US20180191131A1 - Heat-dissipating semiconductor assembly - Google Patents
Heat-dissipating semiconductor assembly Download PDFInfo
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- US20180191131A1 US20180191131A1 US15/670,624 US201715670624A US2018191131A1 US 20180191131 A1 US20180191131 A1 US 20180191131A1 US 201715670624 A US201715670624 A US 201715670624A US 2018191131 A1 US2018191131 A1 US 2018191131A1
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- Prior art keywords
- heat
- laser diode
- emitting laser
- edge emitting
- dissipating
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/024—Arrangements for thermal management
- H01S5/02469—Passive cooling, e.g. where heat is removed by the housing as a whole or by a heat pipe without any active cooling element like a TEC
-
- H01S5/02236—
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/023—Mount members, e.g. sub-mount members
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0233—Mounting configuration of laser chips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0235—Method for mounting laser chips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0235—Method for mounting laser chips
- H01S5/02355—Fixing laser chips on mounts
- H01S5/0237—Fixing laser chips on mounts by soldering
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0233—Mounting configuration of laser chips
- H01S5/0234—Up-side down mountings, e.g. Flip-chip, epi-side down mountings or junction down mountings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/024—Arrangements for thermal management
- H01S5/02476—Heat spreaders, i.e. improving heat flow between laser chip and heat dissipating elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/20—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers
- H01S5/22—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
- H01S5/4025—Array arrangements, e.g. constituted by discrete laser diodes or laser bar
- H01S5/4031—Edge-emitting structures
Definitions
- a traditional laser diode is metallically wired and packaged with a heat-dissipating substrate.
- Metal has good thermal conductivity, so thermal conduction to the heat-dissipating substrate can be achieved through the metal wire.
- the contacting area between the metal wire and the electrodes of the laser diode is too small and the distance from the light-emitting area of the laser diode to the heat-dissipating substrate is too far to provide timely heat dissipation, thus not able to ensure the device's performance and service life. Therefore, the inventor of the present invention has paid effort to devise a heat-dissipating semiconductor assembly that effectively addresses the problem related to inferior heat dissipation of laser diodes.
- the width of the groove is wider than the width of the ridge of the edge emitting laser diode.
Abstract
The invention provides a heat-dissipating semiconductor assembly, comprising: a heat-dissipating substrate, a metal solder layer, and an edge emitting laser diode. The heat-dissipating substrate has one side formed with a flat surface for mounting the edge emitting laser diode. The edge emitting laser diode is mounted on the metal solder layer, and by lowering the active area of the edge emitting laser diode, the active area of the edge emitting laser diode is drawn close to one side of the heat-dissipating substrate. The edge emitting laser diode has an optical output direction parallel to the flat surface of the heat-dissipating substrate, and the heat-dissipating substrate and/or the metal solder layer have a groove. The ridge of the edge emitting laser diode is aligned with an opening formed in the groove of the heat-dissipating substrate, thereby preventing the heat-dissipating substrate and metal solder layer from contacting the ridge of the edge emitting laser diode.
Description
- The present invention relates a heat-dissipating semiconductor assembly, more particularly to a heat-dissipating substrate with the groove form for high power semiconductor assembly.
- As optical communication devices become more performative, they have been developed to be more compact, more capable, and maturer in terms of power, data transfer rate, thermal stability as well as voltage endurance. Laser diodes represent one of the most extensively used segments. When operating, a laser diode unavoidably generates a great quantity of heat. If the heat is not released timely, the junction of the laser diode can become hot and this can jeopardize the device's performance and service life, in turn blighting the device's reliability. Hence, for ensuring reliability, it is necessary to improve the device's heat dissipation.
- In the field of optical communication, heat dissipation for laser diodes have long been an issue of top priority for the academic and industrial researchers to work on. A traditional laser diode is metallically wired and packaged with a heat-dissipating substrate. Metal has good thermal conductivity, so thermal conduction to the heat-dissipating substrate can be achieved through the metal wire. However, the contacting area between the metal wire and the electrodes of the laser diode is too small and the distance from the light-emitting area of the laser diode to the heat-dissipating substrate is too far to provide timely heat dissipation, thus not able to ensure the device's performance and service life. Therefore, the inventor of the present invention has paid effort to devise a heat-dissipating semiconductor assembly that effectively addresses the problem related to inferior heat dissipation of laser diodes.
