US20180256307A1 - Multilayer composite material vias - Google Patents
Multilayer composite material vias Download PDFInfo
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- US20180256307A1 US20180256307A1 US15/979,173 US201815979173A US2018256307A1 US 20180256307 A1 US20180256307 A1 US 20180256307A1 US 201815979173 A US201815979173 A US 201815979173A US 2018256307 A1 US2018256307 A1 US 2018256307A1
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- United States
- Prior art keywords
- metal
- hermetic package
- tungsten
- platinum
- package according
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- 239000011185 multilayer composite material Substances 0.000 title abstract description 7
- 229910052751 metal Inorganic materials 0.000 claims abstract description 37
- 239000002184 metal Substances 0.000 claims abstract description 37
- 239000007943 implant Substances 0.000 claims abstract description 5
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 43
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims description 25
- 239000010410 layer Substances 0.000 claims description 24
- 239000010937 tungsten Substances 0.000 claims description 24
- 229910052721 tungsten Inorganic materials 0.000 claims description 24
- 229910052697 platinum Inorganic materials 0.000 claims description 21
- 239000000919 ceramic Substances 0.000 claims description 15
- 239000000758 substrate Substances 0.000 claims description 15
- 239000011229 interlayer Substances 0.000 claims description 5
- 150000002739 metals Chemical class 0.000 abstract description 7
- 238000004519 manufacturing process Methods 0.000 abstract description 2
- 238000000034 method Methods 0.000 description 6
- 230000008901 benefit Effects 0.000 description 3
- 239000002131 composite material Substances 0.000 description 3
- 238000010304 firing Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 210000001124 body fluid Anatomy 0.000 description 2
- 239000010839 body fluid Substances 0.000 description 2
- 230000003197 catalytic effect Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012805 post-processing Methods 0.000 description 2
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical group [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- HZEWFHLRYVTOIW-UHFFFAOYSA-N [Ti].[Ni] Chemical compound [Ti].[Ni] HZEWFHLRYVTOIW-UHFFFAOYSA-N 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- -1 for example Substances 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 238000007735 ion beam assisted deposition Methods 0.000 description 1
- 229910052741 iridium Inorganic materials 0.000 description 1
- GKOZUEZYRPOHIO-UHFFFAOYSA-N iridium atom Chemical compound [Ir] GKOZUEZYRPOHIO-UHFFFAOYSA-N 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- MGRWKWACZDFZJT-UHFFFAOYSA-N molybdenum tungsten Chemical group [Mo].[W] MGRWKWACZDFZJT-UHFFFAOYSA-N 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 238000004886 process control Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 230000002207 retinal effect Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
Images
Classifications
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61F—FILTERS IMPLANTABLE INTO BLOOD VESSELS; PROSTHESES; DEVICES PROVIDING PATENCY TO, OR PREVENTING COLLAPSING OF, TUBULAR STRUCTURES OF THE BODY, e.g. STENTS; ORTHOPAEDIC, NURSING OR CONTRACEPTIVE DEVICES; FOMENTATION; TREATMENT OR PROTECTION OF EYES OR EARS; BANDAGES, DRESSINGS OR ABSORBENT PADS; FIRST-AID KITS
- A61F2/00—Filters implantable into blood vessels; Prostheses, i.e. artificial substitutes or replacements for parts of the body; Appliances for connecting them with the body; Devices providing patency to, or preventing collapsing of, tubular structures of the body, e.g. stents
- A61F2/0095—Packages or dispensers for prostheses or other implants
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61L—METHODS OR APPARATUS FOR STERILISING MATERIALS OR OBJECTS IN GENERAL; DISINFECTION, STERILISATION OR DEODORISATION OF AIR; CHEMICAL ASPECTS OF BANDAGES, DRESSINGS, ABSORBENT PADS OR SURGICAL ARTICLES; MATERIALS FOR BANDAGES, DRESSINGS, ABSORBENT PADS OR SURGICAL ARTICLES
