US20160262252A1 - Substrate structure - Google Patents
Substrate structure Download PDFInfo
- Publication number
- US20160262252A1 US20160262252A1 US14/742,721 US201514742721A US2016262252A1 US 20160262252 A1 US20160262252 A1 US 20160262252A1 US 201514742721 A US201514742721 A US 201514742721A US 2016262252 A1 US2016262252 A1 US 2016262252A1
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- US
- United States
- Prior art keywords
- layer
- buffer layer
- substrate
- protecting layer
- connective
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 78
- 239000010410 layer Substances 0.000 claims description 185
- 239000011241 protective layer Substances 0.000 claims description 8
- 230000035939 shock Effects 0.000 description 15
- 239000000463 material Substances 0.000 description 7
- 239000002355 dual-layer Substances 0.000 description 5
- 239000011521 glass Substances 0.000 description 5
- 238000010586 diagram Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 239000000499 gel Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- 238000005728 strengthening Methods 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09145—Edge details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09145—Edge details
- H05K2201/09154—Bevelled, chamferred or tapered edge
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
Definitions
- the present invention relates to a substrate structure.
- a wide range of substrates is often designed to carry various elements. After the substrates are assembled to form relevant actual products, it is often possible for the actual products to receive serious damage from being hit on the edges. For example, a fall of the product may result in a strike upon the edge. Since the edge of the substrate has a small area to accept the force, a small impact can still cause a great stress, and therefore it is easy to create a crack after such a strike. In long term, the crack may become larger and bring some problems in the practical operation of the relevant products.
- the present invention provides a substrate structure including a buffer layer and a protecting layer.
- the buffer layer absorbs the external shock for reducing the external force exerted on the substrate.
- the protecting layer protects the shell of the substrate and the buffer layer from peeling or being damaged due to the external shock. In this way, when getting hit by the external force, the substrate can be protected from being destroyed by the buffer layer and the protecting layer.
- One aspect of the present invention provides a substrate structure, including a substrate, a buffer layer, and a protecting layer.
- the substrate includes a side surface.
- the buffer layer is disposed between the side surface and the protecting layer, and the hardness of the protecting layer is greater than the hardness of the buffer layer.
- the substrate structure further includes an inner protecting layer disposed between the side surface and the buffer layer, and a hardness of the inner protecting layer is greater than the hardness of the buffer layer.
- the hardness of the protecting layer is greater than the hardness of the inner protecting layer.
- a thickness of the protecting layer is in a range from about 10 micrometers to about 100 micrometers.
- a thickness of the buffer layer is in a range from about 30 micrometers to about 200 micrometers.
- the hardness of the protecting layer is in a range from about 85 Shore D to about 95 Shore D
- the hardness of the buffer layer is in a range from about 30 Shore D to about 80 Shore D.
- the substrate includes at least one surface and at least one connective round surface, the surface is perpendicular to the side surface, and the connective round surface is disposed between the surface and the side surface for connecting the surface and the side surface, in which the buffer layer covers the connective round surface and the side surface.
- the substrate includes at least one surface and at least one connective oblique surface, the surface is perpendicular to the side surface, and the connective oblique surface is disposed between the surface and the side surface for connecting the surface and the side surface, in which the buffer layer covers the connective oblique surface and the side surface, and the protective layer fully covers the buffer layer.
- the substrate includes two strengthened layers on a top surface and a bottom surface of the substrate respectively.
- FIG. 1 is a cross-sectional view of the substrate structure according to one embodiment of the present invention.
- FIG. 2 is a cross-sectional view of the substrate structure according to another embodiment of the present invention.
- FIG. 3 is a cross-sectional view of the substrate structure according to another embodiment of the present invention.
- FIG. 4 is a cross-sectional view of the substrate structure according to another embodiment of the present invention.
- FIG. 1 is a cross-sectional view of the substrate structure 100 according to one embodiment of the present invention.
- the substrate structure 100 includes a substrate 110 , a buffer layer 120 , and a protecting layer 130 .
- the substrate 110 includes a side surface 112 .
- the buffer layer 120 is disposed between the side surface 112 and the protecting layer 130 , and the hardness of the protecting layer 130 is greater than the hardness of the buffer layer 120 .
- the substrate 110 includes at least one surface 114 and at least one connective round surface 116 , the surface 114 is perpendicular to the side surface 112 , and the connective round surface 116 is disposed between the surface 114 and the side surface 112 for connecting the surface 114 and the side surface 112 .
- the connective round surface 116 can be formed by plural steps in the processing of the substrate, such as cutting, computer numerical control (CNC) processing, edge polishing, hydrofluoric acid etching, re-strengthening, etc.
- CNC computer numerical control
- edge polishing edge polishing
- hydrofluoric acid etching hydrofluoric acid etching
- re-strengthening re-strengthening
- the substrate 110 can be a touch glass or a thin film transistor (TFT) glass.
- the substrate can be a one-glass-solution (OGS) touch screen. Through one glass, the OGS touch screen achieves dual effects simultaneously, which are to protect the glass, and to sense the touch.
- OGS one-glass-solution
- the substrate structure 100 can optionally include strengthened layers 150 , an electrode layer 140 , and a light-shielding layer 180 .
- the substrate 110 includes a surface 115 disposed opposite the surface 114 .
- the strengthened layers 150 is disposed on the surface 114 and the surface 115 of the substrate 110 to enhance the hardness of the substrate 110 .
- the strengthened layers 150 can fully cover the surface 114 and the surface 115 of the substrate 110 , and prevent the surface 114 and the surface 115 from being exposed.
- the hardness of the protecting layer 130 is in a range from about 85 Shore D to about 95 Shore D, and the hardness of the buffer layer 120 is in a range from about 30 Shore D to about 80 Shore D.
- the surface 132 of the protecting layer 130 is configured with a surface hardness greater than a pencil hardness of 3H.
- the materials of the protecting layer 130 can be epoxy gels
- the materials of the buffer layer 120 can be acrylic gels.
- Both the protecting layer 130 and the buffer layer 120 can be formed by applying the material on the side surface 112 and the connective round surface 116 with the use of sprays or dispensers. Of course, it is fine to spray plural substrates at the same time, thereby reaching the purposes of mass production.
- a thickness of the protecting layer 130 is in a range from about 10 micrometers to about 100 micrometers.
- a thickness of the buffer layer 120 is in a range from about 30 micrometers to about 200 micrometers.
- the sum thickness of the protecting layer 130 and the buffer layer 120 is in a range from about 40 micrometers to about 300 micrometers, ideally, the sum thickness of the protecting layer 130 and the buffer layer 120 is in a range from about 40 micrometers to about 250 micrometers.
- the buffer layer 120 covers the side surface 112 and the connective round surface 116
- the protecting layer 130 fully covers the buffer layer 120 and prevents the buffer layer 120 from being exposed.
- the side surface 112 and the connective round surface 116 are at least protected by dual layers, the buffer layer 120 and the protecting layer 130 .
- the buffer layer 120 is substantially limited between the protecting layer 130 and the connective round surface 116 , and between the protecting layer 130 and the side surface 112 .
- the strengthened layers 150 can be connected with the buffer layer 120 and the protecting layer 130 , and therefore a consecutive strengthened structure is formed on the surface 114 , the side surface 112 , and the connective round surface 116 of the substrate 110 . In this way, the substrate 110 is totally surrounded and wrapped by the strengthened structure.
- the strengthened layers 150 can be disconnected from the buffer layer 120 and the protecting layer 130 .
- the surface 114 , the side surface 112 , and the connective round surface 116 of the substrate 110 are effective surrounded and protected by the strengthened layers 150 , the buffer layer 120 , and the protecting layer 130 , and therefore are prevented from the direct strike.
- the dual-layer protection of the buffer layer 120 and the protecting layer 130 can reduce the force impacted on the side surface 112 and the connective round surface 116 .
- the surface 132 of the protecting layer 130 with a higher hardness accepts the shock, and disperses the shock from a dot to an area to distract the intensity. Then, the buffer layer 120 deforms to absorb the shock from the protecting layer 130 to reduce the intensity of the shock. The final force exerted on the side surface 112 and the connective round surface 116 has been distracted and reduced, and therefore the impact force greatly decreases.
- the surface 132 of the protective layer 130 has the higher surface hardness, therefore the surface 132 has an anti-scratch effect. Also, the protective layer 130 with the high hardness can protect the buffer layer 120 from being scratched or peeling and thereto being destroyed due to external collision.
- plural buffer layers 120 and protective layers 130 can be configured in the substrate structure with an adequate stack sequence, and the substrate structure can also reach the effect of reducing the impact force.
- FIG. 2 is a cross-sectional view of the substrate structure 100 according to another embodiment of the present invention. This embodiment is similar to the embodiment of FIG. 1 , and the difference is that: in this embodiment, the substrate structure 100 further includes an inner protecting layer 160 disposed between the side surface 112 and the buffer layer 120 .
- the hardness of the protecting layer 130 is greater than or equal to the hardness of the inner protecting layer 160
- a hardness of the inner protecting layer 160 is greater than the hardness of the buffer layer 120 .
- the inner protecting layer 160 covers the side surface 112 and the connective round surface 116
- the buffer layer 120 fully covers the inner protecting layer 160 , preventing the inner protecting layer 160 from being exposed.
- the protecting layer 130 also fully covers the buffer layer 120 , preventing the buffer layer 120 from being exposed.
- the side surface 112 and the connective round surface 116 are protected by at least three layers, which are inner protecting layer 160 , buffer layer 120 , and the protecting layer 130 .
- the inner protecting layer 160 is substantially limited between the buffer layer 120 and the connective round surface 116 , and between the buffer layer 120 and the side surface 112 .
- the buffer layer 120 is substantially limited between the protecting layer 130 and the inner protecting layer 160 .
- the protecting layer 130 and the inner protecting layer 160 can be made of the same materials.
- the protecting layer 130 and the inner protecting layer 160 can be made of different materials having high hardness, in which the materials of the protecting layer 130 have high surface hardness.
- a thickness of the inner protecting layer 160 is in a range from about 20 micrometers to about 100 micrometers
- a sum thickness of inner protecting layer 160 , the protecting layer 130 , and the buffer layer 120 is preferably in a range from about 40 micrometers to about 200 micrometers.
- Other configurations of the hardness and thickness of the buffer layer 120 and the protecting layer 130 of this embodiment are substantially the same as the embodiment of FIG. 1 , and therefore not repeated herein.
- the side surface 112 and the connective round surface 116 are prevented from being hit directly.
- the surface 132 of the protecting layer 130 with the higher surface hardness accepts the shock, and disperses the shock from a dot to an area to distract the intensity.
- the buffer layer 120 deforms to absorb the impact to reduce the intensity of the shock.
- the inner protecting layer 160 with a higher hardness disperses the shock.
- the final force exerted on the side surface 112 and the connective round surface 116 has been distracted, reduced, and distracted again, and therefore the impact force has been greatly decreased.
- the surface 132 of the protective layer 130 has the higher surface hardness, the surface 132 has an anti-scratch effect.
- the protective layer 130 with the high hardness can protect the buffer layer 120 from peeling and being destroyed due to external collision, and the inner protective layer 160 with the high hardness can protect the substrate 110 from peeling and being destroyed due to external collision.
- FIG. 3 is a cross-sectional view of the substrate structure 100 according to another embodiment of the present invention.
- the substrate 110 includes a connective oblique surface 118 instead of the connective round surface 116 (referring to FIG. 1 ).
- the connective oblique surface 118 is disposed between the surface 114 and the side surface 112 for connecting the surface 114 and the side surface 112 .
- the buffer layer 120 covers the side surface 112 and the connective oblique surface 118 , and the protecting layer 130 fully covers the buffer layer 120 , preventing the buffering layer 120 from being exposed.
- the side surface 112 and the connective oblique surface 118 are at least protected by dual layers, the buffer layer 120 and the protecting layer 130 .
- the buffer layer 120 is substantially limited between the protecting layer 130 and the connective oblique surface 118 , and between protecting layer 130 and the side surface 112 .
- the connective oblique surface 118 can be formed by plural steps in the processing of the substrate, such as cutting, computer numerical control (CNC) processing, etc.
- the size and slope of the connective oblique surface 118 can be designed in accordance with the requirements of actual situation. Comparing to the connective round surface 116 (referring to FIG. 1 ), the connective oblique surface 118 can be fabricated without the steps of polishing and etching, and therefore the steps in the processing of the substrate can be simplified.
- the configuration of the connective oblique surface 118 can affect the shapes of the buffer layer 120 and the protecting layer 130 .
- the protecting layer 130 and the buffer layer 120 can be formed on the side surface 112 and the connective round surface 116 by spraying or dispensing, and therefore the shapes of the buffer layer 120 and the protecting layer 130 are influenced by the connective oblique surface 118 and the side surface 112 . In this way, how the buffer layer 120 and the protecting layer 130 accept the impact force is influenced.
- the tilt angle of the connective oblique surface 118 can be designed to be larger, and the buffer layer 120 and the protecting layer 130 at the connective oblique surface 118 can be designed to be thicker, thereby enhancing the ability of the connective oblique surface 118 to withstand the shock.
- FIG. 4 is a cross-sectional view of the substrate structure 100 according to another embodiment of the present invention. This embodiment is similar to the embodiment of FIG. 1 , and the difference is that: in this embodiment, the surface 114 and the side surface 112 are connected directly, and the substrate 110 does not include the connective round surface 116 (referring to FIG. 1 ).
- the buffer layer 120 covers the side surface 112 , and the protecting layer 130 fully covers the buffer layer 120 , preventing the buffer layer 120 from being exposed.
- the side surface 112 is at least protected by dual layers, the buffer layer 120 and the protecting layer 130 .
- the buffer layer 120 is substantially limited between the protecting layer 130 and the side surface 112 .
- the substrate structure 100 of this embodiment is configured with neither the connective round surface 116 (referring to FIG. 1 ) nor the connective oblique surface 118 (referring to FIG. 3 ), the plural steps in the fabrication process can be simplified. Moreover, since the buffer layer 120 and the protecting layer 130 are only attached to the side surface 112 , the buffer layer 120 and the protecting layer 130 can be designed to include a uniform thickness and shape. Comparing to the previous embodiments, the configuration of this embodiment can minify the volume occupied by the buffer layer 120 and the protecting layer 130 , and therefore the substrate structure 100 can be applied to panel structures with limited space.
- the present invention provides a substrate structure including a buffer layer and a protecting layer.
- the buffer layer absorbs the external shock for reducing the external force exerted on the substrate.
- the protecting layer protects the shell of the substrate and the buffer layer from peeling or being damaged due to the external shock. In this way, when getting hit by an external force, the substrate can be protected from being destroyed by the buffer layer and the protecting layer.
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- General Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
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- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
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- Surface Treatment Of Glass (AREA)
Abstract
Description
- This application claims priority to Chinese Application Serial Number 201510099000.6, filed Mar. 5, 2015, which is herein incorporated by reference.
- 1. Field of Invention
- The present invention relates to a substrate structure.
- 2. Description of Related Art
- In the field of touch panels and display panels, a wide range of substrates is often designed to carry various elements. After the substrates are assembled to form relevant actual products, it is often possible for the actual products to receive serious damage from being hit on the edges. For example, a fall of the product may result in a strike upon the edge. Since the edge of the substrate has a small area to accept the force, a small impact can still cause a great stress, and therefore it is easy to create a crack after such a strike. In long term, the crack may become larger and bring some problems in the practical operation of the relevant products.
- The present invention provides a substrate structure including a buffer layer and a protecting layer. The buffer layer absorbs the external shock for reducing the external force exerted on the substrate. The protecting layer protects the shell of the substrate and the buffer layer from peeling or being damaged due to the external shock. In this way, when getting hit by the external force, the substrate can be protected from being destroyed by the buffer layer and the protecting layer.
- One aspect of the present invention provides a substrate structure, including a substrate, a buffer layer, and a protecting layer. The substrate includes a side surface. The buffer layer is disposed between the side surface and the protecting layer, and the hardness of the protecting layer is greater than the hardness of the buffer layer.
- In one or more embodiments of the present invention, the substrate structure further includes an inner protecting layer disposed between the side surface and the buffer layer, and a hardness of the inner protecting layer is greater than the hardness of the buffer layer.
- In one or more embodiments of the present invention, the hardness of the protecting layer is greater than the hardness of the inner protecting layer.
- In one or more embodiments of the present invention, a thickness of the protecting layer is in a range from about 10 micrometers to about 100 micrometers.
- In one or more embodiments of the present invention, a thickness of the buffer layer is in a range from about 30 micrometers to about 200 micrometers.
- In one or more embodiments of the present invention, the hardness of the protecting layer is in a range from about 85 Shore D to about 95 Shore D, and the hardness of the buffer layer is in a range from about 30 Shore D to about 80 Shore D.
- In one or more embodiments of the present invention, the substrate is a one-glass-solution touch screen.
- In one or more embodiments of the present invention, the substrate includes at least one surface and at least one connective round surface, the surface is perpendicular to the side surface, and the connective round surface is disposed between the surface and the side surface for connecting the surface and the side surface, in which the buffer layer covers the connective round surface and the side surface.
- In one or more embodiments of the present invention, the substrate includes at least one surface and at least one connective oblique surface, the surface is perpendicular to the side surface, and the connective oblique surface is disposed between the surface and the side surface for connecting the surface and the side surface, in which the buffer layer covers the connective oblique surface and the side surface, and the protective layer fully covers the buffer layer.
- In one or more embodiments of the present invention, the substrate includes two strengthened layers on a top surface and a bottom surface of the substrate respectively.
- The invention can be more fully understood by reading the following detailed description of the embodiment, with reference made to the accompanying drawings as follows:
-
FIG. 1 is a cross-sectional view of the substrate structure according to one embodiment of the present invention; -
FIG. 2 is a cross-sectional view of the substrate structure according to another embodiment of the present invention; -
FIG. 3 is a cross-sectional view of the substrate structure according to another embodiment of the present invention; and -
FIG. 4 is a cross-sectional view of the substrate structure according to another embodiment of the present invention. - The following embodiments are disclosed with accompanying diagrams for detailed description. For illustration clarity, many details of practice are explained in the following descriptions. However, it should be understood that these details of practice do not intend to limit the present invention. That is, these details of practice are not necessary in parts of embodiments of the present invention. Furthermore, for simplifying the drawings, some of the conventional structures and elements are shown with schematic illustrations.
-
FIG. 1 is a cross-sectional view of thesubstrate structure 100 according to one embodiment of the present invention. Thesubstrate structure 100 includes asubstrate 110, abuffer layer 120, and a protectinglayer 130. Thesubstrate 110 includes aside surface 112. Thebuffer layer 120 is disposed between theside surface 112 and the protectinglayer 130, and the hardness of the protectinglayer 130 is greater than the hardness of thebuffer layer 120. - In this embodiment, the
substrate 110 includes at least onesurface 114 and at least oneconnective round surface 116, thesurface 114 is perpendicular to theside surface 112, and theconnective round surface 116 is disposed between thesurface 114 and theside surface 112 for connecting thesurface 114 and theside surface 112. Theconnective round surface 116 can be formed by plural steps in the processing of the substrate, such as cutting, computer numerical control (CNC) processing, edge polishing, hydrofluoric acid etching, re-strengthening, etc. Herein, the size and curvature of theconnective round surface 116 can be designed in accordance with the requirements of actual situation. - In one or more embodiments of the present invention, the
substrate 110 can be a touch glass or a thin film transistor (TFT) glass. Especially, the substrate can be a one-glass-solution (OGS) touch screen. Through one glass, the OGS touch screen achieves dual effects simultaneously, which are to protect the glass, and to sense the touch. - The
substrate structure 100 can optionally include strengthenedlayers 150, anelectrode layer 140, and a light-shielding layer 180. Thesubstrate 110 includes asurface 115 disposed opposite thesurface 114. By a strengthening process, the strengthenedlayers 150 is disposed on thesurface 114 and thesurface 115 of thesubstrate 110 to enhance the hardness of thesubstrate 110. In one or more embodiments of the present invention, the strengthenedlayers 150 can fully cover thesurface 114 and thesurface 115 of thesubstrate 110, and prevent thesurface 114 and thesurface 115 from being exposed. - After forming the strengthened
layers 150, the light-shielding layer 180 can be formed on one of the strengthenedlayers 150. Then, theelectrode layer 140 is formed on a side of the light-shielding layer 180 opposite thesubstrate 110. It is noted that neither theelectrode layer 140 nor the light-shielding layer 180 are necessary configurations, and thesubstrate 110 can be an ordinary glass without the configuration of electrodes. - In one or more embodiments of the present invention, the hardness of the protecting
layer 130 is in a range from about 85 Shore D to about 95 Shore D, and the hardness of thebuffer layer 120 is in a range from about 30 Shore D to about 80 Shore D. In addition, thesurface 132 of the protectinglayer 130 is configured with a surface hardness greater than a pencil hardness of 3H. - In the configuration of materials, the materials of the protecting
layer 130 can be epoxy gels, and the materials of thebuffer layer 120 can be acrylic gels. Both the protectinglayer 130 and thebuffer layer 120 can be formed by applying the material on theside surface 112 and theconnective round surface 116 with the use of sprays or dispensers. Of course, it is fine to spray plural substrates at the same time, thereby reaching the purposes of mass production. - In one or more embodiments of the present invention, a thickness of the protecting
layer 130 is in a range from about 10 micrometers to about 100 micrometers. A thickness of thebuffer layer 120 is in a range from about 30 micrometers to about 200 micrometers. Though the sum thickness of theprotecting layer 130 and thebuffer layer 120 is in a range from about 40 micrometers to about 300 micrometers, ideally, the sum thickness of theprotecting layer 130 and thebuffer layer 120 is in a range from about 40 micrometers to about 250 micrometers. It should be understood that, the diagrams provided by the present invention are only used to schematically illustrate the concepts of the embodiments of the present invention. The relative size depicted in the diagrams, such as thickness, length, etc. should not be used to limit the scope of the present invention. - In this embodiment, the
buffer layer 120 covers theside surface 112 and the connectiveround surface 116, and theprotecting layer 130 fully covers thebuffer layer 120 and prevents thebuffer layer 120 from being exposed. In other words, theside surface 112 and the connectiveround surface 116 are at least protected by dual layers, thebuffer layer 120 and theprotecting layer 130. Thebuffer layer 120 is substantially limited between the protectinglayer 130 and the connectiveround surface 116, and between the protectinglayer 130 and theside surface 112. - Ideally, the strengthened
layers 150 can be connected with thebuffer layer 120 and theprotecting layer 130, and therefore a consecutive strengthened structure is formed on thesurface 114, theside surface 112, and the connectiveround surface 116 of thesubstrate 110. In this way, thesubstrate 110 is totally surrounded and wrapped by the strengthened structure. However, it should not limit the scope of the present invention. The strengthened layers 150 can be disconnected from thebuffer layer 120 and theprotecting layer 130. - In this embodiment, the
surface 114, theside surface 112, and the connectiveround surface 116 of thesubstrate 110 are effective surrounded and protected by the strengthenedlayers 150, thebuffer layer 120, and theprotecting layer 130, and therefore are prevented from the direct strike. - Generally, when the
substrate 110 is hit, since theside surface 112 and the connectiveround surface 116 has a small area to accept the external shock, damage easily occurs due to huge pressures. In this embodiment, for the shock on the side surface, the dual-layer protection of thebuffer layer 120 and theprotecting layer 130 can reduce the force impacted on theside surface 112 and the connectiveround surface 116. - To be specific, the
surface 132 of theprotecting layer 130 with a higher hardness accepts the shock, and disperses the shock from a dot to an area to distract the intensity. Then, thebuffer layer 120 deforms to absorb the shock from the protectinglayer 130 to reduce the intensity of the shock. The final force exerted on theside surface 112 and the connectiveround surface 116 has been distracted and reduced, and therefore the impact force greatly decreases. - Herein, since the
surface 132 of theprotective layer 130 has the higher surface hardness, therefore thesurface 132 has an anti-scratch effect. Also, theprotective layer 130 with the high hardness can protect thebuffer layer 120 from being scratched or peeling and thereto being destroyed due to external collision. - Though the composite structure of dual layers are introduces herein, it should not limit the scope of the present invention. In some embodiment, plural buffer layers 120 and
protective layers 130 can be configured in the substrate structure with an adequate stack sequence, and the substrate structure can also reach the effect of reducing the impact force. -
FIG. 2 is a cross-sectional view of thesubstrate structure 100 according to another embodiment of the present invention. This embodiment is similar to the embodiment ofFIG. 1 , and the difference is that: in this embodiment, thesubstrate structure 100 further includes aninner protecting layer 160 disposed between theside surface 112 and thebuffer layer 120. The hardness of theprotecting layer 130 is greater than or equal to the hardness of theinner protecting layer 160, and a hardness of theinner protecting layer 160 is greater than the hardness of thebuffer layer 120. - In this embodiment, the
inner protecting layer 160 covers theside surface 112 and the connectiveround surface 116, and thebuffer layer 120 fully covers theinner protecting layer 160, preventing theinner protecting layer 160 from being exposed. Then, the protectinglayer 130 also fully covers thebuffer layer 120, preventing thebuffer layer 120 from being exposed. In other words, theside surface 112 and the connectiveround surface 116 are protected by at least three layers, which areinner protecting layer 160,buffer layer 120, and theprotecting layer 130. Theinner protecting layer 160 is substantially limited between thebuffer layer 120 and the connectiveround surface 116, and between thebuffer layer 120 and theside surface 112. Thebuffer layer 120 is substantially limited between the protectinglayer 130 and theinner protecting layer 160. - In this embodiment, the protecting
layer 130 and theinner protecting layer 160 can be made of the same materials. On the other hand, the protectinglayer 130 and theinner protecting layer 160 can be made of different materials having high hardness, in which the materials of theprotecting layer 130 have high surface hardness. Ideally, a thickness of theinner protecting layer 160 is in a range from about 20 micrometers to about 100 micrometers, and a sum thickness ofinner protecting layer 160, the protectinglayer 130, and thebuffer layer 120 is preferably in a range from about 40 micrometers to about 200 micrometers. Other configurations of the hardness and thickness of thebuffer layer 120 and theprotecting layer 130 of this embodiment are substantially the same as the embodiment ofFIG. 1 , and therefore not repeated herein. - In this embodiment, through the three-layer protection of the
buffer layer 120, the protectinglayer 130, and theinner protecting layer 160, theside surface 112 and the connectiveround surface 116 are prevented from being hit directly. To be specific, thesurface 132 of theprotecting layer 130 with the higher surface hardness accepts the shock, and disperses the shock from a dot to an area to distract the intensity. Next, thebuffer layer 120 deforms to absorb the impact to reduce the intensity of the shock. Then, theinner protecting layer 160 with a higher hardness disperses the shock. The final force exerted on theside surface 112 and the connectiveround surface 116 has been distracted, reduced, and distracted again, and therefore the impact force has been greatly decreased. - Herein, since the
surface 132 of theprotective layer 130 has the higher surface hardness, thesurface 132 has an anti-scratch effect. Theprotective layer 130 with the high hardness can protect thebuffer layer 120 from peeling and being destroyed due to external collision, and the innerprotective layer 160 with the high hardness can protect thesubstrate 110 from peeling and being destroyed due to external collision. - Other details of this embodiment are substantially the same as the embodiment of
FIG. 1 , and thereto not repeated herein. -
FIG. 3 is a cross-sectional view of thesubstrate structure 100 according to another embodiment of the present invention. This embodiment is similar to the embodiment ofFIG. 1 , and the difference is that: in this embodiment, thesubstrate 110 includes aconnective oblique surface 118 instead of the connective round surface 116 (referring toFIG. 1 ). Theconnective oblique surface 118 is disposed between thesurface 114 and theside surface 112 for connecting thesurface 114 and theside surface 112. - In this embodiment, the
buffer layer 120 covers theside surface 112 and theconnective oblique surface 118, and theprotecting layer 130 fully covers thebuffer layer 120, preventing thebuffering layer 120 from being exposed. In other words, theside surface 112 and theconnective oblique surface 118 are at least protected by dual layers, thebuffer layer 120 and theprotecting layer 130. Thebuffer layer 120 is substantially limited between the protectinglayer 130 and theconnective oblique surface 118, and between protectinglayer 130 and theside surface 112. - In this embodiment, the
connective oblique surface 118 can be formed by plural steps in the processing of the substrate, such as cutting, computer numerical control (CNC) processing, etc. The size and slope of theconnective oblique surface 118 can be designed in accordance with the requirements of actual situation. Comparing to the connective round surface 116 (referring toFIG. 1 ), theconnective oblique surface 118 can be fabricated without the steps of polishing and etching, and therefore the steps in the processing of the substrate can be simplified. - Furthermore, the configuration of the
connective oblique surface 118 can affect the shapes of thebuffer layer 120 and theprotecting layer 130. As illustrated previously, the protectinglayer 130 and thebuffer layer 120 can be formed on theside surface 112 and the connectiveround surface 116 by spraying or dispensing, and therefore the shapes of thebuffer layer 120 and theprotecting layer 130 are influenced by theconnective oblique surface 118 and theside surface 112. In this way, how thebuffer layer 120 and theprotecting layer 130 accept the impact force is influenced. For example, the tilt angle of theconnective oblique surface 118 can be designed to be larger, and thebuffer layer 120 and theprotecting layer 130 at theconnective oblique surface 118 can be designed to be thicker, thereby enhancing the ability of theconnective oblique surface 118 to withstand the shock. - Other details of this embodiment are substantially the same as the embodiment of
FIG. 1 , and thereto not repeated herein. -
FIG. 4 is a cross-sectional view of thesubstrate structure 100 according to another embodiment of the present invention. This embodiment is similar to the embodiment ofFIG. 1 , and the difference is that: in this embodiment, thesurface 114 and theside surface 112 are connected directly, and thesubstrate 110 does not include the connective round surface 116 (referring toFIG. 1 ). - In this embodiment, the
buffer layer 120 covers theside surface 112, and theprotecting layer 130 fully covers thebuffer layer 120, preventing thebuffer layer 120 from being exposed. In other words, theside surface 112 is at least protected by dual layers, thebuffer layer 120 and theprotecting layer 130. Thebuffer layer 120 is substantially limited between the protectinglayer 130 and theside surface 112. - Comparing to the previous embodiments, since the
substrate structure 100 of this embodiment is configured with neither the connective round surface 116 (referring toFIG. 1 ) nor the connective oblique surface 118 (referring toFIG. 3 ), the plural steps in the fabrication process can be simplified. Moreover, since thebuffer layer 120 and theprotecting layer 130 are only attached to theside surface 112, thebuffer layer 120 and theprotecting layer 130 can be designed to include a uniform thickness and shape. Comparing to the previous embodiments, the configuration of this embodiment can minify the volume occupied by thebuffer layer 120 and theprotecting layer 130, and therefore thesubstrate structure 100 can be applied to panel structures with limited space. - Other details of this embodiment are substantially the same as the embodiment of
FIG. 1 , and thereto not repeated herein. - The present invention provides a substrate structure including a buffer layer and a protecting layer. The buffer layer absorbs the external shock for reducing the external force exerted on the substrate. The protecting layer protects the shell of the substrate and the buffer layer from peeling or being damaged due to the external shock. In this way, when getting hit by an external force, the substrate can be protected from being destroyed by the buffer layer and the protecting layer.
- Although the present invention has been disclosed in the above embodiments, but it should not be used to limit the present invention. It will be apparent to those skilled in the art that various modifications and variations can be made to the present invention without departing from the scope or spirit of the invention. In view of the foregoing, it is intended that the scope of present invention is defined in the following claims.
Claims (10)
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CN201510099000.6A CN104699300B (en) | 2015-03-05 | 2015-03-05 | Board structure |
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CN201510099000 | 2015-03-05 |
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US9420681B1 (en) | 2016-08-16 |
TW201633083A (en) | 2016-09-16 |
TWI578201B (en) | 2017-04-11 |
CN104699300B (en) | 2018-07-06 |
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