- The objective of the present invention is to solve the problem related to inferior heat dissipation, and in turn low optical output power and short service life of laser diodes as seen in the prior art.
- To solve above problems, the present invention provides a heat-dissipating semiconductor assembly, comprising: a heat-dissipating substrate and an edge emitting laser diode mounted on the heat-dissipating substrate. The heat-dissipating substrate has one side formed with a flat surface. The edge emitting laser diode includes an active area and a rigid deposited on one side of a light-emitting area of the active area. The edge emitting laser diode is mounted on the heat-dissipating substrate, and by lowering the active area of the edge emitting laser diode, the active area of the edge emitting laser diode is drawn closer to one side of the heat-dissipating substrate, in which the edge emitting laser diode has an optical output direction parallel to the flat surface of the heat-substrate, and the heat-dissipating substrate has a groove so that the ridge of the edge emitting laser diode is aligned with an opening of the groove of the heat-dissipating substrate, thereby preventing the heat-dissipating substrate from contacting the ridge of the edge emitting laser diode.
- Further, the heat-dissipating semiconductor assembly further comprises a metal solder layer deposited on the heat-dissipating substrate and located at two sides of the groove for holding the edge emitting laser diode in position.
- Further, the distance from the active area to the contacting surface between the edge emitting laser diode and the metal solder is 2 μm to 14 μm.
- Further, the metal solder layer is made of a material containing gold-tin alloy.
- Further, the heat-dissipating substrate is a ceramic board.
- Further, the heat-dissipating substrate is made of a material containing aluminum nitride (AlN), silicon carbide (SiC), or aluminum oxide (Al2O3).
- Further, the width of the groove is wider than the width of the ridge of the edge emitting laser diode.
- Further, the groove extends across the flat surface of the heat-dissipating substrate from one side to the opposite side.
- Another object of the present invention is to provide a heat-dissipating semiconductor assembly, comprising: a heat-dissipating substrate, a metal solder layer deposited on the heat-dissipating substrate, and an edge emitting laser diode deposited on the metal solder layer. The heat-dissipating substrate has one side formed with a flat surface. The metal solder layer is deposited on the flat surface of the heat-dissipating substrate and having a groove. The edge emitting laser diode includes an active area and a rigid deposited on one side of a light-emitting area of the active area. The edge emitting laser diode is mounted on the metal solder layer, and by lowering the active area of the edge emitting laser diode, the active area of the edge emitting laser diode is drawn closer to one side of the heat-dissipating substrate. The edge emitting laser diode has an optical output direction parallel to the flat surface of the heat-dissipating substrate, and the rigid of the edge emitting laser diode is aligned with an opening formed in the groove of the metal solder layer, thereby preventing the metal solder layer from contacting the rigid of the edge emitting laser diode.
- Further, the distance from the active area to the contact surface between the edge emitting laser diode and the metal solder layer is 2 μm to 14 μm.
- Further, the metal solder layer is made of a material containing gold-tin alloy.
- Further, the heat-dissipating substrate is a ceramic board.
- Further, the heat-dissipating substrate is made of a material containing aluminum nitride (AlN), silicon carbide (SiC), or aluminum oxide (Al2O3).
- Further, the width of the groove is wider than the width of the rigid of the edge emitting laser diode.
- Therefore, comparing to the prior art, the present invention has advantages described as below:
- 1. The disclosed heat-dissipating semiconductor assembly has the edge emitting laser diode deposited on the metal solder layer and has the active area of the edge emitting laser diode close to the heat-dissipating substrate by lowering the active area of the edge emitting laser diode, thereby shortening the heat conducting path of the edge emitting laser diode, and effectively conducting the heat generated by the edge emitting laser diode to the heat-dissipating substrate in the shortened heat conducting path.
- 2. The disclosed heat-dissipating semiconductor assembly has the groove formed on the heat-dissipating substrate, and has the ridge of the edge emitting laser diode aligned with the opening of the groove, thereby preventing the heat-dissipating substrate from damaging the ridge of the edge emitting laser diode and in turn ruining its light-emitting quality.
