect of the present embodiments. -
FIGS. 3A-3F shows a system including an optical multiplexer box configured to cut and shape a glass substrate according to one aspect of the present embodiments. -
FIG. 4 shows a system including an optical multiplexer box configured to chemically alter a glass substrate into a shape defined by the chemical alteration according to one aspect of the present embodiments. -
FIG. 5 shows an exemplary flow diagram in accordance with one aspect of the present embodiments. -
FIGS. 6A, 6B, and 6C show a system for shaping an exposed edge of a previously cut glass substrate according to one aspect of the present embodiments. -
FIGS. 7A and 7B show a system for shaping an exposed edge with an energy source that is tangential to the exposed edge according to one aspect of the present embodiments. -
FIG. 8 shows a system for shaping an exposed edge with plasma according to one aspect of the present embodiments. -
FIG. 9 shows another exemplary flow diagram in accordance with one aspect of the present embodiments. -
FIG. 10 shows an additional exemplary flow diagram in accordance with one aspect of the present embodiments. - Before various embodiments are described in greater detail, it should be understood that the embodiments are not limiting, as elements in such embodiments may vary. It should likewise be understood that a particular embodiment described and/or illustrated herein has elements which may be readily separated from the particular embodiment and optionally combined with any of several other embodiments or substituted for elements in any of several other embodiments described herein.
- It should also be understood that the terminology used herein is for the purpose of describing the certain concepts, and the terminology is not intended to be limiting. Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood in the art to which the embodiments pertain.
- Unless indicated otherwise, ordinal numbers (e.g., first, second, third, etc.) are used to distinguish or identify different elements or steps in a group of elements or steps, and do not supply a serial or numerical limitation on the elements or steps of the embodiments thereof. For example, “first,” “second,” and “third” elements or steps need not necessarily appear in that order, and the embodiments thereof need not necessarily be limited to three elements or steps. It should also be understood that, unless indicated otherwise, any labels such as “left,” “right,” “front,” “back,” “top,” “middle,” “bottom,” “beside,” “forward,” “reverse,” “overlying,” “underlying,” “up,” “down,” or other similar terms such as “upper,” “lower,” “above,” “below,” “under,” “between,” “over,” “vertical,” “horizontal,” “proximal,” “distal,” and the like are used for convenience and are not intended to imply, for example, any particular fixed location, orientation, or direction. Instead, such labels are used to reflect, for example, relative location, orientation, or directions. It should also be understood that the singular forms of “a,” “an,” and “the” include plural references unless the context clearly dictates otherwise.
- As the technology of magnetic recording media reaches maturity, it becomes increasingly difficult to continue to increase the storage capacity of recording media (e.g. disk drive disks) or to reduce the size of recording media while maintaining storage capacity. Such challenges may be overcome by increasing the bit density on the recording media. New technology such as Heat Assisted Magnetic Recording (HAMR) in disk drives has offered higher areal density as well as backward compatibility and enhanced data retention. A glass substrate has been used in HAMR technology consistent with thermal transfer properties of the HAMR writing process. Similarly, perpendicular media recording (PMR) technology in disk drive may benefit from using a glass substrate because a glass substrate has modulus and density similar to that of aluminum used in most cloud storage products.
- Reducing the glass substrate thickness increases disk packing density, thereby increasing the drive capacity. In order to increase the drive capacity, the glass substrates used in HAMR and PMR have stringent surface roughness with tight dimensional precision. Unfortunately, the glass substrates are mechanically cut and grinded, causing fracturing and other surface anomalies. Moreover, mechanically cutting the glass substrate results in large dimensional errors, which require subsequent edging to bring the glass substrate within the final tolerances. Furthermore, subsequent grinding is not only costly but also time consuming, thereby adversely impacting the throughput.
- Accordingly, a need has arisen to avoid mechanical cutting and grinding of the glass substrate in technologies with stringent surface roughness and tight dimensional precision such as PMR and HAMR. In some embodiments, an apparatus cuts and shapes the glass substrate in a non-mechanical fashion. In some embodiments, laser technology is used to simultaneously cut and shape a glass substrate. For example, the apparatus may include a beam splitter and a plurality of mirrors. The beam splitter is positioned to receive a laser beam from a source and split the received laser beam to a first plurality of split laser beams and a second plurality of split laser beams. The plurality of mirrors is configured to direct the first plurality of split laser beams and further configured to direct the second plurality of split laser beams. The first plurality of split laser beams directed by the plurality of mirrors is configured to cut a glass substrate. The second plurality of split laser beams directed by the plurality of mirrors is configured to shape the glass substrate. It is appreciated that the apparatus may further include a Diffractive Optics, Micro-lens Arrays and Spatial Light Modulator (SLM) configured to receive a laser beam from the source, or from the plurality of mirrors, or from the beam splitter. The Diffractive Optics, Micro-lens Arrays and Spatial Light Modulator (SLM) is configured to bend the received laser beam that shapes the glass substrate. It is appreciated that in some embodiments, the Diffractive Optics, Micro-lens Arrays and Spatial Light Modulator (SLM) is configured to cut the glass substrate.
- Referring now to
FIGS. 1A-1E , a system configured to cut and shape a glass substrate according to one aspect of the present embodiments is shown. More specifically, referring toFIG. 1A , asystem 100A is shown. Thesystem 100A includes alaser source 110 and anoptical multiplexer box 180. Thelaser source 110 is configured to generate one or more laser beams, e.g.,laser beam 112, that are received by theoptical multiplexer box 180. Theoptical multiplexer box 180 is positioned to manipulate the received laser beam to generate a modified laser beam(s), e.g.,laser beams - In some embodiments, the
optical multiplexer box 180 includes abeam splitter 120, and a plurality of mirrors, e.g., mirrors 132 and 134. Thebeam splitter 120 is positioned to receive thelaser beam 112 from thelaser source 110. Thebeam splitter 120 is configured to split the receivedlaser beam 112 into more than one laser beam, e.g.,laser beams mirrors laser beams mirrors split laser beams mirrors split laser beams laser beams laser beam 126. It is appreciated that the positioning of themirrors 132 and/or 134 may be fixed or it may be modifiable, e.g., one or more mirrors may be rotated to change the angle of incident and the angle of reflection. - The
laser beams optical multiplexer box 180 onto the glass substrate. As such, the glass substrate may be cut and shaped through means other than mechanical cutting and shaping. In some embodiments, thelaser beams - It is appreciated that a component, e.g., diffractive optics, micro-lens arrays, spatial light modulator (SLM) for phase, wave front, and polarization control over the transverse direction of the laser, highly silvered mirrors on a linear piezo stage, pitch and yaw rotation stage, beam expander, beam compression, pulse stretching device, pulse shortening device, polarizing filter, polarizing rotator, photo-detector, beam shaping device (without shortening/stretching the pulse), fiber optic couplers, etc., may be positioned prior to or after the
beam splitter 120 receiving the laser beam in order to modify the received laser beam, e.g., changing the coherency of the laser beam, changing the polarization of the laser beam, changing the magnitude of the laser beam, changing the wavelength of the laser beam, changing the intensity of the laser beam, changing the spot diameter of the laser beam, changing the pulse duration of the laser beam, changing the pulse shape of the laser beam, etc. It is similarly appreciated that a component may be positioned prior to or after themirrors 132 and/or 134 receiving the split laser beams from thebeam splitter 120 in order to modify the split laser beam, e.g., changing the coherency of the laser beam, changing the polarization of the laser beam, changing the magnitude of the laser beam, changing the wavelength of the laser beam, changing the intensity of the laser beam, changing the spot diameter of the laser beam, changing the pulse duration of the laser beam, changing the pulse shape of the laser beam, etc. - Referring now to
