CN101823151B - Waterborne through-hole silver paste and preparation method and application thereof - Google Patents
Waterborne through-hole silver paste and preparation method and application thereof Download PDFInfo
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- CN101823151B CN101823151B CN2009100376593A CN200910037659A CN101823151B CN 101823151 B CN101823151 B CN 101823151B CN 2009100376593 A CN2009100376593 A CN 2009100376593A CN 200910037659 A CN200910037659 A CN 200910037659A CN 101823151 B CN101823151 B CN 101823151B
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Abstract
The utility model discloses a waterborne through-hole silver paste, which consists of the following components in percentage by mass: 8 percent to 15 percent of polyamide-imide powder, 5 percent to 10 percent of N-methylpyrrolidone, 0.5 percent to 2 percent of triethylamine, 2 percent to 8 percent of fully methyl-etherified waterborne amino resin, 1 to 2 percent of silane coupling agent, 48 percent to 65 percent of flake silver powder, 10 percent to 15 percent of water and ethanol mixed according to the weight ratio of 1:1, and 0.5 percent to 3 percent of levelling agent and defoaming agent. The waterborne through-hole silver paste adopts the binders which are completely different from the solvent system, thus ensuring the due quality requirement on the conductive silver paste on a circuit board and reducing the harm on environment and human health, various current verifications prove that the formula of the system is safe and reliable, the water-soluble polyamide-imide emulsion and the water-soluble amino resin are adopted as the binders, so that the drying time and the post-drying performance can be effectively ensured, the domestic pure silver powder is chosen as conductive medium, consequently, the cost is reduced, and the domestic technical level is promoted to increase.
Description
Technical field
The present invention relates to the conduction electrons slurry technical field that multilayer circuit board connects conduction usefulness, especially a kind of waterborne through-hole silver paste and its production and use; This kind of waterborne through-hole silver paste can replace original the plating to connect.
Background technology
The through-hole silver paste of import being arranged on the market, be widely used, all is based on solvent-borne type, is not that the product of diluent occurs with water.Traditional solvent-borne type is to make main binding agent with epoxy resin and epoxy resin special curing agent, add silver powder (or silver-coated copper powder) as conducting medium, through twice dry solidification process, between the injection articulamentum on the wiring board of path, make conductive applications, be communicated with to replace electroplating.Yet solvent product is in today of paying attention to environmental protection day by day, begun inapplicablely, and main cause is that solvent has a large amount of VOC to produce, and environment and human health are caused extremely bad influence.
Summary of the invention
The objective of the invention is to overcome above-mentioned the deficiencies in the prior art, and provide a kind of is the perforation conductive silver paste of solvent with water, this conductive silver paste adopts the binding agent of the dicyandiamide solution that is different from prior art fully, both ensure the due in the circuit board quality requirement of conductive silver paste, again environment and human health had been reduced injury.
Another object of the present invention also is to provide a kind of preparation technology easy waterborne through-hole silver paste preparation method, and the purposes of this waterborne through-hole silver paste.
The object of the present invention is achieved like this:
A kind of waterborne through-hole silver paste, this waterborne through-hole silver paste comprise following each component and mass percentage content is:
Polyamide-imide powder 8 ~ 15%;
N-methyl pyrrolidone 5 ~ 10%;
Triethylamine 0.5 ~ 2%;
Full methyl-etherified water-compatible amino resin 2 ~ 8%;
Silane coupler 1 ~ 2%;
Flake silver powder 48 ~ 65%;
Water and ethanol are pressed mass ratio 1:1 and are mixed 10 ~ 15%;
Levelling agent and defoamer 0.5 ~ 3%.
Another object of the present invention is to adopt following technical measures to solve:
A kind of method for preparing above-mentioned waterborne through-hole silver paste comprises the steps:
Step 1 is selected import polyamide-imide powder resin for use, through an amount of N-methyl pyrrolidone and deionized water, adds triethylamine as auxiliary agent, and the heating for dissolving resin disperses through 5 hours high-speed stirred, makes half-finished resin emulsion, and is standby;
Step 2 is selected full methyl-etherified water-compatible amino resin for use, joins above-mentioned resin emulsion, disperses to stir, and makes binding agent;
Step 3 with hydrophilic flake silver powder, is mixed with water, ethanolic solution with an amount of silane coupler, soaks into silver powder, after 24 hours, put into and disperse to add above-mentioned binding agent while stirring in the bucket, disperse after 2 hours, add levelling agent and defoamer as auxiliary agent, disperse 30 minutes again after, i.e. manufactured goods.
A kind of purposes of waterborne through-hole silver paste, described waterborne through-hole silver paste is with printing the machine-processed multilayer circuit board inspection panel that gets of perforation, its technology is, be 60 ℃, about 90 minutes prebake of time through excess temperature earlier, forwarding temperature again to is 150 ℃, about 30 minutes of time baking-curing, take out the cooling finished product, measuring resistance is certified products below 35m Ω/hole.
The invention has the beneficial effects as follows:
(1) waterborne through-hole silver paste of the present invention, adopted the binding agent that is different from above dicyandiamide solution fully, both ensured the due in the circuit board quality requirement of conductive silver paste, again environment and human health are reduced injury, obtained many-sided checking at present, confirm the security reliability of this system formulation, we have adopted water soluble polyamide imines emulsion and water soluble amino resin as binding agent, have a good guarantee in drying time and dried performance, the fine silver powder of selecting production domesticization for use is as conducting medium, save cost, promote the raising of domestic technique level.
The specific embodiment
A kind of waterborne through-hole silver paste, this waterborne through-hole silver paste comprise following each component and mass percentage content is:
Polyamide-imide powder 8 ~ 15%;
N-methyl pyrrolidone 5 ~ 10%;
Triethylamine 0.5 ~ 2%;
Full methyl-etherified water-compatible amino resin 2 ~ 8%;
Silane coupler 1 ~ 2%;
Flake silver powder 48 ~ 65%;
Water and ethanol are pressed mass ratio 1:1 and are mixed 10 ~ 15%;
Levelling agent and defoamer 0.5 ~ 3%.
The preparation method of above-mentioned waterborne through-hole silver paste comprises the steps:
Step 1 is selected import polyamide-imide powder resin for use, through an amount of N-methyl pyrrolidone and deionized water, adds triethylamine as auxiliary agent, and the heating for dissolving resin disperses through 5 hours high-speed stirred, makes half-finished resin emulsion, and is standby;
Step 2 is selected full methyl-etherified water-compatible amino resin for use, joins above-mentioned resin emulsion, disperses to stir, and makes binding agent;
Step 3 with hydrophilic flake silver powder, is mixed with water, ethanolic solution with an amount of silane coupler, soaks into silver powder, after 24 hours, put into and disperse to add above-mentioned binding agent while stirring in the bucket, disperse after 2 hours, add levelling agent and defoamer as auxiliary agent, disperse 30 minutes again after, i.e. manufactured goods.
The purposes of above-mentioned waterborne through-hole silver paste, described waterborne through-hole silver paste is with printing the machine-processed multilayer circuit board inspection panel that gets of perforation, its technology is, be 60 ℃, about 90 minutes prebake of time through excess temperature earlier, forwarding temperature again to is 150 ℃, about 30 minutes of time baking-curing, take out the cooling finished product, measuring resistance is certified products below 35m Ω/hole.
Claims (3)
1. a waterborne through-hole silver paste is characterized in that, this waterborne through-hole silver paste comprises following each component and mass percentage content is:
Polyamide-imide powder 8 ~ 15%;
N-methyl pyrrolidone 5 ~ 10%;
Triethylamine 0.5 ~ 2%;
Full methyl-etherified water-compatible amino resin 2 ~ 8%;
Silane coupler 1 ~ 2%;
Flake silver powder 48 ~ 65%;
Water and ethanol are pressed mass ratio 1:1 and are mixed 10 ~ 15%;
Levelling agent and defoamer 0.5 ~ 3%.
2. a method for preparing the described waterborne through-hole silver paste of claim 1 is characterized in that, comprises the steps:
Step 1 is selected import polyamide-imide powder resin for use, through an amount of N-methyl pyrrolidone and deionized water, adds triethylamine as auxiliary agent, and the heating for dissolving resin disperses through 5 hours high-speed stirred, makes half-finished resin emulsion, and is standby;
Step 2 is selected full methyl-etherified water-compatible amino resin for use, joins above-mentioned resin emulsion, disperses to stir, and makes binding agent;
Step 3 with hydrophilic flake silver powder, is mixed with water, ethanolic solution with an amount of silane coupler, soaks into silver powder, after 24 hours, put into and disperse to add above-mentioned binding agent while stirring in the bucket, disperse after 2 hours, add levelling agent and defoamer as auxiliary agent, disperse 30 minutes again after, i.e. manufactured goods.
3. the purposes of a waterborne through-hole silver paste as claimed in claim 1, it is characterized in that, described waterborne through-hole silver paste is with printing the machine-processed multilayer circuit board inspection panel that gets of perforation, its technology is, be that 60 ℃, time are 90 minutes prebake through excess temperature earlier, forwarding temperature again to and be 150 ℃, time is 30 minutes baking-curings, takes out the cooling finished product, measuring resistance is certified products below 35m Ω/hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009100376593A CN101823151B (en) | 2009-03-06 | 2009-03-06 | Waterborne through-hole silver paste and preparation method and application thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009100376593A CN101823151B (en) | 2009-03-06 | 2009-03-06 | Waterborne through-hole silver paste and preparation method and application thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101823151A CN101823151A (en) | 2010-09-08 |
| CN101823151B true CN101823151B (en) | 2011-11-16 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
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| CN2009100376593A Expired - Fee Related CN101823151B (en) | 2009-03-06 | 2009-03-06 | Waterborne through-hole silver paste and preparation method and application thereof |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20150102264A1 (en) * | 2013-10-11 | 2015-04-16 | Ryan David Allmandinger | Electrically Conductive Polyamide-imide Solution for the Purpose of Creating Electrical Circuits. |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110942918B (en) * | 2018-09-21 | 2022-08-12 | 钰冠科技股份有限公司 | Stacked capacitor, manufacturing method thereof and silver colloid layer |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1383355A (en) * | 2002-05-10 | 2002-12-04 | 上准衡器股份有限公司 | Technology for making strengthened glass circuit board and its product and application |
-
2009
- 2009-03-06 CN CN2009100376593A patent/CN101823151B/en not_active Expired - Fee Related
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1383355A (en) * | 2002-05-10 | 2002-12-04 | 上准衡器股份有限公司 | Technology for making strengthened glass circuit board and its product and application |
Non-Patent Citations (1)
| Title |
|---|
| 朱民.银浆贯孔印制板制造技术.《电子工艺技术》.1998,第19卷(第4期),127-135. * |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20150102264A1 (en) * | 2013-10-11 | 2015-04-16 | Ryan David Allmandinger | Electrically Conductive Polyamide-imide Solution for the Purpose of Creating Electrical Circuits. |
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| Publication number | Publication date |
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| CN101823151A (en) | 2010-09-08 |
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Granted publication date: 20111116 Termination date: 20150306 |
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