US20160141313A1 - Method for manufacturing flexible display device - Google Patents
Method for manufacturing flexible display device Download PDFInfo
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- US20160141313A1 US20160141313A1 US14/420,645 US201414420645A US2016141313A1 US 20160141313 A1 US20160141313 A1 US 20160141313A1 US 201414420645 A US201414420645 A US 201414420645A US 2016141313 A1 US2016141313 A1 US 2016141313A1
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- 238000000034 method Methods 0.000 title claims abstract description 44
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 39
- 239000000758 substrate Substances 0.000 claims abstract description 414
- 239000000853 adhesive Substances 0.000 claims description 12
- 230000001070 adhesive effect Effects 0.000 claims description 12
- 239000000463 material Substances 0.000 claims description 11
- 239000011521 glass Substances 0.000 description 29
- 230000008602 contraction Effects 0.000 description 12
- 239000004033 plastic Substances 0.000 description 9
- 229920003023 plastic Polymers 0.000 description 9
- 238000010438 heat treatment Methods 0.000 description 6
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- 230000002708 enhancing effect Effects 0.000 description 3
- 239000004973 liquid crystal related substance Substances 0.000 description 3
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- 229920002430 Fibre-reinforced plastic Polymers 0.000 description 2
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- 239000011151 fibre-reinforced plastic Substances 0.000 description 2
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 2
- 229920001230 polyarylate Polymers 0.000 description 2
- 229920000515 polycarbonate Polymers 0.000 description 2
- 239000004417 polycarbonate Substances 0.000 description 2
- 229920006393 polyether sulfone Polymers 0.000 description 2
- 239000011112 polyethylene naphthalate Substances 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
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- 230000015572 biosynthetic process Effects 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1259—Multistep manufacturing methods
- H01L27/1262—Multistep manufacturing methods with a particular formation, treatment or coating of the substrate
- H01L27/1266—Multistep manufacturing methods with a particular formation, treatment or coating of the substrate the substrate on which the devices are formed not being the final device substrate, e.g. using a temporary substrate
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
- B32B37/26—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer which influences the bonding during the lamination process, e.g. release layers or pressure equalising layers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B43/00—Operations specially adapted for layered products and not otherwise provided for, e.g. repairing; Apparatus therefor
- B32B43/006—Delaminating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1218—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition or structure of the substrate
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
- B32B37/26—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer which influences the bonding during the lamination process, e.g. release layers or pressure equalising layers
- B32B2037/268—Release layers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/40—Properties of the layers or laminate having particular optical properties
- B32B2307/422—Luminescent, fluorescent, phosphorescent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/50—Properties of the layers or laminate having particular mechanical properties
- B32B2307/546—Flexural strength; Flexion stiffness
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
Definitions
- the present invention relates to the field of display, and in particular to a method for manufacturing a flexible display device.
- a known method for manufacturing a flexible display device is generally forming a very thin plastic substrate on a surface of a glass substrate and forming components, such as flexible displaying components, on the plastic substrate.
- the plastic substrate with the flexible displaying components formed thereon is then peeled off the glass substrate to form a flexible display device.
- formation of the components, such as flexible displaying components requires a high temperature process. Due to the fact that the plastic substrate and the glass substrate have different extents of thermal expansion, edges of the plastic substrate may get warped thereby causing poor quality of the flexible display device.
- the present invention provides a method for manufacturing a flexible display device.
- the method for manufacturing a flexible display device comprises:
- the substrate comprises a first surface and a second surface that are opposite to each other;
- a force acting from the first flexible substrate to the substrate is equal to, but in opposite direction, a force acting from the second substrate to the substrate;
- the method for manufacturing the flexible display device further comprises:
- the atmospheric pressure is used to set the first flexible substrate on the first surface of the substrate and the atmospheric pressure is used to set the second flexible substrate on the second surface of the substrate.
- the method for manufacturing the flexible display device further comprises:
- the present invention provides a method for manufacturing a flexible display device.
- the method for manufacturing a flexible display device comprises:
- the substrate comprises a first surface and a second surface that are opposite to each other;
- first flexible substrate on the first surface of the substrate and forming the second flexible substrate on the second surface of the substrate, wherein the first flexible substrate and the second flexible substrate are made of the same material to have the same size;
- the method for manufacturing the flexible display device further comprises:
- step of “forming a first flexible substrate on the first surface of the substrate and forming the second flexible substrate on the second surface of the substrate, wherein the first flexible substrate and the second flexible substrate are made of the same material to have the same size” adhesive is applied to bond the first flexible substrate to the first surface of the substrate and adhesive is applied to bond the second flexible substrate to the second surface of the substrate.
- the atmospheric pressure is used to set the first flexible substrate on the first surface of the substrate and the atmospheric pressure is used to set the second flexible substrate on the second surface of the substrate.
- the method for manufacturing the flexible display device further comprises:
- the first flexible substrate when the first flexible substrate and the second flexible substrate are subjected to heating, since the amount of contraction of the first flexible substrate is greater than the amount of contraction of the glass substrate, the first flexible substrate applies an acting force to the glass substrate, which will be referred to as a first acting force. Under the action of the first acting force, the first flexible substrate forces the glass substrate to contract upward.
- the second flexible substrate is formed on the second surface of the substrate, when the second flexible substrate is subjected to heating, due to the amount of contraction of the second flexible substrate being greater than the amount of contraction of the glass substrate, the second flexible substrate applied an acting force to the glass substrate, which will be referred to as a second acting force.
- the second flexible substrate forces the glass substrate to contract downward. Since the first acting force and the second acting force are equal in amount but opposite in direction, the first acting force and the second acting force cancel each other thereby preventing the first flexible substrate, the second flexible substrate, and the substrate from getting warped and thus enhancing the quality of a flexible display device.
- FIG. 1 is a flow chart illustrating a method for manufacturing a flexible display device according to a first preferred embodiment of the present invention
- FIGS. 2-9 are schematic views illustrating various steps of the method for manufacturing a flexible display device according to the first embodiment of the present invention.
- FIG. 10 is a flow chart illustrating a method for manufacturing a flexible display device according to a second preferred embodiment of the present invention.
- FIG. 1 is a flow chart illustrating a method for manufacturing a flexible display device according to a first preferred embodiment of the present invention
- the method for manufacturing a flexible display device 10 comprises, but is not limited to, the following steps.
- Step S 101 providing a substrate 100 , wherein the substrate 100 comprises a first surface 100 a and a second surface 100 b that are opposite to each other.
- the substrate 100 can be a glass substrate, and the glass substrate can be an ultrathin glass substrate.
- the glass substrate has a thickness less than or equal to 0 . 1 mm.
- Step S 102 forming a first flexible substrate 110 on the first surface 100 a of the substrate 100 and forming the second flexible substrate 120 on the second surface 100 b of the substrate 100 , wherein a force acting from the first flexible substrate 110 to the substrate 100 is equal to, but in opposite direction, a force acting from the second substrate 120 to the substrate 100 .
- the first flexible substrate 110 and the second flexible substrate 120 are respectively formed on the first surface 100 a and the second surface 100 b of the substrate 100 .
- the first flexible substrate 110 and the second flexible substrate 120 are both plastic substrates and the materials of the plastic substrates comprise one of polycarbonate, polyethylene terephthalate, polyimide, polyarylate, polyethersulfone, polyethylene naphthalate, and fiber reinforced plastics, or combinations of two or more than two of them.
- An acting force applied from the first flexible substrate 110 to the substrate 100 is equal to, but in opposite direction, an acting force applied from the second substrate 120 to the substrate 100 .
- the first flexible substrate 110 and the second flexible substrate 120 are subjected to heating, since the amount of contraction of the first flexible substrate 110 is greater than the amount of contraction of the glass substrate, the first flexible substrate 110 applies an acting force to the glass substrate, which will be referred to as a first acting force. Under the action of the first acting force, the first flexible substrate 110 forces the glass substrate to contract upward.
- the second flexible substrate 120 is formed on the second surface 100 b of the substrate 100 , when the second flexible substrate 120 is subjected to heating, due to the amount of contraction of the second flexible substrate 110 being greater than the amount of contraction of the glass substrate, the second flexible substrate 120 applied an acting force to the glass substrate, which will be referred to as a second acting force. Under the action of the second acting force, the second flexible substrate forces the glass substrate to contract downward. Since the first acting force and the second acting force are equal in amount but opposite in direction, the first acting force and the second acting force cancel each other thereby preventing the first flexible substrate 110 , the second flexible substrate 120 , and the substrate 100 from getting warped and thus enhancing the quality of a flexible display device.
- Step S 102 adhesive is applied to bond the first flexible substrate 110 to the first surface 100 a of the substrate 100 and adhesive is applied to bond the second flexible substrate 120 to the second surface 110 b of the substrate 100 .
- Step S 102 the atmospheric pressure is used to set the first flexible substrate 110 on the first surface 100 a of the substrate 100 and the atmospheric pressure is used to set the second flexible substrate 120 on the second surface 100 b of the substrate 100 .
- Step S 103 forming a displaying component 130 on a surface of the first flexible substrate 110 that is distant from the substrate 100 .
- the first flexible substrate 110 comprises two opposite surfaces and the first flexible substrate 110 is formed through one of these surfaces on the first surface 100 a of the substrate 100 , and the other surface of the first flexible substrate 100 is used to receive the displaying component 130 formed thereon.
- the displaying component can be one of a liquid crystal display, an organic electroluminescent display, an electronic paper, an electrophoretic display, a touch screen, and a thin-film photovoltaic cell or a combination of two or more than two of them.
- the method for manufacturing the flexible display device 10 further comprises: forming a driving circuit 140 of the displaying component 130 on the surface of the first flexible substrate 110 that is distant from the substrate 100 .
- the driving circuit 140 is provided to drive the displaying component 130 . It is appreciated that, in other embodiments, forming the driving circuit 140 of the displaying component 130 formed on the surface of the first flexible substrate 110 that is distant from the substrate 100 can be performed in the same step as that of forming the displaying component 130 on the surface of the first flexible substrate 110 that is distant from the substrate 100 .
- Step S 104 peeling the first flexible substrate 110 on which the displaying component 130 is formed off the substrate 100 so as to form a flexible display device 10 .
- the first flexible substrate 110 on which the displaying component 130 is formed is peeled from the first surface 100 a of the substrate 100 so that the first flexible substrate 100 and the displaying component 130 formed on the surface of the first flexible substrate 100 collectively form the flexible display device 10 .
- Step S 105 forming a first flexible substrate 110 on the first surface 100 a of the substrate 100 .
- a first flexible substrate 110 is formed again on the first surface 100 a of the substrate 100 .
- Step S 106 forming a displaying component 130 on a surface of the first flexible substrate 110 that is distant from the substrate 100 .
- the first flexible substrate 110 comprises two opposite surfaces and the first flexible substrate 110 is formed through one of these surfaces on the first surface 100 a of the substrate 100 , and the other surface of the first flexible substrate 100 is used to receive the displaying component 130 formed thereon.
- the displaying component can be one of a liquid crystal display, an organic electroluminescent display, an electronic paper, an electrophoretic display, a touch screen, and a thin-film photovoltaic cell or a combination of two or more than two of them.
- the method for manufacturing the flexible display device 10 further comprises: forming a driving circuit 140 of the displaying component 130 on the surface of the first flexible substrate 110 that is distant from the substrate 100 .
- the driving circuit 140 is provided to drive the displaying component 130 . It is appreciated that, in other embodiments, forming the driving circuit 140 of the displaying component 130 formed on the surface of the first flexible substrate 110 that is distant from the substrate 100 can be performed in the same step as that of forming the displaying component 130 on the surface of the first flexible substrate 110 that is distant from the substrate 100 .
- Step S 107 peeling the first flexible substrate 110 on which the displaying component 130 is formed off the substrate 100 so as to form another one of the flexible display device 10 .
- the first flexible substrate 110 on which the displaying component 130 is formed is peeled from the first surface 100 a of the substrate 100 so that the first flexible substrate 100 and the displaying component 130 formed on the surface of the first flexible substrate 100 collectively form the flexible display device 10 .
- Step S 104 Steps S 105 -S 107 are repeatedly performed so as to repeatedly use the substrate 10 of which the second surface 110 b comprises the second flexible substrate 120 formed thereon to generate multiple ones of the flexible display device 10 .
- the method for manufacturing a flexible display device 10 comprises, but is not limited to, the following steps.
- Step S 201 providing a substrate 100 , wherein the substrate comprises a first surface 100 a and a second surface 100 b that are opposite to each other.
- the substrate 100 can be a glass substrate, and the glass substrate can be a ultrathin glass substrate.
- the glass substrate has a thickness less than or equal to 0.1 mm.
- Step S 202 forming a first flexible substrate 110 on the first surface 100 a of the substrate 100 and forming the second flexible substrate 120 on the second surface 100 b of the substrate 100 , wherein the first flexible substrate 110 and the second flexible substrate 120 are made of the same material to have the same size.
- the first flexible substrate 110 and the second flexible substrate 120 are of the same material and the same size.
- the sizes of the first flexible substrate 110 and the second flexible substrate 120 are identical and have the same thickness, the same shape, the same length, and the same width.
- the first flexible substrate 110 and the second flexible substrate 120 are respectively formed on the first surface 100 a and the second surface 100 b of the substrate 100 .
- the first flexible substrate 110 and the second flexible substrate 120 are both plastic substrates and the materials of the plastic substrates comprise one of polycarbonate, polyethylene terephthalate, polyimide, polyarylate, polyethersulfone, polyethylene naphthalate, and fiber reinforced plastics, or combinations of two or more than two of them.
- an acting force applied from the first flexible substrate 110 to the substrate 100 is equal to, but in opposite direction, an acting force applied from the second substrate 120 to the substrate 100 .
- the first flexible substrate 110 and the second flexible substrate 120 are subjected to heating, since the amount of contraction of the first flexible substrate 110 is greater than the amount of contraction of the glass substrate, the first flexible substrate 110 applies an acting force to the glass substrate, which will be referred to as a first acting force. Under the action of the first acting force, the first flexible substrate 110 forces the glass substrate to contract upward. However, since the second flexible substrate 120 is formed on the second surface 100 b of the substrate 100 , when the second flexible substrate 120 is subjected to heating, due to the amount of contraction of the second flexible substrate 110 being greater than the amount of contraction of the glass substrate, the second flexible substrate 120 applied an acting force to the glass substrate, which will be referred to as a second acting force.
- the second flexible substrate forces the glass substrate to contract downward. Since the first acting force and the second acting force are equal in amount but opposite in direction, the first acting force and the second acting force cancel each other thereby preventing the first flexible substrate 110 , the second flexible substrate 120 , and the substrate 100 from getting warped and thus enhancing the quality of a flexible display device.
- Step S 202 adhesive is applied to bond the first flexible substrate 110 to the first surface 100 a of the substrate 100 and adhesive is applied to bond the second flexible substrate 120 to the second surface 110 b of the substrate 100 .
- Step S 202 the atmospheric pressure is used to set the first flexible substrate 110 on the first surface 100 a of the substrate 100 and the atmospheric pressure is used to set the second flexible substrate 120 on the second surface 100 b of the substrate 100 .
- Step S 203 forming a displaying component 130 on a surface of the first flexible substrate 110 that is distant from the substrate 100 .
- the method for manufacturing the flexible display device 10 further comprises: forming a driving circuit 140 of the displaying component 130 on the surface of the first flexible substrate 110 that is distant from the substrate 100 .
- the driving circuit 140 is provided to drive the displaying component 130 . It is appreciated that, in other embodiments, forming the driving circuit 140 of the displaying component 130 formed on the surface of the first flexible substrate 110 that is distant from the substrate 100 can be performed in the same step as that of forming the displaying component 130 on the surface of the first flexible substrate 110 that is distant from the substrate 100 .
- Step S 204 peeling the first flexible substrate 110 on which the displaying component 130 is formed off the substrate 100 so as to form a flexible display device 10 .
- the first flexible substrate 110 on which the displaying component 130 is formed is peeled from the first surface 100 a of the substrate 100 so that the first flexible substrate 100 and the displaying component 130 formed on the surface of the first flexible substrate 100 collectively form the flexible display device 10 .
- Step S 205 forming a first flexible substrate 110 on the first surface 100 a of the substrate 100 .
- a first flexible substrate 110 is formed again on the first surface 100 a of the substrate 100 .
- Step S 206 forming a displaying component 130 on a surface of the first flexible substrate 110 that is distant from the substrate 100 .
- the first flexible substrate 110 comprises two opposite surfaces and the first flexible substrate 110 is formed through one of these surfaces on the first surface 100 a of the substrate 100 , and the other surface of the first flexible substrate 100 is used to receive the displaying component 130 formed thereon.
- the displaying component can be one of a liquid crystal display, an organic electroluminescent display, an electronic paper, an electrophoretic display, a touch screen, and a thin-film photovoltaic cell or a combination of two or more than two of them.
- the method for manufacturing the flexible display device 10 further comprises: forming a driving circuit 140 of the displaying component 130 on the surface of the first flexible substrate 110 that is distant from the substrate 100 .
- the driving circuit 140 is provided to drive the displaying component 130 . It is appreciated that, in other embodiments, forming the driving circuit 140 of the displaying component 130 formed on the surface of the first flexible substrate 110 that is distant from the substrate 100 can be performed in the same step as that of forming the displaying component 130 on the surface of the first flexible substrate 110 that is distant from the substrate 100 .
- Step S 207 peeling the first flexible substrate 110 on which the displaying component 130 is formed off the substrate 100 so as to form another one of the flexible display device 10 .
- the first flexible substrate 110 on which the displaying component 130 is formed is peeled from the first surface 100 a of the substrate 100 so that the first flexible substrate 100 and the displaying component 130 formed on the surface of the first flexible substrate 100 collectively form the flexible display device 10 .
- Step S 204 Steps S 205 -S 207 are repeatedly performed so as to repeatedly use the substrate 10 of which the second surface 110 b comprises the second flexible substrate 120 formed thereon to generate multiple ones of the flexible display device 10 .
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Abstract
Description
- This application claims the priority of Chinese Patent Application No. 201410658898.1, entitled “Method for Manufacturing Flexible Display Device”, filed on Nov. 18, 2014, the disclosure of which is incorporated herein by reference in its entirety.
- 1. Field of the Invention
- The present invention relates to the field of display, and in particular to a method for manufacturing a flexible display device.
- 2. The Related Arts
- With the progress of science and technology, flexible displaying techniques have been advanced very quickly. A known method for manufacturing a flexible display device is generally forming a very thin plastic substrate on a surface of a glass substrate and forming components, such as flexible displaying components, on the plastic substrate. The plastic substrate with the flexible displaying components formed thereon is then peeled off the glass substrate to form a flexible display device. However, formation of the components, such as flexible displaying components, requires a high temperature process. Due to the fact that the plastic substrate and the glass substrate have different extents of thermal expansion, edges of the plastic substrate may get warped thereby causing poor quality of the flexible display device.
- In an aspect, the present invention provides a method for manufacturing a flexible display device.
- The method for manufacturing a flexible display device comprises:
- providing a substrate, wherein the substrate comprises a first surface and a second surface that are opposite to each other;
- forming a first flexible substrate on the first surface of the substrate and forming the second flexible substrate on the second surface of the substrate, wherein a force acting from the first flexible substrate to the substrate is equal to, but in opposite direction, a force acting from the second substrate to the substrate;
- forming a displaying component on a surface of the first flexible substrate that is distant from the substrate; and
- peeling the first flexible substrate on which the displaying component is formed off the substrate so as to form a flexible display device.
- After the step of “peeling the first flexible substrate on which the displaying component is formed off the substrate so as to form a flexible display device”, the method for manufacturing the flexible display device further comprises:
- forming a first flexible substrate on the first surface of the substrate;
- forming a displaying component on a surface of the first flexible substrate that is distant from the substrate; and
- peeling the first flexible substrate on which the displaying component is formed off the substrate so as to form a flexible display device.
- In the step of “forming a first flexible substrate on the first surface of the substrate and forming the second flexible substrate on the second surface of the substrate, wherein a force acting from the first flexible substrate to the substrate is equal to, but in opposite direction, a force acting from the second substrate to the substrate”, adhesive is applied to bond the first flexible substrate to the first surface of the substrate and adhesive is applied to bond the second flexible substrate to the second surface of the substrate.
- In the step of “forming a first flexible substrate on the first surface of the substrate and forming the second flexible substrate on the second surface of the substrate, wherein a force acting from the first flexible substrate to the substrate is equal to, but in opposite direction, a force acting from the second substrate to the substrate”, the atmospheric pressure is used to set the first flexible substrate on the first surface of the substrate and the atmospheric pressure is used to set the second flexible substrate on the second surface of the substrate.
- The method for manufacturing the flexible display device further comprises:
- forming a driving circuit of the displaying component on the surface of the first flexible substrate that is distant from the substrate.
- In the second aspect, the present invention provides a method for manufacturing a flexible display device. The method for manufacturing a flexible display device comprises:
- providing a substrate, wherein the substrate comprises a first surface and a second surface that are opposite to each other;
- forming a first flexible substrate on the first surface of the substrate and forming the second flexible substrate on the second surface of the substrate, wherein the first flexible substrate and the second flexible substrate are made of the same material to have the same size;
- forming a displaying component on a surface of the first flexible substrate that is distant from the substrate; and
- peeling the first flexible substrate on which the displaying component is formed off the substrate so as to form a flexible display device.
- After the step of “peeling the first flexible substrate on which the displaying component is formed off the substrate so as to form a flexible display device”, the method for manufacturing the flexible display device further comprises:
- forming a first flexible substrate on the first surface of the substrate;
- forming a displaying component on a surface of the first flexible substrate that is distant from the substrate; and
- peeling the first flexible substrate on which the displaying component is formed off the substrate so as to form a flexible display device.
- In the step of “forming a first flexible substrate on the first surface of the substrate and forming the second flexible substrate on the second surface of the substrate, wherein the first flexible substrate and the second flexible substrate are made of the same material to have the same size”, adhesive is applied to bond the first flexible substrate to the first surface of the substrate and adhesive is applied to bond the second flexible substrate to the second surface of the substrate.
- In the step of “forming a first flexible substrate on the first surface of the substrate and forming the second flexible substrate on the second surface of the substrate, wherein the first flexible substrate and the second flexible substrate are made of the same material to have the same size”, the atmospheric pressure is used to set the first flexible substrate on the first surface of the substrate and the atmospheric pressure is used to set the second flexible substrate on the second surface of the substrate.
- The method for manufacturing the flexible display device further comprises:
- forming a driving circuit of the displaying component on the surface of the first flexible substrate that is distant from the substrate.
- In each of the methods for manufacturing a flexible display device described in each of the above embodiments, when the first flexible substrate and the second flexible substrate are subjected to heating, since the amount of contraction of the first flexible substrate is greater than the amount of contraction of the glass substrate, the first flexible substrate applies an acting force to the glass substrate, which will be referred to as a first acting force. Under the action of the first acting force, the first flexible substrate forces the glass substrate to contract upward. However, since the second flexible substrate is formed on the second surface of the substrate, when the second flexible substrate is subjected to heating, due to the amount of contraction of the second flexible substrate being greater than the amount of contraction of the glass substrate, the second flexible substrate applied an acting force to the glass substrate, which will be referred to as a second acting force. Under the action of the second acting force, the second flexible substrate forces the glass substrate to contract downward. Since the first acting force and the second acting force are equal in amount but opposite in direction, the first acting force and the second acting force cancel each other thereby preventing the first flexible substrate, the second flexible substrate, and the substrate from getting warped and thus enhancing the quality of a flexible display device.
- To more clearly explain the technical solutions proposed in embodiments of the present invention or those of the prior art, a brief description of the drawings that are necessary for describing the embodiments of the present invention or the prior art is given as follows. It is obvious that the drawings that will be described below show only some embodiments of the present invention. For those having ordinary skills of the art, other drawings may also be readily available from these attached drawings without the expense of creative effort and endeavor.
-
FIG. 1 is a flow chart illustrating a method for manufacturing a flexible display device according to a first preferred embodiment of the present invention; -
FIGS. 2-9 are schematic views illustrating various steps of the method for manufacturing a flexible display device according to the first embodiment of the present invention; and -
FIG. 10 is a flow chart illustrating a method for manufacturing a flexible display device according to a second preferred embodiment of the present invention. - A clear and complete description will be given to technical solutions of embodiments of the present invention with reference to the attached drawings of the embodiments of the present invention. However, the embodiments so described are only some, but not all, of the embodiments of the present invention. Other embodiments that are available to those having ordinary skills of the art without the expense of creative effort and endeavor are considered belonging to the scope of protection of the present invention.
- Referring to
FIG. 1 , which is a flow chart illustrating a method for manufacturing a flexible display device according to a first preferred embodiment of the present invention, the method for manufacturing a flexible display device 10 comprises, but is not limited to, the following steps. - Step S101: providing a
substrate 100, wherein thesubstrate 100 comprises afirst surface 100 a and asecond surface 100 b that are opposite to each other. Referring additionally toFIG. 2 , thesubstrate 100 can be a glass substrate, and the glass substrate can be an ultrathin glass substrate. The glass substrate has a thickness less than or equal to 0.1 mm. - Step S102: forming a first
flexible substrate 110 on thefirst surface 100 a of thesubstrate 100 and forming the secondflexible substrate 120 on thesecond surface 100 b of thesubstrate 100, wherein a force acting from the firstflexible substrate 110 to thesubstrate 100 is equal to, but in opposite direction, a force acting from thesecond substrate 120 to thesubstrate 100. - Referring additionally to
FIG. 3 , the firstflexible substrate 110 and the secondflexible substrate 120 are respectively formed on thefirst surface 100 a and thesecond surface 100 b of thesubstrate 100. In the instant embodiment, the firstflexible substrate 110 and the secondflexible substrate 120 are both plastic substrates and the materials of the plastic substrates comprise one of polycarbonate, polyethylene terephthalate, polyimide, polyarylate, polyethersulfone, polyethylene naphthalate, and fiber reinforced plastics, or combinations of two or more than two of them. - An acting force applied from the first
flexible substrate 110 to thesubstrate 100 is equal to, but in opposite direction, an acting force applied from thesecond substrate 120 to thesubstrate 100. When the firstflexible substrate 110 and the secondflexible substrate 120 are subjected to heating, since the amount of contraction of the firstflexible substrate 110 is greater than the amount of contraction of the glass substrate, the firstflexible substrate 110 applies an acting force to the glass substrate, which will be referred to as a first acting force. Under the action of the first acting force, the firstflexible substrate 110 forces the glass substrate to contract upward. However, since the secondflexible substrate 120 is formed on thesecond surface 100 b of thesubstrate 100, when the secondflexible substrate 120 is subjected to heating, due to the amount of contraction of the secondflexible substrate 110 being greater than the amount of contraction of the glass substrate, the secondflexible substrate 120 applied an acting force to the glass substrate, which will be referred to as a second acting force. Under the action of the second acting force, the second flexible substrate forces the glass substrate to contract downward. Since the first acting force and the second acting force are equal in amount but opposite in direction, the first acting force and the second acting force cancel each other thereby preventing the firstflexible substrate 110, the secondflexible substrate 120, and thesubstrate 100 from getting warped and thus enhancing the quality of a flexible display device. - In one embodiment, in Step S102, adhesive is applied to bond the first
flexible substrate 110 to thefirst surface 100 a of thesubstrate 100 and adhesive is applied to bond the secondflexible substrate 120 to the second surface 110 b of thesubstrate 100. - In another embodiment, in Step S102, the atmospheric pressure is used to set the first
flexible substrate 110 on thefirst surface 100 a of thesubstrate 100 and the atmospheric pressure is used to set the secondflexible substrate 120 on thesecond surface 100 b of thesubstrate 100. - Step S103: forming a displaying
component 130 on a surface of the firstflexible substrate 110 that is distant from thesubstrate 100. Referring additionally toFIG. 4 , the firstflexible substrate 110 comprises two opposite surfaces and the firstflexible substrate 110 is formed through one of these surfaces on thefirst surface 100 a of thesubstrate 100, and the other surface of the firstflexible substrate 100 is used to receive the displayingcomponent 130 formed thereon. The displaying component can be one of a liquid crystal display, an organic electroluminescent display, an electronic paper, an electrophoretic display, a touch screen, and a thin-film photovoltaic cell or a combination of two or more than two of them. - Preferably, after Step S103, the method for manufacturing the flexible display device 10 further comprises: forming a
driving circuit 140 of the displayingcomponent 130 on the surface of the firstflexible substrate 110 that is distant from thesubstrate 100. Referring additionally toFIG. 5 , the drivingcircuit 140 is provided to drive the displayingcomponent 130. It is appreciated that, in other embodiments, forming the drivingcircuit 140 of the displayingcomponent 130 formed on the surface of the firstflexible substrate 110 that is distant from thesubstrate 100 can be performed in the same step as that of forming the displayingcomponent 130 on the surface of the firstflexible substrate 110 that is distant from thesubstrate 100. - Step S104: peeling the first
flexible substrate 110 on which the displayingcomponent 130 is formed off thesubstrate 100 so as to form a flexible display device 10. Referring additionally toFIG. 6 , the firstflexible substrate 110 on which the displayingcomponent 130 is formed is peeled from thefirst surface 100 a of thesubstrate 100 so that the firstflexible substrate 100 and the displayingcomponent 130 formed on the surface of the firstflexible substrate 100 collectively form the flexible display device 10. - Step S105: forming a first
flexible substrate 110 on thefirst surface 100 a of thesubstrate 100. Referring additionally toFIG. 7 , a firstflexible substrate 110 is formed again on thefirst surface 100 a of thesubstrate 100. - Step S106: forming a displaying
component 130 on a surface of the firstflexible substrate 110 that is distant from thesubstrate 100. Referring additionally toFIG. 8 , the firstflexible substrate 110 comprises two opposite surfaces and the firstflexible substrate 110 is formed through one of these surfaces on thefirst surface 100 a of thesubstrate 100, and the other surface of the firstflexible substrate 100 is used to receive the displayingcomponent 130 formed thereon. The displaying component can be one of a liquid crystal display, an organic electroluminescent display, an electronic paper, an electrophoretic display, a touch screen, and a thin-film photovoltaic cell or a combination of two or more than two of them. - Preferably, after Step S106, the method for manufacturing the flexible display device 10 further comprises: forming a
driving circuit 140 of the displayingcomponent 130 on the surface of the firstflexible substrate 110 that is distant from thesubstrate 100. The drivingcircuit 140 is provided to drive the displayingcomponent 130. It is appreciated that, in other embodiments, forming the drivingcircuit 140 of the displayingcomponent 130 formed on the surface of the firstflexible substrate 110 that is distant from thesubstrate 100 can be performed in the same step as that of forming the displayingcomponent 130 on the surface of the firstflexible substrate 110 that is distant from thesubstrate 100. - Step S107: peeling the first
flexible substrate 110 on which the displayingcomponent 130 is formed off thesubstrate 100 so as to form another one of the flexible display device 10. Referring additionally toFIG. 9 , the firstflexible substrate 110 on which the displayingcomponent 130 is formed is peeled from thefirst surface 100 a of thesubstrate 100 so that the firstflexible substrate 100 and the displayingcomponent 130 formed on the surface of the firstflexible substrate 100 collectively form the flexible display device 10. - After Step S104, Steps S105-S107 are repeatedly performed so as to repeatedly use the substrate 10 of which the second surface 110 b comprises the second
flexible substrate 120 formed thereon to generate multiple ones of the flexible display device 10. - Referring to
FIG. 10 , which is a flow chart illustrating a method for manufacturing a flexible display device according to a second preferred embodiment of the present invention, the method for manufacturing a flexible display device 10 comprises, but is not limited to, the following steps. - Step S201: providing a
substrate 100, wherein the substrate comprises afirst surface 100 a and asecond surface 100 b that are opposite to each other. Referring additionally toFIG. 2 , thesubstrate 100 can be a glass substrate, and the glass substrate can be a ultrathin glass substrate. The glass substrate has a thickness less than or equal to 0.1 mm. - Step S202: forming a first
flexible substrate 110 on thefirst surface 100 a of thesubstrate 100 and forming the secondflexible substrate 120 on thesecond surface 100 b of thesubstrate 100, wherein the firstflexible substrate 110 and the secondflexible substrate 120 are made of the same material to have the same size. Specifically, the firstflexible substrate 110 and the secondflexible substrate 120 are of the same material and the same size. The sizes of the firstflexible substrate 110 and the secondflexible substrate 120 are identical and have the same thickness, the same shape, the same length, and the same width. - Referring additionally to
FIG. 3 , the firstflexible substrate 110 and the secondflexible substrate 120 are respectively formed on thefirst surface 100 a and thesecond surface 100 b of thesubstrate 100. In the instant embodiment, the firstflexible substrate 110 and the secondflexible substrate 120 are both plastic substrates and the materials of the plastic substrates comprise one of polycarbonate, polyethylene terephthalate, polyimide, polyarylate, polyethersulfone, polyethylene naphthalate, and fiber reinforced plastics, or combinations of two or more than two of them. - Since the first
flexible substrate 110 and the secondflexible substrate 120 are of the same material and the same size, an acting force applied from the firstflexible substrate 110 to thesubstrate 100 is equal to, but in opposite direction, an acting force applied from thesecond substrate 120 to thesubstrate 100. - When the first
flexible substrate 110 and the secondflexible substrate 120 are subjected to heating, since the amount of contraction of the firstflexible substrate 110 is greater than the amount of contraction of the glass substrate, the firstflexible substrate 110 applies an acting force to the glass substrate, which will be referred to as a first acting force. Under the action of the first acting force, the firstflexible substrate 110 forces the glass substrate to contract upward. However, since the secondflexible substrate 120 is formed on thesecond surface 100 b of thesubstrate 100, when the secondflexible substrate 120 is subjected to heating, due to the amount of contraction of the secondflexible substrate 110 being greater than the amount of contraction of the glass substrate, the secondflexible substrate 120 applied an acting force to the glass substrate, which will be referred to as a second acting force. Under the action of the second acting force, the second flexible substrate forces the glass substrate to contract downward. Since the first acting force and the second acting force are equal in amount but opposite in direction, the first acting force and the second acting force cancel each other thereby preventing the firstflexible substrate 110, the secondflexible substrate 120, and thesubstrate 100 from getting warped and thus enhancing the quality of a flexible display device. - In one embodiment, in Step S202, adhesive is applied to bond the first
flexible substrate 110 to thefirst surface 100 a of thesubstrate 100 and adhesive is applied to bond the secondflexible substrate 120 to the second surface 110 b of thesubstrate 100. - In another embodiment, in Step S202, the atmospheric pressure is used to set the first
flexible substrate 110 on thefirst surface 100 a of thesubstrate 100 and the atmospheric pressure is used to set the secondflexible substrate 120 on thesecond surface 100 b of thesubstrate 100. - Step S203: forming a displaying
component 130 on a surface of the firstflexible substrate 110 that is distant from thesubstrate 100. - Preferably, after Step S203, the method for manufacturing the flexible display device 10 further comprises: forming a
driving circuit 140 of the displayingcomponent 130 on the surface of the firstflexible substrate 110 that is distant from thesubstrate 100. Referring additionally toFIG. 5 , the drivingcircuit 140 is provided to drive the displayingcomponent 130. It is appreciated that, in other embodiments, forming the drivingcircuit 140 of the displayingcomponent 130 formed on the surface of the firstflexible substrate 110 that is distant from thesubstrate 100 can be performed in the same step as that of forming the displayingcomponent 130 on the surface of the firstflexible substrate 110 that is distant from thesubstrate 100. - Step S204: peeling the first
flexible substrate 110 on which the displayingcomponent 130 is formed off thesubstrate 100 so as to form a flexible display device 10. Referring additionally toFIG. 6 , the firstflexible substrate 110 on which the displayingcomponent 130 is formed is peeled from thefirst surface 100 a of thesubstrate 100 so that the firstflexible substrate 100 and the displayingcomponent 130 formed on the surface of the firstflexible substrate 100 collectively form the flexible display device 10. - Step S205: forming a first
flexible substrate 110 on thefirst surface 100 a of thesubstrate 100. Referring additionally toFIG. 7 , a firstflexible substrate 110 is formed again on thefirst surface 100 a of thesubstrate 100. - Step S206: forming a displaying
component 130 on a surface of the firstflexible substrate 110 that is distant from thesubstrate 100. Referring additionally toFIG. 8 , the firstflexible substrate 110 comprises two opposite surfaces and the firstflexible substrate 110 is formed through one of these surfaces on thefirst surface 100 a of thesubstrate 100, and the other surface of the firstflexible substrate 100 is used to receive the displayingcomponent 130 formed thereon. The displaying component can be one of a liquid crystal display, an organic electroluminescent display, an electronic paper, an electrophoretic display, a touch screen, and a thin-film photovoltaic cell or a combination of two or more than two of them. - Preferably, after Step S206, the method for manufacturing the flexible display device 10 further comprises: forming a
driving circuit 140 of the displayingcomponent 130 on the surface of the firstflexible substrate 110 that is distant from thesubstrate 100. The drivingcircuit 140 is provided to drive the displayingcomponent 130. It is appreciated that, in other embodiments, forming the drivingcircuit 140 of the displayingcomponent 130 formed on the surface of the firstflexible substrate 110 that is distant from thesubstrate 100 can be performed in the same step as that of forming the displayingcomponent 130 on the surface of the firstflexible substrate 110 that is distant from thesubstrate 100. - Step S207: peeling the first
flexible substrate 110 on which the displayingcomponent 130 is formed off thesubstrate 100 so as to form another one of the flexible display device 10. Referring additionally to FIG. 9, the firstflexible substrate 110 on which the displayingcomponent 130 is formed is peeled from thefirst surface 100 a of thesubstrate 100 so that the firstflexible substrate 100 and the displayingcomponent 130 formed on the surface of the firstflexible substrate 100 collectively form the flexible display device 10. - After Step S204, Steps S205-S207 are repeatedly performed so as to repeatedly use the substrate 10 of which the second surface 110 b comprises the second
flexible substrate 120 formed thereon to generate multiple ones of the flexible display device 10. - Disclosed above is only one preferred embodiment of the present invention, which does not impose undue constraints to the scope of protection of the present invention. Those having ordinary skills of the art may readily appreciate that equivalent modifications that allow for realization of all or part of the operation process of the preferred embodiment described above and comply with the requirement defined in the appended claims are considered within the protection scope covered by the present invention.
Claims (10)
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CN201410658898 | 2014-11-18 | ||
CN201410658898.1A CN104392903A (en) | 2014-11-18 | 2014-11-18 | Flexible display device production method |
PCT/CN2014/093162 WO2016078161A1 (en) | 2014-11-18 | 2014-12-05 | Preparation method for flexible display device |
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US9337219B1 US9337219B1 (en) | 2016-05-10 |
US20160141313A1 true US20160141313A1 (en) | 2016-05-19 |
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US20150324042A1 (en) * | 2014-05-06 | 2015-11-12 | Darwin Hu | Single flexible cover for touch screen |
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JP4101666B2 (en) * | 2002-01-22 | 2008-06-18 | 松下電器産業株式会社 | Information recording medium, recording apparatus, reproducing apparatus, recording method, reproducing method |
US7504327B2 (en) * | 2004-06-14 | 2009-03-17 | Semiconductor Energy Laboratory Co., Ltd. | Method of manufacturing thin film semiconductor device |
KR101354162B1 (en) * | 2004-10-20 | 2014-01-22 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | Laser irradiation, laser irradiation apparatus and method for manufacturing semiconductor device |
US7605026B1 (en) * | 2007-12-03 | 2009-10-20 | Cbrite, Inc. | Self-aligned transparent metal oxide TFT on flexible substrate |
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US20150324042A1 (en) * | 2014-05-06 | 2015-11-12 | Darwin Hu | Single flexible cover for touch screen |
US9701099B2 (en) * | 2014-05-06 | 2017-07-11 | Darwin Hu | Single flexible cover for touch screen |
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