US20180033968A1 - Organic light-emitting display apparatus and method of manufacturing the same - Google Patents
Organic light-emitting display apparatus and method of manufacturing the same Download PDFInfo
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- US20180033968A1 US20180033968A1 US15/657,439 US201715657439A US2018033968A1 US 20180033968 A1 US20180033968 A1 US 20180033968A1 US 201715657439 A US201715657439 A US 201715657439A US 2018033968 A1 US2018033968 A1 US 2018033968A1
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Images
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- H01L51/0016—
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- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/1201—Manufacture or treatment
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- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/10—OLEDs or polymer light-emitting diodes [PLED]
- H10K50/11—OLEDs or polymer light-emitting diodes [PLED] characterised by the electroluminescent [EL] layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/10—OLEDs or polymer light-emitting diodes [PLED]
- H10K50/14—Carrier transporting layers
- H10K50/15—Hole transporting layers
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/10—OLEDs or polymer light-emitting diodes [PLED]
- H10K50/14—Carrier transporting layers
- H10K50/16—Electron transporting layers
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/10—OLEDs or polymer light-emitting diodes [PLED]
- H10K50/17—Carrier injection layers
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/10—OLEDs or polymer light-emitting diodes [PLED]
- H10K50/17—Carrier injection layers
- H10K50/171—Electron injection layers
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/805—Electrodes
- H10K50/81—Anodes
- H10K50/818—Reflective anodes, e.g. ITO combined with thick metallic layers
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/805—Electrodes
- H10K50/82—Cathodes
- H10K50/824—Cathodes combined with auxiliary electrodes
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/121—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/122—Pixel-defining structures or layers, e.g. banks
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- H—ELECTRICITY
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- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/805—Electrodes
- H10K59/8051—Anodes
- H10K59/80518—Reflective anodes, e.g. ITO combined with thick metallic layers
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- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/805—Electrodes
- H10K59/8052—Cathodes
- H10K59/80522—Cathodes combined with auxiliary electrodes
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- H—ELECTRICITY
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- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
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- H—ELECTRICITY
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- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
- H10K71/164—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using vacuum deposition
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- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
- H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask
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- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/20—Changing the shape of the active layer in the devices, e.g. patterning
- H10K71/221—Changing the shape of the active layer in the devices, e.g. patterning by lift-off techniques
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/20—Changing the shape of the active layer in the devices, e.g. patterning
- H10K71/231—Changing the shape of the active layer in the devices, e.g. patterning by etching of existing layers
- H10K71/233—Changing the shape of the active layer in the devices, e.g. patterning by etching of existing layers by photolithographic etching
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- H01L2251/301—
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- H01L2251/5315—
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K2102/00—Constructional details relating to the organic devices covered by this subclass
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K2102/00—Constructional details relating to the organic devices covered by this subclass
- H10K2102/301—Details of OLEDs
- H10K2102/302—Details of OLEDs of OLED structures
- H10K2102/3023—Direction of light emission
- H10K2102/3026—Top emission
Definitions
- Embodiments relate to an organic light-emitting display apparatus and a method of manufacturing the same.
- An organic light-emitting display apparatus may be structured as a self-emitting display apparatus that includes an organic emission layer formed between electrodes.
- the organic light-emitting display may be driven to emit light when holes injected from one of the electrodes and electrons injected from another of the electrodes recombine in the organic emission layer.
- the organic light-emitting display apparatus may have advantages such as low power consumption, high luminance, and fast response.
- Embodiments are directed to an organic light-emitting display apparatus, including a substrate; lower electrodes, the lower electrodes being on the substrate and spaced apart from one another; a pixel-defining film, the pixel-defining film having portions that cover ends of the lower electrodes; upper electrodes, an upper electrode corresponding to each lower electrode, each upper electrode including a first portion contacting the corresponding lower electrode and a second portion contacting the pixel-defining film; organic functional layers, each including an emission layer, an organic functional layer corresponding to each upper electrode and disposed thereon; and an electrode on the organic functional layers.
- the upper electrodes may include a material with a reducibility that is higher than a reducibility of a material of the lower electrodes.
- the lower electrodes may not include silver (Ag).
- the upper electrodes may include silver (Ag).
- the organic functional layers may each further include at least one functional layer from among a hole injection layer, a hole transport layer, an electron transport layer, and an electron injection layer.
- the electrode on the organic functional layers may be integrated across a plurality of the organic functional layers.
- the organic light-emitting display apparatus may further include auxiliary electrodes.
- An auxiliary electrode may correspond to each organic functional layer and disposed thereon, and the auxiliary electrodes may be spaced apart from one another.
- the first upper electrodes may be respectively on inclined surfaces of the portions of the pixel-defining film that cover the ends of the first lower electrodes.
- Embodiments are also directed to a method of manufacturing an organic light-emitting display apparatus, the method including forming lower electrodes on a substrate, the lower electrodes being spaced apart from one another; forming a pixel-defining film, the pixel-defining film having portions that cover ends of the lower electrodes; forming a first lift-off layer on the lower electrodes and the pixel-defining film; forming a first region corresponding to a first one of the lower electrodes, the first region being formed by removing a first portion of the first lift-off layer; sequentially forming, in the first region, a first upper electrode and a first organic functional layer that includes a first emission layer; removing a second portion of the first lift-off layer using a first solvent; forming a second lift-off layer on the substrate, the second lift-off layer covering the first organic functional layer and the lower electrodes; forming a second region corresponding to a second one of the lower electrodes, the second region being formed by removing a first portion of the second lift-off layer
- Each of the first and second lift-off layers may include a fluoropolymer.
- Each of the first and second lift-off layers may further include a light-sensitive material.
- the method may further include forming a first photoresist on the first lift-off layer; and forming a second photoresist on the second lift-off layer.
- the first photoresist may be patterned where the first region is, as the first portion of the first lift-off layer is removed, the first lift-off layer may be formed with an undercut profile in the first region, the second photoresist may be patterned where the second region is, and, as the second portion of the second lift-off layer is removed, the second lift-off layer may be formed with an undercut profile.
- Each of the first solvent and the second solvent may include fluorine.
- the first upper electrode and the first organic functional layer may be formed using a deposition process.
- the second upper electrode and the second organic functional layer may be formed using a deposition process.
- the first upper electrode may be formed of a material with a reducibility higher than a reducibility of the corresponding lower electrode.
- the lower electrodes may not include silver (Ag).
- the upper electrodes may include silver (Ag).
- the method may further include, before the forming of the second electrode, forming a first auxiliary electrode on the first organic functional layer and forming a second auxiliary electrode on the second organic functional layer, the first and second auxiliary electrodes being spaced apart from each other.
- FIG. 1 illustrates a cross-sectional view of an organic light-emitting display apparatus according to an embodiment
- FIG. 2 illustrates a cross-sectional view for explaining an operation of forming a plurality of anodes on a substrate of the organic light-emitting display apparatus of FIG. 1 ;
- FIG. 3 illustrates a cross-sectional view for explaining an operation of forming a pixel-defining film in the organic light-emitting display apparatus of FIG. 1 ;
- FIGS. 4A through 4G illustrate cross-sectional views for explaining a first process of the organic light-emitting display apparatus of FIG. 1 ;
- FIGS. 5A through 5G illustrate cross-sectional views for explaining a second process of the organic light-emitting display apparatus of FIG. 1 ;
- FIGS. 6A through 6G illustrate cross-sectional views for explaining a third process of the organic light-emitting display apparatus of FIG. 1 ;
- FIGS. 7A through 7D illustrate cross-sectional views for explaining some processes of an organic light-emitting display apparatus according to a comparative example
- FIG. 8 illustrates a view for comparing sizes of emission areas of the organic light-emitting display apparatus of FIG. 1 and the organic light-emitting display apparatus according to the comparative example
- FIG. 9 illustrates a cross-sectional view of an organic light-emitting display apparatus according to another embodiment
- FIG. 10 illustrates a graph showing a relationship between a reflectance and a wavelength of each of pure silver (Ag) and a silver alloy.
- FIGS. 11A and 11B illustrate views illustrating particle defect patterns according to whether a first anode lower electrode includes silver.
- the term “and/or” includes any and all combinations of one or more of the associated listed items. Expressions such as “at least one of” when preceding a list of elements, modify the entire list of elements and do not modify the individual elements of the list.
- FIG. 1 is a cross-sectional view of an organic light-emitting display apparatus 1 according to an embodiment.
- a plurality of anode lower electrodes including a first anode lower electrode 101 , a second anode lower electrode 102 , and a third anode lower electrode 103 are located on a substrate 100 to be spaced apart from one another.
- a pixel-defining film 110 covers ends of the first through third anode lower electrodes 101 , 102 , and 103 .
- First through third anode upper electrodes 141 , 142 , and 143 are respectively located on the first through third anode lower electrodes 101 , 102 , and 103 .
- First through third organic functional layers 151 , 152 , and 153 are respectively located on the first through third anode upper electrodes 141 , 142 , and 143 .
- First through third auxiliary cathodes 181 , 182 , and 183 are respectively located on the first through third organic functional layers 151 , 152 , and 153 .
- An integrated cathode 180 is located as a common electrode on the first through third auxiliary cathodes 181 , 182 , and 183 and the pixel-defining film 110 .
- FIG. 2 is a cross-sectional view for explaining a method of manufacturing the organic light-emitting display apparatus 1 according to the present example embodiment and the organic light-emitting display apparatus manufactured by using the method will now be explained in more detail with reference to FIGS. 2 through 6G .
