US20180261461A1 - Salicide formation using a cap layer - Google Patents

Salicide formation using a cap layer Download PDF

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US20180261461A1
US20180261461A1 US15/981,665 US201815981665A US2018261461A1 US 20180261461 A1 US20180261461 A1 US 20180261461A1 US 201815981665 A US201815981665 A US 201815981665A US 2018261461 A1 US2018261461 A1 US 2018261461A1
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Prior art keywords
semiconductor device
salicide layer
feature
gate
gate stack
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US15/981,665
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Mei-Hsuan LIN
Chih-Hsun Lin
Ching-Hua Chu
Ling-Sung Wang
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Taiwan Semiconductor Manufacturing Co TSMC Ltd
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Taiwan Semiconductor Manufacturing Co TSMC Ltd
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Assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. reassignment TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CHU, CHING-HUA, LIN, CHIH-HSUN, LIN, MEI-HSUAN, WANG, LING-SUNG
Publication of US20180261461A1 publication Critical patent/US20180261461A1/en
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Definitions

  • Salicides are self-aligned silicides.
  • Self-aligned refers to a manufacturing technique where a gate electrode region of a transistor is used as a mask for doping the source and drain.
  • Some techniques for forming salicides over source and drain features include depositing a metal layer over a surface of a semiconductor assembly including the source and drain features. The assembly is then annealed to form a salicide in a reaction between silicon atoms in the source and drain features and metal atoms in the metal layer. The unreacted metal is then removed using an etching process.
  • the reaction to form salicide consumes silicon atoms in the source and drain features. If the source and drain features have an insufficient amount of silicon at a surface interface with the metal layer, in some instances, the salicide is also etched through during the etching process to remove unreacted metal. Etching through the salicide creates openings that can form short circuits when metal contacts are deposited on the source and drain features. Additionally, in situations where silicon atoms are unevenly concentrated in the source and drain features, voids can form in the salicide and cause the semiconductor device to malfunction.
  • FIG. 1 is a side view diagram of a semiconductor device including cap layers, according to one ore more embodiments.
  • FIG. 2 is a flowchart of a method of forming a salicide layer in a semiconductor device including cap layers, according to one or more embodiment.
  • FIGS. 3A-3G are side view diagrams of a semiconductor device during various stages of the method of FIG. 2 .
  • FIG. 1 is a side view diagram of a semiconductor device 100 according to an embodiment.
  • Semiconductor device 100 includes a substrate 102 having source and drain features 104 in substrate 102 .
  • Semiconductor device 100 includes a gate stack 106 and optional spacers 108 over substrate 102 .
  • Semiconductor device 100 further includes cap layers 110 over at least a portion of source and drain features 104 .
  • substrate 102 is silicon. In some embodiments, substrate 102 is silicon germanium, gallium arsenide, germanium or other suitable semiconductor material. In some embodiments, substrate 102 is a semiconductor on insulator such as silicon on insulator
  • Source and drain features 104 are areas of higher charge mobility within substrate 102 . In some embodiments, source and drain features 104 have higher hole mobility than substrate 102 . In some embodiments, source and drain features 104 have higher electron mobility than substrate 102 . In some embodiments, source and drain features 104 are doped with p-type dopants, such as boron or BF 2 ; or n-type dopants, such as phosphorous or arsenic. In some embodiments, source and drain features 104 comprise silicon germanium. In some embodiments, source and drain features 104 are substantially silicon free.
  • Gate stack 106 includes a gate electrode 106 a over an optional a gate dielectric 106 b .
  • gate electrode 106 a comprises polysilicon.
  • gate electrode 106 a comprises molybdenum, aluminum, copper or other suitable conductive material.
  • optional gate dielectric 106 b comprises silicon dioxide.
  • optional gate dielectric 106 b comprises a high k dielectric, such as hafnium silicate, zirconium silicate, hafnium dioxide, zirconium dioxide, or other suitable dielectric material.
  • source and drain features 104 and gate stack 106 collectively form a transistor. In some embodiments, where source and drain features 104 are selected to enhance hole mobility, source and drain features 104 and gate stack 106 collectively form a p-type metal oxide semiconductor (PMOS) transistor. In some embodiments, where source and drain features 104 are selected to enhance electron mobility, source and drain features 104 and gate stack 106 collectively form an n-type metal oxide semiconductor (NMOS) transistor.
