US20170236974A1 - Light emitting device with transparent conductive group-iii nitride layer - Google Patents

Light emitting device with transparent conductive group-iii nitride layer Download PDF

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Publication number
US20170236974A1
US20170236974A1 US15/429,603 US201715429603A US2017236974A1 US 20170236974 A1 US20170236974 A1 US 20170236974A1 US 201715429603 A US201715429603 A US 201715429603A US 2017236974 A1 US2017236974 A1 US 2017236974A1
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layer
transparent
current
current aperture
aperture stop
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Marco MALINVERNI
Marco Rossetti
Antonino Francesco CASTIGLIA
Nicolas Pierre Grandjean
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Exalos AG
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Exalos AG
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Assigned to EXALOS AG reassignment EXALOS AG ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: GRANDJEAN, NICOLAS PIERRE, ROSSETTI, MARCO, Castiglia, Antonino Francesco, MALNVERNI, MARCO
Publication of US20170236974A1 publication Critical patent/US20170236974A1/en
Priority to US16/249,981 priority Critical patent/US10600934B2/en
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    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
    • H01L33/14—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a carrier transport control structure, e.g. highly-doped semiconductor layer or current-blocking structure
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    • H01L33/0062—Processes for devices with an active region comprising only III-V compounds
    • H01L33/0075—Processes for devices with an active region comprising only III-V compounds comprising nitride compounds
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    • H01L33/26—Materials of the light emitting region
    • H01L33/30—Materials of the light emitting region containing only elements of Group III and Group V of the Periodic Table
    • H01L33/32—Materials of the light emitting region containing only elements of Group III and Group V of the Periodic Table containing nitrogen
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    • H01L33/26—Materials of the light emitting region
    • H01L33/30—Materials of the light emitting region containing only elements of Group III and Group V of the Periodic Table
    • H01L33/32—Materials of the light emitting region containing only elements of Group III and Group V of the Periodic Table containing nitrogen
    • H01L33/325—Materials of the light emitting region containing only elements of Group III and Group V of the Periodic Table containing nitrogen characterised by the doping materials
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    • H01S5/3054—Structure or shape of the active region; Materials used for the active region characterised by the doping materials used in the laser structure p-doping
    • H01S5/3063—Structure or shape of the active region; Materials used for the active region characterised by the doping materials used in the laser structure p-doping using Mg
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    • H01S5/183—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities having only vertical cavities, e.g. vertical cavity surface-emitting lasers [VCSEL]
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    • H01S5/2054—Methods of obtaining the confinement
    • H01S5/2059—Methods of obtaining the confinement by means of particular conductivity zones, e.g. obtained by particle bombardment or diffusion
    • H01S5/2068—Methods of obtaining the confinement by means of particular conductivity zones, e.g. obtained by particle bombardment or diffusion obtained by radiation treatment or annealing
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    • H01S5/00—Semiconductor lasers
    • H01S5/20—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers
    • H01S5/22—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure
    • H01S5/223—Buried stripe structure
    • H01S5/2231—Buried stripe structure with inner confining structure only between the active layer and the upper electrode
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    • H01S5/30—Structure or shape of the active region; Materials used for the active region
    • H01S5/32—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures
    • H01S5/323—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser
    • H01S5/32308—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser emitting light at a wavelength less than 900 nm
    • H01S5/32341—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser emitting light at a wavelength less than 900 nm blue laser based on GaN or GaP

Definitions

  • the invention relates to the field of semiconductor-based light emitters and in particular to light emitters based on nitrides of group III elements. It relates to the devices themselves and also to methods for manufacturing such devices. Such devices can be or include, e.g., LEDs or lasers.
  • “Vertical” in the present description denotes directions in which layer growth takes place. In usual wafer level manufacturing techniques, vertical directions are aligned perpendicular to the plane described by the wafer.
  • “Lateral” in the present description denotes directions which are perpendicular to vertical directions, i.e. denotes directions parallel to the wafer plane.
  • Mg-doped III-nitride layers are complicated to deal with due to the fact that the dopant, i.e. Mg, has a high activation energy (low hole concentrations despite high Mg concentrations) and since activation/passivation of the Mg dopant is accomplished by heat treatments and by interaction with hydrogen, respectively.
  • Mg-doped III-nitride layers frequently have a high resistivity, e.g., in light-emitting p-i-n junctions. And control of the quality of metallic or semitransparent conductive contacts to the layers is difficult.
  • An object of the present disclosure is to describe ways of achieving a particularly high conversion efficiency, i.e. having a particularly high light output per inputted electrical energy, as well as to describe corresponding devices.