- FIG. 2 is a cross-sectional view illustrating the first through third anode lower electrodes 101 , 102 , and 103 formed on the substrate 100 of the organic light-emitting display apparatus 1 according to the present example embodiment.
- FIG. 3 is a cross-sectional view illustrating the pixel-defining film 110 formed in the organic light-emitting display apparatus 1 according to the present example embodiment.
- FIGS. 4A through 4G are cross-sectional views for explaining a first process of the organic light-emitting display apparatus 1 according to the present example embodiment.
- FIGS. 5A through 5G are cross-sectional views for explaining a second process of the organic light-emitting display apparatus 1 according to the present example embodiment.
- FIGS. 6A through 6G are cross-sectional views for explaining a third process of the organic light-emitting display apparatus 1 according to the present example embodiment.
- a plurality of anode lower electrodes including the first anode lower electrode 101 , the second anode lower electrode 102 , and the third anode lower electrode 103 , is formed on the substrate 100 .
- the substrate 100 may be formed by using various materials.
- the substrate 100 may be formed of glass or plastic.
- the plastic may include materials having excellent heat resistance and excellent durability such as polyimide, polyethylenenaphthalate, polyethyleneterephthalate, polyarylate, polycarbonate, polyetherimide, and polyethersulfone.
- a buffer layer for planarizing a surface and preventing penetration of impurity elements may be formed over the substrate 100 .
- the buffer layer may have a single-layer structure or a multi-layer structure formed of silicon nitride and/or silicon oxide.
- Each of the first through third anode lower electrodes 101 , 102 , and 103 may be hole injection electrodes and may be formed of, for example, a material having a high work function.
- Each of the first through third anode lower electrodes 101 , 102 , and 103 may include, for example, a transparent conductive oxide component.
- each of the first through third anode lower electrodes 101 , 102 , and 103 may include at least one selected from the group of indium tin oxide, indium zinc oxide, zinc oxide, indium oxide, indium gallium oxide, and aluminum zinc oxide.
- Each of the first through third anode lower electrodes 101 , 102 , and 103 may include a metal component such as aluminum, magnesium, lithium, or calcium.
- each of the first through third anode lower electrodes 101 , 102 , and 103 does not include a silver (Ag) component that is a metal with a high reducibility. Since each of the first through third anode lower electrodes 101 , 102 , and 103 does not include a silver component, particle defects due to re-precipitation of silver may be avoided, which will be explained below in detail.
- a silver (Ag) component that is a metal with a high reducibility
- first through third anode lower electrodes 101 , 102 , and 103 may be respectively electrically connected to first through third thin-film transistors located between the substrate 100 and the first through third anode lower electrodes 101 , 102 , and 103 .
- the pixel-defining film 110 surrounding edges of the first anode lower electrode 101 , the second anode lower electrode 102 , and the third anode lower electrode 103 is formed on the substrate 100 .
- Ends of the first through third anode lower electrodes 101 , 102 , and 103 may be sharp.
- an electric field may concentrate on the ends of the first through third anode lower electrodes 101 , 102 , and 103 and an electrical short circuit may occur during operation.
- the first through third organic functional layers 151 , 152 , and 153 cover the ends of the first through third anode lower electrodes 101 , 102 , and 103 and a pixel-defining film 110 also covers the ends of the first through third anode lower electrodes 101 , 102 , and 103 .
- an electric field may be prevented from concentrating at the ends of the first through third anode lower electrodes 101 , 102 , and 103 .
- the pixel-defining film 110 may be an organic insulating film including, for example, a general-purpose polymer such as poly(methyl methacrylate) (PMMA) or polystyrene (PS), a polymer derivative having a phenol group, an acryl-based polymer, an imide-based polymer, an arylether-based polymer, an amide-based polymer, a fluorine-based polymer, a p-xylene-based polymer, a vinyl alcohol-based polymer, and a blend thereof.
- PMMA poly(methyl methacrylate)
- PS polystyrene
- a first lift-off layer 121 and a first photoresist 131 each including a fluoropolymer are sequentially formed on the substrate 100 on which the first through third anode lower electrodes 101 , 102 , and 103 are formed.
- the fluoropolymer included in the first lift-off layer 121 may include, for example, a polymer having a fluorine content ranging from about 20 wt % to about 60 wt %.
- the fluoropolymer included in the first lift-off layer 121 may include at least one from among a copolymer of polytetrafluoroethylene, polychlorotrifluoroethylene, polydichlorodifluoroethylene, chlorotrifluoroethylene, and dichlorofluoroethylene, a copolymer of tetrafluoroethylene and perfluoroalkylvinylether, a copolymer of chlorotrifluoroethylene and perfluoroalkylvinylether, a copolymer of tetrafluoroethylene and perfluoroalkylvinylether, and a copolymer of chlorotrifluoroethylene and perfluoroalkylvinylether.
- the first lift-off layer 121 may be formed on the substrate 100 by using, for example, a coating method, a printing method, or a deposition method.
- a coating method for example, curing and polymerization may be performed and then a process of forming a photoresist may be performed.
- a thickness of the first lift-off layer 121 may be, for example, equal to or greater than 0.2 ⁇ m and equal to or less than 5 ⁇ m.
- a time taken to dissolve the first lift-off layer 121 for patterning may be increased and thus a manufacturing process time may be increased.
- the first lift-off layer 121 is thinner, it may be difficult to perform a lift-off process.
- the first lift-off layer 121 may further include a moisture-absorbing agent.
- the moisture-absorbing agent may include various materials.
- the moisture-absorbing agent may include a material that is a compound in which metals are connected by oxygen such as calcium oxide, barium oxide, aluminum oxide, or magnesium oxide and that forms metal hydroxide by reacting with water.
- the moisture-absorbing agent may include any one selected from the group of a metal halide, an inorganic acid salt of a metal, an organic acid salt, a porous inorganic compound, and a combination thereof.
- the moisture-absorbing agent may include an acryl-based organic material, a methacryl-based organic material, a polyisoprene-based organic material, a vinyl-based organic material, an epoxy-based organic material, a urethane-based organic material, or a cellulose-based organic material.
- the moisture-absorbing agent may include a titania-based inorganic material, a silicon oxide-based inorganic material, a zirconia-based inorganic material, or an alumina-based inorganic material.
- the moisture-absorbing agent may include a sealant formed of epoxy silane, vinyl silane, amine silane, or methacrylate silane.
- the moisture-absorbing agent may trap moisture generated during a first process and may prevent degradation of the first organic functional layer 151 formed in the first process.
- the first photoresist 131 is formed on the first lift-off layer 121 .
- the first photoresist 131 may be exposed and developed by using a first photomask.
- the first photoresist 131 may be a positive photoresist or a negative photoresist. In the present example embodiment, it is assumed that the first photoresist 131 is a positive photoresist.
- the first photoresist 131 is patterned.
- the first photoresist 131 that is exposed and developed is removed at a first portion 131 - 1 corresponding to the first anode lower electrode 101 and remains at a second portion 131 - 2 other than the first portion 131 - 1 .
- the first lift-off layer 121 is etched by using a pattern of the first photoresist 131 of FIG. 4B as an etch mask.
- the etchant may include a solvent to etch the fluoropolymer.
- the etchant may include a first solvent including fluorine.
- the first solvent may include hydrofluoroether.
- Hydrofluoroether is a material that is electrochemically stable due to a low interaction with other materials and is environmentally stable due to a low global warming potential and a low toxicity.
- a portion of the first lift-off layer 121 formed over the first anode lower electrode 101 to correspond to the first portion 131 - 1 is etched during an etching process.
- the first lift-off layer 121 may be etched to form a first undercut profile UC 1 under a boundary surface of the first portion 131 - 1 of the first photoresist 131 and to be spaced apart by a predetermined interval from a side surface of the first anode lower electrode 101 .
- the first undercut profile UC 1 may allow the first anode upper electrode 141 to cover an inclined surface that is an end of the pixel-defining film 110 in a subsequent deposition process.
- the first anode upper electrode 141 is formed on a structure of FIG. 4C .
- the first anode upper electrode 141 may include various metals.
- the first anode upper electrode 141 may include, for example, a material with a reducibility higher than a material of the first anode lower electrode 101 .
- the first anode upper electrode 141 may include silver with a high reducibility.
- Silver that is a metal with a high reflectance may be used as a material of a reflective electrode of a display apparatus.
- an electrode close to the substrate 100 may be a reflective electrode.
- silver ions receiving electrons in an etching process for forming a pattern of the first anode lower electrode 101 may be re-precipitated to form particles, thereby leading to defects.
- the first anode lower electrode 101 does not include a silver component and the first anode upper electrode 141 includes a silver component.
- particle defects of a display apparatus may be reduced, a reflectance may be increased, and light efficiency may be improved.
- the first anode lower electrode 101 may be subjected to an etching process in order to form a pattern.
- the first anode upper electrode 141 of the present example embodiment may be formed by using a vacuum deposition method without undergoing an etching process.
- a part of the first anode upper electrode 141 may be deposited to directly contact a top surface of the first anode lower electrode 101 and a part of the first anode upper electrode 141 may be deposited to contact the inclined surface that is the end of the pixel-defining film 110 , by using the first lift-off layer 121 and the first photoresist 131 as masks. Accordingly, an emission area may be increased and defects due to a residue generated in a subsequent lift-off process may be reduced.
- the first organic functional layer 151 is formed on a structure of FIG. 4D .
- the first organic functional layer 151 includes a first organic emission layer. Also, the first organic functional layer 151 may further include at least one functional layer from among a hole injection layer, a hole transport layer, an electron transport layer, and an electron injection layer.