  • PMOS metal oxide semiconductor
  • NMOS n-type metal oxide semiconductor
  • semiconductor device 100 optionally includes spacers 108 along sidewalls of gate stack 106 .
  • spacers 108 comprise silicon dioxide, silicon nitride, silicon oxynitride or other suitable material. In some embodiments, spacers 108 comprise non-conductive material.
  • Cap layers 110 are over source and drain features 104 extending beyond gate stack 106 and optional spacers 108 . In at least some embodiments, cap layers 110 extend over substantially all of source and drain features 104 extending beyond gate stack 106 and optional spacers 108 . Cap layers 110 comprise silicon. In some embodiments, cap layers 110 have a thickness ranging from about 5 Angstroms to about 10 Angstroms. This range, in some embodiments, is narrower, e.g., from 5 Angstroms to 10 Angstroms.
  • cap layers 110 provide sufficient silicon atoms to form the salicide layer over source and drain features 104 to a thickness sufficient to avoid etching through the salicide layer. The inclusion of cap layers 110 in semiconductor device 100 , thus acts to increase the yield of a production process by reducing the number of semiconductor devices that are defective due to short circuits.
  • Cap layers 110 also provide substantially uniform silicon concentration over source and drain features 104 . In some instances where the salicide layer is formed with variations in silicon concentration, voids form in the salicide layer thereby increasing resistance to current flow. Increased resistance causes semiconductor device 100 to perform below acceptable standards. Cap layers 110 avoid the formation of voids in the salicide through the substantially uniform distribution of silicon, thereby increasing production yield.
  • FIG. 2 is a process flow diagram of a method 200 of forming a semiconductor device 300 , according to one or more embodiments.
  • Method 200 begins with forming source and drain features 104 in substrate 102 , gate stack 106 and optionally spacers 108 over substrate 102 in operation 202 .
  • source and drain features 104 are formed by ion implantation, including tilted ion implantation.
  • source and drain features 104 are formed by doping, annealing or other suitable processes.
  • Gate stack 106 and optional spacers 108 are formed using methods known in the art including gate last processes.
  • FIG. 3A is a side view diagram of semiconductor device 300 following formation of source and drain features 104 , gate stack 106 and optionally spacers 108 .
  • Method 200 continues with optional operation 204 , in which a photoresist layer 112 ( FIG. 3B ) is deposited over substrate 102 .
  • outer boundaries of source and drain features 104 are defined by isolation features, another gate stack, or other features over substrate 102 of semiconductor device 300 . If the outer boundaries of source and drain features 104 are defined by another feature, photoresist layer 112 is eliminated, according to some embodiments.
  • spin-on deposition, physical vapor deposition, or other suitable deposition process deposits photoresist layer 112 over substrate 102 .
  • Method 200 continues with optional operation 206 , in which photoresist layer 112 is patterned and etched.
  • operation 206 is likewise omitted.
  • ultraviolet light passing through a mask patterns photoresist layer 112 .
  • thermal energy or other suitable patterning processes are used to pattern photoresist layer 112 .
  • patterned photoresist layer 112 is etched using a wet etching process.
  • the etching process is a dry etching process, a plasma etching process, a reactive ion etching process, or other suitable etching process.
  • FIG. 3C is a side view diagram of semiconductor device 300 following patterning and etching of photoresist layer 112 .
  • cap layers 110 are deposited over source and drain features 104 .
  • cap layers 110 are deposited using an epitaxial growth process.
  • cap layers 110 are deposited by sputtering, atomic layer deposition, or other suitable deposition processes. In some embodiments, deposition continues until cap layers 110 have a thickness ranging from about 5 Angstroms to about 10 Angstroms.
  • FIG. 3D is a side view diagram of semiconductor device 300 following deposition of cap layers 110 .
  • photoresist layer 112 is removed. In some embodiments, photoresist layer 112 is removed using plasma ashing. In some embodiments, photoresist layer 112 is removed using etching or other suitable removal processes.
  • a metal layer 114 ( FIG. 3E ) is deposited over substrate 102 .
  • metal layer 114 is deposited using physical vapor deposition.
  • metal layer 114 is deposited using chemical vapor deposition, atomic layer deposition, electron beam evaporation, sputtering, or other suitable deposition process.
  • metal layer 114 comprises nickel, cobalt, titanium, platinum, or other suitable metal material.
