US20150101783A1 - Thermal conductor with ultra-thin flat wick structure - Google Patents

Thermal conductor with ultra-thin flat wick structure Download PDF

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Publication number
US20150101783A1
US20150101783A1 US14/054,104 US201314054104A US2015101783A1 US 20150101783 A1 US20150101783 A1 US 20150101783A1 US 201314054104 A US201314054104 A US 201314054104A US 2015101783 A1 US2015101783 A1 US 2015101783A1
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Prior art keywords
wick structure
thermal conductor
shell
conductor according
plane
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Abandoned
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US14/054,104
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Hao Pai
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Individual
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention relates to an ultra-thin plate type heat pipe and in particular to a thermal conductor with an ultra-thin flat wick structure.
  • the heat pipes used therein for heat dissipation or heat conduction also need to be thinned down, which causes the creation of the ultra-thin plate type heat pipe (the thickness is below about 1.5 mm).
  • the thickness of the ultra-thin plate type heat pipe needs to be thinned, thus resulting in a thinner thickness of the wick structure therein, otherwise the steam channels with sufficient space cannot be formed in the heat pipe.
  • the excessively thin wick structure cannot be filled through the gap between the wall of the heat pipe and the mandrel. The reason is that a relatively small gap causes a greater resistance when the metal powder is filled and thus cannot be processed subsequently. Therefore, the powder wick structure in the previous ultra-thin plate type heat pipe is formed only in the local area in the heat pipe and not thinned.
  • the powder wick structure in the ultra-thin plate type heat pipe of the prior art cannot be easily filled into the cross section of the heat pipe completely, which cannot provide the adequate surfaces for evaporation and condensation and the truncated transfer surface. Also, this still does not have sufficient steam channels and solid internal support structures, resulting in easy collapse of the heat pipe and thus greater thermal contact resistance. Hence, the heat transfer efficiency cannot be improved further.
  • the inventor pays special attention to research with the application of related theory and tries to overcome the above disadvantages.
  • the inventor proposes the present invention which is a reasonable design and effectively overcomes the above disadvantages.
  • the main objective of the present invention is to provide a thermal conductor with an ultra-thin flat wick structure, in which the thinned wick structure can be formed on the inner wall of the thermal conductor such that the steam channels can be maintained to provide sufficient space for heat transfer by evaporation and condensation after the ultra-thin thermal conductor is pressed and formed, to provide the maximal capillary surface area and truncated transfer surface, and to provide more solid internal support structures to make the heat pipe not easy to collapse and have lower thermal contact resistance, achieving the objective of providing an ultra-thin thermal conductor.
  • the present invention provides a thermal conductor with an ultra-thin flat wick structure, comprising a hollow shell having a flat shape, and a wick structure disposed in the shell and contacted with an inner wall of the shell.
  • the wick structure is a thin planar body having a plane and a pressing surface opposite to the plane.
  • the plane is attached to the inner wall of the shell.
  • a plurality of elongated concave surfaces are spacedly arranged on the pressing surface such that a steam channel is formed in the shell via each of the concave surfaces and an elongated wick structure connection is formed between each concave surface and the plane.
  • FIG. 1 is a perspective schematic view of the present invention
  • FIG. 2 is a cross-sectional schematic view along line 2 - 2 of FIG. 1 ;
  • FIG. 3 is a perspective schematic view of the wick structure of the present invention.
  • FIG. 4 is a cross-sectional schematic view of the wick structure according to the second embodiment of the present invention.
  • FIG. 5 is a cross-sectional schematic view of the wick structure according to the third embodiment of the present invention.
  • FIG. 6 is a cross-sectional schematic view of the wick structure according to the fourth embodiment of the present invention.
  • FIG. 7 is a cross-sectional schematic view of another embodiment of the present invention along a longitudinal direction thereof;
  • FIG. 8 is a perspective schematic view of the wick structure according to the fifth embodiment of the present invention.
  • FIG. 9 is a perspective schematic view of the wick structure according to the sixth embodiment of the present invention.
  • FIG. 10 is a cross-sectional schematic view according to another embodiment of the present invention.
  • FIG. 1 is a perspective schematic view of the present invention.
  • the present invention provides a thermal conductor with an ultra-thin flat wick structure, comprising a hollow shell 1 having a flat shape, and at least one wick structure 2 disposed in the shell 1 and contacted with an inner wall of the shell 1 .
  • the shell 1 may be formed to have the flat shape by manufacturing processes such as pressing.
  • the thickness T of the external contour of the shell 1 may be formed below 0.5 mm by pressing.
  • the shell 1 after the shell 1 is pressed, it has an upper wall 10 , a lower wall 11 spaced with and opposite to the upper wall 10 , and side edges 12 surrounding the outer edges of the upper wall 10 and the lower wall 11 .
  • the wick structure 2 may be braid, fiber, sintered metal powder, or any combination thereof to form a thin planar body.
  • the wick structure 2 is disposed in the above-mentioned shell 1 and has a plane 20 attached to an inner wall 110 of the shell 1 and a pressing surface 21 attached to another inner wall 100 .
  • a plurality of elongated concave surfaces 210 are evenly or unevenly spacedly arranged on the pressing surface 21 by pressing.
  • the concave surfaces 210 are extended and disposed along a longitudinal direction of the wick structure 2 such that a respective steam channel 101 is formed in the shell 1 via each of the concave surfaces 210 .
  • a respective elongated wick structure connection 200 is formed between each concave surface 210 and the plane 20 of the wick structure 2 . Furthermore, the thickness t 1 of the wick structure 2 is below about 0.25 mm and the minimum thickness t 2 of the respective elongated wick structure connection 200 ranges about from 0.02 mm to 0.04 mm.
  • each of the concave surfaces 210 may have a shape of an arc; as also shown in FIGS. 4-6 , each concave surface 210 many have a shape of a “V”, a rectangle, or a trapezoid. As shown in FIG. 7 , viewed cross-sectionally along a longitudinal direction of the wick structure 2 , each concave surface 210 gradually expands or shrinks along a longitudinal direction of the wick structure 2 .
  • each concave surface 210 of the wick structure 2 of the present invention may have the penetrated heat transfer holes 211 to enhance heat transfer.
  • a plurality of recesses 212 may be recessed and disposed between the respective concave surfaces 210 by the above-mentioned pressing such that after the wick structure 2 is placed into the shell 1 , the adjacent formed steam channels 101 can communicate with each other.
  • the present invention further comprises another wick structure 2 such that the two above-mentioned wick structures 2 are stacked up and down with respective concave surfaces 210 facing to each other to form the steam channels 101 .
  • the present invention indeed achieves the expected objective of use and overcomes the disadvantages of the prior art.
  • the present invention is useful, novel and non-obvious, which meets the requirements of patent application. Please examine the application carefully and grant it a patent for protecting the rights of the inventor.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Thermal Sciences (AREA)
  • Sustainable Development (AREA)
  • Mechanical Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

A thermal conductor with an ultra-thin flat wick structure (2) includes a hollow shell (1) having a flat shape, and a wick structure (2) disposed in the shell (1) and contacted with an inner wall (100) of the shell (1), wherein the wick structure (2) is a thin planar body having a plane (20) and a pressing surface (21) opposite to the plane (20), wherein the plane (20) is attached to the inner wall (100) of the shell (1), wherein a plurality of elongated concave surfaces (210) are spacedly arranged on the pressing surface (21) such that a steam channel (101) is formed in the shell (1) via each of the concave surfaces (210) and an elongated wick structure connection (200) is formed between each concave surface (210) and the plane (20).

Description

    BACKGROUND OF THE INVENTION
  • 1. Field of the Invention
  • The present invention relates to an ultra-thin plate type heat pipe and in particular to a thermal conductor with an ultra-thin flat wick structure.
  • 2. Description of Related Art
  • Since most current 3C electronic products indicate a trend towards a light, thin, short, and compact design, the heat pipes used therein for heat dissipation or heat conduction also need to be thinned down, which causes the creation of the ultra-thin plate type heat pipe (the thickness is below about 1.5 mm).
  • However, the thickness of the ultra-thin plate type heat pipe needs to be thinned, thus resulting in a thinner thickness of the wick structure therein, otherwise the steam channels with sufficient space cannot be formed in the heat pipe. During the manufacturing process, the excessively thin wick structure cannot be filled through the gap between the wall of the heat pipe and the mandrel. The reason is that a relatively small gap causes a greater resistance when the metal powder is filled and thus cannot be processed subsequently. Therefore, the powder wick structure in the previous ultra-thin plate type heat pipe is formed only in the local area in the heat pipe and not thinned. Consequently, the powder wick structure in the ultra-thin plate type heat pipe of the prior art cannot be easily filled into the cross section of the heat pipe completely, which cannot provide the adequate surfaces for evaporation and condensation and the truncated transfer surface. Also, this still does not have sufficient steam channels and solid internal support structures, resulting in easy collapse of the heat pipe and thus greater thermal contact resistance. Hence, the heat transfer efficiency cannot be improved further.
  • In view of this, the inventor pays special attention to research with the application of related theory and tries to overcome the above disadvantages. Finally, the inventor proposes the present invention which is a reasonable design and effectively overcomes the above disadvantages.
    • SUMMARY OF THE INVENTION
  • The main objective of the present invention is to provide a thermal conductor with an ultra-thin flat wick structure, in which the thinned wick structure can be formed on the inner wall of the thermal conductor such that the steam channels can be maintained to provide sufficient space for heat transfer by evaporation and condensation after the ultra-thin thermal conductor is pressed and formed, to provide the maximal capillary surface area and truncated transfer surface, and to provide more solid internal support structures to make the heat pipe not easy to collapse and have lower thermal contact resistance, achieving the objective of providing an ultra-thin thermal conductor.
  • To achieve the above objective, the present invention provides a thermal conductor with an ultra-thin flat wick structure, comprising a hollow shell having a flat shape, and a wick structure disposed in the shell and contacted with an inner wall of the shell. The wick structure is a thin planar body having a plane and a pressing surface opposite to the plane. The plane is attached to the inner wall of the shell. A plurality of elongated concave surfaces are spacedly arranged on the pressing surface such that a steam channel is formed in the shell via each of the concave surfaces and an elongated wick structure connection is formed between each concave surface and the plane.
    • BRIEF DESCRIPTION OF DRAWING
  • FIG. 1 is a perspective schematic view of the present invention;
  • FIG. 2 is a cross-sectional schematic view along line 2-2 of FIG. 1;
  • FIG. 3 is a perspective schematic view of the wick structure of the present invention;
  • FIG. 4 is a cross-sectional schematic view of the wick structure according to the second embodiment of the present invention;
  • FIG. 5 is a cross-sectional schematic view of the wick structure according to the third embodiment of the present invention;