- the first organic functional layer 151 may be formed by using a vacuum deposition method, like the first anode upper electrode 141 .
- the first lift-off layer 121 and the first photoresist 131 function as deposition masks.
- a part of the first organic functional layer 151 is formed to cover a top surface of the first anode upper electrode 141 and another part of the first organic functional layer 151 is formed on the second portion 131 - 2 of the first photoresist 131 .
- the first auxiliary cathode 181 is formed on a structure of FIG. 4E .
- the first auxiliary cathode 181 may be formed by using, for example, a vacuum deposition method, e.g., like the first anode upper electrode 141 and the first organic functional layer 151 .
- a vacuum deposition method e.g., like the first anode upper electrode 141 and the first organic functional layer 151 .
- the first lift-off layer 121 and the first photoresist 131 may function as deposition masks.
- a part of the first auxiliary cathode 181 is formed to cover a top surface of the first organic functional layer 151 and another part of the first auxiliary cathode 181 is formed on the second portion 131 - 2 of the first photoresist 131 other than the first portion 131 - 1 .
- the first auxiliary cathode 181 may include the same material as that of the cathode 180 that is a common electrode. In another implementation, the first auxiliary cathode 181 may be formed of a material different from that of the cathode 180 . The first auxiliary cathode 181 may function as a barrier for protecting the first organic functional layer 151 from a solvent used in a subsequent lift-off process.
- a lift-off process is performed on a structure of FIG. 4F .
- the first lift-off layer 121 may include the fluoropolymer, and a second solvent including fluorine may be used in the lift-off process.
- the first organic functional layer 151 may be formed and then the lift-off process may be performed.
- the second solvent may include a material having a low reactivity with the first organic functional layer 151 .
- the second solvent may include, for example, hydrofluoroether, like the first solvent.
- a second process of forming the second organic functional layer 152 (see FIG. 5G ) (which may emit light of a color different from that of the first organic functional layer 151 ) may be performed on an area where the second anode lower electrode 102 is located.
- a second lift-off layer 122 and a second photoresist 132 which may each include a fluoropolymer, are sequentially formed on the substrate 100 on which the first through third anode lower electrodes 101 , 102 , and 103 and the first organic functional layer 151 are formed.
- the second lift-off layer 122 may be formed by using, for example, a coating method, a printing method, or a deposition method.
- the second lift-off layer 122 may be formed of the same material as that of the first lift-off layer 121 .
- the second photoresist 132 may be exposed and developed by using a second photomask.
- the second photoresist 132 may be, for example, a positive photoresist or a negative photoresist. In the present example embodiment, the second photoresist is described as a positive photoresist.
- the second photoresist 132 is patterned.
- the second photoresist 132 that is exposed and developed is removed at a first portion 132 - 1 corresponding to the second anode lower electrode 102 and remains at a second portion 132 - 2 other than the first portion 132 - 1 .
- the second lift-off layer 122 is etched by using a pattern of the second photoresist 132 of FIG. 5B as an etch mask.
- the second lift-off layer 122 may includes the fluoropolymer, and the etchant may include a solvent that may etch the fluoropolymer.
- the etchant may include a first solvent including fluorine.
- the first solvent may include hydrofluoroether, like in the first process.
- the first solvent may include a material different from that in the first process.
- a portion of the second lift-off layer 122 formed over the second anode lower electrode 102 to correspond to the first portion 132 - 1 is etched during an etching process.
- the second lift-off layer 122 may be etched to form a second undercut profile UC 2 under a boundary surface of the first portion 132 - 1 of the second photoresist 132 and to be spaced apart by a predetermined interval from a side surface of the second anode lower electrode 102 .
- the second undercut profile UC 2 may allow the second anode upper electrode 142 to cover an inclined surface that is an end of the pixel-defining film 110 in a subsequent deposition process.
- the second anode upper electrode 142 is formed on a structure of FIG. SC.
- the second anode upper electrode 142 may include, for example, various metals.
- the second anode upper electrode 142 may include a material that is the same as or different from that of the first anode upper electrode 141 .
- the second anode upper electrode 142 may include a material with a reducibility higher than that of the second anode lower electrode 102 .
- the second anode upper electrode 142 may include silver with a high reducibility.
- a part of the second anode upper electrode 142 may be deposited to directly contact a top surface of the second anode lower electrode 102 , and a part of the second anode upper electrode 142 may be deposited to contact the inclined surface that is the end of the pixel-defining film 110 , using the second lift-off layer 122 and the second photoresist 132 as masks. Accordingly, an emission area may be increased and defects due to a residue generated in a subsequent lift-off process may be reduced.
- the second organic functional layer 152 is formed on a structure of FIG. 5D .
- the second organic functional layer 152 includes a second organic emission layer. Also, the second organic functional layer 152 may further include at least one functional layer from among a hole injection layer, a hole transport layer, an electron transport layer, and an electron injection layer.
- the second organic functional layer 152 may be formed by using, for example, a vacuum deposition method, like the second anode upper electrode 142 .
- the second lift-off layer 122 and the second photoresist 132 may function as deposition masks.
- a part of the second organic functional layer 152 is formed to cover a top surface of the second anode upper electrode 142 and another part of the second organic functional layer 152 is formed on the second portion 132 - 2 of the second photoresist 132 .
- the second auxiliary cathode 182 is formed on a structure of FIG. 5E .
- the second auxiliary cathode 182 may be formed by using, for example, a vacuum deposition method, like the second anode upper electrode 142 and the second organic functional layer 152 .
- the second lift-off layer 122 and the second photoresist 132 may function as deposition masks.
- a part of the second auxiliary cathode 182 is formed to cover a top surface of the second organic functional layer 152 and another part of the second auxiliary cathode 182 is formed on the second portion 132 - 2 of the second photoresist 132 other than the first portion 132 - 1 .
- the second auxiliary cathode 182 may include a material that is the same as or different from that of the first auxiliary cathode 181 .
- the second auxiliary cathode 182 may include the same material as that of the cathode 180 that is a common electrode.
- the second auxiliary cathode 182 may be formed of a material different from that of the cathode 180 .
- the second auxiliary cathode 182 may function as a barrier for protecting the second organic functional layer 152 from a solvent used in a subsequent lift-off process.
- a lift-off process is performed on a structure of FIG. 5F .
- the second lift-off layer 122 may include the fluoropolymer, and a second solvent including fluorine may be used in the lift-off process. Since the second organic functional layer 152 may be formed and then the lift-off process may be performed, the second solvent may include a material having a low reactivity with the second organic functional layer 152 .
- the second solvent may include, for example, hydrofluoroether, like the first solvent.
- a third process of forming the third organic functional layer 153 (see FIG. 6G ) (which may emit light of a color different from those of the first organic functional layer 151 and the second organic functional layer 152 ) may be performed on an area where the third anode lower electrode 103 is located.
- a third lift-off layer 123 and a third photoresist 333 which may each include a fluoropolymer, are sequentially formed on the substrate 100 on which the first through third anode lower electrodes 101 , 102 , and 103 and the first and second organic functional layers 151 and 152 are formed.
- the third lift-off layer 123 may be formed by using, for example, a coating method, a printing method, and a deposition method.
- the third lift-off layer 123 may be formed of the same material as those/that of the first and/or the second lift-off layers 121 and 122 .
- the third photoresist 133 may be exposed and developed by using a third photomask.
- the third photoresist 133 may be a positive photoresist or a negative photoresist. In the present example embodiment, the third photoresist is described as a positive photoresist.
- the third photoresist 133 is patterned.
- the third photoresist 133 is exposed and developed to be removed at a first portion 133 - 1 corresponding to the third anode lower electrode 103 and to remain at a second portion 133 - 2 other than the first portion 133 - 1 .
- the third lift-off layer 123 may be etched by using a pattern of the third photoresist 133 of FIG. 6B as an etch mask.
- the third lift-off layer 123 may include the fluoropolymer, and the etchant may include a solvent that etches the fluoropolymer.
- the etchant may include a first solvent including fluorine.
- the first solvent may include, for example, hydrofluoroether, like in the first and second processes.
- the first solvent may include a material different from that in the first and second processes.
- a portion of the third lift-off layer 123 formed over the third anode lower electrode 103 to correspond to the first portion 133 - 1 is etched during an etching process.
- the third lift-off layer 123 may be etched to form a third undercut profile UC 3 under a boundary surface of the first portion 133 - 1 of the third photoresist 133 and to be spaced apart by a predetermined interval from a side surface of the third anode lower electrode 103 .
- the third undercut profile UC 3 may allow the third anode upper electrode 143 to cover an inclined surface that is an end of the pixel-defining film 110 in a subsequent deposition process.
- the third anode upper electrode 143 is formed on a structure of FIG. 6C .
- the third anode upper electrode 143 may include various metals.
- the third anode upper electrode 143 may include a material that is the same as or different from those of the first and second anode upper electrodes 141 and 142 .
- the third anode upper electrode 143 may include a material with a reducibility higher than that of the third anode lower electrode 103 .
- the third anode upper electrode 143 may include silver with a high reducibility.
- a part of the third anode upper electrode 143 may be deposited to directly contact a top surface of the third anode lower electrode 103 and a part of the third anode upper electrode 143 may be deposited to contact the inclined surface that is the end of the pixel-defining film 110 , using the third lift-off layer 123 and the third photoresist 133 as masks. Accordingly, an emission area may be increased and defects due to a residue generated in a subsequent lift-off process may be reduced.
- the third organic functional layer 153 is formed on a structure of FIG. 6D .