  • the deposition process continues until metal layer 114 has a thickness ranging from about 200 Angstroms to about 400 Angstroms. This range, in some embodiments, is narrower, e.g., from 200 Angstroms to 400 Angstroms.
  • FIG. 3E is a side view diagram of semiconductor device 300 following deposition of metal layer 114 .
  • Method 200 continues with operation 212 , in which semiconductor device 300 is heated during an annealing process.
  • the annealing process causes metal atoms in metal layer 114 to react with silicon atoms in cap layers 110 and in source and drain features 104 to create the salicide layer.
  • semiconductor device 300 is heated to a temperature ranging from about 200 C to about 800 C. This range, in some embodiments, is narrower, e.g., from 200 C to 800 C.
  • the annealing process continues for a duration ranging from about 1 minute to about 10 minutes.
  • the annealing process tunes the resistivity of the salicide layer. Generally, the higher the annealing temperature and the longer the annealing duration, the lower the resistivity of the resulting salicide layer because of the formation of larger grains in the salicide layer. If the metal of metal layer 114 and the silicon of cap layers 110 react to form different compounds, tailoring the annealing process allows selective formation of a desired salicide compound. For example, when the metal of metal layer 114 is nickel, the desired salicide compound is NiSi, instead of materials with a higher resistivity such as Ni 2 Si or NiSi 2 . In order to obtain the highest concentration of NiSi in the salicide layer, the annealing process takes place at a temperature of about 200 C to about 500 C for a duration of about one minute.
  • FIG. 3F is a side view diagram of semiconductor device 300 following the annealing process.
  • the annealing process causes metal layer 114 to react with silicon to form salicide layer 116 .
  • salicide layer 116 has a thickness ranging from about 120 Angstroms to about 300 Angstroms. This range, in some embodiments, is narrower, e.g., from 120 Angstroms to 300 Angstroms.
  • gate electrode 106 a contains silicon, e.g., polysilicon, and the annealing process causes metal layer 114 to react with silicon atoms of gate electrode 106 a to form a salicide layer over gate stack 106 as well as over source and drain features 104 .
  • FIG. 3G is a side view diagram of semiconductor device 300 following removal of the unreacted metal.
  • cap layers 110 helps to form salicide layers 116 with sufficient thickness, to prevent the process removing metal layer 114 in operation 214 from also exposing source and drain features 104 through portions of salicide layers 116 .
  • the inclusion of cap layers 110 also aids in forming salicide layers 116 having reduced amounts of germanium within the salicide layers.
  • a germanium concentration within salicide layers 116 is less than about 3% by weight. Using conventional techniques which do not include cap layers 110 , a germanium concentration within conventional salicide layers ranges from about 13% by weight to about 17% by weight.
  • cap layers 110 are connected to salicide layers 116 and electrically connected to an interconnect structure to incorporate semiconductor device 300 into a circuit. Including cap layers 110 in the formation of semiconductor device 300 increases production yield over formation processes in which cap layers 110 are omitted.
  • the method includes forming a source feature and a drain feature in a substrate.
  • the method further includes forming a gate stack over a first portion of the source feature and a first portion of the drain feature, the gate stack comprising a gate electrode.
  • the method further includes depositing a first cap layer comprising silicon over a second portion of the source feature exposed by the gate stack.
  • the method further includes depositing a second cap layer comprising silicon over a second portion of the drain feature exposed by the gate stack.
  • the method further includes depositing a metal layer over the gate stack, the first cap layer and the second cap layer.
  • the method further includes annealing the semiconductor device until all of the silicon in the first cap layer and the second cap layer reacts with metal from the metal layer, wherein the annealing causes metal from the metal layer to react with silicon in the first cap layer, the second cap layer, the source feature, and the drain feature while leaving at least a portion of the gate electrode free of silicide.
  • Annealing the semiconductor device includes annealing the semiconductor device at a temperature ranging from 450° C. to 800° C. to form a salicide layer having a germanium concentration less than 3% by weight.
  • the method includes forming a source feature and a drain feature in a substrate.
  • the method further includes forming a gate stack over a first portion of the source feature and a first portion of the drain feature, the gate stack comprising a gate electrode.
  • the method further includes depositing, patterning, and etching a photoresist layer over the substrate.
  • the method further includes depositing a first cap layer comprising silicon over a second portion of the source feature exposed by the gate stack and the photoresist layer.
