US20150042728A1 - Actuator, liquid ejecting head, and liquid ejecting apparatus - Google Patents
Actuator, liquid ejecting head, and liquid ejecting apparatus Download PDFInfo
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- US20150042728A1 US20150042728A1 US14/489,859 US201414489859A US2015042728A1 US 20150042728 A1 US20150042728 A1 US 20150042728A1 US 201414489859 A US201414489859 A US 201414489859A US 2015042728 A1 US2015042728 A1 US 2015042728A1
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- United States
- Prior art keywords
- conductive layer
- layer
- conductive
- liquid ejecting
- actuator
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2/14201—Structure of print heads with piezoelectric elements
- B41J2/14233—Structure of print heads with piezoelectric elements of film type, deformed by bending and disposed on a diaphragm
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/20—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators
- H10N30/204—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators using bending displacement, e.g. unimorph, bimorph or multimorph cantilever or membrane benders
- H10N30/2047—Membrane type
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/87—Electrodes or interconnections, e.g. leads or terminals
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/87—Electrodes or interconnections, e.g. leads or terminals
- H10N30/875—Further connection or lead arrangements, e.g. flexible wiring boards, terminal pins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2/14201—Structure of print heads with piezoelectric elements
- B41J2/14233—Structure of print heads with piezoelectric elements of film type, deformed by bending and disposed on a diaphragm
- B41J2002/14241—Structure of print heads with piezoelectric elements of film type, deformed by bending and disposed on a diaphragm having a cover around the piezoelectric thin film element
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2002/14491—Electrical connection
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2202/00—Embodiments of or processes related to ink-jet or thermal heads
- B41J2202/01—Embodiments of or processes related to ink-jet heads
- B41J2202/18—Electrical connection established using vias
Landscapes
- Particle Formation And Scattering Control In Inkjet Printers (AREA)
Abstract
An actuator includes a vibration plate, a first conductive layer formed on an upper surface of the vibration plate and extending in a predetermined direction, a piezoelectric layer covering the first conductive layer, a second conductive layer formed on an upper surface of the piezoelectric layer, a metal layer formed on the upper surface of the vibration plate and on an upper surface of the second conductive layer, and an electrode electrically connected to the metal layer. The first conductive layer, the second conductive layer, and the piezoelectric layer interposed between the first and second conductive layers form a driving unit. A plurality of the driving units are disposed in a direction perpendicular to the predetermined direction. The metal layer intersects a plurality of the second conductive layers so as to electrically connect the plurality of second conductive layers.
Description
- The present application is a Continuation of U.S. patent application Ser. No. 12/953,651, filed on Nov. 24, 2010, which claims priority to Japanese Patent Application No. 2009-268613, filed Nov. 26, 2009, which applications are expressly incorporated herein by reference.
- 1. Technical Field
- The present invention relates to an actuator, a liquid ejecting head, and a liquid ejecting apparatus. More specifically, the present invention relates to an actuator, liquid ejecting head, and a liquid ejecting apparatus which includes a plurality of driving units which are connected together at a low resistance.
- 2. Related Art
- In various liquid ejecting apparatuses currently used in the art, such as ink jet printers, actuators are used which include a piezoelectric element which causes the apparatus to eject liquid droplets such as ink. The piezoelectric element can function as a driving unit displacing a vibration plate, for example. Such an actuator is provided with a plurality of pressure chambers. Moreover, a driving unit is disposed on a vibration plate in each pressure chamber.
- Typically, in the actuator including the plurality of driving units, one electrode of the driving unit serves as an individual electrode and the other electrode of the driving unit serves as a common electrode and also electrically connects the plurality of driving units to each other. For example, in the Japanese Patent Document No. JP-A-2005-88441, an upper electrode film serves as an individual electrode while a lower electrode film is disposed to extend from one end portion of a pressure chamber in a longitudinal direction to a circumferential wall and is connected on the circumferential wall so as to serve as a common electrode. In this way, the plurality of piezoelectric elements can be electrically connected to each other. In the actuator including the plurality of driving units, it is preferable that the plurality of driving units are connected to each other at a low resistance.
- An advantage of some aspects of the invention is that it provides an actuator capable of connecting a plurality of driving units to each other at a low resistance. Another advantage of some aspects of the invention is that it provides a liquid ejecting head including the actuator and a liquid ejecting apparatus.
- A first aspect of the invention is an actuator including a vibration plate, a first conductive layer formed on an upper surface of the vibration plate and extending in a predetermined direction, a piezoelectric layer covering the first conductive layer, a second conductive layer formed on an upper surface of the piezoelectric layer, a metal layer formed on the upper surface of the vibration plate and on an upper surface of the second conductive layer, and an electrode electrically connected to the metal layer. The first conductive layer, the second conductive layer, and the piezoelectric layer interposed between the first and second conductive layers form a driving unit. A plurality of the driving units are disposed in a direction perpendicular to the predetermined direction. The metal layer intersects a plurality of the second conductive layers so as to be electrically connected to the plurality of second conductive layers.
- According to the actuator having the configuration, the plurality of second conductive layers can be electrically connected to each other by the metal layer. Accordingly, the plurality of driving units can be connected to each other at a low resistance.
- In the description of the aspect of the invention, the term, the “upper surface”, is used as in “another specific member (hereinafter, referred to as “B”) is formed on the “upper surface” of a specific member (hereinafter, referred to as “A”)”. In the description of the aspect of the invention, in this case, the term, the “upper surface” is used in a case where B is directly formed on A and a case where B is formed on A with another member interposed therebetween.
- In the actuator described above, the manufacturing process can be simplified.
- Another aspect of the invention is a liquid ejecting head including the actuator described above and a pressure chamber which communicates with a nozzle hole and of which a volume is varied by an operation of the actuator.
- According to the liquid ejecting head, the plurality of driving units can be connected to each other at a low resistance since the liquid ejecting head includes the actuator according to the above aspect of the invention.
- According to still another aspect of the invention, there is provided a liquid ejecting apparatus including the liquid ejecting head according to the above aspect of the invention.
- According to the liquid ejecting apparatus, the plurality of driving units can be connected to each other at a low resistance since the liquid ejecting apparatus includes the liquid ejecting head according to the above aspect of the invention.
- The invention will be described with reference to the accompanying drawings, wherein like numbers reference like elements.
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FIG. 1 is an exploded perspective view schematically illustrating a liquid ejecting head according to one embodiment of the invention; -
FIG. 2A is a plan view schematically illustrating main units of the liquid ejecting head according to the embodiment; -
FIG. 2B is a sectional view schematically illustrating the main units of the liquid ejecting head according to the embodiment; -
FIG. 2C is a sectional view schematically illustrating the main units of the liquid ejecting head according to the embodiment; -
FIG. 2D is a sectional view schematically illustrating the main units of the liquid ejecting head according to the embodiment; -
FIG. 3 is a sectional view schematically illustrating a process of manufacturing the liquid ejecting head according to the embodiment; -
FIG. 4 is a sectional view schematically illustrating a process of manufacturing the liquid ejecting head according to the embodiment; -
FIG. 5 is a sectional view schematically illustrating a process of manufacturing the liquid ejecting head according to the embodiment; -
FIG. 6 is a sectional view schematically illustrating a process of manufacturing the liquid ejecting head according to the embodiment; -
FIG. 7 is a sectional view schematically illustrating a process of manufacturing the liquid ejecting head according to the embodiment; and -
FIG. 8 is a perspective view schematically illustrating a liquid ejecting apparatus according to the embodiment. - Hereinafter, a preferred embodiment of the invention will be described with reference to the drawings.
- First, an
actuator 100 and a liquid ejectinghead 1000 according to an embodiment will be described. Here, a case where theactuator 100 is used in the liquid ejectinghead 1000 as an example of anactuator 100 will be described. The usage of theactuator 100 is not limited to the liquid ejecting head and other uses may be envisioned which do not depart from the scope of the claims. -
FIG. 1 is an exploded perspective view schematically illustrating the liquid ejectinghead 1000 including theactuator 100 according to this embodiment.FIG. 2A is a plan view schematically illustrating apassage forming plate 10 and theactuator 100 as the main units of the liquid ejectinghead 1000.FIG. 2B is a sectional view taken along the line IIB-IIB ofFIG. 2A .FIG. 2C is a sectional view taken along the line IIC-IIC ofFIG. 2A .FIG. 2D is a sectional view taken along the line IID-IID ofFIG. 2A . - The
liquid ejecting head 1000 includes anactuator 100 andpressure chambers 11 which respectively communicate withnozzle holes 21 and of which a volume is varied by the operation of theactuator 100, as shown inFIG. 1 andFIGS. 2A to 2D . Theliquid ejecting head 1000 includes, for example, thepassage forming plate 10, anozzle plate 20, and a sealingplate 40. Theactuator 100 includes avibration plate 110, drivingunits 120, metal layers (afirst metal layer 130 and a second metal layer 132), an electrode (hereinafter, referred to as a “common electrode”) 140, and leadelectrodes 160. The drivingunit 120 includes a firstconductive layer 122, a secondconductive layer 126, and apiezoelectric layer 124 interposed between the firstconductive layer 122 and the secondconductive layer 126. - The
passage forming plate 10 includes thepressure chambers 11. As shown inFIG. 1 , thepassage forming plate 10 includeswall sections 12 forming a side wall of thepressure chamber 11. Thepassage forming plate 10 may include areservoir 15 communicating with thepressure chambers 11 viasupply passages 13 and communication passages 14. A throughhole 16 may be formed in thereservoir 15. A liquid may be supplied from the outside of theliquid ejecting head 100 to thereservoir 15 via the throughhole 16. When the liquid is supplied to thereservoir 15, the liquid can be supplied to thepressure chambers 11 via thesupply passages 13 and the communication passages 14. The shape of thepressure chamber 11 is not particularly limited. For example, thepressure chamber 11 may have a parallelogram or rectangular shape in a plan view. Additionally, the number ofpressure chambers 11 is not particularly limited. One or a plurality of pressure chambers may be disposed. Furthermore, the material of thepassage forming plate 10 is not particularly limited. Thepassage forming plate 10 is formed of, for example, single crystal silicon, nickel, stainless, stainless steel, or glass ceramic. - The
nozzle plate 20 is formed on the lower surface of thepassage forming plate 10, as shown inFIG. 1 . Thenozzle plate 20 is a plate-shaped member and has nozzle holes 21. Thenozzle hole 21 is formed to communicate with thepressure chamber 11. The shape of thenozzle hole 21 is not particularly limited, as long as the liquid is ejected from thenozzle hole 21. For example, the liquid in thepressure chamber 11 can be ejected toward the lower side of thenozzle plate 20 via thenozzle hole 21. The number of nozzle holes 21 is not particularly limited. One or more of nozzle holes 21 may be formed. The material of thenozzle plate 20 is not particularly limited. Thenozzle plate 20 is formed of, for example, single crystal silicon, nickel, stainless, stainless steel, or glass ceramic. - The
actuator 100 is formed on thepassage forming plate 10, as shown inFIG. 1 . The drivingunit 120 of theactuator 100 includes the firstconductive layer 122, the secondconductive layer 126, and thepiezoelectric layer 124 interposed between the firstconductive layer 122 and the secondconductive layer 126. In theactuator 100, the drivingunit 120 is electrically connected to anexternal driving circuit 50 and is moved (vibrated or deformed) based on a signal of theexternal driving circuit 50. Thevibration plate 110 is displaced by the operation of the drivingunits 120 to change the internal pressure of thepressure chamber 11 appropriately. The plurality of drivingunits 120 is disposed in the plurality ofpressure chambers 11, respectively. As shown inFIG. 2A , the plurality of drivingunits 120 is disposed in a first direction A which is perpendicular to a longitudinal direction of the firstconductive layer 122. - The
vibration plate 110 is formed on thepassage forming plate 10, as shown inFIG. 1 andFIGS. 2A to 2D . For example, thevibration plate 110 is a plate-shaped member. The configuration and material of thevibration plate 110 are not particularly limited. In the example ofFIG. 2B , thevibration plate 110 includes afirst layer 110 a and asecond layer 110 b. Thefirst layer 110 a is formed of, for example, zirconium oxide. Thesecond layer 110 b is formed of, for example, silicon oxide. The material of thevibration plate 110 is not limited thereto and other materials may be used without departing from the meaning or scope of the claims. For example, a single layer structure of an insulation film formed of zirconium oxide or silicon oxide, a metal layer formed of nickel or the like, or a polymer material film formed of polyimide or the like or a lamination structure of a plurality of materials. Thevibration plate 110 can vibrate (be deformed) by deformation of thedriving unit 120. In this way, the volume of thepressure chamber 11 formed in the downward direction can be changed. - The first
