US20170219256A1

US20170219256A1 - Thermal transfer devices, temperature stabilized containers including the same, and related methods

Info

Publication number: US20170219256A1
Application number: US15/013,358
Authority: US
Inventors: Michael Friend; Stephen Paul Harston; Andrew Kuehl Miller; David Keith Piech
Original assignee: Tokitae LLC
Current assignee: Tokitae LLC
Priority date: 2016-02-02
Filing date: 2016-02-02
Publication date: 2017-08-03
Also published as: CN109005666A; TW201728317A; WO2017136345A3; WO2017136345A2

Abstract

Generally, this disclosure relates to a temperature-stabilized and/or temperature-controlled storage container. In an embodiment, the storage container may include e a temperature-control regulator or assembly that may control the temperature in the interior space of the temperature-stabilized storage container.

Description

If an Application Data Sheet (ADS) has been filed on the filing date of this application, it is incorporated by reference herein. Any applications claimed on the ADS for priority under 35 U.S.C. §§119, 120, 121, or 365(c), and any and all parent, grandparent, great-grandparent, etc. applications of such applications, are also incorporated by reference, including any priority claims made in those applications and any material incorporated by reference, to the extent such subject matter is not inconsistent herewith.

CROSS-REFERENCE TO RELATED APPLICATIONS

The present application claims the benefit of the earliest available effective filing date(s) from the following listed application(s) (the “Priority Applications”), if any, listed below (e.g., claims earliest available priority dates for other than provisional patent applications or claims benefits under 35 USC §119(e) for provisional patent applications, for any and all parent, grandparent, great-grandparent, etc. applications of the Priority Application(s)).

Priority Applications

None.

BACKGROUND

Temperature-control devices and systems can maintain internal storage region(s) at a suitable temperature for various products that may be sensitive to temperature. For example, temperature-sensitive products may degrade or fail if the temperature thereof increases above an upper threshold temperature or falls below a lower threshold temperature. Some medicines, such as vaccines, may become unusable if held at, above, or below a selected temperature for a selected period of time. Accordingly, manufacturers and users of temperature-control devices and systems continue to seek improvements thereto.

SUMMARY

Generally, the present disclosure relates to a temperature-stabilized or temperature-controlled storage containers and thermal transfer devices for use with such storage containers. In an embodiment, the storage container can include a temperature-control regulator or assembly that can control the temperature in an interior space of the temperature-stabilized storage container. For example, the temperature control unit can cool the interior space of the storage container to a suitable or selected temperature or temperature range and maintain the selected or suitable temperature therein. As such, the temperature-controlled storage container may maintain suitable temperature of temperature-sensitive items stored therein (e.g., medicine, vacines, food, etc.).
An embodiment includes a thermal transfer device for a storage container. The thermal transfer device includes a housing having a top plate, a first pillar extending from the top plate, and a second pillar extending from the top plate. The thermal transfer device also includes at least one phase change material (PCM) container containing at least one first PCM and being configured to be positioned in thermal communication with the first pillar of the housing. Moreover, the thermal transfer device includes at least one PCM carrier containing at least one second PCM and being configured to be positioned in thermal communication with one or more of the first pillar or the second pillar. The thermal transfer device further includes a heat pipe having a first thermal end thereof in thermal communication with one or more of the top plate, the first pillar, or the second pillar.
An embodiment includes a temperature-stabilized container having at least one first wall defining a storage space and at least one second wall spaced outwardly from the at least one first wall and defining an insulation space therebetween. The temperature-stabilized container further includes a thermal transfer device that includes a first portion positioned inside the storage space, and a second portion positioned outside the storage space. The thermal transfer device includes a housing including, a top plate, a first pillar extending from the top plate, and a second pillar extending from the top plate. The first pillar and the second pillar are positioned inside the storage space. The thermal transfer device also includes at least one PCM carrier containing at least one second PCM and being in thermal communication with one or more of the first pillar or the second pillar. The at least one PCM container and the least one PCM carrier are positioned inside the storage space. Moreover, the thermal transfer device includes a heat pipe having a first thermal end thereof in thermal communication with one or more of the top plate, the first pillar, or the second pillar.
An embodiment includes a method of maintaining a temperature in a closed storage space. The method includes providing a temperature-stabilized container that includes a shell defining a storage space and a thermal transfer device positioned inside the storage space. The thermal transfer device includes a top plate, a first pillar extending from the top plate, and a second pillar extending from the top plate. The first pillar and the second pillar are positioned inside the storage space. In addition, the temperature-stabilized container includes at least one PCM container containing at least one first PCM and being in thermal communication with the first pillar of the housing, and at least one PCM carrier containing at least one second PCM and being in thermal communication with one or more of the first pillar or the second pillar. The at least one PCM container and the at least one PCM carrier are positioned inside the storage space
The thermal transfer device also includes a heat pipe having a first thermal end thereof in thermal communication with one or more of the top plate, the first pillar or the second pillar. The method further includes removing heat from the storage space by cooling a second thermal end of the heat pipe to produce heat transfer from the at least one first PCM and the at least one second PCM to the second end of heat pipe.
Features from any of the disclosed embodiments may be used in combination with one another, without limitation. In addition, other features and advantages of the present disclosure will become apparent to those of ordinary skill in the art through consideration of the following detailed description and the accompanying drawings. The foregoing summary is illustrative only and is not intended to be in any way limiting.
In addition to the illustrative aspects, embodiments, and features described above, further aspects, embodiments, and features will become apparent by reference to the drawings and the following detailed description.

BRIEF DESCRIPTION OF THE FIGURES

FIG. 1 is an isometric view of a temperature-stabilized storage container, according to an embodiment;

FIG. 2 is an isometric, cutaway view of the temperature-stabilized storage container of FIG. 1;

FIG. 3 is an exploded, isometric view of a removable cooling element, according to an embodiment;

FIG. 4 is an isometric view of a partial cooling assembly and a thermal housing, according to an embodiment;

FIG. 5A is an isometric view of the thermal housing of FIG. 4;

FIG. 5B is an enlarged, isometric view of a portion of the thermal housing shown in FIG. 4;

FIG. 6 is an exploded, isometric view of a thermal housing, according to an embodiment;

FIG. 7A is an isometric, cutaway view of a temperature-stabilized storage container, according to an embodiment;

FIG. 7B is an isometric, cutaway view of the temperature-stabilized storage container of FIG. 7A; and

FIG. 8 is a partial, isometric view of a cooling unit, according to an embodiment.

DETAILED DESCRIPTION

In the following detailed description, reference is made to the accompanying drawings, which form a part hereof. In the drawings, similar symbols typically identify similar components, unless context dictates otherwise. The illustrative embodiments described in the detailed description, drawings, and claims are not meant to be limiting. Other embodiments may be utilized, and other changes may be made, without departing from the spirit or scope of the subject matter presented here.
Generally, the present disclosure relates to a temperature-stabilized or temperature-controlled storage container. In an embodiment, the storage container can include a temperature-control regulator or assembly that may control the temperature in an interior space of the temperature-stabilized storage container. For example, the temperature control unit can cool the interior space of the storage container to a suitable or selected temperature or maintain the selected or suitable temperature therein. As such, the temperature-controlled storage may maintain suitable temperature of temperature-sensitive items stored therein (e.g., medicine, food, etc.).
Moreover, in an embodiment, the temperature control regulator may have one or more removable temperature-control elements, such as cooling elements (e.g., one or more removable PCM containers, such as 1, 2, 3, 4, etc., removable PCM containers). For example, a cooling unit or element may be removable from the temperature-control unit. In some operating conditions, the removable cooling element(s) may be placed into another container to maintain a temperature-controlled environment therein. For example, the removable cooling elements may be placed into a transfer container (e.g., that may be smaller than the storage container or may be used to temporarily store or transfer temperature-sensitive items located or stored in the storage container).
Generally, a storage container may have any suitable size, shape, configuration, etc. FIG. 1 is an isometric view of a temperature-stabilized storage container 100, according to an embodiment. For example, the temperature-stabilized storage container 100 may have an outer wall or shell 110 defining the exterior of the temperature-stabilized storage container 100. As described below in more detail, the shell 110 also may define an interior space of the temperature-stabilized storage container 100 (e.g., one or more temperature-sensitive items, such as medicine, etc., may be stored in the interior space of the temperature-stabilized storage container 100). Hence, for example, the interior space of the temperature-stabilized storage container 100 may be accessible to place temperature-sensitive items or products therein or to remove items therefrom. For example, the shape, size, and general configuration of the shell 110 of the temperature-stabilized storage container 100 may be similar to the storage container described in U.S. Patent Application Publication No. 2014/0150464, entitled “Temperature-Stabilized Storage Systems With Integral Regulated Cooling,” the entire content of which is incorporated herein by reference. Moreover, as described below in more detail, the temperature-stabilized storage container 100 may include a cooling assembly 160 and cooling unit 170, which may remove heat from the interior space of the shell 110 or may control temperature therein. In the illustrated embodiment, the shell 110 has a substantially cylindrical shape or circular cross-sectional shape. More specifically, for example, the shell 110 may have three sections that collectively define or form the shell 110. In an embodiment, the shell 110 may have an upper section 111, an intermediate section 112, and a lower section 113. The lower section 113 may define or form the bottom of the shell 110 of the interior space inside the shell 110. Hence, for example, the lower section 113 may have a substantially cylindrical peripheral wall and a bottom wall (not visible) connected to or extending from the peripheral wall. For example, the lower section 113 can have a radius or fillet that can connect the peripheral wall to the bottom wall of the lower section 113.
The intermediate section 112 can extend from and can be connected to or integrated with the lower section 113. In an embodiment, the intermediate section 112 can be generally cylindrical and can be connected to or integrated with the substantially cylindrical peripheral wall of the lower section 113 (e.g., the diameter of the intermediate section 112 can be similar to or the same as the diameter of the cylindrical peripheral wall of the lower section 113). For example, the intermediate section 112 can be removably connected to the lower section 113 (e.g., via a snap fit, press-fit, or any number of suitable connections).
In an embodiment the upper section 111 can be connected to or integrated with the intermediate section 112. For example, the upper section 111 can have substantially cylindrical lower and upper portions (e.g., the lower cylindrical portion can have a diameter that is similar to or the same as the diameter of the intermediate section 112). In any event, the intermediate section 112 and the upper section 111 can be connected together. For example, the upper section 111 can be removably connected to the intermediate section 112 (e.g., in the same manner as the lower section 113, as described above)
Also, in an embodiment, the cooling assembly 160 of the temperature-stabilized storage container 100 can include a cover 161 that can enclose or protect one or more elements or components of the cooling assembly 160. For example, the cover 161 can connect to the upper section 111. In an embodiment, the upper portion of the upper section 111 can have shape and size that are similar to the shape and size of the cover 161 (e.g., the upper section of the upper section 111 can be generally cylindrical and can have the same or similar diameter as the diameter of the cover 161, which, for example, can be smaller than the diameter of the lower section of the upper section 111). In an embodiment, the upper section 111 can include a fillet or transition radius extending between and connecting the upper and lower portions of the upper section 111.
As noted above, the upper section 111 can be removable from the intermediate section 112. In particular, for example, the upper section 111 can be removed from the intermediate section 112 together with the cover 161 and the cooling assembly 160, thereby removing elements or components of the cooling assembly 160 that are positioned in the interior space of the shell 110 or removing temperature-sensitive items stored inside the thermally-stabilized storage container 100.
In an embodiment, the cooling unit 170 can include a housing 171 that can enclose or protect one or more elements or components of the cooling unit 170, as described below in more detail. Generally, the housing 171 can have any suitable shape which can vary from one embodiment to the next and can depend on the shape, size, arrangement, etc., of the elements or components of the cooling unit 170 enclosed therein. In an embodiment, the cover 161 can be connected to (e.g., removably) or integrated with the housing 171. In an embodiment, the temperature-stabilized storage container 100 can include an electronic controller 200 that can control the operation of one or more elements and/or components of the cooling assembly 160 and/or of the cooling unit 170, as described below in more detail. For example, the controller 200 can be at least partially housed in the housing 171 of the cooling unit 170
As described above, the temperature-stabilized storage container 100 can include a temperature regulator or assembly that can cool the interior space of the temperature-stabilized storage container 100 or maintain the temperature in the interior space at a selected or suitable temperature. FIG. 2 is an isometric, cutaway view of the temperature-stabilized storage container 100, which exposes external elements and components thereof. As shown in FIG. 2, in an embodiment, the temperature-stabilized storage container 100 can include a temperature-control assembly 120, a portion of which can heat or cool interior space 10 of the temperature-stabilized storage container 100. For example, the temperature-control assembly 120 can include one or more removable cooling elements, such as removable cooling elements 130.
Furthermore, in an embodiment, the temperature-control assembly 120 can include fixed (e.g., permanently or semi-permanently) cooling elements, such as the fixed cooling elements that can contain a PCM or PCM containers 140 (e.g., fixed PCM containers 140 a, PCM containers 140 b). For example, the fixed PCM containers 140 a, 140 b can be similar or the same as one another. In an embodiment, the PCM container 140 a can have a generally mirrored configuration of the PCM container 140 b, as described below in more detail. It should be appreciated, however, that in some embodiments, the temperature-stabilized storage container 100 can have only removable cooling elements, such as the removable cooling elements 130.
In an embodiment, the removable cooling elements 130 or PCM containers 140 can include one or more PCMB. For example, the removable cooling elements 130 can be a PCM carrier that includes one or more PCM containers with a first PCM material. Generally, the PCM can be any material that can be cooled to change from a first phase to a second phase (e.g., from a liquid phase to a solid phase) and can subsequently absorb heat to change back from the second phase to the first phase (e.g., from a solid phase to a liquid phase).
For example, the PCM can have a freezing temperature between about 0° C. to about 2° C. In some embodiments, the PCM has a freezing temperature between about 1° C. to about 3° C. In some embodiments, PCM has a freezing temperature between about 2° C. to about 4° C. In some embodiments, PCM has a freezing temperature between about 3° C. to about 5° C. In some embodiments, the PCM has a freezing temperature between about 4° C. to about 6° C. In an embodiment, the PCM can be or can include water or ice.
In an embodiment, the PCM can be stored in one or more containers that can be included in the removable cooling elements 130 or the PCM containers 140. As the PCM changes from the first phase to the second phase and vice versa, the volume occupied by the PCM in the container(s) can change (e.g., the volume of the PCM in a solid phase can be greater than in a liquid phase or vice versa). In some embodiments, the PCM container(s) include a PCM as well as expansion space sufficient to include the PCM in a different phase. For example, the container(s) containing PCM can include suitable space to accommodate expansion and contraction of the PCM after the change of the phase thereof, such that when the PCM has the largest operating volume (e.g., largest volume produced during operation of the temperature-stabilized storage container 100), the container(s) remain undamaged or undeformed.
As described below in more detail, the removable cooling elements 130 can include PCM containers 135 that can contain the first PCM. Generally, the PCM containers 135 can include or comprise any suitable material (e.g., thermoplastic material, such a polypropylene, polyethylene, etc., metal, such as aluminum, an aluminum alloy, brass, bronze, copper, copper alloys, or steel, etc.). In any event, the removable cooling elements 130 can include or be formed of a material having a suitable coefficient of thermal conductivity, such that the heat in the interior space 10 can be transferred to the PCM in the PCM containers 135 at a suitable rate.
Similarly, the PCM containers 140 can include a second PCM. In an embodiment, the second PCM can be similar to or the same as the first PCM. For example, the second PCM and the first PCM can have a similar or the same melting point or heat capacity. Alternatively, the second PCM can be different from the first PCM (e.g., the second PCM can have a different melting point or heat capacity than the first PCM). Moreover, the PCM containers 140 can include or be formed of a similar or the same material as the PCM containers 135. Alternatively, the PCM containers 140 can include or be formed of a different material than the material of PCM containers 140. For example, the material of the PCM containers 140 can have a different heat transfer coefficient than the material of the PCM containers 135 (e.g., the material of the PCM containers 140 can have a higher heat transfer coefficient than the material of PCM material 131, such that the PCM containers 140 can transfer heat fast from the interior space 10 to the PCM than the removable cooling elements 130, or vice versa).
In an embodiment, the temperature-control assembly 120 includes a housing sized and configured to secure the removable cooling elements 130 and PCM containers 140. In particular, for example, the temperature-control assembly 120 can include a thermal housing 150 that can removably secure the removable cooling elements 130 therein and fixedly secure PCM containers 140. Moreover, the thermal housing 150 can be in thermal communication with a cooling assembly 160 that can remove heat from the thermal housing 150, which can be transferred thereto from the removable cooling elements 130 or PCM containers 140.
In an embodiment, the thermal housing 150 can include one or more slots, such as slot 151, which can accommodate or secure the removable cooling elements 130 therein. For example, the removable cooling elements 130 can be removably positioned in the slot 151, such that the removable cooling elements 130 or the corresponding PCM containers 135 therein are in thermal communication with the thermal housing 150, and the heat from the removable cooling elements 130 can be transferred to the thermal housing 150 and to the cooling assembly 160 (e.g., to maintain the PCM in a selected phase or to reduce the amount of PCM changing from one phase to another, while maintaining the temperature in the interior space 10 at a suitable or selected temperature level). In an embodiment, the removable cooling elements 130 can slide into the slot 151 and can have sliding fit therein, and one or more surfaces or areas of the removable cooling elements 130 can contact one or more areas or surfaces of the thermal housing 150, such as one or more surfaces inside the slot 151. For example, the removable cooling elements 130 can have a handle 139 (FIG. 3) and can have a sliding fit with the slot 151, such that a user can remove the removable cooling elements 130 from the thermal housing 150 by pulling on the handle 139.
In an embodiment, friction between the removable cooling elements 130 and the walls or surfaces defining the slots, such as the slot 151 can suitably retain or secure the removable cooling elements 130 in the slot (e.g., in the slot 151). Additionally or alternatively, the thermal housing 150 or the removable cooling elements 130 can include one or more fastening mechanisms, which can suitably secure the removable cooling elements 130 in the slots (e.g., in the slot 151). For example, as described below in more detail, the thermal housing 150 can include or be formed of any number of suitable materials (e.g., materials suitable for transferring heat from the removable cooling elements 130 and the PCM containers 140 to a location outside of the interior space 10). In an embodiment, the thermal housing 150 can include or be formed of one or more ferromagnetic steel portions, and the removable cooling elements 130 can include one or more magnets (e.g., rare earth magnets) connectable to the corresponding steel portions, thereby removably securing the removable cooling elements 130 to the thermal housing 150.
According to an embodiment, the PCM containers 140 can be in thermal communication with the thermal housing 150 and can be fixedly secured thereto. For example, the PCM containers 140 can have one or more surfaces or areas thereof in contact with one or more surfaces or areas of the thermal housing 150. As described below in more detail, the PCM containers 140 can be secured to the thermal housing 150 (e.g., the PCM containers 140 can be fastened to the thermal housing 150). In any case, the PCM containers 140 can absorb heat from the interior space 10 of the temperature-stabilized storage container 100 (e.g., the PCM in the PCM containers 140 absorb heat from the interior space 10), and the thermal housing 150 can transfer heat from the PCM containers 140 to the cooling assembly 160, thereby maintaining the PCM in the PCM containers 140 in a selected phase or reducing the amount of the PCM in the PCM containers 140 that can change from one phase to another).
Generally, the cooling assembly 160 can have any number of suitable configurations. In an embodiment, the cooling assembly 160 includes a heat pipe that is in thermal communication with the thermal housing 150 (e.g., a hot end of the heat pipe can be in thermal communication with the thermal housing 150) and a cooling unit 170 can be in thermal communication with a cold end of the heat pipe. The heat pipe can have any suitable size and configuration or any suitable working fluid (e.g., the working fluid can depend based on the operating temperatures of the cold or hot ends of the heat pipe, ambient temperature, cooling device(s) connected to the hot end of the heat pipe, etc.). In an embodiment, the temperature-stabilized storage container 100 can include insulation 180 that can at least partially enclose or insulate the heat pipe, thereby reducing heat transfer from the surrounding environment to the heat pipe along the length thereof.
Moreover, the cooling assembly 160 can include a shroud or a cover 161 (see also FIG. 1) that can at least partially enclose or protect the insulation 180 and the heat pipe (e.g., from surrounding environment, from heat, etc.). In an embodiment, the cover 161 can connect to the shell 110 in a manner that seals the interior space 10 of the shell 110 at the bottom of the cover 161. For example, the cover 161 can be sized and configured to connect to the shell 110, such that the exterior or peripheries thereof seal the interior space 10. Additionally or alternatively, the cover 161 can have a generally closed bottom that can seal the interior space 10 of the shell 110. For example, the cover 161 can include an opening in the bottom that allows the heat pipe to pass into the interior space of the cover 161, where the heat pipe is enclosed by the insulation 180; otherwise, the bottom of the cover 161 can be closed and can seal the interior space 10 of the shell 110.
The cooling unit 170 can be in thermal communication with the cold end of the heat pipe and can transfer heat therefrom. As discussed below in more detail, in an embodiment, the cooling unit 170 can use ambient fluid, such as air, to cool the cold end of the heat pipe. Alternatively or additionally, the cooling unit 170 can include one or more thermoelectric units (e.g., Peltier cells) that can at least partially cool the cold end of the heat pipe. For example, the thermoelectric units can be coupled to the heat pipe in a manner that the thermoelectric units operate as thermoelectric coolers and cool the cold end of the heat pipe.
In an embodiment, the cooling unit 170 can include a unit housing 171 (FIG. 1) that can enclose or protect one or more elements or components of the cooling unit 170. For example, the cooling unit 170 can include one or more heat sinks or thermoelectric cooler that can be housed in or at least partially enclosed by the housing 171.
FIG. 3 is an isometric, disassembled view of the removable cooling element 130, according to an embodiment. In particular, for example as shown in FIG. 3, the removable cooling elements 130 can include one or more compartments such as two compartments 131, 132 defined by an exterior shell or wall 133 and by one or more interior dividers or walls 134. Moreover, the removable cooling elements 130 can include PCM containers 135 (e.g., PCM containers 135 a, 135 b) that can be removably positioned in the corresponding first and second. compartments 131, 132. As described above, the removable cooling element 130 or the PCM containers 135 can be removed from the storage container or can be used to maintain a suitable temperature in a temporary container the removable cooling elements 130 can be removed from the thermal housing, and the PCM container 135 can be removed from the first and second compartments 131, 132 of the removable cooling elements 130 and placed into the temporary container).
Generally, the compartments 131, 132 and the corresponding PCM containers 135 a, 135 b can have any suitable shape, such that the PCM containers 135 a, 135 b can fit inside the corresponding compartments 131, 132. In an embodiment, the removable cooling elements 130 can include one or more slots or openings extending through the exterior wall(s) 133, which can accommodate removal of the 135 from the corresponding compartments 131, 132. For example, a back wall of the exterior walls 133 can have openings 136 extending therethrough; the PCM containers 135 can be pushed out of the first and second compartments 131, 132. Additionally or alternatively, at least one of the exterior walls 133, such as one or more peripheral walls, can have slots extending therethrough (e.g., slots 137 or 138). For example, a tool can be inserted through one or more of the slots 137, 138 and between the wall(s) 133 and the one or more of the PCM containers 135, and a force can be applied to the 135 to push the PCM containers 135 out of the corresponding first or second compartments 131, 132.
Again, the removable cooling elements 130 can be removed from the thermal housing. In an embodiment, the removable cooling elements 130 can include one or more handles, such as handle 139, attached or secured to at least one of the exterior walls 133. For example, the handle 139 can be a flexible handle (e.g., a rope or a band) that can fold to reduce the size thereof inside the interior space of the storage container and can be expanded to facilitate grasping thereof (e.g., to pull the removable cooling elements 130 out of the thermal housing 150).
FIG. 4 shows the thermal housing 150 and PCM containers 140 outside of the storage container. For example, as mentioned above, a heat pipe 190, which can be at least partially surrounded by the insulation 180, can be in thermal communication with the thermal housing 150. In particular, the hot end of the heat pipe 190 can be in thermal communication with and can transfer heat from the thermal housing 150, thereby cooling the PCM containers 140 and the PCM carriers that are in thermal communication with the thermal housing 150. The insulation 180 can have any size or shape as can be suitable for enclosing or insulating the heat pipe 190.
As mentioned above, the thermal housing 150 includes slot 151 that can accommodate a removable cooling elements, such as PCM carrier. Moreover, the thermal housing 150 can include a similar slot 152 that can accommodate another PCM carrier. According to an embodiment, the slots 151, 152 are defined by a center pillar 153 and opposing pillars 154 and 155. In particular, the slot 151 can be defined by and between the center pillar 153 and a first side pillar 154, and the slot 152 can be defined by and between the center pillar 153 and the second side pillar 155. Hence, for example, one or more portions or surfaces of the PCM carrier positioned in the slot 151 can be in contact or in thermal communication with the center pillar 153 and with the first side pillar 154 and thereby can transfer heat therefrom (e.g., from the PCM) to the thermal housing 150. Also, one or more portions or surfaces of the PCM carrier positioned in the slot 152 can be in contact or in thermal communication with the center pillar 153 or with the second side pillar 155 and thereby can transfer heat therefrom (e.g., from the PCM) to the thermal housing 150.
It should be appreciated that the thermal housing 150 can have any number of slots or pillars that can define the corresponding slots and the configurations thereof can vary from one embodiment the next. Hence, the terms “center” and “side” pillars are used for convenience of description and should not be interpreted as limiting the scope of this disclosure. Also, in an embodiment, the center pillar 153, the first side pillar 154, the second side pillar 155, or combinations thereof can be generally plate-like or can have a generally flat shape (e.g., any of the center pillar 153, first side pillar 154, and second side pillar 155 can have generally planar opposing major surface separated by a suitable distance defining respective thicknesses thereof). Alternatively, any of the center pillar 153, first side pillar 154, and second side pillar 155 can have any number of other suitable configurations, such as rod or tubular-shaped configurations, bar-shaped configuration, grid or scaffolding-shaped configuration, etc.
Moreover, in an embodiment, the thermal housing 150 can include one or more plates that can secure together the pillars (e.g., the center pillar 153, the first side pillar 154, the second side pillar 155, or combinations thereof) or can provide structural rigidity to the thermal housing 150. For example the thermal housing 150 can include a top plate 156 that can be connected or secured to one or more of the center pillar 153, the first side pillar 154, or the second side pillar 155. Additionally or alternatively, the thermal housing 150 can include a base plate 157 that can be connected or secured to the center pillar 153, the first side pillar 154, or the second side pillar 155. For example, the center pillar 153, the first side pillar 154, the second side pillar 155, the top plate 156, and the base plate 157 can be connected together and can collectively form or define the thermal housing 150 or provide structural rigidity thereto.
Generally, the center pillar 153, the first side pillar 154, the second side pillar 155, the top plate 156, and the base plate 157 can have any number of suitable sizes, shapes, and configurations. For example, the center pillar 153, the first side pillar 154, the second side pillar 155, the top plate 156, and the base plate 157 are substantially planar (e.g., such as to removably accommodate corresponding PCM carriers in the slots 151, 152). For example, the top plate can be substantially positioned in or oriented along a first plane, and the center pillar 153 can be substantially positioned in or oriented along a second plane that can be substantially perpendicular to the first plane (e.g., to correspond to the shape of the PCM carriers positionable in the first and second slots 151, 152). However, in other embodiments, the center pillar 153, the first side pillar 154, the second side pillar 155, the top plate 156, and the base plate 157 can be nonplanar.
In an embodiment, the first or second side pillars 154, 155 can be substantially positioned in or oriented along respective second and third planes. For example, the second and third planes can be substantially perpendicular to the first plane. Moreover, the second and third planes can be substantially parallel to each other.
The thermal housing 150 also can include a substantially planar base plate 157 that can be substantially positioned in or oriented along a fourth plane, which can be substantially parallel to the first plane or substantially perpendicular to the second and third planes. It should be appreciated that, as noted above, any of the center pillar 153, the first side pillar 154, the second side pillar 155, the top plate 156, and the base plate 157 can have any number of suitable shapes or configurations, which can vary from one embodiment to another. Moreover, relative positions or orientations of the center pillar 153, the first side pillar 154, the second side pillar 155, the top plate 156, and the base plate 157 can vary from one embodiment to the next and can be configured such as to accommodate the removable cooling elements 130 or PCM containers 140 generally in a manner described herein.
In an embodiment, the PCM containers 140 can be in thermal communication with the thermal housing 150. For example, the PCM container 140 a can be in thermal communication with the first side pillar 154 to thereby transfer heat therefrom (e.g., from the PCM) to the thermal housing 150. Similarly, the PCM container 140 b can be in thermal communication with the second side pillar 155 and thereby can transfer heat therefrom (e.g., from the PCM) to the thermal housing 150. As described above, in an embodiment, the PCM containers 140 can be fastened or otherwise secured to the thermal housing 150 (e.g., fastening the PCM containers 140 to the thermal housing 150 can provide suitable contact between surfaces thereof, which can provide a suitable thermal connection or reduce thermal resistance therebetween).
Furthermore, in an embodiment, one or more of the PCM containers 140 a, 140 b can include respective panels 140 a′, 140 b′. For example, the plates 140 a′, 140 b′ can facilitate positioning the PCM containers 140 a, 140 b relative to the respective first and second side pillars 154, 155 (e.g., back sides of the panels 140 a′, 140 b′ can abut front edges (or minor sides) of the respective first and second side pillars 154, 155, such as to position the PCM containers 140 a, 140 b relative thereto (e.g., such that the cam locks 141 a (described below in more detail) align with corresponding channels 158, 159 to secure the PCM containers 140 a, 140 b to the respective first and second side pillars 154, 155). Additionally or alternatively, the plates 140 a′, 140 b′ can include an angled portion (e.g., front faces or sides thereof can be angled at non-parallel angles relative to the back sides, as shown in FIG. 4). For example, the angled portions of the plates 140 a′, 140 b′ can facilitate insertion of the removable cooling elements, such as PCM carriers, into the slots 151, 152.
FIGS. 5A and 5B illustrate a connection between the PCM container 140 a and the thermal housing 150 according to an embodiment. More specifically, FIG. 5B is an enlarged, isometric view that shows the connection between the PCM container 140 a and thermal housing 150, as indicated in FIG. 5A. In an embodiment, the PCM container 140 a can include cam locks 141 a that can be positioned in corresponding channels 158 in the first side pillar 154 (the panel 140 a′ (FIG. 4) is removed to better illustrate the cam locks 141 a). More specifically, for example, the cam locks 141 a can be piovotable about an axis 142 a, in a manner that pivoting the cam locks 141 a about the axis 142 a secures or locks the PCM container 140 a to the first side pillar 154. For example, the cam locks 141 a can be spring-loaded, such that pivoting the cam locks 141 a to a locked position (e.g., as shown in FIGS. 5A-5B) presses the cam locks 141 a against the first side pillar 154, thereby pulling or forcing together the PCM container 140 a and the first side pillar 154.
Conversely, pivoting the cam locks 141 into an unlocked position releases the cam locks 141 a and the PCM container 140 a from the first side pillar 154, such that the PCM container 140 a can be removed or pulled away from the first side pillar 154. It should be appreciated that the thermal housing 150 and the PCM container 140 a can be initially assembled together and then placed or positioned in the interior space of the thermally-stabilized storage container. Hence, in some embodiments, to remove the PCM container 140 a or the PCM containers 140 b (FIG. 4) from the thermal housing 150, the PCM container 140 a. 140 b together with the thermal housing 150 are removed from the thermally-stabilized storage container, such that the PCM container 140 a, 140 b can be unlocked and pulled away from the thermal housing 150, after removal from the interior space of the thermally-stabilized storage container.
Moreover, the PCM containers, such as the PCM storage container 140 a, can have any number of suitable shapes or sizes. In an embodiment, outer peripheral surface(s) of the PCM container 140 a can be positioned near or can approximate or correspond to the shape of the wall defining the interior space of the thermally-stabilized storage container. In the illustrated embodiment, a portion of the PCM container 140 a is defined by an arcuate peripheral wall 143 a. In some embodiments, the interior space of the thermally-stabilized storage container can be substantially cylindrical or can have a substantially circular cross-section. Hence, for example, the arcuate peripheral wall 143 a of the PCM container 140 a can be positioned near or in contact with an inner surface of a wall defining the interior space of the storage container (e.g., such configuration can optimize or maximize the amount of PCM that the PCM containers 140 can contain therein). In alternative or additional embodiments, the interior space of the storage container can have any suitable shape, such as generally prismoid shape (e.g., having one or more planar walls that define the interior space), and the PCM container 140 a can have one or more planar walls or surfaces that can be positioned near corresponding walls or surfaces of the storage container or can approximate the shape thereof.
Again, the center pillar 153, the first side pillar 154, the second side pillar 155, the top plate 156, and the base plate 157 can have any number of suitable sizes, shapes, and configurations. Moreover, the center pillar 153, the first side pillar 154, the second side pillar 155, the top plate 156, and the base plate 157 can connect together with any number of suitable connection elements or components (e.g., fasteners, weld, braze, solder, etc.). In an embodiment, the top plate 156 or the base pate 157 can include one or more orientation or positioning features that can facilitate alignment of the center pillar 153, the first side pillar 154, the second side pillar 155, or combinations thereof relative to one another or relative to the top plate 156 or the base pate 157. For example, the top plate 156 can include cutouts 156′, 156″ that can accept portions of the respective first side pillar 154 and second side pillar 155 therein (e.g., such that a portion of the first side pillar 154 and the second side pillar 155 is coplanar with the upper surface of the top plate 156).
In an embodiment, a portion of the first side pillar 154 or the second side pillar 155 can be angled or tapered. For example, tapered portions of the respective first and second side pillars 154, 155 can facilitate access to the cam lock 141 a for locking and unlocking the PCM containers, such as PCM container 140 a, relative to the thermal housing 150. Additionally or alternatively, the tapered portions of the respective first and second pillars 154, 155 can facilitate insertion of the removable cooling elements, such as PCM carriers. As shown in FIG. 6, tapered portion 154′ of the first side pillar 154 can include cutouts 154 a′, 154 b′ that provide access to the cam lock 141 a that lock the PCM containers to the thermal housing 150 in the manner described above. For example a finger or a tool can be inserted through the cutouts 154 a′ or 154 b′and positioned between the first side pillar 154 and the cam lock 141 a, such as to apply force to the cam lock 141 a and pivot the cam lock 141 a away from the inner surface of the first side pillar 154, thereby unlocking the cam lock 141 a from the first side pillar 154.
As mentioned above, any of the PCM containers 140 a, 140 b can be secured to the respective first and second side pillars 154, 155 with any number of suitable mechanisms and/or connections that can facilitate a suitable contact between the surfaces thereof for heat transfer therebetween. For example, the PCM containers 140 a, 140 b can be secured to the respective first and second side pillars 154. 155 with one or more wedge locks, dovetails or t-shaped elements securable by tightenable gibs, bolts, snap-fitting connectors, or magnetic connectors, etc. In an embodiment, the PCM containers 140 a, 140 b can be bolted to the respective first and second side pillars 154, 155 with one or more bolts from the inside of the PCM containers 140 a, 140 b and/or from inside the respective slots 151, 152. Moreover, as described above, the PCM containers 140 a, 140 b and the first and second side pillars 154, 155 can be positioned inside a shell of the temperature-stabilized storage container. In an embodiment, the shell can include a resilient material that can press or force together the the PCM containers 140 a, 140 b and the first and second side pillars 154, 155, thereby securing the PCM containers 140 a, 140 b to the respective first and second side pillars 154, 155. Furthermore, the temperature-stabilized storage container can include one or more elements that can press or force together the PCM containers 140 a, 140 b and the first and second side pillars 154, 155. For example, the temperature-stabilized container can include a tightenable band that can force together the PCM containers 140 a, 140 b and the first and second side pillars 154, 155.
Generally, the tapered portion 154′ can be connected to or integrated with substantially planar or flat portions of the first and second side pillars. For example, the tapered portion 154′ can be removably fastened to flat portion 154″ of the first side pillar 154. Alternatively, the first side pillar 154 or the second side pillar 155 can be fabricated entirely from a solid or unitary piece of material.
As mentioned above, the hot end of the heat pipe 190 can be in thermal communication with the thermal housing 150. In an embodiment, the heat pipe 190 can be in thermal communication with the center column pillar 153 that in turn can be in direct or indirect thermal communication with other portions of the thermal housing 150 (e.g., with the top plate 156, base plate 157, first side pillar 154, second side pillar 155, combinations thereof). In any event, during operation, the heat pipe 190 transfers heat from the thermal housing 150.
In an embodiment, the heat pipe 190 can be positioned in the center pillar 153 and can extend therein toward or to the base plate 157. For example, the center pillar 153 can include portions 153′, 153″ that can be connected together, which can sandwich the heat pipe 190 therebetween. In an embodiment, the heat pipe 190 has a generally circular cross-sectional shape, and the portions 153′, 153″ can include groves suitably sized and shaped to position the heat pipe 190 therein or in contact therewith. For example, the portions 153′, 153″ can have generally arcuate or semi-circular grooves that can together form a tubular opening or a hollow cylinder sized and shaped to fit about the heat pipe 190. In an embodiment, the heat pipe 190 can have tight or press fit with the grooves of the portions 153′, 153″, such as to provide a suitable surface-to-surface contact between the heat pipe 190 and center pillar 153.
As shown in FIG. 6, the hot end of the heat pipe 190 can be positioned near or in contact with the base plate 157 of the thermal housing 150. Alternatively, the heat pipe 190 can terminate at the hot end thereof at any suitable location along at the thermal housing 150 (e.g., along a longitude of the thermal housing 150). For example, the hot end of the heat pipe 190 can be in direct contact or thermal communication with the top plate 156. In the illustrated embodiment, the top plate 156 includes an opening 156 a, and the heat pipe 190 can pass through the opening 156 a and into the groove in the thermal housing 150.
As mentioned above, the heat pipe 190 can have any number of suitable configurations (e.g., cross-sectional shapes, sizes, working fluids, etc.). In an embodiment, the heat pipe 190 can include one or more bends, such as bends 191, 192, which can reorient one or more portions of the heat pipe 190. For example, the heat pipe 190 can extend generally linearly inside the thermal housing 150. In an embodiment, the bends 191 and 192 can reposition a portion of the heat pipe 190 relative to the portion thereof inside the thermal housing 150, such that the repositioned portion extends at an offset location from the portion inside the thermal housing 150. Hence, for example, the hot and hot ends of the heat pipe 190 can be misaligned relative to each other (e.g., positioned at an offset from a straight line). For example, offsetting the hot and hot ends of the heat pipe 190 (relative to a straight line) can facilitate placement or positioning of one or more cooling units that can be in thermal communication with the cold end of the heat pipe 190.
In an embodiment, the change in direction or orientation of the heat pipe 190 can be made as the heat pipe 190 passes through the top plate 156. For example, the opening 156 a can be size or shaped to accommodate a portion of the heat pipe 190 passing therethrough at an oblique angle (e.g., relative to a top surface of the top plate 156). It should be appreciated that the heat pipe 190 can include or comprise any number of suitable materials (e.g., malleable materials) that can be bent without damaging the structural integrity of the heat pipe 190 or without breaking the heat pipe 190. For example, the heat pipe 190 can include or can comprise copper, aluminum, steel, etc.
As described above, the cooling assembly (including the heat pipe 190) can cool the thermal housing 150 as well as the PCM located in the containers that are in thermal communication with the thermal housing 150, thereby maintaining the PCM in the same phase or reducing the amount of PCM changing phase from one to another. In any case, according to an embodiment, a cooling assembly (e.g., which includes the heat pipe 190) can be in thermal communication with the thermal housing 150 and can remove heat therefrom. More specifically, for example, a cooling unit can cool the cold end of the heat pipe 190 and, thereby, maintaining the hot end of the heat pipe 190 at a suitable or selected temperature, such that the heat pipe 190 can remove or transfer heat from the thermal housing 150.
FIGS. 7A and 7B illustrate the cooling unit 170, according to an embodiment. In particular, FIG. 7A shows an isometric, cutaway view of the housing 171 of the cooling unit 170, such that the elements or components that can be enclosed in the housing 171 are visible. FIG. 7B shows the cooling unit 170 with the housing 171 removed to provide a better view of the elements or components located inside the housing 171. As shown in FIGS. 7A and 7B, the heat pipe 190 can be in thermal communication with a thermoelectric unit or cooler 172. More specifically, the thermoelectric cooler 172 (e.g., Peltier cell) can have a cold side 172 a thermally coupled to the cold end of the heat pipe 190, thereby cooling the cold end of the heat pipe 190. Moreover, the cooling unit 170 can include a hot side 172 b, which can be cooled to produce a suitable or selected temperature at the cold side 172 a or to produce a suitable heat transfer rate from the cold end of the heat pipe 190 and, thereby, from the interior space of the storage container.
In an embodiment, the hot side 172 b of the thermoelectric cooler 172 can be thermally coupled to one or more heat sinks, such as heat sinks 173 a, 173 b. Generally, heat sink(s) can be thermally coupled to the hot side thermoelectric cooler 172 b in any number of suitable arrangements or configurations suitable for cooling the hot side 172 b. In the illustrated embodiment, the heat sinks 173 a, 173 b can be thermally coupled to the hot side 172 b with respective heat pipes 174 a, 174 b. In other words, the hot end of the heat pipe 174 a can be in thermal communication with or thermally coupled to the hot side 172 b of the thermoelectric cooler 172, and the cold end of the heat pipe 174 a can be in thermal communication with or thermally coupled to the heat sink 173 a. Similarly, the hot end of the heat pipe 174 b can be in thermal communication with or thermally coupled to the hot side 172 a of the thermoelectric cooler 172, and the cold end of the heat pipe 174 b can be in thermal communication with or thermally coupled to the heat sink 173 b. Again, it should be appreciated that, while the illustrated embodiment shows two heat sinks, this disclosure is not so limited, and any suitable number of heat sinks can be thermally coupled to the hot side 172 b of the thermoelectric cooler 172 (e.g., one, three, four, etc.).
It should be appreciated that the cold end of the heat pipe 190 can be cooled by any number of thermoelectric coolers, which can be connected to any number of heat pipes to further dissipate heat from the hot sides thereof. For example, the heat pipe can be in thermal communication with a connector block that is sized and configured to secure multiple thermoelectric coolers. In an embodiment, the connector block can have a generally triangular cross-sectional shape (e.g., at a cross-section perpendicular to longitudinal axis 20), and two thermoelectric coolers can be secured to and in thermal communication with two of the faces of the connector block. It should be appreciated that increasing the number of thermoelectric cooler can reduce the temperature difference between the hot and cold sides thereof (e.g., that can be produced during cooling of the cold end of the heat pipe 190), which can increase efficiency of the thermoelectric coolers.
It should be appreciated that the temperature-stabilized storage container can include any suitable cooling device, which can vary from one embodiment to another. For example, the temperature-stabilized storage container can include a heat pump (e.g., vapor compression), a solar-desiccant-evaporative cooler, among others.
The heat sinks can have any suitable configuration or arrangement, which can vary from one embodiment to the next. FIG. 8 shows the heat sinks 173 a, 173 b configured and arranged according to at least one embodiment. For example, the heat sinks 173 a, 173 b can include respective heat exchangers 175 a, 175 b (e.g., passive heat exchangers) that can dissipate heat therefrom to surrounding medium that is in contact with the fins thereof (e.g., to ambient air). More specifically, as described above, heat from the cold ends of the respective heat pipes 174 a, 174 b can be transferred to the heat exchangers 175 a, 175 b, which can, subsequently, dissipate or transfer the heat to the surrounding medium. Again, the heat pipes 174 a, 174 b can transfer heat from the hot side 172 b of the thermoelectric cooler 172; the cold side of the thermoelectric cooler 172 can cool the cold end of the heat pipe 190.
In an embodiment, the heat sinks 173 a, 173 b can include one or more fans, such as fans 176 a, 176 b), which can force the surrounding medium (e.g., air) to flow across the fins of the heat exchangers 175 a, 175 b. For example, the fans 176 a, 176 b can force flow of air upward or away from the heat exchangers 175 a, 175 b, thereby drawing ambient air below the heat exchangers 175 a, 175 b to pass therethrough. Alternatively, the fans 176 a, 176 b can force flow of air downward or toward the heat exchangers 175 a, 175 b. Moreover, the fans 176 a, 176 b can be positioned above or below the heat exchangers 175 a, 175 b, and the heat sinks 173 a, 173 b can have any suitable number of fans.
Alternatively, however, the heat exchangers 175 a, 175 b of the heat sinks 173 a, 173 b can be cooled by a natural flow of the surrounding medium, such as air. For example, as the air surrounding the fins of the heat exchangers 175 a, 175 b can have a lower temperature than the fins; as the air is heated by the fins, the heated air will rise and draw in cooler or ambient air, and this process can be continuous (e.g., the process can continue so long as the ambient air is cooler than the temperature of the heat exchangers 175 a, 175 b).
As shown in FIG. 8, the heat pipes 174 a, 174 b can extend substantially in a plane that is perpendicular relative to a longitudinal direction (e.g., substantially perpendicular to a longitudinal axis 20 that can be generally aligned with the heat pipe 190). In an embodiment, the heat pipes 174 a, 174 b can be offset longitudinally relative to each other (e.g., along a longitudinal axis 20 that can be generally aligned with the heat pipe 190). For example, the heat pipe 174 a can be longitudinally lower than the heat pipe 174 b. Under some operating conditions, longitudinally offsetting the heat pipes 174 a, 174 b relative to each other can position the hot ends thereof at different portions of the hot side 172 b of the thermoelectric cooler 172, thereby providing a more uniform heat transfer from or cooling of the hot side 172 b (e.g., as compared with heat pipes that can be connected to the hot side at the same longitudinal position). Moreover, in an embodiment, the heat sinks 173 a, 173 b can be longitudinally offset from each other, as shown in FIG. 8.
It should be appreciated that the heat pipes 174 a, 174 b can dissipate heat to any suitable heat sinks. For example, heat sinks can include a PCM in thermal communication with the respective cold ends of the heat pipes 174 a, 174 b. For example, the PCM can have a freezing point at about the temperature of the outside environment during one or more periods of time (e.g., in the evening or after sundown, such as at about 40-50° F., for example at about 44°F). Under some operating conditions, for example, the PCM can freeze after sundown and can be melted during operation of the temperature-stabilized storage container, by absorbing heat at the cold ends of the heat pipes 174 a, 174 b. For example, the PCM can be in one or more containers thermally connected to the cold ends of the heat pipes 174 a, 174 b.
As mentioned above, the temperature in the internal space of the storage container can be maintained at a suitable or selected temperature level or within a suitable or selected temperature range (e.g., for a suitable time period). More specifically, for example, the electronic controller 200 that includes control electrical circuitry can be coupled to the thermoelectric cooler 172 and can control or direct operation thereof. In an embodiment, the control electrical circuitry can activate operation of the thermoelectric cooler 172 or can control (directly or indirectly) the voltage applied to the thermoelectric cooler 172, thereby controlling the amount of heat transfer from the internal space of the storage container. Additionally or alternatively, the controller 200 can be coupled to one or more of the heat sinks 173 a, 173 b (e.g., to the fans 176 a, 176 b).
Generally, the controller 200 can include a processor, memory, storage, and input/output (I/O) interface. The controller 200 can be configured or programed to perform one or more acts or steps as described herein. It should be also appreciated that the controller 200 can be or can include a general purpose computer that can be programmed or can include instructions to perform the acts described herein. Additionally or alternatively, the controller 200 can be configured as a special purpose controller 200 (e.g., the controller 200 can include programmable field gate arrays (PFGA) that can be programmed or configured, such that the controller 200 can perform the acts described herein).
As described above, a storage container can include one or more PCM containers positioned inside the interior space thereof. For example, substantially all of the PCM in the PCM containers can be initially in a first phase (e.g., in a solid phase). Moreover, under some operating conditions, the temperature inside the interior space of the storage container can be approximately the same as the temperature of the PCM in the PCM containers. When the storage is exposed to environment having a temperature above the temperature of the PCM, the heat from the environment can be transferred to the medium (e,g., air) in the interior space of the storage container and to the PCM in the PCM containers. As the heat is transferred to the PCM in the PCM containers, under some operating conditions, at least some of the PCM can undergo a phase change (e.g., changing from a solid phase to a liquid phase).
The controller 200 can be operably coupled to one or more sensors that can detect temperature inside the interior space of the storage container, the temperature of the PCM inside the PCM container(s), volume of the PCM in one or more of the PCM containers, combinations of the foregoing, etc. The controller 200 can receive one or more signals from the one or more sensors and can operate (directly or indirectly) the thermoelectric cooler 172 or the fans 176 a, 176 b at least partially based on the one or more signals received from the one or more sensors. In an embodiment, the controller 200 can include or can be connected to a database or a lookup table that can include one or more values for temperatures or temperature ranges for the PCM in the PCM container(s), volumes or volume ranges of the PCM in one or more of the PCM containers, change in volume of the PCM (which can be determined by the controller 200 by comparing signals or readings of the volume received from the sensors at different times), etc., which can be correlated with operating schedules or conditions for the thermoelectric cooler 172 or for the fans 176 a, 176 b.
For example, when the volume of the PCM in the PCM containers changes beyond a threshold value (e.g., increases or decreases beyond the threshold value), the controller 200 can activate operation of the thermoelectric cooler 172. Alternatively, the controller 200 can continuously operate the thermoelectric cooler 172, such as to maintain the volume of the PCM or the temperature thereof at a suitable or selected level.
Generally, the power to the controller 200 or other elements or components of the thermally-stable storage container (e.g., to the thermoelectric cooler 172, to the fans 176 a, 176 b, etc.) can be supplied from any suitable source. In an embodiment, the storage container can include a battery (e.g., a rechargeable battery) that can supply suitable power to the elements or components of the controller 200. Alternatively or additionally, the elements or component of the storage container, which require electrical power, can be coupled to a main electrical line (e.g., at a power outlet). In any case, electrical power can be supplied to the elements or component of the storage container that require electrical power (e.g., the electrical power can be supplied intermittently).
The memory also can include instructions regarding priority or hierarchy of power needs. In other words, when the power received from the power source is insufficient to power all elements or components connected at the power output connection, the processor can use the priority instructions to direct the power management unit to provide power to elements or components indicated as having priority over other elements or components. For instance, the processor can give priority to providing power to the controller 200 over the thermoelectric unit. In an embodiment, the priority hierarchy can be as follows, listed from highest to lowest: controller 200 (or battery attached to the controller 200, if any); thermoelectric unit of the heat sink unit, fan for the heat sink unit (if any); display unit (if any).
The state of the art has progressed to the point where there is little distinction left between hardware, software (e.g., a high-level computer program serving as a hardware specification), and/or firmware implementations of aspects of systems; the use of hardware, software, and/or firmware is generally (but not always, in that in certain contexts the choice between hardware and software can become significant) a design choice representing cost vs. efficiency tradeoffs. There are various vehicles by which processes and/or systems and/or other technologies described herein can be effected (e.g., hardware, software (e.g., a high-level computer program serving as a hardware specification), and/or firmware), and that the preferred vehicle will vary with the context in which the processes and/or systems and/or other technologies are deployed. For example, if an implementer determines that speed and accuracy are paramount, the implementer may opt for a mainly hardware and/or firmware vehicle; alternatively, if flexibility is paramount, the implementer may opt for a mainly software (e.g., a high-level computer program serving as a hardware specification) implementation; or, yet again alternatively, the implementer may opt for some combination of hardware, software (e.g., a high-level computer program serving as a hardware specification), and/or firmware in one or more machines, compositions of matter, and articles of manufacture, limited to patentable subject matter under 35 U.S.C. §101. Hence, there are several possible vehicles by which the processes and/or devices and/or other technologies described herein may be effected, none of which is inherently superior to the other in that any vehicle to be utilized is a choice dependent upon the context in which the vehicle will be deployed and the specific concerns (e.g., speed, flexibility, or predictability) of the implementer, any of which may vary.
In some implementations described herein, logic and similar implementations may include computer programs or other control structures. Electronic circuitry, for example, may have one or more paths of electrical current constructed and arranged to implement various functions as described herein. In some implementations, one or more media may be configured to bear a device-detectable implementation when such media hold or transmit device detectable instructions operable to perform as described herein. In some variants, for example, implementations may include an update or modification of existing software (e.g., a high-level computer program serving as a hardware specification) or firmware, or of gate arrays or programmable hardware, such as by performing a reception of or a transmission of one or more instructions in relation to one or more operations described herein. Alternatively or additionally, in some variants, an implementation may include special-purpose hardware, software (e.g., a high-level computer program serving as a hardware specification), firmware components, and/or general-purpose components executing or otherwise invoking special-purpose components. Specifications or other implementations may be transmitted by one or more instances of tangible transmission media as described herein, optionally by packet transmission or otherwise by passing through distributed media at various times.
Alternatively or additionally, implementations may include executing a special-purpose instruction sequence or invoking circuitry for enabling, triggering, coordinating, requesting, or otherwise causing one or more occurrences of virtually any functional operation described herein. In some variants, operational or other logical descriptions herein may be expressed as source code and compiled or otherwise invoked as an executable instruction sequence. In some contexts, for example, implementations may be provided, in whole or in part, by source code, such as C++, or other code sequences. In other implementations, source or other code implementation, using commercially available and/or techniques in the art, may be compiled/implemented/translated/converted into a high-level descriptor language (e.g., initially implementing described technologies in C or C++ programming language and thereafter converting the programming language implementation into a logic-synthesizable language implementation, a hardware description language implementation, a hardware design simulation implementation, and/or other such similar mode(s) of expression). For example, some or all of a logical expression (e.g., computer programming language implementation) may be manifested as a Verilog-type hardware description (e.g., via Hardware Description Language (HDL) and/or Very High Speed Integrated Circuit Hardware Descriptor Language (VHDL)) or other circuitry model which may then be used to create a physical implementation having hardware (e.g., an Application Specific Integrated Circuit).
The foregoing detailed description has set forth various embodiments of the devices and/or processes via the use of block diagrams, flowcharts, and/or examples. Insofar as such block diagrams, flowcharts, and/or examples contain one or more functions and/or operations, it will be understood that each function and/or operation within such block diagrams, flowcharts, to or examples can be implemented individually and/or collectively, by a wide range of hardware, software (e.g., a high-level computer program serving as a hardware specification), firmware, or virtually any combination thereof, limited to patentable subject matter under 35 U.S.C. 101. In an embodiment, several portions of the subject matter described herein may be implemented via Application Specific Integrated Circuits (ASICs), Field Programmable Gate Arrays (FPGAs), digital signal processors (DSPs), or other integrated formats. However, some aspects of the embodiments disclosed herein, in whole or in part, can be equivalently implemented in integrated circuits, as one or more computer programs running on one or more computers (e.g., as one or more programs running on one or more computer systems), as one or more programs running on one or more processors (e.g., as one or more programs running on one or more microprocessors), as firmware, or as virtually any combination thereof limited to patentable subject matter under 35 U.S.C. 101, and that designing the circuitry and/or writing the code for the software (e.g., a high-level computer program serving as a hardware specification) and or firmware would be well within the skill of one of skill in the art in light of this disclosure. The mechanisms of the subject matter described herein are capable of being distributed as a program product in a variety of forms, and that an illustrative embodiment of the subject matter described herein applies regardless of the particular type of signal bearing medium used to actually carry out the distribution. Examples of a signal bearing medium include, but are not limited to, the following: a recordable type medium such as a floppy disk, a hard disk drive, a Compact Disc (CD), a Digital Video Disk (DVD), a digital tape, a computer memory, etc.; and a transmission type medium such as a digital and/or an analog communication medium (e.g., a fiber optic cable, a waveguide, a wired communications link, a wireless communication link (e.g., transmitter, receiver, transmission logic, reception logic, etc.), etc.).
In a general sense, the various aspects described herein which can be implemented, individually and/or collectively, by a wide range of hardware, software (e.g., a high-level computer program serving as a hardware specification), firmware, and/or any combination thereof can be viewed as being composed of various types of “electrical circuitry.” Consequently, as used herein “electrical circuitry” includes, but is not limited to, electrical circuitry having at least one discrete electrical circuit, electrical circuitry having at least one integrated circuit, electrical circuitry having at least one application specific integrated circuit, electrical circuitry forming a general purpose computing device configured by a computer program (e.g., a general purpose computer configured by a computer program which at least partially carries out processes and/or devices described herein, or a microprocessor configured by a computer program which at least partially carries out processes and/or devices described herein), electrical circuitry forming a memory device (e.g., forms of memory (e.g., random access, flash, read only, etc.), and/or electrical circuitry forming a communications device (e.g., a modem, communications switch, optical-electrical equipment, etc.). The subject matter described herein may be implemented in an analog or digital fashion or some combination thereof.
The herein described subject matter sometimes illustrates different components contained within, or connected with, different other components. It is to be understood that such depicted architectures are merely exemplary, and that in fact many other architectures may be implemented which achieve the same functionality. In a conceptual sense, any arrangement of components to achieve the same functionality is effectively “associated” such that the desired functionality is achieved. Hence, any two components herein combined to achieve a particular functionality can be seen as “associated with” each other such that the desired functionality is achieved, irrespective of architectures or intermedial components. Likewise, any two components so associated can also be viewed as being “operably connected”, or “operably coupled,” to each other to achieve the desired functionality, and any two components capable of being so associated can also be viewed as being “operably couplable,” to each other to achieve the desired functionality. Specific examples of operably couplable include but are not limited to physically mateable and/or physically interacting components, and/or wirelessly interactable, and/or wirelessly interacting components, and/or logically interacting, and/or logically interactable components.
In some instances, one or more components may be referred to herein as “configured to,” “configured by,” “configurable to,” “operable/operative to,” “adapted/adaptable,” “able to,” “conformable/conformed to,” etc. Those skilled in the art will recognize that such terms (e.g. “configured to”) generally encompass active-state components and/or inactive-state components and/or standby-state components, unless context requires otherwise.
The herein described components (e.g., operations), devices, objects, and the discussion accompanying them are used as examples for the sake of conceptual clarity and that various to configuration modifications are contemplated. Consequently, as used herein, the specific exemplars set forth and the accompanying discussion are intended to be representative of their more general classes. In general, use of any specific exemplar is intended to be representative of its class, and the non-inclusion of specific components (e.g., operations), devices, and objects should not be taken limiting.
All of the above U.S. patents, U.S. patent application publications, U.S. patent applications, foreign patents, foreign patent applications and non-patent publications referred to in this specification and/or listed in any Application Data Sheet, are incorporated herein by reference, to the extent not inconsistent herewith.
While various aspects and embodiments have been disclosed herein, other aspects and embodiments will be apparent to those skilled in the art. The various aspects and embodiments disclosed herein are for purposes of illustration and are not intended to be limiting, with the true scope and spirit being indicated by the following claims.

Claims

What is claimed is:

1. A thermal transfer device for a storage container, the thermal transfer device comprising:

a housing including,

a top plate;

a first pillar extending from the top plate; and

a second pillar extending from the top plate;

at least one phase change material (PCM) container containing at least one first PCM and being configured to be positioned in thermal communication with the first pillar of the housing;

at least one PCM carrier containing at least one second PCM and being configured to be positioned in thermal communication with one or more of the first pillar or the second pillar; and

a heat pipe having a first thermal end thereof in thermal communication with one or more of the top plate, the first pillar, or the second pillar.

2. The thermal transfer device of claim 1, further including a base plate spaced from the top plate and from which the first and second pillars extend.

3. The thermal transfer device of claim 2, wherein the base plate is attached to the first and second pillars and positioned generally opposite to the top plate.

4. The thermal transfer device of claim 1, wherein the second pillar includes a first pillar portion and a second pillar portion connected together.

5. The thermal transfer device of claim 4, wherein the heat pipe is positioned between and secured in thermal communication to the first and second pillar portions.

6. The thermal transfer device of claim 1, wherein the heat pipe includes a second thermal end in thermal communication with one or more of a cooling unit or a heating unit.

7. The thermal transfer device of claim 6, wherein the second thermal end of the heat pipe is in thermal communication with a thermoelectric cooler (TEC) configured to cool the second thermal end of the heat pipe.

8. The thermal transfer device of claim 7, wherein the TEC includes a cold side in thermal communication with the second end of the heat pipe and a hot side in thermal communication with one or more secondary heat pipes at first thermal ends thereof.

9. The thermal transfer device of claim 7, further including an electronic controller operably coupled to the TEC and configured to control operation of the TEC.

10. The thermal transfer device of claim 8, wherein the one or more secondary heat pipes include second ends in thermal communication with one or more heat sinks.

11. The thermal transfer device of claim 10, further including one or more fans positioned to produce fluid flow across the one or more heat sinks.

12. The thermal transfer device of claim 1, wherein the at least one first PCM is substantial the same as the at least one second PCM.

13. The thermal transfer device of claim 1, wherein the at least one first PCM is different from the at least one second PCM.

14. The thermal transfer device of claim 1, wherein the at least one PCM container is fastenable to the first pillar.

15. The thermal transfer device of claim 14, wherein the at least one PCM container includes one or more pivotable locks, the first pillar includes one or more cutouts sized and positioned to accept corresponding ones of the one or more pivotable locks in a manner that pivoting of the one or more pivotable locks fastens or unfastens the at least one PCM container relative to the first pillar.

16. The thermal transfer device of claim 1, wherein the housing further includes a third pillar extending from the top plate and positioned substantially in a plane that is substantially parallel to the first and second pillars, the second pillar being positioned between the first pillar and the third panel.

17. The thermal transfer device of claim 16, wherein the at least one first PCM includes first and second PCM portions, and wherein the at least one PCM container includes a first PCM container containing the first PCM portion in thermal communication with the first pillar and a second PCM container containing the second PCM portion in thermal communication with the third pillar.

18. The thermal transfer device of claim 17, wherein the first PCM portion is the same as the second PCM portion.

19. The thermal transfer device of claim 17, wherein the first PCM container is fastenable to the first pillar and the second PCM container is fastenable to the third pillar.

20. The thermal transfer device of claim 19, wherein the second PCM container includes one or more pivotable locks, the third pillar includes one or more cutouts sized and positioned to accept the one or more pivotable locks in a manner that pivoting f corresponding ones of the one or more pivotable locks fastens or unfastens the second PCM container relative to the third panel.

21. The thermal transfer device of claim 1, wherein the at least one PCM carrier is removably positioned in a space defined by the first and second pillars.

22. The thermal transfer device of claim 21, wherein the at least one PCM carrier is magnetically securable to the housing.

23. The thermal transfer device of claim 1, wherein the at least one PCM carrier includes a first PCM carrier compartment and a second PCM carrier compartment, and wherein the at least one second PCM includes two or more PCM containers positioned inside the first and second PCM carrier compartments, respectively.

24. The thermal transfer device of claim 23, wherein the two or more PCM containers are sized and configured to removably fit inside the first and second PCM carrier compartments.

25. The thermal transfer device of claim 23, wherein each of the first PCM carrier compartment and the second PCM carrier compartment is defined by exterior walls and one or more interior walls.

26. The thermal transfer device of claim 25, wherein at least one of the exterior walls include one or more notches or openings extending therethrough.

27. The thermal transfer device of claim 25, wherein the at least one PCM carrier includes a flexible handle attached to at least one of the exterior walls thereof.

28. The thermal transfer device of claim 1, wherein the top plate is positioned substantially in a first plane, the first pillar is positioned substantially in a second plane that is substantially perpendicular to the first plane, and the second pillar is positioned substantially in a third plane that is substantially parallel to the second plane.

29. A temperature-stabilized container, comprising:

at least one first wall defining a storage space;

at least one second wall spaced outwardly from the at least one first wall and defining an insulation space therebetween;

a thermal transfer device including a first portion positioned inside the storage space, and a second portion positioned outside the storage space, the thermal transfer device including:

a housing including,

a top plate;

a first pillar extending from the top plate, the first pillar being positioned inside the storage space; and

a second pillar extending from the top plate, the second pillar being positioned inside the storage space;

at least one phase change material (PCM) carrier containing at least one second PCM and being in thermal communication with one or more of the first pillar or the second pillar, the at least one PCM carrier being positioned inside the storage space; and

30. The temperature-stabilized container of claim 29, wherein the thermal transfer device includes a base plate spaced from the top plate and from which the first and second pillars extend.

31. The temperature-stabilized container of claim 30, wherein the base plate of the thermal transfer device is attached to the first pillar and second pillar and positioned generally opposite to the top plate.

32. The temperature-stabilized container of claim 29, herein the second pillar of the thermal transfer device includes a first pillar portion and a second pillar portion connected together.

33. The temperature-stabilized container of claim 32, wherein the heat pipe of the thermal transfer device is positioned between and secured in thermal communication to the first and second pillar portions.

34. The temperature-stabilized container of claim 29, wherein the heat pipe includes a second thermal end in thermal communication with one or more of a cooling unit or a heating unit.

35. The temperature-stabilized container of claim 34, wherein the second thermal end of the heat pipe is in thermal communication with a thermoelectric cooler (TEC) configured to cool the second thermal end of the heat pipe.

36. The temperature-stabilized container of claim 35, wherein the TEC includes a cold side in thermal communication with the second end of the heat pipe and a hot side in thermal communication with one or more secondary heat pipes at first thermal ends thereof.

37. The temperature-stabilized container of claim 35, wherein the TEC is positioned outside of the storage chamber.

38. The temperature-stabilized container of claim 35, further including an electronic controller operably coupled to the TEC and configured to control operation of the TEC.

39. The temperature-stabilized container of claim 36, wherein the one or more secondary heat pipes include second ends in thermal communication with one or more heat sinks.

40. The temperature-stabilized container of claim 39, further including one or more fans positioned to produce fluid flow across the one or more heat sinks.

41. The temperature-stabilized container of claim 39, further including a cover at least partially enclosing the one or more heat sinks.

42. The temperature-stabilized container of claim 41, wherein the cover includes one or more vent openings sized and configured to allow air flow to the one or more heat sinks or from the one or more heat sinks.

43. The temperature-stabilized container of claim 29, further including at least one PCM container containing at least one first PCM and being in thermal communication with the first pillar of the housing, the at least one PCM container being positioned inside the storage space.

44. The temperature-stabilized container of claim 43, wherein the at least one first PCM is substantially the same as the at least one second PCM.

45. The temperature-stabilized container of claim 43, wherein the at least one first PCM is different from the at least one second PCM.

46. The temperature-stabilized container of claim 43, wherein the at least one PCM container is fastened to the first pillar.

47. The temperature-stabilized container of claim 46, wherein the at least one PCM container includes one or more pivotable locks, the first pillar includes one or more cutouts sized and positioned to accept corresponding ones of the one or more pivotable locks in a manner that pivoting of the one or more pivotable locks fastens or unfastens the at least one PCM container relative to the first

48. The temperature-stabilized container of claim 29, wherein the housing includes a third pillar extending from the top plate, the second pillar being positioned between the first pillar and the third panel.

49. The temperature-stabilized container of claim 43, wherein the at least one first PCM includes first and second PCM portions, and wherein the at least one PCM container includes a first PCM container containing the first PCM portion in thermal communication with the first pillar and a second PCM container containing the second PCM portion in thermal communication with the third pillar.

50. The temperature-stabilized container of claim 49, wherein the first PCM portion is the same as the second. PCM portion.

51. The temperature-stabilized container of claim 49, wherein the second PCM container is fastened to a third pillar extending from the top plate.

52. The temperature-stabilized container of claim 51,herein the second PCM container includes one or more pivotable locks, the third pillar includes one or more cutouts sized and positioned to accept the one or more pivotable locks in a manner that pivoting of corresponding ones of the one or more pivotable locks fastens or unfastens the second PCM container relative to the third panel.

53. The temperature-stabilized container of claim 29, wherein the at least one PCM carrier is removably positioned in a space defined by the first and second pillars.

54. The temperature-stabilized container of claim, wherein the at least one PCM carrier is magnetically secured to the housing.

55. The temperature-stabilized container of claim 29, wherein the at least one PCM carrier includes a first PCM carrier compartment and a second PCM carrier compartment, and wherein the at least one second PCM includes two or more PCM containers positioned inside the first and second PCM carrier compartments, respectively.

56. The temperature-stabilized container of claim 55, wherein the two or more PCM containers are sized and configured to removably fit inside the first and second PCM carrier compartments.

57. The temperature-stabilized container of claim 55, wherein each of the first PCM carrier compartment and the second. PCM carrier compartment is defined by exterior walls and one or more interior walls.

58. The temperature-stabilized container of claim 57, wherein the exterior walls of the at least one PCM carrier include one or more notches or openings extending therethrough.

59. The temperature-stabilized container of claim 57, wherein the at least one PCM carrier includes a flexible handle attached to at least one of the exterior walls thereof.

60. The temperature-stabilized container of claim 29, wherein the top plate is positioned substantially in a first plane, the first pillar is positioned substantially in a second plane that is substantially perpendicular to the first plane, and the second pillar is positioned substantially in a third plane that is substantially parallel to the second plane.

61. A method of maintaining a temperature in a closed storage space, the method comprising:

providing a temperature-stabilized container that includes,

a shell defining a storage space;

a thermal transfer device positioned inside the storage space, the thermal transfer device including,

a top plate;

at least one phase change material (PCM) container containing at least one first PCM and being in thermal communication with the first pillar of the housing, the at least one PCM container being positioned inside the storage space;

at least one PCM carrier containing at least one second PCM and being in thermal communication with one or more of the first pillar or the second pillar, the at least one PCM carrier being positioned inside the storage space; and

a heat pipe having a first thermal end thereof in thermal communication with one or more of the top plate, the first pillar or the second pillar; and

removing heat from the storage space by cooling a second thermal end of the heat pipe to produce heat transfer from the at least one first PCM and the at least one second PCM to the second end of heat pipe.

62. The method of claim 61, further including maintaining a selected temperature or a temperature range inside the storage space by:

measuring one or more of temperature inside the storage space, temperature of the at least one first or at least one second PCM, amount of the at least one first or at least one second PCM in a solid phase, or amount of the at least one first or at least one second PCM in a liquid phase; and

via a controller, operating a cooling device in thermal communication with the second thermal end of the heat pipe to cool the storage space to a selected temperature at least partially based on one or more of the measured temperature inside the storage space, temperature of the at least one first or at least one second PCM, amount of the at least one first or at least one second PCM in a solid phase, or amount of the first or at least one second PCM in a liquid phase.

63. The method of claim 62, wherein the cooling device includes thermoelectric cooler (TEC).

64. The method of claim 63, further including cooling a hot side of the TEC.

65. The method of claim 64, further including channeling heat from the hot side of the TEC to one or more heat sinks.

66. The method of claim 65, further including flowing air over the one or more heat sinks effective to remove heat therefrom.