  • the method further includes depositing a second cap layer comprising silicon over a second portion of the drain feature exposed by the gate stack and the photoresist layer.
  • the method further includes removing the photoresist layer.
  • the method further includes depositing a metal layer over the gate stack, the first cap layer and the second cap layer.
  • the method further includes annealing the semiconductor device until all of the silicon in the first cap layer and the second cap layer is consumed by a silicidation reaction, wherein the annealing causes metal from the metal layer to react with silicon in the first cap layer, the second cap layer, the source feature, and the drain feature while leaving at least a portion of the gate electrode free of silicide.
  • Annealing the semiconductor device includes annealing the semiconductor device at a temperature ranging from 450° C. to 800° C. to form a silicide layer having a germanium concentration less than 3% by weight.
  • the semiconductor device includes a substrate having a source feature and a drain feature therein configured to enhance charge mobility.
  • the semiconductor device further includes a gate stack over a portion of the source feature and a portion of the drain feature.
  • the semiconductor device further includes a first salicide layer over substantially the entire source feature not covered by the gate stack, wherein the first salicide layer has a germanium concentration less than about 3% by weight.
  • the semiconductor device further includes a second salicide layer over substantially the entire drain feature not covered by the gate stack, wherein the second salicide layer has a germanium concentration less than about 3% by weight.

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Abstract

A semiconductor device includes a substrate having a source feature and a drain feature therein configured to enhance charge mobility, a gate stack directly over a portion of the source feature and a portion of the drain feature, a first salicide layer over substantially the entire source feature exposed by the gate stack, and a second salicide layer over substantially the entire drain feature exposed by the gate stack. The first salicide layer has a germanium concentration greater than about 0% by weight and less than about 3% by weight. The second salicide layer has a germanium concentration greater than about 0% by weight and less than about 3% by weight.

Description

    PRIORITY CLAIM
  • The present application is a divisional of U.S. application Ser. No. 14/957,948, filed Dec. 3, 2015, which is a continuation of U.S. application Ser. No. 13/367,989, filed Feb. 7, 2012, now U.S. Pat. No. 9,343,318, issued May 17, 2016, which are incorporated herein by reference in their entireties.
    • BACKGROUND
  • Many semiconductor devices use metal-silicon compounds called silicdes to enhance conductivity between source and drain features and conductive lines. Salicides are self-aligned silicides. Self-aligned refers to a manufacturing technique where a gate electrode region of a transistor is used as a mask for doping the source and drain. Some techniques for forming salicides over source and drain features include depositing a metal layer over a surface of a semiconductor assembly including the source and drain features. The assembly is then annealed to form a salicide in a reaction between silicon atoms in the source and drain features and metal atoms in the metal layer. The unreacted metal is then removed using an etching process.
  • The reaction to form salicide consumes silicon atoms in the source and drain features. If the source and drain features have an insufficient amount of silicon at a surface interface with the metal layer, in some instances, the salicide is also etched through during the etching process to remove unreacted metal. Etching through the salicide creates openings that can form short circuits when metal contacts are deposited on the source and drain features. Additionally, in situations where silicon atoms are unevenly concentrated in the source and drain features, voids can form in the salicide and cause the semiconductor device to malfunction.
    • BRIEF DESCRIPTION OF THE DRAWINGS
  • One or more embodiments are illustrated by way of example, and not by limitation, in the figures of the accompanying drawings, wherein elements having the same reference numeral designations represent like elements throughout. It is emphasized that, in accordance with standard practice in the industry various features may not be drawn to scale and are used for illustration purposes only. In fact, the dimensions of the various features in the drawings may be arbitrarily increased or reduced for clarity of discussion.
  • FIG. 1 is a side view diagram of a semiconductor device including cap layers, according to one ore more embodiments.
  • FIG. 2 is a flowchart of a method of forming a salicide layer in a semiconductor device including cap layers, according to one or more embodiment.
  • FIGS. 3A-3G are side view diagrams of a semiconductor device during various stages of the method of FIG. 2.
    •  DETAILED DESCRIPTION
  • The following disclosure provides many different embodiments, or examples, for implementing different features of the invention. Specific examples of components and arrangements are described below to simplify the present disclosure. These are of course, merely examples and are not intended to be limiting.
  • FIG. 1 is a side view diagram of a semiconductor device 100 according to an embodiment. Semiconductor device 100 includes a substrate 102 having source and drain features 104 in substrate 102. Semiconductor device 100 includes a gate stack 106 and optional spacers 108 over substrate 102. Semiconductor device 100 further includes cap layers 110 over at least a portion of source and drain features 104.
  • In some embodiments, substrate 102 is silicon. In some embodiments, substrate 102 is silicon germanium, gallium arsenide, germanium or other suitable semiconductor material. In some embodiments, substrate 102 is a semiconductor on insulator such as silicon on insulator
  • Source and drain features 104 are areas of higher charge mobility within substrate 102. In some embodiments, source and drain features 104 have higher hole mobility than substrate 102. In some embodiments, source and drain features 104 have higher electron mobility than substrate 102. In some embodiments, source and drain features 104 are doped with p-type dopants, such as boron or BF2; or n-type dopants, such as phosphorous or arsenic. In some embodiments, source and drain features 104 comprise silicon germanium. In some embodiments, source and drain features 104 are substantially silicon free.
  • Gate stack 106 includes a gate electrode 106 a over an optional a gate dielectric 106 b. In some embodiments, gate electrode 106 a comprises polysilicon. In some embodiments, gate electrode 106 a comprises molybdenum, aluminum, copper or other suitable conductive material. In some embodiments, optional gate dielectric 106 b comprises silicon dioxide. In some embodiments, optional gate dielectric 106 b comprises a high k dielectric, such as hafnium silicate, zirconium silicate, hafnium dioxide, zirconium dioxide, or other suitable dielectric material.
  • In some embodiments, source and drain features 104 and gate stack 106 collectively form a transistor. In some embodiments, where source and drain features 104 are selected to enhance hole mobility, source and drain features 104 and gate stack 106 collectively form a p-type metal oxide semiconductor (PMOS) transistor. In some embodiments, where source and drain features 104 are selected to enhance electron mobility, source and drain features 104 and gate stack 106 collectively form an n-type metal oxide semiconductor (NMOS) transistor.
  • In some embodiments, semiconductor device 100 optionally includes spacers 108 along sidewalls of gate stack 106. In some embodiments, spacers 108 comprise silicon dioxide, silicon nitride, silicon oxynitride or other suitable material. In some embodiments, spacers 108 comprise non-conductive material.
  • Cap layers 110 are over source and drain features 104 extending beyond gate stack 106 and optional spacers 108. In at least some embodiments, cap layers 110 extend over substantially all of source and drain features 104 extending beyond gate stack 106 and optional spacers 108. Cap layers 110 comprise silicon. In some embodiments, cap layers 110 have a thickness ranging from about 5 Angstroms to about 10 Angstroms. This range, in some embodiments, is narrower, e.g., from 5 Angstroms to 10 Angstroms.
  • In the reaction to form a salicide layer (FIG. 3G) over source and drain features 104, silicon is consumed. In some embodiments, where source and drain features 104 do not comprise sufficient silicon concentrations, the salicide layer formed over source and drain features 104 is insufficiently thick to prevent etching through the salicide layer and prevent exposing source and drain features 104 during removal of unreacted metal. Exposing source and drain features 104 creates short circuits when metallized features, e.g., vias, are formed in contact with source and drain features 104. Cap layers 110 provide sufficient silicon atoms to form the salicide layer over source and drain features 104 to a thickness sufficient to avoid etching through the salicide layer. The inclusion of cap layers 110 in semiconductor device 100, thus acts to increase the yield of a production process by reducing the number of semiconductor devices that are defective due to short circuits.
  • Cap layers 110 also provide substantially uniform silicon concentration over source and drain features 104. In some instances where the salicide layer is formed with variations in silicon concentration, voids form in the salicide layer thereby increasing resistance to current flow. Increased resistance causes semiconductor device 100 to perform below acceptable standards. Cap layers 110 avoid the formation of voids in the salicide through the substantially uniform distribution of silicon, thereby increasing production yield.
  • FIG. 2 is a process flow diagram of a method 200 of forming a semiconductor device 300, according to one or more embodiments. Method 200 begins with forming source and drain features 104 in substrate 102, gate stack 106 and optionally spacers 108 over substrate 102 in operation 202. In some embodiments, source and drain features 104 are formed by ion implantation, including tilted ion implantation. In some embodiments, source and drain features 104 are formed by doping, annealing or other suitable processes. Gate stack 106 and optional spacers 108 are formed using methods known in the art including gate last processes. FIG. 3A is a side view diagram of semiconductor device 300 following formation of source and drain features 104, gate stack 106 and optionally spacers 108.
  • Method 200 continues with optional operation 204, in which a photoresist layer 112 (FIG. 3B) is deposited over substrate 102. In some embodiments, outer boundaries of source and drain features 104 are defined by isolation features, another gate stack, or other features over substrate 102 of semiconductor device 300. If the outer boundaries of source and drain features 104 are defined by another feature, photoresist layer 112 is eliminated, according to some embodiments. In some embodiments, spin-on deposition, physical vapor deposition, or other suitable deposition process deposits photoresist layer 112 over substrate 102.
  • Method 200 continues with optional operation 206, in which photoresist layer 112 is patterned and etched. In some embodiments, if the outer boundaries of source and drain features 104 are defined by other features photoresist layer 112 is eliminated. If operation 204 is not used, operation 206 is likewise omitted. In some embodiments, ultraviolet light passing through a mask patterns photoresist layer 112. In some embodiments, thermal energy or other suitable patterning processes are used to pattern photoresist layer 112. In some embodiments, patterned photoresist layer 112 is etched using a wet etching process. In other embodiments, the etching process is a dry etching process, a plasma etching process, a reactive ion etching process, or other suitable etching process. FIG. 3C is a side view diagram of semiconductor device 300 following patterning and etching of photoresist layer 112.
  • In operation 208 of method 200, cap layers 110 are deposited over source and drain features 104. In some embodiments, cap layers 110 are deposited using an epitaxial growth process. In some embodiments, cap layers 110 are deposited by sputtering, atomic layer deposition, or other suitable deposition processes. In some embodiments, deposition continues until cap layers 110 have a thickness ranging from about 5 Angstroms to about 10 Angstroms. FIG. 3D is a side view diagram of semiconductor device 300 following deposition of cap layers 110.
  • Following deposition of cap layers 110, optional photoresist layer 112 is removed. In some embodiments, photoresist layer 112 is removed using plasma ashing. In some embodiments, photoresist layer 112 is removed using etching or other suitable removal processes.
  • In operation 210, a metal layer 114 (FIG. 3E) is deposited over substrate 102. In some embodiments, metal layer 114 is deposited using physical vapor deposition. In some embodiments, metal layer 114 is deposited using chemical vapor deposition, atomic layer deposition, electron beam evaporation, sputtering, or other suitable deposition process. In some embodiments, metal layer 114 comprises nickel, cobalt, titanium, platinum, or other suitable metal material. In some embodiments, the deposition process continues until metal layer 114 has a thickness ranging from about 200 Angstroms to about 400 Angstroms. This range, in some embodiments, is narrower, e.g., from 200 Angstroms to 400 Angstroms. FIG. 3E is a side view diagram of semiconductor device 300 following deposition of metal layer 114.
  • Method 200 continues with operation 212, in which semiconductor device 300 is heated during an annealing process. The annealing process causes metal atoms in metal layer 114 to react with silicon atoms in cap layers 110 and in source and drain features 104 to create the salicide layer. In some embodiments, during the annealing process semiconductor device 300 is heated to a temperature ranging from about 200 C to about 800 C. This range, in some embodiments, is narrower, e.g., from 200 C to 800 C. In some embodiments, the annealing process continues for a duration ranging from about 1 minute to about 10 minutes.
  • In some embodiments, the annealing process tunes the resistivity of the salicide layer. Generally, the higher the annealing temperature and the longer the annealing duration, the lower the resistivity of the resulting salicide layer because of the formation of larger grains in the salicide layer. If the metal of metal layer 114 and the silicon of cap layers 110 react to form different compounds, tailoring the annealing process allows selective formation of a desired salicide compound. For example, when the metal of metal layer 114 is nickel, the desired salicide compound is NiSi, instead of materials with a higher resistivity such as Ni2Si or NiSi2. In order to obtain the highest concentration of NiSi in the salicide layer, the annealing process takes place at a temperature of about 200 C to about 500 C for a duration of about one minute.
  • FIG. 3F is a side view diagram of semiconductor device 300 following the annealing process. The annealing process causes metal layer 114 to react with silicon to form salicide layer 116. In some embodiments, salicide layer 116 has a thickness ranging from about 120 Angstroms to about 300 Angstroms. This range, in some embodiments, is narrower, e.g., from 120 Angstroms to 300 Angstroms. In some embodiments, gate electrode 106 a contains silicon, e.g., polysilicon, and the annealing process causes metal layer 114 to react with silicon atoms of gate electrode 106 a to form a salicide layer over gate stack 106 as well as over source and drain features 104.
  • If the temperature of semiconductor device 300 is lowered below a temperature needed for metal layer 114 to react with silicon, the salicide forming reaction ceases, but unreacted metal remains in metal layer 114. In operation 214, unreacted metal in metal layer 114 is removed. In some embodiments, the unreacted metal is removed using an etching process such as wet etching, dry etching, reactive ion etching, plasma etching, or another suitable etching process. FIG. 3G is a side view diagram of semiconductor device 300 following removal of the unreacted metal.
  • The inclusion of cap layers 110 helps to form salicide layers 116 with sufficient thickness, to prevent the process removing metal layer 114 in operation 214 from also exposing source and drain features 104 through portions of salicide layers 116. In some embodiments where the source and drain features 104 include silicon germanium, the inclusion of cap layers 110 also aids in forming salicide layers 116 having reduced amounts of germanium within the salicide layers. In some embodiments, a germanium concentration within salicide layers 116 is less than about 3% by weight. Using conventional techniques which do not include cap layers 110, a germanium concentration within conventional salicide layers ranges from about 13% by weight to about 17% by weight.
  • Following formation of salicide layers 116, electrical contacts are connected to salicide layers 116 and electrically connected to an interconnect structure to incorporate semiconductor device 300 into a circuit. Including cap layers 110 in the formation of semiconductor device 300 increases production yield over formation processes in which cap layers 110 are omitted.
  • One aspect of this description relates to a method of forming a semiconductor device. The method includes forming a source feature and a drain feature in a substrate. The method further includes forming a gate stack over a first portion of the source feature and a first portion of the drain feature, the gate stack comprising a gate electrode. The method further includes depositing a first cap layer comprising silicon over a second portion of the source feature exposed by the gate stack. The method further includes depositing a second cap layer comprising silicon over a second portion of the drain feature exposed by the gate stack. The method further includes depositing a metal layer over the gate stack, the first cap layer and the second cap layer. The method further includes annealing the semiconductor device until all of the silicon in the first cap layer and the second cap layer reacts with metal from the metal layer, wherein the annealing causes metal from the metal layer to react with silicon in the first cap layer, the second cap layer, the source feature, and the drain feature while leaving at least a portion of the gate electrode free of silicide. Annealing the semiconductor device includes annealing the semiconductor device at a temperature ranging from 450° C. to 800° C. to form a salicide layer having a germanium concentration less than 3% by weight.
  • Another aspect of this description relates to a method of forming a semiconductor device. The method includes forming a source feature and a drain feature in a substrate. The method further includes forming a gate stack over a first portion of the source feature and a first portion of the drain feature, the gate stack comprising a gate electrode. The method further includes depositing, patterning, and etching a photoresist layer over the substrate. The method further includes depositing a first cap layer comprising silicon over a second portion of the source feature exposed by the gate stack and the photoresist layer. The method further includes depositing a second cap layer comprising silicon over a second portion of the drain feature exposed by the gate stack and the photoresist layer. The method further includes removing the photoresist layer. The method further includes depositing a metal layer over the gate stack, the first cap layer and the second cap layer. The method further includes annealing the semiconductor device until all of the silicon in the first cap layer and the second cap layer is consumed by a silicidation reaction, wherein the annealing causes metal from the metal layer to react with silicon in the first cap layer, the second cap layer, the source feature, and the drain feature while leaving at least a portion of the gate electrode free of silicide. Annealing the semiconductor device includes annealing the semiconductor device at a temperature ranging from 450° C. to 800° C. to form a silicide layer having a germanium concentration less than 3% by weight.
  • Still another aspect of this description relates to a semiconductor device. The semiconductor device includes a substrate having a source feature and a drain feature therein configured to enhance charge mobility. The semiconductor device further includes a gate stack over a portion of the source feature and a portion of the drain feature. The semiconductor device further includes a first salicide layer over substantially the entire source feature not covered by the gate stack, wherein the first salicide layer has a germanium concentration less than about 3% by weight. The semiconductor device further includes a second salicide layer over substantially the entire drain feature not covered by the gate stack, wherein the second salicide layer has a germanium concentration less than about 3% by weight.
  • It will be readily seen by one of ordinary skill in the art that the disclosed embodiments fulfill one or more of the advantages set forth above. After reading the foregoing specification, one of ordinary skill will be able to affect various changes, substitutions of equivalents and various other embodiments as broadly disclosed herein. It is therefore intended that the protection granted hereon be limited only by the definition contained in the appended claims and equivalents thereof.

Claims (20)

What is claimed is:
1. A semiconductor device comprising:
a substrate having a source feature and a drain feature therein configured to enhance charge mobility;
a gate stack directly over a portion of the source feature and a portion of the drain feature;
a first salicide layer over substantially the entire source feature exposed by the gate stack, wherein the first salicide layer has a germanium concentration greater than about 0% by weight and less than about 3% by weight; and
a second salicide layer over substantially the entire drain feature exposed by the gate stack, wherein the second salicide layer has a germanium concentration greater than about 0% by weight and less than about 3% by weight.
2. The semiconductor device of claim 1, wherein the first salicide layer and the second salicide layer independently comprise at least one of nickel, cobalt, titanium or platinum.
3. The semiconductor device of claim 1, wherein the first salicide layer and the second salicide layer independently have a thickness ranging from about 120 Angstroms to about 300 Angstroms.
4. The semiconductor device of claim 1, further comprising electrical contacts, wherein each electrical contact of the electrical contact is connected to a corresponding one of the first salicide layer or the second salicide layer.
5. The semiconductor device of claim 1, further comprising a gate salicide layer over a top surface of the gate stack.
6. The semiconductor device of claim 1, wherein the source feature and the drain feature comprise silicon germanium.
7. The semiconductor device of claim 1, wherein the source feature and the drain feature are substantially free of silicon.
8. The semiconductor device of claim 1, wherein the source feature and the drain feature are configured to increase hole mobility.
9. The semiconductor device of claim 1, wherein the gate stack comprises:
a gate electrode; and
spacers adjacent to sidewalls of the gate electrode, wherein the spacers are between the first salicide layer and the gate electrode.
10. A semiconductor device comprising:
a substrate having a source feature and a drain feature therein, wherein each of the source feature and the drain feature comprises a germanium-containing semiconductor material;
a gate stack directly over a portion of the source feature and a portion of the drain feature;
a first salicide layer over substantially the entire source feature exposed by the gate stack, wherein the first salicide layer has a germanium concentration greater than about 0% by weight and less than about 3% by weight;
a second salicide layer over substantially the entire drain feature exposed by the gate stack, wherein the second salicide layer has a germanium concentration greater than about 0% by weight and less than about 3% by weight; and
a gate salicide layer over a top surface of the gate stack.
11. The semiconductor device of claim 10, wherein the source feature and the drain feature comprise silicon germanium.
12. The semiconductor device of claim 10, wherein the gate stack comprises:
a gate dielectric;
a gate electrode over the gate dielectric; and
gate spacers adjacent to sidewalls of the gate electrode and sidewalls of the gate dielectric.
13. The semiconductor device of claim 12, wherein the gate dielectric comprises silicon dioxide, hafnium silicate, zirconium silicate, hafnium dioxide, or zirconium dioxide.
14. The semiconductor device of claim 12, wherein the gate electrode comprises polysilicon.
15. The semiconductor device of claim 12, wherein an entirety of one of the gate spacers is over the source feature.
16. The semiconductor device of claim 12, wherein an entirety of another one of the gate spacers is over the drain feature.
17. A semiconductor device comprising:
a substrate having a source feature and a drain feature therein;
a gate stack directly over a portion of the source feature and a portion of the drain feature;
a first salicide layer over substantially the entire source feature exposed by the gate stack; and
a second salicide layer over substantially the entire drain feature exposed by the gate stack,
wherein bottoms surfaces of the first salicide layer and the second salicide layer are substantially coplanar with a top surface of the substrate.
18. The semiconductor device of claim 17, wherein the first salicide layer has a germanium concentration greater than about 0% by weight and less than about 3% by weight.
19. The semiconductor device of claim 17, wherein the second salicide layer has a germanium concentration greater than about 0% by weight and less than about 3% by weight.
20. The semiconductor device of claim 17, wherein the first salicide layer and the second salicide layer surround a lower portion of the gate stack.
US15/981,665 2012-02-07 2018-05-16 Salicide formation using a cap layer Pending US20180261461A1 (en)

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