US20190027364A1 - Semiconductor structure and method for preparing the same - Google Patents
Semiconductor structure and method for preparing the same Download PDFInfo
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- US20190027364A1 US20190027364A1 US15/656,668 US201715656668A US2019027364A1 US 20190027364 A1 US20190027364 A1 US 20190027364A1 US 201715656668 A US201715656668 A US 201715656668A US 2019027364 A1 US2019027364 A1 US 2019027364A1
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B12/00—Dynamic random access memory [DRAM] devices
- H10B12/30—DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/033—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers
- H01L21/0334—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers characterised by their size, orientation, disposition, behaviour, shape, in horizontal or vertical plane
- H01L21/0338—Process specially adapted to improve the resolution of the mask
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/033—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers
- H01L21/0332—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers characterised by their composition, e.g. multilayer masks, materials
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/033—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers
- H01L21/0334—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers characterised by their size, orientation, disposition, behaviour, shape, in horizontal or vertical plane
- H01L21/0335—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers characterised by their size, orientation, disposition, behaviour, shape, in horizontal or vertical plane characterised by their behaviour during the process, e.g. soluble masks, redeposited masks
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/033—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers
- H01L21/0334—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers characterised by their size, orientation, disposition, behaviour, shape, in horizontal or vertical plane
- H01L21/0337—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers characterised by their size, orientation, disposition, behaviour, shape, in horizontal or vertical plane characterised by the process involved to create the mask, e.g. lift-off masks, sidewalls, or to modify the mask, e.g. pre-treatment, post-treatment
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- H01L27/10805—
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- H01L27/10894—
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- H01L27/10897—
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B12/00—Dynamic random access memory [DRAM] devices
- H10B12/01—Manufacture or treatment
- H10B12/02—Manufacture or treatment for one transistor one-capacitor [1T-1C] memory cells
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B12/00—Dynamic random access memory [DRAM] devices
- H10B12/01—Manufacture or treatment
- H10B12/09—Manufacture or treatment with simultaneous manufacture of the peripheral circuit region and memory cells
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B12/00—Dynamic random access memory [DRAM] devices
- H10B12/50—Peripheral circuit region structures
Definitions
- the present disclosure relates to a semiconductor structure and a method for preparing the same.
- Photolithography process is typically used to fabricate electronic and optoelectronic devices on a semiconductor substrate and photoresist patterns prepared by the photolithography process are used as masks in etching or ion implantation. Therefore, the fineness of the photoresist patterns is a very important factor in determining the degree of integration.
- One method to increase resolution is to use a light source with a shorter wavelength as the exposure light source.
- a krypton fluoride (KrF) laser is used to provide deep UV light with a wavelength of 248 nanometers and an argon fluoride (ArF) laser is used to provide deep UV light with a wavelength of 193 nanometers.
- KrF krypton fluoride
- ArF argon fluoride
- Another method of forming such fine photoresist patterns on the semiconductor substrate is through double patterning technique. In a double patterning process, a pattern from a first exposure may be etched onto a photoresist layer on the semiconductor substrate, and the semiconductor substrate is subsequently recoated with the photoresist layer to form a second pattern and then re-etched to obtain the desired pattern.
- the double patterning technique requires that the exposure process be performed twice, which requires very precise alignment between the two exposure processes.
- One aspect of the present disclosure provides a semiconductor structure comprising: a substrate having a memory array region and a peripheral circuit region; a plurality of first line patterns positioned in the memory array region and extending along a first direction; a plurality of second line patterns positioned over the first line patterns in the memory array region, wherein the plurality of second line patterns extend along a second direction different from the first direction; a plurality of third line patterns disposed over the first line patterns in the memory array region, wherein the plurality of second line patterns and the plurality of third line patterns are disposed over the first line pattern in an alternate manner; and a plurality of linear features positioned in the peripheral circuit region; wherein the plurality of second line patterns, the plurality of third line patterns, and the plurality of linear features are positioned at substantially the same level in the substrate.
- the peripheral circuit region is in the absence of the first line patterns.
- the plurality of linear features in the peripheral circuit region are integrally formed with the plurality of second line patterns in the memory array region.
- the plurality of linear features in the peripheral circuit region are integrally foiiiied with the plurality of third line patterns in the memory array region.
- Another aspect of the present disclosure provides a semiconductor structure comprising a substrate having a memory array region and a peripheral circuit region; a plurality of island patterns positioned in the memory array region; and a plurality of linear features in the peripheral circuit region; wherein the plurality of island patterns and the plurality of linear features are positioned at substantially different levels in the substrate.
- the plurality of island patterns are positioned in the memory array region in an array manner, wherein the array extends along a first direction and a second direction substantially not perpendicular to the first direction.
- the plurality of linear features extend along the first direction in the peripheral circuit region.
- the plurality of island patterns are positioned at a first level
- the plurality of linear features are positioned at a second level
- the first level is substantially lower than the second level in the substrate.
- Another aspect of the present disclosure provides a method for preparing a semiconductor structure, comprising: forming a plurality of linear core patterns and a plurality of linear spacer patterns on a substrate, wherein the plurality of linear spacer patterns are formed on sidewalls of the linear core patterns; removing the plurality of linear core patterns from the substrate; removing a portion of the substrate not covered by the plurality of linear spacer patterns to form a plurality of first line patterns, wherein the plurality of first line patterns extend along a first direction; performing a first litho-etch process to form a plurality of second line patterns over the first line patterns, wherein the plurality of second line patterns extend along a second direction different from the first direction; and performing a second litho-etch process to form a plurality of third line patterns over the first line patterns, wherein the plurality of second line patterns and the plurality of third line patterns are formed over the first line pattern in an alternate manner.
- the second direction is substantially not perpendicular to the first direction.
- the plurality of first line patterns are formed in a mask layer of the substrate, and a patterning process is performed using the plurality of second line patterns and the plurality of third line patterns to pattern the plurality of first line patterns into a plurality of island patterns.
- the method further comprises performing an etching process using the plurality of island patterns as an etching mask to remove a portion of a target layer under the mask layer.