- A61L27/00—Materials for grafts or prostheses or for coating grafts or prostheses
- A61L27/02—Inorganic materials
- A61L27/04—Metals or alloys
- A61L27/047—Other specific metals or alloys not covered by A61L27/042 - A61L27/045 or A61L27/06
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61L—METHODS OR APPARATUS FOR STERILISING MATERIALS OR OBJECTS IN GENERAL; DISINFECTION, STERILISATION OR DEODORISATION OF AIR; CHEMICAL ASPECTS OF BANDAGES, DRESSINGS, ABSORBENT PADS OR SURGICAL ARTICLES; MATERIALS FOR BANDAGES, DRESSINGS, ABSORBENT PADS OR SURGICAL ARTICLES
- A61L27/00—Materials for grafts or prostheses or for coating grafts or prostheses
- A61L27/50—Materials characterised by their function or physical properties, e.g. injectable or lubricating compositions, shape-memory materials, surface modified materials
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61F—FILTERS IMPLANTABLE INTO BLOOD VESSELS; PROSTHESES; DEVICES PROVIDING PATENCY TO, OR PREVENTING COLLAPSING OF, TUBULAR STRUCTURES OF THE BODY, e.g. STENTS; ORTHOPAEDIC, NURSING OR CONTRACEPTIVE DEVICES; FOMENTATION; TREATMENT OR PROTECTION OF EYES OR EARS; BANDAGES, DRESSINGS OR ABSORBENT PADS; FIRST-AID KITS
- A61F2210/00—Particular material properties of prostheses classified in groups A61F2/00 - A61F2/26 or A61F2/82 or A61F9/00 or A61F11/00 or subgroups thereof
- A61F2210/0076—Particular material properties of prostheses classified in groups A61F2/00 - A61F2/26 or A61F2/82 or A61F9/00 or A61F11/00 or subgroups thereof multilayered, e.g. laminated structures
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61L—METHODS OR APPARATUS FOR STERILISING MATERIALS OR OBJECTS IN GENERAL; DISINFECTION, STERILISATION OR DEODORISATION OF AIR; CHEMICAL ASPECTS OF BANDAGES, DRESSINGS, ABSORBENT PADS OR SURGICAL ARTICLES; MATERIALS FOR BANDAGES, DRESSINGS, ABSORBENT PADS OR SURGICAL ARTICLES
- A61L2430/00—Materials or treatment for tissue regeneration
- A61L2430/16—Materials or treatment for tissue regeneration for reconstruction of eye parts, e.g. intraocular lens, cornea
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24273—Structurally defined web or sheet [e.g., overall dimension, etc.] including aperture
Definitions
- the present disclosure relates to composite via structures. More particularly, it relates to multilayer composite material vias.
- FIG. 1 illustrates a traditional via with one metal.
- FIG. 2 illustrates one embodiment of a via with two metals.
- FIG. 3 illustrates a traditional via with one metal and interlayer circuitry.
- FIG. 4 illustrates one embodiment of a via with two metals and interlayer circuitry.
- FIG. 5 illustrates one embodiment of a hermetic package.
- FIG. 6 illustrates an alternate embodiment where a metal via is protected by a biocompatible cap.
- a multilayer composite material comprising: an insulating substrate having a first surface and a second surface; at least one via defined in the insulating substrate, wherein the at least one via comprises at least one layer of a first metal; and at least one layer of a second metal different from the first metal, and wherein the at least one via forms a continuous path from the first surface to the second surface.
- High Temperature Co-fired Ceramic is a popular material choice for hermetic packaging due to its desirable electrical properties, high mechanical strength and good thermal conductivity. Hermetic packages are airtight, or otherwise impervious to air or other gases.
- the present disclosure describes a multilayer composite material via that unlike traditional multilayer vias is constructed using more than one metal paste system to fill the via layers. Using more than one metal allows the use of different or complementary properties possessed by different metals.
- tungsten is a metal with desirable properties, as it is robust and not as reactive as platinum.
- a composite via structure can take advantage of the robustness of the tungsten system.
- the process for firing the tungsten system is very robust and insensitive to variation normally occurring during said processing.