  • FIG. 6 is a cross-sectional schematic view of the wick structure according to the fourth embodiment of the present invention;
  • FIG. 7 is a cross-sectional schematic view of another embodiment of the present invention along a longitudinal direction thereof;
  • FIG. 8 is a perspective schematic view of the wick structure according to the fifth embodiment of the present invention;
  • FIG. 9 is a perspective schematic view of the wick structure according to the sixth embodiment of the present invention; and
  • FIG. 10 is a cross-sectional schematic view according to another embodiment of the present invention.
    •  DETAILED DESCRIPTION OF THE INVENTION
  • To make examiners understand the features and technical contents regarding the present invention, please refer to the following detailed description and attached figures. However, the attached figures are only used for reference and explanation, not to limit the present invention.
  • Please refer to FIG. 1, which is a perspective schematic view of the present invention. The present invention provides a thermal conductor with an ultra-thin flat wick structure, comprising a hollow shell 1 having a flat shape, and at least one wick structure 2 disposed in the shell 1 and contacted with an inner wall of the shell 1.
  • As shown in FIGS. 1 and 2, the shell 1 may be formed to have the flat shape by manufacturing processes such as pressing. The thickness T of the external contour of the shell 1 may be formed below 0.5 mm by pressing. In the embodiment of the present invention, after the shell 1 is pressed, it has an upper wall 10, a lower wall 11 spaced with and opposite to the upper wall 10, and side edges 12 surrounding the outer edges of the upper wall 10 and the lower wall 11.
  • Please refer to FIGS. 2 and 3. The wick structure 2 may be braid, fiber, sintered metal powder, or any combination thereof to form a thin planar body. The wick structure 2 is disposed in the above-mentioned shell 1 and has a plane 20 attached to an inner wall 110 of the shell 1 and a pressing surface 21 attached to another inner wall 100. A plurality of elongated concave surfaces 210 are evenly or unevenly spacedly arranged on the pressing surface 21 by pressing. The concave surfaces 210 are extended and disposed along a longitudinal direction of the wick structure 2 such that a respective steam channel 101 is formed in the shell 1 via each of the concave surfaces 210. Also, a respective elongated wick structure connection 200 is formed between each concave surface 210 and the plane 20 of the wick structure 2. Furthermore, the thickness t1 of the wick structure 2 is below about 0.25 mm and the minimum thickness t2 of the respective elongated wick structure connection 200 ranges about from 0.02 mm to 0.04 mm.
  • Further, as shown in FIG. 2, each of the concave surfaces 210 may have a shape of an arc; as also shown in FIGS. 4-6, each concave surface 210 many have a shape of a “V”, a rectangle, or a trapezoid. As shown in FIG. 7, viewed cross-sectionally along a longitudinal direction of the wick structure 2, each concave surface 210 gradually expands or shrinks along a longitudinal direction of the wick structure 2.
  • In addition, as shown in FIG. 8, each concave surface 210 of the wick structure 2 of the present invention may have the penetrated heat transfer holes 211 to enhance heat transfer. Also, as shown in FIG. 9, a plurality of recesses 212 may be recessed and disposed between the respective concave surfaces 210 by the above-mentioned pressing such that after the wick structure 2 is placed into the shell 1, the adjacent formed steam channels 101 can communicate with each other.
  • Moreover, as shown in FIG. 10, the present invention further comprises another wick structure 2 such that the two above-mentioned wick structures 2 are stacked up and down with respective concave surfaces 210 facing to each other to form the steam channels 101.
  • In summary, the present invention indeed achieves the expected objective of use and overcomes the disadvantages of the prior art. In addition, the present invention is useful, novel and non-obvious, which meets the requirements of patent application. Please examine the application carefully and grant it a patent for protecting the rights of the inventor.
  • The embodiments described above are only preferred ones and not to limit the scope of appending claims regarding the present invention. Therefore, all the modifications of equivalent technology and means which apply the specification and figures of the present invention are embraced by the scope of the present invention.