- the substrate comprises a memory array region and a peripheral circuit region, and the first litho-etch process and the second litho-etch process are performed to form the plurality of second line patterns and the plurality of third line patterns in the memory array region and a plurality of linear features in the peripheral circuit region.
- the plurality of linear features in the peripheral circuit region are integrally formed with the plurality of second line patterns in the memory array region.
- the plurality of linear features in the peripheral circuit region are integrally formed with the plurality of third line patterns in the memory array region.
- the substrate comprises a memory array region and a peripheral circuit region, the plurality of first line patterns are formed in the memory array region, and the peripheral circuit region is in the absence of the first line patterns.
- the forming of the plurality of linear core patterns comprises perfoiiiiing an immersion-litho process.
- the forming of the plurality of first line patterns comprises performing an etching process using the plurality of linear spacer patterns as an etching mask.
- FIG. 1 is a schematic layout of a DRAM memory device having a memory array region and a peripheral circuit region in accordance with some embodiments of the present disclosure.
- FIG. 2 depicts a schematic diagram of a DRAM memory cell in accordance with some embodiments of the present disclosure.
- FIG. 3 schematically depicts the top view of the memory array region in accordance with some embodiments of the present disclosure.
- FIG. 4 is a flow chart of the method for preparing a semiconductor structure in accordance with some embodiments of the present disclosure.
- FIGS. 5 to 29 are schematic views of a process for preparing the semiconductor structure by the method in FIG. 4 in accordance with some embodiments of the present disclosure.
- references to “one embodiment,” “an embodiment,” “exemplary embodiment,” “other embodiments,” “another embodiment,” etc. indicate that the embodiment(s) of the disclosure so described may include a particular feature, structure, or characteristic, but not every embodiment necessarily includes the particular feature, structure, or characteristic. Further, repeated use of the phrase “in the embodiment” does not necessarily refer to the same embodiment, although it may.
- the present disclosure is directed to a semiconductor structure and a method for preparing the same.
- detailed steps and structures are provided in the following description. Obviously, implementation of the present disclosure does not limit special details known by persons skilled in the art. In addition, known structures and steps are not described in detail, so as not to unnecessarily limit the present disclosure. Preferred embodiments of the present disclosure are described in detail below. However, in addition to the detailed description, the present disclosure may also be widely implemented in other embodiments. The scope of the present disclosure is not limited to the detailed description, but is defined by the claims.
- FIG. 1 is a schematic layout of a DRAM memory device 10 having a memory array region 11 A and a peripheral circuit region 11 B in accordance with some embodiments of the present disclosure.
- the memory device 10 comprises a memory array 13 in the memory array region 11 A and a plurality of peripheral circuits 15 in the peripheral circuit region 11 B.
- a plurality of schematically depicted illustrative peripheral circuits 15 are depicted in FIG. 1 .
- the illustrative peripheral circuits 15 comprise read-write circuits 15 A, sense amp circuits 15 B and power management circuits 15 C.
- the illustrative peripheral circuits depicted in FIG. 1 do not comprise an exhaustive set of all such peripheral circuits 15 on the memory device 10 .
- the peripheral circuit 15 may comprise any circuitry on the memory device 10 including those other than the circuitry found within the memory array 13 .
- the memory array 13 includes a multitude of memory cells arranged in rows and columns. Each of the memory cells is structured for storing digital information in the form of a logical high (i.e., a “1”) or a logical low (i.e., a “0”).
- a logical high i.e., a “1”
- a logical low i.e., a “0”.
- To write (i.e., store) a bit into a memory cell a binary address having portions identifying the cell's row (the “row address”) and column (the “column address”) is provided to addressing circuitry in the memory device 10 to activate the cell, and the bit is then supplied to the cell.
- the cell is again activated using the cell's memory address and the bit is then output from the cell.
- FIG. 2 depicts a schematic diagram of a DRAM memory cell 20 in accordance with some embodiments of the present disclosure.
- the memory cell 20 comprises a capacitor 21 and a transistor 23 .
- the capacitor 21 can store charge, which represents one bit of information.
- the transistor 23 acts as a switch, which controls the flow of charge into or out of the capacitor 21 .
- the control gate of the transistor 23 is coupled to a word line 25
- the drain of the transistor 23 is coupled to a bit line 27 .
- the transistor 23 is activated through the word line 25 , and the charge in the capacitor 21 can be detected by a sense amplifier through the bit line 27 and processed to determine the bit state of the cell 20 .
- a typical memory array 13 contains thousands or millions of cells 20 .
- FIG. 3 schematically depicts the top view of the memory array region 11 A in accordance with some embodiments of the present disclosure.
- the memory array region 11 A comprises a plurality of active areas 31 , a plurality of word lines 25 formed between corresponding active areas 29 , a plurality of bit lines 27 coupled to a portion of active areas 29 , and a plurality of capacitors 21 coupled with other portions of active areas 29 .
- the plurality of active areas 29 are island patterns positioned in the memory array region 11 A in an array manner, and the array extends along a first direction D 1 and a second direction D 2 substantially not perpendicular to the first direction.
- FIG. 4 is a flow chart of the method 40 for preparing a semiconductor structure in accordance with some embodiments of the present disclosure.
- the method 40 comprises a step 41 of foiiiiing a plurality of linear core patterns and a plurality of linear spacer patterns on a substrate, wherein the plurality of linear spacer patterns are formed on sidewalls of the linear core patterns; a step 43 of removing the plurality of linear core patterns from the substrate; a step 45 of removing a portion of the substrate not covered by the plurality of linear spacer patterns to form a plurality of first line patterns, wherein the plurality of first line patterns extend along a first direction; a step 47 of performing a first litho-etch process to form a plurality of second line patterns over the first line patterns, wherein the plurality of second line patterns extend along a second direction different from the first direction; and a step 49 of performing a second litho-etch process to form a plurality of third line patterns over the first line patterns, wherein the plurality of second line patterns
- FIGS. 5 to 29 are schematic views of a process for preparing the semiconductor structure by the method 40 in FIG. 4 in accordance with some embodiments of the present disclosure.
- a plurality of linear core patterns 61 and a plurality of linear spacer patterns 65 are formed on a substrate 51 , as shown in FIGS. 5 to 10 .
