US20150262871A1 - Semiconductor structure and method for manufacturing the same - Google Patents

Semiconductor structure and method for manufacturing the same Download PDF

Info

Publication number
US20150262871A1
US20150262871A1 US14/215,149 US201414215149A US2015262871A1 US 20150262871 A1 US20150262871 A1 US 20150262871A1 US 201414215149 A US201414215149 A US 201414215149A US 2015262871 A1 US2015262871 A1 US 2015262871A1
Authority
US
United States
Prior art keywords
conductive
dielectric
dielectric portion
conductive plug
dielectric layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
US14/215,149
Other versions
US9142454B1 (en
Inventor
Guan-Ru Lee
Yu-Wei Jiang
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Macronix International Co Ltd
Original Assignee
Macronix International Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Macronix International Co Ltd filed Critical Macronix International Co Ltd
Priority to US14/215,149 priority Critical patent/US9142454B1/en
Assigned to MACRONIX INTERNATIONAL CO., LTD. reassignment MACRONIX INTERNATIONAL CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: JIANG, YU-WEI, LEE, GUAN-RU
Publication of US20150262871A1 publication Critical patent/US20150262871A1/en
Application granted granted Critical
Publication of US9142454B1 publication Critical patent/US9142454B1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76801—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing
    • H01L21/76829—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing characterised by the formation of thin functional dielectric layers, e.g. dielectric etch-stop, barrier, capping or liner layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
    • H01L21/76877—Filling of holes, grooves or trenches, e.g. vias, with conductive material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76801—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing
    • H01L21/76802—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing by forming openings in dielectrics
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76801—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing
    • H01L21/76802—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing by forming openings in dielectrics
    • H01L21/76816—Aspects relating to the layout of the pattern or to the size of vias or trenches
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/481—Internal lead connections, e.g. via connections, feedthrough structures
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B41/00—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates
    • H10B41/50—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates characterised by the boundary region between the core region and the peripheral circuit region
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B43/00—EEPROM devices comprising charge-trapping gate insulators
    • H10B43/50—EEPROM devices comprising charge-trapping gate insulators characterised by the boundary region between the core and peripheral circuit regions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B41/00—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates
    • H10B41/20—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates characterised by three-dimensional arrangements, e.g. with cells on different height levels
    • H10B41/23—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates characterised by three-dimensional arrangements, e.g. with cells on different height levels with source and drain on different levels, e.g. with sloping channels
    • H10B41/27—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates characterised by three-dimensional arrangements, e.g. with cells on different height levels with source and drain on different levels, e.g. with sloping channels the channels comprising vertical portions, e.g. U-shaped channels
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B43/00—EEPROM devices comprising charge-trapping gate insulators
    • H10B43/20—EEPROM devices comprising charge-trapping gate insulators characterised by three-dimensional arrangements, e.g. with cells on different height levels
    • H10B43/23—EEPROM devices comprising charge-trapping gate insulators characterised by three-dimensional arrangements, e.g. with cells on different height levels with source and drain on different levels, e.g. with sloping channels
    • H10B43/27—EEPROM devices comprising charge-trapping gate insulators characterised by three-dimensional arrangements, e.g. with cells on different height levels with source and drain on different levels, e.g. with sloping channels the channels comprising vertical portions, e.g. U-shaped channels

Definitions

  • the invention relates to a semiconductor structure and a method for manufacturing the same are disclosed and more specifically to a semiconductor structure including a conductive plug and a method for manufacturing the same.
  • Semiconductor structures include memory devices, used in storage elements for many products such as MP3 players, digital cameras, computer files, etc. As the application increases, the demand for the memory device focuses on small size and large memory capacity. For satisfying the requirement, a memory having a high element density is need.
  • Designers have developed a method for improving a memory device density, using 3D stack memory device so as to increase a memory capacity and a cost per cell.
  • complex structures of a memory device make manufacturing processes complicated.
  • a method for manufacturing a semiconductor structure comprises following steps.
  • a first conductive structure is formed on a substrate.
  • a second conductive structure is formed on the substrate and has a material different from a material of an upper conductive portion of the first conductive structure.
  • a lower dielectric portion of a dielectric structure is formed on the first conductive structure and the second conductive structure.
  • a dielectric layer is formed on the lower dielectric portion.
  • An upper dielectric portion of the dielectric structure is formed on the dielectric layer having a material different from materials of the upper dielectric portion and the lower dielectric portion.
  • a first conductive plug is formed to pass through only the upper dielectric portion, the dielectric layer and the lower dielectric portion to physically and electrically contact with the first conductive structure.
  • a second conductive plug is formed to pass through the upper dielectric portion, the dielectric layer and the lower dielectric portion to physically and electrically contact with the second conductive structure.
  • a semiconductor structure comprising a substrate, a first conductive structure, a second conductive structure, a dielectric structure, a dielectric layer, a first conductive plug, and a second conductive plug.
  • the first conductive structure is on the substrate.
  • the second conductive structure is on the substrate and has a material different from an upper conductive portion of the first conductive structure.
  • the dielectric structure comprises an upper dielectric portion and a lower dielectric portion.
  • the dielectric layer is between the upper dielectric portion and the lower dielectric portion, and has a material different from materials of the upper dielectric portion and the lower dielectric portion.
  • the first conductive plug passes through only the upper dielectric portion, the dielectric layer and the lower dielectric portion to physically and electrically contact with the first conductive structure.
  • the second conductive plug passes through the upper dielectric portion, the dielectric layer and the lower dielectric portion to physically and electrically contact with the second conductive structure.
  • FIG. 1A to FIG. 1H illustrate a method for manufacturing a semiconductor structure according to an embodiment.
  • FIG. 2 illustrates a semiconductor structure according to a comparative example.
  • FIG. 1A to FIG. 1H illustrate a method for manufacturing a semiconductor structure according to an embodiment.
  • a substrate 102 is provided.
  • the substrate 102 may comprise a silicon substrate, such as polysilicon, or other suitable semiconductor substrates.
  • a first conductive structure 104 is formed on the substrate 102 in a first circuit region 106 .
  • a lower dielectric portion 108 is formed on the first conductive structure 104 .
  • the first conductive structure 104 comprises conductive stair of different levels, separated form each other by the lower dielectric portion 108 .
  • the conductive stairs of the first conductive structure 104 comprise (un-metalized) polysilicon material.
  • a silicon-containing structure 110 is formed on the substrate 102 in a second circuit region 112 .
  • the silicon-containing structure 110 comprises polysilicon.
  • the silicon-containing structure 110 may be formed over the conductive strips 114 and dielectric strips 116 stacked alternately of a 3D stacked memory, and separated from the conductive strips 114 and the dielectric strips 116 by an insulating material 118 .
  • the conductive stairs of the first conductive structure 104 and the conductive strips 114 of the second circuit region 112 may be arranged in the same level, and the silicon-containing structure 110 may be disposed higher than the first conductive structure 104 .
  • a first etching stop layer 120 is formed to cover the lower dielectric portion 108 in the first circuit region 106 and the insulating material 118 on the silicon-containing structure 110 in the second circuit region 112 .
  • a dielectric material is formed on the first etching stop layer 120 to form an upper dielectric portion 122 in the first circuit region 106 .
  • the dielectric material is planarized by a CMP process stopping on the first etching stop layer 120 .
  • portions of the upper dielectric portion 122 ( FIG. 1A ), the first etching stop layer 120 ( FIG. 1A ) and the insulating material 118 may be removed by an etching step, to expose an upper portion of the silicon-containing structure 110 , and remain the first etching stop layer 120 in the first circuit region 106 to form a dielectric layer 124 under the upper dielectric portion 122 A.
  • a formed second conductive structure 128 comprises the upper conductive portion 126 and a lower conductive portion 130 , wherein the lower conductive portion 130 maintains comprising the (un-metalized) polysilicon material as the silicon-containing structure 110 .
  • the second conductive structure 128 is not limited to be a gate structure of a MOS, and can be a source or a drain of the MOS, or other contact structures.
  • a dielectric material is formed in the first circuit region 106 and the second circuit region 112 , to form a lower dielectric portion 132 covering the second conductive structure 128 , and form the upper dielectric portion 122 B.
  • a second etching stop layer 134 is formed to cover the upper dielectric portion 122 B in the first circuit region 106 and the lower dielectric portion 132 in the second circuit region 112 .
  • a patterned mask 136 is formed on the second etching stop layer 134 ( FIG. 1D ) in the second circuit region 112 .
  • An un-covered portion of the second etching stop layer 134 in the first circuit region 106 is removed by an etching process.
  • the remained portion of the second etching stop layer 134 by the etching process forms a dielectric layer 138 .
  • the patterned mask 136 is removed to form the structure as shown in FIG. 1F .
  • a dielectric material is formed on the upper dielectric portion 1226 ( FIG. 1F ) in the first circuit region 106 and the dielectric layer 138 in the second circuit region 112 , to form the upper dielectric portion 122 C in the first circuit region 106 , and an upper dielectric portion 140 in the second circuit region 112 .
  • the dielectric layer 124 has a material different from materials of the upper dielectric portion 122 C and the lower dielectric portion 108 of a dielectric structure 142 .
  • the dielectric layer 138 has a material different from materials of the upper dielectric portion 140 and the lower dielectric portion 132 of a dielectric structure 144 .
  • the upper dielectric portions 122 C, 140 and the lower dielectric portions 108 , 132 comprise an oxide such as silicon oxide.
  • the dielectric layers 124 , 138 comprise a nitride such as silicon nitride.
  • a first conductive plug 146 is formed to pass through only the upper dielectric portion 122 C, the dielectric layer 124 and the lower dielectric portion 108 , to physically and electrically contact with the first conductive structure 104 .
  • a second conductive plug 148 is formed to pass through only the upper dielectric portion 140 , the dielectric layer 138 and the lower dielectric portion 132 , to physically and electrically contact with the upper conductive portion 126 of the second conductive structure 128 .
  • the first conductive plug 146 has an aspect ratio or a height larger than an aspect ratio or a height of the second conductive plug 148 .
  • the first conductive plug 146 may have a high aspect ratio.
  • the first conductive plug 146 and the second conductive plug 148 may be formed by a method comprising forming through holes 150 , 152 by etching processes and filling the through holes 150 , 152 by a conductive material.
  • through holes stopping on the dielectric layers 124 , 138 may be formed by a first etching step using the same mask (not shown) to etch down from upper surfaces of the upper dielectric portion 122 C and the upper dielectric portion 140 at the same time.
  • the first etching step has a higher etching selectivity to the upper dielectric portions 122 C, 140 , that is, the first etching step etches the upper dielectric portions 122 C, 140 faster than the dielectric layers 124 , 138 , or etches none of the dielectric layers 124 , 138 substantially (the similar concepts will not described hereafter).
  • the first etching step and the through holes formed by the first etching step can stop on the dielectric layer 124 and the dielectric layer 138 in desire, and have desirable different aspect ratios or height.
  • the dielectric layers 124 , 138 exposed by the through holes may be removed by a second etching step different from the first etching step to extend the through hole down to form through holes exposing the lower dielectric portions 108 , 132 .
  • the second etching step may have a higher etching selectivity to the dielectric layers 124 , 138 . Therefore, the second etching step and the through holes formed by the second etching step can be controlled to stop on the lower dielectric portions 108 , 132 in desire.
  • the lower dielectric portions 108 , 132 exposed by the through holes may be removed by a third etching step different from the second etching step, to extend the through holes down to form a through hole 150 and a through hole 152 exposing the first conductive structure 104 and the second conductive structure 128 respectively.
  • the third etching step has a higher etching selectivity to the lower dielectric portions 108 , 132 . Therefore, the third etching step and the through holes 150 , 152 formed by the third etching step can be controlled to stop on the first conductive structure 104 and the second conductive structure 128 with desire.
  • the first etching step for removing the upper dielectric portions 122 C, 140 and the third etching step for the lower dielectric portions 108 , 132 may use the same etching conditions such as the same etching solution, etc.
  • the second etching step for removing the dielectric layers 124 , 138 may be continued after removing the dielectric layers 124 , 138 to continuously remove the lower dielectric portions 108 , 132 .
  • the second etching step can be controlled to stop on the first conductive structure 104 and the second conductive structure 128 by controlling an etching time or depending on etching selectivity to materials to be etched.
  • the semiconductor structure and the method for manufacturing for which may be varied according to the above concepts. Some examples are illustrated as following.
  • the upper dielectric portions 122 C, 140 and the lower dielectric portions 108 , 132 are not limited to an oxide, and the dielectric layers 124 , 138 are not limited to a nitride.
  • materials for the upper dielectric portions 122 C, 140 , the lower dielectric portions 108 , 132 and the dielectric layers 124 , 138 may be suitably selected according to parameters of etching processes and etching selectivity characteristics to the materials.
  • the second conductive structure 128 and the first conductive structure 104 may be arranged in a similar or the same level by omitting the conductive strips 114 or reducing a number of the conductive strips 114 to be less than a number of the conductive stairs of the first conductive structure 104 .
  • the first conductive plug 146 may be longer than or as long as the second conductive plug 148 .
  • the concepts of the embodiments can be applied to device of other kinds, needed to form conductive plugs electrically and physically contact with conductive structures of different structure characteristic and/or different levels (heights), respectively.
  • FIG. 2 illustrates a semiconductor structure according to a comparative example. Differences between the semiconductor structures of the comparative example and the embodiment are illustrated as following.
  • the first conductive plug 246 in sequence passes through an upper dielectric portion 222 C, a dielectric layer 238 , a middle dielectric portion 254 , a dielectric layer 224 , and a lower dielectric portion 208 to physically and electrically contact with the first conductive structure 104 .
  • the upper dielectric portion 222 C, the middle dielectric portion 254 and the lower dielectric portion 208 of a dielectric structure 242 comprises an oxide such as silicon oxide
  • the dielectric layers 224 , 238 comprise a nitride such as silicon.
  • the semiconductor structure of the embodiment as shown in FIG. 1A to FIG. 1H uses only one mask to etch out the through holes 150 , 152 for forming the first conductive plug 146 and the second conductive plug 148 , and need less etching processes and shorter manufacturing time.
  • the mask for the embodiment can have a feature size lager (such as non-critical) than a feature size of the mask for the comparative example. Therefore, the semiconductor structure according to embodiments has low cost and high WPH.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)

Abstract

A semiconductor structure and a method for manufacturing the same are disclosed. The semiconductor structure includes a substrate, a first conductive structure, a second conductive structure, a dielectric structure, a dielectric layer, a first conductive plug, and a second conductive plug. The first conductive plug passes through only an upper dielectric portion of the dielectric structure, the dielectric layer and a lower dielectric portion of the dielectric structure to physically and electrically contact with the first conductive structure. The second conductive plug passes through the upper dielectric portion, the dielectric layer and the lower dielectric portion to physically and electrically contact with the second conductive structure.

Description

    BACKGROUND
  • 1. Technical Field
  • The invention relates to a semiconductor structure and a method for manufacturing the same are disclosed and more specifically to a semiconductor structure including a conductive plug and a method for manufacturing the same.
  • 2. Description of the Related Art
  • Semiconductor structures include memory devices, used in storage elements for many products such as MP3 players, digital cameras, computer files, etc. As the application increases, the demand for the memory device focuses on small size and large memory capacity. For satisfying the requirement, a memory having a high element density is need.
  • Designers have developed a method for improving a memory device density, using 3D stack memory device so as to increase a memory capacity and a cost per cell. However, complex structures of a memory device make manufacturing processes complicated.
    • SUMMARY
  • According to one embodiment, a method for manufacturing a semiconductor structure is disclosed. The method comprises following steps. A first conductive structure is formed on a substrate. A second conductive structure is formed on the substrate and has a material different from a material of an upper conductive portion of the first conductive structure. A lower dielectric portion of a dielectric structure is formed on the first conductive structure and the second conductive structure. A dielectric layer is formed on the lower dielectric portion. An upper dielectric portion of the dielectric structure is formed on the dielectric layer having a material different from materials of the upper dielectric portion and the lower dielectric portion. A first conductive plug is formed to pass through only the upper dielectric portion, the dielectric layer and the lower dielectric portion to physically and electrically contact with the first conductive structure. A second conductive plug is formed to pass through the upper dielectric portion, the dielectric layer and the lower dielectric portion to physically and electrically contact with the second conductive structure.
  • According to another embodiment, a semiconductor structure is disclosed, comprising a substrate, a first conductive structure, a second conductive structure, a dielectric structure, a dielectric layer, a first conductive plug, and a second conductive plug. The first conductive structure is on the substrate. The second conductive structure is on the substrate and has a material different from an upper conductive portion of the first conductive structure. The dielectric structure comprises an upper dielectric portion and a lower dielectric portion. The dielectric layer is between the upper dielectric portion and the lower dielectric portion, and has a material different from materials of the upper dielectric portion and the lower dielectric portion. The first conductive plug passes through only the upper dielectric portion, the dielectric layer and the lower dielectric portion to physically and electrically contact with the first conductive structure. The second conductive plug passes through the upper dielectric portion, the dielectric layer and the lower dielectric portion to physically and electrically contact with the second conductive structure.
    • BRIEF DESCRIPTION OF THE DRAWINGS
  • FIG. 1A to FIG. 1H illustrate a method for manufacturing a semiconductor structure according to an embodiment.
  • FIG. 2 illustrates a semiconductor structure according to a comparative example.
    •  DETAILED DESCRIPTION
  • FIG. 1A to FIG. 1H illustrate a method for manufacturing a semiconductor structure according to an embodiment.
  • Referring to FIG. 1A, a substrate 102 is provided. The substrate 102 may comprise a silicon substrate, such as polysilicon, or other suitable semiconductor substrates. A first conductive structure 104 is formed on the substrate 102 in a first circuit region 106. A lower dielectric portion 108 is formed on the first conductive structure 104. In one embodiment, the first conductive structure 104 comprises conductive stair of different levels, separated form each other by the lower dielectric portion 108. In one embodiment, the conductive stairs of the first conductive structure 104 comprise (un-metalized) polysilicon material.
  • A silicon-containing structure 110 is formed on the substrate 102 in a second circuit region 112. In one embodiment, the silicon-containing structure 110 comprises polysilicon. The silicon-containing structure 110 may be formed over the conductive strips 114 and dielectric strips 116 stacked alternately of a 3D stacked memory, and separated from the conductive strips 114 and the dielectric strips 116 by an insulating material 118. In one embodiment, the conductive stairs of the first conductive structure 104 and the conductive strips 114 of the second circuit region 112 may be arranged in the same level, and the silicon-containing structure 110 may be disposed higher than the first conductive structure 104.
  • A first etching stop layer 120 is formed to cover the lower dielectric portion 108 in the first circuit region 106 and the insulating material 118 on the silicon-containing structure 110 in the second circuit region 112. A dielectric material is formed on the first etching stop layer 120 to form an upper dielectric portion 122 in the first circuit region 106. In one embodiment, for example, the dielectric material is planarized by a CMP process stopping on the first etching stop layer 120.
  • Referring to FIG. 1B, portions of the upper dielectric portion 122 (FIG. 1A), the first etching stop layer 120 (FIG. 1A) and the insulating material 118 may be removed by an etching step, to expose an upper portion of the silicon-containing structure 110, and remain the first etching stop layer 120 in the first circuit region 106 to form a dielectric layer 124 under the upper dielectric portion 122A.
  • Referring to FIG. 1C, the exposed upper portion of the silicon-containing structure 110 (FIG. 1B) is metalized so as to form an upper conductive portion 126 comprising a metal silicide. Therefore, a formed second conductive structure 128 comprises the upper conductive portion 126 and a lower conductive portion 130, wherein the lower conductive portion 130 maintains comprising the (un-metalized) polysilicon material as the silicon-containing structure 110. The second conductive structure 128 is not limited to be a gate structure of a MOS, and can be a source or a drain of the MOS, or other contact structures.
  • Referring to FIG. 1D, a dielectric material is formed in the first circuit region 106 and the second circuit region 112, to form a lower dielectric portion 132 covering the second conductive structure 128, and form the upper dielectric portion 122B. A second etching stop layer 134 is formed to cover the upper dielectric portion 122B in the first circuit region 106 and the lower dielectric portion 132 in the second circuit region 112.
  • Referring to FIG. 1E, a patterned mask 136 is formed on the second etching stop layer 134 (FIG. 1D) in the second circuit region 112. An un-covered portion of the second etching stop layer 134 in the first circuit region 106 is removed by an etching process. The remained portion of the second etching stop layer 134 by the etching process forms a dielectric layer 138. The patterned mask 136 is removed to form the structure as shown in FIG. 1F.
  • Referring to FIG. 1G, a dielectric material is formed on the upper dielectric portion 1226 (FIG. 1F) in the first circuit region 106 and the dielectric layer 138 in the second circuit region 112, to form the upper dielectric portion 122C in the first circuit region 106, and an upper dielectric portion 140 in the second circuit region 112. The dielectric layer 124 has a material different from materials of the upper dielectric portion 122C and the lower dielectric portion 108 of a dielectric structure 142. The dielectric layer 138 has a material different from materials of the upper dielectric portion 140 and the lower dielectric portion 132 of a dielectric structure 144. In one embodiment, for example, the upper dielectric portions 122C, 140 and the lower dielectric portions 108, 132 comprise an oxide such as silicon oxide. The dielectric layers 124, 138 comprise a nitride such as silicon nitride.
  • Referring to FIG. 1H, a first conductive plug 146 is formed to pass through only the upper dielectric portion 122C, the dielectric layer 124 and the lower dielectric portion 108, to physically and electrically contact with the first conductive structure 104. A second conductive plug 148 is formed to pass through only the upper dielectric portion 140, the dielectric layer 138 and the lower dielectric portion 132, to physically and electrically contact with the upper conductive portion 126 of the second conductive structure 128. In one embodiment, for example, the first conductive plug 146 has an aspect ratio or a height larger than an aspect ratio or a height of the second conductive plug 148. The first conductive plug 146 may have a high aspect ratio.
  • The first conductive plug 146 and the second conductive plug 148 may be formed by a method comprising forming through holes 150, 152 by etching processes and filling the through holes 150, 152 by a conductive material.
  • For example, through holes stopping on the dielectric layers 124, 138 may be formed by a first etching step using the same mask (not shown) to etch down from upper surfaces of the upper dielectric portion 122C and the upper dielectric portion 140 at the same time. Compared to the dielectric layers 124, 138, the first etching step has a higher etching selectivity to the upper dielectric portions 122C, 140, that is, the first etching step etches the upper dielectric portions 122C, 140 faster than the dielectric layers 124, 138, or etches none of the dielectric layers 124, 138 substantially (the similar concepts will not described hereafter). Therefore, in spite of the bigger thickness of the upper dielectric portion 122C than the upper dielectric portion 140, the first etching step and the through holes formed by the first etching step can stop on the dielectric layer 124 and the dielectric layer 138 in desire, and have desirable different aspect ratios or height.
  • Then, in one embodiment, the dielectric layers 124, 138 exposed by the through holes may be removed by a second etching step different from the first etching step to extend the through hole down to form through holes exposing the lower dielectric portions 108, 132. For example, compared to the upper dielectric portions 122C, 140 and the lower dielectric portions 108, 132, the second etching step may have a higher etching selectivity to the dielectric layers 124, 138. Therefore, the second etching step and the through holes formed by the second etching step can be controlled to stop on the lower dielectric portions 108, 132 in desire.
  • Next, in one embodiment, the lower dielectric portions 108, 132 exposed by the through holes may be removed by a third etching step different from the second etching step, to extend the through holes down to form a through hole 150 and a through hole 152 exposing the first conductive structure 104 and the second conductive structure 128 respectively. Compared to the dielectric layers 124, 138, the first conductive structure 104 and the second conductive structure 128, the third etching step has a higher etching selectivity to the lower dielectric portions 108, 132. Therefore, the third etching step and the through holes 150, 152 formed by the third etching step can be controlled to stop on the first conductive structure 104 and the second conductive structure 128 with desire.
  • For example, as the upper dielectric portions 122C, 140 have the same material with the lower dielectric portions 108, 132, the first etching step for removing the upper dielectric portions 122C, 140 and the third etching step for the lower dielectric portions 108, 132 may use the same etching conditions such as the same etching solution, etc.
  • In other embodiments, since the dielectric layer 124 and the lower dielectric portion 108 have thickness similar or substantially equal to thickness of the dielectric layer 138 and the lower dielectric portion 132, the second etching step for removing the dielectric layers 124, 138 may be continued after removing the dielectric layers 124, 138 to continuously remove the lower dielectric portions 108, 132. The second etching step can be controlled to stop on the first conductive structure 104 and the second conductive structure 128 by controlling an etching time or depending on etching selectivity to materials to be etched.
  • The semiconductor structure and the method for manufacturing for which may be varied according to the above concepts. Some examples are illustrated as following. For example, the upper dielectric portions 122C, 140 and the lower dielectric portions 108, 132 are not limited to an oxide, and the dielectric layers 124, 138 are not limited to a nitride. In other embodiments, materials for the upper dielectric portions 122C, 140, the lower dielectric portions 108, 132 and the dielectric layers 124, 138 may be suitably selected according to parameters of etching processes and etching selectivity characteristics to the materials. In some embodiments, the second conductive structure 128 and the first conductive structure 104 may be arranged in a similar or the same level by omitting the conductive strips 114 or reducing a number of the conductive strips 114 to be less than a number of the conductive stairs of the first conductive structure 104. In other embodiments, the first conductive plug 146 may be longer than or as long as the second conductive plug 148. The concepts of the embodiments can be applied to device of other kinds, needed to form conductive plugs electrically and physically contact with conductive structures of different structure characteristic and/or different levels (heights), respectively.
  • FIG. 2 illustrates a semiconductor structure according to a comparative example. Differences between the semiconductor structures of the comparative example and the embodiment are illustrated as following. In the comparative example, the first conductive plug 246 in sequence passes through an upper dielectric portion 222C, a dielectric layer 238, a middle dielectric portion 254, a dielectric layer 224, and a lower dielectric portion 208 to physically and electrically contact with the first conductive structure 104. For example, the upper dielectric portion 222C, the middle dielectric portion 254 and the lower dielectric portion 208 of a dielectric structure 242 comprises an oxide such as silicon oxide, and the dielectric layers 224, 238 comprise a nitride such as silicon. Compared to the semiconductor structure of the comparative example which need two necessary masks (one is for removing the upper dielectric portion 222C and the dielectric layer 238, and the other is for removing the middle dielectric portion 254, the dielectric layer 224 and the lower dielectric portion 208), the semiconductor structure of the embodiment as shown in FIG. 1A to FIG. 1H uses only one mask to etch out the through holes 150, 152 for forming the first conductive plug 146 and the second conductive plug 148, and need less etching processes and shorter manufacturing time. In addition, the mask for the embodiment can have a feature size lager (such as non-critical) than a feature size of the mask for the comparative example. Therefore, the semiconductor structure according to embodiments has low cost and high WPH.
  • While the invention has been described by way of example and in terms of the exemplary embodiment(s), it is to be understood that the invention is not limited thereto. On the contrary, it is intended to cover various modifications and similar arrangements and procedures, and the scope of the appended claims therefore should be accorded the broadest interpretation so as to encompass all such modifications and similar arrangements and procedures.

Claims (20)

1. A method for manufacturing a semiconductor structure, comprising:
forming a first conductive structure on a substrate;
forming a second conductive structure on the substrate, the second conductive structure comprising an upper conductive portion, wherein the upper conductive portion has a material different from a material of the first conductive structure;
forming a lower dielectric portion of a dielectric structure on the first conductive structure and the second conductive structure;
forming a dielectric layer on the lower dielectric portion;
forming an upper dielectric portion of the dielectric structure on the dielectric layer, wherein the dielectric layer has a material different from materials of the upper dielectric portion and the lower dielectric portion;
forming a first conductive plug passing through only the upper dielectric portion, the dielectric layer and the lower dielectric portion to physically and electrically contact with the first conductive structure; and
forming a second conductive plug passing through the upper dielectric portion, the dielectric layer and the lower dielectric portion to physically and electrically contact with the second conductive structure;
wherein the first conductive plug and the second conductive plug have different aspect ratios.
2. The method for manufacturing the semiconductor structure according to claim 1, wherein the second conductive plug passes through only the upper dielectric portion, the dielectric layer and the lower dielectric portion to physically and electrically contact with the second conductive structure.
3. The method for manufacturing the semiconductor structure according to claim 1, comprising:
forming a silicon-containing structure;
forming a first etching stop layer covering the lower dielectric portion in a first circuit region and the silicon-containing structure in a second circuit region;
removing the first etching stop layer in the second circuit region to expose the silicon-containing structure and remain the first etching stop layer in the first circuit region to form the dielectric layer; and
metalizing an exposed portion of the silicon-containing structure to form the upper conductive portion.
4. The method for manufacturing the semiconductor structure according to claim 1, comprising:
forming a second etching stop layer covering the upper dielectric portion; and
removing the second etching stop layer in a first circuit region and remain the second etching stop layer in a second circuit region to form the dielectric layer.
5. The method for manufacturing the semiconductor structure according to claim 1, wherein the first conductive plug and the second conductive plug are formed by a method comprising:
removing a portion of the upper dielectric portion to form through holes by a first etching step stopping on the dielectric layer;
removing the dielectric layer exposed by the through holes to extend the through holes down to expose the lower dielectric portion by a second etching step different from the first etching step and stopping on the lower dielectric portion;
removing the lower dielectric portion exposed by the through holes to extend the through holes down to respectively expose the first conductive structure and the second conductive structure by a third etching step different from the second etching step; and
filling the through holes by a conductive material to form the first conductive plug and the second conductive plug.
6. The method for manufacturing the semiconductor structure according to claim 5, wherein,
the first etching step etches the upper dielectric portion faster than the dielectric layer,
the second etching step etches the dielectric layer faster than the upper dielectric portion and the lower dielectric portion,
the third etching step etches the lower dielectric portion faster than the dielectric layer.
7. The method for manufacturing the semiconductor structure according to claim 5, the through holes formed by the first etching step have different aspect ratios.
8. The method for manufacturing the semiconductor structure according to claim 5, wherein the through holes for the first conductive plug and the second conductive plug are defined by the same mask.
9. The method for manufacturing the semiconductor structure according to claim 1, wherein the first conductive plug and the second conductive plug are formed by a method comprising:
removing a portion of the upper dielectric portion to form through holes by a first etching step stopping on the dielectric layer;
removing the dielectric layer exposed by the through holes to extend the through holes down to expose the first conductive structure and the second conductive structure by a second etching step different from the first etching step and stopping on the first conductive structure and the second conductive structure; and
filling the through holes by a conductive material to form the first conductive plug and the second conductive plug.
10. A semiconductor structure, comprising:
a substrate;
a first conductive structure on the substrate;
a second conductive structure on the substrate, the second conductive structure comprising an upper conductive portion, wherein the upper conductive portion has a material different from the first conductive structure;
a dielectric structure comprising an upper dielectric portion and a lower dielectric portion;
a dielectric layer between the upper dielectric portion and the lower dielectric portion, and having a material different from materials of the upper dielectric portion and the lower dielectric portion;
a first conductive plug passing through only the upper dielectric portion, the dielectric layer and the lower dielectric portion to physically and electrically contact with the first conductive structure; and
a second conductive plug passing through the upper dielectric portion, the dielectric layer and the lower dielectric portion to physically and electrically contact with the second conductive structure;
wherein the first conductive plug and the second conductive plug have different aspect ratios.
11. (canceled)
12. The semiconductor structure according to claim 10, wherein an aspect ratio of the first conductive plug is larger than an aspect ratio of the second conductive plug.
13. The semiconductor structure according to claim 10, comprising a first circuit region and a second circuit region, wherein the first circuit region and the second circuit region are non-overlapping, the first conductive structure and the first conductive plug are disposed in the first circuit region, the second conductive structure and the second conductive plug are disposed in the second circuit region.
14. The semiconductor structure according to claim 13, wherein the upper dielectric portion in the first circuit region is thicker than the upper dielectric portion in the second circuit region.
15. The semiconductor structure according to claim 13, comprising a plurality the first conductive plug, wherein the first conductive structure comprises conductive stairs of different levels, the first conductive plugs separated from each other physically and electrically contact the conductive stairs.
16. The semiconductor structure according to claim 10, wherein the first conductive structure comprises polysilicon, the upper conductive portion of the second conductive structure comprises a metal silicide.
17. The semiconductor structure according to claim 10, wherein the second conductive structure comprises a lower conductive portion under the upper conductive portion and physically connecting with the upper conductive portion comprising a metal silicide, the lower conductive portion comprises polysilicon.
18. The semiconductor structure according to claim 10, wherein the upper dielectric portion and the lower dielectric portion of the dielectric structure comprise an oxide, the dielectric layer comprises a nitride.
19. The semiconductor structure according to claim 10, wherein the second conductive plug passing through only the upper dielectric portion, the dielectric layer and the lower dielectric portion.
20. The semiconductor structure according to claim 10, wherein the first conductive plug and the second conductive plug have different lengths.
US14/215,149 2014-03-17 2014-03-17 Semiconductor structure and method for manufacturing the same Active US9142454B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US14/215,149 US9142454B1 (en) 2014-03-17 2014-03-17 Semiconductor structure and method for manufacturing the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US14/215,149 US9142454B1 (en) 2014-03-17 2014-03-17 Semiconductor structure and method for manufacturing the same

Publications (2)

Publication Number Publication Date
US20150262871A1 true US20150262871A1 (en) 2015-09-17
US9142454B1 US9142454B1 (en) 2015-09-22

Family

ID=54069661

Family Applications (1)

Application Number Title Priority Date Filing Date
US14/215,149 Active US9142454B1 (en) 2014-03-17 2014-03-17 Semiconductor structure and method for manufacturing the same

Country Status (1)

Country Link
US (1) US9142454B1 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20170294384A1 (en) * 2016-04-12 2017-10-12 Macronix International Co., Ltd. Semiconductor structure having etching stop layer and manufacturing method of the same
CN107293532A (en) * 2016-04-11 2017-10-24 旺宏电子股份有限公司 Semiconductor structure and its manufacture method
US20190067310A1 (en) * 2017-08-28 2019-02-28 Toshiba Memory Corporation Method for manufacturing semiconductor device and semiconductor device
US10438801B2 (en) * 2017-09-22 2019-10-08 Toshiba Memory Corporation Semiconductor memory device

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070117372A1 (en) * 2005-11-18 2007-05-24 Yu-Hao Hsu Fabricating method of an interconnect structure
US20120199970A1 (en) * 2011-02-08 2012-08-09 Ki-Young Yun Semiconductor device and method of manufacturing a semiconductor device
US20130196506A1 (en) * 2012-02-01 2013-08-01 Infineon Technologies Ag Apparatuses and Methods for Gas Mixed Liquid Polishing, Etching, and Cleaning

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070117372A1 (en) * 2005-11-18 2007-05-24 Yu-Hao Hsu Fabricating method of an interconnect structure
US20120199970A1 (en) * 2011-02-08 2012-08-09 Ki-Young Yun Semiconductor device and method of manufacturing a semiconductor device
US20130196506A1 (en) * 2012-02-01 2013-08-01 Infineon Technologies Ag Apparatuses and Methods for Gas Mixed Liquid Polishing, Etching, and Cleaning

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107293532A (en) * 2016-04-11 2017-10-24 旺宏电子股份有限公司 Semiconductor structure and its manufacture method
US20170294384A1 (en) * 2016-04-12 2017-10-12 Macronix International Co., Ltd. Semiconductor structure having etching stop layer and manufacturing method of the same
US10026692B2 (en) * 2016-04-12 2018-07-17 Macronix International Co., Ltd. Semiconductor structure having etching stop layer and manufacturing method of the same
US20190067310A1 (en) * 2017-08-28 2019-02-28 Toshiba Memory Corporation Method for manufacturing semiconductor device and semiconductor device
US10546867B2 (en) * 2017-08-28 2020-01-28 Toshiba Memory Corporation Method for manufacturing semiconductor device and semiconductor device
US10438801B2 (en) * 2017-09-22 2019-10-08 Toshiba Memory Corporation Semiconductor memory device

Also Published As

Publication number Publication date
US9142454B1 (en) 2015-09-22

Similar Documents

Publication Publication Date Title
US10535530B2 (en) Patterning method
KR20200135869A (en) Step formation in 3D memory devices
US10439048B2 (en) Photomask layout, methods of forming fine patterns and method of manufacturing semiconductor devices
US20190304909A1 (en) Semiconductor memory device
US10312090B2 (en) Patterning method
JP2023029357A (en) Formation of staircase structure in three-dimensional memory device
US8592978B2 (en) Method of fabricating semiconductor device and the semiconductor device
US20160284722A1 (en) Memory device and manufacturing method of the same
US9142454B1 (en) Semiconductor structure and method for manufacturing the same
US9184096B2 (en) Semiconductor structure and manufacturing method for the same
US9455155B2 (en) Semiconductor structure and manufacturing method for the same
US9620364B2 (en) Methods of manufacturing semiconductor device
CN108695239B (en) Semiconductor structure with contact plug and manufacturing method thereof
TWI515825B (en) Semiconductor structure and manufacturing method for the same
US10504914B2 (en) Integrated circuit structure and manufacturing method thereof
TWI682547B (en) Semiconductor structure and manufacturing method thereof
US8946045B2 (en) Metal-insulator-metal (MIM) capacitor with deep trench (DT) structure and method in a silicon-on-insulator (SOI)
US9343477B2 (en) Semiconductor device and method for fabricating the same
TWI580086B (en) Memory device and manufacturing method of the same
TWI527196B (en) semiconductor structure and method for manufacturing the same
TW201624622A (en) Non-volatile memory cell, NAND-type non-volatile memory and method of manufacturing thereof
US9461062B1 (en) Semiconductor device and manufacturing method thereof
CN105280590B (en) Semiconductor structure and its manufacturing method
US10770565B2 (en) Memory structure and manufacturing method thereof
US9349813B2 (en) Method for fabricating semiconductor device

Legal Events

Date Code Title Description
AS Assignment

Owner name: MACRONIX INTERNATIONAL CO., LTD., TAIWAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:LEE, GUAN-RU;JIANG, YU-WEI;REEL/FRAME:032451/0083

Effective date: 20140310

STCF Information on status: patent grant

Free format text: PATENTED CASE

MAFP Maintenance fee payment

Free format text: PAYMENT OF MAINTENANCE FEE, 4TH YEAR, LARGE ENTITY (ORIGINAL EVENT CODE: M1551); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY

Year of fee payment: 4

MAFP Maintenance fee payment

Free format text: PAYMENT OF MAINTENANCE FEE, 8TH YEAR, LARGE ENTITY (ORIGINAL EVENT CODE: M1552); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY

Year of fee payment: 8