  • Another object of the present disclosure is to describe ways of achieving a particularly high-intensity light emission, as well as to describe corresponding devices.
  • Another object of the present disclosure is to describe ways of achieving very homogeneous current spreading, in particular lateral current spreading, of injection currents for light emission, as well as to describe corresponding devices.
  • Another object of the present disclosure is to describe ways of achieving particularly low contact resistances towards electrical contacts of devices and/or towards a semiconductor layer of a light-emitting semiconductor structure of a device, as well as to describe corresponding devices.
  • Another object of the present disclosure is to describe ways of achieving a high transparency of layers though which light is emitted from a light-emitting semiconductor structure, as well as to describe corresponding devices.
  • Another object of the present disclosure is to describe ways of achieving a high light emission density, as well as to describe corresponding devices.
  • a device which comprises
  • the transparent layer is present on the first layer.
  • the transparent layer and the first layer can share a common interface.
  • the transparent layer and the first layer can be in direct contact, e.g., the transparent layer can be deposited directly on the first layer.
  • the transparent layer can be present on the first layer (such as on a portion of the first layer) with no further layer present between them (in the range of said portion).
  • the transparent layer can have a low resistivity.
  • the transparent layer can have a resistivity so low that it can be considered an electrically conductive layer.
  • the resistivity of the transparent layer can be, e.g., below 5 ⁇ 10 ⁇ 4 ⁇ cm or even below 2 ⁇ 10 ⁇ 4 ⁇ cm. In instances, the resistivity of the transparent layer is at most 1 ⁇ 10 ⁇ 4 ⁇ cm.
  • the electrical conductivity of the transparent layer can exceed the conductivity of the first layer by a factor of at least 10, e.g., of at least 50. In instances, the electrical conductivity of the transparent layer exceeds the electrical conductivity of the first layer by a factor of at least 100.
  • the very high conductivity (or equivalently: low resistivity) of the transparent layer can result in excellent (lateral) current spreading properties of the transparent layer.
  • Holes in p-doped III-nitride layers have large effective mass, which results in a typically lower mobility if compared to n-doped layers.
  • Mg (which apparently is the only known p-dopant to date) is a deep acceptor, and only a small fraction of the atoms in the crystal are ionized to provide holes in the valence band.
  • the transparent layer can be provided for injecting charge carriers into the first layer or for receiving charge carriers from the first layer.
  • the transparent layer can be a layer of a nitride of, e.g., one or more of Ga, Al, In.
  • the transparent layer can be transparent to UV light and/or to visible light.
  • the light emittable from the semiconductor layer can be UV light or visible light.
  • the device can be a light emitting device. It can be, e.g., an edge emitting semiconductor device such as an edge emitting laser, a vertical cavity surface emitting laser (VCSEL), a light emitting diode (LED), an RCLED (resonant cavity LED).
  • an edge emitting semiconductor device such as an edge emitting laser, a vertical cavity surface emitting laser (VCSEL), a light emitting diode (LED), an RCLED (resonant cavity LED).
  • the semiconductor structure can be, e.g., any known light-emitting semiconductor structure, such as a p-i-n layer stack (p-doped layer, intrinsic layer, n-doped layer) or a p-n layer stack (p-doped layer, n-doped layer).
  • a p-i-n layer stack p-doped layer, intrinsic layer, n-doped layer
  • a p-n layer stack p-doped layer, n-doped layer
  • the first and second layers are doped semiconducting layers.
  • the first layer can be of a first doping type and the second layer of a second, opposite doping type.
  • the first layer can be p-type (i.e., p-doped), while the second layer is n-type (i.e., n-doped).
  • the first layer can be in other embodiments n-type (i.e. n-doped), while the second layer is p-type (i.e., p-doped).
  • the first layer is p-type and the second layer is n-type.
  • Mg is mentioned as p-type dopant for the first layer.
  • corresponding n-type dopants can be, e.g., Si or O or Ge.
  • the semiconductor structure has an active region in which the light is generated.
  • the active region coincides with the i-layer; in case of a p-n structure, the active region coincides with the interface between the p-doped and the n-doped layer.
  • the first layer is a III-nitride.
  • it can comprise the same III-nitride as the transparent layer does.
  • the transparent layer is made of Al x Ga y In 1-x-y N (with 0 ⁇ x ⁇ 1; 0 ⁇ y ⁇ 1)
  • the first layer can be made of Al x Ga y In 1-x-y N (with identical x and y).
  • the second layer and/or (if present), to an i-layer between the first and second layer can be a III-nitride layer.
  • the semiconductor structure is an epitaxial structure, e.g., a homoepitaxial layer stack.
  • the first layer, the second layer and, if present, an i-layer between the first and second layer can all be layers made of Al x Ga y In 1-x-y N (with 0 ⁇ x ⁇ 1; 0 ⁇ y ⁇ 1), with different or with the same x and y, but usually differing in their respective dopants and/or dopant concentrations.
  • the transparent layer can be an epitaxial with the first layer, in instances even a homoepitaxial layer. It can be of the same doping type or of the opposite doping type.
  • Epitaxial layers can show a high crystal quality and can thus have low resistivities and high degrees of transparency. Moreover, layer-to-layer interface resistances can be particularly low.
  • the transparent layer can alternatively have a different crystallinity and, e.g., be a polycrystalline layer.
  • light produced in the semiconductor structure is emitted through the transparent layer. This can facilitate the manufacture of top-emitting devices such as VCSELs.
  • the device comprises a substrate, the second layer being arranged between the substrate and the first layer. It is, however, also possible to manufacture the device without an additional substrate and/or to provide a substrate (with the second layer being arranged between the substrate and the first layer) during some manufacturing steps and to remove the substrate in a later processing step.
  • the semiconductor structure can be produced in any known way.
  • the semiconductor structure can be produced by MOVPE (Metal Organic Vapor Phase Epitaxy).
  • MOVPE Metal Organic Vapor Phase Epitaxy
  • at least the first layer is produced by MOVPE.
  • the semiconductor structure comprises an i-layer, at least the i-layer and, e.g., also the first layer, can be produced by MOVPE.
  • MOVPE Metal Organic Chemical Vapor Deposition
  • the dopant can be present in a passivated state, e.g., due to the presence of H (hydrogen in the layer).
  • a heat treatment also referred to as “annealing” can be applied, e.g., by heating to a temperature between 400° C. and 900° C.
  • the transparent layer is deposited after an activation, step has been accomplished in which passivated dopant present in the first layer is activated, e.g., in an above-described way.
  • a deposition technique can be used which is different from the deposition technique used for depositing the first layer.
  • the transparent layer can be produced by, e.g., MBE (Molecular Beam Epitaxy).
  • deposition techniques e.g., vacuum deposition techniques (in particular chemical vapor deposition techniques or physical vapor deposition techniques), can be used, such as sputtering, atomic layer deposition, pulsed laser deposition.
  • MBE can make possible epitaxial, e.g., homoepitaxial, growth of the transparent layer. This can result in very low resistitivies and interface resistances and good transparency.
  • the transparent layer can, accordingly, be “regrown” on the first layer.
  • Low resistances at interfaces between the first layer and the transparent layer can be achieved when the transparent layer adopts the lattice structure and lattice constant from the first layer.
  • the transparent layer can have a high degree of crystallinity, which can result in a low percentage of non-radiative recombination and thus in high conversion efficiency.
  • a full-width at half maximum (FWHM) of an Omega rocking curve in X-ray diffraction can be below 2° or rather below 1°.
  • the low resistivities of the transparent layer mentioned above can be achieved by high point defect concentrations in the transparent layer.
  • the point defects can be vacancies (i.e., missing atoms in the lattice) or can be impurities such as foreign atoms in the lattice, which can be, e.g., dopants.
  • Point defect concentrations in the transparent layer can be, e.g., at least 5 ⁇ 10 19 /cm 3 . They can be, e.g., up to 1 ⁇ 10 21 /cm 3 . In some embodiments, the point defect concentration in the transparent layer is between 5 ⁇ 10 19 /cm 3 and 5 ⁇ 10 20 /cm 3 .
  • the foreign atoms in the lattice of the transparent layer can be one or more of Si, O, C, Mg, Be, Ge, Zn, Ti.
  • the first layer is a p-doped layer, e.g., with Mg as dopant
  • the transparent layer is an n-doped layer, e.g., doped with Si and/or with O. But also other foreign atoms may be present (cf. above).
  • the first layer and the transparent layer are both p-doped layers, e.g., both with Mg as dopant.
  • n-type transparent layers For n-type transparent layers, it is, with technologies currently at hand, easier to achieve high conductivities than for p-type layers, as has been explained above.
  • the transparent layer can be used for efficient injection of charge carriers from the transparent layer into the first layer or from the first layer into the transparent layer, in response to application of an electric field across the transparent layer and the first layer.
  • the electric field can extend across the semiconductor structure and the transparent layer.
  • the transparent layer and the first layer are, in some embodiments, in direct contact with each other (and thus form a common interface) over the full lateral extension of the transparent layer and/or of the first layer.
  • a current aperture stop can be provided. This can also be beneficial if one or more electrical contacts are provided on one or more portions of the transparent layer, in particular in case a precision with which the electrical contact(s) are laterally positioned is low, e.g., is lower than a precision with which the current aperture stop can be laterally positioned.
  • the device can comprise a current aperture stop between a portion of the semiconductor structure and a portion of the transparent layer.
  • the first layer and the transparent layer establish their common interface which has been mentioned above already.
  • the common interface can be, e.g., extended also across a portion of the transparent layer and, in instances, also across a portion of the first layer.
  • the current aperture stop can be provided for confining electrical currents flowing from the transparent layer through the first layer into the active region or vice versa.
  • the current aperture stop laterally encircles a portion of the first layer. In particular, it can do so in a common vertical range in which both, the current aperture stop and the first layer are present.
  • the transparent layer can be epitaxially (and even homoepitaxially) grown on the current aperture stop, as this can result in particularly good crystallinity of the transparent layer.
  • the current aperture stop can be epitaxially or even homoepitaxially with the first layer. This can be achieved in various ways some of which will be explained.
  • the current aperture stop is (e.g., epitaxially) grown on the first layer.
  • the current aperture stop is created in the first layer. This can be accomplished, e.g., without having to grow another layer establishing the current aperture stop.
  • impurity concentrations such as, e.g., co-dopant concentrations, can be locally changed in order to produce the current aperture stop and/or a status (activated or passivated) of a dopant in the first layer can be locally changed in order to produce the current aperture stop in the first layer.
  • a resistive material i.e., a material having a resistivity exceeding the resistivity of the first layer to establish the current aperture stop
  • the current aperture stop can be made of a (relatively) high resistivity material.
  • material comprised in the current aperture stop can have a resistivity of at least 10 times the resistivity of the first layer, or even of at least 100 times the resistivity of the first layer.
  • material comprised in the current aperture stop can have a resistivity of at least 5.10 ⁇ 2 ⁇ cm or even of at least 1 ⁇ cm.
  • a current effecting the light emission in the semiconductor structure can be confined and/or the light emission from the semiconductor structure can be confined.
  • the before-mentioned common interface of the transparent layer and the first layer can be surrounded, e.g., be fully encircled, by the current aperture stop.
  • the current aperture stop is present between the transparent layer and the first layer (laterally outside an area taken by said common interface). This way, e.g., the first layer can have its full lateral extension where it is close to the active region of the semiconductor structure. This can result in a high light output.
  • the current aperture is present between an active region of the semiconductor structure and the transparent layer (laterally outside an area taken by said common interface).
  • active region such as an i-layer of the semiconductor structure or the p-n-interface in case of a semicondcutor structure of p-n type
  • active region can have its full lateral extension. This can result in a high light output.
  • the current aperture stop epitaxially (or even homoepitaxially) with the first layer and/or to have the transparent layer epitaxially (or even homoepitaxially) with the current aperture stop.
  • the base on which the transparent layer is deposited can have the same crystal properties where the first layer establishes said base (i.e. in the lateral region of the current aperture) and where the current aperture stop establishes said base. Accordingly, a low defect density can be achieved not only where the transparent layer interfaces the current aperture stop and where it interfaces the first layer, but also where the current aperture stop abuts the current aperture.
  • the transparent layer laterally overlaps the current aperture stop.
  • One or more electrical contacts of the device for applying currents for effecting the light emission
  • Producing the current aperture can be accomplished, e.g., in one of the following ways:
  • a dopant in the first layer is selectively activated.
  • the first layer contains a passivated dopant.
  • H hydrogen
  • a passivated dopant can be produced, e.g., by applying an additional process step in which the dopant (which previously was not passivated) is passivated.
  • a diffusion-inhibiting mask can be selectively deposited on the first layer in the (lateral) region(s) where the current aperture stop shall be established, and then passivating atoms are removed from the non-masked region(s) of the first layer such as by diffusion, e.g., promoted by a heat treatment such as by heating to above 450° C. This way, a thickness of the current aperture stop identical with the thickness of the first layer can be achieved. Before applying the transparent layer, the diffusion-inhibiting mask can be removed.
  • device portions can be produced (namely the current aperture stop and the first layer portion establishing the current aperture) which are located laterally next to each other (e.g., abutting each other) and located on the same vertical level, and which have different resistivities.
  • they can have strongly different concentrations of passivated and activated dopant. E.g., while in the current aperture, more than 40% or even more than 50% of the doping atoms are activated, in the current aperture stop, less than 5% of the doping atoms are activated.