- the plurality of linear core patterns 61 are formed on the substrate 51 by deposition, lithography and etching processes.
- FIG. 5 is a top view of the memory array region 11 A and FIG. 6 is a cross-sectional view along a cross-sectional line A-A in FIG. 5 .
- the substrate 51 comprises a silicon wafer. In some embodiments, the substrate 51 comprises a metal layer 51 A, a first layer 51 B and a second layer 51 C. In some embodiments, the metal layer 51 A comprises tungsten (W), titanium nitride (TiN) or titanium (Ti). In some embodiments, the first layer 51 B and the second layer 51 C comprise different materials selected from the group consisting of silicon oxide, silicon nitride, silicon oxynitride, silicon, carbon, or the combination thereof.
- FIG. 7 is a top view of the memory array region 11 A and FIG. 8 is a cross-sectional view along a cross-sectional line B-B in FIG. 7 .
- a deposition process is performed to form a dielectric layer 63 on the substrate 51 .
- the deposition process is an atomic layer deposition process, and the dielectric layer 63 covers the plurality of linear core patterns 61 and comprises materials selected from the group consisting of silicon oxide, silicon nitride and silicon oxynitride.
- FIG. 9 is a top view of the memory array region 11 A and FIG. 10 is a cross-sectional view along a cross-sectional line C-C in FIG. 9 .
- a spacer etching process is performed to remove a portion of the dielectric layer 63 so as to form the plurality of linear spacer patterns 65 on sidewalls of the linear core patterns 61 .
- FIG. 11 is a top view of the memory array region 11 A and FIG. 12 is a cross-sectional view along a cross-sectional line D-D in FIG. 11 .
- the plurality of linear core patterns 61 are removed from the substrate 51 .
- the space between the linear spacer patterns 65 in FIG. 12 is smaller than the space between the linear core patterns 61 in FIG. 6 .
- the space between the linear spacer patterns 65 in FIG. 12 is half of the space between the linear core patterns 61 in FIG. 6 .
- FIG. 13 is a top view of the memory array region 11 A and FIG. 14 is a cross-sectional view along a cross-sectional line E-E in FIG. 13 .
- step 45 of the method 40 a portion of the substrate 51 not covered by the plurality of linear spacer patterns 65 is removed to form a plurality of first line patterns 67 , wherein the plurality of first line patterns 67 extend along a first direction D 1 .
- an etching process is performed using the linear spacer patterns 65 as etching masks to remove a portion of the second layer 51 C not covered by the plurality of linear spacer patterns 65 , so as to form the plurality of first line patterns 67 under the linear spacer patterns 65 , which are then stripped from the substrate 51 .
- the plurality of first line patterns 67 are formed in the memory array region 11 A; in other words, the peripheral circuit region 11 B is in the absence of the first line patterns 37 .
- FIG. 15 is a top view of the memory array region 11 A
- FIG. 16 is a cross-sectional view along a cross-sectional line F-F in FIG. 15
- FIG. 17 is a cross-sectional view along a cross-sectional line G-G in FIG. 15
- a third layer 69 and a fourth layer 71 are formed on the substrate 51 by deposition process.
- a first litho-etch process is performed to remove a portion of the fourth layer 71 , so as to form a plurality of second line patterns 73 over the first line patterns 67 .
- the plurality of second line patterns 73 extend along a second direction D 2 different from the first direction D 1 .
- the second direction D 2 is substantially not perpendicular to the first direction D 1 .
- the first litho-etch process includes forming a patterned photoresist layer by lithography and performing an etching process using the patterned photoresist layer as an etching mask to remove a portion of the fourth layer 71 not covered by the etching mask.
- FIG. 18 is a top view of the peripheral circuit region 11 B and FIG. 19 is a cross-sectional view along a cross-sectional line H-H in FIG. 18 .
- the first litho-etch process also forms a plurality of linear features 75 in the peripheral circuit region 11 B; in other words, the plurality of linear features 75 in the peripheral circuit region 11 B are integrally formed with the plurality of second line patterns 73 in the memory array region 11 A.
- the corresponding elements of the linear features 75 and the second line patterns 73 are formed substantially by the same fabrication process, and have substantially the same physical and chemical properties as they are integrally formed with each other.
- FIG. 20 is a top view of the memory array region 11 A
- FIG. 21 is a cross-sectional view along a cross-sectional line I-I in FIG. 20
- FIG. 21 is a cross-sectional view along a cross-sectional line J-J in FIG. 20
- a second litho-etch process is performed to remove a portion of the fourth layer 71 to form a plurality of third line patterns 77 over the first line patterns 67 .
- the plurality of third line patterns 77 extend along the second direction D 2 different from the first direction D 1 .
- the plurality of second line patterns 73 and the plurality of third line patterns 77 are formed over the first line patterns 67 in an alternate manner
- the second litho-etch process includes forming a patterned photoresist layer by lithography and performing an etching process using the patterned photoresist layer as an etching mask to remove a portion of the fourth layer 71 not covered by the etching mask.
- FIG. 23 is a top view of the peripheral circuit region 11 B and FIG. 24 is a cross-sectional view along a cross-sectional line K-K in FIG. 23 .
- the second litho-etch process in step 49 of the method 40 , also forms a plurality of linear features 79 in the peripheral circuit region 11 B; in other words, the plurality of linear features 79 in the peripheral circuit region 11 B are integrally formed with the plurality of third line patterns 77 in the memory array region 11 A.
- the plurality of second line patterns 73 , the plurality of third line patterns 77 , and the plurality of linear features 75 , 79 are positioned at substantially the same level in the substrate 51 .
- the corresponding elements of the linear features 79 and the third line patterns 77 are formed substantially by the same fabrication process, and have substantially the same physical and chemical properties as they are integrally formed with each other.
- FIG. 20 is a top view of the memory array region 11 A
- FIG. 21 is a cross-sectional view along a cross-sectional line L-L in FIG. 20
- FIG. 21 is a cross-sectional view along a cross-sectional line M-M in FIG. 20
- FIG. 28 is a top view of the peripheral circuit region 11 B
- FIG. 29 is a cross-sectional view along a cross-sectional line N-N in FIG. 28 .
- an etching process is performed using the patterned fourth layer 71 to pattern the third layer 69 in the memory array region 11 A and in the peripheral circuit region 11 B.
- etching process is performed using the patterned third layer 69 to pattern the second layer 51 C in the memory array region 11 A and in the peripheral circuit region 11 B, so as to form a plurality of island patterns 81 in the memory array region 11 A and a plurality of linear features 83 in the peripheral circuit region 11 B.
- the plurality of first line patterns 67 are formed in the second layer (mask layer) 51 C of the substrate, and the two-etch process serves as a patterning process using the plurality of second line patterns 73 and the plurality of third line patterns 77 to pattern the plurality of first line patterns 67 into the plurality of island patterns 81 in the memory array region 11 A.
- the plurality of island patterns 81 and the plurality of linear features 83 are positioned at substantially different levels in the substrate 51 .
- the plurality of island patterns 81 are positioned at a first level
- the plurality of linear features 83 are positioned at a second level
- the first level is substantially lower than the second level in the substrate 51 .
- the island patterns 81 are active areas positioned in the memory array region 11 A in an array manner, the array extends along the first direction D 1 and the second direction D 2 substantially not perpendicular to the first direction D 1 .
- the plurality of linear features 83 extend along the first direction D 1 in the peripheral circuit region 11 B.
- a semiconductor structure includes a substrate having a memory array region and a peripheral circuit region; a plurality of first line patterns positioned in the memory array region and extending along a first direction; a plurality of second line patterns positioned over the first line patterns in the memory array region; and a plurality of linear features positioned in the peripheral circuit region.
- the plurality of second line patterns extend along a second direction different from the first direction.
- the plurality of second line patterns and the plurality of linear features are positioned at substantially the same level in the substrate.
- a semiconductor structure includes a substrate having a memory array region and a peripheral circuit region; a plurality of island patterns positioned in the memory array region; and a plurality of linear features in the peripheral circuit region.
- the plurality of island patterns and the plurality of linear features are positioned at substantially different levels in the substrate.
- a method for preparing a semiconductor structure comprises forming a plurality of linear core patterns and a plurality of linear spacer patterns on a substrate, wherein the plurality of linear spacer patterns are fornied on sidewalls of the linear core patterns.
- the method removes the plurality of linear core patterns from the substrate, and then removes a portion of the substrate not covered by the plurality of linear spacer patterns to form a plurality of first line patterns, wherein the plurality of first line patterns extend along a first direction.
- the method performs a first litho-etch process to form a plurality of second line patterns over the first line patterns, and performs a second litho-etch process to form a plurality of third line patterns over the first line patterns, wherein the plurality of second line patterns and the plurality of third line patterns are formed over the first line pattern in an alternate manner.
- the plurality of second line patterns extend along a second direction different from the first direction.
Abstract
A semiconductor structure includes a substrate having a memory array region and a peripheral circuit region; a plurality of first line patterns positioned in the memory array region and extending along a first direction; a plurality of second line patterns positioned over the first line patterns in the memory array region; and a plurality of linear features positioned in the peripheral circuit region. The plurality of second line patterns extend along a second direction different from the first direction. The plurality of second line patterns and the plurality of linear features are positioned at substantially the same level in the substrate.
Description
- The present disclosure relates to a semiconductor structure and a method for preparing the same.
- As the integration density of semiconductor devices increases, the lithographic process requires higher resolution to meet the precision requirements of the semiconductor devices. Photolithography process is typically used to fabricate electronic and optoelectronic devices on a semiconductor substrate and photoresist patterns prepared by the photolithography process are used as masks in etching or ion implantation. Therefore, the fineness of the photoresist patterns is a very important factor in determining the degree of integration.
- One method to increase resolution is to use a light source with a shorter wavelength as the exposure light source. For example, a krypton fluoride (KrF) laser is used to provide deep UV light with a wavelength of 248 nanometers and an argon fluoride (ArF) laser is used to provide deep UV light with a wavelength of 193 nanometers. Another method of forming such fine photoresist patterns on the semiconductor substrate is through double patterning technique. In a double patterning process, a pattern from a first exposure may be etched onto a photoresist layer on the semiconductor substrate, and the semiconductor substrate is subsequently recoated with the photoresist layer to form a second pattern and then re-etched to obtain the desired pattern. However, the double patterning technique requires that the exposure process be performed twice, which requires very precise alignment between the two exposure processes.
- This Discussion of the Background section is provided for background information only. The statements in this Discussion of the Background are not an admission that the subject matter disclosed in this section constitutes prior art to the present disclosure, and no part of this Discussion of the Background section may be used as an admission that any part of this application, including this Discussion of the Background section, constitutes prior art to the present disclosure.
- One aspect of the present disclosure provides a semiconductor structure comprising: a substrate having a memory array region and a peripheral circuit region; a plurality of first line patterns positioned in the memory array region and extending along a first direction; a plurality of second line patterns positioned over the first line patterns in the memory array region, wherein the plurality of second line patterns extend along a second direction different from the first direction; a plurality of third line patterns disposed over the first line patterns in the memory array region, wherein the plurality of second line patterns and the plurality of third line patterns are disposed over the first line pattern in an alternate manner; and a plurality of linear features positioned in the peripheral circuit region; wherein the plurality of second line patterns, the plurality of third line patterns, and the plurality of linear features are positioned at substantially the same level in the substrate.
- In some embodiments, the peripheral circuit region is in the absence of the first line patterns.
- In some embodiments, the plurality of linear features in the peripheral circuit region are integrally formed with the plurality of second line patterns in the memory array region.
- In some embodiments, the plurality of linear features in the peripheral circuit region are integrally foiiiied with the plurality of third line patterns in the memory array region.
- Another aspect of the present disclosure provides a semiconductor structure comprising a substrate having a memory array region and a peripheral circuit region; a plurality of island patterns positioned in the memory array region; and a plurality of linear features in the peripheral circuit region; wherein the plurality of island patterns and the plurality of linear features are positioned at substantially different levels in the substrate.
- In some embodiments, the plurality of island patterns are positioned in the memory array region in an array manner, wherein the array extends along a first direction and a second direction substantially not perpendicular to the first direction.
