US20140083669A1 - Heat sink - Google Patents
Heat sink Download PDFInfo
- Publication number
- US20140083669A1 US20140083669A1 US13/669,454 US201213669454A US2014083669A1 US 20140083669 A1 US20140083669 A1 US 20140083669A1 US 201213669454 A US201213669454 A US 201213669454A US 2014083669 A1 US2014083669 A1 US 2014083669A1
- Authority
- US
- United States
- Prior art keywords
- fins
- heat sink
- fin
- bottom plate
- bar
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 230000017525 heat dissipation Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4871—Bases, plates or heatsinks
- H01L21/4882—Assembly of heatsink parts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Definitions
- the present disclosure relates to a heat sink.
- Heat dissipation for electronic devices in a server is generally done by heat sinks. Different CPUs have different heat ratings. However, design of the heat sinks is based on the high heat ratings of the CPUs, which is inflexible.
- FIG. 1 is an exploded, isometric view of an exemplary embodiment of a heat sink, wherein the heat sink includes a plurality of first fins and a plurality of second fins.
- FIG. 2 is an enlarged, inverted view of one of the second fins of FIG. 1 .
- FIG. 3 is an assembled, isometric view of FIG. 1 .
- FIG. 4 is an enlarged view of a circled portion IV of FIG. 3 .
- FIGS. 1 and 2 show an exemplary embodiment of a heat sink.
- the heat sink includes a bottom plate 10 , a plurality of first fins 20 perpendicularly extending up from the bottom plate 10 , and a plurality of second fins 30 .
- Each second fin 30 includes a main body 31 and a bar 32 connected to a bottom side of the main body 31 .
- a hooking slot 322 is defined in a bottom of the bar 32 .
- a plurality of pairs of resilient tabs 33 extends from a bottom of the bar 32 .
- the resilient tabs 33 of each pair are respectively located at opposite sides of the hooking slot 322 .
- Each resilient tab 33 is substantially C-shaped, arced toward the other resilient tab 33 of the same pair of the resilient tabs 33 .
- FIGS. 3 and 4 show in assembly, the hooking slot 322 of each second fin 30 is aligned with the corresponding first fin 20 and is manipulated toward the first fin 30 .
- the first fin 20 extends through the pairs of resilient tabs 33 of the second fin 30 and engages in the hooking slot 322 , to allow the resilient tabs 33 to resiliently sandwich the first fin 20 .
- a corresponding number of second fins 30 are mounted to the first fins 20 .
- the second fins 30 are alternately mounted to the first fins 20 , for instance, to every other one of the first fins 20 .
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
A heat sink includes a bottom plate, a number of first fins extending up from the bottom plate, and a number of second fins. The second fins are detachably connected to tops of the corresponding first fins.
Description
- 1. Technical Field
- The present disclosure relates to a heat sink.
- 2. Description of Related Art
- Heat dissipation for electronic devices in a server, such as central processing units (CPUs), is generally done by heat sinks. Different CPUs have different heat ratings. However, design of the heat sinks is based on the high heat ratings of the CPUs, which is inflexible.
- Many aspects of the present embodiments can be better understood with reference to the following drawings. The components in the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the present embodiments. Moreover, in the drawings, all the views are schematic, and like reference numerals designate corresponding parts throughout the several views.
-
FIG. 1 is an exploded, isometric view of an exemplary embodiment of a heat sink, wherein the heat sink includes a plurality of first fins and a plurality of second fins. -
FIG. 2 is an enlarged, inverted view of one of the second fins ofFIG. 1 . -
FIG. 3 is an assembled, isometric view ofFIG. 1 . -
FIG. 4 is an enlarged view of a circled portion IV ofFIG. 3 . - The disclosure, including the accompanying drawings, is illustrated by way of example and not by way of limitation. It should be noted that references to “an” or “one” embodiment in this disclosure are not necessarily to the same embodiment, and such references mean at least one.