conductive layer 122 is formed on the upper surface of thevibration plate 110. As shown inFIG. 2A , the firstconductive layer 122 is formed to extend in a second direction B. Examples of the material of the firstconductive layer 122 include various kinds of metal such as nickel, iridium, and platinum, a conductive oxide (for example, iridium oxide), a composite oxide (SrRuOX: SRO) of strontium and ruthenium, and a composite oxide (LaNiOX: LNO) of lanthanum and nickel. The firstconductive layer 122 may have a single structure of the exemplified material or a lamination structure composed of a plurality of layers of material(s). An adhesion layer or the like may be formed between the firstconductive layer 122 and thevibration plate 110. For example, a titanium layer may be used as the adhesion layer. For example, the thickness of the firstconductive layer 122 is in the range from 50 nm to 300 nm. As shown inFIG. 2C , the firstconductive layer 122 includes a firstconductive portion 123 a of thedriving unit 120. One function of the firstconductive portion 123 a is as an electrode (a lower electrode formed on the lower side of the piezoelectric layer 124) applying a voltage to thepiezoelectric layer 124. The firstconductive portion 123 a is a region overlapping with the secondconductive layer 126 via thepiezoelectric layer 124, when viewed in the thickness direction of thevibration plate 110. The firstconductive layer 122 may include a secondconductive portion 123 b. The secondconductive portion 123 b functions as connecting thelead electrode 160 electrically to the firstconductive portion 123 a. In the illustrated example, the secondconductive portion 123 b extends from the firstconductive portion 123 a to anopening 150. For example, theactuator 100 may have a metal film 101 (seeFIGS. 2C and 2D ) in the region overlapping with thecommon electrode 140, when viewed in the thickness direction of thevibration plate 110. For example, themetal layer 101 may not be electrically connected to any member. - The
piezoelectric layer 124 is formed to cover the firstconductive layer 122. As shown inFIG. 2B , thepiezoelectric layer 124 covers the upper surface and side surfaces of the firstconductive layer 122 and the upper surface of thevibration plate 110. Another layer may be formed between thepiezoelectric layer 124 and the firstconductive layer 122. For example, an alignment control layer (for example, a titanium layer) may be formed as another layer to control alignment of the crystal of thepiezoelectric layer 124. The thickness of thepiezoelectric layer 124 is in the range from 300 nm to 3000 nm, for example. When the thickness of thepiezoelectric layer 124 is not in this range, the necessary expansion and contraction when thevibration plate 110 is deformed may not be obtained. - The
piezoelectric layer 124 includes anupper surface 124 a and aside surface 124 b connected to theupper surface 124 a. In the example ofFIG. 2B , theupper surface 124 a of thepiezoelectric layer 124 is a flat surface and is substantially parallel to the upper surface of thevibration plate 110. Theupper surface 124 a of thepiezoelectric layer 124 is not necessarily limited to the flat surface, but may have a convex shape to which the shape of the firstconductive layer 122 of an underlying layer is reflected. Theside surface 124 b of thepiezoelectric layer 124 is a surface connecting theupper surface 124 a of thepiezoelectric layer 124 to the upper surface of thevibration layer 110. Theside surface 124 b of thepiezoelectric layer 124 may be formed as one flat surface or may include a plurality of flat surfaces. Theside surface 124 b of thepiezoelectric layer 124 may include a curved surface. - The
piezoelectric layer 124 is formed of a piezoelectric material. Therefore, thepiezoelectric layer 124 is deformable when an electric field is applied by the firstconductive layer 122 and the secondconductive layer 126. Thevibration plate 110 can sag or vibrate by the deformation. Thepiezoelectric layer 124 includes afirst region 125 a interposed between the firstconductive layer 122 and the secondconductive layer 126, when viewed in the thickness direction of thevibration plate 110. Thefirst region 125 a of thepiezoelectric layer 124, the firstconductive layer 122, and the secondconductive layer 126 form thedriving unit 120. The drivingunit 120 serves as a piezoelectric element in such a manner that thepiezoelectric layer 124 is interposed between the twoconductive layers piezoelectric layer 124 may also include asecond region 125 b. Thesecond region 125 b may be a region other than thefirst region 125 a of thepiezoelectric layer 124. That is, thesecond region 125 b may be a region to which the electric field is not applied by the firstconductive layer 122 and the secondconductive layer 126. As shown inFIG. 2C , for example, theopening 150 is formed in thesecond region 125 b. With such a configuration, the firstconductive layer 122 and thelead electrode 160 may be electrically connected to each other. - A perovskite type oxide expressed as a general expression ABO3 (for example, A includes Pb and B includes Zr and Ti) is very suitable for the material of the
piezoelectric layer 124. Specific examples of this material include lead zirconate titanate (Pb(Zr, Ti)O3) (hereinafter, abbreviated to PZT), barium titanate (BaTiO3), and niobium acid potassium sodium ((K, Na) NbO3). Among these materials, PZT is very suitable as the material of thepiezoelectric layer 124, since the piezoelectric characteristic is good. - The second
conductive layer 126 is formed on the upper surface of thepiezoelectric layer 124. The secondconductive layer 126 may be formed on theupper surface 124 a of thepiezoelectric layer 124. The secondconductive layer 126 extends in the second direction B. The length of the secondconductive layer 126 in the second direction B is equal to the length of thefirst region 125 a in the second direction B, as shown inFIG. 2C . The thickness of the secondconductive layer 126 is not particularly limited. For example, the thickness of the secondconductive layer 126 may be in the range from 20 nm to 200 nm. One of the functions of the secondconductive layer 126 is the other electrode (an upper electrode formed in the upper portion of the piezoelectric layer 124) applying a voltage to thepiezoelectric layer 124. Examples of the material of the secondconductive layer 126 include various kinds of metal such as nickel, iridium, platinum, tungsten, and gold, conductive oxides (for example, iridium oxide) thereof, SrRuO3, and LaNiO3. The secondconductive layer 126 may have a structure of a single layer or a lamination structure consisting of a plurality of layers. - Since the second
conductive layer 126 is formed on theupper surface 124 a of thepiezoelectric layer 124, the secondconductive layer 126 is not formed on theside surface 124 b of thepiezoelectric layer 124 and thevibration plate 110. In theactuator 100, it is preferable that thevibration plate 110 before voltage application is located on the upper surface. Therefore, since the deformation of thevibration plate 110 necessary for obtaining the same displacement amount can be suppressed as small as possible, it is possible to prevent breakage caused by the deformation of thevibration plate 110 at the time of voltage application. However, since thepiezoelectric layer 124 formed of a sol-gel method or the like generally has a tension stress, it is easy for thevibration plate 110 before voltage application to be located on the lower side. Here, the secondconductive layer 126 is formed by a sputter method, and thus generally has a compression stress. For this reason, in theactuator 100, the tension stress of thepiezoelectric layer 124 is cancelled, when the secondconductive layer 126 is formed on the upper surface of thepiezoelectric layer 124. Therefore, thevibration plate 110 before the voltage application can be operated so as to be located on the upper surface. When the secondconductive layer 126 is not formed on theside surface 124 b of thepiezoelectric layer 124 and on thevibration plate 110, thevibration plate 110 before the voltage application is not operated so as to be located on the lower side. Therefore, by forming the secondconductive layer 126 on the upper surface of thepiezoelectric layer 124 and not forming the secondconductive layer 126 on theside surface 124 b of thepiezoelectric layer 124 and on thevibration plate 110, thevibration plate 110 before the voltage application can be located on the upper surface. Accordingly, it is possible to prevent the breakage caused by the deformation of thevibration plate 110 at the time of voltage application. - The metal layers 130 and 132 intersect the second
conductive layers 126 of the plurality of drivingunits 120. In the example ofFIG. 2A , the metal layers 130 and 132 extend in the first direction A to intersect the secondconductive layers 126 of the plurality of drivingunits 120. The metal layers 130 and 132 may be formed of a layer with conductivity. Therefore, the secondconductive layers 126 of the plurality of drivingunits 120 can be electrically connected to each other. As shown inFIG. 1 , the metal layers 130 and 132 are electrically connected to thecommon electrode 140 in the ends of the metal layers 130 and 132 in the first direction A. The resistances of the metal layers 130 and 132 can be easily controlled by a width W (seeFIG. 2A ) and a thickness T (seeFIG. 2B ). That is, by enlarging the width W or thickening the thickness T, the resistances of the metal layers 130 and 132 can be reduced. A plurality of the metal layers 130 and 132 may be provided. By increasing the number ofmetal layers conductive layers 126 can be connected to each other at a lower resistance. When the metal layers 130 and 132 are disposed, the displacement of theactuator 100 is disturbed. Therefore, the numbers ofmetal layers common electrode 140, and thelead electrode 160 can be formed in the same process, as described below, the metal layers 130 and 132, thecommon electrode 140, and thelead electrode 160 can be manufactured by a simple and easy process. The structure of the metal layers 130 and 132 is not limited to the lamination structure of nickel-chrome alloy and gold. For example, a single-layer structure or a lamination structure of nickel-chrome alloy, gold, platinum (Pt), iridium (Ir), and the like may be used. - The metal layers 130 and 132 are formed on the upper surface of the
vibration plate 110 and on the upper surface of the secondconductive layer 126. In the example ofFIG. 2B , the metal layers 130 and 132 are formed on thevibration plate 110, theside surface 124 b of thepiezoelectric layer 124, and the upper surface of the secondconductive layer 126. By forming the metal layers 130 and 132 on the secondconductive layer 126, thepiezoelectric layer 124 can be prevented from being deformed. In the illustrated example, twometal layers first metal layer 130 and thesecond metal layer 132 are formed, but the number of metal layers is not limited. As shown inFIG. 2C , thefirst metal layer 130 is formed on the secondconductive layer 126 and is located close to afirst end surface 126 a which is one side of the secondconductive layer 126. Thesecond metal layer 132 is formed on the secondconductive layer 126 and is located close to asecond end surface 126 b which is the other side of the secondconductive layer 126. With such a configuration, thepiezoelectric layer 124 can be prevented from being displaced near the end surfaces 126 a and 126 b which are regions where the excessive stress is focused due to the deformation of thepiezoelectric layer 124. It is preferable that the distance between thefirst metal layer 130 and thefirst end surface 126 a and the distance between thesecond metal layer 132 and thesecond end surface 126 b are small. In this way, thepiezoelectric layer 124 can be further prevented from being displaced. Since the metal layers 130 and 132 are formed in the regions excluding a central region C (seeFIG. 2C ) of thefirst region 125 a in a plan view, the displacement of the piezoelectric layer in the vicinity of the central region C is not disturbed. Here, the end surfaces 126 a and 126 b may be both end surfaces of the secondconductive layer 126 in the second direction B. When the secondconductive layer 126 is continuously formed with other layers (not shown), the end surfaces 126 a and 126 b of the secondconductive layer 126 may be present in surfaces which are not exposed. It can be considered that thefirst metal layer 130 is, for example, formed on the secondconductive layer 126 and is located near one end portion of the secondconductive layer 126 and thesecond metal layer 132 is, for example, formed on the secondconductive layer 126 and is located near the other end portion of the secondconductive layer 126. The metal layers 130 and 132 can control the deformation degree of thepiezoelectric layer 124 depending on the width W and the thickness T of the metal layers 130 and 132. That is, by enlarging the width W of the metal layers 130 and 132 and thickening the thickness T of the metal layers 130 and 132, thepiezoelectric layer 124 can be further prevented from being deformed. - As shown in
FIG. 2C , thefirst metal layer 130 and thesecond metal layer 132 may be disposed at the position at which the distances between the central region C and therespective metal layers driving unit 120, stress is not focused on a part of theactuator 100 and theactuator 100 with a good rigidity balance can be obtained. In the illustrated example, the metal layers 130 and 132 are formed on the secondconductive layer 126 so as to be close to the end surfaces 126 a and 126 b, respectively, as described above. However, the positions at which the metal layers 130 and the 132 are formed on the secondconductive layer 126 are not particularly limited. - The metal layers 130 and 132 may have
extension portions first metal layer 130 may have thefirst extension portion 131 and thesecond metal layer 132 may have thesecond extension portion 133. Thefirst extension portion 131 is formed between theadjacent driving units 120, as shown inFIG. 2A . Thefirst extension portion 131 extends from thefirst metal layer 130 extending in the first direction A to thefirst end surface 126 a of the secondconductive layer 126. Thefirst extension portion 131 extends toward the outside of the region, where the plurality of drivingunits 120 is formed, further outside than thefirst end surface 126 a in a plan view (seeFIG. 2A ). Thefirst extension portion 131 continues to be formed to thecommon electrode 140, as shown inFIG. 2D . That is, thefirst metal layer 130 can be electrically connected to thecommon electrode 140 by thefirst extension portion 131. In this way, the plurality of secondconductive layers 126 can be connected at a lower resistance. Thesecond extension portion 133 is formed between theadjacent driving units 120, as shown inFIG. 2A . Thesecond extension portion 133 extends from thesecond metal layer 132 extending in the first direction A to thesecond end surface 126 b of the secondconductive layer 126. Thesecond extension portion 133 extends toward the outside of the region, where the plurality of drivingunits 120 are formed, further outside than thesecond end surface 126 b in a plan view (seeFIG. 2A ). That is, thefirst extension portion 131 extends in the direction opposite to the direction in which thesecond metal layer 132 extends in a plan view. Therefore, thesecond extension portion 133 extends in the direction opposite to the direction in which thefirst metal layer 130 extends. Thefirst extension portion 131 and thesecond extension portion 133 extend from the metal layers 130 and 132 in the second direction B in opposite directions. Therefore, it is possible to suppress focus on the stress caused by addition of the rigidity of only the vicinity of thefirst extension portion 131 of thevibration plate 110 when only thefirst extension portion 131 is formed. In theactuator 100, the rigidity can be satisfactorily balanced since theextension portions first metal layer 130 and thesecond metal layer 132, respectively. Although not illustrated, at least a part of thesecond extension portion 133 may be electrically connected to thecommon electrode 140. In this way, the plurality of secondconductive layers 126 can be connected at a lower resistance. - The
common electrode 140 is electrically connected to the metal layers 130 and 132. That is, thecommon electrode 140 is electrically connected to the plurality of secondconductive layers 126 by the metal layers 130 and 132. For example, thecommon electrode 140 is electrically connected to theexternal driving circuit 50. As shown inFIG. 2D , for example, thecommon electrode 140 is formed on the upper surface of the piezoelectric layer 124 (thesecond region 125 b). As shown inFIG. 1 , thecommon electrode 140 is formed in the periphery (outside region) of the regions where the drivingunits 120 are arranged. For example, thecommon electrode 140 can be formed from a layer with the same material as that of the metal layers 130 and 132. Thecommon electrode 140 is not limited thereto, but the common electrode may be a layer with conductivity. For example, thecommon electrode 140 may be connected to alayer 102 with the same material as that of the secondconductive layer 126. - The
lead electrode 160 is formed so as to cover at least theopening 150. Thelead electrode 160 is an electrode electrically connecting theexternal driving circuit 50 to the firstconductive portion 123 a of the firstconductive layer 122 via the secondconductive portion 123 b of the firstconductive layer 122, for example. Thelead electrode 160 may be formed of the same material as that of the metal layers 130 and 132, but the invention is not limited thereto. Aconductive portion 162 formed of the same material as that of the secondconductive layer 126 may be formed round theopening 150. - The sealing
plate 40 can seal the drivingunits 120. The sealingplate 40 has aregion 41 sealing the drivingunits 120. The size and shape of theregion 41 of the sealingplate 40 are not particularly limited, as long as theregion 41 does not disturb the deformation of the driving unit 120 (piezoelectric layer 124). The sealingplate 40 is formed of, for example, single crystal silicon, nickel, stainless, stainless steel, or glass ceramic. - The
liquid ejecting head 1000 may include a case (not shown) formed of various kinds of resin materials or various kinds of metal materials and accommodating the above-described configuration. - For example, the
actuator 100 has the following features: - In the
actuator 100, the metal layers 130 and 132 intersect the secondconductive layers 126 of the plurality of drivingunits 120 and electrically connect the plurality of secondconductive layers 126 to thecommon electrode 140. The metal layers 130 and 132 can connect the plurality of secondconductive layers 126 at a low resistance since the width W or the thickness T of the metal layers 130 and 132 can be easily controlled. By increasing the number ofmetal layers conductive layers 126 can be connected to each other at a lower resistance. According to theactuator 100, the plurality of drivingunits 120 can be connected to each other at a low resistance. - The
actuator 100 includes the metal layers 130 and 132 on the upper surface of the secondconductive layers 126. Therefore, it is possible to control the displacement of thepiezoelectric layer 124 in the periphery of the regions where the metal layers 130 and 132 are formed. According to theactuator 100, for example, it is possible to prevent the breakage caused by the excessive displacement of thepiezoelectric layer 124. Accordingly, the reliability can be improved. Moreover, thefirst metal layer 130 can be formed close to thefirst end surface 126 a of the secondconductive layer 126 and thesecond metal layer 132 can be formed close to thesecond end surface 126 b of the secondconductive layer 126. With such a configuration, it is possible to suppress the displacement of thepiezoelectric layer 124 in the region where the excessive stress caused by the deformation of thepiezoelectric layer 124 is focused. Moreover, the displacement in the vicinity of the central region C of thefirst region 125 a of thepiezoelectric layer 124 is not disturbed. - In the
actuator 100, thefirst metal layer 130 may include thefirst extension portion 131 electrically connected to thecommon electrode 140. With such a configuration, the plurality of secondconductive layers 126 can be connected to each other at a lower resistance. In theactuator 100, thesecond metal layer 132 may include thesecond extension portion 133. In theactuator 100 with such a configuration, theextension portions first metal layer 130 and thesecond metal layer 132, respectively. Therefore, the rigidity of thevibration plate 110 can be satisfactorily balanced compared to a case where theextension portion 131 is formed only in thefirst metal layer 130. Accordingly, according to theactuator 100, the reliability can be improved. - The
actuator 100 has the above-described features. Accordingly, according to theliquid ejecting head 1000 including theactuator 100, the plurality of drivingunits 120 can be connected to each other at a low resistance. Moreover, according to theliquid ejecting head 1000, theactuator 100 capable of controlling the displacement amount of thevibration plate 110 using the metal layers 130 and 132 can be used. Therefore, for example, since desired liquid droplets can be ejected, the reliability can be improved. - Next, a method of manufacturing the
actuator 100 and theliquid ejecting head 1000 according to this embodiment will be described with reference to the drawings.FIGS. 3 to 7 are sectional views schematically illustrating the method of manufacturing theactuator 100 and theliquid ejecting head 1000. - As shown in
FIG. 3 , thevibration plate 110 is first formed on, for example, asilicon substrate 1. Thevibration plate 110 is formed by a known film forming technique such as a sputter method. Thevibration plate 110 may be formed by forming a plurality of layers. Next, the firstconductive layer 122 is formed on thevibration plate 110. The firstconductive layer 122 can be formed by a sputter method, a coating method, a vacuum deposition method, or the like. More specifically, the firstconductive layer 122 can be formed by forming a conductive layer (not shown) on the entire surface of thevibration plate 110 and patterning the conductive layer. Here, an etching protective film (not shown) may be formed on the conductive layer before the conductive layer for forming the firstconductive layer 122 is patterned by etching. The etching protective film may be present in the piezoelectric layer formed of the same piezoelectric material as that of thepiezoelectric layer 124, which is described below. The etching protective film may be formed at least in the region where the firstconductive layer 122 to be patterned in a desired shape is formed. Then, in the etching process of patterning the firstconductive layer 122, the surface of the firstconductive layer 122 can be protected from the chemical damage caused by an etchant to be used. - As shown in