- the third organic functional layer 153 includes a third organic emission layer. Also, the third organic functional layer 153 may further include at least one functional layer from among a hole injection layer, a hole transport layer, an electron transport layer, and an electron injection layer.
- the third organic functional layer 153 may be formed by using, for example, a vacuum deposition process, like the third anode upper electrode 143 .
- a vacuum deposition process the third lift-off layer 123 and the third photoresist 133 function as deposition masks.
- a part of the third organic functional layer 153 is formed to cover a top surface of the third anode upper electrode 143 and another part of the third organic functional layer 153 is formed on the second portion 133 - 2 of the third photoresist 133 .
- the third auxiliary cathode 183 is formed on a structure of FIG. 6E .
- the third auxiliary cathode 183 may be formed by using, for example, a vacuum deposition method, like the third anode upper electrode 143 and the third organic functional layer 153 .
- the third lift-off layer 123 and the third photoresist 133 function as deposition masks.
- a part of the third auxiliary cathode 183 is formed to cover a top surface of the third organic functional layer 153 and another part of the third auxiliary cathode 183 is formed on the second portion 133 - 2 of the third photoresist 133 other than the first portion 133 - 1 .
- the third auxiliary cathode 183 may include a material that is the same as or different from those of the first and second auxiliary cathodes 181 and 182 .
- the third auxiliary cathode 183 may include the same material as that of the cathode 180 that is a common electrode.
- the third auxiliary cathode 183 may be formed of a material different from that of the cathode 180 .
- the third auxiliary cathode 183 may function as a barrier for protecting the third organic functional layer 153 from a solvent used in a subsequent lift-off process.
- a lift-off process is performed on a structure of FIG. 6F .
- the third lift-off layer 123 may include the fluoropolymer, and a second solvent including fluorine may be used in the lift-off process. Since the third organic functional layer 153 may be formed and then the lift-off process may be performed, the second solvent may include a material having a low reactivity with the third organic functional layer 153 .
- the second solvent may include, for example, hydrofluoroether, like the first solvent.
- the first through third organic functional layers 151 , 152 , and 153 may emit light of different colors. White light may be formed by mixing light emitted from the first through third organic functional layers 151 , 152 , and 153 .
- the first through third organic functional layers 151 , 152 , and 153 may respectively emit red light, green light, and blue light.
- the first through third organic functional layers 151 , 152 , and 153 may correspond to subpixels constituting a unit pixel of the organic light-emitting display apparatus 1 .
- the organic light-emitting display apparatus 1 of FIG. 1 may include one unit pixel. Also, the present example embodiment may be applied to an organic light-emitting display apparatus including a plurality of the unit pixels of FIG. 1 .
- a plurality of the first organic functional layers 151 that emit light of a first color may be simultaneously formed.
- a plurality of the second organic functional layers 152 that emit light of a second color may be simultaneously formed.
- a plurality of the third organic functional layers 153 that emit light of a third color may be simultaneously formed. Light of full colors may be formed by using the first through third processes.
- the cathode 180 is formed on a structure of FIG. 6G .
- the cathode 180 may be integrally formed as a common electrode on the first through third organic functional layers 151 , 152 , and 153 and the pixel-defining film 110 .
- first through third anode lower electrodes 101 , 102 , and 103 and the first through third anode upper electrodes 141 , 142 , and 143 are hole injection electrodes and the first through third auxiliary cathodes 181 , 182 , and 183 and the cathode 180 are electron injection electrodes in the present example embodiment
- the present disclosure is not limited thereto and electron injection electrodes may be formed on an area where the first through third anode lower electrodes 101 , 102 , and 103 and the first through third anode upper electrodes 141 , 142 , and 143 are located and hole injection electrodes may be formed on an area where the first through third auxiliary cathodes 181 , 182 , and 183 , and the cathode 180 are located.
- patterns of the first through third organic functional layers 151 , 152 , and 153 may be formed by using first through third lift-off processes. Thus, issues relating to the use of the metal mask may be avoided.
- FIGS. 7A through 7D are cross-sectional views for explaining some processes of an organic light-emitting display apparatus 2 according to a comparative example.
- the pixel-defining film 110 that covers ends of the first through third anode lower electrodes 101 , 102 , and 103 formed on the substrate 100 to be spaced apart from one another is formed.
- the first lift-off layer 121 and the first photoresist 131 are sequentially stacked, and the first photoresist 131 is patterned through exposure and development.
- the first photoresist 131 is removed at the first portion 131 - 1 corresponding to the first anode lower electrode 101 and remains at the second portion 131 - 2 other than the first portion 131 - 1 .
- the first undercut profile UC 1 is formed under a boundary surface of the first portion 131 - 1 of the first photoresist 131 by etching the first lift-off layer 121 by using a pattern of the first photoresist 131 as an etch mask. A portion of the first lift-off layer 121 formed over the first anode lower electrode 101 to correspond to the first portion 131 - 1 is etched. The first lift-off layer 121 including a fluoropolymer may not be completely removed and a residue P 1 may remain on the first anode lower electrode 101 as shown in FIG. 7A .
- the first organic functional layer 151 and the first auxiliary cathode 181 are deposited on a structure of FIG. 7A .
- a lift-off process is performed on a structure of FIG. 7B .
- the first lift-off layer 121 including the fluoropolymer may not be completely removed and a residue P 2 may remain on the second anode lower electrode 102 as shown in FIG. 7C .
- the residue P 1 on the first anode lower electrode 101 and the residue P 2 on the second anode lower electrode 102 may degrade hole or electron injection characteristics from an electrode to an organic functional layer.
- the first through third anode upper electrodes 141 , 142 , and 143 may be formed by using a deposition process using a lift-off layer on the first through third anode lower electrodes 101 , 102 , and 103 .
- the residues may not directly contact the first through third organic functional layers 151 , 152 , and 153 . Accordingly, according to an example embodiment, defects due to a residue generated in a lift-off process may be reduced.
- FIG. 7D is a cross-sectional view of the organic light-emitting display apparatus 2 according to the comparative example after first through third processes are completed.
- FIG. 8 is a view for comparing sizes of emission areas of the organic light-emitting display apparatus 1 according to the present example embodiment and the organic light-emitting display apparatus 2 according to the comparative example.
- an emission area EA 2 is defined as a portion of the first anode lower electrode 101 that is not covered by the pixel-defining film 110 .
- the first anode upper electrode 141 is formed on a top surface of the first anode lower electrode 101 and on an inclined surface that is an end of the pixel-defining film 110 and then the first organic functional layer 151 is formed on the first anode upper electrode 141 .
- an emission area EA 1 is greater than the emission area EA 2 of the comparative example. Accordingly, an aperture ratio of a display apparatus may be increased.
- FIG. 9 is a cross-sectional view of an organic light-emitting display apparatus 3 according to another example embodiment.
- the organic light-emitting display apparatus 3 of FIG. 9 is different from the organic light-emitting display apparatus 1 in that specific materials are selected as materials of the first anode lower electrode 103 and the first anode upper electrode 141 .
- the first anode lower electrode 103 is formed of indium tin oxide and the first anode upper electrode 141 is formed of silver.
- the first anode lower electrode 103 has a stacked structure formed of aluminum (Al) and indium tin oxide, and the first anode upper electrode 141 is formed of silver Ag.
- Silver is a metal with a high reducibility.
- silver ions receiving electrons in an etching process for forming a pattern of the first anode lower electrode 101 may be re-precipitated to form particles, thereby leading to defects.
- FIGS. 11A and 11B are views illustrating particle defect patterns according to whether the first anode lower electrode 101 includes silver.
- FIG. 11A illustrates a result obtained after a lift-off process is performed when the first anode lower electrode 101 does not include silver.
- FIG. 11B illustrates a result obtained after a lift-off process is performed when the first anode lower electrode 101 includes silver.
- the first anode upper electrode 141 is formed in a vacuum deposition process and the first anode upper electrode 141 is blocked from external air in a subsequent encapsulation process.
- the first anode upper electrode 141 may be formed of pure silver, instead of an alloy.
- FIG. 10 is a graph showing a relationship between a reflectance and a wavelength of each of pure silver and a silver alloy. Since the pure silver has a light reflectance higher than that of the silver alloy and an increase in a reflectance in blue wavelengths equal to or less than 500 nm is large, the efficiency of a blue device may be improved.
- each of the organic light-emitting display apparatuses may further include an encapsulation member that encapsulates an organic emission layer.
- the encapsulation member may include a glass substrate, a metal foil, and a thin-film encapsulation layer in which an inorganic layer and an organic layer are combined.
- embodiments may provide an organic light-emitting display apparatus that may reduce defects and manufacturing costs, and a method of manufacturing the organic light-emitting display apparatus.
- an emission layer may be formed without using a fine metal mask (FMM), and a high resolution display panel may be formed.
- FMM fine metal mask
- an anode upper electrode may be deposited in a vacuum.
- defects due to a residue formed in a lift-off process may be reduced.
- an anode upper electrode may be deposited to extend to an inclined surface of a pixel-defining film.
- an emission area may be increased and an aperture ratio of a display apparatus may be increased.
- an anode lower electrode may not include silver. Thus, particle defects due to silver may be avoided.
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Abstract
Description
- Korean Patent Application No. 10-2016-0098043, filed on Aug. 1, 2016, in the Korean Intellectual Property Office, and entitled: “Organic Light-Emitting Display Apparatus and Method of Manufacturing the Same,” is incorporated by reference herein in its entirety.
- Embodiments relate to an organic light-emitting display apparatus and a method of manufacturing the same.
- An organic light-emitting display apparatus may be structured as a self-emitting display apparatus that includes an organic emission layer formed between electrodes. The organic light-emitting display may be driven to emit light when holes injected from one of the electrodes and electrons injected from another of the electrodes recombine in the organic emission layer. The organic light-emitting display apparatus may have advantages such as low power consumption, high luminance, and fast response.
- Embodiments are directed to an organic light-emitting display apparatus, including a substrate; lower electrodes, the lower electrodes being on the substrate and spaced apart from one another; a pixel-defining film, the pixel-defining film having portions that cover ends of the lower electrodes; upper electrodes, an upper electrode corresponding to each lower electrode, each upper electrode including a first portion contacting the corresponding lower electrode and a second portion contacting the pixel-defining film; organic functional layers, each including an emission layer, an organic functional layer corresponding to each upper electrode and disposed thereon; and an electrode on the organic functional layers.
- The upper electrodes may include a material with a reducibility that is higher than a reducibility of a material of the lower electrodes.
- The lower electrodes may not include silver (Ag).
- The upper electrodes may include silver (Ag).
- The organic functional layers may each further include at least one functional layer from among a hole injection layer, a hole transport layer, an electron transport layer, and an electron injection layer.
- The electrode on the organic functional layers may be integrated across a plurality of the organic functional layers.
- The organic light-emitting display apparatus may further include auxiliary electrodes. An auxiliary electrode may correspond to each organic functional layer and disposed thereon, and the auxiliary electrodes may be spaced apart from one another.
- The first upper electrodes may be respectively on inclined surfaces of the portions of the pixel-defining film that cover the ends of the first lower electrodes.
- Embodiments are also directed to a method of manufacturing an organic light-emitting display apparatus, the method including forming lower electrodes on a substrate, the lower electrodes being spaced apart from one another; forming a pixel-defining film, the pixel-defining film having portions that cover ends of the lower electrodes; forming a first lift-off layer on the lower electrodes and the pixel-defining film; forming a first region corresponding to a first one of the lower electrodes, the first region being formed by removing a first portion of the first lift-off layer; sequentially forming, in the first region, a first upper electrode and a first organic functional layer that includes a first emission layer; removing a second portion of the first lift-off layer using a first solvent; forming a second lift-off layer on the substrate, the second lift-off layer covering the first organic functional layer and the lower electrodes; forming a second region corresponding to a second one of the lower electrodes, the second region being formed by removing a first portion of the second lift-off layer; sequentially forming, in the second region, a second upper electrode and a second functional layer that includes a second emission layer; removing a second portion of the second lift-off layer using a second solvent; and forming a second electrode on the first organic functional layer and the second organic functional layer.
- Each of the first and second lift-off layers may include a fluoropolymer.
- Each of the first and second lift-off layers may further include a light-sensitive material.
- The method may further include forming a first photoresist on the first lift-off layer; and forming a second photoresist on the second lift-off layer.
- The first photoresist may be patterned where the first region is, as the first portion of the first lift-off layer is removed, the first lift-off layer may be formed with an undercut profile in the first region, the second photoresist may be patterned where the second region is, and, as the second portion of the second lift-off layer is removed, the second lift-off layer may be formed with an undercut profile.
- Each of the first solvent and the second solvent may include fluorine.
- The first upper electrode and the first organic functional layer may be formed using a deposition process.
- The second upper electrode and the second organic functional layer may be formed using a deposition process.
- The first upper electrode may be formed of a material with a reducibility higher than a reducibility of the corresponding lower electrode.
- The lower electrodes may not include silver (Ag).
- The upper electrodes may include silver (Ag).
- The method may further include, before the forming of the second electrode, forming a first auxiliary electrode on the first organic functional layer and forming a second auxiliary electrode on the second organic functional layer, the first and second auxiliary electrodes being spaced apart from each other.
- Features will become apparent to those of skill in the art by describing in detail exemplary embodiments with reference to the attached drawings in which:
-
FIG. 1 illustrates a cross-sectional view of an organic light-emitting display apparatus according to an embodiment; -
FIG. 2 illustrates a cross-sectional view for explaining an operation of forming a plurality of anodes on a substrate of the organic light-emitting display apparatus ofFIG. 1 ; -
FIG. 3 illustrates a cross-sectional view for explaining an operation of forming a pixel-defining film in the organic light-emitting display apparatus ofFIG. 1 ; -
FIGS. 4A through 4G illustrate cross-sectional views for explaining a first process of the organic light-emitting display apparatus ofFIG. 1 ; -
FIGS. 5A through 5G illustrate cross-sectional views for explaining a second process of the organic light-emitting display apparatus ofFIG. 1 ; -
FIGS. 6A through 6G illustrate cross-sectional views for explaining a third process of the organic light-emitting display apparatus ofFIG. 1 ; -
FIGS. 7A through 7D illustrate cross-sectional views for explaining some processes of an organic light-emitting display apparatus according to a comparative example; -
FIG. 8 illustrates a view for comparing sizes of emission areas of the organic light-emitting display apparatus ofFIG. 1 and the organic light-emitting display apparatus according to the comparative example; -
FIG. 9 illustrates a cross-sectional view of an organic light-emitting display apparatus according to another embodiment; -
FIG. 10 illustrates a graph showing a relationship between a reflectance and a wavelength of each of pure silver (Ag) and a silver alloy; and -
FIGS. 11A and 11B illustrate views illustrating particle defect patterns according to whether a first anode lower electrode includes silver. - Example embodiments will now be described more fully hereinafter with reference to the accompanying drawings; however, they may be embodied in different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey exemplary implementations to those skilled in the art. In the drawing figures, the dimensions of layers and regions may be exaggerated for clarity of illustration. Like reference numerals refer to like elements throughout.
- It will be understood that although the terms “first”, “second”, etc. may be used herein to describe various elements, these elements should not be limited by these terms. These elements are only used to distinguish one element from another.
- As used herein, the singular forms “a”, “an”, and “the” are intended to include the plural forms as well, unless the context clearly indicates otherwise.
- It will be further understood that the terms “comprises” and/or “comprising” used herein specify the presence of stated features or components, but do not preclude the presence or addition of one or more other features or components.
- It will be understood that when a layer, region, or element is referred to as being “formed on”, another layer, region, or element, it can be directly or indirectly formed on the other layer, region, or element. Thus, for example, intervening layers, regions, or elements may be present.
- As used herein, the term “and/or” includes any and all combinations of one or more of the associated listed items. Expressions such as “at least one of” when preceding a list of elements, modify the entire list of elements and do not modify the individual elements of the list.
-
FIG. 1 is a cross-sectional view of an organic light-emittingdisplay apparatus 1 according to an embodiment. - Referring to
FIG. 1 , in the organic light-emittingdisplay apparatus 1 according to the present example embodiment, a plurality of anode lower electrodes including a first anodelower electrode 101, a second anodelower electrode 102, and a third anodelower electrode 103 are located on asubstrate 100 to be spaced apart from one another. A pixel-definingfilm 110 covers ends of the first through third anodelower electrodes upper electrodes lower electrodes functional layers upper electrodes auxiliary cathodes functional layers integrated cathode 180 is located as a common electrode on the first through thirdauxiliary cathodes film 110. - A method of manufacturing the organic light-emitting
display apparatus 1 according to the present example embodiment and the organic light-emittingdisplay apparatus 1 manufactured by using the method will now be explained in more detail with reference toFIGS. 2 through 6G . -
FIG. 2 is a cross-sectional view for explaining a method of manufacturing the organic light-emittingdisplay apparatus 1 according to the present example embodiment and the organic light-emitting display apparatus manufactured by using the method will now be explained in more detail with reference toFIGS. 2 through 6G . -
FIG. 2 is a cross-sectional view illustrating the first through third anodelower electrodes substrate 100 of the organic light-emittingdisplay apparatus 1 according to the present example embodiment.FIG. 3 is a cross-sectional view illustrating the pixel-definingfilm 110 formed in the organic light-emittingdisplay apparatus 1 according to the present example embodiment.FIGS. 4A through 4G are cross-sectional views for explaining a first process of the organic light-emittingdisplay apparatus 1 according to the present example embodiment.FIGS. 5A through 5G are cross-sectional views for explaining a second process of the organic light-emittingdisplay apparatus 1 according to the present example embodiment.FIGS. 6A through 6G are cross-sectional views for explaining a third process of the organic light-emittingdisplay apparatus 1 according to the present example embodiment. - Referring to
FIG. 2 , a plurality of anode lower electrodes, including the first anodelower electrode 101, the second anodelower electrode 102, and the third anodelower electrode 103, is formed on thesubstrate 100. - The
substrate 100 may be formed by using various materials. For example, thesubstrate 100 may be formed of glass or plastic. Examples of the plastic may include materials having excellent heat resistance and excellent durability such as polyimide, polyethylenenaphthalate, polyethyleneterephthalate, polyarylate, polycarbonate, polyetherimide, and polyethersulfone. - Although not shown in
FIG. 2 , a buffer layer for planarizing a surface and preventing penetration of impurity elements may be formed over thesubstrate 100. For example, the buffer layer may have a single-layer structure or a multi-layer structure formed of silicon nitride and/or silicon oxide. - Each of the first through third anode
lower electrodes lower electrodes lower electrodes lower electrodes lower electrodes lower electrodes - Although not shown in
FIG. 2 , the first through third anodelower electrodes substrate 100 and the first through third anodelower electrodes - Referring to
FIG. 3 , the pixel-definingfilm 110 surrounding edges of the first anodelower electrode 101, the second anodelower electrode 102, and the third anodelower electrode 103 is formed on thesubstrate 100. - Ends of the first through third anode
lower electrodes cathode 180 is formed and current is applied, an electric field may concentrate on the ends of the first through third anodelower electrodes functional layers lower electrodes film 110 also covers the ends of the first through third anodelower electrodes lower electrodes - The pixel-defining
film 110 may be an organic insulating film including, for example, a general-purpose polymer such as poly(methyl methacrylate) (PMMA) or polystyrene (PS), a polymer derivative having a phenol group, an acryl-based polymer, an imide-based polymer, an arylether-based polymer, an amide-based polymer, a fluorine-based polymer, a p-xylene-based polymer, a vinyl alcohol-based polymer, and a blend thereof. - Referring to
FIG. 4A , a first lift-off layer 121 and afirst photoresist 131 each including a fluoropolymer are sequentially formed on thesubstrate 100 on which the first through third anodelower electrodes - The fluoropolymer included in the first lift-
off layer 121 may include, for example, a polymer having a fluorine content ranging from about 20 wt % to about 60 wt %. For example, the fluoropolymer included in the first lift-off layer 121 may include at least one from among a copolymer of polytetrafluoroethylene, polychlorotrifluoroethylene, polydichlorodifluoroethylene, chlorotrifluoroethylene, and dichlorofluoroethylene, a copolymer of tetrafluoroethylene and perfluoroalkylvinylether, a copolymer of chlorotrifluoroethylene and perfluoroalkylvinylether, a copolymer of tetrafluoroethylene and perfluoroalkylvinylether, and a copolymer of chlorotrifluoroethylene and perfluoroalkylvinylether. - The first lift-
off layer 121 may be formed on thesubstrate 100 by using, for example, a coating method, a printing method, or a deposition method. When the first lift-off layer 121 is formed by using a coating method and a printing method, curing and polymerization may be performed and then a process of forming a photoresist may be performed. - A thickness of the first lift-
off layer 121 may be, for example, equal to or greater than 0.2 μm and equal to or less than 5 μm. When the first lift-off layer 121 is thicker, a time taken to dissolve the first lift-off layer 121 for patterning may be increased and thus a manufacturing process time may be increased. When the first lift-off layer 121 is thinner, it may be difficult to perform a lift-off process. - The first lift-
off layer 121 may further include a moisture-absorbing agent. The moisture-absorbing agent may include various materials. The moisture-absorbing agent may include a material that is a compound in which metals are connected by oxygen such as calcium oxide, barium oxide, aluminum oxide, or magnesium oxide and that forms metal hydroxide by reacting with water. Also, the moisture-absorbing agent may include any one selected from the group of a metal halide, an inorganic acid salt of a metal, an organic acid salt, a porous inorganic compound, and a combination thereof. The moisture-absorbing agent may include an acryl-based organic material, a methacryl-based organic material, a polyisoprene-based organic material, a vinyl-based organic material, an epoxy-based organic material, a urethane-based organic material, or a cellulose-based organic material. The moisture-absorbing agent may include a titania-based inorganic material, a silicon oxide-based inorganic material, a zirconia-based inorganic material, or an alumina-based inorganic material. The moisture-absorbing agent may include a sealant formed of epoxy silane, vinyl silane, amine silane, or methacrylate silane. The moisture-absorbing agent may trap moisture generated during a first process and may prevent degradation of the first organicfunctional layer 151 formed in the first process. - The
first photoresist 131 is formed on the first lift-off layer 121. Thefirst photoresist 131 may be exposed and developed by using a first photomask. Thefirst photoresist 131 may be a positive photoresist or a negative photoresist. In the present example embodiment, it is assumed that thefirst photoresist 131 is a positive photoresist. - Referring to
FIG. 4B , thefirst photoresist 131 is patterned. Thefirst photoresist 131 that is exposed and developed is removed at a first portion 131-1 corresponding to the first anodelower electrode 101 and remains at a second portion 131-2 other than the first portion 131-1. - Referring to
FIG. 4C , the first lift-off layer 121 is etched by using a pattern of thefirst photoresist 131 ofFIG. 4B as an etch mask. - When the first lift-
off layer 121 includes the fluoropolymer, the etchant may include a solvent to etch the fluoropolymer. - The etchant may include a first solvent including fluorine. The first solvent may include hydrofluoroether. Hydrofluoroether is a material that is electrochemically stable due to a low interaction with other materials and is environmentally stable due to a low global warming potential and a low toxicity.
- A portion of the first lift-
off layer 121 formed over the first anodelower electrode 101 to correspond to the first portion 131-1 is etched during an etching process. The first lift-off layer 121 may be etched to form a first undercut profile UC1 under a boundary surface of the first portion 131-1 of thefirst photoresist 131 and to be spaced apart by a predetermined interval from a side surface of the first anodelower electrode 101. The first undercut profile UC1 may allow the first anodeupper electrode 141 to cover an inclined surface that is an end of the pixel-definingfilm 110 in a subsequent deposition process. - Referring to
FIG. 4D , the first anodeupper electrode 141 is formed on a structure ofFIG. 4C . The first anodeupper electrode 141 may include various metals. The first anodeupper electrode 141 may include, for example, a material with a reducibility higher than a material of the first anodelower electrode 101. For example, the first anodeupper electrode 141 may include silver with a high reducibility. - Silver that is a metal with a high reflectance may be used as a material of a reflective electrode of a display apparatus. For example, in a top-emission display apparatus in which light is emitted away from the
substrate 100, an electrode close to thesubstrate 100 may be a reflective electrode. When the first anodelower electrode 101 is formed of a material including silver with a high reducibility, silver ions receiving electrons in an etching process for forming a pattern of the first anodelower electrode 101 may be re-precipitated to form particles, thereby leading to defects. - In the present example embodiment, the first anode
lower electrode 101 does not include a silver component and the first anodeupper electrode 141 includes a silver component. Thus, particle defects of a display apparatus may be reduced, a reflectance may be increased, and light efficiency may be improved. - The first anode
lower electrode 101 may be subjected to an etching process in order to form a pattern. However, the first anodeupper electrode 141 of the present example embodiment may be formed by using a vacuum deposition method without undergoing an etching process. Thus, a part of the first anodeupper electrode 141 may be deposited to directly contact a top surface of the first anodelower electrode 101 and a part of the first anodeupper electrode 141 may be deposited to contact the inclined surface that is the end of the pixel-definingfilm 110, by using the first lift-off layer 121 and thefirst photoresist 131 as masks. Accordingly, an emission area may be increased and defects due to a residue generated in a subsequent lift-off process may be reduced. - Referring to
FIG. 4E , the first organicfunctional layer 151 is formed on a structure ofFIG. 4D . - The first organic
functional layer 151 includes a first organic emission layer. Also, the first organicfunctional layer 151 may further include at least one functional layer from among a hole injection layer, a hole transport layer, an electron transport layer, and an electron injection layer. - The first organic
functional layer 151 may be formed by using a vacuum deposition method, like the first anodeupper electrode 141. In a deposition process, the first lift-off layer 121 and thefirst photoresist 131 function as deposition masks. A part of the first organicfunctional layer 151 is formed to cover a top surface of the first anodeupper electrode 141 and another part of the first organicfunctional layer 151 is formed on the second portion 131-2 of thefirst photoresist 131. - In an example embodiment, referring to
FIG. 4F , the firstauxiliary cathode 181 is formed on a structure ofFIG. 4E . - The first
auxiliary cathode 181 may be formed by using, for example, a vacuum deposition method, e.g., like the first anodeupper electrode 141 and the first organicfunctional layer 151. In a deposition process, the first lift-off layer 121 and thefirst photoresist 131 may function as deposition masks. A part of the firstauxiliary cathode 181 is formed to cover a top surface of the first organicfunctional layer 151 and another part of the firstauxiliary cathode 181 is formed on the second portion 131-2 of thefirst photoresist 131 other than the first portion 131-1. - The first
auxiliary cathode 181 may include the same material as that of thecathode 180 that is a common electrode. In another implementation, the firstauxiliary cathode 181 may be formed of a material different from that of thecathode 180. The firstauxiliary cathode 181 may function as a barrier for protecting the first organicfunctional layer 151 from a solvent used in a subsequent lift-off process. - Referring to
FIG. 4G , a lift-off process is performed on a structure ofFIG. 4F . - The first lift-
off layer 121 may include the fluoropolymer, and a second solvent including fluorine may be used in the lift-off process. The first organicfunctional layer 151 may be formed and then the lift-off process may be performed. Thus, the second solvent may include a material having a low reactivity with the first organicfunctional layer 151. The second solvent may include, for example, hydrofluoroether, like the first solvent. - When the first lift-
off layer 121 formed under the second portion 131-2 of thefirst photoresist 131 is lifted off, portions of the first anodeupper electrode 141, the first organicfunctional layer 151, and the firstauxiliary cathode 181 formed over the second portion 131-2 of thefirst photoresist 131 are removed, and portions of the first anodeupper electrode 141, the first organicfunctional layer 151, and the firstauxiliary cathode 181 formed over the first anodelower electrode 101 remain as patterns. - After the first process is performed, a second process of forming the second organic functional layer 152 (see
FIG. 5G ) (which may emit light of a color different from that of the first organic functional layer 151) may be performed on an area where the second anodelower electrode 102 is located. - The second process will now be explained with reference to
FIGS. 5A through 5G . - Referring to
FIG. 5A , a second lift-off layer 122 and asecond photoresist 132, which may each include a fluoropolymer, are sequentially formed on thesubstrate 100 on which the first through third anodelower electrodes functional layer 151 are formed. - The second lift-
off layer 122 may be formed by using, for example, a coating method, a printing method, or a deposition method. The second lift-off layer 122 may be formed of the same material as that of the first lift-off layer 121. - The
second photoresist 132 may be exposed and developed by using a second photomask. Thesecond photoresist 132 may be, for example, a positive photoresist or a negative photoresist. In the present example embodiment, the second photoresist is described as a positive photoresist. - Referring to
FIG. 5B , thesecond photoresist 132 is patterned. Thesecond photoresist 132 that is exposed and developed is removed at a first portion 132-1 corresponding to the second anodelower electrode 102 and remains at a second portion 132-2 other than the first portion 132-1. - Referring to
FIG. 5C , the second lift-off layer 122 is etched by using a pattern of thesecond photoresist 132 ofFIG. 5B as an etch mask. - The second lift-
off layer 122 may includes the fluoropolymer, and the etchant may include a solvent that may etch the fluoropolymer. - The etchant may include a first solvent including fluorine. The first solvent may include hydrofluoroether, like in the first process. The first solvent may include a material different from that in the first process.
- A portion of the second lift-
off layer 122 formed over the second anodelower electrode 102 to correspond to the first portion 132-1 is etched during an etching process. The second lift-off layer 122 may be etched to form a second undercut profile UC2 under a boundary surface of the first portion 132-1 of thesecond photoresist 132 and to be spaced apart by a predetermined interval from a side surface of the second anodelower electrode 102. The second undercut profile UC2 may allow the second anodeupper electrode 142 to cover an inclined surface that is an end of the pixel-definingfilm 110 in a subsequent deposition process. - Referring to
FIG. 5D , the second anodeupper electrode 142 is formed on a structure of FIG. SC. The second anodeupper electrode 142 may include, for example, various metals. The second anodeupper electrode 142 may include a material that is the same as or different from that of the first anodeupper electrode 141. The second anodeupper electrode 142 may include a material with a reducibility higher than that of the second anodelower electrode 102. For example, the second anodeupper electrode 142 may include silver with a high reducibility. - A part of the second anode
upper electrode 142 may be deposited to directly contact a top surface of the second anodelower electrode 102, and a part of the second anodeupper electrode 142 may be deposited to contact the inclined surface that is the end of the pixel-definingfilm 110, using the second lift-off layer 122 and thesecond photoresist 132 as masks. Accordingly, an emission area may be increased and defects due to a residue generated in a subsequent lift-off process may be reduced. - Referring to
FIG. 5E , the second organicfunctional layer 152 is formed on a structure ofFIG. 5D . - The second organic
functional layer 152 includes a second organic emission layer. Also, the second organicfunctional layer 152 may further include at least one functional layer from among a hole injection layer, a hole transport layer, an electron transport layer, and an electron injection layer. - The second organic
functional layer 152 may be formed by using, for example, a vacuum deposition method, like the second anodeupper electrode 142. In a deposition process, the second lift-off layer 122 and thesecond photoresist 132 may function as deposition masks. A part of the second organicfunctional layer 152 is formed to cover a top surface of the second anodeupper electrode 142 and another part of the second organicfunctional layer 152 is formed on the second portion 132-2 of thesecond photoresist 132. - Referring to
FIG. 5F , the secondauxiliary cathode 182 is formed on a structure ofFIG. 5E . - The second
auxiliary cathode 182 may be formed by using, for example, a vacuum deposition method, like the second anodeupper electrode 142 and the second organicfunctional layer 152. In a deposition process, the second lift-off layer 122 and thesecond photoresist 132 may function as deposition masks. A part of the secondauxiliary cathode 182 is formed to cover a top surface of the second organicfunctional layer 152 and another part of the secondauxiliary cathode 182 is formed on the second portion 132-2 of thesecond photoresist 132 other than the first portion 132-1. - The second
auxiliary cathode 182 may include a material that is the same as or different from that of the firstauxiliary cathode 181. The secondauxiliary cathode 182 may include the same material as that of thecathode 180 that is a common electrode. In another implementation, the secondauxiliary cathode 182 may be formed of a material different from that of thecathode 180. The secondauxiliary cathode 182 may function as a barrier for protecting the second organicfunctional layer 152 from a solvent used in a subsequent lift-off process. - Referring to
FIG. 5G , a lift-off process is performed on a structure ofFIG. 5F . - The second lift-
off layer 122 may include the fluoropolymer, and a second solvent including fluorine may be used in the lift-off process. Since the second organicfunctional layer 152 may be formed and then the lift-off process may be performed, the second solvent may include a material having a low reactivity with the second organicfunctional layer 152. The second solvent may include, for example, hydrofluoroether, like the first solvent. - When the second lift-
off layer 122 formed under the second portion 132-2 of thesecond photoresist 132 is lifted off, portions of the second anodeupper electrode 142, the second organicfunctional layer 152, and the secondauxiliary cathode 182 formed over the second portion 132-2 of thesecond photoresist 132 are removed, and portions of the second anodeupper electrode 142, the second organicfunctional layer 152, and the secondauxiliary cathode 182 formed over the second anodelower electrode 102 remain as patterns. - After the second process is performed, a third process of forming the third organic functional layer 153 (see
FIG. 6G ) (which may emit light of a color different from those of the first organicfunctional layer 151 and the second organic functional layer 152) may be performed on an area where the third anodelower electrode 103 is located. - The third process will now be explained with reference to
FIGS. 6A through 6G . - Referring to
FIG. 6A , a third lift-off layer 123 and a third photoresist 333, which may each include a fluoropolymer, are sequentially formed on thesubstrate 100 on which the first through third anodelower electrodes functional layers - The third lift-
off layer 123 may be formed by using, for example, a coating method, a printing method, and a deposition method. The third lift-off layer 123 may be formed of the same material as those/that of the first and/or the second lift-offlayers - The
third photoresist 133 may be exposed and developed by using a third photomask. Thethird photoresist 133 may be a positive photoresist or a negative photoresist. In the present example embodiment, the third photoresist is described as a positive photoresist. - Referring to
FIG. 6B , thethird photoresist 133 is patterned. Thethird photoresist 133 is exposed and developed to be removed at a first portion 133-1 corresponding to the third anodelower electrode 103 and to remain at a second portion 133-2 other than the first portion 133-1. - Referring to
FIG. 6C , the third lift-off layer 123 may be etched by using a pattern of thethird photoresist 133 ofFIG. 6B as an etch mask. - The third lift-
off layer 123 may include the fluoropolymer, and the etchant may include a solvent that etches the fluoropolymer. - The etchant may include a first solvent including fluorine. The first solvent may include, for example, hydrofluoroether, like in the first and second processes. The first solvent may include a material different from that in the first and second processes.
- A portion of the third lift-
off layer 123 formed over the third anodelower electrode 103 to correspond to the first portion 133-1 is etched during an etching process. The third lift-off layer 123 may be etched to form a third undercut profile UC3 under a boundary surface of the first portion 133-1 of thethird photoresist 133 and to be spaced apart by a predetermined interval from a side surface of the third anodelower electrode 103. The third undercut profile UC3 may allow the third anodeupper electrode 143 to cover an inclined surface that is an end of the pixel-definingfilm 110 in a subsequent deposition process. - Referring to
FIG. 6D , the third anodeupper electrode 143 is formed on a structure ofFIG. 6C . The third anodeupper electrode 143 may include various metals. The third anodeupper electrode 143 may include a material that is the same as or different from those of the first and second anodeupper electrodes upper electrode 143 may include a material with a reducibility higher than that of the third anodelower electrode 103. For example, the third anodeupper electrode 143 may include silver with a high reducibility. - A part of the third anode
upper electrode 143 may be deposited to directly contact a top surface of the third anodelower electrode 103 and a part of the third anodeupper electrode 143 may be deposited to contact the inclined surface that is the end of the pixel-definingfilm 110, using the third lift-off layer 123 and thethird photoresist 133 as masks. Accordingly, an emission area may be increased and defects due to a residue generated in a subsequent lift-off process may be reduced. - Referring to
FIG. 6E , the third organicfunctional layer 153 is formed on a structure ofFIG. 6D . - The third organic
functional layer 153 includes a third organic emission layer. Also, the third organicfunctional layer 153 may further include at least one functional layer from among a hole injection layer, a hole transport layer, an electron transport layer, and an electron injection layer. - The third organic
functional layer 153 may be formed by using, for example, a vacuum deposition process, like the third anodeupper electrode 143. In a deposition process, the third lift-off layer 123 and thethird photoresist 133 function as deposition masks. A part of the third organicfunctional layer 153 is formed to cover a top surface of the third anodeupper electrode 143 and another part of the third organicfunctional layer 153 is formed on the second portion 133-2 of thethird photoresist 133. - Referring to
FIG. 6F , the thirdauxiliary cathode 183 is formed on a structure ofFIG. 6E . - The third
auxiliary cathode 183 may be formed by using, for example, a vacuum deposition method, like the third anodeupper electrode 143 and the third organicfunctional layer 153. In a deposition process, the third lift-off layer 123 and thethird photoresist 133 function as deposition masks. A part of the thirdauxiliary cathode 183 is formed to cover a top surface of the third organicfunctional layer 153 and another part of the thirdauxiliary cathode 183 is formed on the second portion 133-2 of thethird photoresist 133 other than the first portion 133-1. - The third
auxiliary cathode 183 may include a material that is the same as or different from those of the first and secondauxiliary cathodes auxiliary cathode 183 may include the same material as that of thecathode 180 that is a common electrode. Alternatively, the thirdauxiliary cathode 183 may be formed of a material different from that of thecathode 180. The thirdauxiliary cathode 183 may function as a barrier for protecting the third organicfunctional layer 153 from a solvent used in a subsequent lift-off process. - Referring to
FIG. 6G , a lift-off process is performed on a structure ofFIG. 6F . - The third lift-
off layer 123 may include the fluoropolymer, and a second solvent including fluorine may be used in the lift-off process. Since the third organicfunctional layer 153 may be formed and then the lift-off process may be performed, the second solvent may include a material having a low reactivity with the third organicfunctional layer 153. The second solvent may include, for example, hydrofluoroether, like the first solvent. - When the third lift-
off layer 123 formed under the second portion 133-2 of thethird photoresist 133 is lifted off, portions of the third anodeupper electrode 143, the third organicfunctional layer 153, and the thirdauxiliary cathode 183 formed over the second portion 133-2 of thethird photoresist 133 are removed and the third anodeupper electrode 143, the third organicfunctional layer 153, and portions of the thirdauxiliary cathode 183 formed over the third anodelower electrode 103 remain as patterns. - The first through third organic
functional layers functional layers functional layers functional layers display apparatus 1. - Also, the organic light-emitting
display apparatus 1 ofFIG. 1 may include one unit pixel. Also, the present example embodiment may be applied to an organic light-emitting display apparatus including a plurality of the unit pixels ofFIG. 1 . Thus, in the first process, a plurality of the first organicfunctional layers 151 that emit light of a first color may be simultaneously formed. In the second process, a plurality of the second organicfunctional layers 152 that emit light of a second color may be simultaneously formed. In the third process, a plurality of the third organicfunctional layers 153 that emit light of a third color may be simultaneously formed. Light of full colors may be formed by using the first through third processes. - Referring back to
FIG. 1 , thecathode 180 is formed on a structure ofFIG. 6G . Thecathode 180 may be integrally formed as a common electrode on the first through third organicfunctional layers film 110. - Although the first through third anode
lower electrodes upper electrodes auxiliary cathodes cathode 180 are electron injection electrodes in the present example embodiment, the present disclosure is not limited thereto and electron injection electrodes may be formed on an area where the first through third anodelower electrodes upper electrodes auxiliary cathodes cathode 180 are located. - In a general process of depositing an organic functional layer by using a metal mask having an opening, it may be difficult to apply the metal mask to an ultra-high resolution panel due to a difficulty in precision processing, for example, due to a thickness and alignment tolerance, and it may be difficult to increase a size of the metal mask due to warping due to a weight of a metal. According to the present disclosure, patterns of the first through third organic
functional layers -
FIGS. 7A through 7D are cross-sectional views for explaining some processes of an organic light-emittingdisplay apparatus 2 according to a comparative example. - Referring to
FIG. 7A , the pixel-definingfilm 110 that covers ends of the first through third anodelower electrodes substrate 100 to be spaced apart from one another is formed. The first lift-off layer 121 and thefirst photoresist 131 are sequentially stacked, and thefirst photoresist 131 is patterned through exposure and development. Thefirst photoresist 131 is removed at the first portion 131-1 corresponding to the first anodelower electrode 101 and remains at the second portion 131-2 other than the first portion 131-1. - The first undercut profile UC1 is formed under a boundary surface of the first portion 131-1 of the
first photoresist 131 by etching the first lift-off layer 121 by using a pattern of thefirst photoresist 131 as an etch mask. A portion of the first lift-off layer 121 formed over the first anodelower electrode 101 to correspond to the first portion 131-1 is etched. The first lift-off layer 121 including a fluoropolymer may not be completely removed and a residue P1 may remain on the first anodelower electrode 101 as shown inFIG. 7A . - Referring to
FIG. 7B , the first organicfunctional layer 151 and the firstauxiliary cathode 181 are deposited on a structure ofFIG. 7A . - Referring to
FIG. 7C , a lift-off process is performed on a structure ofFIG. 7B . In this case, the first lift-off layer 121 including the fluoropolymer may not be completely removed and a residue P2 may remain on the second anodelower electrode 102 as shown inFIG. 7C . - The residue P1 on the first anode
lower electrode 101 and the residue P2 on the second anodelower electrode 102 may degrade hole or electron injection characteristics from an electrode to an organic functional layer. - However, according to the an example embodiment, in a lift-off process, the first through third anode
upper electrodes lower electrodes lower electrodes functional layers -
FIG. 7D is a cross-sectional view of the organic light-emittingdisplay apparatus 2 according to the comparative example after first through third processes are completed. -
FIG. 8 is a view for comparing sizes of emission areas of the organic light-emittingdisplay apparatus 1 according to the present example embodiment and the organic light-emittingdisplay apparatus 2 according to the comparative example. - Referring to
FIG. 8 , in the organic light-emittingdisplay apparatus 2 according to the comparative example, since the pixel-definingfilm 110 covers an end of the first anodelower electrode 101 and then the first organicfunctional layer 151 is formed, an emission area EA2 is defined as a portion of the first anodelower electrode 101 that is not covered by the pixel-definingfilm 110. - However, in the organic light-emitting
display apparatus 1 according to the present example embodiment, the first anodeupper electrode 141 is formed on a top surface of the first anodelower electrode 101 and on an inclined surface that is an end of the pixel-definingfilm 110 and then the first organicfunctional layer 151 is formed on the first anodeupper electrode 141. Thus, an emission area EA1 is greater than the emission area EA2 of the comparative example. Accordingly, an aperture ratio of a display apparatus may be increased. -
FIG. 9 is a cross-sectional view of an organic light-emittingdisplay apparatus 3 according to another example embodiment. - The organic light-emitting
display apparatus 3 ofFIG. 9 is different from the organic light-emittingdisplay apparatus 1 in that specific materials are selected as materials of the first anodelower electrode 103 and the first anodeupper electrode 141. - In a case A of
FIG. 9 , the first anodelower electrode 103 is formed of indium tin oxide and the first anodeupper electrode 141 is formed of silver. In a case B ofFIG. 9 , the first anodelower electrode 103 has a stacked structure formed of aluminum (Al) and indium tin oxide, and the first anodeupper electrode 141 is formed of silver Ag. - Silver is a metal with a high reducibility. Thus, when the silver is used as a material of the first anode
lower electrode 101, silver ions receiving electrons in an etching process for forming a pattern of the first anodelower electrode 101 may be re-precipitated to form particles, thereby leading to defects. -
FIGS. 11A and 11B are views illustrating particle defect patterns according to whether the first anodelower electrode 101 includes silver.FIG. 11A illustrates a result obtained after a lift-off process is performed when the first anodelower electrode 101 does not include silver.FIG. 11B illustrates a result obtained after a lift-off process is performed when the first anodelower electrode 101 includes silver. - In
FIG. 11B , when the first anodelower electrode 101 includes silver, many particle defects occur. However, as in the present example embodiment, when the first anodelower electrode 101 does not include a silver component and the first anodeupper electrode 141 includes a silver component, particle defects of a display apparatus may be reduced. - Although silver is a metal with a high reflectance, it may be difficult to use silver as a single metal, for example, due to a reaction with oxygen or sulfur in the air. Thus, a silver alloy may be considered. However, a silver alloy may exhibit a reflectance lower than that of silver. In the present example embodiment, the first anode
upper electrode 141 is formed in a vacuum deposition process and the first anodeupper electrode 141 is blocked from external air in a subsequent encapsulation process. Thus, the first anodeupper electrode 141 may be formed of pure silver, instead of an alloy. -
FIG. 10 is a graph showing a relationship between a reflectance and a wavelength of each of pure silver and a silver alloy. Since the pure silver has a light reflectance higher than that of the silver alloy and an increase in a reflectance in blue wavelengths equal to or less than 500 nm is large, the efficiency of a blue device may be improved. - Although not shown in the drawings, each of the organic light-emitting display apparatuses may further include an encapsulation member that encapsulates an organic emission layer. The encapsulation member may include a glass substrate, a metal foil, and a thin-film encapsulation layer in which an inorganic layer and an organic layer are combined.
- As described above, embodiments may provide an organic light-emitting display apparatus that may reduce defects and manufacturing costs, and a method of manufacturing the organic light-emitting display apparatus.
- According to an embodiment, an emission layer may be formed without using a fine metal mask (FMM), and a high resolution display panel may be formed.
- Also, according to an embodiment, an anode upper electrode may be deposited in a vacuum. Thus, defects due to a residue formed in a lift-off process may be reduced.
- Also, according to an embodiment, an anode upper electrode may be deposited to extend to an inclined surface of a pixel-defining film. Thus, an emission area may be increased and an aperture ratio of a display apparatus may be increased.
- Also, according to an embodiment, an anode lower electrode may not include silver. Thus, particle defects due to silver may be avoided.
- While one or more embodiments have been described with reference to the figures, it will be understood by those of ordinary skill in the art that various changes in form and details may be made therein without departing from the spirit and scope as defined by the following claims.
- Example embodiments have been disclosed herein, and although specific terms are employed, they are used and are to be interpreted in a generic and descriptive sense only and not for purpose of limitation. In some instances, as would be apparent to one of ordinary skill in the art as of the filing of the present application, features, characteristics, and/or elements described in connection with a particular embodiment may be used singly or in combination with features, characteristics, and/or elements described in connection with other embodiments unless otherwise specifically indicated. Accordingly, it will be understood by those of skill in the art that various changes in form and details may be made without departing from the spirit and scope of the present invention as set forth in the following claims.
Claims (20)
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