- In some embodiments, the plurality of linear features extend along the first direction in the peripheral circuit region.
- In some embodiments, the plurality of island patterns are positioned at a first level, the plurality of linear features are positioned at a second level, and the first level is substantially lower than the second level in the substrate.
- Another aspect of the present disclosure provides a method for preparing a semiconductor structure, comprising: forming a plurality of linear core patterns and a plurality of linear spacer patterns on a substrate, wherein the plurality of linear spacer patterns are formed on sidewalls of the linear core patterns; removing the plurality of linear core patterns from the substrate; removing a portion of the substrate not covered by the plurality of linear spacer patterns to form a plurality of first line patterns, wherein the plurality of first line patterns extend along a first direction; performing a first litho-etch process to form a plurality of second line patterns over the first line patterns, wherein the plurality of second line patterns extend along a second direction different from the first direction; and performing a second litho-etch process to form a plurality of third line patterns over the first line patterns, wherein the plurality of second line patterns and the plurality of third line patterns are formed over the first line pattern in an alternate manner.
- In some embodiments, the second direction is substantially not perpendicular to the first direction.
- In some embodiments, the plurality of first line patterns are formed in a mask layer of the substrate, and a patterning process is performed using the plurality of second line patterns and the plurality of third line patterns to pattern the plurality of first line patterns into a plurality of island patterns.
- In some embodiments, the method further comprises performing an etching process using the plurality of island patterns as an etching mask to remove a portion of a target layer under the mask layer.
- In some embodiments, the substrate comprises a memory array region and a peripheral circuit region, and the first litho-etch process and the second litho-etch process are performed to form the plurality of second line patterns and the plurality of third line patterns in the memory array region and a plurality of linear features in the peripheral circuit region.
- In some embodiments, the plurality of linear features in the peripheral circuit region are integrally formed with the plurality of second line patterns in the memory array region.
- In some embodiments, the plurality of linear features in the peripheral circuit region are integrally formed with the plurality of third line patterns in the memory array region.
- In some embodiments, the substrate comprises a memory array region and a peripheral circuit region, the plurality of first line patterns are formed in the memory array region, and the peripheral circuit region is in the absence of the first line patterns.
- In some embodiments, the forming of the plurality of linear core patterns comprises perfoiiiiing an immersion-litho process.
- In some embodiments, the forming of the plurality of first line patterns comprises performing an etching process using the plurality of linear spacer patterns as an etching mask.
- The foregoing has outlined rather broadly the features and technical advantages of the present disclosure in order that the detailed description of the disclosure that follows may be better understood. Additional features and advantages of the disclosure will be described hereinafter, and form the subject of the claims of the disclosure. It should be appreciated by those skilled in the art that the conception and specific embodiment disclosed may be readily utilized as a basis for modifying or designing other structures or processes for carrying out the same purposes of the present disclosure. It should also be realized by those skilled in the art that such equivalent constructions do not depart from the spirit and scope of the disclosure as set forth in the appended claims.
- A more complete understanding of the present disclosure may be derived by referring to the detailed description and claims when considered in connection with the Figures, where like reference numbers refer to similar elements throughout the Figures, and:
-
FIG. 1 is a schematic layout of a DRAM memory device having a memory array region and a peripheral circuit region in accordance with some embodiments of the present disclosure. -
FIG. 2 depicts a schematic diagram of a DRAM memory cell in accordance with some embodiments of the present disclosure. -
FIG. 3 schematically depicts the top view of the memory array region in accordance with some embodiments of the present disclosure. -
FIG. 4 is a flow chart of the method for preparing a semiconductor structure in accordance with some embodiments of the present disclosure. -
FIGS. 5 to 29 are schematic views of a process for preparing the semiconductor structure by the method inFIG. 4 in accordance with some embodiments of the present disclosure. - The following description of the disclosure accompanies drawings, which are incorporated in and constitute a part of this specification, and illustrate embodiments of the disclosure, but the disclosure is not limited to the embodiments. In addition, the following embodiments can be properly integrated to complete another embodiment.
- References to “one embodiment,” “an embodiment,” “exemplary embodiment,” “other embodiments,” “another embodiment,” etc. indicate that the embodiment(s) of the disclosure so described may include a particular feature, structure, or characteristic, but not every embodiment necessarily includes the particular feature, structure, or characteristic. Further, repeated use of the phrase “in the embodiment” does not necessarily refer to the same embodiment, although it may.
- The present disclosure is directed to a semiconductor structure and a method for preparing the same. In order to make the present disclosure completely comprehensible, detailed steps and structures are provided in the following description. Obviously, implementation of the present disclosure does not limit special details known by persons skilled in the art. In addition, known structures and steps are not described in detail, so as not to unnecessarily limit the present disclosure. Preferred embodiments of the present disclosure are described in detail below. However, in addition to the detailed description, the present disclosure may also be widely implemented in other embodiments. The scope of the present disclosure is not limited to the detailed description, but is defined by the claims.
- A variety of semiconductor memory devices are used extensively in many consumer products. Illustrative examples of such memory devices include dynamic random access memory (DRAM) and flash memory devices.
FIG. 1 is a schematic layout of aDRAM memory device 10 having amemory array region 11A and aperipheral circuit region 11B in accordance with some embodiments of the present disclosure. In general, thememory device 10 comprises amemory array 13 in thememory array region 11A and a plurality ofperipheral circuits 15 in theperipheral circuit region 11B. By way of example only, a plurality of schematically depicted illustrativeperipheral circuits 15 are depicted inFIG. 1 . More specifically, the illustrativeperipheral circuits 15 comprise read-writecircuits 15A,sense amp circuits 15B andpower management circuits 15C. The illustrative peripheral circuits depicted inFIG. 1 do not comprise an exhaustive set of all suchperipheral circuits 15 on thememory device 10. In other words, theperipheral circuit 15 may comprise any circuitry on thememory device 10 including those other than the circuitry found within thememory array 13. - The
memory array 13 includes a multitude of memory cells arranged in rows and columns. Each of the memory cells is structured for storing digital information in the form of a logical high (i.e., a “1”) or a logical low (i.e., a “0”). To write (i.e., store) a bit into a memory cell, a binary address having portions identifying the cell's row (the “row address”) and column (the “column address”) is provided to addressing circuitry in thememory device 10 to activate the cell, and the bit is then supplied to the cell. Similarly, to read (i.e., retrieve) a bit from a memory cell, the cell is again activated using the cell's memory address and the bit is then output from the cell. -
FIG. 2 depicts a schematic diagram of aDRAM memory cell 20 in accordance with some embodiments of the present disclosure. Thememory cell 20 comprises acapacitor 21 and atransistor 23. Thecapacitor 21 can store charge, which represents one bit of information. Thetransistor 23 acts as a switch, which controls the flow of charge into or out of thecapacitor 21. The control gate of thetransistor 23 is coupled to aword line 25, and the drain of thetransistor 23 is coupled to abit line 27. When a cell is read, thetransistor 23 is activated through theword line 25, and the charge in thecapacitor 21 can be detected by a sense amplifier through thebit line 27 and processed to determine the bit state of thecell 20. Atypical memory array 13 contains thousands or millions ofcells 20. -
FIG. 3 schematically depicts the top view of thememory array region 11A in accordance with some embodiments of the present disclosure. As shown inFIG. 3 , thememory array region 11A comprises a plurality of active areas 31, a plurality ofword lines 25 formed between correspondingactive areas 29, a plurality ofbit lines 27 coupled to a portion ofactive areas 29, and a plurality ofcapacitors 21 coupled with other portions ofactive areas 29. In some embodiments, the plurality ofactive areas 29 are island patterns positioned in thememory array region 11A in an array manner, and the array extends along a first direction D1 and a second direction D2 substantially not perpendicular to the first direction. -
FIG. 4 is a flow chart of themethod 40 for preparing a semiconductor structure in accordance with some embodiments of the present disclosure. Themethod 40 comprises astep 41 of foiiiiing a plurality of linear core patterns and a plurality of linear spacer patterns on a substrate, wherein the plurality of linear spacer patterns are formed on sidewalls of the linear core patterns; astep 43 of removing the plurality of linear core patterns from the substrate; astep 45 of removing a portion of the substrate not covered by the plurality of linear spacer patterns to form a plurality of first line patterns, wherein the plurality of first line patterns extend along a first direction; astep 47 of performing a first litho-etch process to form a plurality of second line patterns over the first line patterns, wherein the plurality of second line patterns extend along a second direction different from the first direction; and astep 49 of performing a second litho-etch process to form a plurality of third line patterns over the first line patterns, wherein the plurality of second line patterns and the plurality of third line patterns are formed over the first line pattern in an alternate manner. - The following describes an exemplary process flow of the injection
molding simulation method 40 in accordance with some embodiments of the present disclosure.FIGS. 5 to 29 are schematic views of a process for preparing the semiconductor structure by themethod 40 inFIG. 4 in accordance with some embodiments of the present disclosure. - In
step 41 of themethod 40, a plurality oflinear core patterns 61 and a plurality oflinear spacer patterns 65 are formed on asubstrate 51, as shown inFIGS. 5 to 10 . In some embodiments, referring toFIG. 5 andFIG. 6 , the plurality oflinear core patterns 61 are formed on thesubstrate 51 by deposition, lithography and etching processes.FIG. 5 is a top view of thememory array region 11A andFIG. 6 is a cross-sectional view along a cross-sectional line A-A inFIG. 5 . - In some embodiments, the
substrate 51 comprises a silicon wafer. In some embodiments, thesubstrate 51 comprises ametal layer 51A, afirst layer 51B and asecond layer 51C. In some embodiments, themetal layer 51A comprises tungsten (W), titanium nitride (TiN) or titanium (Ti). In some embodiments, thefirst layer 51B and thesecond layer 51C comprise different materials selected from the group consisting of silicon oxide, silicon nitride, silicon oxynitride, silicon, carbon, or the combination thereof. -
FIG. 7 is a top view of thememory array region 11A andFIG. 8 is a cross-sectional view along a cross-sectional line B-B inFIG. 7 . In some embodiments, a deposition process is performed to form adielectric layer 63 on thesubstrate 51. In some embodiments, the deposition process is an atomic layer deposition process, and thedielectric layer 63 covers the plurality oflinear core patterns 61 and comprises materials selected from the group consisting of silicon oxide, silicon nitride and silicon oxynitride. -
FIG. 9 is a top view of thememory array region 11A andFIG. 10 is a cross-sectional view along a cross-sectional line C-C inFIG. 9 . In some embodiments, a spacer etching process is performed to remove a portion of thedielectric layer 63 so as to form the plurality oflinear spacer patterns 65 on sidewalls of thelinear core patterns 61. -
FIG. 11 is a top view of thememory array region 11A andFIG. 12 is a cross-sectional view along a cross-sectional line D-D inFIG. 11 . Instep 43 of themethod 40, the plurality oflinear core patterns 61 are removed from thesubstrate 51. The space between thelinear spacer patterns 65 inFIG. 12 is smaller than the space between thelinear core patterns 61 inFIG. 6 . In some embodiments, the space between thelinear spacer patterns 65 inFIG. 12 is half of the space between thelinear core patterns 61 inFIG. 6 . -
FIG. 13 is a top view of thememory array region 11A andFIG. 14 is a cross-sectional view along a cross-sectional line E-E inFIG. 13 . Instep 45 of themethod 40, a portion of thesubstrate 51 not covered by the plurality oflinear spacer patterns 65 is removed to form a plurality offirst line patterns 67, wherein the plurality offirst line patterns 67 extend along a first direction D1. In some embodiments, an etching process is performed using thelinear spacer patterns 65 as etching masks to remove a portion of thesecond layer 51C not covered by the plurality oflinear spacer patterns 65, so as to form the plurality offirst line patterns 67 under thelinear spacer patterns 65, which are then stripped from thesubstrate 51. In some embodiments, the plurality offirst line patterns 67 are formed in thememory array region 11A; in other words, theperipheral circuit region 11B is in the absence of the first line patterns 37. -
FIG. 15 is a top view of thememory array region 11A,FIG. 16 is a cross-sectional view along a cross-sectional line F-F inFIG. 15 , andFIG. 17 is a cross-sectional view along a cross-sectional line G-G inFIG. 15 . In some embodiments, athird layer 69 and afourth layer 71 are formed on thesubstrate 51 by deposition process. Instep 47 of themethod 40, a first litho-etch process is performed to remove a portion of thefourth layer 71, so as to form a plurality ofsecond line patterns 73 over thefirst line patterns 67. In some embodiments, the plurality ofsecond line patterns 73 extend along a second direction D2 different from the first direction D1. In some embodiments, the second direction D2 is substantially not perpendicular to the first direction D1. In some embodiments, the first litho-etch process includes forming a patterned photoresist layer by lithography and performing an etching process using the patterned photoresist layer as an etching mask to remove a portion of thefourth layer 71 not covered by the etching mask. -
FIG. 18 is a top view of theperipheral circuit region 11B andFIG. 19 is a cross-sectional view along a cross-sectional line H-H inFIG. 18 . In some embodiments, instep 47 of themethod 40, the first litho-etch process also forms a plurality oflinear features 75 in theperipheral circuit region 11B; in other words, the plurality oflinear features 75 in theperipheral circuit region 11B are integrally formed with the plurality ofsecond line patterns 73 in thememory array region 11A. In some embodiments, the corresponding elements of thelinear features 75 and thesecond line patterns 73 are formed substantially by the same fabrication process, and have substantially the same physical and chemical properties as they are integrally formed with each other. -
FIG. 20 is a top view of thememory array region 11A,FIG. 21 is a cross-sectional view along a cross-sectional line I-I inFIG. 20 , andFIG. 21 is a cross-sectional view along a cross-sectional line J-J inFIG. 20 . In some embodiments, instep 49 of themethod 40, a second litho-etch process is performed to remove a portion of thefourth layer 71 to form a plurality ofthird line patterns 77 over thefirst line patterns 67. In some embodiments, the plurality ofthird line patterns 77 extend along the second direction D2 different from the first direction D1. In some embodiments, the plurality ofsecond line patterns 73 and the plurality ofthird line patterns 77 are formed over thefirst line patterns 67 in an alternate manner In some embodiments, the second litho-etch process includes forming a patterned photoresist layer by lithography and performing an etching process using the patterned photoresist layer as an etching mask to remove a portion of thefourth layer 71 not covered by the etching mask. -
FIG. 23 is a top view of theperipheral circuit region 11B andFIG. 24 is a cross-sectional view along a cross-sectional line K-K inFIG. 23 . In some embodiments, instep 49 of themethod 40, the second litho-etch process also forms a plurality oflinear features 79 in theperipheral circuit region 11B; in other words, the plurality oflinear features 79 in theperipheral circuit region 11B are integrally formed with the plurality ofthird line patterns 77 in thememory array region 11A. In some embodiments, the plurality ofsecond line patterns 73, the plurality ofthird line patterns 77, and the plurality oflinear features substrate 51. In some embodiments, the corresponding elements of thelinear features 79 and thethird line patterns 77 are formed substantially by the same fabrication process, and have substantially the same physical and chemical properties as they are integrally formed with each other. -
FIG. 20 is a top view of thememory array region 11A,FIG. 21 is a cross-sectional view along a cross-sectional line L-L inFIG. 20 , andFIG. 21 is a cross-sectional view along a cross-sectional line M-M inFIG. 20 .FIG. 28 is a top view of theperipheral circuit region 11B andFIG. 29 is a cross-sectional view along a cross-sectional line N-N inFIG. 28 . In some embodiments, an etching process is performed using the patternedfourth layer 71 to pattern thethird layer 69 in thememory array region 11A and in theperipheral circuit region 11B. Subsequently, another etching process is performed using the patternedthird layer 69 to pattern thesecond layer 51C in thememory array region 11A and in theperipheral circuit region 11B, so as to form a plurality ofisland patterns 81 in thememory array region 11A and a plurality oflinear features 83 in theperipheral circuit region 11B. - Referring to
FIG. 13 andFIG. 25 , the plurality offirst line patterns 67 are formed in the second layer (mask layer) 51C of the substrate, and the two-etch process serves as a patterning process using the plurality ofsecond line patterns 73 and the plurality ofthird line patterns 77 to pattern the plurality offirst line patterns 67 into the plurality ofisland patterns 81 in thememory array region 11A. - In some embodiments, the plurality of
island patterns 81 and the plurality oflinear features 83 are positioned at substantially different levels in thesubstrate 51. In some embodiments, the plurality ofisland patterns 81 are positioned at a first level, the plurality oflinear features 83 are positioned at a second level, and the first level is substantially lower than the second level in thesubstrate 51. In some embodiments, theisland patterns 81 are active areas positioned in thememory array region 11A in an array manner, the array extends along the first direction D1 and the second direction D2 substantially not perpendicular to the first direction D1. In some embodiments, the plurality oflinear features 83 extend along the first direction D1 in theperipheral circuit region 11B. - In some embodiments, a semiconductor structure includes a substrate having a memory array region and a peripheral circuit region; a plurality of first line patterns positioned in the memory array region and extending along a first direction; a plurality of second line patterns positioned over the first line patterns in the memory array region; and a plurality of linear features positioned in the peripheral circuit region. In some embodiments, the plurality of second line patterns extend along a second direction different from the first direction. In some embodiments, the plurality of second line patterns and the plurality of linear features are positioned at substantially the same level in the substrate.
- In some embodiments, a semiconductor structure includes a substrate having a memory array region and a peripheral circuit region; a plurality of island patterns positioned in the memory array region; and a plurality of linear features in the peripheral circuit region. In some embodiments, the plurality of island patterns and the plurality of linear features are positioned at substantially different levels in the substrate.
- In some embodiments, a method for preparing a semiconductor structure comprises forming a plurality of linear core patterns and a plurality of linear spacer patterns on a substrate, wherein the plurality of linear spacer patterns are fornied on sidewalls of the linear core patterns. In some embodiments, the method removes the plurality of linear core patterns from the substrate, and then removes a portion of the substrate not covered by the plurality of linear spacer patterns to form a plurality of first line patterns, wherein the plurality of first line patterns extend along a first direction. Subsequently, the method performs a first litho-etch process to form a plurality of second line patterns over the first line patterns, and performs a second litho-etch process to form a plurality of third line patterns over the first line patterns, wherein the plurality of second line patterns and the plurality of third line patterns are formed over the first line pattern in an alternate manner. In some embodiments, the plurality of second line patterns extend along a second direction different from the first direction.
- Although the present disclosure and its advantages have been described in detail, it should be understood that various changes, substitutions and alterations can be made herein without departing from the spirit and scope of the disclosure as defined by the appended claims. For example, many of the processes discussed above can be implemented in different methodologies and replaced by other processes, or a combination thereof.
- Moreover, the scope of the present application is not intended to be limited to the particular embodiments of the process, machine, manufacture, composition of matter, means, methods and steps described in the specification. As one of ordinary skill in the art will readily appreciate from the disclosure of the present disclosure, processes, machines, manufacture, compositions of matter, means, methods, or steps, presently existing or later to be developed, that perform substantially the same function or achieve substantially the same result as the corresponding embodiments described herein may be utilized according to the present disclosure. Accordingly, the appended claims are intended to include within their scope such processes, machines, manufacture, compositions of matter, means, methods, or steps.
Claims (20)
1. A semiconductor structure, comprising:
a substrate having a first region and a second region;
a plurality of first line patterns positioned in the first region and extending along a first direction;
a plurality of second line patterns positioned over the first line patterns in the first region, wherein the plurality of second line patterns extend along a second direction substantially not perpendicular to the first direction; and
a plurality of linear features positioned in the second region;
wherein the plurality of second line patterns and the plurality of linear features are positioned at substantially the same level in the substrate.
2. The semiconductor structure of claim 1 , further comprising a plurality of third line patterns disposed over the first line patterns in the first region, wherein the plurality of second line patterns and the plurality of third line patterns are disposed over the first line pattern in an alternate manner.
3. The semiconductor structure of claim 2 , wherein the plurality of second line patterns, the plurality of third line patterns, and the plurality of linear features are positioned at substantially the same level in the substrate.
4. The semiconductor structure of claim 1 , wherein the second region is in the absence of the first line patterns.
5. The semiconductor structure of claim 1 , wherein the plurality of linear features in the second region are integrally formed with the plurality of second line patterns in the first region.
6. The semiconductor structure of claim 1 , wherein the plurality of linear features in the second region are integrally formed with the plurality of third line patterns in the first region.
7. The semiconductor structure of claim 1 , wherein the first region is a memory array region, and the second region is a peripheral circuit region.
8. A semiconductor structure, comprising:
a substrate having a first region and a second region;
a plurality of island patterns positioned only in the first region; and
a plurality of linear features only in the second region;
wherein the plurality of island patterns and the plurality of linear features are positioned at substantially different levels in the substrate.
9. The semiconductor structure of claim 8 , wherein the plurality of island patterns are positioned in the first region in an array manner, the array extends along a first direction and a second direction substantially not perpendicular to the first direction.
10. The semiconductor structure of claim 9 , wherein the plurality of linear features extend along the first direction in the second region.
11. The semiconductor structure of claim 8 , wherein the plurality of island patterns are positioned at a first level, the plurality of linear features are positioned at a second level, and the first level is substantially lower than the second level in the substrate.
12. The semiconductor structure of claim 8 , wherein the first region is a memory array region, and the second region is a peripheral circuit region.
13. A method for preparing a semiconductor structure, comprising:
forming a plurality of linear core patterns and a plurality of linear spacer patterns on a substrate, wherein the plurality of linear spacer patterns are formed on sidewalls of the linear core patterns;
removing the plurality of linear core patterns from the substrate;
removing a portion of the substrate not covered by the plurality of linear spacer patterns to form a plurality of first line patterns, wherein the plurality of first line patterns extend along a first direction;
performing a first litho-etch process to form a plurality of second line patterns over the first line patterns, wherein the plurality of second line patterns extend along a second direction different from the first direction; and
performing a second litho-etch process to form a plurality of third line patterns over the first line patterns, wherein the plurality of second line patterns and the plurality of third line patterns are formed over the first line pattern in an alternate manner
14. The method for preparing a semiconductor structure of claim 13 , wherein the second direction is substantially not perpendicular to the first direction.
15. The method for preparing a semiconductor structure of claim 13 , wherein the plurality of first line patterns are formed in a mask layer of the substrate, and a patterning process is performed using the plurality of second line patterns and the plurality of third line patterns to pattern the plurality of first line patterns into a plurality of island patterns.
16. The method for preparing a semiconductor structure of claim 13 , wherein the substrate comprises a first region and a second region, and the first litho-etch process and the second litho-etch process are performed to form the plurality of second line patterns and the plurality of third line patterns in the first region and a plurality of linear features in the second region.
17. The method for preparing a semiconductor structure of claim 16 , wherein the plurality of linear features in the second region are integrally formed with the plurality of second line patterns in the first region.
18. The method for preparing a semiconductor structure of claim 16 , wherein the plurality of linear features in the second region are integrally formed with the plurality of third line patterns in the first region.
19. The method for preparing a semiconductor structure of claim 13 , wherein the substrate comprises a first region and a second region, the plurality of first line patterns are formed in the first region, and the second region is in the absence of the first line patterns.
20. The method for preparing a semiconductor structure of claim 13 , wherein the forming of the plurality of first line patterns comprises performing an etching process using the plurality of linear spacer patterns as an etching mask.
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CN201710994380.9A CN109285834B (en) | 2017-07-21 | 2017-10-23 | Semiconductor structure and manufacturing method thereof |
US15/853,411 US10090154B1 (en) | 2017-07-21 | 2017-12-22 | Method for preparing a semiconductor structure having second line patterns and third line patterns formed over first line patterns |
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Also Published As
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CN109285834A (en) | 2019-01-29 |
CN109285834B (en) | 2020-10-30 |
TW201909238A (en) | 2019-03-01 |
US10090154B1 (en) | 2018-10-02 |
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