FIG. 1B , aglass substrate 190 being cut/shaped is shown, as discussed inFIG. 1A . The modified laser beams, e.g.,laser beams glass substrate 190 simultaneously in some embodiments. It is appreciated that in some embodiments, the cutting and shaping may occur sequentially but shortly after one another. - Referring now to
FIG. 1C , asystem 100C substantially similar to that ofFIG. 1A is shown. In this embodiment, thebeam splitter 120 split the received laser beams into four split laser beams, e.g.,laser beams Split laser beams - Referring now to
FIG. 1D , asystem 100D substantially similar to that ofFIG. 1C is shown. In this embodiment, thebeam splitter 120 splits the received laser beams into a plurality ofsplit laser beams 129. Moreover, themirror 134 is replaced with amirror 174 that has a plurality of mirrors. Similarly, themirror 132 is replaced with amirror 172 that includes a plurality of mirrors. Themirror 172 receives a subset of the split laser beams and reflects a number of reflectedsplit laser beams 136. Similarly, themirror 174 receives a subset of the split laser beams and reflects a number of reflectedsplit laser beams 137. Some of the split laser beams, e.g., 126 and 128, may be emitted from thebeam splitter 120 without being directed by a mirror. The split laser beams either being emitted from thebeam splitter 120 and/or reflected from the mirrors are emitted from theoptical multiplexer box 180, thereby cutting and/or shaping the glass substrate. - Referring now to
FIG. 1E , asystem 100E substantially similar to that ofFIG. 1D is shown. In this embodiment, themirrors control signal 141 may control a mirror within themirror 174 to move, therefore changing the angle of incident and as result changing the angle of reflection. Other mirrors may similarly be controlled. In some embodiments, the mirrors are controlled using the control signal using a microelectrical component, e.g., a micro-electro mechanical device, piezo electric components, etc. to change their position in order to control the angle of incident and reflection. - Referring now to
FIGS. 2A-2B , a system including a Diffractive Optics, Micro-lens Arrays and Spatial Light Modulator (SLM) configured to cut and shape a glass substrate according to one aspect of the present embodiments is shown.FIG. 2A shows asystem 200A. Thesystem 200A includes alaser source 110 and anoptical multiplexer box 280. Thelaser source 110 is configured to generate one or more laser beams, e.g.,laser beam 112, that are received by theoptical multiplexer box 280. Theoptical multiplexer box 280 is positioned to manipulate the received laser beam to generate a modified laser beam(s). The modified laser beam(s) is emitted onto a glass substrate. The modified laser beam(s) cuts and/or shapes the glass substrate. In some embodiments, the glass substrate is cut and shaped simultaneously. It is appreciated that references made to the laser beam being modified is a reference to the angle (e.g., incident/reflection/diffraction/refraction) of the laser beam changing, the coherency of the laser beam changing, the polarization of the laser beam changing, the magnitude of the laser beam changing, the wavelength of the laser beam changing, the intensity of the laser beam changing, the spot diameter of the laser beam changing, the pulse duration of the laser beam changing, the pulse shape of the laser beam changing, etc. - In some embodiments, the
optical multiplexer box 280 includes a Diffractive Optics, Micro-lens Arrays and Spatial Light Modulator (SLM) 210. The Diffractive Optics, Micro-lens Arrays and Spatial Light Modulator (SLM) 210 may bend the receivedlaser beam 112, e.g.,laser beam 212. It is appreciated that in some embodiments, the Diffractive Optics, Micro-lens Arrays and Spatial Light Modulator (SLM) 210 may be configured to transmit the receivedlaser beam 112 without bending it, e.g.,laser beam 214. Thelaser beams optical multiplexer box 280 may cut and/or shape the substrate glass. It is appreciated that in some embodiments, thelaser beams - Referring now to
FIG. 2B , theglass substrate 190 may be cut using twobended laser beams glass substrate 190 once cut and shaped is shown as theglass substrate 192. - Referring now to
FIGS. 3A-3F , a system including an optical multiplexer box configured to cut and shape a glass substrate according to one aspect of the present embodiments is shown. Referring more specifically toFIG. 3A , a combination ofFIGS. 1A and 2A is shown.System 300A includes alaser source 110 and anoptical multiplexer box 380. Thelaser source 110 is configured to generate one or more laser beams, e.g.,laser beam 112, that are received by theoptical multiplexer box 380. Theoptical multiplexer box 380 is positioned to manipulate the received laser beam(s) to generate a modified laser beam(s), e.g.,laser beams - The
optical multiplexer box 380 includes abeam splitter 120, a Diffractive Optics, Micro-lens Arrays and Spatial Light Modulator (SLM) 210, and a plurality of mirrors, e.g., mirrors 132 and 134. Thebeam splitter 120 is positioned to receive thelaser beam 112 from thelaser source 110. Thebeam splitter 120 is configured to split the receivedlaser beam 112 into more than one laser beam, e.g.,laser beams mirrors laser beams mirrors split laser beams mirrors split laser beams laser beams laser beam 126. It is appreciated that the positioning of themirrors 132 and/or 134 may be fixed or it may be modifiable, e.g., one or more mirrors may be rotated to change the angle of incident and the angle of reflection. - The
split laser beam 312 is emitted from thebeam splitter 120 to the Diffractive Optics, Micro-lens Arrays and Spatial Light Modulator (SLM) 210. Thediffractive optics array 210 may bend the received splitlaser beam 312 to generate abent laser beam 212. - The
laser beams optical multiplexer box 380 onto the glass substrate. As such, the glass substrate may be cut and shaped through means other than mechanical cutting and shaping. In some embodiments, thelaser beams - It is appreciated that a component, e.g., diffractive optics, micro-lens arrays, spatial light modulator (SLM) for phase, wave front, and polarization control over the transverse direction of the laser, highly silvered mirrors on a linear piezo stage, pitch and yaw rotation stage, beam expander, beam compression, pulse stretching device, pulse shortening device, polarizing filter, polarizing rotator, photo-detector, beam shaping device (without shortening/stretching the pulse), fiber optic couplers, etc., may be positioned prior to or after the
beam splitter 120 receiving the laser beam in order to modify the received laser beam, e.g., changing the coherency of the laser beam, changing the polarization of the laser beam, changing the magnitude of the laser beam, changing the wavelength of the laser beam, changing the intensity of the laser beam, changing the spot diameter of the laser beam, changing the pulse duration of the laser beam, changing the pulse shape of the laser beam, etc. It is similarly appreciated that a component may be positioned prior to or after themirrors 132 and/or 134 receiving the split laser beams from thebeam splitter 120 in order to modify the split laser beam, e.g., changing the coherency of the laser beam, changing the polarization of the laser beam, changing the magnitude of the laser beam, changing the wavelength of the laser beam, changing the intensity of the laser beam, changing the spot diameter of the laser beam, changing the pulse duration of the laser beam, changing the pulse shape of the laser beam, etc. Moreover, it is appreciated that a component may be positioned prior to or after the Diffractive Optics, Micro-lens Arrays and Spatial Light Modulator (SLM) 210 receiving the split laser beams from thebeam splitter 120 in order to modify the split laser beam, e.g., changing the coherency of the laser beam, changing the polarization of the laser beam, changing the magnitude of the laser beam, changing the wavelength of the laser beam, changing the intensity of the laser beam, changing the spot diameter of the laser beam, changing the pulse duration of the laser beam, changing the pulse shape of the laser beam, etc. - Referring now to
FIG. 3B ,system 300B is shown that operates substantially similar to that ofFIG. 3A . In this embodiment, themirrors mirrors system 100D discussed inFIG. 1D . - Referring now to
FIG. 3C ,system 300C is shown that operates substantially similar to that ofFIG. 3B . In this embodiment, themirrors system 100E discussed inFIG. 1E . - Referring now to
FIG. 3D ,system 300D is shown that operates substantially similar to that ofFIG. 3A . In this embodiment, themirror 134 emits the reflectedlaser beam 135 to the Diffractive Optics, Micro-lens Arrays and Spatial Light Modulator (SLM) 210 instead of emitting it onto the glass substrate. Thus, the reflectedlaser beam 135 may be bent using the Diffractive Optics, Micro-lens Arrays and Spatial Light Modulator (SLM) 210. The Diffractive Optics, Micro-lens Arrays and Spatial Light Modulator (SLM) 210 may bend the reflectedlaser beam 135 and output thebent laser beam 219 onto the glass substrate. Thus, theoptical multiplexer box 380 mayoutput laser beams optical multiplexer box 380 mayoutput laser beams - Referring now to
FIG. 3E ,system 300E is shown that operates substantially similar to that ofFIG. 3D . In this embodiment, themirrors mirrors system 100D discussed inFIG. 1D . - Referring now to
FIG. 3F ,system 300F is shown that operates substantially similar to that ofFIG. 3E . In this embodiment, themirrors system 100E discussed inFIG. 1E . - Referring now to
FIG. 4 , a system including an optical multiplexer box configured to chemically alter a glass substrate into a shape defined by the chemical alteration according to one aspect of the present embodiments is shown. It is appreciated that a system including an optical multiplexer box, as discussed with respect toFIGS. 1A-3F , may be used to chemically alter the glass substrate into a shape defined by the chemical alteration rather than cut the glass substrate. In other words, the output of the optical multiplexer box may focus the emitted laser beams onto theglass substrate 190 in order to alter the chemical properties of the glass substrate where the laser beam is focused. The chemical alteration delineates a desired cut/shape within the transparent glass substrate. Once theglass substrate 190 is placed in achemical bath 410, e.g., Potassium Hydroxide (KOH) ˜1 um/s with selectivity of 350, Sodium Hydroxide (NaOH), Hydrofluoric acid (HF) ˜1 um/s with selectivity of 100, etc., theglass substrate 190 separates according to the shape defined by the chemical alteration. For example, in the embodiment shown inFIG. 4 , theglass substrate 190 separates at positioned on theglass substrate 190 where the laser beam was focused. Thus, the glass substrate may be formed and shaped without using mechanical cutting and grinding. - Referring now to
FIG. 5 , a flow diagram in accordance with one aspect of the present embodiments is shown. Atstep 510, a laser beam is generated, e.g., by a laser source. Atstep 520, the generated laser beam is received by theoptical multiplexer box 520, e.g., as described inFIGS. 1A-4 . Theoptical multiplexer box 520 may manipulate the received laser beam, instep 530, as described inFIGS. 1A-4 . For example, atstep 531, the laser beam may be split into multiple laser beams, e.g., using a beam splitter. Atstep 532, the received laser beam or one or more of the split laser beams may be bent, e.g., using Diffractive Optics, Micro-lens Arrays and Spatial Light Modulator (SLM). In some embodiments, atstep 533, the received laser beam and/or the split laser beam(s) and/or the bent laser beam(s) may be directed, e.g., using one or mirrors. It is appreciated that the mirrors may be controlled using one or more control signals, as described above. Atstep 540, the manipulated laser beam(s) is emitted from theoptical multiplexer box 520 onto a glass substrate. As such, the glass substrate may be cut and shaped without using mechanical cutting and grinding. Moreover, the glass substrate may be cut and shaped simultaneously. Furthermore, it is appreciated that in some embodiments, the optical multiplexer box may chemically alter the glass substrate into a shape defined by the chemical alteration rather than cut the glass substrate. In other words, the output of the optical multiplexer box may focus the emitted laser beams onto the glass substrate in order to alter the chemical properties of the glass substrate where the laser beam is focused. The chemical alteration delineates a desired cut/shape within the transparent glass substrate. Once the glass substrate is placed in a chemical bath, e.g., Aqueous solutions of Potassium Hydroxide (KOH) (concentrations of 5-20 mol/(dm)3, Sodium Hydroxide (NaOH) (concentrations of 5-20 mol/(dm)3), Hydrofluoric acid (HF) (concentrations of 1-10%), Muriatic acid (HCL) (concentrations of 10-80%). Bath times (5 min-100 min) and etch rates (1 um/min up to 20 um/min) can be adjusted by varying the chemical bath concentrations, bath temperature (between 20 and 90 degree Celsius), etc., theglass substrate 190 separates according to the shape defined by the chemical alteration. Further enhancement of etch rates can be achieved by applying ultrasonic or megasonic waves to the chemical bath. Thus, the glass substrate may be formed and shaped without using mechanical cutting and grinding. - Referring now to
FIGS. 6A, 6B, and 6C , asystem 600 for shaping an exposed edge of a previously cut glass substrate is shown according to one aspect of the present embodiments. Anenergy source 602 is positioned to create an energy beam 604 (e.g. laser, plasma, etc.) along an exposededge 606 of aglass substrate 608. Theenergy beam 604 shapes the exposededge 606 of theglass substrate 608 by removing portions of the exposededge 606 of theglass substrate 608. In various embodiments, theglass substrate 608 may have been previously cut (e.g. by mechanical, laser, chemical, etc.) into an annular shape (e.g. a disc), thereby forming the exposededge 606. As such, the exposededge 606 extends annularly around theglass substrate 608. It is understood that theenergy beam 604 may also be referred to as an energy column. - In some embodiments, a number of energy sources may be used to shape the exposed
edge 606. For example, anadditional energy source 610 may also be positioned to create anadditional energy beam 612 along the exposededge 606 of theglass substrate 608. Theadditional energy beam 612 further shapes the exposededge 606 of theglass substrate 608 by removing additional portions of the exposededge 606 of theglass substrate 608. In further embodiments, any number of energy sources and energy beams may be used. In various embodiments, one or more of the energy sources may be stationary and theglass substrate 608 may be rotatable. As such, theglass substrate 608 may rotate through the energy beams, thereby rotating the exposededge 606 through the energy beams. - As previously described, a beam splitter may be positioned to create a number of energy beams from an energy source. For example, a beam splitter may be positioned between the
energy source 602 and thesubstrate 608. Theenergy source 602 may project an incoming energy beam into the beam splitter. The beam splitter may then split the incoming energy beam into a first energy beam (e.g. energy beam 604) and a second energy beam (e.g. additional energy beam 612). It is understood that if a beam splitter is used to create theadditional energy beam 612, theadditional energy source 610 will not be needed. Also as previously described, one or more mirrors may be positioned to direct one or more of the energy beams along the exposededge 606 of theglass substrate 608. -
FIG. 6B illustrates a smooth and rounded exposededge 606. As previously described, a number of energy beams may be directed along the exposededge 606 of theglass substrate 608. As the number of energy beams directed along the exposededge 606 at different angles increases, the roundness of the exposededge 606 may also increase. For example, after theglass substrate 608 has been cut into the annular shape, the exposededge 606 may be very angular (e.g. not round and pointed with corners), as illustrated byangular portion 614. As the exposededge 606 is shaped by one or more energy beams the roundness increases, as illustrated byrounded portion 616. - In further embodiments, the energy beams may be moved by one or more mirrors (as previously described) in order to increase the roundness of the exposed
edge 606. In additional embodiments, one or more Diffractive Optics, Micro-lens Arrays and Spatial Light Modulator (SLM)s (as previously described) may be positioned to bend one or more energy beams to shape the exposededge 606 of theglass substrate 608. As previously described, theglass substrate 608 may rotate through the bent portion of the one or more energy beams, thereby directing the removal of portions of theglass substrate 608 along the exposededge 606. -
FIG. 6C illustrates a complex shaped exposededge 606. As previously described, energy beams may be used to create any number of shapes (both simple and complex) in the exposededge 606 of theglass substrate 608. In various embodiments, the exposededge 606 may be shaped by any combination of linear energy beam(s) and/or bent energy beam(s). In further embodiments, the exposededge 606 may include a uniform shape around the circumference of theglass substrate 608, or the exposededge 606 may include a non-uniform shape around the circumference of theglass substrate 608. - Referring to
FIGS. 7A and 7B , asystem 700 is shown for shaping an exposed edge with an energy source that is tangential to the exposed edge according to one aspect of the present embodiments. Anenergy source 702 is positioned to create an energy beam 704 (e.g. laser, plasma, etc.) along an exposededge 706 of aglass substrate 708. Theenergy beam 704 is tangential to the exposededge 706 of theglass substrate 708. In various embodiments, theenergy source 702 may also be positioned tangential to the exposededge 706 of theglass substrate 708. In further embodiments, theenergy source 702 may be positioned anywhere and theenergy beam 704 may be directed tangentially to the exposededge 706 through the use of various components described above (e.g. mirror, beam splitter, special diffractive optics array, etc.). - As previously discussed, the
energy beam 704 shapes the exposededge 706 of theglass substrate 708 by removing portions of the exposededge 706 of theglass substrate 708. In various embodiments, theenergy source 702 may include amask feature 710 to shape a profile of theenergy beam 704. As such theenergy beam 704 may be shaped to create any shape in the exposededge 706. For example, in some embodiments theenergy beam 704 may form a simple rounded edge, as illustrated inFIG. 7A . In further embodiments, theenergy beam 704 may form more complex shapes, as illustrated inFIG. 7B . - Referring to
FIG. 8 , asystem 800 is shown for shaping an exposed edge with plasma according to one aspect of the present embodiments.High voltage electrodes 802 create a high density discharge 804 (e.g. plasma). Thehigh density discharge 804 interacts with an exposededge 806 of aglass substrate 808, removing any material extending into thehigh density discharge 804. In various embodiments,lasers 810 may be used to guide and shape thehigh density discharge 804 into any shape. For example, the high density discharge may be formed into a curvature. In some embodiments, additional lasers may also be used to remove material from the exposededge 806. For example, thehigh density discharge 804 may remove some material from the exposededge 806, and one or more additional lasers may also remove material from the exposededge 806. - Referring now to
FIG. 9 , another flow diagram in accordance with one aspect of the present embodiments is shown. Atstep 910, an energy source generates an energy column, wherein the energy source is stationary. Atstep 920, an edge of a glass substrate is rotated through the energy column. Atstep 930, portions of the edge of the glass substrate are removed with the energy column. - Referring now to
FIG. 10 , an additional flow diagram in accordance with one aspect of the present embodiments is shown. Atstep 1010, a first energy beam is projected onto an annular edge of a glass substrate. Atstep 1020, a first portion of the annular edge of the glass substrate is removed with the first energy beam, wherein the removing the first portion increases the roundness of the annular edge of the glass substrate. Atstep 1030, a second energy beam is projected onto the annular edge of the glass substrate. Atstep 1040, a second portion of the annular edge of the glass substrate is removed with the second energy beam, wherein the removing the second portion increases the roundness of the annular edge of the glass substrate. - While the embodiments have been described and/or illustrated by means of particular examples, and while these embodiments and/or examples have been described in considerable detail, it is not the intention of the Applicants to restrict or in any way limit the scope of the embodiments to such detail. Additional adaptations and/or modifications of the embodiments may readily appear, and, in its broader aspects, the embodiments may encompass these adaptations and/or modifications. Accordingly, departures may be made from the foregoing embodiments and/or examples without departing from the scope of the concepts described herein. The implementations described above and other implementations are within the scope of the following claims.
Claims (20)
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US15/729,042 US20190039941A1 (en) | 2017-08-07 | 2017-10-10 | Shaping a glass substrate after cutting |
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US15/729,042 US20190039941A1 (en) | 2017-08-07 | 2017-10-10 | Shaping a glass substrate after cutting |
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US15/792,279 Active 2038-08-03 US10766805B2 (en) | 2017-08-07 | 2017-10-24 | Edge polishing a glass substrate after cutting |
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KR20220088461A (en) * | 2019-10-22 | 2022-06-27 | 코닝 인코포레이티드 | Energy Delivery Optimization for Laser Thickness Control of Fused Glass Systems and Methods |
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US10947148B2 (en) | 2021-03-16 |
US20190039173A1 (en) | 2019-02-07 |
US20190039170A1 (en) | 2019-02-07 |
US10766805B2 (en) | 2020-09-08 |
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