US20150102264A1 - Electrically Conductive Polyamide-imide Solution for the Purpose of Creating Electrical Circuits. - Google Patents

Electrically Conductive Polyamide-imide Solution for the Purpose of Creating Electrical Circuits. Download PDF

Info

Publication number
US20150102264A1
US20150102264A1 US13/956,380 US201313956380A US2015102264A1 US 20150102264 A1 US20150102264 A1 US 20150102264A1 US 201313956380 A US201313956380 A US 201313956380A US 2015102264 A1 US2015102264 A1 US 2015102264A1
Authority
US
United States
Prior art keywords
electrically conductive
electrical circuits
imide solution
conductive ink
creating electrical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US13/956,380
Inventor
Ryan David Allmandinger
Donald David Allmandinger
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to US13/956,380 priority Critical patent/US20150102264A1/en
Publication of US20150102264A1 publication Critical patent/US20150102264A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C09D5/24—Electrically-conducting paints
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/24—Conductive material dispersed in non-conductive organic material the conductive material comprising carbon-silicon compounds, carbon or silicon

Definitions

  • the current methodology for producing non-wire wound potentiometers involves depositing a conductive ink track onto a packed powder substrate, then subjecting the substrate to a high pressure/high temperature molding process. Due to the porosity of the substrate material and the pressure of the molding process, the conductive ink track becomes distorted.
  • An alternate method that involves injection molding a thermoplastic material over a conductive ink track would eliminate the distortion caused by porosity of the substrate, and the high pressure applied to the track. Developing a conductive ink consisting of the same thermoplastic material is necessary for maximum bonding and mold efficiency.
  • This invention describes the materials and processes used to dissolve a thermoplastic material into a liquid solution that is then mixed with conductive materials for printing conductive circuit tracks.
  • the process involves dissolving a polyamide-imide (PAI) material to create a liquid solution and adding an electrical conductor.
  • PAI polyamide-imide
  • PAI can be dissolved with the chemical called N-Methyl-2-pyrrolidone (NMP) to create a solution to which an electrical conductor is added.
  • NMP N-Methyl-2-pyrrolidone
  • Powdered or granulated carbon is one possible electrical conductor. This is added and mixed to create a homogeneous suspension.
  • the chemical Xylene is added to control viscosity and drying rate.
  • This mixture is an electrically conductive ink, with controllable resistance.
  • the mass ratio of carbon to PAI determines the resistive properties of the processed mixture.
  • Another conductive ink is created using the same PAI/NMP/Xylene solution except Silver (Ag) powder is added in place of carbon. This mixture is highly conductive (low electrical resistance) and can be used to create termination pads (electrical connection points).

Abstract

This is the development of a new conductive ink utilizing modern plastics and processes for the purpose of improving modern circuitry. By dissolving polyamide-imide (PAI) resin and mixing it with a conductive material (such as carbon, silver, copper, or gold) we can create an electrically conductive ink that can be printed into circuitry. This method of circuit printing is far stronger and resistant to environmental forces.

Description

    CROSS-REFERENCE TO RELATED APPLICATIONS
  • (Not applicable)
    • STATEMENT OF FEDERALLY SPONSORED RESEARCH/DEVELOPMENT
  • (Not applicable)
    • REFERENCE TO A “SEQUENCE LISTING,” OR A COMPUTER PROGRAM
  • (Not applicable)
    • BACKGROUND OF THE INVENTION
  • The current methodology for producing non-wire wound potentiometers involves depositing a conductive ink track onto a packed powder substrate, then subjecting the substrate to a high pressure/high temperature molding process. Due to the porosity of the substrate material and the pressure of the molding process, the conductive ink track becomes distorted. An alternate method that involves injection molding a thermoplastic material over a conductive ink track would eliminate the distortion caused by porosity of the substrate, and the high pressure applied to the track. Developing a conductive ink consisting of the same thermoplastic material is necessary for maximum bonding and mold efficiency.
    • BRIEF SUMMARY OF THE INVENTION
  • This invention describes the materials and processes used to dissolve a thermoplastic material into a liquid solution that is then mixed with conductive materials for printing conductive circuit tracks.
    • BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWING
  • (If Any)
    • DETAILED DESCRIPTION OF THE INVENTION
  • The process involves dissolving a polyamide-imide (PAI) material to create a liquid solution and adding an electrical conductor.
  • For example:
  • PAI can be dissolved with the chemical called N-Methyl-2-pyrrolidone (NMP) to create a solution to which an electrical conductor is added.
  • Powdered or granulated carbon is one possible electrical conductor. This is added and mixed to create a homogeneous suspension. The chemical Xylene is added to control viscosity and drying rate. This mixture is an electrically conductive ink, with controllable resistance. The mass ratio of carbon to PAI determines the resistive properties of the processed mixture. Another conductive ink is created using the same PAI/NMP/Xylene solution except Silver (Ag) powder is added in place of carbon. This mixture is highly conductive (low electrical resistance) and can be used to create termination pads (electrical connection points).

Claims (1)

1. An electrically conductive mixture consisting of liquefied polyamide-imide solution serving as a carrier for any conductive material for the purpose of creating an electric circuit.
US13/956,380 2013-10-11 2013-10-11 Electrically Conductive Polyamide-imide Solution for the Purpose of Creating Electrical Circuits. Abandoned US20150102264A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US13/956,380 US20150102264A1 (en) 2013-10-11 2013-10-11 Electrically Conductive Polyamide-imide Solution for the Purpose of Creating Electrical Circuits.

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US13/956,380 US20150102264A1 (en) 2013-10-11 2013-10-11 Electrically Conductive Polyamide-imide Solution for the Purpose of Creating Electrical Circuits.

Publications (1)

Publication Number Publication Date
US20150102264A1 true US20150102264A1 (en) 2015-04-16

Family

ID=52808883

Family Applications (1)

Application Number Title Priority Date Filing Date
US13/956,380 Abandoned US20150102264A1 (en) 2013-10-11 2013-10-11 Electrically Conductive Polyamide-imide Solution for the Purpose of Creating Electrical Circuits.

Country Status (1)

Country Link
US (1) US20150102264A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20170174937A1 (en) * 2015-12-20 2017-06-22 Ryan David Allmandinger Electrically Conductive Polyamide-imide Mixture for the Purpose of Creating Electrical Circuits.

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6228288B1 (en) * 2000-04-27 2001-05-08 Cts Corporation Electrically conductive compositions and films for position sensors
CN101823151B (en) * 2009-03-06 2011-11-16 佛山市顺德区锐新科屏蔽材料有限公司 Waterborne through-hole silver paste and preparation method and application thereof
US20130143119A1 (en) * 2011-12-02 2013-06-06 Samsung Electronics Co., Ltd Anode active material for lithium rechargeable battery, method of preparing the same, and lithium battery including the anode active material
US20140001409A1 (en) * 2012-06-27 2014-01-02 Nitto Denko Corporation Polyamide-imide resin film and seamless belt including the resin film

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6228288B1 (en) * 2000-04-27 2001-05-08 Cts Corporation Electrically conductive compositions and films for position sensors
CN101823151B (en) * 2009-03-06 2011-11-16 佛山市顺德区锐新科屏蔽材料有限公司 Waterborne through-hole silver paste and preparation method and application thereof
US20130143119A1 (en) * 2011-12-02 2013-06-06 Samsung Electronics Co., Ltd Anode active material for lithium rechargeable battery, method of preparing the same, and lithium battery including the anode active material
US20140001409A1 (en) * 2012-06-27 2014-01-02 Nitto Denko Corporation Polyamide-imide resin film and seamless belt including the resin film

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20170174937A1 (en) * 2015-12-20 2017-06-22 Ryan David Allmandinger Electrically Conductive Polyamide-imide Mixture for the Purpose of Creating Electrical Circuits.

Similar Documents

Publication Publication Date Title
US20170154702A1 (en) Conductive complex and preparing method therefor
CN101436442A (en) Low-temperature conductive slurry
US9661756B1 (en) Nano-copper pillar interconnects and methods thereof
CN104507301A (en) Electromagnetic shielding film with metal coating and manufacturing technique of electromagnetic shielding film
JP2009096851A5 (en)
KR20150098179A (en) Anisotropic conductive film and manufacturing method thereof
CN105702320A (en) Silver conductive paste for radio frequency identification tag and preparation method thereof
US20150102264A1 (en) Electrically Conductive Polyamide-imide Solution for the Purpose of Creating Electrical Circuits.
JPH06295616A (en) Conductive paste for forming film capable of applying soldering
US20130048363A1 (en) Circuit board
US20140176280A1 (en) Common mode filter and method of manufacturing the same
JP2016143759A (en) Coil device
JP2010090264A (en) Functional electroconductive coating and method for production of printed circuit board using the same
CN104867530B (en) Conductive particle, electric conduction powder, conductive polymer composition and anisotropic conductive sheet
KR101122117B1 (en) Printed Antenna and Manufacturing Method Thereof
JP2016219129A (en) Metal-coated electrically conductive particle and electrically conductive material containing the particle
JP2009070650A (en) Functional conductive coating, its manufacturing method, and printed wiring board
US10588220B2 (en) Dry method of metallizing polymer thick film surfaces
CA2871029A1 (en) Improving properties of printed conductive tracks
CN104693965A (en) Composition for preventing ionic migration and preparation method, non-gel substrate and preparation method
KR101600446B1 (en) Conductive adhesive having conductive polymer and conductive flim thereof
Jiang et al. High-temperature adhesion promoter based on (3-glycidoxypropyl) trimethoxysilane for Cu paste
CN103680764A (en) Manufacturing method of conductive combined body
CN103716979A (en) Conductive composite
JP2006041008A (en) Electronic component mounting method

Legal Events

Date Code Title Description
STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION