US20160184968A1

US20160184968A1 - Nozzle body for wet-blast processing appratus

Info

Publication number: US20160184968A1
Application number: US14/945,588
Authority: US
Inventors: Sachito MATSUBARA; Masanori TSUCHIDA
Original assignee: Macoho Co Ltd
Current assignee: Macoho Co Ltd
Priority date: 2014-12-25
Filing date: 2015-11-19
Publication date: 2016-06-30
Also published as: JP2016120572A

Abstract

The purpose of the present invention is to provide a nozzle body for an innovative wet-blast processing apparatus that demonstrates unprecedented effects. The present invention is a nozzle body for a wet-blast processing apparatus in which a slurry (4) formed by mixing an abrasive (3) in a liquid (2) can be jetted together with pressurized air. The nozzle body removes burrs attached to a terminal (20 b) of a semiconductor package (20) formed by providing a wiring substrate with an electronic component such as a semiconductor integrated circuit chip and covering the semiconductor package (20) with a synthetic resin. The nozzle body has a slurry-jetting opening (5) for jetting the slurry (4) to the tip of a cylindrical main body (6). The slurry-jetting opening (5) is formed having a polygonal shape in cross-section.

Description

TECHNICAL FIELD

The present invention relates to a nozzle body for a wet-blast processing apparatus.

BACKGROUND ART

Wet-blast processing has conventionally been performed as a method for removing resin burrs attached to terminals of semiconductor packages formed by providing a wiring substrate with an electronic component such as a semiconductor integrated circuit chip and covering the semiconductor package with a synthetic resin. The present applicants have proposed the nozzle body disclosed in Japanese Patent Publication No. 3393664 (hereinafter, referred to as the “conventional art example”) as a nozzle body for a wet-blast processing apparatus for resin deburring. Resin burrs mainly attach near the base part of terminals (area continuously connecting the area covered by the synthetic resin and the terminal).
This conventional art example has a main body having a space with which it is possible to maintain the interior at constant pressure, the conventional art example being configured so that a nozzle cylindrical body is provided inside the space, a pressurized-air-supplying part is provided to a base end of the nozzle cylindrical body, a communication hole is provided to a prescribed position of the nozzle cylindrical body inside the space, a slurry introduction part and a slurry output part for introducing and outputting a slurry at a prescribed pressure are respectively provided to the space, the slurry inside the space is maintained at a constant pressure, and the slurry maintained at a constant pressure inside the space can be drawn in and introduced into the nozzle cylindrical body via the communication hole of the nozzle cylindrical body.
The conventional art example is therefore configured so that the slurry inside the space is maintained at a good balance at a prescribed pressure and drawn in from the communication hole by the presence of the slurry introduction part and the slurry output part, injection is not intermittent, and removal of resin burrs can be performed very effectively.
Patent Document 1: Japanese Patent Publication No. 3393664

SUMMARY OF THE INVENTION

Problems to be Solved by the Invention

As a result of further advancements in research and development of the above-described nozzle body, the present applicants have invented an innovative nozzle body for wet-blast processing that demonstrates unprecedented effects.
The main point of the present invention will be described with reference to the annexed drawings.
In a nozzle body for a wet-blast processing apparatus according to a first aspect of the invention, a slurry 4 formed by mixing an abrasive 3 in a liquid 2 is jetted together with pressurized air, the nozzle body removing a burr attached to a terminal 20 b of a semiconductor package 20 formed by providing a wiring substrate with an electronic component such as a semiconductor integrated circuit chip and covering the semiconductor package 20 with a synthetic resin, the nozzle body having a slurry-jetting opening 5 for jetting the slurry 4 to a tip of a cylindrical main body 6, and the slurry-jetting opening 5 being formed having a polygonal shape in cross-section.
A nozzle body for a wet-blast processing apparatus according to a second aspect of the invention, is the wet-blast processing apparatus according to the first aspect, wherein the slurry-jetting opening 5 has a square shape in cross-section.
A nozzle body for a wet-blast processing apparatus according to a third aspect of the invention, is the wet-blast processing apparatus according to the first or second aspect, wherein, wherein a cylindrical main body 6 provided with a cylinder hole having a square shape in cross-section is used as the cylindrical main body 6.
A nozzle body for a wet-blast processing apparatus according to a fourth aspect of the invention, is the wet-blast processing apparatus according to the first aspect, wherein the opening dimensions of the slurry-jetting opening 5 are set to a length of about 6 mm and a width of about 3 mm.
A nozzle body for a wet-blast processing apparatus according to a fifth aspect of the invention, is the wet-blast processing apparatus according to the second aspect, wherein the opening dimensions of the slurry-jetting opening 5 are set to a length of about 6 mm and a width of about 3 mm.
A nozzle body for a wet-blast processing apparatus according to a sixth aspect of the invention, is the wet-blast processing apparatus according to the third aspect, wherein the opening dimensions of the slurry-jetting opening 5 are set to a length of about 6 mm and a width of about 3 mm.

Effect of the Invention

Due to being configured as described above, the present invention is an innovative nozzle body for wet-blast processing that makes it possible to perform wet-blast processing of a semiconductor package quickly and efficiently, and demonstrates other unprecedented effects.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is an explanatory view of the present example in a state of use;

FIG. 2 is a lateral cross-sectional view of the present example;

FIG. 3 is a cross-sectional view along line A-A in FIG. 2;

FIG. 4 is a perspective view illustrating the principal part of the present example;

FIG. 5 is an explanatory view of the present example in a state of use;

FIG. 6 is a perspective view illustrating the principal part of a conventional art example; and

FIG. 7 is an explanatory view of a conventional art example in a state of use.

DESCRIPTION OF THE PREFERRED EMBODIMENTS

Preferred embodiments of the present invention are described merely by indicating the effect of the present invention on the basis of the accompanying drawings.
A slurry 4 that has passed through a cylindrical main body is jetted from a slurry-jetting opening 5, the slurry 4 is jetted onto a resin burr attached to, for example, a base part of a terminal 20 b, and the resin burr is removed.
In the present invention, the slurry-jetting opening 5 has a polygonal shape in cross-section, the slurry 4 jetted from the slurry-jetting opening 5 is in the shape of a rectangular prism, and processing is performed with good efficiency.
That is, when a semiconductor package 20 undergoes wet-blast processing, it is necessary that an area 20 a covered by a synthetic resin not be jetted by the slurry 4. The slurry 4 is jetted along the outer edge of the area 20 a covered by the synthetic resin, but the outer edge area of the jetted slurry is arcuate when the slurry-jetting opening 53 is circular, as illustrated in FIG. 6, and the outer edge of the area 20 a covered by the synthetic resin is linear, as illustrated in FIG. 7, resulting in poor processing efficiency.
Inasmuch, because, in the present invention, the slurry 4 is jetted in the shape of a rectangular prism from the slurry-jetting opening 5, and the outer edge area of the jetted slurry 4 is linear, the jetted surface area relative to the outer edge of the area 20 a covered by the synthetic resin is larger than in the above-described case in which the slurry-jetting opening 5 is circular, as illustrated in FIG. 5, and resin burrs can be removed quickly and with good processing efficiency.

EXAMPLE

Specific examples of the present invention will be described on the basis of the drawings.
The present example is a nozzle body M for a wet-blast processing apparatus in which a slurry 4 formed by mixing an abrasive 3 in a liquid 2 is jetted together with pressurized air, the nozzle body M removing a burr (resin burr 30) attached to a terminal 20 b of a semiconductor package 20 formed by providing a wiring substrate with an electronic component such as a semiconductor integrated circuit chip and covering the semiconductor package 20 with a synthetic resin.
Specifically, the wet-blast processing apparatus is: provided to a base body 21 through which the semiconductor package 20 which is a body to be processed passes, as illustrated in FIG. 1; equipped with a slurry-jetting part comprising the nozzle body M, a slurry-accumulating part 22 installed in a lower position, and a slurry-conveying part 24 for conveying the slurry from the slurry-accumulating part 22 to the slurry-jetting part via a pump device 23; and configured so that the slurry jetted from the slurry-jetting part is sent to the slurry-accumulating part 22 to be reused. Numeral 25A is a pressurized-air-supplying device, 25B is a pressurized-air-conveying part, and 26 is a slurry-returning/conveying part connected to the nozzle body M, the slurry-returning/conveying part returning the slurry 4 to the slurry-accumulating part 22.
The nozzle M is configured of a cylindrical main body 6 and a fitting cylinder 8 continuously connected in a fitted state to the cylindrical main body 6, as illustrated in FIG. 1.
In addition, a base end of the cylindrical main body 6 is continuously connected to a base end part of the fitting cylinder 8, and the base end part of the fitting cylinder 8 is continuously connected to the pressurized-air-conveying part 25B via a port 10.
Furthermore, a communication hole 12 is bored into an area arranged inside a space 7 of the fitting cylinder 8 in the cylindrical main body 6, and a slurry introduction part 13 connected to the above-described slurry-conveying part 24 and a slurry output part 14 connected to the slurry-returning/conveying part 26 are provided to a prescribed outer peripheral location on the fitting cylinder 8.
The cylindrical main body 6 of the present example is, as illustrated in FIGS. 1 to 4, configured so that the periphery of a to rectangular cylindrical member 6 a provided with a cylinder hole having a square shape in cross-section and being formed of a suitable metal member is covered by a synthetic resin coating member 6 b, and a tip opening part having a rectangular shape in cross-section is configured as the slurry-jetting opening 5 for jetting the slurry 4 at the tip of the cylinder hole of the rectangular cylindrical member 6 a.
Accordingly, the slurry 4 is jetted in the shape of a rectangular prism from the slurry-jetting opening 5.
In addition, in the present example, the opening dimensions of the slurry-jetting opening 5 are set to a length of about 6 mm and a width of about 3 mm. The slurry-jetting opening 5 may have a square shape in cross-section (for example, length of 3 mm, width of 3 mm).
Furthermore, although not illustrated in the drawings, when a guide extending from the slurry-jetting opening 5 toward the tip (downward) in the slurry-jetting opening 5 is provided, dispersing of the slurry 4 to the outside (periphery) is inhibited, and satisfactory burr removal can be performed without as much of a tendency for the jetted slurry 4 to degrade.
Because of the above-mentioned configuration of the present example, the slurry 4 can be introduced to the inside of the space 7 from the slurry introduction part 13, and the slurry 4 can be outputted from the slurry output part 14 to the outside of the space 7. As a result, the pressure of the slurry 4 is reduced by the outputting of the slurry 4 from the slurry output part 14, and the slurry 4 is circulated while a constant pressure is maintained inside the space 7. In this state, when pressurized air is introduced into the cylindrical main body 6 from the port 10, the pressurized air draws the slurry 4 into the space 7 via the communication hole 12, and the slurry 4 is accelerated by the pressurized air inside the cylindrical main body 6 and jetted in the shape of a rectangular prism to the outside from the slurry-jetting opening 5. The slurry 4 is circulated inside the space 7 by the slurry introduction part 13 and the slurry output part 14, and a constant pressure is maintained inside the space 7 (accordingly, even if the slurry 4 is drawn into the cylindrical main body 6 via the communication hole 12, the pressure inside the space 7 does not change.).
According to the present example, the slurry 4 is therefore jetted from the slurry-jetting opening 5 in the shape of a rectangular prism, and the outer edge area of the jetted slurry 4 is linear. Therefore, the impacted surface area of the outer edge of the semiconductor package 20 (the area 20 a covered by the synthetic resin) is larger than a case in which the slurry-jetting opening 5 is circular, as illustrated in FIG. 5, and resin burrs 30 can be removed quickly and with good processing efficiency.
In addition, the present example is configured so that the slurry 4 is drawn in by pressurized air passing through at a constant pressure from the space 7 in which the slurry 4 is enclosed at a constant pressure, and there is no excess abrasive. Furthermore, the air-intake pressure for taking in air through the communication hole 12 is maintained at a good balance, the jetted slurry 4 is therefore not intermittent, jetting can be performed smoothly and continuously, and the amount of the abrasive in the slurry 4 jetted from the slurry-jetting opening 5 is constant because the amount of the abrasive drawn in from the communication hole 12 is constant.
Accordingly, the power for drawing the slurry 4 into the cylindrical main body 6 via the communication hole 12 is appropriately adjusted by adjustment of the air pressure, whereby the diameter of the slurry-jetting opening 5 can also be reduced as much as possible, and deburring can be performed that much more accurately in a desired area.
Furthermore, it is preferable that the diameter of the cylindrical main body 6 be reduced in order for accurate deburring to be performed.
As a result of experimentation, jetting of the slurry 4 can be continuously performed without intermittency.
Because the pressurized-air passage can be made longer than with the conventional art example (in the conventional art example, the pressurized-air passage is the cylindrical main body 6, and the length of the pressurized-air passage is the length of the cylindrical main body 6), the length over which the air is accelerated is increased in commensurate fashion, and the jetting speed from the cylindrical main body 6 can therefore be increased even if the air-supply pressure is not increased to such an extent. The effectiveness of burr removal can therefore be improved.
This means that the expansion of air in the long air passage is commensurately sufficient, and air-flow regulation is excellent. The width of pressurized water when jetted from the cylindrical main body 6 (radially expanding width) is reduced in commensurate fashion, and accurate deburring can therefore be performed in commensurate fashion on an area in which deburring is desired. In addition, reducing the width when the water is jetted from the cylindrical main body 6 means that noise generated during commensurately spreading can be suppressed.
The present invention is not limited to the present examples, it being possible to design the specific configuration of various constituent elements as appropriate.

Claims

1. A nozzle body for a wet-blast processing apparatus for causing a slurry formed by mixing an abrasive in a liquid to be jetted together with pressurized air, the nozzle body removing a burr attached to a terminal of a semiconductor package formed by providing a wiring substrate with an electronic component such as a semiconductor integrated circuit chip and covering the semiconductor package with a synthetic resin, the nozzle body having a slurry-jetting opening for jetting the slurry to a tip of a cylindrical main body, and the slurry-jetting opening being formed having a polygonal shape in cross-section.

2. The nozzle body for a wet-blast processing apparatus according to claim 1, wherein the slurry-jetting opening has a square shape in cross-section.

3. The nozzle body for a wet-blast processing apparatus according to claim 1, wherein a cylindrical main body provided with a cylinder hole having a square shape in cross-section is used as the cylindrical main body.

4. The nozzle body for a wet-blast processing apparatus according to claim 1, wherein the opening dimensions of the slurry-jetting opening are set to a length of about 6 mm and a width of about 3 mm.

5. The nozzle body for a wet-blast processing apparatus according to claim 2, wherein the dimensions of the slurry-jetting opening are set to a length of about 6 mm and a width of about 3 mm.

6. The nozzle body for a wet-blast processing apparatus according to claim 3, wherein the dimensions of the slurry-jetting opening are set to a length of about 6 mm and a width of about 3 mm.

7. The nozzle body for a wet-blast processing apparatus according to claim 2, wherein a cylindrical main body provided with a cylinder hole having a square shape in cross-section is used as the cylindrical main body.

8. The nozzle body for a wet-blast processing apparatus according to claim 7, wherein the dimensions of the slurry-jetting opening are set to a length of about 6 mm and a width of about 3 mm.