Claims (12)

What is claimed is:
1. A thermal conductor with an ultra-thin flat wick structure (2), comprising:
a hollow shell (1) having a flat shape; and
a wick structure (2) disposed in the shell (1) and contacted with an inner wall (100) of the shell (2),
wherein the wick structure (2) is a thin planar body having a plane (20) and a pressing surface (21) opposite to the plane (20), wherein the plane (20) is attached to the inner wall (100) of the shell (1), wherein a plurality of elongated concave surfaces (210) are spacedly arranged on the pressing surface (21) such that a respective steam channel (101) is formed in the shell (1) via each of the concave surfaces (210) and a respective elongated wick structure connection (200) is formed between each concave surface (210) and the plane (20).
2. The thermal conductor according to claim 1, wherein the shell (1) further comprises another wick structure (2) such that the two wick structures (2) are stacked up and down with respective concave surfaces (210) facing to each other to form the steam channel (101).
3. The thermal conductor according to claim 1, wherein an external contour of the shell (1) has a thickness below 0.5 mm.
4. The thermal conductor according to claim 1, wherein each concave surface (210) of the wick structure (2) has penetrated heat transfer holes (211).
5. The thermal conductor according to claim 1, wherein a plurality of recesses (212) are recessed and disposed on each concave surface (210) to make the adjacent steam channels (101) communicate with each other.
6. The thermal conductor according to claim 1, wherein each concave surface (210) of the wick structure (2) has a shape of an “V”, an arc, a rectangle, or a trapezoid.
7. The thermal conductor according to claim 1, wherein each concave surface (210) gradually expands or shrinks along a longitudinal direction of the wick structure (2).
8. The thermal conductor according to claim 1, wherein each concave surface (210) is extended and disposed along a longitudinal direction of the wick structure (2).
9. The thermal conductor according to claim 1, wherein a thickness of the wick structure (2) is below 0.25 mm.
10. The thermal conductor according to claim 9, wherein a minimum thickness of the respective elongated wick structure connection (200) ranges from 0.02 mm to 0.04 mm.
11. The thermal conductor according to claim 10, wherein the shell (1) has an upper wall (10), a lower wall (11) spaced with and opposite to the upper wall (10), and side edges (12) surrounding the outer edges of the upper wall (10) and the lower wall (11).
12. The thermal conductor according to claim 11, wherein the wick structure (2) is braid, fiber, sintered metal powder, or any combination thereof
US14/054,104 2013-10-15 2013-10-15 Thermal conductor with ultra-thin flat wick structure Abandoned US20150101783A1 (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20190264986A1 (en) * 2018-02-27 2019-08-29 Auras Technology Co., Ltd. Heat dissipation device
WO2022097417A1 (en) * 2020-11-04 2022-05-12 株式会社村田製作所 Heat spreading device