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FIG. 1 shows a perspective schematic view of the first embodiment of the present invention. -
FIG. 2 shows a cross-sectional schematic view of the first embodiment of the present invention. -
FIG. 3 shows a perspective schematic view of the second embodiment of the present invention. -
FIG. 4 shows a sectional schematic view of the second embodiment of the present invention. - Descriptions and techniques of the present invention would be illustrated in detail with reference to the accompanying drawings herein. Furthermore, for easier illustrating, the drawings of the present invention are not a certainly the practical proportion and are not limited to the scope of the present invention.
- Please first refer to
FIG. 1 for a perspective schematic view of the first embodiment of the present invention. - The present embodiment provides a heat-dissipating semiconductor assembly. The heat-dissipating
semiconductor assembly 100 primarily comprises a heat-dissipating substrate 10 and an edgeemitting laser diode 20. The heat-dissipating substrate 10 has its one side formed with aflat surface 11, ametal solder layer 30, and agroove 12 formed on theflat surface 11. The heat-dissipatingsubstrate 10 can be a ceramic board that features high thermal conductivity, low thermal resistance, long service life, and good thermal endurance. With high thermal conductivity and good thermal endurance, the ceramic board can effectively transfer heat for heat dissipation. Particularly, the heat-dissipating substrate 10 can be made of a ceramic material containing aluminum nitride (AlN), silicon carbide (SiC), or aluminum oxide (Al2O3) or a composite material composed of the foregoing materials, and the present invention places no limitation thereon. In one preferred embodiment, the heat-dissipating substrate is preferably made of a material based on aluminum nitride (AlN). With high thermal conductivity and low coefficient of thermal expansion (CTE), aluminum nitride is effective in preventing offset beam of the edgeemitting laser diode 20 that would otherwise be caused by thermal expansion or contract of the heat-dissipatingsubstrate 10 made of other materials under thermal variation. - Please refer to
FIG. 2 for a cross-sectional schematic view of the first embodiment of the present invention. - The edge
emitting laser diode 20 comprises anactive area 22 and aridge 21 deposited on one side of a light-emittingarea 23 of theactive area 22. Particularly, theridge 21 can be a P-type semiconductor, and theactive area 22 is an area of the P-N junction. An electrode layer (not shown in drawing) is optionally formed on the bottom side of theridge 21 to cover the outside of theridge 21. The electrode layer can extend in both sides to the upper side of themetal solder layer 30. The edge emittinglaser diode 20 is mounted on the heat-dissipatingsubstrate 10. By lowering theactive area 22 of the edge emittinglaser diode 20, theactive area 22 of the edge emittinglaser diode 20 is drawn closer to one side of the heat-dissipatingsubstrate 10. The edge emittinglaser diode 20 has its optical output direction parallel to theflat surface 11 of the heat-dissipatingsubstrate 10. The heat-dissipatingsubstrate 10 is also provided with agroove 12. Theridge 21 of the edge emittinglaser diode 20 is aligned with an opening of thegroove 12 on the heat-dissipatingsubstrate 10. Themetal solder layer 30 is formed at two sides of thegroove 12 for holding the edge emittinglaser diode 20 in position, thereby preventing the heat-dissipatingsubstrate 10 and themetal solder layer 30 from contacting theridge 21 of the edge emittinglaser diode 20. While theridge 21 in the drawing is depicted as a block, theridge 21 can be one jutting out of, recessed from, or flush with the bottom side of the laser semiconductor, according to the type of the laser semiconductor. The present invention places no limitation on the way theridge 21 is realized. Particularly, the edge emittinglaser diode 20 can be a ridge-type laser diode, a planar buried laser diode, a stripe buried laser diode, or other laser diodes having a ridge structure. The present invention places no limitation thereon. - The
groove 12 on the heat-dissipatingsubstrate 10 is wider than theridge 21 of the edge emittinglaser diode 20. Particularly, the minimum width of thegroove 12 of the heat-dissipatingsubstrate 10 is about 1˜2 μm greater than the width of theridge 21 of the edge emittinglaser diode 20, wherein a proper margin has to be maintained lest theridge 21 should be damaged. In one preferred embodiment, thegroove 12 extends across theflat surface 11 of the heat-dissipatingsubstrate 10 from one side to the opposite side, thereby facilitating visual alignment of theridge 21 of the edge emittinglaser diode 20 during installation of the edge emittinglaser diode 20. In another preferred embodiment, thegroove 12 also can merely formed at the lower side of the edge emittinglaser diode 20 and extends to the opposite surface of the heat-dissipatingsubstrate 10. Alternatively, thegroove 12 is formed by assembling two substrates with a proper distance therebetween. The present invention places no limitation thereon. - In a preferred embodiment, the
metal solder layer 30 is made of a material containing gold-tin alloy, and is located at two sides of thegroove 12, so as to fixedly attach the edge emittinglaser diode 20 to the heat-dissipatingsubstrate 10. In other preferred embodiments, themetal solder layer 30 also can be made of, for example, pure tin, gold-tin alloy or other metal materials or alloy materials containing other metal materials, and the present invention places no limitation thereon. - By lowering the
active area 22, the edge emittinglaser diode 20 has theactive area 22 very close to theflat surface 11 of the heat-dissipatingsubstrate 10. In a preferred embodiment, the distance from theactive area 22 to the contacting surface between the edge emittinglaser diode 20 and themetal solder layer 30 can be 2 μm to 14 μm, so that the heat generated by theactive area 22 is directly conducted to theflat surface 11 of the heat-dissipatingsubstrate 10 through themetal solder layer 30, thereby reaching an effect for shortening the heat conducting path. - The disclosed heat-dissipating semiconductor assembly can be embodied in more ways different from that described in the foregoing embodiment. The second embodiment of the present invention is illustrated as below, and please refers to
FIG. 3 , which is a perspective schematic view of the second embodiment of the present invention. - The present embodiment is different from the first embodiment on the heat-dissipating structure, and all the similarities will not be discussed any further hereinafter.
- The present embodiment provides a heat-dissipating semiconductor assembly. The heat-dissipating
semiconductor assembly 200 primarily comprises a heat-dissipatingsubstrate 40, an edge emittinglaser diode 50, and ametal solder layer 60. The heat-dissipatingsubstrate 40 has its one side formed with aflat surface 41. Themetal solder layer 60 is deposited on theflat surface 41 of the heat-dissipatingsubstrate 40, and themetal solder layer 60 has agroove 61. - The heat-dissipating
substrate 40 can be a ceramic board that features high thermal conductivity, low thermal resistance, long service life, and good thermal endurance. With high thermal conductivity and good thermal endurance, the ceramic board can effectively conduct heat for heat dissipation. - Particularly, the heat-dissipating
substrate 40 preferably can be made of a ceramic material containing aluminum nitride (AlN), silicon carbide (SiC), or aluminum oxide (Al2O3) or a composite material composed of the foregoing materials, and the present invention places no limitation thereon. In one preferred embodiment, the heat-dissipating substrate is preferably made of a material based on aluminum nitride (AlN). With high thermal conductivity and low coefficient of thermal expansion, aluminum nitride is effective in preventing offset beam of the edge emittinglaser diode 50 that would otherwise be caused by thermal expansion or contract of the heat-dissipatingsubstrate 40 made of other materials under thermal variation. - In a preferred embodiment, the
metal solder layer 60 is made of a material containing gold-tin alloy. Themetal solder layer 60 is provided with agroove 61 for giving place to theridge 51 of the edge emittinglaser diode 50. Themetal solder layer 60 can also made of, for example, pure tin (Sn), gold-tin alloy or other metal materials or alloy materials containing other metal materials, and the present invention places no limitation thereon. - Please refer to
FIG. 4 for a cross-sectional view of the second embodiment of the present invention. - The edge emitting
laser diode 50 comprises anactive area 52 and aridge 51 deposited on one side of a light-emittingarea 53 of theactive area 52. Particularly, theridge 51 can be a P-type semiconductor, and theactive area 52 can be an area between P and N, which depends on the type of the edge emittinglaser diode 50 used. An electrode layer (not shown in drawing) is optionally formed on the bottom side of theridge 51 to cover the outside of theridge 51. The electrode layer can extend in both sides to the upper side of themetal solder layer 60. The edge emittinglaser diode 50 is mounted on themetal solder layer 60. By lowering theactive area 52 of the edge emittinglaser diode 50, theactive area 52 of the edge emittinglaser diode 50 is drawn closer to one side of the heat-dissipatingsubstrate 40. The edge emittinglaser diode 50 has its optical output direction parallel to theflat surface 41 of the heat-dissipatingsubstrate 40. Themetal solder layer 60 is also provided with agroove 61. Theridge 51 of the edge emittinglaser diode 50 is aligned with an opening of thegroove 61 on themetal solder layer 60, thereby preventing themetal solder layer 60 from contacting theridge 51 of the edge emittinglaser diode 50. While theridge 51 in the drawing is depicted as a block, theridge 51 can be one jutting out of, recessed from, or flush with the bottom side of the laser semiconductor, according to the type of the laser semiconductor. The present invention places no limitation on the way theridge 51 is realized. Particularly, the edge emittinglaser diode 50 can be a ridge-type laser diode, a planar buried laser diode, a stripe buried laser diode, or other laser diodes having a ridge structure. The present invention places no limitation thereon. - The
groove 61 on themetal solder layer 60 is wider than theridge 51 of the edge emittinglaser diode 50. Particularly, the minimum width of thegroove 61 of themetal solder layer 60 is about 1˜2 μm greater than the width of theridge 51 of the edge emittinglaser diode 50, wherein a proper margin has to be maintained lest theridge 51 should be damaged. - By lowering the
active area 52, the edge emittinglaser diode 50 has theactive area 52 very close to themetal solder layer 60. In a preferred embodiment, the distance from theactive area 52 to the contacting surface between the edge emittinglaser diode 50 and themetal solder layer 60 can be 2 μm to 14 μm, so that the heat generated by theactive area 52 is directly conducted to theflat surface 41 of the heat-dissipatingsubstrate 40 through themetal solder layer 60, thereby reaching an effect for shortening the heat conducting path. - As mentioned above, the disclosed heat-dissipating semiconductor assembly has the edge emitting laser diode deposited on the metal solder layer and has the active area of the edge emitting laser diode close to the heat-dissipating substrate by lowering the active area of the edge emitting laser diode, thereby shortening the heat conducting path of the edge emitting laser diode, and effectively conducting the heat generated by the edge emitting laser diode to the heat-dissipating substrate in the shortened heat conducting path. Moreover, the disclosed heat-dissipating semiconductor assembly has the groove formed on the heat-dissipating substrate, and has the ridge of the edge emitting laser diode aligned with the opening of the groove, thereby preventing the heat-dissipating substrate from damaging the ridge of the edge emitting laser diode and in turn ruining its light-emitting quality.
- The present invention is more detailed illustrated by the above preferable example embodiments. While example embodiments have been disclosed herein, it should be understood that other variations may be possible. Such variations are not to be regarded as a departure from the spirit and scope of example embodiments of the present application, and all such modifications as would be obvious to one skilled in the art are intended to be included within the scope of the following claims.
Claims (14)
1. A heat-dissipating semiconductor assembly, comprising:
a heat-dissipating substrate, having one side formed with a flat surface; and
an edge emitting laser diode, including an active area and a ridge deposited on one side of a light-emitting area of the active area, wherein the edge emitting laser diode is mounted on the heat-dissipating substrate, and by lowering the active area of the edge emitting laser diode, the active area of the edge emitting laser diode is drawn closer to one side of the heat-dissipating substrate, in which the edge emitting laser diode has an optical output direction parallel to the flat surface of the heat-dissipating substrate, and the heat-dissipating substrate has a groove so that the ridge of the edge emitting laser diode is aligned with an opening of the groove of the heat-dissipating substrate, thereby preventing the heat-dissipating substrate from contacting the ridge of the edge emitting laser diode.
2. The heat-dissipating semiconductor assembly of claim 1 , further comprising a metal solder layer deposited on the heat-dissipating substrate and located at two sides of the groove for holding the edge emitting laser diode in position.