- the catalytic properties of platinum make the platinum material very sensitive to process variation, particularly in the area of hermetic sealing.
- Tungsten can work very well in terms of hermeticity.
- the tungsten via is also hermetically stable through extreme post processing conditions (e.g. vacuum braze).
- the platinum via is not as stable.
- the platinum via can be much more biocompatible and electrochemically stable, resisting corrosion, which makes it suitable for contact with body fluids.
- the tungsten via readily corrodes in operation when in direct contact with body fluids.
- a composite material construction of the HTCC via takes advantage of the benefits of platinum and tungsten while avoiding their disadvantages.
- the side of the substrate that will face the outside of a hermetic package enclosure towards the body environment would be a platinum-filled via layer.
- the remainder of the via layers towards the hermetic package enclosure side of the substrate would be tungsten-filled via layers.
- the invention may incorporate other metals. Platinum may be replaced with other noble and biocompatible metals such as palladium, iridium, titanium, etc. Tungsten may be replaced with molybdenum or a tungsten-molybdenum mixture.
- the tungsten side makes use of the durability of tungsten, while platinum is used for its stability in a biological environment, such as for example, biological implants in human bodies.
- the vias described in the present disclosure may be fabricated in a variety of ways; for example, through providing a first ceramic sheet; forming holes in the sheet; inserting a conductive thick film paste in the hole; laminating the first ceramic sheet and forming a ceramic substrate with a second and third ceramic sheets attached to the upper and lower surfaces of the first ceramic sheet; firing the laminated ceramic substrate to sinter it and cause the metallic paste to form a metallic via, thereby forming a hermetic seal around the metalized via; and finally removing the second and third ceramic sheets in order to expose the metalized via.
- This method is described, for example, in U.S. Pat. No. 8,555,271, the disclosure of which is incorporated herein by reference in its entirety.
- a traditional via ( 105 ) in a ceramic body ( 106 ) may be made of tungsten and comprise three layers ( 107 , 110 , 115 ).
- a via according to one embodiment of the present disclosure may comprise a layer of platinum ( 205 ), and two layers of tungsten ( 210 ).
- a traditional via may be made, as visible in FIG. 3 , by three layers of tungsten ( 310 ) and interlayer circuitry also made of tungsten ( 305 ).
- a via according to one embodiment of the present disclosure may comprise a layer of platinum ( 410 ), and two layers of tungsten ( 405 ), with interlayer circuitry also made of tungsten ( 415 ).
- a hermetic package may comprise a metal container ( 505 ) and a substrate ( 510 ) through which the vias can be defined.
- the via may comprise one layer of platinum ( 515 ) and two layers of tungsten ( 520 ).
- the substrate ( 510 ) may be brazed to the metal container ( 505 ). Titanium nickel braze is suitable for such a purpose.
- the substrate may be only 0.5 mm in thickness or thinner and remain hermetic.
- the feedthroughs may have a center to center pitch of 0.7 mm or less.
- FIG. 6 shows an alternate embodiment where the ceramic substrate ( 606 ) includes a via ( 605 ) of a first metal, tungsten, for example, and a cap layer ( 608 ) is applied to the body facing side of the ceramic substrate ( 606 ) of a second metal, for example, platinum.
- the cap layer ( 608 ) must be sufficiently dense to seal the tungsten via. This can be accomplished by electroplating platinum, applying platinum by ion beam assisted deposition, or other methods that result in a dense platinum layer.
- the cap layer may also function as a metal trace for redirecting an electrical connection to the via.
- the hermetic package may be used in biological implants; for example, retinal implants which aid vision.
- the vias of the present disclosure comprise at least two metals, so that the metal more compatible with biological environments is on one end of the via, in the biological environment, and the metal more compatible with fabrication, such as High Temperature Co-fired Ceramic and hermetic packages, is on the other end of the via.
Abstract
Description
- This application is a divisional application of U.S. patent application Ser. No. 14/219,194, filed Mar. 19, 2014, for Multilayer Composite Material Vias, which is incorporated herein by reference in its entirety.
- The present disclosure relates to composite via structures. More particularly, it relates to multilayer composite material vias.
- The accompanying drawings, which are incorporated into and constitute a part of this specification, illustrate one or more embodiments of the present disclosure and, together with the description of example embodiments, serve to explain the principles and implementations of the disclosure.
-
FIG. 1 illustrates a traditional via with one metal. -
FIG. 2 illustrates one embodiment of a via with two metals. -
FIG. 3 illustrates a traditional via with one metal and interlayer circuitry. -
FIG. 4 illustrates one embodiment of a via with two metals and interlayer circuitry. -
FIG. 5 illustrates one embodiment of a hermetic package. -
FIG. 6 illustrates an alternate embodiment where a metal via is protected by a biocompatible cap. - In a first aspect of the disclosure, a multilayer composite material is described, the multilayer composite material comprising: an insulating substrate having a first surface and a second surface; at least one via defined in the insulating substrate, wherein the at least one via comprises at least one layer of a first metal; and at least one layer of a second metal different from the first metal, and wherein the at least one via forms a continuous path from the first surface to the second surface.
- High Temperature Co-fired Ceramic (HTCC) is a popular material choice for hermetic packaging due to its desirable electrical properties, high mechanical strength and good thermal conductivity. Hermetic packages are airtight, or otherwise impervious to air or other gases.
- The use of platinum as an HTCC via material makes process control difficult due to the catalytic nature of platinum, particularly in reducing firing atmospheres. Platinum reactivity may result in varying degrees of degradation in an HTCC via. This can lead to problems with hermeticity and electrical resistance through the vias. Loss of hermeticity in post processing (e.g. brazing in a reducing atmosphere) is also a danger.
- The present disclosure describes a multilayer composite material via that unlike traditional multilayer vias is constructed using more than one metal paste system to fill the via layers. Using more than one metal allows the use of different or complementary properties possessed by different metals.
- For example, tungsten is a metal with desirable properties, as it is robust and not as reactive as platinum. A composite via structure can take advantage of the robustness of the tungsten system. The process for firing the tungsten system is very robust and insensitive to variation normally occurring during said processing. On the other hand, the catalytic properties of platinum make the platinum material very sensitive to process variation, particularly in the area of hermetic sealing.
- Tungsten can work very well in terms of hermeticity. The tungsten via is also hermetically stable through extreme post processing conditions (e.g. vacuum braze). The platinum via is not as stable. However, the platinum via can be much more biocompatible and electrochemically stable, resisting corrosion, which makes it suitable for contact with body fluids. The tungsten via readily corrodes in operation when in direct contact with body fluids.
- Therefore, in one embodiment of the present disclosure, a composite material construction of the HTCC via takes advantage of the benefits of platinum and tungsten while avoiding their disadvantages.
- The side of the substrate that will face the outside of a hermetic package enclosure towards the body environment would be a platinum-filled via layer. The remainder of the via layers towards the hermetic package enclosure side of the substrate would be tungsten-filled via layers. The invention may incorporate other metals. Platinum may be replaced with other noble and biocompatible metals such as palladium, iridium, titanium, etc. Tungsten may be replaced with molybdenum or a tungsten-molybdenum mixture.
- In such a way, the tungsten side makes use of the durability of tungsten, while platinum is used for its stability in a biological environment, such as for example, biological implants in human bodies.
- The vias described in the present disclosure may be fabricated in a variety of ways; for example, through providing a first ceramic sheet; forming holes in the sheet; inserting a conductive thick film paste in the hole; laminating the first ceramic sheet and forming a ceramic substrate with a second and third ceramic sheets attached to the upper and lower surfaces of the first ceramic sheet; firing the laminated ceramic substrate to sinter it and cause the metallic paste to form a metallic via, thereby forming a hermetic seal around the metalized via; and finally removing the second and third ceramic sheets in order to expose the metalized via. This method is described, for example, in U.S. Pat. No. 8,555,271, the disclosure of which is incorporated herein by reference in its entirety.
- For example, as visible in
FIG. 1 , a traditional via (105) in a ceramic body (106) may be made of tungsten and comprise three layers (107, 110, 115). - A via according to one embodiment of the present disclosure, as illustrated in
FIG. 2 , may comprise a layer of platinum (205), and two layers of tungsten (210). - According to another example, a traditional via may be made, as visible in
FIG. 3 , by three layers of tungsten (310) and interlayer circuitry also made of tungsten (305). - A via according to one embodiment of the present disclosure, as illustrated in
FIG. 4 , may comprise a layer of platinum (410), and two layers of tungsten (405), with interlayer circuitry also made of tungsten (415). - According to one embodiment of the disclosure, as illustrated in
FIG. 5 , a hermetic package may comprise a metal container (505) and a substrate (510) through which the vias can be defined. The via may comprise one layer of platinum (515) and two layers of tungsten (520). In such a package the substrate (510) may be brazed to the metal container (505). Titanium nickel braze is suitable for such a purpose. The substrate may be only 0.5 mm in thickness or thinner and remain hermetic. The feedthroughs may have a center to center pitch of 0.7 mm or less. -
FIG. 6 shows an alternate embodiment where the ceramic substrate (606) includes a via (605) of a first metal, tungsten, for example, and a cap layer (608) is applied to the body facing side of the ceramic substrate (606) of a second metal, for example, platinum. In this embodiment, the cap layer (608) must be sufficiently dense to seal the tungsten via. This can be accomplished by electroplating platinum, applying platinum by ion beam assisted deposition, or other methods that result in a dense platinum layer. The cap layer may also function as a metal trace for redirecting an electrical connection to the via. - The hermetic package may be used in biological implants; for example, retinal implants which aid vision.
- The vias of the present disclosure comprise at least two metals, so that the metal more compatible with biological environments is on one end of the via, in the biological environment, and the metal more compatible with fabrication, such as High Temperature Co-fired Ceramic and hermetic packages, is on the other end of the via.
- A number of embodiments of the disclosure have been described. Nevertheless, it will be understood that various modifications may be made without departing from the spirit and scope of the present disclosure. Accordingly, other embodiments are within the scope of the following claims.
- The examples set forth above are provided to those of ordinary skill in the art as a complete disclosure and description of how to make and use the embodiments of the disclosure, and are not intended to limit the scope of what the inventor/inventors regard as their disclosure.
- Modifications of the above-described modes for carrying out the methods and systems herein disclosed that are obvious to persons of skill in the art are intended to be within the scope of the following claims. All patents and publications mentioned in the specification are indicative of the levels of skill of those skilled in the art to which the disclosure pertains. All references cited in this disclosure are incorporated by reference to the same extent as if each reference had been incorporated by reference in its entirety individually.
- It is to be understood that the disclosure is not limited to particular methods or systems, which can, of course, vary. It is also to be understood that the terminology used herein is for the purpose of describing particular embodiments only, and is not intended to be limiting. As used in this specification and the appended claims, the singular forms “a,” “an,” and “the” include plural referents unless the content clearly dictates otherwise. The term “plurality” includes two or more referents unless the content clearly dictates otherwise. Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which the disclosure pertains.
Claims (10)
Priority Applications (1)
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US15/979,173 US20180256307A1 (en) | 2014-03-19 | 2018-05-14 | Multilayer composite material vias |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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US14/219,194 US10010396B2 (en) | 2014-03-19 | 2014-03-19 | Multilayer composite materials vias |
US15/979,173 US20180256307A1 (en) | 2014-03-19 | 2018-05-14 | Multilayer composite material vias |
Related Parent Applications (1)
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US14/219,194 Division US10010396B2 (en) | 2014-03-19 | 2014-03-19 | Multilayer composite materials vias |
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US20180256307A1 true US20180256307A1 (en) | 2018-09-13 |
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US14/219,194 Active 2035-03-04 US10010396B2 (en) | 2014-03-19 | 2014-03-19 | Multilayer composite materials vias |
US15/979,173 Abandoned US20180256307A1 (en) | 2014-03-19 | 2018-05-14 | Multilayer composite material vias |
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US14/219,194 Active 2035-03-04 US10010396B2 (en) | 2014-03-19 | 2014-03-19 | Multilayer composite materials vias |
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Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0589813A1 (en) * | 1992-09-23 | 1994-03-30 | International Business Machines Corporation | Multilayer ceramic substrate with graded vias |
US5750926A (en) * | 1995-08-16 | 1998-05-12 | Alfred E. Mann Foundation For Scientific Research | Hermetically sealed electrical feedthrough for use with implantable electronic devices |
US5855995A (en) * | 1997-02-21 | 1999-01-05 | Medtronic, Inc. | Ceramic substrate for implantable medical devices |
US7709961B2 (en) * | 2005-11-02 | 2010-05-04 | Second Sight Medical Products, Inc. | Implantable microelectronic device and method of manufacture |
US20130032382A1 (en) * | 2011-08-02 | 2013-02-07 | Medtronic, Inc. | Hermetic feedthrough |
US20180361164A1 (en) * | 2012-01-16 | 2018-12-20 | Greatbatch Ltd. | Method of manufacturing a feedthrough insulator for an active implantable medical device incorporating a post conductive paste filled pressing step |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4573481A (en) | 1984-06-25 | 1986-03-04 | Huntington Institute Of Applied Research | Implantable electrode array |
US4628933A (en) | 1985-07-23 | 1986-12-16 | Michelson Robin P | Method and apparatus for visual prosthesis |
US4837049A (en) | 1986-06-17 | 1989-06-06 | Alfred E. Mann Foundation For Scientific Research | Method of making an electrode array |
US5215088A (en) | 1989-11-07 | 1993-06-01 | The University Of Utah | Three-dimensional electrode device |
US5109844A (en) | 1990-10-11 | 1992-05-05 | Duke University | Retinal microstimulation |
DE19707046A1 (en) | 1997-02-21 | 1998-08-27 | Rolf Prof Dr Ing Eckmiller | Learnable "Active Vision" implant encoder |
US6458157B1 (en) | 1997-08-04 | 2002-10-01 | Suaning Gregg Joergen | Retinal stimulator |
US5935155A (en) | 1998-03-13 | 1999-08-10 | John Hopkins University, School Of Medicine | Visual prosthesis and method of using same |
AU2003268068A1 (en) * | 2002-08-09 | 2004-02-25 | Second Sight Medical Products, Inc | Insulated implantable electrical circuit |
US7150569B2 (en) * | 2003-02-24 | 2006-12-19 | Nor Spark Plug Co., Ltd. | Optical device mounted substrate assembly |
US20080290494A1 (en) * | 2007-05-21 | 2008-11-27 | Markus Lutz | Backside release and/or encapsulation of microelectromechanical structures and method of manufacturing same |
-
2014
- 2014-03-19 US US14/219,194 patent/US10010396B2/en active Active
-
2018
- 2018-05-14 US US15/979,173 patent/US20180256307A1/en not_active Abandoned
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0589813A1 (en) * | 1992-09-23 | 1994-03-30 | International Business Machines Corporation | Multilayer ceramic substrate with graded vias |
US5750926A (en) * | 1995-08-16 | 1998-05-12 | Alfred E. Mann Foundation For Scientific Research | Hermetically sealed electrical feedthrough for use with implantable electronic devices |
US5855995A (en) * | 1997-02-21 | 1999-01-05 | Medtronic, Inc. | Ceramic substrate for implantable medical devices |
US7709961B2 (en) * | 2005-11-02 | 2010-05-04 | Second Sight Medical Products, Inc. | Implantable microelectronic device and method of manufacture |
US20130032382A1 (en) * | 2011-08-02 | 2013-02-07 | Medtronic, Inc. | Hermetic feedthrough |
US20180361164A1 (en) * | 2012-01-16 | 2018-12-20 | Greatbatch Ltd. | Method of manufacturing a feedthrough insulator for an active implantable medical device incorporating a post conductive paste filled pressing step |
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Publication number | Publication date |
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US10010396B2 (en) | 2018-07-03 |
US20150265396A1 (en) | 2015-09-24 |
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