FIG. 4 , the piezoelectric layer 124 d is formed to cover the firstconductive layer 122. The piezoelectric layer 124 d may be formed of the same material as that of thepiezoelectric layer 124. The piezoelectric layer 124 d may be formed by, for example, a sol-gel method, a chemical vapor deposition (CVD) method, a metal organic deposition (MOD) method, a sputter method, or a laser ablation method. Here, when the material of the piezoelectric layer 124 d is PZT, for example, the piezoelectric layer 124 d can be crystallized by performing annealing at about 700° C. under an oxygen atmosphere. The crystallization may be achieved after the piezoelectric layer 124 d is patterned. When the etching protective film is formed of the same material as that of the piezoelectric layer 124 d, the etching protective film can be integrally formed with the piezoelectric layer 124 d by performing annealing. Next, a conductive layer 126 d is formed on the entire surface of the piezoelectric layer 124 d. For example, the conductive layer 126 d is formed of, for example, the same material as that of the second conductive layer 126 d. The second conductive layer 126 d may be formed by, for example, a sputter method, a coating method, or a vacuum deposition method. - As shown in
FIG. 5 , the conductive layer 126 d and the piezoelectric layer 124 d are patterned. The patterning can be performed by, for example, a known photolithography technique or a known etching technique. In this way, thepiezoelectric layer 124 is formed. Theopening 150 is formed in thepiezoelectric layer 124. Next, the conductive layer 126 d is further patterned. In this way, the secondconductive layer 126 is formed. - As shown in
FIG. 6 , the metal layers 130 and 132 including theextension portions lead electrodes 160, and thecommon electrode 140 are formed. Specifically, metal layers (not shown) are formed on the entire surfaces of the regions exposed onvibration plate 110, the firstconductive layer 122, thepiezoelectric layer 124, and the secondconductive layer 126 by a known method such as a sputter method, and then the metal layers are patterned in desired shapes by a known etching process. - By the above-described processes, the
actuator 100 can be manufactured. - Even though not illustrated, the first
conductive layer 122 in the region where the sealingplate 40 is adhered may be removed before the process shown inFIG. 6 . Thevibration plate 110 in the region where thereservoir 15 is formed may be removed. - As shown in
FIG. 7 , the sealingplate 40 is mounted on theactuator 100. In this way, the drivingunits 120 can be sealed. The sealingplate 40 can be fixed by, for example, an adhesive. Next, thesilicon substrate 1 is formed thinly so as to have a predetermined thickness, and then thepressure chambers 11, thesupply passages 13, the communication passages 14, and thereservoir 15 are formed in the silicon substrate 1 (seeFIGS. 1 and 7 ). For example, a mask (not shown) is formed on the surface opposite to the surface on which thevibration plate 110 is formed, so as to be patterned in a desired shape, and then thepressure chambers 11, thewall sections 12, thesupply passages 13, the communication passages 14, and thereservoir 15 are partitioned by etching. In this way, thepassage forming plate 10 including thepressure chambers 11 can be formed below thevibration plate 110. Next, thenozzle plate 20 including nozzle holes 21 is adhered to a predetermined position by, for example, an adhesive. In this way, the nozzle holes 21 communicate with thepressure chambers 11. - By the above-described processes, the
liquid ejecting head 1000 can be manufactured. The method of manufacturing theliquid ejecting head 1000 is not limited to the above-described manufacturing method. For example, thepassage forming plate 10 and thenozzle plate 20 may be integrally formed using an electroforming method. - According to the method of manufacturing the
liquid ejecting head 1000, the metal layers 130 and 132, thelead electrodes 160, and thecommon electrode 140 can be formed by the process of patterning the metal layers. Accordingly, the metal layers 130 and 132, thelead electrodes 160, and thecommon electrode 140 can be formed by the simple and easy process. - Next, a liquid ejecting apparatus according to this embodiment will be described. The liquid ejecting apparatus according to this embodiment includes the liquid ejecting head according to the invention. Here, an ink jet printer will be described as an example of the
liquid ejecting apparatus 1000 according to the embodiment.FIG. 8 is a perspective view schematically illustrating theliquid ejecting apparatus 10000 according to this embodiment. - The
liquid ejecting apparatus 10000 includes ahead unit 1030, a headunit driving unit 1010, and acontrol unit 1060. Theliquid ejecting apparatus 10000 may include an apparatusmain body 1020, asheet feeding unit 1050, atray 1021 accommodating a print sheet P, asheet discharging port 1022 discharging the print sheet P, and anoperation panel 1070 disposed on the surface of the apparatusmain body 1020. - The
head unit 1030 includes an ink jet print head (hereinafter, referred to as a “head”) formed from the above-describedliquid ejecting head 300. Thehead unit 1030 includes anink cartridge 1031 supplying ink to the head and a transport unit (carriage) 1032 mounting the head and theink cartridge 1031. - The head
unit driving unit 1010 can reciprocate thehead unit 1030. The headunit driving unit 1010 includes acarriage motor 1041 serving as a driving source of thehead unit 1030 and areciprocation mechanism 1042 receiving the rotation of thecarriage motor 1041 and reciprocating thehead unit 1030. - The
reciprocation mechanism 1042 includes acarriage guide shaft 1044 of which both ends are held by a frame (not shown) and atiming belt 1043 extending in parallel to thecarriage guide shaft 1044. Thecarriage guide shaft 1044 holds thecarriage 1032 so that thecarriage 1032 can reciprocate. Thecarriage 1032 is fixed to a part of thetiming belt 1043. Thehead unit 1030 is guided along thecarriage guide shaft 1044 so as to reciprocate, while thetiming belt 1043 travels by the operation of thecarriage motor 1041. During the reciprocating motion, the ink is appropriately ejected from the head and printing on the print sheet P is performed. - The
control unit 1060 can control thehead unit 1030, the headunit driving unit 1010, and thesheet feeding unit 1050. - The
feeding unit 1050 can feed the print sheet P from thetray 1021 to thehead unit 1030. Thesheet feeding unit 1050 includes asheet feeding motor 1051 serving as a driving source and asheet feeding roller 1052 rotated by the operation of thesheet feeding motor 1051. Thesheet feeding roller 1052 includes a drivenroller 1052 a and a drivingroller 1052 b vertically facing each other with the sending path of the print sheet P therebetween. The drivingroller 1052 b is connected to thesheet feeding motor 1051. When thesheet feeding unit 1050 is driven by thecontrol unit 1060, the print sheet P is sent to pass below thehead unit 1030. - The
head unit 1030, the headunit driving unit 1010, thecontrol unit 1060, and thesheet feeding unit 1050 are disposed inside the apparatusmain body 1020. - The
liquid ejecting apparatus 10000 may include theliquid ejecting head 1000. In theliquid ejecting head 1000, as described above, the plurality of drivingunits 120 can be connected to each other at a low resistance. Therefore, it is possible to realize theliquid ejecting apparatus 10000 in which the plurality of drivingunits 120 are connected to each other at a low resistance. According to theliquid ejecting head 1000, it is possible to improve reliability, since desired liquid droplets can be ejected, for example. - The ink jet printing head has hitherto been described as the liquid ejecting head. However, the liquid ejecting head according to the invention is also applicable to a color material ejecting head used to manufacture a color filter such as a liquid crystal display, an electrode material ejecting head used to form an electrode such as an organic EL display or a field emission display (FED), a bio-organism ejecting head used to manufacture a bio chip, and the like.
- The above-described embodiment and modified examples described above are illustrative only and the invention is not limited thereto. For example, the embodiment and the modified examples may be appropriately combined.
- Although the embodiment of the invention has been described in detail, the embodiment may be modified in various forms without practically departing from the novelties and advantages of the invention. Accordingly, it should be understood that the modifications are apparent to those skilled in the art, and the modifications are all included in the scope of the invention.
Claims (15)
1. An actuator comprising:
a vibration plate;
a first conductive layer formed on an upper surface of the vibration plate and extending in a predetermined direction;
a piezoelectric layer covering the first conductive layer;
a second conductive layer formed on an upper surface of the piezoelectric layer;
a metal layer formed on the upper surface of the vibration plate and on an upper surface of the second conductive layer; and
an electrode electrically connected to the metal layer,
wherein the first conductive layer, the second conductive layer, and the piezoelectric layer interposed between the first and second conductive layers form a driving unit,
wherein a plurality of the driving units are disposed in a direction perpendicular to the predetermined direction, and
wherein the metal layer intersects a plurality of the second conductive layers so as to be electrically connected to the plurality of second conductive layers.
2. The actuator according to claim 1 , wherein the metal layer comprises a plurality of metal layers.
3. The actuator according to claim 2 ,
wherein a first metal layer of a plurality of the metal layers is formed on the upper surface of the second conductive layer and is located close to one end surface of the second conductive layer, and
wherein a second metal layer of the plurality of metal layers is formed on the upper surface of the second conductive layer and is located close to the other end surface of the second conductive layer.
4. The actuator according to claim 3 ,
wherein the first metal layer includes a first extension portion formed between the adjacent driving units and extending toward the one end surface, and
wherein the first extension portion is electrically connected to the electrode.
5. The actuator according to claim 4 , wherein the second metal layer includes a second extension portion formed between the adjacent driving units and extending toward the other end surface.
6. The actuator according to claim 1 , wherein the electrode and the metal layer each have a structure in which nickel-chrome alloy and gold are laminated.
7. The actuator according to claim 3 , wherein the electrode, the first metal layer, and the second metal layer have a structure in which nickel-chrome alloy and gold are laminated.
8. A liquid ejecting head comprising:
the actuator according to claim 1 ; and
a pressure chamber which communicates with a nozzle hole and of which a volume is varied by an operation of the actuator.
9. A liquid ejecting apparatus comprising:
the liquid ejecting head according to claim 8 .
10. An actuator comprising:
a vibration plate;
a plurality of driving units disposed in a direction perpendicular to the predetermined direction, wherein each driving unit includes:
a first conductive layer formed on an upper surface of the vibration plate and extending in a predetermined direction,
a piezoelectric layer covering the first conductive layer, and
a second conductive layer formed on an upper surface of the piezoelectric layer, such that the piezoelectric layer is interposed between the first and second conductive layers; and
a metal layer formed on the upper surface of the vibration plate and on an upper surface of the second conductive layer, so as to intersect and electrically connect the second conductive layers of a plurality of driving units, the metal layer including:
a first metal layer formed on the upper surface of the second conductive layer at an end surface of the second conductive layer, and
a second metal layer formed on the upper surface of the second conductive layer at the opposite end surface of the second conductive layer.
11. The actuator according to claim 10 ,
wherein the first metal layer includes a first extension portion formed between the adjacent driving units and extending toward the one end surface, and
wherein the first extension portion is electrically connected to the electrode.
12. The actuator according to claim 11 , wherein the second metal layer includes a second extension portion formed between the adjacent driving units and extending toward the other end surface.
13. The actuator according to claim 10 , wherein the electrode and each of the metal layers each have a structure in which nickel-chrome alloy and gold are laminated.
14. A liquid ejecting head comprising:
the actuator according to claim 10 ; and
a pressure chamber which communicates with a nozzle hole and of which a volume is varied by an operation of the actuator.
15. A liquid ejecting apparatus comprising:
the liquid ejecting head according to claim 14 .
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US14/489,859 US20150042728A1 (en) | 2009-11-26 | 2014-09-18 | Actuator, liquid ejecting head, and liquid ejecting apparatus |
Applications Claiming Priority (4)
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---|---|---|---|
JP2009-268613 | 2009-11-26 | ||
JP2009268613A JP5392489B2 (en) | 2009-11-26 | 2009-11-26 | Actuator, liquid ejecting head, and liquid ejecting apparatus |
US12/953,651 US8876261B2 (en) | 2009-11-26 | 2010-11-24 | Actuator, liquid ejecting head, and liquid ejecting apparatus |
US14/489,859 US20150042728A1 (en) | 2009-11-26 | 2014-09-18 | Actuator, liquid ejecting head, and liquid ejecting apparatus |
Related Parent Applications (1)
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US12/953,651 Continuation US8876261B2 (en) | 2009-11-26 | 2010-11-24 | Actuator, liquid ejecting head, and liquid ejecting apparatus |
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US20150042728A1 true US20150042728A1 (en) | 2015-02-12 |
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US12/953,651 Active 2033-01-14 US8876261B2 (en) | 2009-11-26 | 2010-11-24 | Actuator, liquid ejecting head, and liquid ejecting apparatus |
US14/489,859 Abandoned US20150042728A1 (en) | 2009-11-26 | 2014-09-18 | Actuator, liquid ejecting head, and liquid ejecting apparatus |
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US12/953,651 Active 2033-01-14 US8876261B2 (en) | 2009-11-26 | 2010-11-24 | Actuator, liquid ejecting head, and liquid ejecting apparatus |
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US (2) | US8876261B2 (en) |
JP (1) | JP5392489B2 (en) |
CN (1) | CN102166884B (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10744769B2 (en) | 2018-08-09 | 2020-08-18 | Brother Kogyo Kabushiki Kaisha | Liquid ejection head including vibrating film and piezoelectric film deflecting toward pressure chambers |
US11273641B2 (en) | 2019-04-01 | 2022-03-15 | Brother Kogyo Kabushiki Kaisha | Piezoelectric actuator and liquid ejection apparatus |
Families Citing this family (14)
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JP2013118234A (en) * | 2011-12-02 | 2013-06-13 | Taiyo Yuden Co Ltd | Piezoelectric actuator and method of manufacturing the same |
JP5957914B2 (en) * | 2012-02-01 | 2016-07-27 | セイコーエプソン株式会社 | Liquid ejecting head and liquid ejecting apparatus |
JP2013162063A (en) * | 2012-02-08 | 2013-08-19 | Seiko Epson Corp | Piezoelectric element, liquid injection head, and liquid injection device |
JP6024170B2 (en) * | 2012-04-13 | 2016-11-09 | セイコーエプソン株式会社 | Liquid ejecting head, liquid ejecting apparatus, and actuator |
JP2015166160A (en) * | 2014-03-04 | 2015-09-24 | セイコーエプソン株式会社 | Liquid jet head, liquid jet device, and method for manufacturing liquid jet head |
JP5997219B2 (en) * | 2014-08-25 | 2016-09-28 | 京セラ株式会社 | Piezoelectric actuator substrate, liquid ejection head using the same, and recording apparatus |
JP5958568B2 (en) * | 2015-01-26 | 2016-08-02 | セイコーエプソン株式会社 | Liquid ejecting head and liquid ejecting apparatus |
JP6610856B2 (en) * | 2015-03-20 | 2019-11-27 | セイコーエプソン株式会社 | Piezoelectric element, piezoelectric element applied device, and method of manufacturing piezoelectric element |
JP2017052135A (en) * | 2015-09-08 | 2017-03-16 | セイコーエプソン株式会社 | Mems device, liquid jet head, liquid jet device, manufacturing method of mems device, and manufacturing method of liquid jet head |
JP2017193108A (en) * | 2016-04-20 | 2017-10-26 | 東芝テック株式会社 | Ink jet head and ink jet recording device |
TWI717498B (en) * | 2016-06-21 | 2021-02-01 | 日商前進材料科技股份有限公司 | Membrane structure and manufacturing method thereof |
JP6059394B2 (en) * | 2016-08-18 | 2017-01-11 | 京セラ株式会社 | Piezoelectric actuator substrate, liquid ejection head using the same, and recording apparatus |
JP6418275B2 (en) * | 2017-05-12 | 2018-11-07 | セイコーエプソン株式会社 | Liquid ejecting head, liquid ejecting apparatus, piezoelectric device, and method of manufacturing liquid ejecting head |
TWI678289B (en) * | 2018-12-07 | 2019-12-01 | 謙華科技股份有限公司 | Manufacturing method of thermal head |
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JP3412156B2 (en) * | 1992-08-26 | 2003-06-03 | セイコーエプソン株式会社 | Inkjet recording head |
JP2003136718A (en) * | 2001-11-06 | 2003-05-14 | Seiko Epson Corp | Ink jet recording head, its manufacturing method and ink jet recorder |
JP2003237077A (en) * | 2002-02-19 | 2003-08-26 | Seiko Epson Corp | Ink-jet recording head and ink-jet recording apparatus |
JP2004235599A (en) * | 2002-05-31 | 2004-08-19 | Matsushita Electric Ind Co Ltd | Piezoelectric element, ink jet head, angular velocity sensor, and their manufacturing methods, and ink jet type recording apparatus |
JP2005088441A (en) | 2003-09-18 | 2005-04-07 | Seiko Epson Corp | Liquid injection head and device |
CN100503245C (en) * | 2004-07-02 | 2009-06-24 | 精工爱普生株式会社 | Liquid-jet head and liquid-jet apparatus |
WO2006046545A1 (en) * | 2004-10-26 | 2006-05-04 | Kyocera Corporation | Elastic surface wave element and communication device |
JP4657002B2 (en) * | 2005-05-12 | 2011-03-23 | 信越化学工業株式会社 | Composite piezoelectric substrate |
JP4404105B2 (en) * | 2007-03-30 | 2010-01-27 | ブラザー工業株式会社 | Piezoelectric actuator and liquid ejecting apparatus including the piezoelectric actuator |
CN101544113A (en) * | 2008-03-27 | 2009-09-30 | 精工爱普生株式会社 | Liquid ejecting head, liquid ejecting apparatus, and actuator |
-
2009
- 2009-11-26 JP JP2009268613A patent/JP5392489B2/en active Active
-
2010
- 2010-11-24 US US12/953,651 patent/US8876261B2/en active Active
- 2010-11-26 CN CN201010565638.1A patent/CN102166884B/en not_active Expired - Fee Related
-
2014
- 2014-09-18 US US14/489,859 patent/US20150042728A1/en not_active Abandoned
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10744769B2 (en) | 2018-08-09 | 2020-08-18 | Brother Kogyo Kabushiki Kaisha | Liquid ejection head including vibrating film and piezoelectric film deflecting toward pressure chambers |
US11273641B2 (en) | 2019-04-01 | 2022-03-15 | Brother Kogyo Kabushiki Kaisha | Piezoelectric actuator and liquid ejection apparatus |
Also Published As
Publication number | Publication date |
---|---|
CN102166884B (en) | 2014-03-12 |
JP5392489B2 (en) | 2014-01-22 |
JP2011110784A (en) | 2011-06-09 |
CN102166884A (en) | 2011-08-31 |
US20110122205A1 (en) | 2011-05-26 |
US8876261B2 (en) | 2014-11-04 |
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Owner name: SEIKO EPSON CORPORATION, JAPAN Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:HIRAI, EIJU;REEL/FRAME:033768/0170 Effective date: 20101112 |
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STCB | Information on status: application discontinuation |
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