3. The heat-dissipating semiconductor assembly of claim 2 , wherein the distance from the active area to the contacting surface between the edge emitting laser diode and the metal solder layer is 2 μm to 14 μm.
4. The heat-dissipating semiconductor assembly of claim 3 , wherein the metal solder layer is made of a material containing gold-tin alloy.
5. The heat-dissipating semiconductor assembly of claim 3 , wherein the heat-dissipating substrate is a ceramic board.
6. The heat-dissipating semiconductor assembly of claim 5 , wherein the heat-dissipating substrate is made of a material containing aluminum nitride (AlN), silicon carbide (SiC), or aluminum oxide (Al2O3).
7. The heat-dissipating semiconductor assembly of claim 3 , wherein the width of the groove is wider than the width of the ridge of the edge emitting laser diode.
8. The heat-dissipating semiconductor assembly of claim 2 , wherein the groove extends across the flat surface of the heat-dissipating substrate from one side to the opposite side.
9. A heat-dissipating semiconductor assembly, comprising:
a heat-dissipating substrate, having one side formed with a flat surface;
a metal solder layer, being deposited on the flat surface of the heat-dissipating substrate and having a groove; and
an edge emitting laser diode, including an active area and a ridge deposited on one side of a light-emitting area of the active area, wherein the edge emitting laser diode is mounted on the metal solder layer, and by lowering the active area of the edge emitting laser diode, the active area of the edge emitting laser diode is drawn close to one side of the heat-dissipating substrate, in which the edge emitting laser diode has an optical output direction parallel to the flat surface of the heat-dissipating substrate, and the ridge of the edge emitting laser diode is aligned with an opening formed in the groove of the metal solder layer, thereby preventing the metal solder layer from contacting the ridge of the edge emitting laser diode.
10. The heat-dissipating semiconductor assembly of claim 9 , wherein the distance from the active area to the contacting surface between the edge emitting laser diode and the metal solder layer is 2 μm to 14 μm.
11. The heat-dissipating semiconductor assembly of claim 10 , wherein the metal solder layer is made of a material containing gold-tin alloy.
12. The heat-dissipating semiconductor assembly of claim 10 , wherein the heat-dissipating substrate is a ceramic board.
13. The heat-dissipating semiconductor assembly of claim 12 , wherein the heat-dissipating substrate is made of a material containing aluminum nitride (AlN), silicon carbide (SiC), or aluminum oxide (Al2O3).
14. The heat-dissipating semiconductor assembly of claim 10 , wherein the width of the groove is wider than the width of the ridge of the edge emitting laser diode.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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TW105220104 | 2016-12-30 | ||
TW105220104U TWM542857U (en) | 2016-12-30 | 2016-12-30 | Combination of semiconductor and grooved heat dissipation substrate |
Publications (1)
Publication Number | Publication Date |
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US20180191131A1 true US20180191131A1 (en) | 2018-07-05 |
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ID=59689842
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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US15/670,624 Abandoned US20180191131A1 (en) | 2016-12-30 | 2017-08-07 | Heat-dissipating semiconductor assembly |
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US (1) | US20180191131A1 (en) |
CN (1) | CN206697748U (en) |
TW (1) | TWM542857U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10903618B2 (en) * | 2019-03-20 | 2021-01-26 | Chroma Ate Inc. | Fixture assembly for testing edge-emitting laser diodes and testing apparatus having the same |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
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TWI674375B (en) * | 2019-03-15 | 2019-10-11 | 聯鈞光電股份有限公司 | Light emitting device and manufacturing method thereof |
-
2016
- 2016-12-30 TW TW105220104U patent/TWM542857U/en not_active IP Right Cessation
-
2017
- 2017-02-16 CN CN201720139245.1U patent/CN206697748U/en active Active
- 2017-08-07 US US15/670,624 patent/US20180191131A1/en not_active Abandoned
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10903618B2 (en) * | 2019-03-20 | 2021-01-26 | Chroma Ate Inc. | Fixture assembly for testing edge-emitting laser diodes and testing apparatus having the same |
Also Published As
Publication number | Publication date |
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TWM542857U (en) | 2017-06-01 |
CN206697748U (en) | 2017-12-01 |
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