-
FIGS. 1 and 2 show an exemplary embodiment of a heat sink. The heat sink includes abottom plate 10, a plurality offirst fins 20 perpendicularly extending up from thebottom plate 10, and a plurality ofsecond fins 30. - Each
second fin 30 includes amain body 31 and abar 32 connected to a bottom side of themain body 31. A hooking slot 322 is defined in a bottom of thebar 32. A plurality of pairs ofresilient tabs 33 extends from a bottom of thebar 32. Theresilient tabs 33 of each pair are respectively located at opposite sides of the hooking slot 322. Eachresilient tab 33 is substantially C-shaped, arced toward the otherresilient tab 33 of the same pair of theresilient tabs 33. -
FIGS. 3 and 4 show in assembly, the hooking slot 322 of eachsecond fin 30 is aligned with the correspondingfirst fin 20 and is manipulated toward thefirst fin 30. Thefirst fin 20 extends through the pairs ofresilient tabs 33 of thesecond fin 30 and engages in the hooking slot 322, to allow theresilient tabs 33 to resiliently sandwich thefirst fin 20. - In use, according to the heat rating of the electronic device, a corresponding number of
second fins 30 are mounted to thefirst fins 20. In the embodiment, thesecond fins 30 are alternately mounted to thefirst fins 20, for instance, to every other one of thefirst fins 20. - Even though numerous characteristics and advantages of the embodiments have been set forth in the foregoing description, together with details of the structure and the functions of the embodiments, the disclosure is illustrative only, and changes may be made in details, especially in the matters of shape, size, and arrangement of parts within the principles of the embodiments to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed.
Claims (4)
1. A heat sink, comprising:
a bottom plate;
a plurality of first fins extending up from the bottom plate; and
a plurality of second fins detachably connected to tops of corresponding ones of the first fins opposite to the bottom plate.
2. The heat sink of claim 1 , wherein a bar is formed on a bottom of each second fin, a hooking slot is defined in a bottom of the bar, the top of the corresponding first fin engages in the hooking slot, a pair of resilient tabs extends from the bottom of the bar, the resilient tabs are located at opposite sides of the hooking slot and resiliently sandwich the corresponding first fin.
3. The heat sink of claim 2 , wherein each resilient tab is substantially C-shaped, arced toward the other resilient tab.
4. The heat sink of claim 1 , wherein the second fins are alternately mounted to the first fins.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201210364753.1A CN103687433A (en) | 2012-09-26 | 2012-09-26 | Radiator |
CN2012103647531 | 2012-09-26 |
Publications (1)
Publication Number | Publication Date |
---|---|
US20140083669A1 true US20140083669A1 (en) | 2014-03-27 |
Family
ID=50323292
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US13/669,454 Abandoned US20140083669A1 (en) | 2012-09-26 | 2012-11-06 | Heat sink |
Country Status (3)
Country | Link |
---|---|
US (1) | US20140083669A1 (en) |
CN (1) | CN103687433A (en) |
TW (1) | TW201414981A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109004811A (en) * | 2018-06-22 | 2018-12-14 | 江苏英杰铝业有限公司 | A kind of variable-frequency power sources aluminium sheet radiator |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105186927B (en) * | 2015-10-13 | 2018-07-27 | 魏淏 | A kind of gas stove wok stand using cogeneration |
CN110187750A (en) * | 2019-05-28 | 2019-08-30 | 浪潮商用机器有限公司 | A kind of server, onboard structure and more efficiency composite layer radiators |
Citations (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5437328A (en) * | 1994-04-21 | 1995-08-01 | International Business Machines Corporation | Multi-stage heat sink |
US6263955B1 (en) * | 1996-06-27 | 2001-07-24 | Kaveh Azar | Heat sink with open region |
US6639802B1 (en) * | 2002-11-05 | 2003-10-28 | Hon Hai Precision Ind. Co., Ltd. | Heat sink with interlocked fins |
US6672379B1 (en) * | 2002-07-29 | 2004-01-06 | Waffer Technology Corp. | Positioning and buckling structure for use in a radiator |
US20040080911A1 (en) * | 2002-10-25 | 2004-04-29 | Liu Heben | Heat sink assembly with embedded fan |
US6862183B2 (en) * | 2001-10-29 | 2005-03-01 | Intel Corporation | Composite fins for heat sinks |
US20060054307A1 (en) * | 2004-09-15 | 2006-03-16 | Foxconn Technology Co., Ltd. | Heat sink |
US20090165999A1 (en) * | 2007-12-27 | 2009-07-02 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat sink |
US20090229791A1 (en) * | 2008-03-14 | 2009-09-17 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Thermal module assembly and heat sink assembly thereof |
US20090236076A1 (en) * | 2008-03-20 | 2009-09-24 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat dissipation device |
US20100018669A1 (en) * | 2008-07-28 | 2010-01-28 | Foxconn Technology Co., Ltd. | Heat dissipation device |
US20100132919A1 (en) * | 2008-12-03 | 2010-06-03 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat sink |
US8230903B2 (en) * | 2008-04-18 | 2012-07-31 | International Business Machines Corporation | Low profile heat sink for semiconductor devices |
-
2012
- 2012-09-26 CN CN201210364753.1A patent/CN103687433A/en active Pending
- 2012-10-08 TW TW101137072A patent/TW201414981A/en unknown
- 2012-11-06 US US13/669,454 patent/US20140083669A1/en not_active Abandoned
Patent Citations (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5437328A (en) * | 1994-04-21 | 1995-08-01 | International Business Machines Corporation | Multi-stage heat sink |
US6263955B1 (en) * | 1996-06-27 | 2001-07-24 | Kaveh Azar | Heat sink with open region |
US6862183B2 (en) * | 2001-10-29 | 2005-03-01 | Intel Corporation | Composite fins for heat sinks |
US6672379B1 (en) * | 2002-07-29 | 2004-01-06 | Waffer Technology Corp. | Positioning and buckling structure for use in a radiator |
US20040080911A1 (en) * | 2002-10-25 | 2004-04-29 | Liu Heben | Heat sink assembly with embedded fan |
US6639802B1 (en) * | 2002-11-05 | 2003-10-28 | Hon Hai Precision Ind. Co., Ltd. | Heat sink with interlocked fins |
US20060054307A1 (en) * | 2004-09-15 | 2006-03-16 | Foxconn Technology Co., Ltd. | Heat sink |
US20090165999A1 (en) * | 2007-12-27 | 2009-07-02 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat sink |
US20090229791A1 (en) * | 2008-03-14 | 2009-09-17 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Thermal module assembly and heat sink assembly thereof |
US20090236076A1 (en) * | 2008-03-20 | 2009-09-24 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat dissipation device |
US8230903B2 (en) * | 2008-04-18 | 2012-07-31 | International Business Machines Corporation | Low profile heat sink for semiconductor devices |
US20100018669A1 (en) * | 2008-07-28 | 2010-01-28 | Foxconn Technology Co., Ltd. | Heat dissipation device |
US20100132919A1 (en) * | 2008-12-03 | 2010-06-03 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat sink |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109004811A (en) * | 2018-06-22 | 2018-12-14 | 江苏英杰铝业有限公司 | A kind of variable-frequency power sources aluminium sheet radiator |
Also Published As
Publication number | Publication date |
---|---|
TW201414981A (en) | 2014-04-16 |
CN103687433A (en) | 2014-03-26 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
AS | Assignment |
Owner name: HON HAI PRECISION INDUSTRY CO., LTD., TAIWAN Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:TIAN, BO;HAN, YU;REEL/FRAME:029243/0892 Effective date: 20121029 Owner name: HONG FU JIN PRECISION INDUSTRY (SHENZHEN) CO., LTD Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:TIAN, BO;HAN, YU;REEL/FRAME:029243/0892 Effective date: 20121029 |
|
STCB | Information on status: application discontinuation |
Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION |