US20150259099A1 - System and method for constructing 3d objects - Google Patents

System and method for constructing 3d objects Download PDF

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Publication number
US20150259099A1
US20150259099A1 US14/656,576 US201514656576A US2015259099A1 US 20150259099 A1 US20150259099 A1 US 20150259099A1 US 201514656576 A US201514656576 A US 201514656576A US 2015259099 A1 US2015259099 A1 US 2015259099A1
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voxel
cartridge
assembly
voxels
arrangement
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Abandoned
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US14/656,576
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English (en)
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Edo Segal
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Individual
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Individual
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Priority to US14/656,576 priority Critical patent/US20150259099A1/en
Priority to US14/657,726 priority patent/US9937697B2/en
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Abandoned legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B41/00—Arrangements for controlling or monitoring lamination processes; Safety arrangements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
    • B23P19/00—Machines for simply fitting together or separating metal parts or objects, or metal and non-metal parts, whether or not involving some deformation; Tools or devices therefor so far as not provided for in other classes
    • B23P19/04—Machines for simply fitting together or separating metal parts or objects, or metal and non-metal parts, whether or not involving some deformation; Tools or devices therefor so far as not provided for in other classes for assembling or disassembling parts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Programme-controlled manipulators
    • B25J9/16—Programme controls
    • B25J9/1679—Programme controls characterised by the tasks executed
    • B25J9/1687—Assembly, peg and hole, palletising, straight line, weaving pattern movement
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/56—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using mechanical means or mechanical connections, e.g. form-fits
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/0046—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by constructional aspects of the apparatus
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • B32B37/1207—Heat-activated adhesive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/16—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating
    • B32B37/18—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating involving the assembly of discrete sheets or panels only
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/0008—Electrical discharge treatment, e.g. corona, plasma treatment; wave energy or particle radiation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/18—Handling of layers or the laminate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B39/00—Layout of apparatus or plants, e.g. modular laminating systems
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D25/00—Details of other kinds or types of rigid or semi-rigid containers
    • B65D25/38—Devices for discharging contents
    • B65D25/52—Devices for discharging successive articles or portions of contents
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F30/00—Computer-aided design [CAD]
    • G06F30/10—Geometric CAD
    • G06F30/13—Architectural design, e.g. computer-aided architectural design [CAAD] related to design of buildings, bridges, landscapes, production plants or roads
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F30/00—Computer-aided design [CAD]
    • G06F30/10—Geometric CAD
    • G06F30/17—Mechanical parametric or variational design
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
    • B29C65/4805—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the type of adhesives
    • B29C65/483—Reactive adhesives, e.g. chemically curing adhesives
    • B29C65/4835—Heat curing adhesives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
    • B29C65/4805—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the type of adhesives
    • B29C65/483—Reactive adhesives, e.g. chemically curing adhesives
    • B29C65/485—Multi-component adhesives, i.e. chemically curing as a result of the mixing of said multi-components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/56—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using mechanical means or mechanical connections, e.g. form-fits
    • B29C65/58—Snap connection
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/18—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form
    • G05B19/4097—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form characterised by using design data to control NC machines, e.g. CAD/CAM
    • G05B19/4099—Surface or curve machining, making 3D objects, e.g. desktop manufacturing
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/31—From computer integrated manufacturing till monitoring
    • G05B2219/31044—Assembly of modular products, variant configurability
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/40—Robotics, robotics mapping to robotics vision
    • G05B2219/40033—Assembly, microassembly
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]

Definitions

  • the present invention is directed to an apparatus and method for constructing or 3D printing objects using standardized assembly units according to a specific instruction set.
  • the present invention describes an apparatus configured to assemble or construct an object from a supply of multi-colored assembly units according to an electronic instruction set included along with the supply of standard assembly units.
  • the invention is directed to constructing an object, such as a toy, from standard assembly units that are permanently bonded or affixed to one another. This permanent bonding characteristic is accomplished by mechanical or chemical adhesion mechanisms.
  • additive and subtractive manufacturing technologies enable computer designs, such as CAD files, to be made into three dimensional (3D) objects.
  • 3D printing also known as additive manufacturing, typically comprises depositing, curing, fusing, or otherwise forming a material into sequential cross-sectional layers of the 3D object.
  • fused deposition modeling techniques which are generally disclosed in U.S. Pat. No. 4,749,347 and U.S. Pat. No. 5,121,329, herein incorporated by reference, describe melting a filament of material and extruding the material out of a dispenser that is moved in the x, y and z-axes relative to a print pad.
  • the material is generally deposited in layers in the x and y axes to form cross-sectional layers that are stacked along the z-axis to form the 3D object.
  • the prior art uses powders, resins and other substances to additively assemble structures.
  • construction devices and methods describe solve the problem of constructing structurally sound objects from standardized assembly units, especially standardized assembly units of uniform size.
  • the present invention concerns an apparatus and method for assembling objects using standardized assembly units, or voxels.
  • a “voxel” is a three dimensional assembly unit which operates as a 3-dimensional extension of a 2D pixel, i.e., a volume pixel.
  • an object construction device is configured to enclose a specified assembly area and assemble objects, such as toys, within this assembly area.
  • the construction device includes a processor with a memory device configured to access an instruction set encoding the assembly instructions of the object.
  • the processor executes the instruction set in order to control and direct a voxel manipulator to additively construct or assemble the object from voxel construction units.
  • the voxel manipulator is further configured to alter the orientation of at least one voxel prior to positioning the voxel in the assembly area.
  • the voxels are stored prior to use in a storage device configured to supply voxels to the voxel manipulator.
  • the voxels are arranged in the voxel storage device according to the order of use in the assembly process.
  • FIG. 1 is a cutaway view of an embodiment of the arrangement of the present invention depicting the object assembly apparatus.
  • FIGS. 2A-D are side views of differing embodiments of one arrangement of the present invention.
  • FIG. 3 is a side view of the construction units' backing strip according to one arrangement of the present invention.
  • FIG. 4 is a side cutaway view of the further elements in one arrangement of the present invention.
  • FIG. 5 is a diagram of the operation of a voxel manipulator according to one arrangement of the present invention.
  • FIG. 6 is a diagram of a further operation of a voxel manipulator according to one arrangement of the present invention.
  • FIG. 7 is a top-down view of a further particular arrangement of the present invention.
  • FIG. 8 is an illustrated diagram of the elements of the system of an embodiment of the present invention.
  • the present apparatus and method describe constructing objects out of a plurality of standardized construction units, herein “voxels”, using an object constructor.
  • the apparatus is configured to assemble a three-dimensional object out of standardized construction units placed in overlapping and interlocking layers and having particular surface features and characteristics.
  • the object constructor constructs a three-dimensional article, such as a toy, having a variety of color features.
  • the end user avoids the necessity of painting the finished assembled object.
  • the use of different colors allows for the integration of text and graphics onto the surface of the object at the time of assembly.
  • the object constructor 100 includes an object assembly area 102 , a voxel manipulator 104 , and a plurality of voxel storage containers 106 .
  • the object constructor 100 also includes a processor or computer 110 configured to instruct the voxel manipulator 104 where to position a voxel 112 within the object assembly area based on an instruction set.
  • the instruction set is a computer file, such as a CAD computer file.
  • the object construction device also includes a power supply 127 .
  • the power supply is battery supply.
  • the power supply is an AC/DC converter device to transform AC outlet power to DC power.
  • the assembly area 102 defines an enclosed space that includes an assembly stage 114 .
  • the assembly stage 114 is configured to be raised or lowered in order to meet the voxel manipulator 104 .
  • the voxel manipulator 104 works in conjunction with the assembly stage 114 in order to move and position voxels 112 within the assembly area.
  • the movement of the assembly stage 114 is controlled by instructions or signals sent from the processor 110 , such as may be used to energize a motor or solenoid that has moveable parts physically coupled to the assembly stage.
  • the object constructor 100 constructs the intended object 120 using a plurality of voxel construction units 112 .
  • a voxel 112 is a three dimensional interlocking assembly unit, and as such, has at least one surface feature for mechanically attaching to a complimentary surface feature on at least one other voxel.
  • the voxels are each provided with attachment features that allow the voxels to be permanently secured with vertically and horizontally aligned neighboring voxels. More particularly, the voxels allow for multi-voxel width and height objects to be constructed free of the need to use an overlapping, or brick-work like stacking strategy.
  • the voxel 112 is substantially square in two dimensions, and can be substantially cubic in all three dimensions.
  • the voxels 112 have different polyhedron configurations such as tetrahedral, hexahedral or other known and understood three-dimensional shapes.
  • the voxel 112 is spherical or ovoid in shape.
  • the object constructor 100 also includes an optional adhesive or binding activator 121 .
  • the adhesive activator is configured to activate an adhesive coated on the surface of the voxels.
  • the adhesive activator is a device configured to transmit electromagnetic energy to the voxel in the form of infrared light.
  • the adhesive activator is used to deposit a water vapor onto a voxel coated with a water activated adhesive.
  • the voxels have millimeter scale dimensions.
  • the voxels are used to construct small scale items and objects.
  • the overall dimensions of the voxels 112 are sufficiently small to allow efficient 3D manufacturing techniques
  • the voxels have diameters of at least 1 centimeter in size along one side or dimension of the voxel 112 .
  • the invention described uses voxels having dimensions that allow for individual manipulation.
  • the voxels 112 used in assembling the object 120 are selected from a number of different shapes and sizes.
  • the voxels 112 are stored in a voxel storage device 106 .
  • the voxel storage device 106 is a cartridge 504 .
  • two voxel storage devices are provided.
  • any number of voxel cartridges can be used in suitable arrangement with the device and methods described.
  • the voxel storage 106 is composed of a cartridge containing an unordered collection of voxels 112 .
  • voxels 112 in a given cartridge have identical characteristics, such as identical shape and color.
  • the voxel cartridge is composed of a plurality of receptacles 502 , each receptacle holding voxels of different characteristics.
  • one storage receptacle 502 is equipped with a collection of voxels each having a particular color, dimension or combination of features.
  • the number of voxels in each sub-arrangement or collection is not tied to the specific construction instructions for a given item or object.
  • the cartridge 504 contains a pre-determined number of voxels that exit from the cartridge in a pre-determined sequence (A, B, C, D, E . . . ).
  • This sequence is related to the instruction steps necessary to construct the object 120 .
  • the voxels 112 stored in the cartridge 504 are arranged such that the first voxel accessible to the voxel feed represents the first voxel necessary to assemble a particular object 120 .
  • an array of sub-sequences 506 is provided. Each subsequence contains a specific sub sequence that corresponds to a portion of the overall object assembly sequence.
  • cartridge types can be used as a standalone cartridge or in various combinations with other cartridge types.
  • the object constructor is equipped with a plurality of cartridges, each cartridge holding a plurality of receptacles containing voxels having different characteristics.
  • the cartridges are equipped with an exit port or door 508 configured to allow the voxels to leave the cartridge or receptacle.
  • the door 508 is activated by commonly used mechanisms, such as springs, levers, louvers, dilators, and the like.
  • the voxels are configured to exit the cartridge for use in the construction process.
  • each cartridge is equipped with a mechanical door or port configured to allow passage of one voxel at a time from the cartridge to the voxel manipulator.
  • the door 508 is spring operated and configured to work with the force of gravity to remove voxels from the bottom of the cartridge.
  • the cartridge and/or sub cartridges are equipped with spring-loaded pushing mechanisms configured to push voxels out of the cartridge according to an electrical or mechanical input.
  • the cartridge is equipped with a sliding element, that when retracted, allows the removal of a voxel.
  • the object constructor is equipped with sufficient extraction devices to obtain a voxel from the cartridge and orient the voxel into proper placement position.
  • FIG. 2D An alternative arrangement of the voxel cartridge is provided in FIG. 2D , a portion of which is shown in detail in FIG. 3 .
  • the voxels are secured on a strip 512 wound upon a spool 510 in a cartridge 504 .
  • the strip of voxels 512 is advanced so as to present voxels 112 to the voxel manipulator 104 .
  • a mechanism for advancing the voxels within the cartridge is contained within the cartridge and is controlled by the processor via electrical linkages.
  • the advancing mechanism is manually controlled and operable.
  • a second spool is provided as a take-up wheel to store an empty backing strip and provide tension to the strip 504 .
  • the voxels 112 are arranged on the bottom portion of the strip 512 . However, in an alternative configuration, the voxels are placed on a top surface of the strip.
  • One potential configuration of the backing strip is provided in FIG. 3 . As shown, the voxels 112 are attached to a backing or strip material 512 by securing the voxel to a strip retainer 514 .
  • the strip retainer 514 is configured to removably couple to one of the interlocking elements of the voxel 112 and secure the voxel to the strip.
  • the voxels are pushed out of or otherwise extracted from the cartridge.
  • the cartridge is equipped with an extraction device, such as a plunger or other mechanical device configured to push voxels out of the cartridge.
  • the voxel pushing device is controlled electronically.
  • the voxel pushing device is a mechanically operated device.
  • the described cartridges 504 are equipped with an additional data storage element, or a separate processor (not shown).
  • the data element 110 of the object constructor 100 is configured to receive the instruction set from the data storage element of the cartridge 504 .
  • a processor integral to the cartridge 504 is configured to communicate with the processor 110 in order to transmit the instruction set based on the data stored in the data storage element included with the cartridge 504 .
  • the stored data or instruction set included with the cartridge optionally includes a template for the construction of an object 102 using the pre-determined voxels 112 in the cartridge 504 .
  • the data stored in the data storage element of the cartridge 504 also includes authentication and use data.
  • the authentication data is used to confirm that the cartridge 504 is used in conjunction with a verified object constructor 100 .
  • the use data confirms an authorized amount of times that the instruction set can be used to assemble a given object 102 .
  • the use code configures the object constructor 100 to assemble a single object 120 based on the instruction set stored within the data storage device of the cartridge 504 . Alternatively, the use code grants unlimited access to the instruction set regardless of the amount of voxels present in the cartridge.
  • the voxels 112 are moved from the voxel storage 106 by way of the voxel manipulator 104 .
  • the cartridge includes a strip or portion of backing material.
  • the voxel manipulator is used to obtain the voxels from the voxel storage devices directly.
  • the voxel manipulator 104 is configured to access or receive a voxel 112 that has exited from a receptacle or cartridge 504 .
  • the voxel manipulator is configured to extract the voxel 112 from the cartridge directly and orient the voxel for placement and use in the construction process.
  • the voxel manipulator 104 is configured to alter the orientation of each voxel 112 that is received from the voxel feed, such that a desired surface of the voxel 112 is placed in a proper location.
  • the voxel manipulator 104 is configured to select a voxel using the voxel capture head 413 and move the voxel 112 by selecting a transporting it to the desired location within the X, Y coordinate space.
  • the voxel manipulator is configured to move in the X, Y and Z coordinate space to allow for the selection and transport of voxels.
  • the voxel capture head couples to an interlocking element of the voxel 112 and extracts the voxel 112 from the backing strip material 512 .
  • the voxel capture head 413 is provided with an end piece having a given shape.
  • the voxels in this arrangement are provided with an opening on the top portion having a complementary shape to the end piece, the voxel manipulator descends and inserts the end piece into the complementary opening and then rotates the end piece such that the end piece shape and the voxel opening are no longer complementary.
  • the voxel manipulator raises the voxel capture head and removes the voxel from the its backing strip.
  • the voxel manipulator 104 is configured to select a portion of the voxel 112 with voxel capture head 413 , and use the capture head to secure a voxel 112 for transport to the desired location.
  • the processor 110 is configured to instruct the voxel manipulator 104 to deliver the voxel to a given location within an X and Y and optionally Z axis coordinate space within the assembly area 102 .
  • FIG. 6 illustrates the placement of a voxel in the course of assembling the object 120 .
  • a voxel 112 is moved to a position that allows it to join or bind to another voxel that is already part of the object 120 under construction.
  • the entire voxel manipulator 104 assembly is configured to move vertically along the Z-axis within the assembly area to deliver a voxel 112 to a given location.
  • the voxel manipulator 104 is equipped with motors, gears, solenoids or other actuators to allow for vertical movement of the voxel capture head 413 , such that the voxel capture head 413 is positioned over the voxel and moved to retrieve a voxel 112 from a voxel storage container.
  • the voxel manipulator 104 is configured to move along rails 603 aligned along the perimeter of the assembly area 102 using a motor or arrangement of motors. In this configuration the voxels are deposited in the assembly area in a layer-by-layer manner in order to assemble the particular three-dimensional object.
  • the voxel manipulator 104 is configured to move within the x-y space of the assembly area in movement increments corresponding to the dimensions of a single voxel.
  • the voxel manipulator 104 is equipped with a drive system.
  • the drive system is configured to deliver energy to the motor in pulses, each pulse configured to only advance the motor, such that the voxel manipulator 104 has moved the width of a voxel 112 .
  • the voxel manipulator 104 is equipped with a gear arrangement that limits the movement of the voxel manipulator to voxel length movement increments.
  • the voxel manipulator 104 or processor 110 is configured with sensing and feedback mechanisms.
  • the voxel manipulator 104 includes a mechanical or electronic device (not shown) configured to count the number of movement steps intended by the processor instruction set and compare that information to the present location of the voxel manipulator 104 .
  • a two-dimensional gird is used to orient the present position of the voxel manipulator 104 . Any of the foregoing mechanisms are then used to correct the position of the voxel manipulator 104 such that a voxel is positioned correctly.
  • the voxel manipulator 104 is configured to change the orientation of the voxel 112 such that a particular surface is presented as an exterior surface of the object 120 .
  • the voxel manipulator 104 is configured to rotate along rotation axis R in order to alter the orientation of the voxel 112 .
  • the voxel manipulator 104 receives the voxels 112 from the voxel feed 108 at a voxel head (not shown).
  • the voxels 112 are held in place prior to positioning by the voxel head by friction, surface tension, magnetic fields or compressive pressure.
  • subsequent voxels 112 are obtained from voxel storage 106 and are placed according to the instruction set.
  • subsequent voxels 112 can be obtained from voxel storage 106 while another voxel is being placed relative to the assembly stage 114 .
  • a computer or processor 110 is utilized to execute instructions detailing the acquisition of voxels according to a pre-set or user defined plan or schematic.
  • the processor is configured to access pre-set instructions stored in an onboard memory.
  • the processor is a chipset of microchips that include separate and multiple analog and digital processors. As shown in FIG. 10 , the processor can provide coordination of the other components of a general computing device, such as control of user interfaces, applications run by the computing device 1350 , and data communication by the computing device.
  • the object constructor device of the present invention is configured to communicate with a general purpose computer equipped with software to control the functions of the object construction.
  • the object constructor is connected to a general purpose computer by a physical linkage, such as, but not limited to, a USB cable.
  • the object constructor is equipped with wireless communication protocols features that permit the bi-directional or unidirectional exchange of data from the general computer to the object constructor.
  • the general computer device is a portable or handled computing device such as, but not limited to, an Apple IOS®, Windows® or Android® operating system based device.
  • the processor 110 is equipped with a memory element that stores information for use with the processor device.
  • the memory is a volatile memory unit or units.
  • the memory is a non-volatile memory unit or units.
  • the memory includes magnetic or optical disk(s) or solid state memory components.
  • the general computer is equipped with software for designing an object to be constructed and converting that design into instructions for use by the object constructor.
  • the general purpose computer is configured to access a software appliance located on a remote server configured to store and provide access to instructions sets that have been purchased and/or created.
  • the present invention also includes a method of using the object assembly device described to carry out and achieve the function of building an object using supplied voxels 112 according to an instruction set supplied to the processor.
  • the instruction step includes receiving an instruction set indicating the necessary steps required for assembling a specified object 120 from voxel 112 units.
  • the steps include an accessing step for accessing an instruction set from a cartridge in communicative contact with the object constructor.
  • the accessing step includes accessing an instruction set from a remote storage device or computer.
  • the method also includes a voxel acquisition step for instructing the voxel feed to transport voxels to the voxel manipulator for placement in the assembly area.
  • the voxel acquisition step includes selecting the appropriate voxel from a plurality of voxel reservoirs or cartridge sub-arrays.
  • the method described also includes an optional voxel reservoir selection step where voxels having a specific characteristic are selected from a specific voxel reservoir.
  • the method further includes a voxel placement step in which the voxel manipulator transports a voxel to a location according to the instructions provided in the instruction set.
  • the voxel placement step includes sending instructions to the assembly stage to rise vertically to a given height so as to provide the proper placement position for the voxel.
  • the voxel placement step includes moving the voxel manipulator along 3-axis so as to place the voxel at a given location on the assembly stage.
  • the voxel placement step also includes a sub-step of aligning the voxel with another already placed voxel through the use of the voxel alignment element.
  • an additional step includes the manipulation of the orientation of a selected voxel by the voxel manipulator such that the appropriate color surface is selected.
  • the voxel manipulation and voxel acquisition steps are repeated continuously until the object detailed in the instruction set is assembled.
  • the method also includes an optional adhesion step, in which the voxels are bonded or otherwise permanently joined to one another.
  • the adhesion step includes bringing the voxels into contact with one another and activating the surface adhesion coatings.
  • the adhesion step involves removing the assembled object from the object assembly area and exposing it to electromagnetic radiation, such as microwaves.
  • each of their processing functions can be operated as a series of programmed steps performed by a computer system having a processor or processors configured using one or more modules of computer-executable code.
  • a set of software modules can be configured to cooperate with one another to configure a processor so that when executed, they provide an instruction set to an object constructor in order to assemble the intended object.
  • the instruction module can be configured as a series of discrete sub-modules designed to access an object creation instruction set from a data storage location and configure the computer to instruct the voxel manipulator to as to the proper placement of the voxels within the assembly area.
  • a voxel selection module can be configured as a series of discrete sub-modules designed to access the object creation instruction set and correlate that data to the specific voxels available in the voxel storage receptacle.
  • the voxel selection module can be configured to determine which voxel reservoir to select the necessary voxels given the intended color and shape of the intended object.
  • a voxel manipulation module can be configured as a series of discrete sub-modules designed to compare the instruction set for the intended object to the current state of the object, and position the next voxel accordingly.
  • An adhesion module in which an adhesion device, accessible by the processor, is instructed to emit an adhesion substance, or energy that cures an adhesion substance for a specified period of time.
  • the instruction can energize an emitter that opens a valve to release a substance under pressure in the direction of the voxels to be adhered.
  • the instruction can commence an action that otherwise causes an adhesive, vapor, or energy to be directed toward specific or general voxels in a prescribed manner.
  • Each of these modules can comprise hardware, code executing in a processor, or both, that configures a machine, such as the computing system, to implement the functionality described herein.
  • the functionality of these modules can be combined or further separated, as understood by persons of ordinary skill in the art, in analogous implementations of arrangements of the invention.
  • the processor of the described apparatus is configurable for connection to remote storage devices and computing devices.
  • the processor of the described apparatus is configuration for communication with a mobile computing device, or connecting via the internet to a remote server.
  • the computing system is further illustrated in FIG. 8 , and includes a processor 1302 , a memory 1304 , a storage device 1306 , a high-speed interface 1308 connecting to the memory 1304 and multiple high-speed expansion ports 1310 , and a low-speed interface 1312 connecting to a low-speed expansion port 1314 and the storage device 1306 .
  • Each of the processor 1302 , the memory 1304 , the storage device 1306 , the high-speed interface 1308 , the high-speed expansion ports 1310 , and the low-speed interface 1312 are interconnected using various busses, and can be mounted on a common motherboard or in other manners as appropriate.
  • the processor 1302 can process instructions for execution within the computing device 1300 , including instructions stored in the memory 1304 or on the storage device 1306 to display graphical information for a GUI on an external input/output device, such as a display 1316 coupled to the high-speed interface 1308 .
  • an external input/output device such as a display 1316 coupled to the high-speed interface 1308 .
  • multiple processors and/or multiple buses can be used, as appropriate, along with multiple memories and types of memory.
  • multiple computing devices can be connected, with each device providing portions of the necessary operations (e.g., as a server bank, a group of blade servers, or a multi-processor system).
  • the mobile computing device 1350 includes a processor 1352 , a memory 1364 , and an input/output device such as a display 1354 , a communication interface 1366 , and a transceiver 1368 , among other components.
  • the mobile computing device 1350 can also be provided with a storage device, such as a micro-drive or other device, to provide additional storage.
  • a storage device such as a micro-drive or other device, to provide additional storage.
  • Each of the processor 1352 , the memory 1364 , the display 1354 , the communication interface 1366 , and the transceiver 1368 are interconnected using various buses, and several of the components can be mounted on a common motherboard or in other manners as appropriate.
  • the processor 1352 can communicate with a user through a control interface 1358 and a display interface 1356 coupled to the display 1354 .
  • the display 1354 can be, for example, a TFT (Thin-Film-Transistor Liquid Crystal Display) display or an OLED (Organic Light Emitting Diode) display, or other appropriate display technology.
  • the display interface 1356 can comprise appropriate circuitry for driving the display 1354 to present graphical and other information to a user.
  • the control interface 1358 can receive commands from a user and convert them for submission to the processor 1352 .
  • an external interface 1362 can provide communication with the processor 1352 , so as to enable near area communication of the mobile computing device 1350 with other devices.
  • the external interface 1362 can provide, for example, for wired communication in some implementations, or for wireless communication in other implementations, and multiple interfaces can also be used.
  • the memory 1364 stores information within the mobile computing device 1350 .
  • the memory 1364 can be implemented as one or more of a computer-readable medium or media, a volatile memory unit or units, or a non-volatile memory unit or units.
  • An expansion memory 1374 can also be provided and connected to the mobile computing device 1350 through an expansion interface 1372 , which can include, for example, a SIMM (Single In Line Memory Module) card interface.
  • SIMM Single In Line Memory Module
  • the expansion memory 1374 can provide extra storage space for the mobile computing device 1350 , or can also store applications or other information for the mobile computing device 1350 .
  • the expansion memory 1374 can include instructions to carry out or supplement the processes described above, and can include secure information also.
  • the expansion memory 1374 can be provided as a security module for the mobile computing device 1350 , and can be programmed with instructions that permit secure use of the mobile computing device 1350 .
  • secure applications can be provided via the SIMM cards, along with additional information, such as placing identifying information on the SIMM card in a non-hackable manner.
  • the mobile computing device 1350 can communicate wirelessly through the communication interface 1366 , which can include digital signal processing circuitry where necessary.
  • the communication interface 1366 can provide for communications under various modes or protocols, such as GSM voice calls (Global System for Mobile communications), SMS (Short Message Service), EMS (Enhanced Messaging Service), or MMS messaging (Multimedia Messaging Service), CDMA (code division multiple access), TDMA (time division multiple access), PDC (Personal Digital Cellular), WCDMA (Wideband Code Division Multiple Access), CDMA2000, or GPRS (General Packet Radio Service), among others.
  • GSM voice calls Global System for Mobile communications
  • SMS Short Message Service
  • EMS Enhanced Messaging Service
  • MMS messaging Multimedia Messaging Service
  • CDMA code division multiple access
  • TDMA time division multiple access
  • PDC Personal Digital Cellular
  • WCDMA Wideband Code Division Multiple Access
  • CDMA2000 Code Division Multiple Access
  • GPRS General Packet Radio Service
  • a GPS (Global Positioning System) receiver module 1370 can provide additional navigation- and location-related wireless data to the mobile computing device 1350 , which can be used as appropriate by applications running on the mobile computing device 1350 .
  • the mobile computing device 1350 can also communicate audibly using an audio codec 1360 , which can receive spoken information from a user and convert it to usable digital information.
  • the audio codec 1360 can likewise generate audible sound for a user, such as through a speaker, e.g., in a handset of the mobile computing device 1350 .
  • Such sound can include sound from voice telephone calls, can include recorded sound (e.g., voice messages, music files, etc.) and can also include sound generated by applications operating on the mobile computing device 1350 .
  • the mobile computing device 1350 can be implemented in a number of different forms, as shown in the figure. For example, it can be implemented as a cellular telephone 1380 . It can also be implemented as part of a smart-phone 1382 , personal digital assistant, or other similar mobile device.
  • implementations of the systems and techniques described here can be realized in digital electronic circuitry, integrated circuitry, specially designed ASICs (application specific integrated circuits), computer hardware, firmware, software, and/or combinations thereof.
  • ASICs application specific integrated circuits
  • These various implementations can include implementation in one or more computer programs that are executable and/or interpretable on a programmable system including at least one programmable processor, which can be special or general purpose, coupled to receive data and instructions from, and to transmit data and instructions to, a storage system, at least one input device, and at least one output device.
  • machine-readable storage medium and computer-readable storage medium refer to any computer program product, apparatus and/or device (e.g., magnetic discs, optical disks, memory, Programmable Logic Devices (PLDs)) used to provide machine instructions and/or data to a programmable processor, including a machine-readable storage medium that receives machine instructions as a machine-readable signal.
  • machine-readable signal refers to any signal used to provide machine instructions and/or data to a programmable processor.
  • a machine-readable storage medium does not include a machine-readable signal.
  • the systems and techniques described here can be implemented on a computer having a display device (e.g., a CRT (cathode ray tube) or LCD (liquid crystal display) monitor) for displaying information to the user and a keyboard and a pointing device (e.g., a mouse or a trackball) by which the user can provide input to the computer.
  • a display device e.g., a CRT (cathode ray tube) or LCD (liquid crystal display) monitor
  • a keyboard and a pointing device e.g., a mouse or a trackball
  • Other kinds of devices can be used to provide for interaction with a user as well; for example, feedback provided to the user can be any form of sensory feedback (e.g., visual feedback, auditory feedback, or tactile feedback); and input from the user can be received in any form, including acoustic, speech, or tactile input.
  • the systems and techniques described here can be implemented in a computing system that includes a back end component (e.g., as a data server), or that includes a middleware component (e.g., an application server), or that includes a front end component (e.g., a client computer having a graphical user interface or a Web browser through which a user can interact with an implementation of the systems and techniques described here), or any combination of such back end, middleware, or front end components.
  • the components of the system can be interconnected by any form or medium of digital data communication (e.g., a communication network). Examples of communication networks include a local area network (LAN), a wide area network (WAN), and the Internet.
  • LAN local area network
  • WAN wide area network
  • the Internet the global information network
  • the computing system can include clients and servers.
  • a client and server are generally remote from each other and typically interact through a communication network.
  • the relationship of client and server arises by virtue of computer programs running on the respective computers and having a client-server relationship to each other.

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Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20160288416A1 (en) * 2015-04-02 2016-10-06 Xerox Corporation Method for transmitting data, method for receiving data, and device
CN109589613A (zh) * 2019-02-12 2019-04-09 滁州市云米工业设计有限公司 一种用于电子玩具加工的配件组接配装设备及其工作方法
CN109703010A (zh) * 2019-01-18 2019-05-03 深圳市硬核智娱科技有限公司 一种用于积木制造的模块化3d打印机
US20210229091A1 (en) * 2020-01-28 2021-07-29 Rn Technologies, Llc Additive manufacturing of devices from assemblies of discretized component voxel elements
US11161295B2 (en) 2016-04-29 2021-11-02 Hewlett-Packard Development Company, L.P. Three-dimensional printer with a supporting element insertion apparatus
EP3954531A1 (fr) * 2020-08-10 2022-02-16 Max-Planck-Gesellschaft zur Förderung der Wissenschaften e.V. Procédé de fabrication d'une machine magnétique déformable et machine magnétique 3d déformable

Citations (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4339984A (en) * 1973-05-29 1982-07-20 G. H. Pfaff Pietzsch Industrieroboter Drive, particularly for an industrial manipulator
US4610083A (en) * 1985-08-26 1986-09-09 Zenith Electronics Corporation Method and apparatus for electronic component matching
US4704792A (en) * 1985-04-17 1987-11-10 Hitachi, Ltd. Components feeding apparatus
US4971647A (en) * 1987-11-05 1990-11-20 Chrysler Corporation Method of automated assembly of a harness retainer stud
US5125149A (en) * 1989-04-28 1992-06-30 Canon Kabushiki Kaisha Method of accessing and assembling parts in an assembly apparatus incorporating mobile robots
US5191693A (en) * 1989-12-29 1993-03-09 Canon Kabushiki Kaisha Tape type work conveying method and conveying apparatus
US5289625A (en) * 1989-04-05 1994-03-01 Canon Kabushiki Kaisha Method for supplying articles and apparatus therefor
US5299902A (en) * 1991-01-22 1994-04-05 Matsushita Electric Industrial Co., Ltd. Chip-type electronic element supplying apparatus
US5400497A (en) * 1990-10-29 1995-03-28 Matsushita Electric Industrial Co., Ltd. Electronic parts mounting apparatus having memory equipped parts supply device
US5515600A (en) * 1993-04-14 1996-05-14 Kabushiki Kaisha Toshiba Parts mounter and cartridge structure
US5531859A (en) * 1993-12-29 1996-07-02 Daewoo Heavy Industries Ltd. Electronic component feeder
US5553376A (en) * 1995-02-15 1996-09-10 Motorola, Inc. Method of and apparatus for changing a production setup
US5562384A (en) * 1991-12-23 1996-10-08 Joseph Alvite Tape packaging system with removeable covers
US5725140A (en) * 1996-09-09 1998-03-10 Amistar Corporation Tape feeder for a surface mount placement system
US5941674A (en) * 1996-06-12 1999-08-24 Tempo G Interchangeable electronic carrier tape feeder adaptable to various surface mount assembly machines
US6082603A (en) * 1998-06-24 2000-07-04 Fuji Machine Mfg. Co., Ltd. Electric-component tape feeding apparatus and electric-component supplying method
US6157870A (en) * 1997-02-18 2000-12-05 Zevatech Trading Ag Apparatus supplying components to a placement machine with splice sensor
US20010042598A1 (en) * 1997-05-01 2001-11-22 Fuji Xerox Co., Ltd. Apparatus for manufacturing micro-structure
US6332387B1 (en) * 1997-10-29 2001-12-25 Fuji Machine Manufacturing Co., Ltd. Cover-tape treating method and apparatus and electric-component supplying unit
US6591488B1 (en) * 2000-04-07 2003-07-15 Hirata Corporation Production system
US6694606B1 (en) * 1998-06-24 2004-02-24 Fuji Machine Mfg. Co., Ltd. Electric-component supplying apparatus and circuit-board assembling method for feeding a plurality of electric-component tapes
US20040074581A1 (en) * 2002-10-18 2004-04-22 Whelen Engineering Company, Inc. Apparatus and method for assembling electronic components to a printed circuit board
US6817216B2 (en) * 2002-08-22 2004-11-16 Accu-Assembly Incorporated Electronic component placement
US6834787B2 (en) * 2000-04-27 2004-12-28 Siemens Aktiengesellschaft Feeding devices for taped electric components
US6902090B2 (en) * 2001-10-16 2005-06-07 Matsushita Electric Industrial Co., Ltd. Tape feeder, electronic component mounting apparatus using the same, and method of feeding electronic components
US6948541B2 (en) * 2001-09-19 2005-09-27 Mydata Automation Ab System for handling components at a component mounting machine
US20100043980A1 (en) * 2008-08-19 2010-02-25 Silverbrook Research Pty Ltd Alignment mechanism for aligning an integrated circuit
US7805831B2 (en) * 2005-05-23 2010-10-05 Panasonic Corporation Electronic components feeding apparatus, and components information managing method in electronic components feeding apparatus
US7930819B2 (en) * 2006-10-03 2011-04-26 Yamaha Hatsudoki Kabushiki Kaisha Component supply unit and surface mounter
US8070473B2 (en) * 2008-01-08 2011-12-06 Stratasys, Inc. System for building three-dimensional objects containing embedded inserts, and method of use thereof
US8092625B2 (en) * 2008-08-19 2012-01-10 Silverbrook Research Pty Ltd Integrated circuit placement system
US8336195B2 (en) * 2005-11-30 2012-12-25 Hitachi High-Tech Instruments Co., Ltd. Electronic component mounting apparatus
WO2013136440A1 (fr) * 2012-03-13 2013-09-19 富士機械製造株式会社 Système de gestion d'un appareil d'introduction d'un dispositif de montage de composants

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3809186A (en) * 1971-12-14 1974-05-07 L Suozzo Mechanical shock and sway arrestor
US4749347A (en) 1985-08-29 1988-06-07 Viljo Valavaara Topology fabrication apparatus
US5121329A (en) 1989-10-30 1992-06-09 Stratasys, Inc. Apparatus and method for creating three-dimensional objects
US5686180A (en) 1994-09-29 1997-11-11 Central Products Company Water activated adhesive and paper-plastic tape containing same
US6568143B2 (en) * 2000-06-23 2003-05-27 Withrow Block, L.L.C. Interlocking construction components
US6648715B2 (en) * 2001-10-25 2003-11-18 Benjamin I. Wiens Snap-fit construction system
EP2295227A3 (fr) 2002-12-03 2018-04-04 Stratasys Ltd. Dispositif et procédé pour la création d'objets tridimensionels par impression
US7146875B2 (en) * 2003-01-08 2006-12-12 Dura Global Technologies, Inc. Locking device for cable assembly
US6922965B2 (en) * 2003-07-25 2005-08-02 Ilinois Tool Works Inc. Bonded interlocking flooring
US7806038B2 (en) * 2004-07-14 2010-10-05 Duke Leslie P Modular polymeric projectile absorbing armor
US20060059838A1 (en) * 2004-08-06 2006-03-23 Pimental Terry W Modular, hollow construction building block and methodology of use
US7261793B2 (en) * 2004-08-13 2007-08-28 Hewlett-Packard Development Company, L.P. System and method for low temperature plasma-enhanced bonding
US7799383B2 (en) * 2004-09-30 2010-09-21 Illinois Tool Works, Inc. Surface activated adhesive systems
CN101068607A (zh) * 2004-12-03 2007-11-07 Bld东洋株式会社 多面体玩具
US7848838B2 (en) * 2006-06-23 2010-12-07 Massachusetts Institute Of Technology Digital assembler for digital materials
US20090246418A1 (en) * 2008-02-12 2009-10-01 Ronald Wise Joint construction for artificial turf substrate
CN102164734B (zh) * 2008-07-25 2014-06-11 康奈尔大学 用于数字化制造的装置和方法
US20100109247A1 (en) * 2008-11-05 2010-05-06 Joseph Cernansky Interconnecting game tiles and games therewith
US20110239593A1 (en) * 2010-03-08 2011-10-06 Basf Se Use of an activatable adhesive composition for producing folding-carton blanks
US9506485B2 (en) * 2011-11-04 2016-11-29 Massachusetts Institute Of Technology Hierarchical functional digital materials

Patent Citations (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4339984A (en) * 1973-05-29 1982-07-20 G. H. Pfaff Pietzsch Industrieroboter Drive, particularly for an industrial manipulator
US4704792A (en) * 1985-04-17 1987-11-10 Hitachi, Ltd. Components feeding apparatus
US4610083A (en) * 1985-08-26 1986-09-09 Zenith Electronics Corporation Method and apparatus for electronic component matching
US4971647A (en) * 1987-11-05 1990-11-20 Chrysler Corporation Method of automated assembly of a harness retainer stud
US5289625A (en) * 1989-04-05 1994-03-01 Canon Kabushiki Kaisha Method for supplying articles and apparatus therefor
US5125149A (en) * 1989-04-28 1992-06-30 Canon Kabushiki Kaisha Method of accessing and assembling parts in an assembly apparatus incorporating mobile robots
US5191693A (en) * 1989-12-29 1993-03-09 Canon Kabushiki Kaisha Tape type work conveying method and conveying apparatus
US5400497A (en) * 1990-10-29 1995-03-28 Matsushita Electric Industrial Co., Ltd. Electronic parts mounting apparatus having memory equipped parts supply device
US5299902A (en) * 1991-01-22 1994-04-05 Matsushita Electric Industrial Co., Ltd. Chip-type electronic element supplying apparatus
US5562384A (en) * 1991-12-23 1996-10-08 Joseph Alvite Tape packaging system with removeable covers
US5515600A (en) * 1993-04-14 1996-05-14 Kabushiki Kaisha Toshiba Parts mounter and cartridge structure
US5531859A (en) * 1993-12-29 1996-07-02 Daewoo Heavy Industries Ltd. Electronic component feeder
US5553376A (en) * 1995-02-15 1996-09-10 Motorola, Inc. Method of and apparatus for changing a production setup
US5941674A (en) * 1996-06-12 1999-08-24 Tempo G Interchangeable electronic carrier tape feeder adaptable to various surface mount assembly machines
US5725140A (en) * 1996-09-09 1998-03-10 Amistar Corporation Tape feeder for a surface mount placement system
US6157870A (en) * 1997-02-18 2000-12-05 Zevatech Trading Ag Apparatus supplying components to a placement machine with splice sensor
US20010042598A1 (en) * 1997-05-01 2001-11-22 Fuji Xerox Co., Ltd. Apparatus for manufacturing micro-structure
US6332387B1 (en) * 1997-10-29 2001-12-25 Fuji Machine Manufacturing Co., Ltd. Cover-tape treating method and apparatus and electric-component supplying unit
US6694606B1 (en) * 1998-06-24 2004-02-24 Fuji Machine Mfg. Co., Ltd. Electric-component supplying apparatus and circuit-board assembling method for feeding a plurality of electric-component tapes
US6082603A (en) * 1998-06-24 2000-07-04 Fuji Machine Mfg. Co., Ltd. Electric-component tape feeding apparatus and electric-component supplying method
US6591488B1 (en) * 2000-04-07 2003-07-15 Hirata Corporation Production system
US6834787B2 (en) * 2000-04-27 2004-12-28 Siemens Aktiengesellschaft Feeding devices for taped electric components
US6948541B2 (en) * 2001-09-19 2005-09-27 Mydata Automation Ab System for handling components at a component mounting machine
US6902090B2 (en) * 2001-10-16 2005-06-07 Matsushita Electric Industrial Co., Ltd. Tape feeder, electronic component mounting apparatus using the same, and method of feeding electronic components
US6817216B2 (en) * 2002-08-22 2004-11-16 Accu-Assembly Incorporated Electronic component placement
US20040074581A1 (en) * 2002-10-18 2004-04-22 Whelen Engineering Company, Inc. Apparatus and method for assembling electronic components to a printed circuit board
US7805831B2 (en) * 2005-05-23 2010-10-05 Panasonic Corporation Electronic components feeding apparatus, and components information managing method in electronic components feeding apparatus
US8336195B2 (en) * 2005-11-30 2012-12-25 Hitachi High-Tech Instruments Co., Ltd. Electronic component mounting apparatus
US7930819B2 (en) * 2006-10-03 2011-04-26 Yamaha Hatsudoki Kabushiki Kaisha Component supply unit and surface mounter
US8070473B2 (en) * 2008-01-08 2011-12-06 Stratasys, Inc. System for building three-dimensional objects containing embedded inserts, and method of use thereof
US20100043980A1 (en) * 2008-08-19 2010-02-25 Silverbrook Research Pty Ltd Alignment mechanism for aligning an integrated circuit
US8092625B2 (en) * 2008-08-19 2012-01-10 Silverbrook Research Pty Ltd Integrated circuit placement system
WO2013136440A1 (fr) * 2012-03-13 2013-09-19 富士機械製造株式会社 Système de gestion d'un appareil d'introduction d'un dispositif de montage de composants
US9669980B2 (en) * 2012-03-13 2017-06-06 Fuji Machine Mfg. Co., Ltd. Feeder management system of component mounting apparatus

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
Pasek et al, Lego Factory: An Educational CIM Environment for Assembly 2005, American Society of Engineering Education Annual Conference & Exposition. *

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20160288416A1 (en) * 2015-04-02 2016-10-06 Xerox Corporation Method for transmitting data, method for receiving data, and device
US9884449B2 (en) * 2015-04-02 2018-02-06 Xerox Corporation Three-dimensional printed part removal using an interlaced platen
US11161295B2 (en) 2016-04-29 2021-11-02 Hewlett-Packard Development Company, L.P. Three-dimensional printer with a supporting element insertion apparatus
CN109703010A (zh) * 2019-01-18 2019-05-03 深圳市硬核智娱科技有限公司 一种用于积木制造的模块化3d打印机
CN109589613A (zh) * 2019-02-12 2019-04-09 滁州市云米工业设计有限公司 一种用于电子玩具加工的配件组接配装设备及其工作方法
US20210229091A1 (en) * 2020-01-28 2021-07-29 Rn Technologies, Llc Additive manufacturing of devices from assemblies of discretized component voxel elements
EP3954531A1 (fr) * 2020-08-10 2022-02-16 Max-Planck-Gesellschaft zur Förderung der Wissenschaften e.V. Procédé de fabrication d'une machine magnétique déformable et machine magnétique 3d déformable
WO2022033933A1 (fr) * 2020-08-10 2022-02-17 MAX-PLANCK-Gesellschaft zur Förderung der Wissenschaften e.V. Procédé de fabrication d'une machine magnétique déformable et machine magnétique 3d déformable

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US10052858B2 (en) 2018-08-21
US20150261910A1 (en) 2015-09-17
US9937697B2 (en) 2018-04-10

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