  • a portion of the first layer (with activated dopants) is converted into the current aperture stop by increasing a resistivity therein by locally introducing impurities (foreign atoms) into the first layer.
  • the foreign atoms can be co-dopants, such as n-dopants, e.g., Si or O or Ge, in case the first layer is a p-layer, e.g., with Mg as dopant, or can be atoms which passivate the dopant(s) in the first layer, such as H atoms in III-nitrides which are p-doped by Mg. Or they can be other types of atoms such as Ti, Ar, C, Cl which increase resistivity, e.g., of III-nitrides which are p-doped by Mg, by mechanisms which are today partially not yet completely understood.
  • the dopant(s) in the first layer is (are), after deposition, initially passivated, e.g., by H atoms passivating Mg atoms as dopant (cf. the example above with p-doped III-nitride), the dopant(s) can be activated before the local introduction of impurities into the first layer. This can be accomplished, e.g., by the before-mentioned heat treatment.
  • a thickness of a current aperture stop produced in the second embodiment can be smaller than a thickness of the first layer; and accordingly in this case, the current aperture layer can be located between the first layer and the transparent layer.
  • a diffusion-promoting mask is locally applied to regions where the current aperture stop shall be established, wherein the mask contains said impurity atoms.
  • the current aperture stop is created.
  • a heat treatment such as heating to above 100° (and, optionally below 450° C.) can be applied.
  • diffusion-promoting masks are masks containing Ti (for Ti as impurities), masks containing Ge (for Ge as impurities), masks containing SiN (for Si as impurities), masks containing SiO 2 (for Si and/or O as impurities). Before applying the transparent layer, the diffusion-promoting mask can be removed.
  • a diffusion-inhibiting mask can be selectively deposited on the first layer in the (lateral) region where the current aperture shall be established, and then, impurities such as H, O, C, Si, Cl, Ar can be introduced into the first layer—in the region(s) not protected by the diffusion-inhibiting mask and thus in the region(s) where the current aperture stop shall be established.
  • impurities such as H, O, C, Si, Cl, Ar
  • a plasma can be applied which contains one or more types of the impurity atoms.
  • the plasma can be applied, e.g., at between 0.001 mbar and 0.2 mbar (or between 1 mTorr and 100 mTorr) pressure and at plasma power supply voltages between 50 V and 500 V.
  • the diffusion-inhibiting mask Before applying the transparent layer, the diffusion-inhibiting mask can be removed.
  • material of the current aperture stop is deposited on a portion of the semiconductor structure, e.g., on the first layer, so as to form the aperture stop, e.g. by means of MBE.
  • the material of the current aperture stop has a resistivity which is relatively higher than the resistivity of the first layer.
  • the material can be, e.g., intrinsic (non-intentionally doped) semiconductor material (e.g., a III-nitride) or co-doped material, e.g., containing a p-dopant such as Mg and one or more n-dopants such as Si, O.
  • material is also deposited in the (lateral) region of the current aperture such as on a removable mask present there, such material can be removed by removing the removable mask, e.g., in a lift-off technique.
  • the material of the current aperture stop in the third embodiment can be epitaxial and in particular even homoepitaxial with the material of the first layer.
  • the dopant(s) in the first layer is (are), after deposition, initially passivated, e.g., by H atoms passivating Mg atoms as dopant (cf. the example above with p-doped III-nitride), the dopant(s) can be activated before the local introduction of impurities into the first layer. This can be accomplished, e.g., by the before-mentioned heat treatment.
  • a portion of the first layer is removed in the (lateral) region(s) where the current aperture stop shall be established, e.g., by etching such as ion etching, e.g., with Cl ions. It is even possible to completely remove the first layer.
  • a protective mask such as an etch-protective mask (which can be identical with or, alternatively, different from the removable mask mentioned above) can be applied to the first layer in said region(s).
  • material of the current aperture stop is deposited, so as to form the aperture stop, e.g. by means of MBE.
  • the surface on which the transparent layer will be deposited can be a non-planar surface, but has a higher portion (on the current aperture stop) and a lower portion (on the first layer where it establishes the current aperture). Accordingly, the transparent layer can have a curved cross-section. This can, in instances lead to a somewhat increased density of dislocations of the transparent layer.
  • all layers of the semiconductor structure are III-nitride layers.
  • all layers of the current aperture stop are III-nitride layers.
  • the current aperture stop can be constituted by a single structured layer.
  • all layers of the transparent layer are III-nitride layers.
  • the transparent layer can be constituted by a single III-layer.
  • a composition of any of the III-nitride layers, in particular of those of the semiconductor structure, can vary along the vertical axis.
  • parameters x and y in Al x Ga y In 1-x-y N can vary along the growth axis in the first and/or in the second layer.
  • III-nitride layers can be epitaxially grown on each other even if they have different compositions in this sense.
  • the i-layer can comprise quantum wells.
  • dopant concentrations in layers of the device in particular in the first and/or in the second layer, can vary along the vertical axis.
  • the transparent layer can be used as a vertical injector, i.e. as a layer via which current is vertically guided. Resistances to electrical contacts (such as to metallic layers) can be minimized this way.
  • the transparent layer can be used as a horizontal current spreading layer, so as to ensure a good lateral distribution of currents flowing through the semiconductor structure.
  • the transparent layer can be used as an efficient transparent current injector.
  • the transparent layer can be deposited after activation of a dopant in the first layer grown by MOVPE such as a p-dopant, e.g., Mg.
  • the transparent layer can contain high levels of impurity atoms (e.g. silicon, oxygen, carbon, magnesium, beryllium, germanium, zinc) or other point defects (e.g., vacancies in the lattice structure of the III-nitride, e.g., N-vacancies) and can be mono- or poly-crystalline depending on technology and parameters used for growth/deposition.
  • Epitaxial monocrystalline III-nitride (which, however, can contain some degree of disclocations and of point defects) can make possible to achieve particularly low resistivities.
  • the current aperture laterally overlaps with an active region of the semiconductor layer.
  • the device comprises a first electrical contact (which is electrically conductive, e.g., metallic) and a second electrical contact (which is electrically conductive, e.g., metallic):
  • the first electrical contact can be present on (an be in direct contact with) the transparent layer.
  • charge carriers move in the following sequence (or vice versa) through the following constituents of the device: transparent layer, first layer, (if present: i-layer between first and second layer), second layer.
  • the device can be, e.g., any device herein described.
  • the first layer can be produced using metal organic vapor phase epitaxy (MOVPE). Also the second layer and, if present another layer between the first and the second layer such as a non-intentionally doped layer can be produced by MOVPE.
  • MOVPE metal organic vapor phase epitaxy
  • the transparent layer can be produced in a technique different from MOVPE and in particular in a technique in which the first layer is not exposed to hydrogen, such as using molecular beam epitaxy.
  • Transparent layers can be produced which have the before-mentioned common interface with the first layer and which share an interface with the current aperture stop. wherein the latter interface and said common interface are in one and the same plane. This way, the number of dislocations in the transparent layer can be very small which can result in low resistivities and/or high transparency.
  • FIG. 1 a device comprising a TCN layer and a current aperture stop
  • FIG. 2A a prior art GaAs-based VCSEL
  • FIG. 2B a prior art GaAs-based VCSEL with TCO current spreading layer
  • FIG. 3 a device without current aperture
  • FIG. 4 a flip chip LED device comprising a TCN layer
  • FIG. 5A an LED device comprising a TCN layer and current aperture stop, with non-conductive substrate;
  • FIG. 5B an LED device comprising a TCN layer and current aperture stop, with conductive substrate;
  • FIG. 6 a ridge waveguide laser diode device
  • FIG. 7 a stripe injection gain-guided laser device
  • FIG. 8 an air-cladding laser device
  • FIG. 9 a VCSEL device
  • FIG. 10 a device in which the current aperture stop extends from the TCN layer to the active region of the semiconductor structure
  • FIG. 11A a semiconductor structure on a substrate
  • FIG. 11B the semiconductor structure of FIG. 11A with a current aperture in the first layer
  • FIG. 11C a device obtained from the semiconductor structure of FIGS. 11A, 11B by applying the TCN layer across the current aperture and a portion of the first layer.
  • TCN layer or transparent layer a transparent and conductive III-nitride layer that can be present, e.g., on an uppermost Mg-doped layer of a III-nitride p-i-n junction grown by, e.g., conventional MOVPE.
  • FIG. 1 illustrates schematically such a device 10 in a cross-sectional view.
  • the TCN layer 5 grown as a monocrystalline layer (e.g. by MBE or MOVPE) or deposited as a polycrystalline layer (e.g., by sputtering, evaporation or atomic layer deposition), provides very low resistivity, in particular- to metallic contacts, and offers excellent transparency to UV and/or visible light.
  • the TCN layer 5 has a high concentration of impurities (like for example silicon, oxygen, carbon, magnesium, beryllium, germanium, zinc atoms) or other types of point defects, like for example Nitrogen vacancies.
  • the semiconductor structure 4 is a p-i-n structure, e.g., grown by MOVPE.
  • the p-doped layer 1 is also referred to as first layer 1
  • the n-doped layer 2 is also referred to as second layer 2
  • the layer 3 in between can be an i-layer, i.e. a non-intentionally doped layer.
  • Semiconductor structure 4 is post-growth thermally annealed to activate the p-dopant in the first layer 1 , i.e. to remove hydrogen bonded to the Mg dopant, and it can be also processed by conventional techniques (photolithography, etching, plasma passivation, ion implantation, etc.), e.g., to optionally create a current aperture 7 defined by a current aperture stop 6 before the growth/deposition of the TCN layer 5 .
  • III nitride based p-i-n structures 4 grown by MOVPE are current technology required for producing highly efficient and long-lifetime light-emitting diodes and laser diodes with emission in the UV or visible part of the spectrum.
  • MOVPE metal-organic vapor deposition
  • FIG. 2A illustrates a prior art GaAs-based VCSEL.
  • Metal contacts are referenced 8 and 9
  • reflectors are referenced 11 and 12 .
  • the open arrow indicates the direction of light emission.
  • TCO transparent conductive oxide layers
  • III-nitride layer in particular AlInGaN with any possible composition of Al, In and Ga atoms
  • MOVPE metal-organic vapor deposition
  • the as grown MOVPE structure comes with p-layers that are not active due to the magnesium being bond to hydrogen atoms that are widely present in the epitaxial growth environment.
  • the p-dopant is activated by post-growth thermal annealing and hydrogen segregation from the structure resulting therefrom.
  • the activation of the p dopant can be performed, e.g., either in-situ inside the MOVPE-growth equipment or ex-situ in a thermal annealing oven.
  • the semiconductor structure 4 can be processed to create one or more current apertures and then produce the TCN layer 5 (cf. FIG. 1 ), or the TCN layer 5 can be produced directly on first layer 1 . The latter case with no current aperture is illustrated in FIG. 3 .
  • the semiconductor structure 4 can be (in any embodiment) present on a substrate 18 .
  • the TCN layer e.g., a highly Si-doped GaN layer
  • MBE metal-organic chemical vapor deposition
  • a highly Si-doped GaN layer can be grown by MBE, e.g., over a conventional p-i-n structure 4 .
  • MOVPE metal-organic chemical vapor deposition
  • sputtering evaporation
  • evaporation can, in instances be used, too.
  • MBE can be carried out in a hydrogen-free environment. Therefore, using MBE or other hydrogen-free techniques for depositing the TCN layer 5 can prevent that Mg which is already present (in the first layer 1 ) is deactivated (by hydrogen present during deposition of the TCN layer 5 ).
  • the TCN layer 5 can be epitaxially grown over the existing structure (which includes the first layer 1 and, if present, also the current aperture stop 6 ) and thus offers an excellent crystalline purity and can therefore be designed for very high transparency to the light emitted from the active region of the underlying semiconductor structure 4 , i.e. from the i-layer in case of a p-i-n structure 4 .
  • LEDs Light emitting diodes
  • LDs laser diodes
  • TCN layer 5 e.g., regrown by means of MBE.
  • the inventors already have achieved contact resistances as low as 1 ⁇ 10 ⁇ 6 ⁇ cm ⁇ 2 (which is two orders of magnitude lower than in conventional devices without TCN layer 5 ), while no adverse effect on the optical performance or quality of the devices has been found.
  • one or more electrical contacts can be applied.
  • the device 10 can be, e.g., one of the devices sketched in the following.
  • the meaning of the reference symbols can be inferred from the previous Figures, where not explicitly explained.
  • the open arrows indicate directions of light emission.
  • Electrical contacts 8 , 9 can be metallic contacts.
  • the first layer 1 extends below the current aperture stop 6 .
  • a thickness of the current aperture stop 6 is identical to a thickness of the first layer 1 . While in illustrated embodiments above, only a portion of the first layer 1 is present in the lateral area defined by the current aperture 7 , in FIG. 10 , the whole first layer is present in the lateral area defined by the current aperture 7 .
  • FIGS. 11A, 11B, 11C illustrate method steps for manufacturing a device 10 .
  • the semiconductor structure 4 (which also can be considered the body of the light emitting device 10 ).
  • An example is illustrated in FIG. 11A . It includes one or more light emitting layers that are sandwiched between doped layers 1 , 2 of different type. P-type layers can be above, towards the surface of the device. N-type layers can be below, in between the light emitting layers and an optional substrate 18 .
  • Substrate 18 can be, e.g., free-standing III-nitride (e.g., GaN), sapphire, Silicon, SiC. It may include reflectors, in particular optical reflectors having a high reflectivity such as Bragg reflectors
  • i-layer 3 represents the active region of the semiconductor structure 4 .
  • one or more current aperture stops 6 can be produced (cf. FIG. 11B ), in particular in the semiconductor structure 4 and even more specifically in the first layer 1 .
  • a current aperture 7 can be located within the top p-layer 1 .
  • Current aperture 7 can have lower resistivity than the surrounding areas, i.e. than the current aperture stop 6 .
  • conductivity due to the p-type dopant can be, e.g., compensated by the presence of other impurities of different type, i.e. of n-type, like for example Si, Oxygen, Titanium, Carbon.
  • the p-type dopant (Mg) can be passivated by Hydrogen, in order to form the current aperture stop in the first layer 1 .
  • a current aperture stop 6 can also be considered a current confining area or current confining structure or current blocking structure.
  • the TCN layer 5 is applied on top.
  • the p-i-n structure 4 (more specifically a portion of the first layer 1 ) and the current aperture stop 6 are overgrown by the TCN layer, and thus by a transparent highly n-type or p-type doped III-layer (the group-III elements being one or more of Al, In, Ga).
  • the TCN layer 5 minimizes the resistance to metallic layers that can be deposited thereabove. And it can also provide a tunnel junction at the interface with the uppermost layer (first layer 1 ) for efficient current injection through the non-resistive current apertures, in case the TCN layer 5 is n-type doped and the first layer is p-type doped or vice versa.
  • the body of the light emitting device can be made by, e.g., MOCVD or MBE.
  • the current aperture 7 can be formed, e.g., from a first layer 1 which is a resistive p-layer, by decreasing the resistivity in local areas (where the current aperture shall be located), e.g., by removal of a type of impurities (like for example Hydrogen or Oxygen impurities that are present in the layer together with the Mg).
  • a type of impurities like for example Hydrogen or Oxygen impurities that are present in the layer together with the Mg.
  • the current aperture can be formed, e.g., from a low-resistivity first layer which is a p-layer, by increasing the resistivity in local areas (where the current aperture stop shall be located), by the introduction of doping species of different type (i.e. n-type, like Si, O 2 , Ti, C), or by locally passivating the p-type Mg with Hydrogen.
  • a low-resistivity first layer which is a p-layer
  • doping species of different type i.e. n-type, like Si, O 2 , Ti, C
  • n-type like Si, O 2 , Ti, C
  • the highly doped TCN layer 5 (e.g., n-type doped; or p-type doped) can be epitaxially deposited by MBE. In case of an n-doped TCN-layer 5 , this can result in an efficient tunnel junction at the interface with the uppermost p-layer.
  • the current aperture seen from the top of the wafer can have, e.g., a circular or rectangular shape.
  • a device can include several current apertures.
  • a current aperture can be repeated several times within a single device, e.g., to produce linear or 2D current aperture arrays.
  • the thickness t (along the vertical axis) of the current aperture stop 6 can be, e.g., between 10 nm and 1 ⁇ m or between 10 nm and the full thickness of the first layer. Its thickness can be dependent on the method used for creating the current aperture stop:
  • deposition of the TCN layer can take place after removal of the mask.
  • MOVPE can make possible to produce III-nitride based semiconductor structures of excellent crystal quality capable of high light emission efficiency, but Mg atoms (as p-dopant) are passivated by hydrogen such that as-grown structures have a high resistivity (in the p-doped layer).
  • the hydrogen can be removed by annealing above about 400° C., resulting in a good conductivity.
  • lateral current injection is problematic (because of still relatively high resistivity), and producing ohmic contacts of low resistance on the first layer is problematic, too.
  • the deposition of the transparent layer 5 (TCN layer) can contribute to achieving a good lateral current spreading and low-resistance ohmic contacts.
  • Provision of current aperture stops e.g., as described, can provide the effects as described. It can be produced in a way that it is epitaxial with the first layer, cf. above.
  • the transparent (TCN) layer can be grown without exposing the first layer 1 to hydrogen, e.g. when using MBE.
  • Epitaxial deposition of the transparent layer 5 (on the first layer 1 ) can result in low resistances at the interface to the first layer and to low resistivity in the transparent layer 5 .
  • epitaxial deposition of the transparent layer (on the current aperture stop) can result in low resistances at the interface to the current aperture stop 6 .
  • the interfaces of the transparent layer to the first layer and to the current aperture stop can both be planar and lie both in one and the same (lateral) plane.
  • High doping levels of the transparent layer e.g., with Si as dopant, can result in excellent electrical properties.

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