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US7143818B2 (en) * 2003-09-02 2006-12-05 Thermal Corp. Heat pipe evaporator with porous valve
US20070107878A1 (en) * 2005-11-17 2007-05-17 Foxconn Technology Co., Ltd. Heat pipe with a tube therein
US20070114008A1 (en) * 2005-11-18 2007-05-24 Foxconn Technology Co., Ltd. Heat pipe
US20090084526A1 (en) * 2007-09-28 2009-04-02 Foxconn Technology Co., Ltd. Heat pipe with composite wick structure
US20100157534A1 (en) * 2008-12-24 2010-06-24 Sony Corporation Heat-transporting device and electronic apparatus
US20100266864A1 (en) * 2009-04-16 2010-10-21 Yeh-Chiang Technology Corp. Ultra-thin heat pipe
US20120048516A1 (en) * 2010-08-27 2012-03-01 Forcecon Technology Co., Ltd. Flat heat pipe with composite capillary structure
US20120180994A1 (en) * 2011-01-18 2012-07-19 Asia Vital Components Co., Ltd. Heat pipe structure
US20120180995A1 (en) * 2011-01-18 2012-07-19 Asia Vital Components Co., Ltd. Thin heat pipe structure and method of manufacturing same
US20120211202A1 (en) * 2011-02-18 2012-08-23 Asia Vital Components Co., Ltd. Low-profile heat transfer device
US20120279687A1 (en) * 2011-05-05 2012-11-08 Celsia Technologies Taiwan, I Flat-type heat pipe and wick structure thereof

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7143818B2 (en) * 2003-09-02 2006-12-05 Thermal Corp. Heat pipe evaporator with porous valve
US20070107878A1 (en) * 2005-11-17 2007-05-17 Foxconn Technology Co., Ltd. Heat pipe with a tube therein
US20070114008A1 (en) * 2005-11-18 2007-05-24 Foxconn Technology Co., Ltd. Heat pipe
US20090084526A1 (en) * 2007-09-28 2009-04-02 Foxconn Technology Co., Ltd. Heat pipe with composite wick structure
US20100157534A1 (en) * 2008-12-24 2010-06-24 Sony Corporation Heat-transporting device and electronic apparatus
US20100266864A1 (en) * 2009-04-16 2010-10-21 Yeh-Chiang Technology Corp. Ultra-thin heat pipe
US20120048516A1 (en) * 2010-08-27 2012-03-01 Forcecon Technology Co., Ltd. Flat heat pipe with composite capillary structure
US20120180994A1 (en) * 2011-01-18 2012-07-19 Asia Vital Components Co., Ltd. Heat pipe structure
US20120180995A1 (en) * 2011-01-18 2012-07-19 Asia Vital Components Co., Ltd. Thin heat pipe structure and method of manufacturing same
US20120211202A1 (en) * 2011-02-18 2012-08-23 Asia Vital Components Co., Ltd. Low-profile heat transfer device
US20120279687A1 (en) * 2011-05-05 2012-11-08 Celsia Technologies Taiwan, I Flat-type heat pipe and wick structure thereof

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20190264986A1 (en) * 2018-02-27 2019-08-29 Auras Technology Co., Ltd. Heat dissipation device
WO2022097417A1 (en) * 2020-11-04 2022-05-12 株式会社村田製作所 Heat spreading device
JPWO2022097417A1 (en) * 2020-11-04 2022-05-12
TWI790794B (en) * 2020-11-04 2023-01-21 日商村田製作所股份有限公司 Vapor Chambers and Electronic Machinery Equipped with Vapor Chambers
JP7283641B2 (en) 2020-11-04 2023-05-30 株式会社村田製作所 heat spreading device

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