US20160111194A1 - Chip electronic component and board having the same - Google Patents

Chip electronic component and board having the same Download PDF

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Publication number
US20160111194A1
US20160111194A1 US14/677,826 US201514677826A US2016111194A1 US 20160111194 A1 US20160111194 A1 US 20160111194A1 US 201514677826 A US201514677826 A US 201514677826A US 2016111194 A1 US2016111194 A1 US 2016111194A1
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US
United States
Prior art keywords
electronic component
chip electronic
insulating substrate
internal coil
disposed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US14/677,826
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English (en)
Inventor
Dong Jin JEONG
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Samsung Electro Mechanics Co Ltd
Original Assignee
Samsung Electro Mechanics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Electro Mechanics Co Ltd filed Critical Samsung Electro Mechanics Co Ltd
Assigned to SAMSUNG ELECTRO-MECHANICS CO., LTD. reassignment SAMSUNG ELECTRO-MECHANICS CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: JEONG, DONG JIN
Publication of US20160111194A1 publication Critical patent/US20160111194A1/en
Abandoned legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/2804—Printed windings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H01F17/0006—Printed inductances
    • H01F17/0013—Printed inductances with stacked layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H01F17/04—Fixed inductances of the signal type  with magnetic core
    • H01F17/06—Fixed inductances of the signal type  with magnetic core with core substantially closed in itself, e.g. toroid
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/24—Magnetic cores
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/29—Terminals; Tapping arrangements for signal inductances
    • H01F27/292—Surface mounted devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H01F17/04—Fixed inductances of the signal type  with magnetic core
    • H01F2017/048—Fixed inductances of the signal type  with magnetic core with encapsulating core, e.g. made of resin and magnetic powder
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/2804—Printed windings
    • H01F2027/2809—Printed windings on stacked layers

Definitions

  • the present disclosure relates to a chip electronic component and a board having the same.
  • An inductor, a chip electronic component is a representative passive element configuring an electronic circuit, together with a resistor and a capacitor, in order to remove noise therefrom.
  • a thin film type inductor may be manufactured by forming an internal coil part through a plating process, forming a magnetic body by hardening a magnetic powder-resin composite in which magnetic powder and resin are mixed, and forming external electrodes on outer surfaces of the magnetic body.
  • Patent Document 1 Japanese Patent Laid-Open Publication No. 2007-067214
  • An aspect of the present disclosure may provide a chip electronic component in which excessive growth of via pads is suppressed to prevent short-circuits due to the excessive growth of the via pads and prevent loss of inductance due to an enlarged area of the via pads.
  • a chip electronic component may include: an insulating substrate; a first internal coil part which is disposed on one surface of the insulating substrate; a second internal coil part which is disposed on the other surface of the insulating substrate opposing one surface of the insulating substrate; a via penetrating through the insulating substrate and connecting the first and second internal coil parts to each other; and first and second via pads disposed on one surface and the other surface of the insulating substrate, respectively, so as to cover the via, wherein when a width of each of a coil pattern of the first and second coil parts is a and a maximum width of each of the first and second via pads is b, 1 ⁇ b/a ⁇ 2.3 is satisfied.
  • FIG. 1 is a schematic perspective view of a chip electronic component according to an exemplary embodiment in the present disclosure, together with an internal coil part included therein;
  • FIG. 2 is a cross-sectional view taken along line I-I′ of FIG. 1 ;
  • FIG. 3 is schematic plan view of via pads according to an exemplary embodiment in the present disclosure
  • FIG. 4 is a cross-sectional view taken along line II-II′ of FIG. 1 ;
  • FIG. 5 is a perspective view of a board in which the chip electronic component of FIG. 1 is mounted on a printed circuit board;
  • FIG. 6 is a perspective view of a board in which a chip electronic component is mounted on a printed circuit board, according to another exemplary embodiment of the present disclosure.
  • FIG. 1 is a schematic perspective view of a chip electronic component according to an exemplary embodiment in the present disclosure, together with an internal coil part included therein.
  • a thin film type inductor used in a power line of a power supplying circuit is illustrated as an example of a chip electronic component.
  • a chip electronic component 100 may include a magnetic body 50 , internal coil parts 41 and 42 buried in the magnetic body 50 , and first and second external electrodes 81 and 82 disposed on outer surfaces of the magnetic body 50 and electrically connected to the internal coil parts 41 and 42 .
  • a ‘length’ direction refers to an ‘L’ direction of FIG. 1
  • a ‘width’ direction refers to a ‘W’ direction of FIG. 1
  • a ‘thickness’ direction refers to a ‘T’ direction of FIG. 1 .
  • the magnetic body 50 may form the exterior appearance of the chip electronic inductor 100 and may be formed of any material that exhibits magnetic properties.
  • the magnetic body 50 may be filled with ferrite or magnetic metal powder.
  • the ferrite may include Mn-Zn based ferrite, Ni—Zn based ferrite, Ni—Zn—Cu based ferrite, Mn—Mg based ferrite, Ba based ferrite, and Li based ferrite.
  • the magnetic metal powder may contain at least one selected from the group consisting of Fe, Si, Cr, Al, and Ni.
  • the magnetic metal powder may include a Fe—Si—B—Cr based amorphous metal, but is not limited thereto.
  • the magnetic metal powder may have a particle diameter of 0.1 ⁇ m to 30 ⁇ m and may be dispersed in a thermosetting resin such as an epoxy resin or a polyimide resin.
  • the first internal coil part 41 having a coil pattern may be formed on one surface of an insulating substrate 20 disposed inside the magnetic body 50
  • the second internal coil part 42 having a coil pattern may be formed on the other surface of the insulating surface 20 opposing one surface of the insulating substrate 20 .
  • the first and second internal coil parts 41 and 42 may have a spiral shape and be formed by using an electroplating method.
  • the insulating substrate 20 may be, for example, a polypropylene glycol (PPG) substrate, a ferrite substrate, or a metal based soft magnetic substrate.
  • PPG polypropylene glycol
  • the insulating substrate 20 may have a through-hole formed in a central portion thereof, wherein the through-hole may be filled with a magnetic material to form a core part 55 .
  • the core part 55 may be formed to be filled with the magnetic material, thereby improving inductance Ls.
  • FIG. 2 is a cross-sectional view taken along line I-I′ of FIG. 1 .
  • the first and second internal coil parts 41 and 42 formed on one surface and the other surface of the insulating substrate 20 may be connected to each other through a via 45 penetrating through the insulating substrate 20 .
  • First and second via pads 43 and 44 may be formed on one surface and the other surface of the insulating substrate 20 , respectively, so as to cover the via 45 .
  • the first via pad 43 may be formed by extending one end portion of the first internal coil part 41
  • the second via pad 44 may be formed by extending one end portion of the second internal coil part 42 .
  • the first and second via pads 43 and 44 may be formed by using an electroplating method, similar to the first and second internal coil parts 41 and 42 .
  • an excessive amount of plating solution may be present in regions of the internal coil parts in which the via pads are to be formed than in other regions of the internal coil parts in a plating process of forming the via pads, causing excessive growth of the via pads, and thus, short-circuits between the via pads and portions of the internal coil parts adjacent to the via pads may occur.
  • an area of the via pad is increased due to the excessive growth of the via pad, an area of the core part may be decreased and a magnetic material filling the core part may be decreased, whereby inductance (Ls) characteristics may deteriorate.
  • the above-mentioned problems have been solved by allowing a width a of each of coil patterns 41 ′ and 42 ′ of the first and second internal coil parts 41 and 42 and a maximum width b of each of the first and second via pads 43 and 44 to satisfy 1 ⁇ b/a ⁇ 2.3.
  • FIGS. 3A and 3B are schematic plan views of via pads according to an exemplary embodiment in the present disclosure.
  • the maximum width b of each of the first and second via pads 43 and 44 refers to the largest width thereof measured in the same direction as a direction in which the width a of each end portion of the coil patterns 41 ′ and 42 ′ of the first and second internal coil parts 41 and 42 connected to the first and second via pads 43 and 44 is measured.
  • a difference between a thickness c of each of the internal coil parts 41 and 42 and a thickness d of each of the via pads 43 and 44 may be reduced, and short-circuits due to the excessive growth of the via pads may be prevented.
  • the open defect in which the via 45 and the via pads 43 and 44 are misaligned with each other to thereby be electrically disconnected from each other, may occur.
  • b/a is 2.3 or more, as the width of the via pad becomes excessively increased, the via pad becomes excessively thicker than the internal coil part, whereby short-circuits may occur due to the excessive growth of the via pad.
  • d/c when the thickness of each of the coil patterns 41 ′ and 42 ′ in the first and second internal coil parts 41 and 42 is c and the thickness of each of the first and second via pads 43 and 44 is d, d/c may be 1 or less.
  • the via pad may become excessively thicker than the internal coil part, and thus, short-circuits may occur between the via pad and the coil pattern adjacent thereto.
  • each of the coil patterns 41 ′ and 42 ′ of the first and second internal coil parts 41 and 42 may range from 30 ⁇ m to 200 ⁇ m.
  • the maximum width b of each of the first and second via pads 43 and 44 may range from 60 ⁇ m to 250 ⁇ m.
  • each of the coil patterns 41 ′ and 42 ′ of the first and second internal coil parts 41 and 42 and the maximum width b of each of the first and second via pads 43 and 44 are not limited thereto, and may be adjusted to satisfy
  • the first and second internal coil parts 41 and 42 , the via 45 , and the first and second via pads 43 and 44 may be formed of a metal having excellent electrical conductivity, such as silver (Ag), palladium (Pd), aluminum (Al), nickel (Ni), titanium (Ti), gold (Au), copper (Cu), platinum (Pt), or an alloy thereof.
  • a metal having excellent electrical conductivity such as silver (Ag), palladium (Pd), aluminum (Al), nickel (Ni), titanium (Ti), gold (Au), copper (Cu), platinum (Pt), or an alloy thereof.
  • FIG. 4 is a cross-sectional view taken along line II-II′ of FIG. 1 .
  • the other end portion of the first internal coil part 41 may be extended to form a first lead portion 46 exposed to one end surface of the magnetic body 50 in the length (L) direction thereof, and the other end portion of the second internal coil part 42 may be extended to form a second lead portion 47 exposed to the other end surface of the magnetic body 50 in the length (L) direction thereof.
  • first and second lead portions 46 and 47 may be exposed to at least one surface of the magnetic body 50 .
  • the first and second external electrodes 81 and 82 may be disposed on both end surfaces of the magnetic body 50 in the length (L) direction, respectively, so as to be connected to the first and second lead portions 46 and 47 exposed to both end surfaces of the magnetic body 50 in the length (L) direction, respectively.
  • the first and second external electrodes 81 and 82 may be formed of a metal having excellent electrical conductivity, such as nickel (Ni), copper (Cu), tin (Sn), silver (Ag), or an alloy thereof.
  • the following table 1 shows results of a ratio (b/a) of the maximum width b of each of the via pads 43 and 44 to the width of each of the coil patterns 41 ′ and 42 ′ of the internal coil parts 41 and 42 , a ratio (d/c) of the thickness of each of the first and second via pads 43 and 44 to the thickness of each of the coil patterns 41 ′ and 42 ′ of the internal coil parts 41 and 42 , and the occurrence of short-circuits, depending on changes in the width a of each of the coil patterns 41 ′ and 42 ′ of the internal coil parts 41 and 42 and the maximum width b of each of the via pads 43 and 44 .
  • FIG. 5 is a perspective view of a board in which the chip electronic component of FIG. 1 is mounted on a printed circuit board.
  • a board 1000 having a chip electronic component 100 may include: the chip electronic component 100 ; and a printed circuit board 1100 on which the chip electronic component 100 is mounted, and first and second electrode pads 1110 and 1120 may be formed to be spaced apart from each other on an upper surface of the printed circuit board 1100 .
  • the chip electronic component 100 may be electrically connected to the printed circuit board 1100 by solders 1130 in a state in which the first and second external electrodes 81 and 82 formed on both end surfaces of the chip electronic component 100 are positioned to contact the first and second electrode pads 1110 and 1120 , respectively.
  • the internal coil parts 41 and 42 of the chip electronic component 100 mounted on the printed circuit board may be disposed to be parallel to amounting surface (S M ) of the printed circuit board 1100 .
  • FIG. 6 is a perspective view of a board in which a chip electronic component is mounted on a printed circuit board, according to another exemplary embodiment of the present disclosure.
  • internal coil parts 41 and 42 of the chip electronic component 200 may be disposed to be perpendicular to a mounting surface (S M ) of the printed circuit board 1100 .
  • short-circuits due to excessive growth of the via pads may be prevented, and loss of inductance due to an enlarged area of the via pads may be prevented.

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coils Or Transformers For Communication (AREA)
US14/677,826 2014-10-16 2015-04-02 Chip electronic component and board having the same Abandoned US20160111194A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2014-0139623 2014-10-16
KR1020140139623A KR101832546B1 (ko) 2014-10-16 2014-10-16 칩 전자부품 및 칩 전자부품의 실장 기판

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KR (1) KR101832546B1 (ko)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20190013143A1 (en) * 2017-07-05 2019-01-10 Samsung Electro-Mechanics Co., Ltd. Thin film type inductor
US20190013142A1 (en) * 2017-07-05 2019-01-10 Samsung Electro-Mechanics Co., Ltd. Thin film-type inductor
JP2019114768A (ja) * 2017-12-20 2019-07-11 サムソン エレクトロ−メカニックス カンパニーリミテッド． コイル電子部品
US20190237239A1 (en) * 2018-01-29 2019-08-01 Tdk Corporation Coil component
US20200286671A1 (en) * 2019-03-06 2020-09-10 Samsung Electro-Mechanics Co., Ltd. Coil component and manufacturing method for the same
US20200373055A1 (en) * 2014-10-14 2020-11-26 Samsung Electro-Mechanics Co., Ltd. Chip electronic component and board having the same

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101994757B1 (ko) * 2017-09-29 2019-07-01 삼성전기주식회사 박막형 인덕터
KR102064118B1 (ko) * 2019-05-31 2020-01-08 삼성전기주식회사 코일부품 및 그 제조방법

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US6218925B1 (en) * 1998-01-08 2001-04-17 Taiyo Yuden Co., Ltd. Electronic components
US6996892B1 (en) * 2005-03-24 2006-02-14 Rf Micro Devices, Inc. Circuit board embedded inductor
US20080246579A1 (en) * 2005-12-23 2008-10-09 Murata Manufacturing Co., Ltd. Laminated coil component and method for manufacturing the same
US20100026443A1 (en) * 2008-07-29 2010-02-04 Yipeng Yan Magnetic Electrical Device
US20130249664A1 (en) * 2012-03-26 2013-09-26 Tdk Corporation Planar coil element and method for producing the same

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6218925B1 (en) * 1998-01-08 2001-04-17 Taiyo Yuden Co., Ltd. Electronic components
US6996892B1 (en) * 2005-03-24 2006-02-14 Rf Micro Devices, Inc. Circuit board embedded inductor
US20080246579A1 (en) * 2005-12-23 2008-10-09 Murata Manufacturing Co., Ltd. Laminated coil component and method for manufacturing the same
US20100026443A1 (en) * 2008-07-29 2010-02-04 Yipeng Yan Magnetic Electrical Device
US20130249664A1 (en) * 2012-03-26 2013-09-26 Tdk Corporation Planar coil element and method for producing the same

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20200373055A1 (en) * 2014-10-14 2020-11-26 Samsung Electro-Mechanics Co., Ltd. Chip electronic component and board having the same
US11626233B2 (en) * 2014-10-14 2023-04-11 Samsung Electro-Mechanics Co., Ltd. Chip electronic component and board having the same
US10741321B2 (en) * 2017-07-05 2020-08-11 Samsung Electro-Mechanics Co., Ltd. Thin film type inductor
CN109215973A (zh) * 2017-07-05 2019-01-15 三星电机株式会社 薄膜式电感器
US20190013143A1 (en) * 2017-07-05 2019-01-10 Samsung Electro-Mechanics Co., Ltd. Thin film type inductor
US10763032B2 (en) * 2017-07-05 2020-09-01 Samsung Electro-Mechanics Co., Ltd. Thin film-type inductor
CN109215972A (zh) * 2017-07-05 2019-01-15 三星电机株式会社 薄膜型电感器
US20190013142A1 (en) * 2017-07-05 2019-01-10 Samsung Electro-Mechanics Co., Ltd. Thin film-type inductor
JP2019114768A (ja) * 2017-12-20 2019-07-11 サムソン エレクトロ−メカニックス カンパニーリミテッド． コイル電子部品
US11282634B2 (en) * 2017-12-20 2022-03-22 Samsung Electro-Mechanics Co., Ltd. Coil electronic component
US20190237239A1 (en) * 2018-01-29 2019-08-01 Tdk Corporation Coil component
US11569020B2 (en) * 2018-01-29 2023-01-31 Tdk Corporation Coil component
US20200286671A1 (en) * 2019-03-06 2020-09-10 Samsung Electro-Mechanics Co., Ltd. Coil component and manufacturing method for the same
CN111667994A (zh) * 2019-03-06 2020-09-15 三星电机株式会社 线圈组件及用于制造该线圈组件的方法
US11830652B2 (en) * 2019-03-06 2023-11-28 Samsung Electro-Mechanics Co., Ltd. Coil component and manufacturing method for the same

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Publication number Publication date
KR101832546B1 (ko) 2018-02-26
KR20160044756A (ko) 2016-04-26

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AS Assignment

Owner name: SAMSUNG ELECTRO-MECHANICS CO., LTD., KOREA, REPUBL

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:JEONG, DONG JIN;REEL/FRAME:035325/0310

Effective date: 20150304

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION